Stencil Aperture Diameter is 20% smaller than the PCB Pad dimensions. In other words, if solder paste is printed using this stencil, there will be a 10% clearance between the solder paste and edge of the pad. By giving such a good clearance, one can prevent the occurrence of solder balls around the component.

Take this Fantastic journey from the microcosm to the edge of this universe ...... do it now ..... it is really worth it !! Enjoy this exciting journey through this universe !! Does it make you wonder what this force that created this universe looks like ?

It is a little known fact, that Ms Spears is an expert in semiconductor physics. Not content with just singing and acting, in the following pages, she will guide you in the fundamentals of the vital semiconductor laser components that have made it possible to hear her super music in a digital format.

An excellent chapter on Wave Soldering by Martin Tarr.

An Excellent book on Design for Manufacturing and Concurrent Engineering as it pertains to PCB Fab and Assembly Operations.

This is an excellent article that highlights some key myths prevalent in Electronic Manufacturing Industry. The author, Eddy Van den Wijngaerd of South Africa exposes the ignorance of some seasoned soldering engineers when it comes to the most common terms, dewetting and non-wetting. He also talks about the term "dry solder" which is used loosely in the industry though the soldering experts can...