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DESIGN CALCULATIONS

FOR
DESIGN OF 1.1 kV, 5000A LT BUSDUCT

PROJECT:

Customer: Consultant: Contractor:

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Contents:
1. 2. Design Parameters Thermal Withstand Capability

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DESIGN OF SPB
Design parameters
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Nominal System Voltage Rated Voltage BIL Rating. Encl. Dimension Encl. Material Encl. Material Thk. Busbar Material Busbar Size Cross Sectional Area -

0.415 kV 1.1 kV 2.5

- 1000 mm x 700 mm 700 C Aluminium 3 mm Aluminium 200 x 12 4runs Per PH. 9600Sq. mm 50 kA. 1 Sec. 110 kAp 500 C 400 C

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10 Short Circuit Current(Isc) 11 Duration of Short Circuit(T) 12 Momentary Peak Withstand Current 13 Design Ambient Temperature 14 Hot spot temperature of Conductor Carrying Rated Current 15 Hot spot temperature of Enclosure

16 Max. Temperature Rise of Conductor during fault condition While carrying rated current 17 Rated Current - 2500 C Over design ambient temperature 5000 A

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Thermal Withstand Capability


Continuos Current Rating Derating Factors: Conductor to Enclosure ratio (1.3 %) Temperature Rise of 400 C Rise above 50 0 C Ambient Proximity effect Black-Matt finish Non Magnetic Enclosure Total De-rating factor 0.875 0.815 0.95 1.2 1.0 0.81

AC Current rating of bare ( unpainted ) busbar in still but unconfined air for a Temperature rise of 35 0 C over an ambient of 50 0 C. = 6150 A For Interleaving Design = 1.18 x 6150 = 7257 A Rating of busbar for above size conductor = 7257 x 0.81 = 5878 A

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