Service Manual

Internal Use Only

Service Manual U990/KU990

Model : U990/KU990

Date: November, 2007 / Issue 1.0

Table Of Contents
1. INTRODUCTION.................................. 5
1.1 Purpose ...................................................... 5 1.2 Regulatory Information ............................... 5 4.11 Micro SD trouble ....................................122 4.12 Audio trouble..........................................123 4.13 Camera trouble ......................................136 4.14 Main LCD trouble...................................142 4.15 Bluetooth trouble....................................145 4.16 Bluetooth RF Test..................................146 4.17 Touch Screen trouble ............................147

2. PERFORMANCE ..................................7
2.1 System Overview.........................................7 2.2 Usable environment.....................................8 2.3 Radio Performance......................................8 2.4 Current Consumption.................................16 2.5 RSSI BAR ..................................................17 2.6 Battery BAR ...............................................17 2.7 Sound Pressure Level ...............................18 2.8 Charging ....................................................18

5. DOWNLOAD.....................................148
5.1 Introduction ..............................................148 5.2 Downloading Procedure ..........................148 5.3 Troubleshooting Download Errors ..........161 5.4 Caution ....................................................166

3. TECHNICAL BRIEF............................19
3.1 General Description ...................................19 3.2 GSM Mode.................................................21 3.3 UMTS Mode...............................................25 3.4 LO generation and distribution circuits ......27 3.5 Off-chip RF Components ...........................27 3.6 Digital Baseband (DBB/MSM6280) ...........37 3.7 Subsystem(MSM6280) ..............................40 3.8 Power Block...............................................48 3.9 External memory interface.........................53 3.10 H/W Sub System .....................................55 3.11 Feature List..............................................72 3.12 Multimedia Chip Interface ........................78 3.13 Touch Screen Interface ...........................85 3.14 Main Features..........................................86

6. BLOCK DIAGRAM ...........................167
6.1 GSM & UMTS RF Block ..........................167 6.2 Interface Diagram ....................................169

7. CIRCUIT DIAGRAM..........................171 8. BGA IC PIN MAP..............................183 9. PCB LAYOUT ...................................191 10. Calibration......................................199
10.1 Usage of Hot-Kimchi..............................199

11. EXPLODED VIEW & REPLACEMENT PART LIST ..................................... 203
11.1 EXPLODED VIEW ................................ 203 11.2 Replacement Parts <Mechanic component> ....................... 205 <Main component> ............................... 208 11.3 Accessory ............................................. 226

4. TROUBLE SHOOTING.......................93
4.1 RF Component ..........................................93 4.2 SIGNAL PATH ...........................................94 4.3 Checking VCTCXO Block ..........................96 4.4 Checking Front-End Module Block ............98 4.5 Checking UMTS Block.............................101 4.6 Checking GSM Block...............................106 4.7 Power on trouble......................................112 4.8 SIM detect trouble....................................117 4.9 Key sense trouble ( KEYPAD ) ................118 4.10 Keypad backlight trouble .......................120

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1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

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1. INTRODUCTION

E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.

• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. • Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used. • When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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2. PERFORMANCE

2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time with 1000mAh) Standby Time (with 1000mAh) Antenna LCD LCD Backlight Camera Vibrator LED Indicator MIC Receiver Earphone Jack Connectivity External Memory I/O Connect Specification GSM900/1800/1900 and WCDMA2100 - Bar type Handset 103.5 X 54.4 X 14.8 mm Under 112 g (with 1000mAh Battery) 3.7 V normal, 1000 mAh Li-Ion Over 170 min (WCDMA, Tx=10 dBm, Voice) Over 200 min (GSM, Max Tx-29dBm, Voice) Over 250 Hrs (WCDMA, DRX=1.28) Over 250 Hrs (GSM, Paging period=5) Internal type Main 3” TFT, WQVGA, 262K White LED Back Light 5.0 Mega pixel + VGA Video Call Camera Yes (Coin Type) No Yes Yes Yes (18 pin) Bluetooth, USB Yes(Micro SD) 18 Pin

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2. PERFORMANCE

2.2 Usable environment
1) Environment
Item Voltage Operation Temp Storage Temp Humidity Specification 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] -20 ~ +60°C -30 ~ +80°C 85 % (Max)

2) Environment (Accessory)
Reference TA Power * CLA : 12 ~ 24 V(DC) Spec. Available power Min 100 Typ. 220 Max 240 Unit Vac

2.3 Radio Performance
1) Transmitter - GSM Mode
No Item 100k~1GHz MS allocated Channel 1G~12.75GHz Conducted 1 Spurious Emission Idle Mode 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz
* In case of DCS : [A] -> 1710, [B] -> 1785 LGE Internal Use Only

GSM -39dBm

DCS & PCS 9k ~ 1GHz 1G~[A]MHz [A]M~[B]MHz -33dBm [B]M~12.75GHz -33dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm 100k~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz -39dBm -33dBm -39dBm

100k~880MHz 880M~915MHz 915M~1GHz

* In case of PCS : [A] -> 1850, [B] -> 1910

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2. PERFORMANCE

No

Item 30M ~ 1GHz MS allocated Channel 1G ~ 4GHz Radiated

GSM -36dBm

DCS & PCS 30M~1GHz 1G~[A]MHz [A]M~[B]MHz -30dBm [B]M~4GHz -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm 30M~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz ±0.1ppm ±5(RMS) ±20(PEAK) -36dBm -30dBm -36dBm

2

Spurious Emission Idle Mode

30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz

3 4

Frequency Error Phase Error

±0.1ppm ±5(RMS) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity Frequency Error 5 Under Multipath and Interference Condition RA250 : ±200Hz HT100 : ±100Hz TU50 : ±100Hz TU3 : ±150Hz 0 ~ 100kHz 200kHz 250kHz Due to modulation Output RF 6 Spectrum 3000 ~ 6000kHz ≥6000kHz 400kHz Due to 600kHz Switching 1200kHz transient 1800kHz
** In case of DCS : [A] -> 1710, [B] -> 1785

RA250: ±250Hz HT100: ±250Hz TU50: ±150Hz TU1.5: ±200Hz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB 400kHz 600kHz 1200kHz 1800kHz -22dB -24dB -24dB -27dB 0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz ≥6000kHz +0.5dB -30dB -33dB -60dB -60dB -65dB -73dB

400kHz 600 ~ 1800kHz 1800 ~ 3000kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

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No

Item

GSM

DCS & PCS Frequency offset 800kHz

Intermodulation product should 7 Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level 5 6 7 8 9 10 8 Transmitter Output Power 11 12 13 14 15 16 17 18 19 (dBm) 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 (dB) ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±5 ±5 ±5 ±5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 9 Burst timing Mask IN (dBm) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Mask IN (dB) ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±3 ±4 ±4 ±4 ±4 ±4 ±5 ±5

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2. PERFORMANCE

2) Transmitter - WCDMA Mode

No 1 2 3

Item Maximum Output Power Frequency Error Open Loop Power control in uplink

Specification Class 3 : +24dBm(+1/-3dB) ±0.1ppm ±9dB@normal, ±12dB@extreme Adjust output(TPC command) cmd +1 1dB +0.5/1.5 2dB +1/3 3dB +1.5/4.5

4

Inner Loop Power control in uplink

0 -1

-0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24

-50dBm(3.84MHz) Qin/Qout : PCCH quality levels

6

Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB

7 8

Transmit OFF Power Transmit ON/OFF Time Mask

-56dBm(3.84MHz) ±25us PRACH,CPCH,uplinlk compressed mode ±25us Power varies according to the data rate

9

Change of TFC DTX : DPCH off (minimize interference between UE)

10 11

Power setting in uplink compressed Occupied Bandwidth(OBW)

±3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k -35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

12

Spectrum emission Mask -39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M -49dBc@∆f=8.5~12.5MHz,1M

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2. PERFORMANCE

No 13

Item Adjacent Channel Leakage Ratio(ACLR)

Specification 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW

Spurious Emissions 14 (*: additional requirement)

-30dBm@f=1~12.5GHz, 1M BW (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc

15

Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm)

16

Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code

17

Transmit OFF Power transmission

3)Receiver - GSM Mode

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2. PERFORMANCE

3) Transmitter - HSDPA Mode
No 1 Item Sub-Test Maximum Output Power 1=1/15, 3=13/15 5=15/7 Sub-test in table C.10.1.4 2 HS-DPCCH 1 5 2 3 4 3 Spectrum Emission Mask Start of CQI Middle of CQI End of CQI step 2=12/15 4=15/8 6=15/0 boundary 21~25dBm / 3.84 MHz 20~25dBm / 3.84 MHz 19~25dBm / 3.84 MHz step [dB] Start of Ack/Nack 6 1 0 5 power step [dB] +/- 2.3 +/- 0.6 +/- 0.6 +/- 2.3 Specification

Power Start of Ack/Nack Power Transmitter size, P tolerance

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 Frequency offset from carrier ∆f 2.5 ~ 3.5 MHz 3.5 ~ 7.5 MHz 7.5 ~ 8.5 MHz 8.5 ~ 12.5 MHz Minimum requirement -35-15(∆f-2.5)dBc -35-1(∆f-3.5)dBc -35-10(∆f-7.5)dBc -49dBc Measurement Bandwidth 30 kHz 1 MHz 1 MHz 1 MHz

4

Adjacent Channel Leakage Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 > 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

5

Error Vector Magnitude

3GPP Not Complete

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2. PERFORMANCE

4)Receiver - GSM Mode
No 1 2 (TCH/FS Class II, RBER, TU high/FH) 3 Adjacent Channel Rejection 200kHz 400kHz C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-98dBm 1st 4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-45dBm Blocking Response 5 (TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency Wanted Signal :-101dBm C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-44dBm Wanted Signal :-101dBm Item Sensitivity (TCH/FS Class II) Co-Channel Rejection C/Ic=7dB Storage -30 ~ +85 GSM -105dBm DCS & PCS -105dBm

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2. PERFORMANCE

5) Receiver - WCDMA Mode
No 1 Item Reference Sensitivity Level Specification -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and 5 Out-band Blocking 2230~2255MHz UE@+20dBm output power(Class3) -15dBm/3.84MHz@f=1~2025 and 2255~12500MHz UE@+20dBm output power(Class3) -44dBm CW 6 Spurious Response UE@+20dBm output power(Class3) -46dBm CW@10MHz 7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz UE@+20dBm output power(Class3) -57dBm@f=9KHz~1GHz, 100K BW 8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW -60dBm@f=1920MHz~1980MHz, 3.84M BW -60dBm@f=2110MHz~2170MHz, 3.84M BW

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2. PERFORMANCE

6) Receiver - HSDPA Mode
No 1 Item Maximum Input Level (BLER or R), 16QAM Only Specification Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 BLER < 10% or R >= 700kbps

2.4 Current Consumption
1) KU990/U990 Current Consumption
Stand by Under 4.00 mA WCDMA (DRX=1.28) Under 4.00 mA GSM Paging=5 period Voice Call Under 350 mA (Tx=10dBm) Under 300 mA (Tx=29dBm) VT Under 550mA (Tx=10dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On)

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2.5 RSSI BAR
Level Change BAR 4 → 3 BAR 3 → 2 BAR 2 → 1 BAR 1 → 0 WCDMA -88 ± 2 dBm -98 ± 2 dBm -108 ± 2 dBm -112 ± 2 dBm GSM -90 ± 2 dBm -95 ± 2 dBm -100 ± 2 dBm -106 ± 2 dBm

2.6 Battery BAR
Indication Bar 4 Bar 4 → 3 Bar 3 → 2 Bar 2 → 1 Bar 1 → Empty Low Voltage, Warning message+ Blinking Power Off Standby Over 3.81 ± 0.03V 3.80 ± 0.03V 3.70 ± 0.03V 3.61 ± 0.03V 3.49 ± 0.03V 3.49 ± 0.03V (Stand-by) / 3.49 ± 0.03V (Talk) [Interval : 3min(Stand-by) / 1min(Talk)] 3.20 ± 0.03V (Stand-by) 3.10 ± 0.03V (Talk)

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2.7 Sound Pressure Level
No 1 2 3 4 5 6 7 8 9 10 11 12 Test Item Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) TDMA Noise -. GSM : Power Level : 5 DCS/PCS : Power Level : 0 (Cell Power : -90 ~ -105 dBm) 13 -. Acoustic (Max Vol.) MS/Headset SLR : 8 ± 3dB MS/Headset RLR : -15 ± 3dB/-12dB (SLR/RLR : Mid-value setting) MS and Headset Max Under -62 dBm Headset Nor Max Min Min Max Nor Max MS Nor Max Min Min Max Nor Max Specification 8 ±3 dB -4 ± 3 dB -15 ± 3 dB 17 dB 40 dB -64 dBm0p Under -47 dBPA Under -36 dBPA 8±3dB -1 ±3 dB -12 ±3 dB 25 dB 40 dB -55 dBm0p Under -45 dBPA Under -40 dBPA

2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage) • Maximum Charging Voltage : 4.2 V • Maximum Charging Current : 600 mA • Normal Battery Capacity : 1000 mAh • Charging Time : Max 3 hours (except for trickle charging time) • Full charging indication current (charging icon stop current) : 80 mA • Cut-off voltage : 3.20 V (Stand-By), 3.10V (Talk)

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3. TECHNICAL BRIEF

3. TECHNICAL BRIEF
3.1 General Description
The U990 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

[Fig 1.1] Block diagram of RF part

1

QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

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3. TECHNICAL BRIEF

A generic, high-level functional block diagram of U990 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC. For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver. In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology: 1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF; 2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM U990 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

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3. TECHNICAL BRIEF

3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U990’s receiver functions are split between the three RFICs as follows: • GSM-900, DCS-1800, PCS-1900 and UMTS-2100 modes both use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2controlled parameters. RF Front end consists of antenna, antenna switch module (LSHS-M090UH) which includes three RX saw filters (GSM-900, DCS-1800 and PCS-1900). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U990, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS1800, PCS-1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM900, DCS1800, and PCS1900 operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. Control Logic (L : 0 ~ 0.1V, H : 2.6 ~ 2.8V) Vc3 GSM900 Tx DCS1800/PCS1900 Tx UMTS Tx/Rx GSM 900 Rx DCS 1800 Rx PCS 1900 Rx L/H : L and H are acceptable [Table 1.1] Antenna Switch Module Control logic L L H L H L Vc2 H L L L/H L/H L/H Vc1 H H H L L L Vdd H H H H H H

2

The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details.

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3. TECHNICAL BRIEF

The GSM900, DCS1800, and PCS1900 receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM900, DCS1800, and PCS1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since GSM900, DCS1800, and PCS1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module. The GSM900, DCS1800, and PCS1900 receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ωsources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6275 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range. The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6280 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs)

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3. TECHNICAL BRIEF

[Fig 1.2] RTR6275 RX feature

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3. TECHNICAL BRIEF

3.2.2 GSM Transmitter
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.

6pF

68Ω

91Ω 5pF 51Ω

91Ω

120Ω

120Ω

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band

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3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface. The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.

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[Figure 1.4] RTR6275 IC functional block diagram

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3.4 LO generation and distribution circuits
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF. Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS 2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, DCS1800, and PCS1900. The second synthesizer (PLL2) provides the LO for the UMTS 2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components onchip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.

3.5 Off-chip RF Components
3.5.1 UMTS PAM (U105: AWT6277R)
The UMTS PA output power is monitored by power detector circuits (U101 : RTR6275) . This detector voltage can be used for transmitter calibration and monitor to meet RF system specification.

FL104
EFCH1950TDF1
2 1 GND1 4 GND2 8 GND3
C159 +VPWR 8.2p C160 22u C162 0.01u C163 100p C164 1u L124 L123 15nH
4 5
IN G2 G1

FL103
SAYZY1G95EB0B00

ANT

C161
1

O1 G3

3 GND6 6 GND5 9 GND4

WCDMA_2100_TX_OUT C165 NA 56p L122 NA

RX

TX

3

2

7

5

U105
U104
SCDY0003403
1 2 OUT
4.7nH L128 C170 1.8p L126 8.2nH 11 10 9 8 7 6 GND5 VCC2 GND4 RFOUT GND3 GND2 VCC1 RFIN GND1 VMODE VREF 1 2 3 4 5

3.3nH

C169 5.6p

PA_R1

IN

Q100
VREG_TCXO_2.85V
4

50OHM

COUP

AWT6277R
C173 100p R123 PWR_DET 68

3

20dB

PA_ON

4

3

R124 51 R125 100

5

KRX102E

R126 100 8 dB

[Figure 1.5] UMTS PAM, Duplexer, Coupler

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1

2

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3.5.2 VCTCXO (X100 : TG-5010LH(19.2M))
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6280 IC. The oscillator frequency is controlled by the MSM6280 IC.s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line. The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM6280 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6275 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (FL100 : LSHS-M090UH)
This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10], and GPIO[11]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and ANT_SEL2 respectively.

Vc3 GSM900 Tx DCS1800/PCS1900 Tx UMTS Tx/Rx GSM 900 Rx DCS 1800 Rx PCS 1900 Rx L L H L H L

Vc2 H L L L L L

Vc1 H H H L L L

Vdd H H H H H H

[Table 1.2] Front End Module control logic

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3.5.4 PMIC Functional Block Diagram (U501 : PM6650-2M)
• Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltage, and pulsed charging of the main battery - Supports coin cell backup battery (including charging) - Battery voltage detectors with programmable thresholds - VDD collapse protection - Charger current regulation and real-time monitoring for over-current protection - Charger transistor protection by power limit control - Control drivers for two external pass transistors and one external battery MOSFET MOSFET is optional - Voltage, current, and power control loops - Automated recovery from sudden momentary power loss • Output voltage regulation - One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG - Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA (or second MSMC) supply voltages - Supports dynamic voltage scaling (DVS) for MSMC and PA - Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits. - All regulators can be individually enabled/disabled for power savings - Low power mode available on MSMA and MSMP regulators - All regulated outputs are derived from a common bandgap referenceclose tracking • Integrated handset-level housekeeping functions reduces external parts count, size, cost - Analog multiplexer selects from 8 internal and up to 18 external inputs - Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution - Adjusted multiplexer output is buffered and routed to an MSM device ADC - Dual oscillators -32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock - Crystal oscillator detector and automated switch-over upon lost oscillation - Real time clock for tracking time and generating associated alarms - On-chip adjustments minimize crystal oscillator frequency errors - Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal - TCXO buffer control for optimal QPH/catnap timing - Three-stage over-temperature protection (smart thermal control) • Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 Ω speakers with volume controlled 500 mW)
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• IC-level interfaces - MSM device-compatible 3-line SBI for efficient initialization, status, and control - Supports the MSM devices interrupt processing with an internal interrupt manager - Many functions monitored and reported through real-time and interrupt status signals - Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal - Several events continuously monitored for triggering power-on/power-off sequences - Supports and orchestrates soft resets - USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals - RUIM level translators enable MSM device interfacing with external modules • Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer. • Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief

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[Figure 1.7] PM6650 Block Diagram

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3.5.5 GSM PAM (U101:TQM7M5003)
The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset applications. This module has been optimized for excellent EDGE efficiency and Pout in a Polar Loop environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability 3 rd generation InGaP HBT technology. With 50ߟ and output, no external matching or bias components are required. The module incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the AM/AM path in EDGE operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a low-profile overmolded landgrid array on laminate.

14 13 12 11 C136 8p 10 C138 L112 NA 15nH 8 9

GND6 GND5 VCC GND4 GND3

DCS_PCS_IN BS U101 TQM7M5003 TX_EN VBATT GND1 VRAMP GSM_IN

1 2 3 4 5 6 7 C137 1u C135 33u GSM_PA_BAND GSM_PA_EN +VPWR R112 91

R111 DCS_PCS_TX 68 R113 91

10 dB

DCS_PCS_OUT

GND8

GND7

GSM_OUT GND2

FL101
3
EFCH897MTDB1

2

G2 G1 IN O1 G3

R114
1

GSM_TX 51 8 dB R118 120 R119 120

17

16

15

4

5

R117

2.2K GSM_PA_RAMP

C146

10p

C143 68p

C142 0.75p

L113 4.7nH GSM_PA_BAND LOW
PQ

MODE GSM DCS/PCS

HIGH

[Figure 1. 8] GSM PAM Schematic

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3.5.6 UMTS Duplexer(FL103:SAYZY1G95EB0B00)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; • Insertion loss, this component is also in the receive and transmit paths ; In the U990 typical losses : UMTS2100_ Tx = 1.5 dB, UMTS2100_ Rx = 1.8 dB • Out-of-band rejection or attenuation, the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: • Rx-band isolation, the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7 dB. • Tx-band isolation, the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 51.7dB. • Passband ripple, the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled. • Return loss, minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). • Power handling, high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

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3.5.7 UMTS Rx RF filter (FL102 : EFCH2140TDE1)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: • Out-of-band rejection or attenuation levels, usually specified to meet these conditions: - Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. - Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. - Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

[Table 1.3] UMTS Rx SAW Filter Specification

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3.5.8 Bluetooth (M800 : LBRQ-2B43A)
The MSM6280 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U990.

[Figure 1.9] Bluetooth system architecture

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3.5.9 FM Radio (U103 : TEA5766UK)
This FM Module is a single chip, electronically tuned, FM stereo radio with RDS/RBDS demodulator and decoder for low voltage applications, with fully integrated IF selectivity and demodulation. This equipment tunes the European, US, and Japanese FM bands. Figure1.10 shows the FM Radio system architecture in the U990.

[Figure 1.10] FM Radio system architecture in the U990

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3. BB Technical Description
3.6 Digital Baseband (DBB/MSM6280)
3.6.1 General Description
A. Features (MSM6280)
• Support for multimode operation - HSDPA, tri-band WCDMA (UMTS), quad GSM/GPRS/EDGE • Support for HSDPA downlink up to 7.2Mbps (initial commercial release will support 3.6Mbps • HSDPA. Later releases will have support for 7.2 Mbps HSDPA) • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz (later at 270 MHz for 7.2 Mbps HSDPA) • ARM Jazelle Java hardware acceleration for faster Java-based games and other applets • QDSP4000 high-performance DSP cores • Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals • QcameraTM with 15 fps QVGA viewfinder resolution, and support for 4 MP camera sensors • Direct interface to digital camera module with video front end (VFE) image processing • True 3D graphics for advanced wireless gaming • SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Q-fuse. • Audio on par with portable music players • Vocoder support (AMR, FR, EFR, HR) • Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology • SD/SDIO hardware support

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Figure. Simplified Block Diagram of Baseband

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Figure. Simplified Block Diagram of RF

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3.7 Subsystem(MSM6280)
3.7.1. ARM Microprocessor Subsystem
The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NAND-Flash devices. Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.

3.7.2 WCDMA R99 features
The MSM6280 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features: ■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions: ❏ The downlink supports the following specifications: - Up to four physical channels, including the broadcast channel (BCH), if present - Up to three dedicated physical channels (DPCHs) - Spreading factor (SF) range support from 4 to 256 - The following transmit diversity modes are supported: Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD) ■ The uplink supports the following specifications: ❏ The uplink provides the following UE support: - One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary - A maximum data rate of 384 kbps ❏ Full SF range support from 4 to 256 ■ SMS (CS and PS) ■ PS data rate - 384 kbps DL / 384 kbps UL ■ CS data rate - 64 kbps DL / 64 kbps UL ■ AMR (all rates)

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3.7.3 HSDPA features
The MSM6280 device supports the HSDPA release 5 standard: ■ Supports HS-DSCH (HS-SCCH, HS-PDSCH and HS-DPCCH) in addition to the R99 transport channels as defined in 3GPP specifications. ■ Supports a maximum of four simultaneous HS-SCCH channels as defined in 3GPP specifications. ■ Supports a maximum of 10 HS-PDSCH channels and supports both QPSK and 16 QAM modulation. It supports UE category 6 in SW release 2.0 and category 8 in SW release 4.0. ■ Supports CQI, and ACK/NACK on HS-DPCCH channel as defined in 3GPP specifications. ■ Supports all incremental redundancy versions for HARQ, as defined in 3GPP specifications. ■ Can switch between HS-PDSCH and DPCH channel resources, as directed by the network. ■ Can be configured to support any of the two power classes 3 or 4 as defined in 3GPP R5 specifications (25.101). ■ Supports network activation of compressed mode by SF/2 or HLS on the DPCH for conducting interfrequency or inter-RAT measurements when the HS-DSCH is active. ■ Supports STTD on both associated DPCH and HS-DSCH simultaneously. ■ Supports CLTD mode 1 on the DPCH when the HS-PDSCH is active. ■ Supports STTD on HS-SCCH when either STTD or CLTD Mode 1 are configured on the associated DPCH. ■ Supports TFC selection limitation on the UL factoring in the transmissions on the HS-DPCCH as required in TS 25.133.

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3.7.4 GSM features
The following GSM modes and data rates are supported by the MSM6280 device hardware. Support modes conform to release '99 specifications of the sub-feature. ■ Voice features ❏ FR ❏ EFR ❏ AMR ❏ HR ❏ A5/1, A5/2, and A5/3 ciphering ■ Circuit-switched data features ❏ 9.6k ❏ 14.4k ❏ Fax ❏ Transparent and non-transparent modes for CS data and fax ❏ No sub-rates are supported.

3.7.5 GPRS features
■ Packet switched data (GPRS) ❏ DTM (Simple Class A) operation ❏ Multi-slot class 12 data services ❏ CS schemes: CS1, CS2, CS3, and CS4 ❏ GEA1, GEA2, and GEA3 ciphering ■ Maximum of four Rx timeslots per frame

3.7.6 EDGE features
■ EDGE E2 power class for 8 PSK ■ DTM (simple Class A), multi-slot class 12 ■ Downlink coding schemes - CS 1-4, MCS 1-9 ■ Uplink coding schemes - CS 1-4, MCS 1-9 ■ BEP reporting ■ SRB loopback and test mode B ■ 8-bit, 11-bit RACH ■ PBCCH support ■ 1 phase/2 phase access procedures ■ Link adaptation and IR ■ NACC, extended UL TBF.

