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max232

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datasheet max232
datasheet max232

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MAX232, MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą
SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

D Meets or Exceeds TIA/EIA-232-F and ITU D D D D D D D D
Recommendation V.28 Operates From a Single 5-V Power Supply With 1.0-mF Charge-Pump Capacitors Operates Up To 120 kbit/s Two Drivers and Two Receivers ±30-V Input Levels Low Supply Current . . . 8 mA Typical ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) Upgrade With Improved ESD (15-kV HBM) and 0.1-mF Charge-Pump Capacitors is Available With the MAX202 Applications − TIA/EIA-232-F, Battery-Powered Systems, Terminals, Modems, and Computers

MAX232 . . . D, DW, N, OR NS PACKAGE MAX232I . . . D, DW, OR N PACKAGE (TOP VIEW)

C1+ VS+ C1− C2+ C2− VS− T2OUT R2IN

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10 9

VCC GND T1OUT R1IN R1OUT T1IN T2IN R2OUT

description/ordering information
The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC library. ORDERING INFORMATION
TA PDIP (N) SOIC (D) 0°C to 70°C SOIC (DW) SOP (NS) PDIP (N) −40°C to 85°C SOIC (D) SOIC (DW) PACKAGE† Tube of 25 Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 Reel of 2000 Tube of 25 Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 ORDERABLE PART NUMBER MAX232N MAX232D MAX232DR MAX232DW MAX232DWR MAX232NSR MAX232IN MAX232ID MAX232IDR MAX232IDW MAX232IDWR MAX232I MAX232I MAX232 MAX232 MAX232IN MAX232 TOP-SIDE MARKING MAX232N

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinASIC is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright  2004, Texas Instruments Incorporated

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

1

TEXAS 75265 . MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą Function Tables EACH DRIVER INPUT TIN L H OUTPUT TOUT H L ą H = high level.SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 MAX232. L = low level EACH RECEIVER INPUT RIN L H OUTPUT ROUT H L H = high level. L = low level logic diagram (positive logic) 11 T1IN 10 T2IN 12 R1OUT 9 R2OUT 8 R2IN 13 R1IN 7 T2OUT 14 T1OUT 2 POST OFFICE BOX 655303 • DALLAS.

. . . . . . . . All voltages are with respect to network GND. . . . . . . . . . . . . . . . . . . NOTES: 1. . . . . . . . . . . VO: T1OUT. . . VS− − 0. . . MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Input supply voltage range. . . . . . . . . . . . . . . . . . . . . . . . . 2. . . . . . . recommended operating conditions MIN VCC VIH VIL R1IN. . . . . . . . . . . . TA = 25°C All outputs open. . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. . . . 150°C Storage temperature range. TJ . T2OUT . . . . . . . .3 V R1OUT. VS− . . . . . . . . . . .3 V to VCC + 0. . . . . . . . . . . R2IN TA Supply voltage High-level input voltage (T1IN. . . . . . . . . . . . . . . . . . . . . . .8 ±30 70 85 NOM 5 MAX 5. . . . . . . . . . . . .3 V to VCC + 0. . . . . These are stress ratings only. . . . . VI: Driver . . . . . . . . . . . . . . VCC − 0. −0. . . The package thermal impedance is calculated in accordance with JESD 51-7. .ą MAX232.3 V to 15 V Negative output supply voltage range. . . . . . . . . . . . . . . . . . . . . . . . . . .3 V Receiver . . . . . . . . . . . . . . . .5 V. . . R2OUT . . . . . . Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 V to VS+ + 0. . . . . . . . . . . . . T2IN) Receiver input voltage Operating free-air temperature MAX232 MAX232I 0 −40 4. . . NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0. . . . . . . . . . . . . . . . . . . . . . . . . 3. . . . . . . . . . . . . . . . . . . 64°C/W Operating virtual junction temperature. . . . . . θJA (see Notes 2 and 3): D package . . . . . . Unlimited Package thermal impedance. . . . . . . . . .3 V to 6 V Positive output supply voltage range. . . . . . . . . .5 V. θJA. . . . . . . . . . . Maximum power dissipation is a function of TJ(max). . POST OFFICE BOX 655303 • DALLAS. VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output voltage range. . . . . . . . . . . −0. . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 V to −15 V Input voltage range. . . . . . −0. . .5 2 0. TEXAS 75265 3 . . . . . . . . . . . . . . . . . . . . . 57°C/W N package . . . . . . . and TA. . . . VS+ . . . The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. . . .T2IN) Low-level input voltage (T1IN. . MIN TYP‡ 8 MAX 10 UNIT mA ‡ All typical values are at VCC = 5 V and TA = 25°C. . . . . . . . . . . . . . . . . . . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. . . . . . . . −0. . . . . . . . . . . Operating at the absolute maximum TJ of 150°C can affect reliability. . . . . . . . . . . . . . . . . . . . .5 UNIT V V V V °C electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER ICC Supply current TEST CONDITIONS VCC = 5. . . 67°C/W NS package . . . . . . . . . . . . . . . . T2OUT . . . . . . . . . . 73°C/W DW package . . .3 V Short-circuit duration: T1OUT. . and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. . . . . .

