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Table Of Contents

Module 4: Modelling With Hardware Description Languages
References:
MECAE 102 ANALOG INTEGRATED CIRCUIT DESIGN L T P C
Module 1: MOSFET Operation and Models for Analog Design
Module 2: Current Mirrors and Single-Stage Amplifiers
Module 3: Differential Amplifiers and Voltage References
Module 4: Operational Amplifiers
MECAE 103 DIGITAL INTEGRATED CIRCUIT DESIGN L T P C
Module 1: CMOS Inverter
Module 2: Designing Combinational Logic Gates in CMOS
Module 3: Designing Sequential Logic Circuits
Module 4: Timing Issues in Digital Circuits
MECAE104 RF SYSTEM DESIGN L T P C
Module 1: Transmission Line Theory
Module 2: RF Filter Design
Module 3: Impedance Matching Networks
Module 4: RF Amplifiers, Oscillators and Mixers
MECAE 105 - 1 DIGITAL COMMUNICATION SYSTEM DESIGN L T P C
Module 1: Overview of Communication System
Module 2: Signaling and Modulation
Module 3: Channels
Module 4: Diversity Techniques
MECAE 105 - 2 RF COMPONENTS AND CIRCUIT DESIGN L T P C
Module 1: RF Components
Module 2: Active RF Components Modelling
Module 3: Microwave Control Components
Module 4: Microwave Circuit Technology
MECAE 105 - 3 IMAGE AND VIDEO PROCESSING SYSTEM
Module 1: Image and Video Basics
Module 2: Image and Video Enhancement
Module 3: Image and Video Encoding Systems
Module 4: Three Dimensional Vision
MECAE 105 - 4 VLSI SYSTEM DESIGN L T P C
Module 1: Introduction to CMOS VLSI Design
Module 2: Static and Dynamic CMOS Design
Module 3: Subsystem Design and Timing Issues
Module 4: Routing, Scheduling and Allocation
MECAE 106 - 1 COMMUNICATION SYSTEM MODELLING AND
Module 1: Modelling of Communication Systems
Module 2: Simulation of Random Variables and Random Process
Module 3: Estimation of Performance Measures
Module 4: Communication Networks
MECAE 106 - 2 RF ANTENNA DESIGN L T P C
Module 1: Microstrip Radiators
Module 2: Rectangular Microstrip Antenna
Module 3: Circular Microstrip Antenna
Module 4: A. Broad Banding of Microstrip Antennas
B. Compact Microstrip Antennas
MECAE 106 - 3 SPEECH AND AUDIO PROCESSING SYSTEM
Module 1: Review of Audio Sources and Propagation
Module 2: Frequency Domain Methods
Module 3: Voice and Audio Encoding Systems
Module 4: Real Time Audio Processing
MECAE 106 - 4 EMBEDDED SYSTEM DESIGN L T P C
Module 1: System Design Methodologies
Module 2: Modelling and Synthesis
Module 3: Software Synthesis
Module 4: Hardware Synthesis
MECAE 107 ELECTRONIC SYSTEM DESIGN LAB - I L T P C
MECAE 108 SEMINAR – I L T P C
MECAE 201 ELECTRONIC PRODUCT DESIGN L T P C
Module 1: Design for Manufacturability
Module 2: PCB Design and Manufacturing Process
Module 3: Electromagnetic Compatibility
Module 4: Electrostatic Discharge and Electronic Packaging
MECAE 202 ANALOG AND DATA CONVERSION SYSTEM
Module 1: Linear Op-Amp Circuits
Module 2: Dynamic Analog Circuits
Module 3: Data Converter Fundamentals and Architecture
Module 4: Implementation of Data Converters
MECAE 203 HIGH SPEED DIGITAL SYSTEM DESIGN
Module 1: Introduction to High Speed Digital Design
Module 2: Power Distribution and Noise
Module 3: Signalling Convention and Circuits
Module 4: Timing Convention and Synchronisation
MECAE 204 DSP ALGORITHM AND ARCHITECTURE DESIGN
Module 1: DSP Algorithm Design
Module 2: Circuits and DSP Architecture Design
Module 3: DSP Module Synthesis
Module 4: Parallel Algorithms and their Dependence
MECAE 205 - 1 WIRELESS COMMUNICATION SYSTEM
Module 1: Fading and Diversity
Module 2: Cellular Communication
Module 3: Spread Spectrum and CDMA
Module 4: Capacity and Standards
MECAE 205 -2 RF INTEGRATED CIRCUIT DESIGN L T P C
Module 1: Elements of Microwave Integrated Circuits (MIC)
Module 2: Microwave Integrated Subassemblies
Module 3: RF IC Design Flow
Module4: Coupled Microstrip, Directional Couplers
MECAE 205 - 3 DSP SYSTEM DESIGN L T P C
Module 1: Introduction
Module 2: Typical DS Processor
Module 3: Filter Design Techniques
Module 4: Current Trends
MECAE 205 - 4 ASIC DESIGN L T P C
Module 1: Types of Asics
Module 2: ASIC Library Design
Module 3: System on Chip Design Process
Module 4: Soc Verification
MECAE 206 - 1 OPTICAL COMMUNICATION SYSTEM DESIGN L T P C
Module 1: Review of Fiber Optic Communication Systems
Module 2: Fiber Optic System Design Considerations and Components
Module 3: Advanced Multiplexing Strategies
Module 4: Optical Networking
MECAE 206 - 2 RF AND MICROWAVE NETWORK DESIGN L T P C
Module1: Microwave Network Analysis
Module 2: Analysis of Symmetrical Networks
Module 3: Power Dividers and Couplers
Module 4: Ferrimagnetic Components
MECAE 206 - 3 DETECTION AND TRACKING SYSTEM DESIGN L T P C
Module 1: Reception in White Noise
Module 2: Reception in Colored Noise
Module 3: Tracking
Module 4: Digital Sonar System
MAE 206 - 4 EMBEDDED NETWORK DESIGN L T P C
Module 1: Programming for Embedded Systems
Module 2: Embedded Communication Systems
Module 3: Device Drivers
Protocol Implementation On Microcontroller And Processors: Device Awareness:
Module 4: Automotive Networked Embedded Systems
Networked Embedded Systems in Industrial Automation: Fieldbus Systems,
MECAE 207 ELECTRONIC SYSTEM DESIGN LAB -II L T P C
MECAE 208 SEMINAR – II L T P C
MECAE 301 INDUSTRIAL TRAINING AND /OR
OR
MECAE 302 MASTER’S THESIS PHASE - I L T P C
MECAE 401 MASTER’S THESIS L T P C
MECAE 402 MASTER’S COMPREHENSIVE VIVA
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Published by: Arun Ayyappan on Jun 13, 2012
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