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3.7.7 MSM6280 device audio processing features
■ Integrated wideband stereo CODEC ❏ 16-bit DAC with typical 88 dB dynamic range ❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path ■ VR- Voice mail + voice memo ■ Acoustic echo cancellation ■ Audio AGC ■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) ■ Internal vocoder supporting AMR, FR, EFR, and HR

3.7.8 MSM6280 microprocessor subsystem
■ Industry standard ARM926EJ-S embedded microprocessor subsystem ❏ 16 kB instruction and 16 kB data cache ❏ Instruction set compatible with ARM7TDMI® ❏ ARM version 5TEJ instructions ❏ Higher performance 5 stage pipeline, Harvard cached architecture ❏ Higher internal CPU clock rate with on-chip cache ■ Java hardware acceleration ■ Enhanced memory support Please note that NOR/PSRAM will not be supported on MSM6280. ❏ 75 MHz and 90 MHz bus clock for SDRAM ❏ 32-bit SDRAM ❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels ❏ 1.8 V or 2.6 V memory interface support (excluding EBI1) ❏ NAND FLASH memory interface - 8/16-bit data I/O width NAND flash support - 1- or 4-bit ECC - 512-byte/2KB page-size support - 2 chip selects supported for NAND Flash ❏ Boot from NAND ❏ Low-power SDRAM (LP-SDRAM) interface ■ Internal watchdog and sleep timers

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3.7.9 Supported interface features
■ USB On-the-Go core supports both slave and host functionality ■ Three universal asynchronous receiver transmitter (UART) serial ports ■ USIM controller (via UART) ■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards ■ Parallel LCD interface ■ General-purpose I/O pins ■ External keypad interface

3.7.10 Supported multimedia features
■ Provide additional general purpose MIPS by using: ❏ Two QDSP4000s ❏ Dedicated hardware accelerators and compression engines ■ Improve Java, BREW, and game performance ❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine ■ Enable various accessories via USB host connectivity. ❏ Integrated USB host controller functionality ■ Enable compelling visual and audio applications. QcameraTM ■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 4-megapixel with 15 fps capture rate ■ 15 fps QVGA viewfinder QtvTM ■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. ■ Audio Codecs supported: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows® Audio v9, RealAudio® v8 ■ Integrated stereo wideband Codec for music/digital clips ■ CMX ■ Video Codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10 Video telephony services: QvideophoneTM ■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF ■ Video Codecs supported: MPEG-4 and H.263 ■ Audio Codecs supported: AMR-NB.

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QcamcorderTM ■ Real time mobile video encoder ■ Video Codecs supported: MPEG-4, H.263.H.264 ■ Audio Codecs supported: AMR-NB, AAC ■ Recording performance: 15 fps @ QVGA, 384 kbps gpsOneTM ■ Integrated gpsOne processing ■ Standalone gpsOne mode in which the handset acts as a GPS receiver CMXTM (MIDI and still image, animation, text, LED/vibrate support) ■ 72 simultaneous polyphonic tones ■ 44 kHz sampling rate ■ 512 kB wave table ■ Support of universal file formats ❏ Standard MIDI Format (SMF) ❏ SP-MIDI ❏ SMAF Audio playback (MA-2, MA-3, MA-5) ❏ XMF/OLS ❏ MFil (requires Docomo license) ■ PNG decoder ■ Pitch bend range support ■ LED/vibrate support ■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) ■ MLZ decoder ■ Integrated PNG/SAF A.T.

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3.7.11 Serial Bus Interface(SBI)
The MSM6280 device’s SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6275, RFR6275 and PM6650 ASICs. Using the SSBI, the RTR6275, RFR6275, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SSBI also controls DC baseband offset errors.

3.7.12 Wideband CODEC
The MSM6280 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6280 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set interally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

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3. TECHNICAL BRIEF

3.7.13 Vocoder Subsystem
The MSM6280 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6280 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.7.14 ARM Microprocessor subsystem
The MSM6280 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.

3.7.15 Mode Select and JTAG Interfaces
The mode pins to the MSM6280 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6280 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

3.7.16 General-Purpose Input/Output Interface
The MSM6280 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.7.17 UART
The MSM6280 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins. ■ UART1 for data ■ UART2 (can be used for USIM interface) ■ UART3 for data

3.7.18 USB
The MSM6280 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host.

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3. TECHNICAL BRIEF

3.8 Power Block
3.8.1 General
MSM6280, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6280, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are : PM6650 : Phone power supply AAT3169 : LCD Backlight/Flash charge pump

3.8.2 PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

LGE Internal Use Only

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3. TECHNICAL BRIEF

Figure 1-1. PM6650 Functional Block Diagram

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3. TECHNICAL BRIEF

3.8.3 Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

4.2V~3.81V 100~70 (%)

3.80V~3.71V 69~45 (%)

3.70V~3.62V 44~20 (%)

3.61V~3.50V 19~3 (%)

3.49V~3.28V 2~0 (%)

KU990 Battery Bar Display(Stand By Condition)

LGE Internal Use Only

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3. TECHNICAL BRIEF

Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter Trickle Current

Min 60

Typ 80

Max 100

Unit mA

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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3. TECHNICAL BRIEF

Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current. • Charging Method : CC & CV (Constant Current & Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 600mA • Nominal Battery Capacity : 1000mAh • Charger Voltage : 5.1V • Charging time : Max 3h (Except time trickle charging) • Full charge indication current (icon stop current) : 100mA • Low battery POP UP : Idle - 3.49V, Dedicated(GSM/WCDMA) - 3.49V • Low battery alarm interval : Idle - 3 min, Dedicated - 1min • Cut-off voltage : 3.20V(idle), 3.1V(call)

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.9 External memory interface
The MSM6280 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, etc. In addition, MSM6280 provide SD bus interface. KU990 supports 512MByte free user memory using SD interface. • EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support • EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices (UB_N & LB_N signals). - 2Mbytes of memory per chip select. - Support for 8 bit/16bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit). • 2Gb NAND(16bit, Large Block ) flash memory + 1Gb SDRAM (32bit) • 1-CS(Chip Select) are used. • The SD bus allows the dynamic configuration of the number of data line from 1 to 4 Bidirectional data signal. After power up by default, the Device will use only DAT0. After initialization, host can change the bus width.
Interface Spec Device NAND SDRAM Part Name TYA000BC00DOGG TYA000BC00DOGG Maker Toshiba Toshiba Read Access Time 50 ns 15 ns Write Access Time 30 ns 15 ns

Table#1. External memory interface

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3. TECHNICAL BRIEF

EBI1
ADDRESS[14: 0] DATA[31:0]

EBI2

NAND_CS* NAND_RE*

SDRAM 1Gbit
(512M x 2)

WE* CS* CAS* RAS* CLK_EN CLK DQM[3:0]

NAND_WE*

MSM6280

NAND_CLE NAND_WP* NAND_ALE NAND_READY DATA[15:0]

NAND 2Gb (256MB)

Figure. Simplified Block Diagram of Memory Interface

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.10 H/W Sub System
3.10.1 RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6280 controls RF part(RTR6275) using these signals. • SBST : SSBI I/F signals for control Sub-chipset • PA_ON1 : Power AMP on RF part • RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF • TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier • DAC_REF : Reference input to the MSM Tx data DACs
SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93
H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 R215 H13

LIN_INVERTER LIN_MOTOR_EN CAM_MCLK LCD_IF_MODE USB_SELECT_N CAM_MODE3_N VGA_CAM_PWDN LCD_LDO_EN MICROSD_DETECT HOOK_SENSE_N RMT_INT

0

HP_AMP_EN CAM_SELECT_N LCD_RESET_N MMP_INT_N R211 TCXO_EN PA_ON (WCMDA 2100 PAM Enable) TX_QM TX_QP TX_IM TX_IP DAC_REF 2K C223 33nF TX_AGC_ADJ TRK_LO_ADJ

TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0

A12 B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25

RX_QM RX_QP RX_IM RX_IP

GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20
H15 D16 F15 D15 A17 H16 K19 N21 G4 J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19 A22

D17

PA_R1 LIN_PWM_MAG

MMP_HPCM_CLK MMP_HPCM_DI MMP_HPCM_DO MMP_HPCM_FSYNC TX_ON ANT_SEL2 ANT_SEL1 ANT_SEL0 CAM_MODE1_N FM_INTX FM_BUSEN GSM_PA_BAND GSM_PA_EN VGA_CAM_RESET_N BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA R213 NA

Figure. Schematic of RF Interface of MSM6280

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3. TECHNICAL BRIEF

B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA(2100) TX Power Amp Enable • ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) • GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp • GSM_PA_RAMP : Power Amp Gain Control of APC_IC • GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.10.2 MSM Sub System
3.10.2.1. USIM Interface
SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx

VREG_UIM 2.85V USIM CLK USIM Reset USIM CLK

MSM6280

PM6650

USIM Reset USIM Data

USIM

USIM Data

Figure. SIM Interface

3.10.2.2 UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map GPIO_96 GPIO_95

Name UART_RXD UART_TXD

Note Data_Rx Data_Tx Table. UART Interface

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3. TECHNICAL BRIEF

3.10.2.3 USB
The MSM6280 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6280 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6280.
Name USB_DAT USB_SE0 USB_OE_N USB_VBUS USB_D+ USB_D Note Data to/from MSM Data to/from MSM Out-Put Enable of Transceiver USB_Power From Host(PC) USB Data+ to Host USB Data- to Host

Table. USB Signal Interface

MMC_CMD_GPIO MMC_DATA_SDC M16 MMC_CLK_SDCC
L14

USB_DAT_VP USB_SE0_VM N25 USB_OE_TP_N
N23

GPIO40 GPIO42

N26

H14

D6

D7

USB_VBUS

16

USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N(M

4.7u

47K

C540

R514

USB_DAT MSM_USB_D+ USB_SE0 MSM_USB_D-

17 18 19 20 21

PM_INT_N PS_HOLD

Figure. Schematic of USB block(MSM6280 Side & PM6650 Side)

LGE Internal Use Only

ICROSD_CMD OSD_DATA[0] MICROSD_CLK

USB_DAT USB_SE0 USB_OE_N

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3. TECHNICAL BRIEF

3.10.3 HKADC(House Keeping ADC)
The MSM6280 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6280 device has six analog input pins which are multiplexed to the input of the internal HKADC.

Figure. MSM6280HKADC Block diagram

Channel HKADC0 HKADC1 HKADC2 HKADC3 HKADC4 HKADC5

Signal AMUX_OUT VBATT_SENSE REF_ADC TTY_ADC_DET PCB_Rev_ADC Battery_THERM

Note RF PAM Temperature Check Battery voltage level ADC Reference voltage Ear jack Detection for TTY PCB Version Check Battery Temperature Check

Table. HKADC channel table

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3. TECHNICAL BRIEF

3.10.4 Key Pad
There are 5 key buttons. Shows the Key Matrix & Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).

COL(0) ROW(0) ROW(1) ROW(2) Lock

COL(1)

Capture
AF

SEND

CLR

Table. Key Matrix Mapping Table

VREG_MSMP_2.7V

R701

51K

700
SEND

701
CLR

KEY_ROW[2]

KEY_COL[0] KEY_COL[1]

EVLC14S02050

EVLC14S02050 VA702

Figure. Main Keypad Circuit

LGE Internal Use Only

VA701

VA703

EVLC14S02050

- 60 -

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3. TECHNICAL BRIEF

1100
SW1100

KEY_ROW[0]

LOCK KEY

CAMERA FOCUS

KEY_ROW[1]

KEY_COL[0] KEY_COL[1]

Figure. Side Keypad Circuit

END PM_ON_SW_N
END

EVL14K02200

ON_SW KEY
Figure. END Keypad Circuit

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

VA700

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.5 Camera Interface
U990 Installed a 5M Pixel and 0.3Mega Camera. Below figure shows the camera board to board connector and camera I/F signal.
CAM_VDD_AF_2.7V

CAM_VDD_SA_2.7V CAM_VDD_CORE_1.2V C601 0.1u C602 1u C600 10u CAM_VDD_SD_1.8V CAM_VDD_IO_2.7V

0.1u

1u

C605 0.1u

CN600 MMP_I2C_SCL MMP_I2C_SDA MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_RESET_N STROBE_TRIGGER 5M_CAM_DATA[6] 5M_CAM_DATA[4] 5M_CAM_DATA[2] 5M_CAM_DATA[0] R607 5M_CAM_MCLK R601 10 R602 10 R603 R604 10 10 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

C609

C608

GB042-30S-H10-E3000

C606 0.1u

C607 0.1u

MMP_CAM_INT 5M_CAM_DATA[7] 5M_CAM_DATA[5] 5M_CAM_DATA[3] 5M_CAM_DATA[1] R608 10 MMP_CAM_PCLK

VA600

VA602

ICVL0518100Y500FR

EVLC18S02015

C610 C611 C612 C613 10p 10p 10p 10p

C614 0.1u

VGA_VDD_2.7V VGA_VDD_1.8V

CN701 VGA_CAM_PWDN VGA_CAM_MCLK MMP_CAM_PCLK VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] VGA_CAM_DATA[4] VGA_CAM_DATA[5] MOTOR+ MOTORRCV+ RCVR717 10 R718 10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

ICVL0518100Y500FR

VA601

33

R719 10 R720 10 R724 R725 10 10

VGA_CAM_RESET_N I2C_SCL I2C_SDA MMP_CAM_HSYNC MMP_CAM_VSYNC VGA_CAM_DATA[7] VGA_CAM_DATA[6] x+ Y+ xY-

VA713

VA714

R729

ICVL0518100Y500FR

EVLC18S02015

NA

Figure. Camera PCB Board to Board Connector

LGE Internal Use Only

resistor

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

EVLC18S02015

C710 0.1u

C711 0.1u

C712 C713 C709 10p 10p 0.1u

VA715
C714 C715 10p 10p

3. TECHNICAL BRIEF

The MEGA Camera module is connected to Main PCB with 30pin Board to Board connector Its interface is dedicated camera interface port in Multimedia chip. The camera port supply 13MHz master clock to camera module, vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from Multimedia chip. [ Pin Description ]

Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)

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3. TECHNICAL BRIEF

The VGA Camera module is connected to FPCB with 20pin Board to Board connector (AXK720147G). Its interface is dedicated camera interface port in MSM6280. The camera port supply 13.MHz master clock to camera module and receive 13MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6280. [ Pin Description ]

No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Name CAM_PWDN CAM_MCLK GND CAM_PCLK CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5) CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC GND I2C_SCD I2C_SCL CAM_RESET_N VREG_MSMP_2.8V VREG_CAM_2.8V

Port i I GND O O O O O O O O O O O GND I I I I I

Note Camera power down Master Clock(24M) GND Clock for Camera Data Out(13M) Data Data Data Data Data Data Data Data Vertical Synch Horizontal Sync GND I2C Clock I2C Clock Camera reset signal Camera I/O Power Camera I/O Power

Table. Interface between VGA Camera Module and FPCB (in camera module)

LGE Internal Use Only

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3.10.6 LCD Module (LS030B3UX01 : SHARP)
- The IM220DBN2A model is a Color TFT Main supplied by SHARP. This LCD Module has a 3.0 inch diagonally measured active display area with 240(RGB)X400 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors - LCD Driver IC: LS030B3UX01(Magnachip) - Driving Method : A-Si TFT Active Matrix - 16 bit CPU interface Parallel

LCD_RESET_N

MMP_CS_N

MMP_LCD_CS_N MMP_LCD_RD_N

MSM6280

EBI2_OE_N EBI2_WE_N EBI2_ADDR[11] EBI2_DATA[0:15] LCD_MAKER_ID LCD_IF_MODE

LCD 3.0î TFT(WQVGA)

Multimedia Chip

MMP_LCD_WE_N MMP_LCD_ADS MMP_LCD_DATA[0:15]

Figure. LCD Module Block Diagram

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3. TECHNICAL BRIEF

3.10.7 Display
LCD module is connected to Main PCB with 40 pin B TO B connector The LCD module is controlled by 16-bit EBI2 in MSM6280 via Multimedia Chip.
LCD_VDD_2.8V

VA300 ICVN0505X150FR

C320 NA

C321 0.1u

CN300 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 MMP_LCD_VSYNC_IN LCD_MAKER_ID WLED_PWR WLED_1 WLED_2 WLED_3 WLED_4 WLED_5 LCD_IF_MODE R314 R315 R316 R317 51 51 51 51 R318 0 MMP_LCD_ADS MMP_LCD_CS_N LCD_RESET_N MMP_LCD_RD_N MMP_LCD_WE_N MMP_LCD_VSYNC_OUT OTP Program Pin LCD_VSYNC_OUT

22p

22p

22p

22p

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11] LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

VA301 C326 22p

C323

C324

ENBY0036001 1.0T, Socket GB042-40S-H10-E3000

FL300 ICVE10184E150R500FR MMP_LCD_DATA[0] MMP_LCD_DATA[1] MMP_LCD_DATA[2] MMP_LCD_DATA[3]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

C322

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3]

G1

5

FL301 ICVE10184E150R500FR MMP_LCD_DATA[4] MMP_LCD_DATA[5] MMP_LCD_DATA[6] MMP_LCD_DATA[7]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

G2

LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

G1

FL302 ICVE10184E150R500FR MMP_LCD_DATA[8] MMP_LCD_DATA[9] MMP_LCD_DATA[10] MMP_LCD_DATA[11]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

5

G2

LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11]

G1

FL303 ICVE10184E150R500FR MMP_LCD_DATA[12] MMP_LCD_DATA[13] MMP_LCD_DATA[14] MMP_LCD_DATA[15]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

5

G2

LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

LGE Internal Use Only

10

5

G1

G2

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C325

3. TECHNICAL BRIEF

3.10.7.1 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6280). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6280) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

Figure. Audio Interface Detailed Diagram(MSM6280)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only
AC18 AC17 AA17 W17 AE18 AF18 T15 AA18 AA19 AC22 AC21 AC19

3. TECHNICAL BRIEF

MSM6280 Audio CODEC pins

HP_R HP_L SPK_R SPK_L RCVRCV+ MICBIAS

Figure . Audio part schematics

- 68 C200 10p
AC20 AF19 AE19 AF21 AF22 AF20 AE20 AA20

C236 0.1u C235 0.1u MIC2P
L200 100nH

LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP MIC1N MIC1P C203 NA

SDCC_DAT SDCC DAT2

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

MICBIAS C564 47p SPM0204HE5-PB-3 P 4 G2 3 G1 2 O 1 MIC500 C575 33p C563 10u C567 C568 22n 22n C569 NA MIC1P MIC1N

MIC

C576 10p

R904

100K

NCS2200SQ2T2G U902
2
VIN+

R905 EAR_MIC_P 10K

3 4

GND VCC

OUT

1 5

HOOK_SENSE_N

5.1K VREG_MSMP_2.7V R907 C905 0.1u

R906

1M

VIN-

Headset Hook Switch

Figure . Audio part schematics

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

VREG_5V R533 C514 C513 0.1u 10u C516 C517 4.7u 0.1u MIDI_3.3V C518 C519 4.7u 0.1u C520 C521 4.7u 0.1u VREG_WM_2.7V 0

VREG_MSME_1.8V

U502 13 DCVDD 14 DBVDD 26 AVDD2 31 AVDD1 MMP_A_LRCLK MMP_A_BCLK MMP_ADI_ADCDAT MMP_ADO_DACDAT MMP_A_MCLK 7 8 9 10 11 LRC BCLK ADCDAT DACDAT MCLK

WM8983 DGND AGND1 AGND2 12 28 24 C524 0.1u 27 32 29 30 FB500 SPK_OUT+ SPK_OUTFB501 OUT3 OUT4 MODE 22 21 18 MIC2P C543 C544 NA NA HP_EAR_R HP_EAR_L C525 10u C531 NA MIC_PWR

C530 12n C532 SPK_R 1K C535 FM_AUDIO_R C536 FM_AUDIO_L C541 SPK_L 1K 4.7n C547 12n 18K 1u R516 C542 R517 1u 4.7n 1u 18K 1u R510 C533 R511

VMID MICBIAS ROUT1 LOUT1

C534 1u

4 RIP 5 RIN 6 R2_GPIO3 L2_GPIO2

C539 1u

3

ROUT2 LOUT2

23 25

MID_MICP

1 LIP 2 LIN 19 20 AUXL AUXR

C548 HP_L C549 HP_R

1u 1u

CODEC_I2C_SCL CODEC_I2C_SDA

15 CSB_GPIO1 16 SCLK 17 SDIN

R519

PGND

33

C550 NA

C551 NA

AUDIO DAC/ADC, AMP etc. (WM8983)

L504 2.2uH

VREG_MSMP_2.7V

CN500 21 19 1 2 3 4 5 6 7 FB504

R528

100K

100K

FM_ANT EAR_MIC_P
TV_OUT

MIDI_EAR_L MIDI_EAR_R
RMT_INT-USB_D+

Figure . Audio part schematics

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.10.7.2 Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE Device Receiver Mode Voice Call Loud Mode Headset Speaker phone Loud Mode Loud Mode MIDI Headset Loud Mode MP3 Headset Headset MP3 Headset MIDI Bell Speaker MP3 Description Receiver Voice Call Speaker Phone Headset Voice Call Speaker Phone Speaker MIDI Bell

Table. Audio Mode Audio & Sound Main Component There are 8 main components in KU990.
Component 1 2 3 4 5 6 7 8 MSM6280 Audio Codec Analog Switch Speaker Receiver Main MIC CAM MIC Ear MIC Maker Part No. MSM6280 WM8983 NC7SB3157L6X EMS1634APB1 EMR0906SP SPM0204HE5-PB SPOB-413S42RC3310BC HC-MQD-LG059 Note Base-Band Modem ADC/DAC, AB class SPK AMP Analog Switch for MIC BIAS 8 ohm Speaker 32 ohm receiver -42 dB microphone -42 dB microphone Ear MIC

Table. Audio main component list

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

# Multimedia Chip 3.11 Feature List
3.11.1 IC Characteristics
• MCP with Internal SDRAM, no need for external memory. • Package: 180-pin TFBGA (8 x 8 mm) • 90nm process • Core voltage - 1.0 V • IO voltage - Eleven strips, separate voltage between 1.8 and 3.3 V

3.11.2 Multimedia Performance
• Digital Still Camera support with ISP on chip up to 5M pixel. - Photo-album and photo-editing capabilities. - Superior quality, (e.g. including lens shading). - Camera controls for flash, optical zoom,focus, shutter and iris. • Camcorder operation as a DivX recorder /player at 30 fps CIF, VGA resolution. AVI file format with MP3 audio. • Player for general DivX content, up to 30 fps CIF resolution. MP3 or WMA audio. • 3GPP MMS compliant video clip recorder, supporting CIF/QCIF H.263, MPEG4 recording with AMR voice or AAC audio. • Player for 3GPP MMS / streaming video clips, up to 30 fps CIF H.263, MPEG4, and H.264 with AMR voice or AAC/Enhanced AACPlus audio. • 3GPP-compliant videophone, with H.263 or MPEG4 video at QCIF 15 fps (full-duplex). • MIDI player (for ring tones, melodies). Compliant with 3GPP standards, including support for Mobile XMF for melodies with custom instruments.