VO = ±2 V 300 Ω IOS§ Short-circuit output current T1OUT. TA = 25°C (see Note 4 and Figure 1) PARAMETER tPLH(R) tPHL(R) Receiver propagation delay time.5 V. ‡ The algebraic convention. ‡ The algebraic convention.5 0. high. TEST CONDITIONS RL = 3 kΩ to 7 kΩ. MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą DRIVER SECTION ą electrical characteristics over recommended ranges of supply voltage and operating free-air temperature range (see Note 4) PARAMETER VOH VOL ro High-level output voltage Low-level output voltage‡ T1OUT. is used in this data sheet for logic voltage levels only. in which the least-positive (most negative) value is designated minimum. switching characteristics. R2IN VCC = 5 V 0. switching characteristics.5 V.5 V. See Figure 2 See Figure 3 One TOUT switching 3 120 MIN TYP MAX 30 UNIT V/µs V/µs kbit/s RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature range (see Note 4) PARAMETER VOH VOL VIT+ VIT− High-level output voltage Low-level output voltage‡ Receiver positive-going input threshold voltage Receiver negative-going input threshold voltage R1OUT. NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0. R2IN VCC = 5. T2IN VI = 0 200 µA † All typical values are at VCC = 5 V. § Not more than one output should be shorted at a time. is used in this data sheet for logic voltage levels only. VCC = 5 V. R2IN R1IN.7 1. T2OUT TEST CONDITIONS RL = 3 kΩ to GND RL = 3 kΩ to GND MIN 5 TYP† 7 −7 −5 MAX UNIT V V Output resistance T1OUT.5 1 V ri Receiver input resistance R1IN. T2OUT VCC = 5.SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 MAX232. VCC = 5 V. T2OUT VS+ = VS− = 0. NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.8 1. T2OUT T1OUT. TEXAS 75265 .5 V. R2OUT R1OUT. in which the least-positive (most negative) value is designated minimum. R2IN TEST CONDITIONS IOH = −1 mA IOL = 3. R2OUT R1IN.to low-level output TYP 500 500 UNIT ns ns NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0. TA = 25°C (see Note 4) PARAMETER SR SR(t) Driver slew rate Driver transition region slew rate Data rate NOTE 4: Test conditions are C1−C4 = 1 µF at VCC = 5 V ± 0.2 mA VCC = 5 V.4 2.2 MIN 3. TA = 25°C. TA = 25°C 3 5 7 kΩ † All typical values are at VCC = 5 V. TA = 25°C TA = 25°C 0.5 V.4 TYP† MAX UNIT V V V V Vhys Input hysteresis voltage R1IN. low.2 0. VO = 0 ±10 mA IIS Short-circuit input current T1IN.to high-level output Receiver propagation delay time. VCC = 5 V. 4 POST OFFICE BOX 655303 • DALLAS. TA = 25°C.

