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Ph.d. Thesis on Modeling Imc Growth and Soldering

Ph.d. Thesis on Modeling Imc Growth and Soldering

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Published by: smtdrkd on Feb 25, 2009
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05/10/2014

SOLDERING

Dissolution of base metal and the development of intermetallic compound (IMC)

are vital to the quality of a solder joint. Final thickness of the IMC in the terminal joint

during a soldering has been a critical concern in the soldering industry. The assessment of

base metal lost during the process is another important subject being investigated by the

researchers in the last two decades. The quantity of the base metal lost and the thickness

of the resulting IMC at the substrate/solder interface quantitatively on the process

parameters such as temperature cycle together with the type and quantity of solder

relative to the substrate thickness.

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