LGE Internal Use Only

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3. TECHNICAL BRIEF

• Audio stereo recorder player MP3/WMA • ID3 tags display • Spectral bars • Lyrics display • Equalizer • 3D Surround Audio

3.11.3 DRM
• MDTV Conditional access compliant to JSR-177 (AES and TDES) • Key exchange support • True RNG (Random Number Generator)

3.11.4 3D Graphics
• 3D hardware + software accelerator targeting VGA 30 fps games with PlayStationTM-1 enhanced quality. - Setup and viewport transforms - Bilinear and Trilinear texturing - Multi-texturing - Flat and Gourard shading - 24-bit ARGB support - Compressed textures (2 bits/texel) - Mipmaping - Full scene anti-aliasing (x4 / x16) - 16-bit Z-buffer - 4-bit stencil buffer - Fog - Alpha blending - Dot3 bump mapping • Fill rate: 120M pixels/sec • Polygon rate 0.8M triangles/sec

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.11.5 Image Sensor
• 10/12/14/16-bit RGB - Bayer Grid - CMOS up to 5MP - CCD up to 5MP - Pixel clock - Up to 90 MHz. - Active pixel rate - up to 75M pixels/sec: - 15fps @ 5MP - 25fps @ 3MP - 30fps @ 2MP - Black-level evaluation and correction - Defective pixel correction - Auto exposure and White-balance - Edge enhancement and auto focus. - Lens shading correction - Polyphase image scaling. - Digital zoom up to X4 in 16 steps - 8/16-bit YCbCr - 4:2:2 - Input streaming bus - as CCIR601 - Progressive (CMOS/CCD sensors) or interlaced (PAL/NTSC decoders) mode - Pixel clock - Up to 120 MHz (8-bit), 60Mhz (16-bit) - Input resolution - Up to 5M pixels - Auto focus - Polyphase image scaling - Digital zoom up to X4 in 16 steps

3.11.6 LCD Port
• Output resolution - up to VGA • Supports dual-panels (two LCDs) • Bypass from Host port to LCD CPU bus • Up to 18-bit color depth (262K colors) • CPU bus 8/9/16/18 bit compliant to all known vendors. • RGB bus 3/6/18 bit up to 30Mhz clock

3.11.7 TV-out Port
• Composite analog interface - NTSC-M - PAL-B,D,G,H,I

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.11.8 Video and Graphics Postprocessing
• Handles Video (YUV) and Graphic (RGB) • Video de-blocking • Blending of video and graphics - up to 256 levels of blending • Resizing (upscale and downscale) using quality polyphase filter • Rotation and flip - 90, 180 and 270 degrees • Picture brightness, contrast, and saturation control • Display gamma adjustment • Color space reduction

3.11.9 Serial Audio Ports
• ZR3453X has two audio/voice ports: one port is used for host bypass connection, and another for connecting to a codec or to a Bluetooth voice port. - PCM master/slave - I2S master/slave (5 lines including clock) - AC’97 master (5 lines including AC-Link reset) - Audio output master clock (I2S), up to 48 MHz - Supports sample rates of 8, 11.025, 16, 22.05, 24, 32, 44.1 or 48 kHz

3.11.10 Serial Data Ports
• I2C Multiple device support 100 and 400 kHz • UART with flow control up to 3Mb/sec • SPI port with Bit clock up to 40 MHz - (Motorola, National microwire, TI synchronous serial interface )

3.11.11 Mass Storage
• High-speed SD/MMC I/F • NAND-flash storage • SPI-flash • CE-ATA HDD. • SDIO peripherals

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.11.12 USB
• USB 2.0 High speed/full speed • USB On The Go • USB applications: - USB mass storage - PictBridge - Webcam

3.11.13 Host Port
• Two flavors: - Generic interface 8/16-bit Intel style. Connects as memory map (4-bit address) - LCD like 8/9/16 bit multiplexed bus. Connects as an LCD (1-bit address)

3.11.14 Clocks
• Main clock input frequency, 10 to 31 MHz: - Directly from system PMU main clock and bypass its control - Embedded crystal oscillator (12Mhz) - Optional GPS TCXO • Four configurable clock-out pins to drive external components: (e.g. Audio codec, Sensor, PWM)

3.11.15 Boot
• Host boot • Standalone boot

3.11.16 Debug
• JTAG for code debug • UART for fast system ramp up

3.11.17 Power
• Very low power consumption, smaller than150mW for all intense multimedia applications. • Low power sleep mode 100 µW - Host can control display audio and peripherals via bypass • Light sleep mode 500uW - Specifically for GPS accurate off-line tracking

LGE Internal Use Only

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3. TECHNICAL BRIEF

Figure 1-1 presents a typical multimedia cellular phone system where ZR3453X is used as a cocoprocessor. In this system, ZR3453X is connected to the following devices: • Baseband chip (the host) • CCD/CMOS Image Sensor for capturing video and still • LCD panel(s)for displaying video • Audio CODEC (A2D, D2A) for capturing voice and playing voice/music • Media Flash (SmartMedia, NANDFlash, MMC or SD) to store media data (two active I/F, e.g. one NAND and one SD) • Connector to TV

[ Figure 1-1 ]

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.12 Multimedia Chip Interface
3.12.1 Host Interface
3.12.1.1 Host Interface
The HOST interface connects the ZR3453X and the host processor (a handset baseband chip) in two optional modes: • On the host memory bus. • On the host LCD bus.
R309 MMP_LCD_BYPASS_CS_N VREG_MSMP_2.7V NA

R310 10K

MMP_CS_N NAND_ALE EBI2_OE_N EBI2_WE_N

R311 R313

0 NA

MMP_INT_N EBI2_ADDR[11] EBI2_ADDR[12] EBI2_ADDR[13] EBI2_ADDR[14] EBI2_DATA[0] EBI2_DATA[1] EBI2_DATA[2] EBI2_DATA[3] EBI2_DATA[4] EBI2_DATA[5] EBI2_DATA[6] EBI2_DATA[7] EBI2_DATA[8] EBI2_DATA[9] EBI2_DATA[10] EBI2_DATA[11] EBI2_DATA[12] EBI2_DATA[13] EBI2_DATA[14] EBI2_DATA[15]

B8 A8 B7 B9 A7 A10 A9 C8 C7 D12 C10 C12 C13 C14 B14 C11 B13 A14 A13 B12 A12 B11 A11 C9 B10 L13 M13

HCS0N HCS1N HRDN HWRN HGINTN HA11 HA12 HA13 HA14 HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 NCSN

[ Block Diagram ]

EBI2_DATA[0:15]

[ Schematics ]

LGE Internal Use Only

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3. TECHNICAL BRIEF

3.12.2 Host - LCD - Bypass mode
The Host-LCD Bypass bypasses the host interface pins to the LCD pins. This means that the bus transactions performed by the host are transferred to the LCD pins, enabling the host to have full control over one or two LCD panels, even when the ZR3453X is in sleep mode. This is the default mode.

3.12.3 Camera interface
ZR3453X connects with the CCD or CMOS Image Sensor (CIS) via its image sensor port. ZR3453X supports several system configurations: • CCD bayer 10,12,14,16 bit (ZR34532 only) • CMOS bayer 10,12,14,16 bit • YCbCr 8 bit • YCbCr 8 bit with pixel valid • YCbCr 16 bit

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.4 LCD Interface
The ZR3453X LCD port supports mobile LCD panels of upto VGA size and upto 60fps refresh rate. There are various bus formats and color depth up to 18-bit (262K colors).

VIDH VIDI VIDJ VIDK VIDL VIDM VIDN VIDO VIDP LD0 LD1 LD2 LD3 LD4 LD5 LD6 LD7 LD8 LD9 LD10 LD11 LD12 LD13 LD14 LD15 LD16 LD17 LCS0N LCS1N LRDN LWRN LA0 LCK LHS LVS LACT

P11 N12 N7 L8 P13 L9 N13 M11 M9 B5 A5 B6 B4 A4 C3 A3 A2 A1 B2 B1 B3 C1 C2 C5 C6 D3 D1 A6 D2 D5 C4 D4 E1 E4 E3 E2

MMP_CAM_DATA[0] MMP_CAM_DATA[1] MMP_CAM_DATA[2] MMP_CAM_DATA[3] MMP_CAM_DATA[4] MMP_CAM_DATA[5] MMP_CAM_DATA[6] MMP_CAM_DATA[7] MMP_LCD_DATA[0] MMP_LCD_DATA[1] MMP_LCD_DATA[2] MMP_LCD_DATA[3] MMP_LCD_DATA[4] MMP_LCD_DATA[5] MMP_LCD_DATA[6] MMP_LCD_DATA[7] MMP_LCD_DATA[8] MMP_LCD_DATA[9] MMP_LCD_DATA[10] MMP_LCD_DATA[11] MMP_LCD_DATA[12] MMP_LCD_DATA[13] MMP_LCD_DATA[14] MMP_LCD_DATA[15]

[ Block Diagram ]

MMP_LCD_CS_N MMP_LCD_RD_N MMP_LCD_WE_N MMP_LCD_ADS
TP300 TP301

MMP_LCD_VSYNC_IN MMP_LCD_VSYNC_OUT

[ Schematics ]

LGE Internal Use Only

- 80 -

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3. TECHNICAL BRIEF

3.12.5 TV out Interface
The display data is converted to video with video-encoder according to CCIR-601 and sampled by 10bit DAC and transmitted over an analog pad as a composite video signal. This mode is used in a system where ZR3453X is connected gluelessly to a TV screen that requires real-time display data. ZR3453X generates TV signal according to the NTSC and PAL standards. The TVDATA pin can drive a full video level signal directly into a 75 terminated TV cable.

C331 22p

G14 F13

TV_OUT

2.2uH C334 330p C335 330p

392ohm 1%

390

75

L300

[ Block Diagram ]

[ Schematics ]

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 81 -

LGE Internal Use Only

E13

VENBYPIN

TVDATA TVREF

R338

R339

3. TECHNICAL BRIEF

3.12.6 Audio Interface
In this configuration ZR3453X is connected to an external audio codec. There are three possible configurations: • Audio/Voice codec with two ports: PCM and I2S • Audio/Voice codec with one port: I2S • Audio/voice/data codec with one port: AC97 In all configurations ZR3453X connects its external audio ports to the codec single or two ports. The host uses its internal voice codec for voice communication. There is no bypass of voice. The host controls the codec configuration via I2C bus directly. The host codec analog audio output is connected to the external audio codec and muxed with the codec audio path from the ZR3453X on the way is to the speaker. The microphone is connected to the external audio codec and the baseband internal codec. ZR3453X appears in Figure 3-35 as a master on the bit clock and frame sync. This is only one of the possible configurations. In external audio configuration ZR3453X can run all the Audio/voice applications including conversation recording .

LGE Internal Use Only

- 82 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

3.12.7 USB interface
ZR3453X is a USB 2.0 Device or On-the-Go dual-role device (OTG) with the following characteristics: • Complies with USB (Universal Serial Bus) 2.0 specifications • Complies with On-the-Go Supplement 1.0a • Integrated 45-ohm termination, 1.5Kilohm pull-up and 15-Kilohm pull-down resistors. • Supports 480-Mbps high-speed, 12-Mbps full-speed and 1.5Mbps low-speed (Host mode only) data transmission rates. • Control + 4 endpoints: - EP0 - two-way Control - 2-input , 2-output - Bulk, INT or ISO • Suspend, resume, reset and SOF signaling

AGND_VDAC

K5 AGND_USBT L5 AGND_USBC

UDP UDN UVBUS UID URSET

P3 P4 J4 R335 P6 M7

0

MMP_USB_D+ MMP_USB_DVREG_5V

R340

3.3K

+VPWR

F12

3.4K 1%

C336 0.01u

USB_SELECT_N

FSUSB30UMX U304 1 10 SEL HSD1+

MSM_USB_D+ MMP_USB_D+ USB_D+

R345

9 8

VCC HSD2+ _OE D+

2 3 4 5

100K

MSM_USB_DMMP_USB_D-

7 6

HSD1- GND HSD2D-

USB_D-

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.8 MMC interface
ZR3453X has a dedicated port for multimedia cards. It can support SD (Secure Digital) cards and SecureMMC (standard multimedia cards with security functions). The same port can be used for HDD CE_ATA connection or SDIO to peripheral devices (e.g.; MDTV front-end). MMC • MMC v4 • Dual voltage (separate IO power domain, host GPIO control) • 1 or 4 bit cards • Multiple cards support (if dual-voltage or high-speed interface are not used) • Up to 43 MHz bit clock SD • 1 or 4 bit bus support • High-Speed SD, up to 43 MHz bit clock
SDAT0 SDAT1 SDAT2 SDAT3 SCMD SCLK SWP F1 F2 E5 F3 H2 G1 G3 MMP_MICROSD_DATA[0] MMP_MICROSD_DATA[1] MMP_MICROSD_DATA[2] MMP_MICROSD_DATA[3] MMP_MICROSD_CMD MMP_MICROSD_CLK

R312

33

P12 VMCLK P10 VPCLK M12 VHREF K12 VVS

MMP_CAM_MCLK MMP_CAM_PCLK MMP_CAM_HSYNC MMP_CAM_VSYNC

3.12.9 Power Domain

LGE Internal Use Only

- 84 -

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3. TECHNICAL BRIEF

3.13 Touch Screen Interface
The TSC2007 device has a 12-bit analog-to-digital resistive touch screen converter including drivers and the control logic to measure touch pressure. The TSC2007 device is controlled by I2C port from MSM6280. Touch Screen interface scheme is shown in Figure. And, there control signals are followed • TOUCH_I2C_SCL : I2C CLOCK • TOUCH_I2C_SDA : I2C DATA • TOUCH_PENIRQ_N : DETECT

Figure. Touch Screen Interface
UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88

LCD_VDD_2.8V

R700

GPIO44 GPIO39 GPIO64

0

C700 1u

C701 0.1u

R702

R703

TP200 G6

E4

F14

L23

F7

F4

M21

M19

D8

D7

NA

U700 A1 A2 A3 B1 B2 B3

TSC2007IYZGR SDA A1 XSCL GND YC1 C2 C3 D1 D2 D3

R704

2.7K

2.7K

TOUCH_PENIRQ_N

AUX VDD_REF X+ PENIRQA0 Y+

TOUCH_I2C_SDA

TOUCH_I2C_SCL

TOUCH_PENIRQ_N CAM_MODE2_N

VGA_CAM_PWR_EN TOUCH_I2C_SCL TOUCH_I2C_SDA PM_INT_N

UART_TXD

USIM_CLK USIM_RST_N USIM_DATA

X+ Y+ XY-

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 85 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.14 Main Features
1. Main features of KU990
- BAR Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Main LCD: 240x400/3.0”/262K TFT - 5.1M Pixel AF Camera - VGA CMOS Camera - φ16 module speaker - Stereo Headset - Video telephony in WCDMA with camera - HSDPA up to 3.6 Mbps - Loud Speaker phone(in GSM and WCDMA) - 64 Poly Sound - Audio: MP3, AAC, AAC+,AAC++, WMA, WAV - MPEG4 encoder/decoder and play/save - H.263 decoder - Video Recording: VGA 30 fps - JPEG en/decoder - Support Bluetooth, USB - FM Radio - touch screen, touch feedback - 103 x 54 x 15.6 mm - 1000mAh soft pack

LGE Internal Use Only

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3. TECHNICAL BRIEF

2. Main Components of KU990

MAIN Top Side

MAIN Bottom Side

VGA camera

5M camera

5M Camera FPCB VGA Camera FPCB

Sub PCB

Intenna

Strobe Flash LCD

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 87 -

LGE Internal Use Only

3. TECHNICAL BRIEF

2.1 Main Top Side

U103 U504 U506 U503 U507 U304 U505 U601 U602

U700 U604

U607 U600 U301

U400 U401

U300 U303 SideKey

701 700

END

Reference U103 U504 U506 U503 U507 U304 U505 U601

Description FM Radio IC Headphone AMP IC CAM/HP MIC SEL IC Audio AMP LDO USB/REMOCON SEL IC Switch IC for USB2.0 Over Voltage Protection IC

Reference 700 701 END SideKey U303

Description Send Key Clear Key End Key Side Key FPCB LCD LOD IC

U300 U301 U600 LCD Backlight Charge Pump IC VGA CAM LDO IC Switch IC for 5M VT Call

5M CAM LDO IC U602 U400 U401 MicroSD Select MSM and MMP IC U607 U604 U700 Touch Screen Driver IC

LGE Internal Use Only

- 88 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

2.2 Main Bottom Side

CN701 SW600 U606 CN600 CN601 CN300 U701 U200 U302 X300

CN500 U502 CN603 U501 X500 U500 OUT PAD U402 X100

U100 J400 SW100 MIC500 ANT PAD
Reference CN701 SW600 U606 CN600 CN601 CN300 U701 U200 U302 X300 U100 J400 SW100 MIC500 Description VGA CAM FPCB Connector Mode Switch Linear Motor Driver IC 5M CAM FPCB Connector Strobe Flash Connector LCD Connector DC-DC Converter IC MSM6280 Modem IC ZR3453 DSP IC 27Mhz Crystal Oscillator RTR6275 RF IC USIM Connector RF Switch MIC Reference CN500 U502 CN603 U501 X500 U500 OUT PAD U402 X100 U105 FL103 U101 FL100 ANT PAD Description TA and USB Connector WM8983 Audio DAC/ADC AMP IC Main-Sub B-to-B Connector PM6650 PMIC 32.768KHz Crystal Oscillator Charging IC Battery Connector PAD Memory IC 19.2MHz Crystal Oscillator for TCXO PAM IC for WCDMA Duplexer IC for WCDMA PAM IC for GSM Antenna Switching Module Main Intenna Connection PAD

U105 FL103 U101 FL100

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 89 -

LGE Internal Use Only

3. TECHNICAL BRIEF

2.3 Sub PCB
BT PAD MIC900 U900 U902 CN800 BAT900 CN801
SPEAKER

M800

S800

Reference BT PAD MIC900 U900 U902 CN800

Description Bluetooth Antenna PAD CAM MIC 5MP Camera Power IC Headset Hook Switch IC Wheel Switch Connector

Reference SPEAKER S800 M800 BAT900 CN801

Description Module Speaker T-Flash Connector Bluetooth Driver IC Backup Battery Main-Sub B-to-B Connector

LGE Internal Use Only

- 90 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

3. TECHNICAL BRIEF

2.4 VGA Camera FPCB

CN102 CN101

Vibrator

CN100

Receiver

Reference Vibrator Receiver CN100

Description Vibrator PAD

Reference CN101

Description Main B-to-B Connector (FPCB to Main PCB) Touch Window Connector

Receiver PAD VGA_CAMERA Connector CN102

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 91 -

LGE Internal Use Only

3. TECHNICAL BRIEF

2.5 5M Camera FPCB

CN601

CN602

Reference CN601

Description 5M Camera Module Connector

Reference CN602

Description Main PCB Connector (FPCB to Main PCB)

LGE Internal Use Only

- 92 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 RF Component

X100

U100

FL104

FL103

U105

FL102

U104

FL100

FL101

SW100

U101

Reference U100 FL103 FL102 FL100 SW100

Descri ption GSM/UMTS Transceiver (RTR) UMTS Duplexer UMTS RX SAW Front -End-Module RF Antenna Connector

Reference X100 FL104 U105 U104 FL101 U101

Description VCTCXO(19.2MHz) UMTS TX SAW UMTS PAM Coupler GSM900 TX SAW GSM/EDGE PAM

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

4. TROUBLE SHOOTING

4.2 SIGNAL PATH
4.2.1 UMTS PATH

COMMON TX/RX PATH UMTS TX PATH UMTS RX PATH

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.2.2 GSM PATH

COMMON TX/RX PATH DCS/PCS TX PATH GSM TX PATH

GSM RX PATH PCS RX PATH DCS RX PATH

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 95 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.3 Checking VCTCXO Block
The reference frequency (19.2MHz) from X100 (VCXO) is used UMTS TX part, GSM part and BB part.

TCXO
TP1
3 VREG_TCXO_2.85V C139 0.1u C140 1000p 4

X100
OUT GND 2 VCC VCONT 1

TP2
R115 100ohm TRK_LO_ADJ C141 0.01u

19.2MHz

TP4
C144 TCXO_PM 1000p R120 100K C145 1000p

VREG_BT_2.85V

C147 RTR6275_TCXO

1000p

C148 8200p

U102
TC7SH04FS

TCXO_BT

TP3

Schematic of the TCXO Block

TP4 TP1

TP2

TP3

Test Point of the TCXO Blcok

LGE Internal Use Only

- 96 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Check TP1 VCC of VCXO

VCC ≥ 2.8V Yes Check TP2 TRK_LO_ADJ

No

Check PMIC

3V≥ Voltage≥ 0V Yes Check TP3, TP4 With Oscilloscope

No

Check MSM

19.2MHz Signal Yes VCXO is OK Check other part

No

Check soldering and components

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 97 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.4 Checking Front-End Module Block
TP4 TP1
ANT_SEL0 ANT_SEL1 ANT_SEL2
C113 47p C115 47p C114 47p

TP3
5 VC1 4 VC2 3 VC3 1 2 9 11 12 14 15 17 18 25 26 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 PGND1 PGND2 ANT 10 C109 47p 6 VDD 7 NC 8 UMTS_TX_RX 13 DCS_PCS_TX 16 EGSM_TX DCS_RX2 DCS_RX1 PCS_RX2 PCS_RX1 EGSM_RX2 EGSM_RX1 LSHS-M090UH 19 20 21 22 23 24

VREG_RF_SMPS

TP2

Schematic of the Front-End Module Block

TP3

TP2

TP1

TP4

Test Point of Front-End Module Block

LGE Internal Use Only

- 98 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Vc3 GSM900 Tx DCS1800/PCS1900 Tx UMTS Tx/Rx GSM 900 Rx DCS 1800 Rx PCS 1900 Rx L L H L H L

Vc2 H L L L/H L/H L/H

Vc1 H H H L L L

Vdd H H H H H H

Logic Table of the FEM

- UMTS Tx/Rx
TP1 (Vc1)

- GSM900 Tx

TP1 (Vc1) TP2 (Vc2) TP2 (Vc2) TP3 (Vc3) TP3 (Vc3)

- DCS1800/PCS1900 Tx
TP1 (Vc1)

- GSM Rx / PCS1900 Rx

TP1 (Vc1) TP2 (Vc2) TP3 (Vc3) TP2 (Vc2) TP3 (Vc3)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 99 -

LGE Internal Use Only

4. TROUBLE SHOOTING

- DCS1800 Rx

TP1 (Vc1) TP2 (Vc2) TP3 (Vc3)

Checking Switch Block power source
Check Soldering ANT_SEL0, 1, 2 High Level

2.5V < Voltgae < 3.0V

NO

Check VDD TP4 VREG_RF_SMPS

YES Check the Logic in each mode

LGE Internal Use Only

- 100 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.5 Checking UMTS Block
4.5.1 Checking TX level
KMS-518 SW100
G1 G2 A C

TP1
C101 120p L102 NA

FL100
5 VC1 4 VC2 3 VC3 1 2 9 11 12 14 15 17 18 25 26 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 PGND1 PGND2 ANT 10 6 VDD 7 NC 8 UMTS_TX_RX 13 DCS_PCS_TX 16 EGSM_TX DCS_RX2 DCS_RX1 PCS_RX2 PCS_RX1 EGSM_RX2 EGSM_RX1 LSHS-M090UH 2.2nH L121 19 20 21 22 23 24 C152 3.9p

TP2 TP4

2.2p

C156

FL104
EFCH1950TDF1
2 1 GND1 4 GND2 8 GND3
C159 +VPWR 8.2p C160 22u C162 0.01u C163 100p C164 1u L124 L123 15nH
4 5
IN G2 G1

FL103
SAYZY1G95EB0B00

ANT

C161
1

O1 G3

3 GND6 6 GND5 9 GND4

WCDMA_2100_TX_OUT C165 NA 56p L122 NA

RX

TX

3

2

7

5

U105
U104
SCDY0003403
1 2 OUT
4.7nH L128 C170 1.8p L126 8.2nH 11 10 9 8 7 6 GND5 VCC2 GND4 RFOUT GND3 GND2 VCC1 RFIN GND1 VMODE VREF 1 2 3 4 5

3.3nH

C167 56p L125 1.2nH
PQ

C168 56p

C169 5.6p

PA_R1

IN

Q100
VREG_TCXO_2.85V
4

50OHM

COUP

AWT6277R
C173 100p R123 PWR_DET 68

3

20dB

PA_ON

4

3

R124 51 R125 100

5

KRX102E

R126 100 8 dB

TP3

Schematic of the WCDMA Tx Block

1

2

TP4

TP3

TP2 TP1

Test Point of the WCDMA Tx Block

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 101 -

LGE Internal Use Only

4. TROUBLE SHOOTING

For testing, Max power of UMT 2100 is needed.
Run a FTM program set RF mode to IMT set uplink freq. To 9750 click Tx on and WCDMA set PA range R1 on set Tx AGC to 410

Check coupler U104

Check Tx SAW Filter FL104

Check Duplexer FL103

Check PAM block U105

Check FEM FL100

LGE Internal Use Only

- 102 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.5.2 Checking UMTS PAM Control Block • PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R123) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. PA_R1 : Control signals that step the active PA mode and bias

+VPWR

VREG_TCXO_2.85V

R123

UMTS2100 Coupler

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 103 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.5.3 Checking RX level

TP3 Vbias

TP4 TP2 TP1

TP1
G1 G2 A C

KMS-518 SW100

ANT100 ANT101 ANT102

L100 0 C102 12nH

L101 C101 120p 4.7nH C104 1.2p L102 NA

PQ

FL100

LGE Internal Use Only

- 104 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Vbias
VDD_RX
C149 22p

EFCH2140TDE1
L114 1.5nH C153 C154 56p L117 1.8nH
PQ

L115 1nH

L116

FL102
2 1
IN G2 O2

WCDMA_MIX_IN_M
1nH

TP2
C152 3.9p

3

WLNA_OUT
56p

G1 O1

C155 0.5p

5

4

L118 1nH

L119

WCDMA_MIX_IN_P
1nH

2.2nH L121

TP3
2 1 GND1 4 GND2 8 GND3
C159 +VPWR 8.2p C160 22u C162 0.01u C163 100p C164 1u L124 L123 15nH

2.2p

C156

TP4
FL104
EFCH1950TDF1

FL103
SAYZY1G95EB0B00

ANT

4

5
IN

C161
1

O1 G3 G2 G1

3 GND6 6 GND5 9 GND4

RX

TX

3

2

7

5

U105
U104
SCDY0003403
1 2 OUT
4.7nH L128 C170 1.8p L126 8.2nH 11 10 9 8 7 6 GND5 VCC2 GND4 RFOUT GND3 GND2 VCC1 RFIN GND1 VMODE VREF 1 2 3 4 5

3.3nH

C165 NA

56p

C167 RX_WCDMA_2100 56p L125 1.2nH
PQ

C168 56p

C169 5.6p

PA_R1

IN

Q100
VREG_TCXO_2.85V
4

50OHM

COUP

AWT6277R
C173 100p R123 PWR_DET 68

3

20dB

PA_ON

4

3

R124 51 R125 100

5

KRX102E

R126 100 8 dB

Check Vbias over 2V?

Check the RF S/W

Check TP2 Signal exist?

Check FEM FL100

Check TP3 Signal exist?

Check the Duplexer FL103

Check TP4 Signal exist?