All diodes are 1N3064 or equivalent.3 kΩ See Note C CL = 50 pF (see Note B) TEST CIRCUIT ≤10 ns 90% 50% 90% 50% ≤10 ns 3V 10% tPLH VOH Output 1. B. TEXAS 75265 5 . CL includes probe and jig capacitance. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements POST OFFICE BOX 655303 • DALLAS.5 V 1. duty cycle ≤ 50%.ą MAX232. C. The pulse generator has the following characteristics: ZO = 50 Ω. MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 PARAMETER MEASUREMENT INFORMATION VCC Pulse Generator (see Note A) R1IN or R2IN R1OUT or R2OUT RL = 1.5 V WAVEFORMS NOTES: A. VOL 0V Input 10% 500 ns tPHL Figure 1.

Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-µs Input) Pulse Generator (see Note A) 3 kΩ EIA-232 Output CL = 2.5 V 10% tTLH 3V −3 V SR + 6V or t VOH VOL ≤10 ns 20 µs tTHL Output 3V −3 V t THL TLH WAVEFORMS NOTE A: The pulse generator has the following characteristics: ZO = 50 Ω. B.5 nF TEST CIRCUIT ≤10 ns Input 10% 90% 1. MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą PARAMETER MEASUREMENT INFORMATION Pulse Generator (see Note A) T1IN or T2IN T1OUT or T2OUT EIA-232 Output RL CL = 10 pF (see Note B) ą TEST CIRCUIT ≤10 ns Input 10% 90% 50% 5 µs tPHL 90% Output tTHL SR + 0.5 V 90% 1.8 (V 10% 10% tTLH –V ) 0. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-µs Input) 6 POST OFFICE BOX 655303 • DALLAS.SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 MAX232.8 (V –V ) OH OL OL OH or t t TLH THL WAVEFORMS NOTES: A. duty cycle ≤ 50%. TEXAS 75265 . CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω. duty cycle ≤ 50%. Figure 3. tPLH VOH VOL 90% 50% ≤10 ns 3V 10% 0V 90% Figure 2.

Resistor values shown are nominal. VCC C1+ C1− C2+ C2− 14 7 13 8 VS− VS+ 6 C4 + 1 µF C3† 2 8. TEXAS 75265 7 . the MAX202 can operate with 0. Typical Operating Circuit POST OFFICE BOX 655303 • DALLAS. B. they should be connected as shown.5 V −8.1-µF capacitors. MAX232I DUAL EIAĆ232 DRIVERS/RECEIVERS ą SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004 APPLICATION INFORMATION 5V CBYPASS =1µF + − 16 1 C1 1 µF 3 4 C2 1 µF 5 11 From CMOS or TTL 10 12 To CMOS or TTL 9 0V 15 GND † C3 can be connected to VCC or GND. NOTES: A. Nonpolarized ceramic capacitors are acceptable. In addition to the 1-µF capacitors shown.ą MAX232. If polarized tantalum or electrolytic capacitors are used.5 V 1 µF EIA-232 Output EIA-232 Output EIA-232 Input EIA-232 Input Figure 4.

ti.PACKAGE OPTION ADDENDUM www.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device MAX232D MAX232DE4 MAX232DG4 MAX232DR MAX232DRE4 MAX232DRG4 MAX232DW MAX232DWE4 MAX232DWG4 MAX232DWR MAX232DWRE4 MAX232DWRG4 MAX232ID MAX232IDE4 MAX232IDG4 MAX232IDR MAX232IDRE4 Status (1) Package Type Package Pins Package Qty Drawing SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC D D D D D D DW DW DW DW DW DW D D D D D 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 40 40 40 2500 2500 2500 40 40 40 2000 2000 2000 40 40 40 2500 2500 Eco Plan (2) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Op Temp (°C) 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 Top-Side Markings (4) Samples ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232 MAX232I MAX232I MAX232I MAX232I MAX232I Addendum-Page 1 .

