The objective is to improve the longitudinal (axial) stress along the interface and the cable insulation.

The examples in Figure 4.12 indicate how this may be effected by application of (a) a heat-shrink stress control sleeve, or (b) a semiconducting stress cone, or (c) a semiconducting cone with a conical thermoset casting and compression springs. At the higher voltages the longitudinal stress can be improved by winding layers of conducting film interleaved with polymeric film around the cable insulation to form a capacitor-type bushing construction [24]. The necessity for very good physical contact between interface surfaces is analysed in CIGRE Brochure 210 [25]. Among the findings, it is concluded

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