Check the RTR6275 U100

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

1

2

- 105 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6 Checking GSM Block

3

2 1

4.6.1 Checking Front-End Module
Refer to chapter 3.4

LGE Internal Use Only

- 106 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.6.2 Checking RF Tx Level
TP1

KMS-518 SW100
G1 G2 A C

ANT100 ANT101 ANT102

L100 0 C102 12nH

L101 C101 120p 4.7nH C104 1.2p L102 NA

PQ

FL100
5 VC1 4 VC2 3 VC3 ANT 10 6 VDD 7 NC 8 UMTS_TX_RX 13 DCS_PCS_TX 16 EGSM_TX DCS_RX2 DCS_RX1 PCS_RX2 PCS_RX1 EGSM_RX2 EGSM_RX1 LSHS-M090UH 19 20 21 22 23 24

TP2

ANT_SEL0 ANT_SEL1 ANT_SEL2
C113 47p C114 47p C115 47p

10 C138 L112 NA 15nH 8 9

DCS_PCS_OUT

1 2 9 11 12 14 15 17 18 25 26

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 PGND1 PGND2

14 13 12 11 C136 8p

GND6 GND5 VCC GND4 GND3

DCS_PCS_IN BS U101 TQM7M5003 TX_EN VBATT GND1 VRAMP GSM_IN

1 2 3 4 5 6 7

GND8 17

GND2

16

GND7

GSM_OUT

TP3

C146

10p

C142 0.75p

L113 4.7nH

PQ

Schematic of the GSM Tx Block

TP1

TP2

TP3

Test Point of GSM Tx Block

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 107 -

LGE Internal Use Only

15

4. TROUBLE SHOOTING

START

Check TP1 If GSM over 31 dBm? If DCS/PCS over 28dBm?

Yes

GSM/DCS/PCS Tx is OK Check other part

No

Check TP2, TP3 If TP2 over 29dBm? If TP3 over 25dBm? No

Yes

Check Front-End Module Refer to chapter 3.4

Check PAM Block OK? Refer to chapter 3.6.3

Yes

Check the RTR6275

No Check Soldering of PAM (U101) If problem still exist, replace the PAM

Yes Problem resolved ? GSM/DCS/PCS Tx is OK

No

Change the Board

LGE Internal Use Only

- 108 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.6.3 Checking PAM Block
TP2
14 13 12 11 10 9 8 GND6 GND5 VCC GND4 GND3 U101 TQM7M5003 DCS_PCS_IN BS TX_EN VBATT GND1 VRAMP GSM_IN 1 2 3 4 5 6 7 C137 1u C135 33u GSM_PA_BAND GSM_PA_EN +VPWR R112 91

TP3
R111 DCS_PCS_TX 68 R113 91

10 dB

DCS_PCS_OUT

GND8

GND7

GSM_OUT GND2

FL101
3
EFCH897MTDB1

2

G2 G1 IN O1 G3

R114
1

GSM_TX 51 8 dB R118 120 R119 120

17

16

15

4

5

R117

2.2K GSM_PA_RAMP

C143 68p

TP1

GSM_PA_BAND LOW HIGH

MODE GSM DCS/PCS

Schematic of PAM Block

TP3

TP2 TP1

Test Point of PAM Block

Test Point TP1 TP2 TP3

Net name GSM_PA_RAMP GSM_PA_EN +VPWR

Description Power Amp Gain Control. Typically, 0.2 ~1.6V Power Amp Enable (ON : >2.5V, OFF : <0.7V) PAM Supply Voltage (Vcc > 3V)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 109 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.4 Checking RF Rx Level
KMS-518 SW100
G1 G2 A C

C101 120p

L102 NA L103 5.6nH

FL100
5 VC1 4 VC2 3 VC3 1 2 9 11 12 14 15 17 18 25 26 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 PGND1 PGND2 ANT 10 6 VDD 7 NC 8 UMTS_TX_RX 13 DCS_PCS_TX 16 EGSM_TX DCS_RX2 DCS_RX1 PCS_RX2 PCS_RX1 EGSM_RX2 EGSM_RX1 LSHS-M090UH 19 20 21 22 23 24

VREG_RF_SMPS
C109 47p

DCS
L105 5.6nH

L104 15nH

TP3

L106

5.6nH L107 15nH

PCS
L108 5.6nH

TP2

L109 22nH

GSM
L111 22nH

L110 22nH

TP1

Schematic of GSM-900, DCS-1800, PCS-1900 Rx Block

TP1

TP2

TP3

Test Point of Rx Block

LGE Internal Use Only

- 110 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 111 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7 Power on trouble
Power on sequence of KU990 is : PWR key press → PM_ON_SW_N go to low (VA700, PM6650-2M KPDPWR_N pin#24) → PM66502M Power Up → VREG_MSMC_1.2V(C560), VREG_MSME_1.8V(R520), VREG_MSMP_2.7V(R513), VREG_MSMA_2.6V(R508), VREG_TCXO_2.85V(C510) power up → PON_RESET_N assert to MSM → Phone booting & PS_HOLD(D500) assert High to PMIC(PM6650-2M)

Start

Battery voltg. higher than 3.2V?

NO

Change or charging the Battery

YES
Press PWR key Keypad LED on?

NO

Follow the LED trouble shoot

YES NO
VA700 high to low when key press?
Check open Pattern of power button Check Dome Sheet

YES

VREG_MSMC_1.2V, VREG_MSMP_2.7V, VREG_MSME_1.8V VREG_TCXO_2.85V, VREG_MSMA_2.6V power up?

NO
Change the Main board

YES
Is clock ok? X100 : 19.2M X500 : 32.768Khz

NO
Check the TXCO and SLEEP CRYSTAL

YES
Change the Main board

LGE Internal Use Only

- 112 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

VREG_TCXO_2.75V(C510) VREG_MSMA_2.6V(R508) VREG_MSMP_2.7V(R513) SLEEP CRYSTAL(32.768KHz) VREG_MSMC_1.2V(C560) VREG_MSME_1.8V(R520)

TCXO ( 19.2MHz )

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 113 -

LGE Internal Use Only

4. TROUBLE SHOOTING

RESET_IN_N(R208)

PS_HOLD(D500)

PM_ON_SW_N (D700)

LGE Internal Use Only

- 114 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.7.1 USB trouble
USB Initial sequence of KU990 is : USB connected to KU990 → USB_VBUS(C540) go to 5V → USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work
Start

NO Cable is insert? YES
USB_VBUS is about to 5V?

Cable insert

NO

Check C540, R514,U500 USB cable

YES NO USB_D+ is about to 3.3V? YES NO 48MHz is run? YES Change the Main board Check X200 Check VA500,U507,U304

VA500(USB_D+)

X200(48MHz)

R514(USB_VBUS) C540(USB_VBUS)

U500(USB_VBUS)

U507(USB_D+)

U304(USB_D+)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 115 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7.2 UMS(USB MASS STORAGE) trouble
UMS Initial sequence of KU990 is : USB connected to KU990 → VREG_5V(R335, UMS) go to 5V → VREG_USB_3.3V(R301) go to 3.3V → USB_DATA is triggered → USB work

Start

NO Cable is insert? YES
VREG_5V is about to 5V?

Cable insert

NO

Check R335, D501

YES
VREG_USB_3.3V is about to 3.3V?

NO Check R301,C529, USB CABLE

YES NO
MICRO SD function OK?

Follow the micro sd trouble

YES Change the Main board < TOP SIDE >

R335(VREG_5V) D501(VREG_5V) C529 (VREG_USB_3.3V) R301(VREG_USB_3.3V)

LGE Internal Use Only

- 116 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.8 SIM detect trouble
USB Initial sequence of KU990 is : VREG_USIM_3.0V(C552 of PM6650) go to 3.0V → USIM clock, reset and data triggered → USIM IF work (Schematic and place are refer to SIM technical brief)
Start

Re-insert the SIM card

Work well? No
VREG_USIM_3.0V is 3.0V? USIM_P_CLK is run?

Yes

End

NO Check J400, D400,C552

YES Change SIM card

Yes Work well? No Change the Main board End

USIM_P_RST_N

USIM_P_CLK

USIM_P_DATA

J400 C552(VREG_USIM_3.0V)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 117 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.9 Key sense trouble ( KEYPAD )
Key Sense sequence of KU990 is : Default condition ROW(0-2) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V → Scan pulse( Col => Row ) → MSM sense what key pressed.
START

Check the R701,R705,R706 with no key press NO Check R701,R705,R706

ROW(0-2) is 2.7V?

Yes Check the R701,R705,R706 with key press

ROW(0-2), COL(0-1) is 0V?

Yes

Change the Main board

NO Change the DOME SHEET

Side Key

Work well? NO Change SIDE KEY NO Work well? YES NO Check VA700~ VA707, R707~R710 YES

Work well? YES NO Change the Main board

Dome sheet

End

LGE Internal Use Only

- 118 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

VREG_MSMP_2.7V

END
R701

51K

PM_ON_SW_N
700
SEND

END

701

KEY_ROW[2]

KEY_COL[0] KEY_COL[1]

EVLC14S02050

EVLC14S02050

EVLC14S02050

ON_SW KEY
VA701(ROW2) VA703(COL1)

VA701

VA702(COL0)

SEND

VA702

VA703

CLR

END

VREG_MSMP_2.7V

VA700

CLR

EVL14K02200

LOCK
R705 R706 51K
CN700 1 2 3 4 5

51K
R707 R708 R709 R710

470 470 470 470

KEY_ROW[0] KEY_ROW[1] KEY_COL[0] KEY_COL[1]

EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

SHOT

VA704

SIDE KEY

VA705

VA706

VA707

Schematic of key sense part

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 119 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Keypad backlight trouble
Key Pad Back Light is on as below : Key pressing → PM6650 KYPD_LED_EN go to Low → LED On (Key Pad LED controlled by PM6650)

Start

Key press NO Check device short : LD700~705 and R711~716 (Main)

+VPWR is OK? Yes
Signal KYPD_LED_EN is Low?

NO

Change the main board

Yes
Some LED is not work?

Yes

Check device open : LD700~705 and R711~716 (Main) Change the main board

NO Work well? Yes End NO

R711~716 (Main)

VA708 (KYPD_LED_EN) LD703 (+VPWR)

LD700~705 (Main)

LGE Internal Use Only

- 120 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

+VPWR

LD703 (+VPWR)

SSC-TWH104-HL

SSC-TWH104-HL

SSC-FR104-II1

200

R713

R715

R711

R716

R712

Rev. 1.1 VA708

KYPD_LED_EN

LD700~705 and R711~716 (Main)

EVL14K02200

(GREEN) (WHITE)

(RED)

VA708 (KYPD_LED_N)

Schematic of keypad backlight part

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

R714

200

47

47

47

47

SSC-FR104-II1

LEGG-S14G

LEGG-S14G

LD705

LD702

LD704

LD700

LD701

LD703

- 121 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.11 Micro SD trouble
Micro SD is worked as below : Micro SD insertion → MICROSD_DETECT(R804) goes to low → go working

Start

Insert the Micro SD Card

MICROSD_DETECT(R804)) is low ?

NO

Change the SUB board

YES
Check VREG_MMC_3.0V is over 2.85V?

YES NO Work well? NO

YES Work well? YES End NO

Change the MAIN board

R804(DETECT) SOCKET

C807(VREG_MMC_3.0V)

LGE Internal Use Only

- 122 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.12 Audio trouble
4.12.1 Receiver path
Voice Receiver path as below: MSM6280 Ear1ON/Ear1OP → CN701(VGA CAM FPCB connector) → Receiver
Start

Connect the phone to network Equipment and setup call Setup 1KHz tone out

Hear the tone to the receiver? NO Change the Receiver YES END

Check connector pin or change the VGA CAM FPCB

Can you hear the tone? YES END

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 123 -

LGE Internal Use Only

4. TROUBLE SHOOTING

VGA CAM FPCB connector

Receiver

Receiver pads

MSM6280

LGE Internal Use Only

- 124 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.12.2 Voice path for headset
Voice path for Head_Set as below: MSM6280 HPH_R, HPH_L → C548,C549 U502(audio codec) → C578,C562 → R529,C522 → U504(Headset AMP) → FB502, FB503 → R525, R524 → #4, #5 pin of CN500 headset Jack

Start

Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set

Headset insertion detection in the Main LCD Display OK?

NO

Check #8 pin of CN500 or change the Main bíd

YES The sine wave appear at C548,C549 ? NO Change the Main board

YES The sine wave appear at C578,C562 ? NO Check the U502 or change the Main bíd

YES The sine wave appear at R525,R524 ? NO Check the U504 or change the Main bíd

YES NO Can you hear the tone? Check the CN500 or change the Main bíd

YES END

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 125 -

LGE Internal Use Only

4. TROUBLE SHOOTING

CN500
1 2 3 4 5 6 7 8 9 10 11 12 13 FB504

21 19 CN500

R524 R525

R528

100K

RMT_INT-USB_D+ RMT_ADC-USB_D-

RMT_PWR_ON_N

EAR_SENSE_N VBATT

MIDI_EAR_L MIDI_EAR_R

FM_ANT EAR_MIC_P

TV_OUT

Schematic of voice path

LGE Internal Use Only

- 126 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

U502

C548

C549

VREG_5V R533 C514 C513 0.1u 10u C516 C517 4.7u 0.1u MIDI_3.3V C518 C519 4.7u 0.1u C520 C521 4.7u 0.1u VREG_WM_2.7V 0

VREG_MSME_1.8V

U502 13 DCVDD 14 DBVDD 26 AVDD2 31 AVDD1 MMP_A_LRCLK MMP_A_BCLK MMP_ADI_ADCDAT MMP_ADO_DACDAT MMP_A_MCLK 7 8 9 10 11 LRC BCLK ADCDAT DACDAT MCLK

WM8983 DGND AGND1 12 28 24 C524 0.1u 27 32 29 30 FB500 SPK_OUT+ SPK_OUTFB501 OUT3 OUT4 MODE 22 21 18 MIC2P C543 C544 NA NA HP_EAR_R HP_EAR_L C525 10u C531 NA MIC_PWR

U502

AGND2

C530 12n C532 SPK_R 1K C535 FM_AUDIO_R C536 FM_AUDIO_L C541 SPK_L 1K 4.7n C547 12n 18K 1u R516 C542 R517 1u 4.7n 1u 18K 1u R510 C533 R511

VMID MICBIAS ROUT1 LOUT1

C534 1u

4 RIP 5 RIN 6 R2_GPIO3 L2_GPIO2

C539 1u

3

ROUT2 LOUT2

23 25

MID_MICP

1 LIP 2 LIN 19 20 AUXL AUXR

C548 HP_L C549 HP_R

1u 1u

CODEC_I2C_SCL CODEC_I2C_SDA

15 CSB_GPIO1 16 SCLK 17 SDIN

R519

PGND

33

C550 NA

C551 NA

Schematic of voice path

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

100K

- 127 -

LGE Internal Use Only

4. TROUBLE SHOOTING

FB502 FB503 U504 C562 R522 C578 R529

HP_AMP_EN

C562 0.22u

HP_EAR_L

R522
MIDI_3.3V

17

16

15

_SHDN

SVDD1

INL+

P_G

INL_

C565 4.7u

C566 1u 1 2 C570 1u 3 4

14

13

15K

FB502 OUTL SVSS OUTR SVDD2 12 11 FB503 10

600

R524 MIDI_EAR_L 68

PVDD C1P PGND

U504 MAX9722BETE

600
PQ

R525 MIDI_EAR_R 68

U504
PVSS SGND INR+ INR_

C1N

9

PRSB6.8C C574

PRSB6.8C
PQ

R529

15K

C577 1u

C578 0.22u

HP_EAR_R

Schematic of voice path

LGE Internal Use Only

- 128 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

C573

6

7

5

8

4. TROUBLE SHOOTING

4.12.3 Loud speaker path (voice speaker phone/VT)
Loud speaker path as below: MSM6280 SPK_R, SPK_L → C532,C541 → R510,R516 → C533,C542 → R511,R517 → U502(audio codec) → FB500,FB501 → CN603(B’toB connector) → OUT800, OUT801 (SPK PAD) → Speaker

Start

Connect the phone to network Equipment and setup call Setup 1KHz tone out Set phone with speaker phone mode

The sine wave appear at C532,C541? YES The sine wave appear at FB500, FB501? YES The sine wave appear at pads of speaker? YES Can you hear the tone? YES END

NO

Change the Main board

NO

Check the U502 or Change the Main board

NO

Check the CN603

NO Change the speaker

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 129 -

LGE Internal Use Only

4. TROUBLE SHOOTING

LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS

AC18 AC17 AA17 W17 AE18 AF18 T15

HP_R HP_L SPK_R SPK_L RCVRCV+ MICBIAS

C530 12n C532 SPK_R 1K C535 FM_AUDIO_R C536 FM_AUDIO_L C541 SPK_L 1K 4.7n C547 12n 18K 1u R516 C542 R517 1u 4.7n 1u 18K 1u R510 C533 R511

MMP_A_LRCLK MMP_A_BCLK MMP_ADI_ADCDAT MMP_ADO_DACDAT MMP_A_MCLK

7 8 9 10 11

AGND2 LRC BCLK ADCDAT DACDAT MCLK

24 C524 0.1u 27 32 29 30 FB500 SPK_OUT+ SPK_OUTFB501 C543 C544 NA NA HP_EAR_R HP_EAR_L C525 10u C531 NA MIC_PWR

VMID MICBIAS ROUT1 LOUT1

C534 1u

4 RIP 5 RIN 6 R2_GPIO3 L2_GPIO2

C539 1u

3

ROUT2 LOUT2

23 25

MID_MICP

1 LIP 2 LIN 19 20 AUXL AUXR

OUT3 OUT4 MODE

22 21 18

MIC2P

CODEC I2C SCL

15 CSB_GPIO1 16 SCLK

9

VREG_MSMP_2.7V

CN603 G1 EAR_MIC_P BT_SBST BT_TX_RX_N TCXO_BT BT_CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G2 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

VREG_MMC_3.0V

VREG_BT_2.85V

+VPWR

BT_SBCK BT_SBDT BT_DATA V_BACK_UP HOOK_SENSE_N CAM_VDD_AF_2.7V CAM_VDD_SD_1.8V SPK_OUTSPK_OUT+

MICROSD_CLK MICROSD_DETECT MICROSD_CMD MICROSD_DATA[0] MICROSD_DATA[1] MICROSD_DATA[2] MICROSD_DATA[3]

CAM_MIC+ WHEEL_SW_R WHEEL_SW_L MMP_CAM_PWR_EN

AXK740327G

LGE Internal Use Only

- 130 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

K

4. TROUBLE SHOOTING

Pads of Speaker

C532,C541

C722 U502 (audio codec) MSM

FB500, FB501 CN603

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 131 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12.4 Microphone for main MIC
Main Microphone path as below: MIC → C567,C568 → MSM internal CODEC

MICBIAS C564 47p SPM0204HE5-PB-3 P 4 G2 3 G1 2 O 1 MIC500 C575 33p C563 10u C567 C568 22n 22n C569 NA MIC1P MIC1N

MIC

C576 10p

10p

C236 0.1u

C235

0.1u

C200

MIC1N MIC1P NA

C203

C204

NA

C238

C237
0.1u Place near MSM pin W18 (CODEC VSS) 10%
F25

AC21

AC19

AC20

LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP

AA20

AE19

AE20

AF19

AF21

AF22

AF20

NA

Start

SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100 M26 SDCC_DAT3_GPIO101

MSM MSM MSM

Make a call

MIC_BIAS(R221) is 1.8V?

NO

Change the Main B'd

YES
make some sound or voice to MIC

Can you scoping some sound signal at C567,C568?

NO

Change the MIC or Change the Main B'd

YES YES
Work well?

END

LGE Internal Use Only

- 132 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

MSM

C567, C568

MIC500 (MIC for Handset)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 133 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12.5 Microphone for headset
MIC for Head_Set path as below: Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6280 sense Head_Set insertion → MIC signal → U502(audio codec) → MSM6280.

L504 2.2uH

VREG_MSMP_2.7V

CN500 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 FB504

R528

100K

FM_ANT EAR_MIC_P
TV_OUT

MIDI_EAR_L MIDI_EAR_R
RMT_INT-USB_D+ RMT_ADC-USB_D-

MMP_A_LRCLK MMP_A_BCLK MMP_ADI_ADCDAT MMP_ADO_DACDAT MMP_A_MCLK

7 8 9 10 11

AGND2 LRC BCLK ADCDAT DACDAT MCLK

24 C524 0.1u 27 32 29 30 FB500 SPK_OUT+ SPK_OUTFB501 C543 C544 NA NA HP_EAR_R HP_EAR_L C525 10u C531 NA MIC_PWR

VMID MICBIAS ROUT1 LOUT1

EAR_SENSE_N VBATT RMT_PWR_ON_N

C534 1u

4 RIP 5 RIN 6 R2_GPIO3 L2_GPIO2

C539 1u

USB_VBUS
UART TXD

3

ROUT2 LOUT2

23 25

MID_MICP

1 LIP 2 LIN 19 20 AUXL AUXR

OUT3 OUT4 MODE

22 21 18

MIC2P

CODEC I2C SCL

15 CSB_GPIO1 16 SCLK

Start Make a call Try ch ange the head set NO EAR_SENSE_N is 0V? YES MIC_BIAS is 2.7V ? YES make some sound or vo ice t o MIC Can y ou s coping s ome sound signal at C539? YES Can y ou s coping s ome sound signal at C235,L20 0? YES YES Work w ell? END NO
Check t he U502 or Change the Main Bíd

MIC2P
L200 100nH

YES NO

10p

Change the Main b'd NO Change the Main b'd
C236 0.1u

C235

0.1u

C200

MIC1N MIC1P NA C203

END

K

9

C204
C2

AC21

AC19

AC20

NO

Change the MIC

LGE Internal Use Only

- 134 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP

SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC DAT3 GPIO101

AA20

AE19

AE20

AF19

AF21

AF22

AF20

NA

4. TROUBLE SHOOTING

C535

#8 pin of ear connector to check EAR_SENSE_N

MSM

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 135 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 Camera trouble
Camera control signals are generated by ZORAN (Multimedia Chip) and directly connected with ZORAN. KU990 has two cameras. The one is a 5 Mega Camera, the other is VGA camera.

5M START

Check the camera conn. and reconnect the camera Yes Camera is OK? NO NO
ZORAN output signal check (MMP_CAM_RESET_N, MMP_ CAM_PWR_EN))

End

Yes NO Change the LDO (U601, U602, U701, U900, U901) Yes
Check master clock 5M_CAM_MCLK (CN600)

NO Change the Analog Switch (U604, U607)

Yes Check MMP_CAM_PCLK (CN600) No Change the camera Yes
Check the EMI/ESD filter (FL600, FL601)

No

Yes Change the Filter

Yes Camera is OK NO Change the Main board End

LGE Internal Use Only

- 136 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

MMP_CAM_PWR_EN

CAM_VDD_SA_2.7V

CAM_VDD_SD_1.8V

CAM_VDD_IO_2.7V U604 MMP_CAM_RESET_N

FL600 U607 FL601

CAM_VDD_CORE_1.2V 5M_CAM_MCLK

MMP_CAM_PCLK

CAM_VDD_AF_2.7V

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 137 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C609 : CAM_VDD_SA_2.7V
CAM_VDD_AF_2.7V

C601 : CAM_VDD_AF_2.7V C605 : CAM_VDD_CORE_1.2V
CAM_VDD_SA_2.7V CAM_VDD_CORE_1.2V C601 0.1u C602 1u C600 10u

C606 : CAM_VDD_IO_2.7V
CAM_VDD_SD_1.8V CAM_VDD_IO_2.7V

C607 : CAM_VDD_SD_1.8V

0.1u

1u

C605 0.1u

CN600 R601 10 MMP_I2C_SCL R602 10 MMP_I2C_SDA MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_RESET_N STROBE_TRIGGER 5M_CAM_DATA[6] 5M_CAM_DATA[4] 5M_CAM_DATA[2] 5M_CAM_DATA[0] R607 5M_CAM_MCLK 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

R603 R604

10 10

C609

C608

GB042-30S-H10-E3000

C606 0.1u

C607 0.1u

MMP_CAM_INT 5M_CAM_DATA[7] 5M_CAM_DATA[5] 5M_CAM_DATA[3] 5M_CAM_DATA[1] R608 10 MMP_CAM_PCLK

VA600

ICVL0518100Y500FR

VA602

R607 : 5M_CAM_MCLK

EVLC18S02015

C610 C611 C612 C613 10p 10p 10p 10p

C614 0.1u

R608 : 5M_CAM_PCLK

MMP_I2C_SCL MMP_I2C_SDA MMP_CAM_RESET_N MMP_STROBE_CHARGE MMP_CAM_PWR_EN MMP_CAM_INT

N14 P14 P2 M3 P7 N1 P1 M5 N6 M6 P5 N5

SCL SDA
10

100K

R331

TP302

MICROSD_DETECT

R333

NA
TP303

GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9

G2

G1

5

ICVL0518100Y500FR

VA601

33

MMP_CAM_DATA[7] MMP_CAM_DATA[6] MMP_CAM_DATA[5] MMP_CAM_DATA[4]

6 7 8 9

INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

4 3 2 1

5M_CAM_DATA[7] 5M_CAM_DATA[6] 5M_CAM_DATA[5] 5M_CAM_DATA[4]

ICVE10184E070R100FR

FL600

FL600

R331 : MMP_CAM_PWR_EN
5M_CAM_MCLK VGA_CAM_MCLK

U604
CAM_SELECT_N +VPWR CAM_MCLK
MMP_CAM_DATA[3] MMP_CAM_DATA[2] MMP_CAM_DATA[1] MMP_CAM_DATA[0]

U604 NC7SB3157L6X 6 1 S B1 5 2 GND VCC 3 4 A B0

10 G2

G1

5

5M_CAM_MCLK

U607 NC7SB3157L6X 1 6 B1 S 2 5 GND VCC 4 3 A B0

6 7 8 9

INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

4 3 2 1

+VPWR MMP_CAM_MCLK

5M_CAM_DATA[3] 5M_CAM_DATA[2] 5M_CAM_DATA[1] 5M_CAM_DATA[0]