NRND: Not recommended for new designs.ti. LIFEBUY: TI has announced that the device will be discontinued. Device is in production to support existing customers.PACKAGE OPTION ADDENDUM www.com 24-Jan-2013 Orderable Device MAX232IDRG4 MAX232IDW MAX232IDWE4 MAX232IDWG4 MAX232IDWR MAX232IDWRE4 MAX232IDWRG4 MAX232IN MAX232INE4 MAX232N MAX232NE4 MAX232NSR MAX232NSRE4 MAX232NSRG4 Status (1) Package Type Package Pins Package Qty Drawing SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP PDIP PDIP SO SO SO D DW DW DW DW DW DW N N N N NS NS NS 16 16 16 16 16 16 16 16 16 16 16 16 16 16 2500 40 40 40 2000 2000 2000 25 25 25 25 2000 2000 2000 Eco Plan (2) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Op Temp (°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70 0 to 70 0 to 70 0 to 70 0 to 70 Top-Side Markings (4) Samples ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM MAX232I MAX232I MAX232I MAX232I MAX232I MAX232I MAX232I MAX232IN MAX232IN MAX232N MAX232N MAX232 MAX232 MAX232 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. but TI does not recommend using this part in a new design. Addendum-Page 2 . and a lifetime-buy period is in effect. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. PREVIEW: Device has been announced but is not in production.

TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. Where designed to be soldered at high temperatures. and makes no representation or warranty as to the accuracy of such information.please check http://www. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. and peak solder temperature. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. including the requirement that lead not exceed 0.ti.PACKAGE OPTION ADDENDUM www. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible). or 2) lead-based die adhesive used between the die and leadframe.The planned eco-friendly classification: Pb-Free (RoHS). Only one of markings shown within the brackets will appear on the physical device. or Green (RoHS & no Sb/Br) .1% by weight in homogeneous materials. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. Efforts are underway to better integrate information from third parties. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances. Addendum-Page 3 .The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications. TI Pb-Free products are suitable for use in specified lead-free processes. Peak Temp.com/productcontent for the latest availability information and additional product content details. TI and TI suppliers consider certain information to be proprietary.1% by weight in homogeneous material) (3) MSL. -. (4) Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.ti.com 24-Jan-2013 (2) Eco Plan . Pb-Free (RoHS Exempt). TI bases its knowledge and belief on information provided by third parties. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0. and thus CAS numbers and other limited information may not be available for release.

7 2.5 6.0 330.0 16.75 B0 (mm) 10.1 2.7 2.4 16.0 330.0 12.1 2.0 8.0 W Pin1 (mm) Quadrant 16.75 10.0 16.PACKAGE MATERIALS INFORMATION www.1 2.4 6.0 8.4 16.75 10.4 16.4 16.3 10.1 2.0 12.4 16.7 P1 (mm) 8.0 12.4 16.4 16.5 10.0 16.7 10.5 10.0 8.0 330.0 8.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC D D D D DW DW D DW DW 16 16 16 16 16 16 16 16 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.4 16.0 16.3 10.0 330.1 2.0 330.0 16.0 330.0 16.3 10.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 MAX232DR MAX232DR MAX232DRG4 MAX232DRG4 MAX232DWR MAX232DWRG4 MAX232IDR MAX232IDWR MAX232IDWRG4 2500 2500 2500 2500 2000 2000 2500 2000 2000 Pack Materials-Page 1 .ti.7 10.0 330.3 10.5 6.0 16.7 2.0 12.0 16.7 10.7 K0 (mm) 2.0 16.3 10.75 6.0 330.5 6.

0 38.0 28.0 345.0 367.0 367.0 38.9 364.0 Width (mm) 367.9 367.2 333.0 364.0 50.0 367.6 28.0 333.0 333.0 28.0 345.6 50.0 366.PACKAGE MATERIALS INFORMATION www.9 345.0 Pack Materials-Page 2 .com 8-Apr-2013 *All dimensions are nominal Device MAX232DR MAX232DR MAX232DRG4 MAX232DRG4 MAX232DWR MAX232DWRG4 MAX232IDR MAX232IDWR MAX232IDWRG4 Package Type SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC Package Drawing D D D D DW DW D DW DW Pins 16 16 16 16 16 16 16 16 16 SPQ 2500 2500 2500 2500 2000 2000 2500 2000 2000 Length (mm) 367.2 367.ti.6 38.0 367.2 366.0 Height (mm) 38.

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