Strategi Merekabentuk Papan

Litar Tercetak (PCB)

KL 3083 Rekabentuk Sistem
Hilmi Sanusi

Strategi Awal
Spesifikasi
Dimensi
Susun-atur komponen

Aplikasi
Kegunaan alat pada tahap frekuensi:

DC
Frekuensi rendah
Julat audio
Frekuensi tinggi
Gelombang mikro

Persekitaran
Hingar dari EMC RFI dan EMI
Julat suhu

Spesifikasi
Akan menghadkan rekabentuk dari segi
Kekangan bentuk
dimensi, bulat, bujur, segi empat tepat dll
bentuk PCB

Kekangan susun-atur komponen

input,
output,
penyesaran haba,
bypass capacitor

Aplikasi Litar
Keperluan yang sesuai bagi rekaan PCB

pembumian
lebar track
jenis dielectric
ketebalan track

Keperluan bagi track

Arus
Isyarat yang melaluinya
Analog
Digital

Gangguan dari perambatan yang terhasil dari

arus yang mengalir dalam track

Hasil dari keperluan litar

Jenis pembumian yang sesuai

Penyusunan modular melalui segmen
interaksi EMC

Jenis track
Bus
track corner
junction

Jenis pad
luas pad
kedudukan pad
jenis pad

Jenis penyambungan
Jumper
via

PCB

Low Frequency

High frequency

DC

High frequency

Low frequency
< 400Hz

Microwave

Audio range

Noise Interference
Power line modulation
Back propagation from switching
single layer
Double layer
(Isolation)
grounding

Emc rfi & emi

Capacitive and inductive effect of the
track and patch
Track corner
Shielding effect
Skin effect
Multiple layer
Two layer (microstrip)

Application

Operating frequency

Track width
Type of ground
Interconnect

Dimension limitation
and component

Component selection
to satisfy the
Specification
Footprint of the
selected component

Specification

Segmentation
Modular

What are the information needed

Layer / type of the board

EMC
Track width
Overall design
Modular / segment / component placement
PCB shape and dimension limitation
Components selection
Footprint and dimension

Overall design

Overall design

Overall design

Components selection
Dimension
Footprint
Usage
- Tolerance
- specification
- rating

Module (PCB) placement in the system

Circuit BOM (specification)

Components selection

Based on
Rating
Specification
dimension

Components footprint

Components dimension

Components: dimension and footprint

Components: dimension and footprint

PCB - dimension

Placement of components

Placement of components pad (footprint)

Routing of the track

Routing of the track

Adjustment to the components

Re-routing of the track

Track of the PCB

Component side of the PCB

PCB software: example

schematic diagram: netlist

Rat-nest of the netlist

Interconnect: via

Simple Quiz .??