ICVE10184E070R100FR FL601

U607

C621 0.1u

C622 0.1u

FL601

Schematic of 5M camera part

LGE Internal Use Only

- 138 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

VGA START

Check the camera & 30-pin conn. And reconnect these connectors (Main & FPCB connector)

Yes Camera is OK? NO NO
MSM6280 output signal check (VGA_CAM_RESET_N, V VGA_CAM_PWDN)

End

Yes Check VGA_VDD_2.7, VGA_VDD_1.8V Yes NO
Check master clock (VGA_CAM_MCLK : R717)

NO Change the LDO (U600)

NO Change the Analog Switch (U604, U607)

Yes Check the EMI/ESD filter Yes Yes
Check the VGA_CAM_PCLK (R718)

NO

Change the Filter (FL700, FL701)

NO Change the slider FPCB Yes

No

Change the camera

Yes Camera is OK NO Change the Main board End

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 139 -

LGE Internal Use Only

4. TROUBLE SHOOTING

VGA_CAM_PWDN

VGA_CAM_PCLK FL700, FL701 : EMI FILTER

VGA_CAM_PCLK

VGA_CAM_RESET_N

VGA_VDD_1.8V

VGA_VDD_2.7V

U604

U607

LGE Internal Use Only

- 140 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

R718 : VGA_CAM_PCLK
VGA_VDD_2.7V VGA_VDD_1.8V

R717 : VGA_CAM_MCLK

CN701 VGA_CAM_PWDN VGA_CAM_MCLK MMP_CAM_PCLK VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] VGA_CAM_DATA[4] VGA_CAM_DATA[5] MOTOR+ MOTORRCV+ RCVR717 10 R718 10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

R719 10 R720 10 R724 R725 10 10

VGA_CAM_RESET_N I2C_SCL I2C_SDA MMP_CAM_HSYNC MMP_CAM_VSYNC VGA_CAM_DATA[7] VGA_CAM_DATA[6] x+ Y+ xY-

VA713

VA714

R729

ICVL0518100Y500FR

EVLC18S02015

NA

VA713 : VGA_CAM_PWDN VA713 : VGA_VDD_2.7V VA713 : VGA_VDD_2.7V FL700
ICVE10184E070R100FR MMP_CAM_DATA[0] MMP_CAM_DATA[1] MMP_CAM_DATA[2] MMP_CAM_DATA[3]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

resistor

C709 : VGA_VDD_1.8V

FL701
ICVE10184E070R100FR VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] MMP_CAM_DATA[4] MMP_CAM_DATA[5] MMP_CAM_DATA[6] MMP_CAM_DATA[7]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

EVLC18S02015

C710 0.1u

C711 0.1u

C712 C713 C709 10p 10p 0.1u

VA715
C714 C715 10p 10p

VGA_CAM_DATA[4] VGA_CAM_DATA[5] VGA_CAM_DATA[6] VGA_CAM_DATA[7]

G1 5

G1

5

G2

10

10

G2

FL700

FL701

U604
5M_CAM_MCLK VGA_CAM_MCLK U604 NC7SB3157L6X 1 6 B1 S 2 5 GND VCC 3 4 A B0 CAM_SELECT_N +VPWR CAM_MCLK

5M_CAM_MCLK

U607 NC7SB3157L6X 1 6 B1 S 2 5 GND VCC 4 3 A B0

+VPWR MMP_CAM_MCLK

U607

C621 0.1u

C622 0.1u

Schematic of VGA camera part

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 141 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.14 Main LCD trouble
Main LCD control signals are generated by MSM6280. Those signal’s path are : MSM6280 → Z ORAN (Multimedia Chip) -> 40-pin connector(CN300 in Main PCB) -> 40-pin connector (in LCD Module)

START

Press END key to turn the power on

Is the circuit powered? Yes Disconnect and reconnect 40-pin B to B connector

No

Follow the Power ON trouble shooting

LCD display OK? No
Check LCD_VDD_2.8V, LCD_RESET_N, LCD_DATA[0~15] in Main BD

Yes

No Change the Main BD

Yes Yes Display OK? No Change the LCD module

The LCD works

End

LGE Internal Use Only

- 142 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

Main BD

LCD_VDD_2.8V

LCD_NRESET

LCD_DATA[0~15]

SUB BD

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 143 -

LGE Internal Use Only

4. TROUBLE SHOOTING

LCD_VDD_2.8V

VA300 ICVN0505X150FR

C320 NA

C321 0.1u

C321 : LCD_VDD_2.8V

CN300 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 MMP_LCD_VSYNC_IN LCD_MAKER_ID WLED_PWR WLED_1 WLED_2 WLED_3 WLED_4 WLED_5 LCD_IF_MODE R314 R315 R316 R317 51 51 51 51 R318 0 MMP_LCD_ADS MMP_LCD_CS_N LCD_RESET_N MMP_LCD_RD_N MMP_LCD_WE_N MMP_LCD_VSYNC_OUT OTP Program Pin LCD_VSYNC_OUT

22p

22p

22p

22p

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11] LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

VA301 C326 22p

C323

C324

ENBY0036001 1.0T, Socket GB042-40S-H10-E3000

C322

C325

FL300
MMP_LCD_DATA[0] MMP_LCD_DATA[1] MMP_LCD_DATA[2] MMP_LCD_DATA[3]
1 2 3 4

C326 : LCD_VDD_2.8V
FL300 ICVE10184E150R500FR
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3]

G1 5

FL301
MMP_LCD_DATA[4] MMP_LCD_DATA[5] MMP_LCD_DATA[6] MMP_LCD_DATA[7]
1 2 3 4

FL301 ICVE10184E150R500FR
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

G2

LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7]

G1

FL302
MMP_LCD_DATA[8] MMP_LCD_DATA[9] MMP_LCD_DATA[10] MMP_LCD_DATA[11]
1 2 3 4

FL302 ICVE10184E150R500FR
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

5

G2

LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11]

G1

FL303
MMP_LCD_DATA[12] MMP_LCD_DATA[13] MMP_LCD_DATA[14] MMP_LCD_DATA[15]
1 2 3 4

FL303 ICVE10184E150R500FR
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

10

5

G2

LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

Schematic of LCD part

LGE Internal Use Only

10

5

G1

G2

- 144 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.15 Bluetooth trouble
Bluetooth supplied voltages are generated by the PM6650. Those signal’s path are : PM6650 → VREG_MSMP_2.7V and VREG_BT_2.85V is asserted → TCXO_BT 19.2MHz is asserted → Bluetooth ON → BT_TX_RX_N is High → BT serial interface control is operated (SBST / SBCK / SBDT)

C800

NA

BT_ANT

BT_GND

L800

NA

R800

0

BLUETOOTH
LBRQ-2B43A

BT_CLK

C801

1000p

9 3 2 10

ANT

16

M800 4 SBST 11 SBCK 12 SBDT 5 13 7

LG INNOTEK
TP800 TP801 TP802

CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT

BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N

SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN

R807 C802

0 1000p

BT_DATA TCXO_BT

C803 1u

C804 1u

14

PGND4 20 PGND3 19 PGND2 18 PGND1 17

GND4 15 GND3 8 GND2 6 GND1 1

R808

R809

10K

VREG_MSMP_2.7V VREG_BT_2.85V

C811 100p

C812 0.1u

C813 C814 100p 2.2u

TCXO
X100
3 VREG_TCXO_2.85V C139 0.1u C140 1000p 4 OUT GND 2 R115 VCC VCONT 1 C141 0.01u 100ohm TRK_LO_ADJ

19.2MHz

10K

VREG_BT_2.85V C144 TCXO_PM 1000p R120 100K C145 1000p

C147 RTR6275_TCXO

1000p

C148 8200p

U102
TC7SH04FS

TCXO_BT

Figure. Schematic of Bluetooth Interface

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 145 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.16 Bluetooth RF Test

TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode. - Enter Test Mode(3845#*990#) → Module Test Set → BT DUT → BT DUT ON 2. Insert a phone in a TEMSELL (in case of radiation test) 3. Set ‘discover’ after push menu button of the tester and select the link analyzer . 4. After ‘set test mode’, confirm the connection state. 5. Measure the power of full channel after hopping mode is selected to ‘ON’ 6. You can select wanted test cases after getting an optimized power
TP801
Set the bluet oot h ON

M800 TP800

VREG_BT_2.85V and VREG_MSMP_2.7V is ass erted?

No

Check P MIC (U501) Pin#64

Yes XTAL_IN is ass erted? Yes CLK_REF is ass erted? Yes No No No

Check Os ci llator (X100) An d Check Buffer (U102) Check sol deri ng of BT( M800)

TP802

BT Antenna

SYNC_DET_TX_EN is ass erted?

Check sol deri ng of BT( M800)

Yes
SBST/SBCK/SBDT is ass erted?

BT_GND
No Check TP800/TP801/ P802

Yes
Bluetoot h is work well?

No

Change the main board

Yes END

R800 BT_ANT

LGE Internal Use Only

- 146 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

4. TROUBLE SHOOTING

4.17 Touch Screen trouble
Touch Initial sequence of KU990 is: LCD_VDD_2.8V(C701) goes to 2.8V → TOUCH_PENIRQ_N(R702),TOUCH_I2C_SCL(R703) & TOUCH_I2C_SDA(R704) go to high Touch operation of KU990 is : A finger is touching on the screen -> TOUCH_PENIRQ_N is low -> I2C is connected -> A finger is took off from the Screen -> TOUCH_PENIRQ_N is high -> I2C is not connected.

Start

Touchpad Calibration

Work well? No

Yes

End

NO Connector Is insert? YES Replace the Folder Insert Connector, again

Yes Work well? No Replace the Main board End

C701 (LCD_VDD_2.8V) U700

Touch Window Connector

R702 (TOUCH_PENIRQ_N)

R704(TOUCH_I2C_SDA) VGA FPCB Connector R703 (TOUCH_I2C_SCL)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

5. DOWNLOAD
5.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

5.2 Downloading Procedure
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences.

➢ Play a success sound It will be played a .wav file when the download has been completed. To enable this simply check the box. ➢ Always on Top Check if LGMDP always appears at the top of the window so that user can monitor it all the time. ➢ Automatically run Select Port When LGMDP starts When LGMDP starts, it will automatically select Select Port button to download new image file.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

• The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse... button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse... button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically.

1) 2)

3) 5)

4)

6)

7)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option. Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out. Keep All Contents Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected. 5) Additional Options: Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose. 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5.2.2 Choosing image files
• Select the image folder, where all the image files are located, by clicking on the Browse.... (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse... button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.)

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse... button.

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 155 -

LGE Internal Use Only

5. DOWNLOAD

Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.

Yes

No

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5.2.3 Downloading
• This message box informs that a new file for NV backup will be created in the displayed file name in the LGMDP installation directory.

• Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.

• Erasing the existing directories and files before the Module image is downloaded.

• Downloading the AMSS modem image

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

• Rebooting the handset and re-establishing the connection

• Restoring NV data which backed up in the Backing up process. User can also restore NV data using NV Default image selection.

• Rebooting the handset and re-establishing the connection

• Erasing the existing directories and files before downloading the selected Media image

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

• Downloading Media image in progress

• Downloading Module image in progress

• Downloading process has completed successfully

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 159 -

LGE Internal Use Only

5. DOWNLOAD

5.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5.3 Troubleshooting Download Errors
5.3.1 When the phone does not work
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image. The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.) • The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue.

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

• Choose Image file after clicking on the Browse... button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

5.3.2 NV Restore Error
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

• Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

5. DOWNLOAD

• Click on Browse... . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

5. DOWNLOAD

5.4 Caution
1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name IMEI number

Port number

4) Recommended that the Module and Media Image have to be downloaded at the same time. 5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block

[Figure 2.1] UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

6. BLOCK DIAGRAM

Block Common

Ref. Name FL100 SW100 X100 U100

Part Name LSHS-M090UH KMS518 TG-5010LH_19_2M RTR6275 LBRQ-2B43A SAYZ1G95EB0B00 EFCH2140TDE1 EFCH1950TDF1 A WT6277R CP0402A1950DNTR TQM7M5003 EFCH897MTDB1

Function Front End Module Test Connector VCTCXO RF Transceiver IC BT RF Transceiver Duplexer RX SAW Filter TX SAW Filter TX PAM Coupler TX Dual PAM Tx SAW Filter

Comment ASM+Rx Saw Calibration, etc 19.2MHz TRX BT TRX TRX RX TX TX TX TX Tx

Bluetooth UMTS

M800 FL103 FL102 FL104 U105 U104

GSM

U101 FL101

[Table 2.1] RF Block Component

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

6. BLOCK DIAGRAM

6.2 Interface Diagram

[Figure 2.2] U990 Interface Diagram

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

6. BLOCK DIAGRAM

Main RF signal
Main RF signal GSM 900 TX DCS TX PCS TX W- TX GSM 900 RX DCS RX PCS RX W- RX TX_I/Q RX_I/Q Description GSM 900 TX RF Signal DCS TX RF Signal PCS TX RF Signal UMTS2100 TX RF Signal GSM 900 RX RF Signal DCS RX RF Signal PCS RX RF Signal UMTS2100 RX RF Signal I/Q for Tx of RF I/Q for Rx of RF Comment

Control signal
Control signal UMTS PA_CTL signal PA_R1 PA_ON GSM PA_CTL signal GSM_PA_BAND GSM_PA_EN GSM_PA_RAMP RF Tranceiver_CTL signal TX_ON SSBDT_RTR TX_AGC_ADJ FEM_CTL signal UMTS, ANT_SEL 0,1,2 Ant Switch Module Mode Selection GSM900Tx/Rx, DCS Tx/Rx, PCS Tx/Rx RF Enable Signal Bidirectional SSBI Data UMTS Transmit Gain Control DCS or PCS /GSM Mode Selection Power Amp. Gain Control Enable Power Amp. Gain Control UMTS Tx High/Low Power Control Power Amp. Enable Description Comment

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2
KMS-518 SW100
G1 G2 A C

3

4

5

6

7

8

9

10

11

12

C100 180p TX_IP

ANT100 ANT101 ANT102

L100 0 C102

L101 C101 120p 4.7nH C104 1.2p L103 5.6nH L102 NA C105 WCDMA_2100_TX_OUT DCS_PCS_TX L104 15nH L105 5.6nH TX_ON TX_AGC_ADJ DAC_REF SSBDT_RTR L106 5.6nH L107 15nH L108 5.6nH C116 12p R101 (1%) 680 C117 22p 31 GCELL_INP 30 GCELL_INN 32 EGSM_INP 33 EGSM_INN L110 22nH L111 22nH 38 DCS_INP 39 DCS_INN 36 GPCS_INP 37 GPCS_INN R100 12K (1%) 24 56 54 14 RF_ON VCONTROL DAC_REF SBDT TCXO 7 C111 C112 3300p 1000p GSM_TX C106 C108 56p 6p 5p 55 ENV_OUT 2 ENV_LNP 1 ENV_LNN 51 TX_IP 50 TX_IN 53 TX_QP 52 TX_QN

C103 180p

TX_IM

A
12nH

46 HB_RF_OUT1 44 HB_RF_OUT2 43 LB_RF_OUT1 42 LB_RF_OUT2

A
C107 180p TX_QP

PQ

FL100
5 VC1 4 VC2 3 VC3 ANT 10 6 VDD 7 NC 8 UMTS_TX_RX 13 DCS_PCS_TX 16 EGSM_TX DCS_RX2 DCS_RX1 PCS_RX2 PCS_RX1 EGSM_RX2 EGSM_RX1 LSHS-M090UH 19 20 21 22 23 24

VREG_RF_SMPS
C109 47p

DCS

C110 180p

TX_QM

ANT_SEL0 ANT_SEL1 ANT_SEL2
C113 47p C114 47p C115 47p

B

1 2 9 11 12 14 15 17 18 25 26

5 VTUNE1 18 VTUNE2

VTUNE-Connected directly to GND

RTR6275_TCXO RX_IP RX_IM RX_QP RX_QM R102 PWR_DET

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 PGND1 PGND2

U100
RTR6275

12 RX_IP 13 RX_IN 10 RX_QP 11 RX_QN 40 PWD_DET_IN 21 TEST VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 4 6 8 9 15 16 19 20 28 41 45 47 48 49

PCS

3 R_BIAS1 27 R_BIAS2

R103 R104

NA 5.1

0 VREG_RF_SMPS 22u C118

B

L109 22nH

R107

2.7

0.1u

0.1u

0.1u

0.1u

C119

C120

C121

C123

0.1u

WLNA_OUT

34 WMIX_INP 35 WMIX_INN

22 CAL_INP 23 CAL_INN RX_WCDMA_2100 26 WLNA_IN

C122

C124

0.1u

GSM

VREG_SYNTH_2.6V C126 22p C127 100p C125 1u

25 GND 57 PGND

29

17

VDDM

VDD_RX

WLNA_OUT

R109

10

C128 22p

C

WCDMA_MIX_IN_P WCDMA_MIX_IN_M
C131 100p C129 0.1u 22u C130

C
VREG_RF_SMPS

ANTENNA SWITCH MODULE LOGIC
ANT_SEL0 GSM 850/GSM 900 TX GSM 1800/GSM 1900 TX GSM 850 RX GSM 900 RX GSM 1800 RX HIGH HIGH LOW LOW LOW LOW HIGH ANT_SEL1 HIGH LOW LOW LOW HIGH HIGH LOW ANT_SEL2 LOW LOW 13 LOW HIGH C136 HIGH C138 LOW HIGH L112 NA WCDMA 15nH 8 9 8p 10 12 11 GND5 VCC GND4 GND3 U101 TQM7M5003 BS TX_EN VBATT GND1 VRAMP GSM_IN 2 3 4 5 6 7 C137 1u C135 33u GSM_PA_BAND GSM_PA_EN +VPWR R112 91 14 1 R111

VREG_MSMP_2.7V C132 0.01u C133 22p C134 1000p

SMPS circuit for RF
near to 48pin

GND6

DCS_PCS_IN

DCS_PCS_TX 68 R113 91

10 dB

TCXO
X100
3 2

DCS_PCS_OUT

D

GSM 1900 RX

GND8

GND7

GSM_OUT GND2

FL101
3 R114
IN O1 G3 EFCH897MTDB1 G2 G1

D
2 R115 100ohm TRK_LO_ADJ C141 0.01u 1

OUT

GND

1

GSM_TX 51 8 dB R118 120 R119 120

VREG_TCXO_2.85V C139 0.1u C140 1000p

4

VCC VCONT

17

16

15

4

5

19.2MHz

R117

2.2K GSM_PA_RAMP

Thermistor circuit deleted

C146

10p

C143 68p VREG_BT_2.85V C144 L113 4.7nH GSM_PA_BAND LOW
PQ

C142

1000p

R120 100K

GSM
E

TCXO_PM MODE GSM DCS/PCS C147 RTR6275_TCXO 1000p C148 8200p

C145 1000p

0.75p

HIGH

U102
TC7SH04FS

TCXO_BT

E

WCDMA
VDD_RX
C149 22p

FM RADIO
EFCH2140TDE1
L114 1.5nH C153 C154 56p L117 1.8nH
PQ

L115 1nH

L116

FL102
2 1
IN G2 O2

WCDMA_MIX_IN_M
1nH C150 0.1u C151 0.01u U103 TEA5766UK VAFR E6 E5 FM_AUDIO_L E4 E3 E2 E1 C157 C158 1u A6 B1 B2 B5 B6
4 5
IN

3

56p

10K

F

R121

C152 3.9p

WLNA_OUT

G1 O1

C155 0.5p A1 A2

FM_AUDIO_R

5

4

F

CPOUT LOOPSW LO1 LO2 VCCVCO VCC SWPORT INTX AGND RFIN1 FREQIN BUSEN

VAFL MPXOUT VREFDIG CLOCK DATA TMUTE ISS DGND2 DGND1 VDD RFIN2 RFGND

L118 1nH

L119

WCDMA_MIX_IN_P
100K R122
1nH

L120

Rev. 1.1

A3 47nH A4 A5

VREG_MSMP_2.7V
TP100 TP101

2.2nH L121 VREG_MMC_3.0V

I2C_SCL I2C_SDA

2.2p

C156

D6 0.1u D5 D3 D2 D1 C6 C5

FL104
EFCH1950TDF1
2 1 GND1 4 GND2 8 GND3
C159 +VPWR 8.2p C160 22u C162 0.01u C163 100p C164 1u L124 L123 15nH C161
1
O1 G3 G2 G1

FM_INTX

TP102

FL103
G SAYZY1G95EB0B00

ANT

3 GND6 6 GND5 9 GND4

WCDMA_2100_TX_OUT C165 NA 56p L122 NA FM_BUSEN

C1 C2

G

RX

TX

3

2

7

5

U105
U104
SCDY0003403
1 2 OUT
4.7nH L128 C170 1.8p L126 8.2nH 11 10 9 8 7 6 GND5 VCC2 GND4 RFOUT GND3 GND2 1 VCC1 2 RFIN 3 GND1 4 VMODE 5 VREF
4

3.3nH

C166 FM_ANT 100p C171 56p PA_R1

C167 RX_WCDMA_2100 56p L125 1.2nH
PQ

C168 56p

C169 5.6p

IN

Q100
VREG_TCXO_2.85V TP103 SLEEP_CLK C173 100p PA_ON
2

50OHM

4

H

R124 51 R125 100

3

COUP

AWT6277R

R123 PWR_DET 68 R126 100 8 dB

5

1

3

20dB

C172 27p

L127 100nH

KRX102E

H

1

2

3

4

5

6

7

8

9

10

11

12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 171 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

6

7

8

9

1

10 0

11

12

PCB_Rev_ADC MODE

USB 48M CLK
A
( +/- 2500ppm for USB Peripheral )

ADC
MODE2 MODE1 MODE0 0 0 BOOT_MODE 0 1 1 NOR boot 8-bit, NAND boot 16-bit, NAND boot ( Default Pull-Down) Native, ARM JTAG Native, MSM JTAG HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - HDET1 HKADC[3] - REMOTE_ADC HKADC[4] - PCB_Rev_ADC HKADC[5] - VBATT_TEMP PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM Normal boot Trusted boot

MIC2P

USB_XTAL_IN
ICRT20S48M0X514CR X200 48MHz R200

VREG_MSMP_2.7V

0 0

0 1

A

BOOT_MODE2 X 0 1 BOOT_MODE3 0 1

3

VREG_MSME_1.8V

VREG_MSMP_2.7V VREG_MSMP_2.7V

1

1M

2

L200 R201 470K1% 100nH R202 150K 1%

VREG_MSMP_2.7V

10p

SDRAM_CLK SDRAM_CS_N SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N

BUFF_TCXO USB_XTAL_IN USB_XTAL_OUT SLEEP_CLK

SDRAM_WE_N SDRAM_DQM[3] SDRAM_DQM[2] SDRAM_DQM[1] SDRAM_DQM[0]

AMUX_OUT VBAT_SENSE

RESET_IN_N RESOUT_N

VBAT_TEMP

RMT_ADC

HP_R HP_L SPK_R SPK_L RCVRCV+ MICBIAS

R203 R204 R205

C236 0.1u

C235

NA 51K 51K

0.1u

C200

MIC1N MIC1P

USB_XTAL_OUT

NA

100K

C203

V1 SDRAM_ADDR[0]

L1 SDRAM_ADDR[1]

L4 SDRAM_ADDR[2]

M8 SDRAM_ADDR[3]

M4 SDRAM_ADDR[4]

N11 SDRAM_ADDR[5]

N8 SDRAM_ADDR[6]

N6 SDRAM_ADDR[7]

N2 SDRAM_ADDR[8]

N1 SDRAM_ADDR[9]

P1SDRAM_ADDR[10]

P2SDRAM_ADDR[11]

P6SDRAM_ADDR[12]

P8SDRAM_ADDR[13]

P11 SDRAM_ADDR[14]

100K

51

R206

C204

C238

C237

B

SDRAM_ADDR[0:14]

NA

NA

B

NA

0.1u Place near MSM pin W18 (CODEC VSS)

RESIN_N F11 RESOUT_N AA4 RESOUT_N_EBI1 AE17 R209 WDOG_EN

AB1 R207

R208

10%
AA23 AB23 AC18 AC17 AA17 AA18 AA19 AC22 AC21 AC19 AC20

TCXO A10 USB_XTAL48_IN B10 USB_XTAL48_OUT A16 SLEEP_XTAL_IN B16 SLEEP_XTAL_OUT

MODE2 U23 MODE1 Y23 MODE0

ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0

A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14

BOOT_MODE BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5

LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP

SDRAM_DATA[0:31]

AA20

AE21

AE22

AE18

AE19

AE20

AF18

AF19

AF21

AF22

AF20

W21

W17

AA2

AD1

D18

V21

V19

Y21

F13

T21

T15

W6

M6

N4

G1

K8

U8

U4

Y4

V8

V2

L2

VREG_MSMC_1.2V
F25

VREG_MSME_1.8V

VREG_MSMP_2.7V

VREG_MSMA_2.6V

C

D

SDRAM_DATA[31] SDRAM_DATA[30] SDRAM_DATA[29] SDRAM_DATA[28] SDRAM_DATA[27] SDRAM_DATA[26] SDRAM_DATA[25] SDRAM_DATA[24] SDRAM_DATA[23] SDRAM_DATA[22] SDRAM_DATA[21] SDRAM_DATA[20] SDRAM_DATA[19] SDRAM_DATA[18] SDRAM_DATA[17] SDRAM_DATA[16] SDRAM_DATA[15] SDRAM_DATA[14] SDRAM_DATA[13] SDRAM_DATA[12] SDRAM_DATA[11] SDRAM_DATA[10] SDRAM_DATA[9] SDRAM_DATA[8] SDRAM_DATA[7] SDRAM_DATA[6] SDRAM_DATA[5] SDRAM_DATA[4] SDRAM_DATA[3] SDRAM_DATA[2] SDRAM_DATA[1] SDRAM_DATA[0]

T8 T6 T4 R8 T2 T1 R6 R4 W4 V6 Y2 Y1 E1 R11 V4 U6 L6 L8 K4 J1 K6 J2 J4 P4 H4 G2 J6 AB4 D1 AB2 D2 E2

A1_22 A1_21 A1_20 A1_19 A1_18 A1_17 A1_16 A1_15 GPIO_74 GPIO_73 GPIO_72 GPIO_71 GPIO_70 GPIO_69 GPIO_68 GPIO_67 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0

SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100 M26 SDCC_DAT3_GPIO101 AE3 MDP_VSYNC_SECONDA_GPIO104 AD2 R210 MDP_VSYNC_PRIMARY_GPIO105
H25 F26 H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 R215 H13

0

MSM_MICROSD_DATA[1] MSM_MICROSD_DATA[2] MSM_MICROSD_DATA[3] LCD_MAKER_ID LCD_VSYNC_OUT

(CAD : 10uF=>Input MSMA_2.6V)
C239 4.7u C233 10u C234 1u

WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93

LIN_INVERTER LIN_MOTOR_EN CAM_MCLK LCD_IF_MODE USB_SELECT_N CAM_MODE3_N VGA_CAM_PWDN LCD_LDO_EN MICROSD_DETECT HOOK_SENSE_N RMT_INT

C

C210 0.01u

C211 0.01u

C212 0.1u

C213 0.01u

C214 0.01u

C215 0.1u

C216 0.1u

0

HP_AMP_EN CAM_SELECT_N LCD_RESET_N MMP_INT_N R211 TCXO_EN PA_ON (WCMDA 2100 PAM Enable) TX_QM TX_QP TX_IM TX_IP DAC_REF 2K C223 33nF TX_AGC_ADJ TRK_LO_ADJ

C217 1000p

C218 1000p

C219 0.01u

C220 0.01u

C221 0.01u

2200p cap => place between D12(VDDA1) and F12(DAC_REF)

TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0

C222 2200p C224 1u C225 1u C226 1000p C227 1000p C228 0.1u C229 0.1u

DAC_REF

D

A12 B12 A13 B13 F12 W23 V23 V25 W25

Near to B18 (VDD_PLL)

MMP_CS_N MMP_LCD_BYPASS_CS_N NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY EBI2_DATA[15] EBI2_DATA[14] EBI2_DATA[13] EBI2_DATA[12] EBI2_DATA[11] EBI2_DATA[10] EBI2_DATA[9] EBI2_DATA[8] EBI2_DATA[7] EBI2_DATA[6] EBI2_DATA[5] EBI2_DATA[4] EBI2_DATA[3] EBI2_DATA[2] EBI2_DATA[1] EBI2_DATA[0]

AC15 AF14 AF10

XMEM2_CS_N1 LCD_CS_N_GPIO38

VREG_MSMA_2.6V

VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12

VDD_PLL VDD_MDDI

VDD_PAD1_0 VDD_PAD1_1 VDD_PAD1_2 VDD_PAD1_3 VDD_PAD1_4

VDD_PAD2_0 VDD_PAD2_1 VDD_PAD2_2

VDD_PAD3_0 VDD_PAD3_1 VDD_PAD3_2 VDD_PAD3_3

AC25

AA10 AC9 W10 AA9 AE7 AC8 W9 AA8 AC7 AF5 AA7 AE5 AC6 AE4 AF3 AC5

E

D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0

VDD_PAD4_0

GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20
H15 D16 F15 D15 A17 H16 K19 N21 G4 J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19 A22

D17

(VDD_DAC_REF)

VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10

EBI2_DATA[0:15]

UB2_N XMEM2_CS_N0 OE2_N AF4 WE2_N AE10 LB2_N_A2_0 T14 NAND2_FLASH_READY_GPIO33
W14 AF7

U200-1 MSM6280_A

AA26

AA16

AE16

AE11

AE15

AE23

AE24

Y25 AB25

RX_QM RX_QP RX_IM RX_IP

AF17

AC2

AE8

AE6

G25

D25

B24

B14

B11

R25

K25

B15

B18

B21

D12

U25

U26

P23

Y26

T25

AA25

C230 0.1u 10%

C231 0.01u

W2

M2

C2

H2

B5

K2

R2

U2

B9

A3

F2

PA_R1 LIN_PWM_MAG

M1 R1

VSS_PAD1_0 VSS_PAD1_1 VSS_PAD1_2 VSS_PAD1_3 U1 VSS_PAD1_4
K1

F1

RESERVED
(PLLOUT_TEST)

C26

E
C1 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 A11 A5 AC23

AF6 AF11 AF15

VSS_PAD2_0 VSS_PAD2_1 VSS_PAD2_2

MMP_HPCM_CLK MMP_HPCM_DI MMP_HPCM_DO MMP_HPCM_FSYNC TX_ON ANT_SEL2 ANT_SEL1 ANT_SEL0 CAM_MODE1_N FM_INTX FM_BUSEN GSM_PA_BAND GSM_PA_EN VGA_CAM_RESET_N BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA R213 NA

R26 B17

VSS_PAD3_0 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3
A18 A21 D13 D19 P26 U19 V26 W16 W18 W26 AB26 AC16 AC26 AD25 AF23 AF24

MMP_PWR_EN

AF13 AA14 T13 AC14

F
EBI2_ADDR[14] EBI2_ADDR[13] EBI2_ADDR[12] EBI2_ADDR[11]

AE14 W13 AC13 AA13 AF12 AE12 AC12 AA12 W12 T12 AC11 AA11 AC10 W11 AF9 AE9

UART1_RFR_N_PA_POWER_CTL_M_GPIO98 UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 UART1_DP_TX_DATA_GPIO95 GPIO44 GPIO39 GPIO64

CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 RINGER_GPIO18

MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31

UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 M19 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42

UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88

KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46 KEYSENSE1_N_GPIO63 R21 KEYSENSE0_N_GPIO62

PA_POWER_CTL GSM_PA_DAC_REF

USB_DAT_VP N23 USB_SE0_VM N25 USB_OE_TP_N

I2C_SDA_GPIO26 I2C_SCL_GPIO27

MDDIH_STBN MDDIH_STBP B19 MDDIH_DATN B20 MDDIH_DATP

VDD_EF_USE

A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1

MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN

F6

D23

A25

A26

B25

B26

H19

K10

N12

N13

N14

N15

R12

R13

R14

M11

M12

M13

M14

M15

R15

P13

P12

P14

P15

F21

L11

L16

T11

A1

A2

B1

B2

D4

H8

T16

W8

GPIO45 GPIO53 GPIO52 GPIO51 GPIO50 GPIO49

SBST SBDT SBCK

W19

VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38

VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16

U200-2 MSM6280_B

VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 VSS_DIG

NC VSS39 VSS41 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50

AA21

F
AA6 AC4 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26

w18 (Analog VSS guard ring for CODEC)

G

G
If you are not Qfuse (security), this pin can be grounded as in MSM6275 for VSS_THERMAL

TP200 G6

E4

F7

F4

L12

L23

L14

F16

G21

L26

F14

L21

F20

L15

L19

AD26

A4

A7

B7

D8

J23

B3

J25

U21

R23

D14

D10

N26

H14

H26

K21

D20

J19

D22

C25

D21

K23

J26

K26

H23

A19

M23

M21

A20

P19

P21

P16

E23

P25

M16

N16

MMP_RESET_IN_N KEY_COL[0] KEY_COL[1] WHEEL_SW_L WHEEL_SW_R WM_EN

KEY_ROW[2] KEY_ROW[1] KEY_ROW[0]

TOUCH_PENIRQ_N CAM_MODE2_N

MMP_CAM_DATA[7] MMP_CAM_DATA[6] MMP_CAM_DATA[5] MMP_CAM_DATA[4] MMP_CAM_DATA[3] MMP_CAM_DATA[2] MMP_CAM_DATA[1] MMP_CAM_DATA[0] MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_PCLK MMC_SELECT_N CODEC_I2C_SDA LCD_BL_CTRL CODEC_I2C_SCL EAR_SENSE_N LIN_PWM_FREQ

VGA_CAM_PWR_EN TOUCH_I2C_SCL TOUCH_I2C_SDA PM_INT_N PS_HOLD

MSM_MICROSD_CMD MSM_MICROSD_DATA[0] MSM_MICROSD_CLK

VREG_MSMP_2.7V

H

GSM_PA_RAMP GSM_PA_PWR_CTL_REF

UART_RXD UART_TXD

USIM_CLK USIM_RST_N USIM_DATA

USB_DAT USB_SE0 USB_OE_N

C232 0.1u 10%

R16

F9

Place near MSM pin AD26

SSBDT_RTR

SSBDT_PM

R217 2.2K

R218 2.2K

H

1

2

3

4

I2C_SDA I2C_SCL

5

6

7

8

9

10

11

12

LGE Internal Use Only

- 172 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2

3

4

4

5

6

7

8

9

10

11

12

MMP_VDD_CORE_1.0V

A

A
CAM_VDD_IO_2.7V LCD_VDD_2.8V VREG_MMC_3.0V VREG_USB_3.3V 0 MMP_VDD_USB_3.3V VREG_MSMP_2.7V 0 MMP_VDD_1.9V

VREG_MMC_3.0V

VREG_USB_3.3V CAM_VDD_IO_2.7V

MMP_VDD_CORE_1.0V

C301 0.1u

C302 0.1u

C303 0.1u

C304 0.1u

C305 0.1u

C306 0.1u

C307 10p

C300 10u

R300

R301

LCD INTERFACE
MMP_RESET_IN_N

MMP_VDD_1.9V

FB300

B
C310 0.1u C311 10p C308 10u C312 0.1u C313 0.1u C314 0.1u C315 10p C309 10u

FB301

LCD_VDD_2.8V

VREG_MSMP_2.7V

B
LCD_VDD_2.8V FL300 ICVE10184E150R500FR MMP_LCD_DATA[0] MMP_LCD_DATA[1] MMP_LCD_DATA[2] MMP_LCD_DATA[3]
1 2 3 4

0.1u 1u

0.1u

1u

C316 C317

0

INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4

INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4

9 8 7 6

C318

C319

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] VA300 ICVN0505X150FR CN300 LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 MMP_LCD_VSYNC_IN LCD_MAKER_ID WLED_PWR WLED_1 WLED_2 WLED_3 WLED_4 WLED_5 LCD_IF_MODE R314 R315 R316 R317 51 51 51 51 R318 0 MMP_LCD_ADS MMP_LCD_CS_N LCD_RESET_N MMP_LCD_RD_N MMP_LCD_WE_N MMP_LCD_VSYNC_OUT OTP Program Pin LCD_VSYNC_OUT C320 NA C321 0.1u

R308

G1 5

H11 AVDD_VDACI G11 AVDD_VDACP

D10 D9 G4 H4 K10 M8 D6 G2

D11 TCK D13 TDO E12 TDI E14 TMS D14 TRSTN

G13

E10

D8 VDDCORE1 F4 VDDCORE2 J11 VDDCORE3 L7 VDDCORE4

VDD_PMU VDD_HOST VDD_SERIAL VDD_GENERAL VDD_NAND VDD_CIS VDD_LCD VDD_MMC

K4 AVDD_USBT L4 AVDD_USBC

AVDD_PLL

D7 VDDQ2 L6 VDDQ1

RESETN

TEST

F14

FL301 ICVE10184E150R500FR MMP_LCD_DATA[4] MMP_LCD_DATA[5] MMP_LCD_DATA[6] MMP_LCD_DATA[7]
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 9 8 7 6

R309 MMP_LCD_BYPASS_CS_N VREG_MSMP_2.7V NA

5

R310 10K

MMP_CS_N NAND_ALE EBI2_OE_N EBI2_WE_N

R311 R313

0 NA

MMP_INT_N EBI2_ADDR[11] EBI2_ADDR[12] EBI2_ADDR[13] EBI2_ADDR[14] EBI2_DATA[0] EBI2_DATA[1] EBI2_DATA[2] EBI2_DATA[3] EBI2_DATA[4] EBI2_DATA[5] EBI2_DATA[6] EBI2_DATA[7] EBI2_DATA[8] EBI2_DATA[9] EBI2_DATA[10] EBI2_DATA[11] EBI2_DATA[12] EBI2_DATA[13] EBI2_DATA[14] EBI2_DATA[15]

B8 A8 B7 B9 A7 A10 A9 C8 C7 D12 C10 C12 C13 C14 B14 C11 B13 A14 A13 B12 A12 B11 A11 C9 B10 L13 M13 L12 L11 K13 M14

HCS0N HCS1N HRDN HWRN HGINTN HA11 HA12 HA13 HA14 HD0 HD1 HD2 HD3 HD4 HD5 HD6 HD7 HD8 HD9 HD10 HD11 HD12 HD13 HD14 HD15 NCSN NALE NCLE NREN NWEN NRBN ND0 ND1 ND2 ND3 ND4 ND5 ND6 ND7 ND15 SPICLK SPICS SPIDO SPIDI UARTTX UARTRX UARTRTS UARTCTS SCL SDA GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 TVDATA TVREF

R312

33

FL302 ICVE10184E150R500FR MMP_CAM_MCLK MMP_CAM_PCLK MMP_CAM_HSYNC MMP_CAM_VSYNC MMP_LCD_DATA[8] MMP_LCD_DATA[9] MMP_LCD_DATA[10] MMP_LCD_DATA[11]
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 9 8 7 6

P12 VMCLK P10 VPCLK M12 VHREF K12 VVS VIDA VIDB VIDC VIDD VIDE VIDF VIDG VIDH VIDI VIDJ VIDK VIDL VIDM VIDN VIDO VIDP LD0 LD1 LD2 LD3 LD4 LD5 LD6 LD7 LD8 LD9 LD10 LD11 LD12 LD13 LD14 LD15 LD16 LD17 LCS0N LCS1N LRDN LWRN LA0 LCK LHS LVS LACT P8 N8 P9 M10 N10 N9 N11 P11 N12 N7 L8 P13 L9 N13 M11 M9 B5 A5 B6 B4 A4 C3 A3 A2 A1 B2 B1 B3 C1 C2 C5 C6 D3 D1 A6 D2 D5 C4 D4 E1 E4 E3 E2 R324 R325 R326 R327 R329 33

10

C

SDAT0 SDAT1 SDAT2 SDAT3 SCMD SCLK SWP

F1 F2 E5 F3 H2 G1 G3

MMP_MICROSD_DATA[0] MMP_MICROSD_DATA[1] MMP_MICROSD_DATA[2] MMP_MICROSD_DATA[3] MMP_MICROSD_CMD MMP_MICROSD_CLK

10

G2

LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11]

22p

22p

22p

22p

FL303 ICVE10184E150R500FR MMP_LCD_DATA[12] MMP_LCD_DATA[13] MMP_LCD_DATA[14] MMP_LCD_DATA[15]
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 9 8 7 6

LCD_DATA[0] LCD_DATA[1] LCD_DATA[2] LCD_DATA[3] LCD_DATA[4] LCD_DATA[5] LCD_DATA[6] LCD_DATA[7] LCD_DATA[8] LCD_DATA[9] LCD_DATA[10] LCD_DATA[11] LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

G1

G2

C

G1 5

10

G2

VA301 C326 22p

10

5

D

MMP_CAM_DATA[0] MMP_CAM_DATA[1] MMP_CAM_DATA[2] MMP_CAM_DATA[3] MMP_CAM_DATA[4] MMP_CAM_DATA[5] MMP_CAM_DATA[6] MMP_CAM_DATA[7] MMP_LCD_DATA[0] MMP_LCD_DATA[1] MMP_LCD_DATA[2] MMP_LCD_DATA[3] MMP_LCD_DATA[4] MMP_LCD_DATA[5] MMP_LCD_DATA[6] MMP_LCD_DATA[7] MMP_LCD_DATA[8] MMP_LCD_DATA[9] MMP_LCD_DATA[10] MMP_LCD_DATA[11] MMP_LCD_DATA[12] MMP_LCD_DATA[13] MMP_LCD_DATA[14] MMP_LCD_DATA[15]

LCD_DATA[12] LCD_DATA[13] LCD_DATA[14] LCD_DATA[15]

C322

C323

G1

G2

ENBY0036001 1.0T, Socket GB042-40S-H10-E3000

C324

C325

D

LCD connector change : 35pin ZIF -> 40pin BTB

EBI2_DATA[0:15]

U302 ZR3453

CAM_VDD_IO_2.7V

CAM_VDD_IO_2.7V

CAM_VDD_IO_2.7V

E

L14 L10 J12 H12 K14 G12 J13 H13 K11 N2 K3 L2 J3 M4 N3 M1 L1

E

100K

MMP_LCD_CS_N MMP_LCD_RD_N MMP_LCD_WE_N MMP_LCD_ADS
TP300 TP301

R319 10K

R321 1K

MMP_STROBE_READY

R320

R322 1K

LCD LDO

LCD BACKLIGHT CHARGE PUMP

MMP_LCD_VSYNC_IN MMP_LCD_VSYNC_OUT 0 0 0 NA MMP_A_MCLK MMP_A_BCLK MMP_A_LRCLK MMP_ADO_DACDAT MMP_ADI_ADCDAT MMP_USB_D+ MMP_USB_DVREG_5V MMP_HPCM_CLK MMP_HPCM_FSYNC MMP_HPCM_DO MMP_HPCM_DI BH28PB1WHFV 1 5 STBY SEL 2 6 GND BGND 3 4 VIN VOUT C329 1u U300

LCD_VDD_2.8V 150mA +VPWR LCD_LDO_EN +VPWR C327 1u U301 4 5 C1+ C1AAT3169IFO-T1 C328 7 C2+ 1u 8 C26 OUTCP 11 12 13 14 1 2 C333 1u

MMP_I2C_SCL MMP_I2C_SDA

N14 P14 P2 M3 P7 N1 P1 M5 N6 M6 P5 N5 G14 F13

H3 HPCMCLK H1 HPCMFS J2 HPCMDO J1 HPCMDI N4 AMCLK M2 ABCLK K2 AFS K1 ADO L3 ADI P3 UDP P4 UDN J4 R335 UVBUS P6 UID M7 URSET

F
MMP_CAM_PWR_EN

MMP_CAM_RESET_N MMP_STROBE_CHARGE MMP_CAM_INT

F
WLED_PWR

R331

100K

TP302

MICROSD_DETECT

R333

NA
TP303

C330 1u LCD_BL_CTRL

9

IN D1 D2 D3 D4 D5 D6

3

EN_SET

C331 22p

0

10 GND 15 PGND

WLED_1 WLED_2 WLED_3 WLED_4 WLED_5

AGND_VDAC

E13 VENBYPIN E11 VENBYPOUT

K5 AGND_USBT L5 AGND_USBC

XTALOUT

AVSS_PLL

R336

100K

C332 1u

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 GND12 GND13 GND14 GND15 GND16

390

75

L300 TV_OUT 2.2uH C334 330p C335 330p

XTALIN

R338

R339

+VPWR

MMP_VDD_1.9V

R340

392ohm 1%

F11

F6 F7 F8 F9 G6 G7 G8 G9 H6 H7 H8 H9 J6 J7 J8 J9

H14

F12

J14

3.3K

3.4K 1%

+VPWR

1

U303 R1114D191D-TR-F 3 VDD VOUT 2 GND1 5 GND2

G
MMP_XTAL_IN MMP_XTAL_OUT
MMP_PWR_EN

4 NC 6 CE

G

C336 0.01u

C337 1u

C338 1u

27Mhz XTAL
MMP_XTAL_IN MMP_XTAL_OUT FA-238_27MHz_9PF X300
4 1 3 2

USB_SELECT_N

FSUSB30UMX U304 1 10 SEL HSD1+

MSM_USB_D+ MMP_USB_D+ USB_D+

R345

9 8

VCC HSD2+ _OE D+

2 3 4 5

100K

MSM_USB_DMMP_USB_D-

7 6

HSD1- GND HSD2D-

27MHz

H

C339 8p

C340 8p

USB_D-

H

SWITCH FOR USB2.0
1 2 3 4 4 5 6 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 173 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

A

A

B

B

MEMORY (2Gbit 70n NAND FLASH + 1Gbit SDRAM)
VREG_USIM_3.0V

J400 USIM_P_RST_N USIM_P_CLK SDRAM_ADDR[0:12] A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 C3 D3 E3 E2 D12 C12 D11 C11 D10 C10 E4 D9 C9 L6 K6 D5 D6 E6 C8 E5 D7 M3 M4 M9 M10 M2 D8 C4 D4 C7 D2 D13 V3 V8 V12 SDRAM_ADDR[0] SDRAM_ADDR[1] SDRAM_ADDR[2] SDRAM_ADDR[3] SDRAM_ADDR[4] SDRAM_ADDR[5] SDRAM_ADDR[6] SDRAM_ADDR[7] SDRAM_ADDR[8] SDRAM_ADDR[9] SDRAM_ADDR[10] SDRAM_ADDR[11] SDRAM_ADDR[12] RESOUT_N EBI2_WE_N SDRAM_RAS_N SDRAM_WE_N SDRAM_CAS_N SDRAM_CLK SDRAM_CS_N NAND_ALE NAND_CLE EBI2_OE_N NAND_READY SDRAM_CLK_EN SDRAM_ADDR[13] SDRAM_ADDR[14] VREG_MSME_1.8V R401 100K R400 15K 1 2 3 7 8 4 C1 C5 5 C2 C6 6 C3 C7 10 GND1 GND4 9 GND2 GND3

C

D

SDRAM_DATA[0] SDRAM_DATA[1] SDRAM_DATA[2] SDRAM_DATA[3] SDRAM_DATA[4] SDRAM_DATA[5] SDRAM_DATA[6] SDRAM_DATA[7] SDRAM_DATA[8] SDRAM_DATA[9] SDRAM_DATA[10] SDRAM_DATA[11] SDRAM_DATA[12] SDRAM_DATA[13] SDRAM_DATA[14] SDRAM_DATA[15] SDRAM_DATA[16] SDRAM_DATA[17] SDRAM_DATA[18] SDRAM_DATA[19] SDRAM_DATA[20] SDRAM_DATA[21] SDRAM_DATA[22] SDRAM_DATA[23] SDRAM_DATA[24] SDRAM_DATA[25] SDRAM_DATA[26] SDRAM_DATA[27] SDRAM_DATA[28] SDRAM_DATA[29] SDRAM_DATA[30] SDRAM_DATA[31] SDRAM_DQM[0] SDRAM_DQM[1] SDRAM_DQM[2] SDRAM_DQM[3] EBI2_DATA[0:15] EBI2_DATA[0] EBI2_DATA[1] EBI2_DATA[2] EBI2_DATA[3] EBI2_DATA[4] EBI2_DATA[5] EBI2_DATA[6] EBI2_DATA[7] EBI2_DATA[8] EBI2_DATA[9] EBI2_DATA[10] EBI2_DATA[11] EBI2_DATA[12] EBI2_DATA[13] EBI2_DATA[14] EBI2_DATA[15]

U4 T4 T5 V5 U5 T6 V6 U7 T9 T10 V10 T11 U11 V11 T12 U12 P3 R3 P4 R4 P5 R5 P6 R6 P9 P10 R10 P11 R11 P12 R12 R13

DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31

NC83 NC84 NC85 NC86 NC87 NC88 NC89 NC90 NC91 NC92 NC93 NC94 NC95 NC96 NC97 NC98 NC99 NC100 NC101 NC102 NC103 NC104 NC105 NC106 NC107 NC108 NC109 NC110 NC111 NC112 NC113 NC114 NC115 NC116 NC117 NC118 NC119 NC120 NC121 NC122 NC123

SDRAM_DATA[0:31]

N3 N4 N5 N6 N9 N10 N11 N12 N13 P7 P8 R2 R7 R9 T2 T3 T7 T13 U1 U3 U14 V1 V2 V13 V14 W1 W2 W3 W4 W11 W12 W13 W14 Y1 Y2 Y3 Y4 Y11 Y12 Y13 Y14

USIM_P_DATA

VREG_USIM_3.0V D400 C400 33p C401 33p C402 1u USIM_P_DATA
6 5 4 1 2 3

C

USIM_P_CLK

VREG_MSMP_2.7V PLR0504F

USIM_P_RST_N

_WP _WEN _RAS _WED _CAS CLK _CS1 _CS2 ALE CLE _CE _RE RY__BY CKE BA0 BA1 VCCD1 VCCD2 VCCD3 VCCD4 VCCD5 VCCD6

USIM
R402 100K R403 10K NAND_CS_N

R404 0

D

TYA000BC00HOGG

C403 C404 C405 C406 C407 C408 C409

U8 DQM0 T8 DQM1 V7 DQM2 U9 DQM3 M11 M13 L10 L12 J9 H12 H10 G12 M12 L9 L11 K9 H13 H11 H9 G11 A1 A2 A3 A4 A11 A12 A13 A14 B1 B2 B3 B4 B11 B12 B13 B14 C1 C2 C5 C13 C14 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 IO12 IO13 IO14 IO15 IO16 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21

U402

0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u

VREG_MSMP_2.7V +VPWR

+VPWR

V4 VCCQD1 V9 VCCQD2 VCCN2 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 NC63 NC64 NC65 NC66 NC67 NC68 NC69 NC70 NC71 NC72 NC73 NC74 NC75 NC76 NC77 NC78 NC79 NC80 NC81 NC82 K12 C6 F7 G2 G13 L13 P2 P13 R8 U2 U6 U10 U13 J12 J13 K1 K2 K3 K4 K5 K10 K11 K13 K14 L1 L2 L3 L4 L5 L14 M5 M6 N2 C410 0.01u C411 0.1u C412 0.01u U400 SLAS4717EPMTR2G
1 VCC 2 NO1 3 COM1 4 IN1 5 NC1 GND NC2 6 IN2 7 COM2 8 NO2 9 10

E

MMP_MICROSD_DATA[0] MMC_SELECT_N MSM_MICROSD_DATA[1] MSM_MICROSD_CLK MICROSD_DATA[1] MICROSD_CLK MMP_MICROSD_DATA[1] MMC_SELECT_N MMP_MICROSD_CLK MSM_MICROSD_DATA[2] MICROSD_DATA[2]

1 2 3 4 5 6 7 8 17

U401 MAX4701ETE+T 16 NC1 COM1 IN1_IN2 NO2 COM2 NC2 GND NO3 COM3 PGND C413 0.01u NO1 V+ NC4 COM4 NO4 IN3_IN4 NC3 15 14 13 12 11 10 9

E
MICROSD_DATA[0] MSM_MICROSD_DATA[0]

MMP_MICROSD_DATA[3] MICROSD_DATA[3] MSM_MICROSD_DATA[3]

MSM_MICROSD_CMD MICROSD_CMD

MMP_MICROSD_CMD

MMP_MICROSD_DATA[2]

F

F

NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC30 NC31 NC32 NC33 NC34 NC35 NC36 NC37 NC38 NC39 NC40 NC41 NC42 NC43 NC44 NC45 NC46 NC47 NC48 NC49 NC50 NC51 NC52 NC53 NC54 NC55 NC56 NC57 NC58 NC59 NC60 NC61 NC62

MICRO SD SELECT MSM AND MMP
G

G

H

D1 D14 E1 E7 E8 E9 E10 E11 E12 E13 F2 F3 F4 F5 F6 F8 F9 F10 F11 F12 F13 G3 G4 G5 G6 G7 G8 G9 G10 H2 H3 H4 H5 H6 J2 J3 J4 J5 J6 J10 J11

H

1

2

3

4

5

6

6

7

8

9

10

11

12

LGE Internal Use Only

- 174 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2

3
VREG_TCXO_2.85V VREG_SYNTH_2.6V

4

5

6

7

8

9

10

11

12

VREG_WM_2.7V

PMIC VPWR BYPASS

VGA_VDD_1.8V

VREG_BT_2.85V

+VPWR

U500 +VPWR VBATT +5V_PWR USB_VBUS 10 1 2 3

NUS3116MTR2G 9 8 7 6 5 CHG_CNT_N USB_CNT_N BATT_FET_N VBATT VREG_5V R533 C514 C513 0.1u 10u C516 C517 4.7u 0.1u VREG_WM_2.7V 0

C504

C501

C502

C503

C505

C506

C507

C508

P_DRAIN P_COLLECTOR EMITTER1 EMITTER2 COLLECTOR SOURCE BASE1 BASE2 GATE DRAIN

4.7u

0.1u

0.1u

0.1u

0.1u

4.7u

0.1u

4.7u

A

C509 4.7u

C500 33u

+VPWR

A

2.2u 1608

ICHARGE

1u

C510

C512 1u

VDD_MSMC : 4.7uF VDD_MSME : 4.7uF VDD_PA : 4.7uF VSW_5V : 4.7uF

GSM_PA_PWR_CTL_REF AMUX_OUT

C590

C515

VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF

C511

ICHARGEOUT +VPWR

R504 2012

1608

4

0.1

CHARGING
Rev. 1.1
MIDI_3.3V C518 C519 4.7u 0.1u

2.2u

2.2u

RMT_PWR_ON_N

VREG_MSME_1.8V C520 C521 4.7u 0.1u

+5V_PWR

VREG_USB_3.3V
79 78 77 76 75 74 73 69 68 67 72 71 70 66 65 85 84 83 82 81 80 CBL0PWR_N(MPP3) CBL1PWR_N(MPP4) AMUX_IN2(MPP2) AMUX_IN1(MPP1) REF_OUT(MPP8) SPKR_OUT_M SPKR_OUT_P VREG_RFRX1 VREG_RFRX2 VREG_WLAN VREG_RFTX VDD_WLAN GND_SLUG 64

B

R505 470K JTAG_PS_HOLD D500
REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD VREG_MSMA TCXO_EN VDD_ANA TCXO_OUT VDD_MSM SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43

VREG_TCXO

VDD_MAIN

VREG_SYNT

SPKR_IN_M

VDD_SPKR

SPKR_IN_P

AMUX_OUT

SPKR_BYP

VDD_RF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

ADC_BYP VCHG ISNS_P CHG_CTL_N ISNS_M VBAT BAT_FET_N FLSH_DRV_N PON_RESET_N VREG_USB USB_ID VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P

C522 R506
TP500

0.1u 121K (1%) PM_INT_N TCXO_PM R508 TCXO_EN 0 C523 1u V_BACK_UP RB521S-30 VREG_MSMA_2.6V

PS_HOLD

10K

1u

VBATT

ICHARGE CHG_CNT_N ICHARGEOUT BATT_FET_N FLSH_DRV_N RESET_IN_N

0.1u

U502 13 DCVDD 14 DBVDD 26 AVDD2 31 AVDD1 MMP_A_LRCLK MMP_A_BCLK MMP_ADI_ADCDAT MMP_ADO_DACDAT MMP_A_MCLK 7 LRC 8 BCLK 9 ADCDAT 10 DACDAT 11 MCLK

WM8983 DGND AGND1 AGND2 12 28 24 C524 0.1u 27 32 29 30 FB500 SPK_OUT+ SPK_OUTFB501 OUT3 OUT4 MODE 22 21 18 MIC2P C543 C544 NA NA HP_EAR_R HP_EAR_L C525 10u C531 NA MIC_PWR

C526

C527

VREG_5V

R507

RB521S-30

C529 C528 4.7u

1u

+VPWR L500 4.7uH

U501 PM6650-2M PMIC
RUIM_M_CLK(MPP9) RUIM_M_RST(MPP5) RUIM_M_IO(MPP11) RUIM_CLK(MPP10) RUIM_IO(MPP12)

VREG_MSMP_2.7V C532 R512 R513 51K 0 SPK_R 1K C535 FM_AUDIO_R C536 1608 4.7u C541 SPK_L 1K 1u R516 FM_AUDIO_L 1u R510

C530 12n C533 4.7n 1u 1u R511 18K

VMID MICBIAS ROUT1 LOUT1

D501

BUFF_TCXO

C534 1u

R509

51

USB_OE_N USB_CNT_N USB_VBUS

4 RIP 5 RIN 6 R2_GPIO3 L2_GPIO2

smd_2520h1_6_r

C

4.7u

47K

1 2 32.768KHz

C540

R514

USB_DAT MSM_USB_D+ USB_SE0 MSM_USB_D+VPWR

SSBDT_PM

C539 1u

C537 R515 4.7u 51K 1608

C538

3

ROUT2 LOUT2

23 25

X500

USB_SE0 USB_D_M GP1_DRV_N(MPP7)

SLEEP_CLK XTAL_IN RUIM_RST(MPP6)

SLEEP_CLK USIM_P_RST_N C545 22p +VPWR

C542 4.7n C547 12n

R517 18K

MID_MICP

1 LIP 2 LIN 19 20 AUXL AUXR

VREG_MSMC

VREG_MSME

KPD_DRV_N

LCD_DRV_N

VREG_RUIM

VSW_MSMC

VSW_MSME

VREG_MMC

VDD_MSMC

KPDPWR_N

VDD_MSME

VIB_DRV_N

VDD_RUIM

VREG_PA

VSW_PA

VDD_PA

C546 22p Rev. 1.0

R519

10K USIM_RST_N USIM_P_CLK USIM_CLK USIM_DATA VBATT

VREG_USIM_3.0V

VREG_MMC_3.0V

C548 HP_L C549 HP_R

1u 1u

CODEC_I2C_SCL CODEC_I2C_SDA

PGND

33

KYPD_LED_EN PM_ON_SW_N USIM_P_DATA

D
L501 4.7uH
ind_2x1_6h1_r

C550 NA

C551 NA

VREG_MSME_1.8V L502 4.7uH R520 0

C552 1608 2.2u

C553 1608 2.2u

VREG_RF_SMPS C554 22u VREG_MSMC_1.2V 0.1u L503 4.7uH 4.7u C555 10u C556 0.1u C557 1000p C559 C558

1608

E
C561 0.1u C560 4.7u 1608 MIDI_3.3V HP_AMP_EN

AUDIO DAC/ADC, AMP etc. (WM8983)
C562 0.22u

100K

R518

15 CSB_GPIO1 16 SCLK 17 SDIN

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

E

MMP_VDD_USB_3.3V

HP_EAR_L

R522 R521

Power Line --> Route carefully!!!!! VREG_5V Draw the Artwork_line thickly !!!!! --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

15K

NA

MICBIAS MIDI_3.3V C565 4.7u WM_EN C566 1u 1 2 4 C570 1u 3 4 C564 47p FB502 OUTL SVSS OUTR 12 11 FB503 10
PQ

17

16

15

_SHDN

1 2 3

VDD GND1 VOUT

CE_OR_NC GND2 NC

6 5

SVDD1

INL+

P_G

INL_

U503

14

13

600

R524 MIDI_EAR_L 68

PVDD C1P PGND

SPM0204HE5-PB-3 P 4 G2 3 G1 2 O 1 MIC500

C563 10u C567 C568 22n 22n C569 NA MIC1P MIC1N

U504 MAX9722BETE

600

R525 MIDI_EAR_R 68

F
L504 2.2uH VREG_MSMP_2.7V

SGND

PVSS

C571 1u

C572 1u

R1180D331B

F

C1N

SVDD2

9

INR+

INR_

PRSB6.8C C574

PRSB6.8C

C573

100K

MIC
PQ

7

5

CN500 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22 FB504

6

R529

8

C575 33p

C576 10p

R528

15K

C577 1u

FM_ANT EAR_MIC_P
TV_OUT

C578 0.22u

HP_EAR_R

MIC_PWR
C579 10u C580 47p

MIDI_EAR_L MIDI_EAR_R
RMT_INT-USB_D+ RMT_ADC-USB_D5 6 7 8 SRC GATE OUT VCC DRAIN_THERMAL NUS3065MUTAG U505 FSUSB30UMX U507 10 1 SEL HSD1+ 9 8 RMT_ADC USB_D7 6 VCC HSD2+ _OE D+ 2 3 4 5 RMT_ADC-USB_DDRAIN CNTRL GND IN 4 3 2 1 C581 0.01u U506 NC7SB3157L6X 1 6 B1 S 2 5 GND VCC 3 4 A B0

R530

G

EAR_SENSE_N VBATT RMT_PWR_ON_N

2.2K

HEADPHONE AMP

+VPWR

VREG_MSMP_2.7V

G

CAM_MIC+ EAR_MIC_P

EAR_SENSE_N MID_MICP

USB_VBUS
UART_TXD UART_RXD

9

C583

10p

ULCE0505C015FR

ULCE0505C015FR

OVP

+5V_PWR

EAR_SENSE_N

RMT_INT USB_D+ RMT_INT-USB_D+

C584 0.1u

EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

D502

HSD1- GND HSD2D-

47p

33p

VA507

VA508

47p

1u

VA500

VA501

VA502

VA503

C585

SD12T1G

C586

C587

VA505

PRSB6.8C

PRSB6.8C

VA504

VA506

C589

C588 10p

CAM/HP MIC SEL
H

H

USB/REMOCON_SEL MMI 18Pin CONNECTOR
1 2 3 4 7 8 9 10 11 12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 175 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

VGA CAM LDO
A
VGA_CAM_PWR_EN +VPWR

VGA_VDD_2.7V

5M CAMERA INTERFACE
CAM_VDD_AF_2.7V CAM_VDD_SA_2.7V CAM_VDD_CORE_1.2V C601 0.1u C602 1u C600 10u CAM_VDD_SD_1.8V CAM_VDD_IO_2.7V

U600 BH28PB1WHFV 1 5 STBY SEL 2 6 GND BGND 3 4 VIN VOUT

C603 1u

0.1u

1u

10

C604 1u

C605 0.1u
5

MMP_CAM_DATA[7] MMP_CAM_DATA[6] MMP_CAM_DATA[5] MMP_CAM_DATA[4]

6 7 8 9

INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1

4 3 2 1

5M_CAM_DATA[7] 5M_CAM_DATA[6] 5M_CAM_DATA[5] 5M_CAM_DATA[4]

CN600 R601 10 MMP_I2C_SCL R602 10 MMP_I2C_SDA MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_RESET_N STROBE_TRIGGER 5M_CAM_DATA[6] 5M_CAM_DATA[4] 5M_CAM_DATA[2] 5M_CAM_DATA[0] R607 5M_CAM_MCLK 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

B
CAM_VDD_IO_2.7V 150mA +VPWR

5MP CAM LDO

ICVE10184E070R100FR CAM_VDD_SA_2.7V 150mA +VPWR

FL600

R603 R604

10 10

C609

C608

GB042-30S-H10-E3000

C606 0.1u

G2

G1

C607 0.1u

MMP_CAM_INT 5M_CAM_DATA[7] 5M_CAM_DATA[5] 5M_CAM_DATA[3] 5M_CAM_DATA[1] R608 10 MMP_CAM_PCLK

1 2 3 C615 1u C616 1u

GND1 VOUT

GND2 NC

5 4 C617 1u C618 1u

2 3

GND1 VOUT

GND2 NC

5 4

ICVL0518100Y500FR

8 9

INOUT_B1 INOUT_A1

2 1

ICVE10184E070R100FR FL601

EVLC18S02015

7

INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2

3

C610 C611 C612 C613 10p 10p 10p 10p

C614 0.1u

ICVL0518100Y500FR

MMP_CAM_DATA[3] MMP_CAM_DATA[2] MMP_CAM_DATA[1] MMP_CAM_DATA[0]

6

INOUT_B4 INOUT_A4

4

5M_CAM_DATA[3] 5M_CAM_DATA[2] 5M_CAM_DATA[1] 5M_CAM_DATA[0]

VA602

G2

G1

VDD

CE_OR_NC

6

MMP_CAM_PWR_EN

1

VDD

CE_OR_NC

6

MMP_CAM_PWR_EN

VA600

VA601

10

U601

R1114D271D

U602

R1114D271D

33
5

C

C

VREG_MMC_3.0V

D
VREG_MMC_3.0V C620 R610 LIN_MOTOR_EN 1 2 3 1 2 3 U605 TC7SZ86FU 5 VCC IN_B IN_A 4 OUT_Y GND U603 IN_B IN_A GND TC7SZ86FU 5 VCC OUT_Y 4 R611 100K U606 1 2 R615 100K 3 4 _SHUTDOWN BYPASS IN+ INTPA6205A1DRBR 6 VDD 2200p 100K

C619

MODE SWITCH

SWITCH FOR 5M VT CALL

Strobe(Xenon Lamp) Flash Interface
D
VREG_MSMP_2.7V +VPWR VREG_5V

1u

VREG_MSMP_2.7V
51K 51K 51K
U604 NC7SB3157L6X 1 6 B1 S 2 5 GND VCC 3 4 A B0

LIN_PWM_MAG

5M_CAM_MCLK

R612

R613

R614

LIN_INVERTER LIN_PWM_FREQ

VOVO+

8 5

VGA_CAM_MCLK

CAM_SELECT_N +VPWR CAM_MCLK

AXK714247G
1 2 CN601 14 13 12 11 10 9 FLSH_DRV_N 7 8

MOTORMOTOR+

CAM_MODE3_N

7 GND 9 PGND

CAM_MODE2_N CAM_MODE1_N
VA603 VA604 VA605

5M_CAM_MCLK

U607 NC7SB3157L6X 1 6 B1 S 5 2 GND VCC 4 3 A B0

3 +VPWR MMP_CAM_MCLK 4 STROBE_TRIGGER 5 MMP_STROBE_READY

R619

100K 2200p

E

EVLC14S02050

EVLC14S02050

EVLC14S02050

C623 0.1u

C621 0.1u SW600
G2 G1 G4 G3
P1 P2 P3 P4

C622 0.1u

6 MMP_STROBE_CHARGE

C624

E

SSP-132MHT MODE1 MODE2 MODE3

LINEAR MOTOR DRIVER ( AUDIO AMP )

ESSY0004701

VREG_MSMP_2.7V

VREG_MMC_3.0V

VREG_BT_2.85V

F

F
VBATT

+VPWR

470K CN603 G1 CN602 12 11 10 9 8 7 6 5 4 3 2 1
CTS RTS DSR

INSTPAR

R621

PSD05-LF

C625 10u

VREG_MSMP_2.7V

EAR_MIC_P BT_SBST BT_TX_RX_N TCXO_BT BT_CLK

G

MSM_USB_D+ MSM_USB_DUSB_VBUS VBATT PM_ON_SW_N +5V_PWR UART_TXD UART_RXD

UTXD NC3 URXD NC2 PWR VBAT VBAT ON_SW ON_SW NC1 VCHAR TX TX RX RX GND GND
NC4

BT_SBCK BT_SBDT BT_DATA V_BACK_UP HOOK_SENSE_N CAM_VDD_AF_2.7V CAM_VDD_SD_1.8V SPK_OUTSPK_OUT+

2.5G

3G

PCB ARRAY TP JTAG CONNECTOR
H
OJ600 OJ601 OJ602 OJ603 OJ604 UART_TXD UART_RXD PM_ON_SW_N VBATT
TP600 TP601 TP602 TP603 TP604

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G2

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

D600

VBAT_SENSE C626 0.1u MICROSD_CLK MICROSD_DETECT MICROSD_CMD MICROSD_DATA[0] MICROSD_DATA[1] MICROSD_DATA[2] MICROSD_DATA[3] R623 680K

R622 80.6K VBAT_TEMP C627 0.1u OUT608 OUT611 OUT614

G

CAM_MIC+ WHEEL_SW_R WHEEL_SW_L MMP_CAM_PWR_EN

(BATTERY PAD 1.5 X 3.4)

AXK740327G

H

R626 0

1608

MAIN - SUB B to B Conn.

FOR NEST JIG
1 2 3 4 5 6 7 8 9 10 11 12

LGE Internal Use Only

- 176 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

LCD_VDD_2.8V

A
R700 0

VREG_MSMP_2.7V
+VPWR VREG_MSMP_2.7V

R701

C700 1u

C701 0.1u

R702

51K

R703

R704

2.7K

2.7K

700
R705 R706 51K 51K
SEND

701
SSC-TWH104-HL
CLR

NA

SSC-TWH104-HL

LD704

LD705

LD700

LD702

LD701

EVL14K02200

TOUCH_PENIRQ_N

VA700

EVLC14S02050

EVLC14S02050

EVLC14S02050

A1 A2 A3 B1 B2 B3

R711

AUX VDD_REF X+ PENIRQA0 Y+

SDA A1 XSCL GND Y-

C1 C2 C3 D1 D2 D3

TOUCH_I2C_SDA

TOUCH_I2C_SCL

CN700 1 2 3 4 5

KEY_COL[1]

R716

R715

R712

200

EVLC14S02050

EVLC14S02050

EVLC14S02050

B

EVLC14S02050

R713

VA704

VA705

VA706

VA707

X+ Y+ XY-

Rev. 1.1

KYPD_LED_EN VA708 EVL14K02200

VA701

ON_SW KEY

EVLC14S02050

EVLC14S02050

EVLC14S02050

EVLC14S02050

VA702

VA703

(GREEN) (WHITE)
SIDE KEY

(RED)

R714

200

47

47

47

47

R707 R708 R709 R710

470 470 470 470

KEY_ROW[0] KEY_ROW[1] KEY_COL[0] KEY_COL[1]

PM_ON_SW_N

END

KEY_COL[0]

LD703

KEY_ROW[2]

SSC-FR104-II1

SSC-FR104-II1

LEGG-S14G

LEGG-S14G

U700

TSC2007IYZGR

END

PQ

KEY KEY PCB BACKLIGHT LEDs
C

VA709

VA710

VA711

C

VA712

TOUCH SCREEN DRIVER IC Touch Driver IC change : TSC2003 -> TSC2007

VGA_VDD_2.7V

D

VGA_VDD_1.8V

D

CN701 VGA_CAM_PWDN VGA_CAM_MCLK MMP_CAM_PCLK VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] VGA_CAM_DATA[4] VGA_CAM_DATA[5] MOTOR+ MOTORRCV+ RCVR717 10 R718 10 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

R719 10 R720 10 R724 R725 10 10

VGA_CAM_RESET_N I2C_SCL I2C_SDA MMP_CAM_HSYNC MMP_CAM_VSYNC VGA_CAM_DATA[7] VGA_CAM_DATA[6] x+ Y+ xY-

+VPWR

MMP_VDD_CORE_1.0V

CAM_VDD_CORE_1.2V

L700 U701 12 C703 4.7u MMP_PWR_EN MMP_CAM_PWR_EN 9 VIN1 VIN2 AAT2510IWP-AA-T1 11 LX1 FB1 2 C702 R726 L701 C704

4.7uH 100p 39K 4.7uH 100p

E

E

1 4

EN1 EN2

LX2 FB2

8 5

VA714

VA713

VA715

R729

GND1 GND2 PGND1 PGND2 BGND

4.7u

2.2u

4.7u

56K

ICVL0518100Y500FR

EVLC18S02015

3 6 7 10 13

R730

R731

C705

C707

F

resistor

C706

C708

NA

EVLC18S02015

C710 0.1u

C711 0.1u

C712 C713 C709 10p 10p 0.1u

C714 C715 10p 10p

56K

R728

56K

2.2u

F

ICVE10184E070R100FR MMP_CAM_DATA[0] MMP_CAM_DATA[1] MMP_CAM_DATA[2] MMP_CAM_DATA[3]
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 9 8 7 6

ICVE10184E070R100FR VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] MMP_CAM_DATA[4] MMP_CAM_DATA[5] MMP_CAM_DATA[6] MMP_CAM_DATA[7]
1 2 3 4 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 9 8 7 6

VGA_CAM_DATA[4] VGA_CAM_DATA[5] VGA_CAM_DATA[6] VGA_CAM_DATA[7]

G1 5

G1

5

G2

10

10

G2

FL700

FL701

G

G

H

H

1

2

3

4

5

5

6

7

8

9

10

11

12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 177 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

A

A

VREG_MSMP_2.7V

VREG_MMC_3.0V

C800

NA

BT_ANT

BT_GND

L800

NA

R800

0

B
100K 100K 100K 100K 100K

B

BLUETOOTH
LBRQ-2B43A S800 SCHA1B0102
DAT2_RSV CD_DAT3_CS CMD_DI VDD CLK_SCLK VSS DAT0_DO DAT1_RSV DETECT COMMON

R804

100K

R805

R801

R802

R803

R806

BT_CLK

C801

1000p

9 3 2 10

ANT

16

M800 4 SBST 11 SBCK 12 SBDT 5 13 7

LG INNOTEK
TP800 TP801 TP802

CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT

MICROSD_DATA[2] MICROSD_DATA[3] MICROSD_CMD MICROSD_CLK MICROSD_DATA[0] MICROSD_DATA[1] MICROSD_DETECT

BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N

SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN

R807 C802

0 1000p

BT_DATA TCXO_BT

C803 1u

C804 1u

14

PGND4 20 PGND3 19 PGND2 18 PGND1 17

R808

R809

10K

DUMMY2

10K

DUMMY1

GND4 15 GND3 8 GND2 6 GND1 1

C807

C805

C806

C808

R810

R811

C809

C810

C
33p 33p 33p 33p 33p 33p 33p 1u

C

VREG_MSMP_2.7V VREG_BT_2.85V

C811 100p

C812 0.1u

C813 C814 100p 2.2u

Micro SD
D D

VREG_MSMP_2.7V

VREG_MMC_3.0V

VREG_BT_2.85V

+VPWR

VREG_MSMP_2.7V CN801 G1

E

EAR_MIC_P BT_SBST BT_TX_RX_N TCXO_BT BT_CLK

BT_SBCK BT_SBDT BT_DATA V_BACK_UP HOOK_SENSE_N CAM_VDD_AF_2.7V CAM_VDD_SD_1.8V SPK_OUTSPK_OUT+

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 G2

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

MICROSD_CLK MICROSD_DETECT MICROSD_CMD MICROSD_DATA[0] MICROSD_DATA[1] MICROSD_DATA[2] MICROSD_DATA[3]

CN800 1 7 2 6 3 5 4

E

WHEEL_SW_R WHEEL_SW_L

CAM_MIC+ WHEEL_SW_R WHEEL_SW_L MMP_CAM_PWR_EN

WHEEL CONNECTOR
F

F

AXK840225WG Header

MAIN - SUB B to B Conn.
SPK_OUT+ SPEAKER PAD SPK_OUTOUT801 OUT800

G

SPEAKER +/-

H

5

6

7

8

9

10

11

12

LGE Internal Use Only

- 178 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

10

11

12

A

A

5MP CAMERA POWER
B B

(VDD_SD) +VPWR CAM_VDD_SD_1.8V 150mA CAM_VDD_AF_2.7V 150mA +VPWR

U901

R1114D271D CE_OR_NC GND2 NC 6 5 4 MMP_CAM_PWR_EN V_BACK_UP C900 1u BAT900

C

1

U900 R1114D181D 3 VDD VOUT 2 GND1 5 GND2 C902 1u C903 1u C904 1u

1 2 3

VDD GND1 VOUT

C

MMP_CAM_PWR_EN C901 1u

4 NC 6 CE

BACK_UP BATTERY
D D

MIC900 1 2 SPOB-413S42-RC3310BC ZD900 CAM_MIC+ PLW0501H-LF INSTPAR

E

E

CAM MIC

F
R904

F

100K

NCS2200SQ2T2G U902
2
VIN+

R905 EAR_MIC_P 10K

3 4

GND VCC

OUT

1 5

HOOK_SENSE_N

5.1K VREG_MSMP_2.7V R907 C905 0.1u

R906

1M

VIN-

Headset Hook Switch
G

G

H

H

1

2

3

4

5

6

7

8

9

10

11

12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 179 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

4

5

6

6

7

8

9

10

11

12

A

A

B

B

CAM_VDD_SA_2.7V CAM_VDD_AF_2.7V CAM_VDD_IO_2.7V CAM_VDD_SD_1.8V CAM_VDD_CORE_1.2V CAM_VDD_AF_2.7V CAM_VDD_SA_2.7V CAM_VDD_IO_2.7V CAM_VDD_SD_1.8V

AXT628124-Header

CAM_VDD_CORE_1.2V

C

32

CN1001

31

C

28 27 26 25 24 23 MMP_CAM_INT 22 21 5M_CAM_DATA[7] 20

1 2 MMP_I2C_SCL 3 MMP_I2C_SDA 4 MMP_CAM_VSYNC 5 MMP_CAM_HSYNC 6 MMP_CAM_RESET_N 7 STROBE_TRIGGER 8 5M_CAM_DATA[6] 9 5M_CAM_DATA[4] 10 5M_CAM_DATA[2] MMP_CAM_PCLK 11 5M_CAM_DATA[0] 12 13 MMP_CAM_MCLK 14 5M_CAM_DATA[7] 5M_CAM_DATA[5] 5M_CAM_DATA[3] 5M_CAM_DATA[1] MMP_CAM_INT GB042-30P-H1--E3000 CN1000 1 30 29 2 28 3 4 27 5 26 6 25 7 24 23 8 9 22 21 10 20 11 12 19 13 18 17 14 16 15

D

5M_CAM_DATA[5] 19 5M_CAM_DATA[3] 18 5M_CAM_DATA[1] 17 16 MMP_CAM_PCLK 15

MMP_I2C_SCL MMP_I2C_SDA MMP_CAM_VSYNC MMP_CAM_HSYNC MMP_CAM_RESET_N STROBE_TRIGGER 5M_CAM_DATA[6] 5M_CAM_DATA[4] 5M_CAM_DATA[2] 5M_CAM_DATA[0] MMP_CAM_MCLK

D

30

29

ENBY0041601

CONNECT TO MAIN PCB
E

E

CONNECT TO CAMERA MODULE

CAMERA FPCB CONNECTOR
F

TP1000 TP1001 TP1002 TP1003

F

G

G

H

H

1

2

2

3

4

5

5

6

7

7

8

9

10

11
LGMC

12

LGE Internal Use Only

- 180 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

7

8

9

9

10

A

B

B

C

C

VGA_VDD_2.7V VGA_VDD_1.8V VGA_VDD_2.7V VGA_VDD_1.8V

GB042-30P-H10-E3000 AXK720147G
CN1201 CN1200 VGA_CAM_PWDN VGA_CAM_MCLK 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VGA_CAM_PWDN VGA_CAM_MCLK VGA_CAM_RESET_N I2C_SCL I2C_SDA CAM_HSYNC CAM_VSYNC VGA_CAM_DATA[7] VGA_CAM_DATA[6] CAM_PCLK VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] VGA_CAM_DATA[4] VGA_CAM_DATA[5] MOTOR+ MOTORRCV+ RCV1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16

D

CAM_PCLK VGA_CAM_DATA[0] VGA_CAM_DATA[1] VGA_CAM_DATA[2] VGA_CAM_DATA[3] VGA_CAM_DATA[4] VGA_CAM_DATA[5]

VGA_CAM_RESET_N I2C_SCL I2C_SDA CAM_HSYNC CAM_VSYNC VGA_CAM_DATA[7] VGA_CAM_DATA[6] x+ Y+ xY-

D

RCV+

OUT1200 RECEIVER PAD OUT1201

E

RCV-

E

RECEIVER +/CN1202 G1 G2 MOTOR+ MOTOROUT1202 OUT1203 1 2 3 4 5 G3 G4 10 9 8 7 6

Y+ x+

xY-

MOTOR +/F

F

G

G

H

H

1

2

2

3

4

5

6

7

8

9

10

11
LGMC

12

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 181 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1

2

3

4

5

6

4

5

6

7

8

9

10

A

B

B

C

C

D
CN1100 1 2 3 4 5

1100
SW1100

D

KEY_ROW[0] KEY_ROW[1] KEY_COL[0] KEY_COL[1]

KEY_ROW[0]

LOCK KEY

CAMERA FOCUS

KEY_ROW[1]

KEY_COL[0] KEY_COL[1]

E

E

F

F

G

G

H

H

1

2

2 3

3 4

4 5

5 6

6

7

8

8 9

9

1

10 0

11
LGMC

12

LGE Internal Use Only

- 182 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA IC PIN MAP

8. BGA IC PIN MAP
1. MSM6280 (Top View)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 183 -

LGE Internal Use Only

8. BGA IC PIN MAP

1. MSM6280 (Top View)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Used Not used

LGE Internal Use Only

- 184 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA IC PIN MAP

2. MCP (Top View)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 185 -

LGE Internal Use Only

8. BGA IC PIN MAP

2. MCP (Top View)

1 2 3 4 5 6
A B C D E F G H J K L M N P R T U V W Y

7 8 9 10 11 12 13 14
A B C D E F G H J K L M N P R T U V W Y

Used Not used

1 2 3 4 5 6

7 8 9 10 11 12 13 14

LGE Internal Use Only

- 186 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA IC PIN MAP

3. PM6650-2 (PMIC)

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 187 -

LGE Internal Use Only

8. BGA IC PIN MAP

4. WM8983 (Audio codec)

LGE Internal Use Only

- 188 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

8. BGA IC PIN MAP

5. FM RADIO

1 A B C D E

2

3

4

5

6

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 189 -

LGE Internal Use Only

8. BGA IC PIN MAP

6. ZORAN(ZR3453)

1

2

3

4

5

6

7

8

9

10

11

12

13

14

A B C D E F G H J K L M N P

LGE Internal Use Only

- 190 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

<Audio Codec> - Headset, speaker operation

<LDO IC> - 1.0V, 1.2V power supply <PM IC>- Power management

<Baseband and RF IC> - Check the battery voltage and Outputs of LDOs-Rx operation

<Charging IC> - Check the TA and bettery

<Xtal> - Check the frequency (27MHz) <Multi media IC> - Camcorder, Camera operation <RF IC> - GSM, WCDMA TX/RX operation <UMTS RX SAW filter> - WCDMA RX operation <RF SW>

<Memory IC>- Check S/W download <Xtal>- Check the frequency (19.2MHz) <GSM900 TX SAW filter> - GSM900 TX operation

<UMTS Duplexer> - WCDMA RX,TX separation <GSM PAM>- GSM TX amplifier operation <FEM>- RX, TX switching selection

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 191 -

LGE Internal Use Only

9. PCB LAYOUT

<FM radio IC> - FM radio operation

<Headphone AMP> - Headset operation <OVP IC> - Over voltage protection <Charge Pump> - LCD backlight charge pump

LGE Internal Use Only

- 192 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 193 -

LGE Internal Use Only

9. PCB LAYOUT

LGE Internal Use Only

- 194 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 195 -

LGE Internal Use Only

9. PCB LAYOUT

LGE Internal Use Only

- 196 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

9. PCB LAYOUT

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 197 -

LGE Internal Use Only

LGE Internal Use Only

- 198 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. Calibration

10. Calibration
10.1 Usage of Hot-Kimchi
10.1.1 Calibration

Calibration only

Model Name

• Procedure
1. Click SETTING in menu, and logic operation in sub-menu. Choose “1” in LOGIC MODE (means calibration alone) 2.Select the model name which you want in list box 3.Click Start button to calibrate a phone

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 199 -

LGE Internal Use Only

10. Calibration

10.1.2 Basic Setting

• Contents
√ Click SETTING in menu, and logic operation in sub-menu. √ You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode. √ You can set UART Port and logic mode. (mode 1 : Calibration alone) √ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run time. √ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.) √ You can set the path of HOTKIMCHI program.

LGE Internal Use Only

- 200 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

10. Calibration

10.1.3 Log of Calibration and Test

• Contents
√ On Running, Log window is created in center area. It displays logs of command, and measurements of Calibration or Autotest. √ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or “~janghee\debug\CalAuto”.

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 201 -

LGE Internal Use Only

LGE Internal Use Only

- 202 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW

17

1

2

87

4

90 4

6

7

8

9

14 15 20

18 19

21 29 30 31 23 24 25 32

33 36

37

38

39

40

41

16 10

28

42

3

86

11

12 57

13 58

22 61 62

26

27 88

34

35 76 77 78 79 80 81

63 64

75

44

45

46

48

50 51

52

56 53 54

84

49 89 68 69 70 55 59 60 65 66 67 82 85 83 47 43 71 72 73 74

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 203 -

LGE Internal Use Only

ASS'Y EXPLODED VIEW

B D A

C

LGE Internal Use Only

- 204 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Mechanic component>
Level 1 2 3 3 3 3 3 3 3 3 3 2 3 4 5 6 5 5 5 5 4 5 5 5 6 5 5 5 5 5 5 5 5 AAAY00 WSAY00 MCCL00 MCJZ00 MLAC00 MLAJ00 MLAP00 MPAA00 MPAB00 MPCY00 APEY00 ACGK00 ACGZ00 MCJZ00 MICA01 MFBB00 MPBM00 MTAF MTAK00 ACHA00 MBJL00 MCCC00 MCJK00 MICA00 MDAG00 MKBZ00 MLEA00 MPBT00 MSDC00 MSIY00 MTAA00 MTAA01 Location No. Description IMT,BAR/FLIP ADDITION SOFTWARE,APPLICATION CAP,BOX COVER LABEL,BARCODE LABEL,MASTER BOX LABEL,UNIT PACKING,BLISTER(LOWE R) PACKING,BLISTER(UPPER ) PALLET PHONE COVER ASSY,FRONT COVER ASSY COVER INSERT,FRONT FILTER,RECEIVER PAD,RECEIVER TAPE,MOTOR TAPE,CAMERA COVER SUB ASSY,FRONT BUTTON,SIDE CAP,EARPHONE JACK COVER,FRONT INSERT,FRONT DECO,FRONT KNOB LOCKER,BATTERY PAD,CAMERA SPRING,LOCKER SHAFT TAPE,DECO TAPE,DECO Part Number TIMT0000711 AAAY0260102 WSAY0113601 MCCL0001103 MCJZ0049101 MLAC0004501 MLAJ0004401 MLAP0001115 MPAA0002003 MPAB0001603 MPCY0011201 APEY0415111 ACGK0093401 ACGZ0013901 MCJZ0046501 MICA0013901 MFBB0023201 MPBM0019201 MTAF0006001 MTAK0002501 ACHA0001801 MBJL0042701 MCCC0045901 MCJK0073001 MICA0019901 MDAG0028401 MKBZ0002101 MLEA0039301 MPBT0044701 MSDC0010601 MSIY0001201 MTAA0142501 MTAA0142601

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec

Color Black Without Color

Remark

; , , ,WORLD WIDE , , BOX, TW, , , , , BOX, TW, , , , , Export(105*40) LABEL,MASTER BOX(for C1300i NEW_CGR) Reliance Seal Label PRESS, PB, , , , , PRESS, PB, , , , , PALLET(for G5400 O2U 1200x1000_Wooden) Without Color Without Color Without Color Without Color Without Color Without Color Without Color Silver Black Without Color UPPER MOLD, PC LUPOY SC-1004A, , , , , 2.2X4.0 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , Without Color Black Without Color Without Color Without Color Without Color COMPLEX, (empty), , , , , Without Color Without Color MOLD, ABS MP-211, , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , M1.4 D2.2 L1.5 MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , Silver Black Black Gold Black Black Black Without Color Without Color CUTTING, STS, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , Silver Without Color Without Color 27 `4 22 34 17 25 18 33 19 29 23 21 5 9 4 7 6 8

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 205 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 5 5 5 5 5 5 5 5 5 5 4 4 4 4 4 4 4 4 4 4 4 4 5 6

Location No. MTAA02 MTAA03 MTAA04 MTAB00 MTAC00 MTAC01 MTAZ00 MTAZ01 MTAZ02 MTAZ03 MKAG00 MLAZ00 MPBG00 MPBG01 MPBT00 MPBZ00 MTAB00 MTAB01 MTAC00 MTAD00

Description TAPE,DECO TAPE,DECO TAPE,DECO TAPE,PROTECTION TAPE,SHIELD TAPE,SHIELD TAPE TAPE TAPE TAPE KEYPAD,MAIN LABEL PAD,LCD PAD,LCD PAD,CAMERA PAD TAPE,PROTECTION TAPE,PROTECTION TAPE,SHIELD TAPE,WINDOW

Part Number MTAA0142701 MTAA0142801 MTAA0146601 MTAB0185401 MTAC0057901 MTAC0058101 MTAZ0193901 MTAZ0195701 MTAZ0195801 MTAZ0195901 MKAG0000901 MLAZ0038303 MPBG0065101 MPBG0068901 MPBT0044901 MPBZ0193801 MTAB0182801 MTAB0182901 MTAC0058201 MTAD0072001 MWAC0083101 SACY0063001 SACE0057301 SACC0036101 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

Spec

Color Without Color Without Color Without Color Without Color Without Color Without Color Black Without Color Without Color Without Color Black White Black Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color

Remark 20 16 26 28 32 31 11 12 15 24 35

MOLD, PC LUPOY SC-1004A, , , , , PRINTING, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

38

1 3

MWAC00 WINDOW,LCD SACY00 SACE00 SACC00 PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT BOTTOM CONNECTOR,BOARD TO BOARD PCB ASSY,FLEXIBLE,SMT TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD PCB,FLEXIBLE VIBRATOR,MOTOR RECEIVER CAMERA CAMERA

7

ENBY00

ENBY0018601

10 PIN,.4 mm,STRAIGHT , ,H=0.9, SOCKET

6

SACD00

SACD0047101

7

ENBY00

ENBY0019501

20 PIN,.4 mm,ETC , ,H=1.5, Socket 30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,R/TP , , POLYI ,0.4 mm,Mutil-5,VGA-CAM ,; , , , , , , , , , 3 V,1.0 A,10*3.6T ,2.0Vrms 175HZ linear motor 1.5G ,; ,3V , , ,1.5G , , , , 36 37 CMOS ,MEGA ,5M AF, Sony 1/2.8", HPCB CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4" 39

7 6 4 4 4 4

ENBY01 SPCY00 SJMY00 SURY00 SVCY00 SVCY01

ENBY0040601 SPCY0106101 SJMY0008502 SURY0012801 SVCY0014601 SVCY0014001

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 4 3 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 3 5

Location No. SVLM00 ACGM00 ENZY00 ESQY00 MCJN00 MDAD00 MFBC00 MFBD00 MFBD01 MLAB00 MPBH00 MPBH01 MPBH02 MPBM00 MPBT00 MPBU00 MPBU01 MPBZ00 MPFZ01 MSDD00 MSDD01 MTAA00 MTAC00 MTAD00 MTAJ00 MTAZ00 MTAZ01

Description LCD MODULE COVER ASSY,REAR CONNECTOR,ETC SWITCH,ROTARY COVER,REAR DECO,CAMERA FILTER,SPEAKER FILTER,MIKE FILTER,MIKE LABEL,A/S PAD,MIKE PAD,MIKE PAD,MIKE PAD,RECEIVER PAD,CAMERA PAD,CONNECTOR PAD,CONNECTOR PAD PLATE SPRING,PLATE SPRING,PLATE TAPE,DECO TAPE,SHIELD TAPE,WINDOW TAPE,FLEXIBLE PCB TAPE TAPE

Part Number SVLM0025501 ACGM0094701 ENZY0019901 ESQY0001201 MCJN0069201 MDAD0032801 MFBC0033001 MFBD0025301 MFBD0025401 MLAB0001102 MPBH0032201 MPBH0032301 MPBH0032401 MPBM0019401 MPBT0044801 MPBU0007601 MPBU0007701 MPBZ0187301 MPFZ0029901 MSDD0006701 MSDD0006901 MTAA0142901 MTAC0058301 MTAD0072101 MTAJ0001701 MTAZ0194001 MTAZ0197401 MWAE0028001 MWAE0026401 MLAK0006901 MLAZ0038301 PID Label 4 Array 3 PIN,3 mm,STRAIGHT , ,

Spec MAIN ,240*400 ,45.08*75*2.2 ,262k ,TFT ,TM ,DAC IC(Sharp) ,

Color

Remark 10

Without Color 70 81 Black Black Without Color Without Color Black White Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color Gold Gold Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color 56 68 76 82 66 63 79 69 77 60 47 65 78 67 72 59 57,71 75 80 64 74 62

6 V,0.005 A,HORIZONTAL ,0.04 G,KU990 Wheel Switch ,; ,2C2P ,6VDC ,0.5MA ,HORIZONTAL , MOLD, PC LUPOY SC-1004A, , , , , PRESS, Al, 0.3, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , C2000 USASV DIA 4.0 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , PRESS, Bs, 0.15, , , , PRESS, Bs, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.1, , , , CUTTING, Quartz Glass, , , , , MOLD, Polyarylamide IXEF 1032, , , , ,

MWAE00 WINDOW,CAMERA MWAE01 WINDOW,CAMERA MLAK00 MLAZ00 LABEL,MODEL LABEL

Without Color

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 207 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Main component>
Level 4 Location No. SNGF00 Description ANTENNA,GSM,FIXED Part Number SNGF0027102

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec 3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 3.0 ,-2.0 dBd, ,BLUETOOTH, INTERNAL ,; ,SINGLE ,-2.0 ,50 ,3.0 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK

Color

Remark 58,73

4 3 3 4 5

SNGF01 GMEY00 SACY00 SACE00 SACD00

ANTENNA,GSM,FIXED SCREW MACHINE,BIND PCB ASSY,FLEXIBLE PCB ASSY,FLEXIBLE,SMT PCB ASSY,FLEXIBLE,SMT TOP CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD PCB,FLEXIBLE PCB ASSY,MAIN PCB ASSY,MAIN,INSERT DOME ASSY,METAL PCB,SIDEKEY PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

SNGF0027201 GMEY0010601 SACY0063003 SACE0057302 SACD0047102

Black

84

6

CN601

ENBY0041601

28 PIN,0.4 mm,ETC , ,B to B ,; , ,0.40MM ,[empty] ,MALE ,SMD ,BK , , 30 PIN,0.4 mm,ETC , ,H=1.0 ,; , ,0.40MM ,STRAIGHT ,MALE ,SMD ,R/TP , , POLYI ,0.2 mm,DOUBLE ,5M-F-CAM ,; , , , , , , , , , 44

6 5 3 4 5 5 4 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

ENBY01 SPCY00 SAFY00 SAFB00 ADCA00 SPKY00 SAFF00 SAFC00 C100 C101 C102 C103 C104 C105 C106 C107 C108 C110 C111 C112 C116 C117 C118

ENBY0040601 SPCY0103601 SAFY0203411 SAFB0075601 ADCA0069301 SPKY0049301 SAFF0124311 SAFC0091501 ECCH0001002 ECCH0000129 ELCH0001401 ECCH0001002 ECCH0000196 ECZH0000841 ECCH0000107 ECCH0001002 ECZH0000806 ECCH0001002 ECCH0000149 ECCH0000143 ECZH0000816 ECCH0000115 ECCH0000393

Without Color POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,

43

180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 120 pF,50V,J,NP0,TC,1005,R/TP 15 nH,J ,1005 ,R/TP ,Pb Free 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 3.3 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C119 C120 C121 C122 C123 C124 C125 C126 C127 C128 C129 C130 C131 C132 C133 C134 C135 C136 C137 C139 C140 C141 C142 C143 C144 C145 C146 C147 C148 C149 C152 C153 C154 C155 C156 C159

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER

Part Number ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0004904 ECCH0000115 ECZH0000813 ECCH0000115 ECCH0000182 ECCH0000393 ECZH0000813 ECCH0000155 ECCH0000115 ECCH0000143 ECTH0005501 ECCH0000109 ECCH0004904 ECCH0000182 ECCH0000143 ECCH0000155 ECCH0000196 ECZH0000844 ECCH0000143 ECCH0000143 ECCH0000110 ECCH0000143 ECZH0001105 ECCH0000115 ECCH0000195 ECZH0000841 ECZH0000841 ECCH0000101 ECCH0000901 ECZH0000846

Spec 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 8 pF,50V,D,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 8200 pF,16V ,K ,X7R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

Color

Remark

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 209 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C160 C161 C162 C163 C164 C167 C168 C169 C170 C173 C200 C214 C218 C219 C222 C223 C231 C232 C233 C235 C236 C238 C239 C300 C301 C303 C308 C309 C310 C311 C321 C322 C323 C324 C325 C326 C339

Description CAP,TANTAL,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECTH0004101 ECZH0000841 ECCH0000155 ECZH0000813 ECCH0004904 ECZH0000841 ECZH0000841 ECCH0000185 ECCH0000178 ECZH0000813 ECCH0000110 ECCH0000155 ECCH0000143 ECCH0000155 ECCH0000147 ECCH0000161 ECCH0000155 ECCH0000182 ECTH0003701 ECCH0000182 ECCH0000182 ECCH0000182 ECTZ0004701 ECTH0003701 ECCH0000182 ECCH0000182 ECTH0003701 ECTH0003701 ECCH0000182 ECCH0000110 ECCH0000182 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000109

Spec 22 uF,6.3V ,M ,STD ,1608 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 2.2 nF,50V,K,X7R,HD,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 8 pF,50V,D,NP0,TC,1005,R/TP

Color

Remark

LGE Internal Use Only

- 210 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C340 C403 C404 C405 C406 C407 C408 C409 C410 C411 C500 C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C518 C519 C522 C523 C524 C525 C526 C527 C528

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000109 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000155 ECCH0000182 ECTH0005501 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0006201 ECCH0000182 ECCH0006201 ECCH0000182 ECCH0006201 ECCH0006201 ECCH0004904 ECZH0001421 ECZH0003501 ECTH0004807 ECCH0000182 ECCH0000198 ECCH0007801 ECCH0000182 ECCH0000182 ECCH0004904 ECCH0000182 ECTH0004807 ECCH0004904 ECCH0000182 ECCH0006201

Spec 8 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

Color

Remark

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C529 C530 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C545 C546 C547 C548 C549 C552 C553 C554 C555 C556 C557 C558 C559 C560 C561 C586 C587 C589 C590 C600 C601 C602 C613 C619

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0004904 ECCH0000199 ECCH0004904 ECCH0000151 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0006201 ECCH0006201 ECCH0004904 ECCH0006201 ECCH0004904 ECCH0000151 ECCH0000115 ECCH0000115 ECCH0000199 ECCH0004904 ECCH0004904 ECZH0001421 ECZH0001421 ECCH0000393 ECCH0005604 ECCH0000182 ECCH0000143 ECCH0006201 ECCH0000182 ECCH0006201 ECCH0000182 ECCH0000122 ECCH0000122 ECZH0000830 ECCH0000198 ECTH0003701 ECCH0000182 ECCH0004904 ECCH0000110 ECCH0004904

Spec 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4.7 nF,25V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 4.7 nF,25V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 12 nF,16V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

- 212 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C620 C623 C624 C625 C626 C627 C702 C703 C704 C705 C706 C707 C708 CN300 CN500 CN600

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,TANTAL,CHIP,MAKER CAP,CHIP,MAKER CAP,TANTAL,CHIP,MAKER CAP,CHIP,MAKER CONNECTOR,BOARD TO BOARD CONNECTOR,I/O CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD CONNECTOR,BOARD TO BOARD DIODE,TVS DIODE,SWITCHING DIODE,TVS DIODE,TVS FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP

Part Number ECCH0000147 ECCH0000182 ECCH0000147 ECCH0005604 ECCH0000182 ECCH0000182 ECZH0000813 ECCH0006201 ECZH0000813 ECTZ0004701 ECZH0001421 ECTZ0004701 ECZH0001421 ENBY0036001 ENRY0006401 ENBY0040701

Spec 2.2 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 2.2 nF,50V,K,X7R,HD,1005,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 40 PIN,0.4 mm,ETC , ,H=1.0, Socket 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type 30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,R/TP ,1.0 , 14 PIN,0.4 mm,ETC , ,H=2.0, Socket

Color

Remark

6

CN601

ENBY0035201

6

CN603

ENBY0029501

40 PIN,0.4 mm,ETC , ,H=3.0, Socket 30 PIN, mm,ETC , , ,; , ,0.40MM ,STRAIGHT ,FEMALE ,SMD ,R/TP ,1.0 , SC70-6L ,6 V,200 W,R/TP ,PB-FREE EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SMD ,12 V,350 W,R/TP , SOD-323 ,6 V,400 W,R/TP ,PB-FREE 120 ohm,1608 , 120 ohm,1608 , 1000 ohm,1005 ,chip bead, 200mA,DCR0.9ohm ,; , , ,SMD ,R/TP 900,1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM TRIPLE, WCDMA2100 FEM, 5X4X1.3 897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx 2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0, 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140 ,1.4*1.1*0.62 ,SMD ,R/TP 1950 MHz,2140 MHz,1.8 dB,2.4 dB,43 dB,45 dB,3.0*2.5*1.1 ,SMD ,SAW DUPLEXER ,; ,2140 ,45 ,1950 ,43 ,2.4 ,1.8 ,3.0*2.5*1.1 ,DUAL ,SMD ,R/TP

6 6 6 6 6 6 6 6

CN701 D400 D501 D502 D600 FB500 FB501 FB504

ENBY0040701 EDTY0008607 EDSY0011901 EDTY0007401 EDTY0008601 SFBH0001501 SFBH0001501 SFBH0008103

6

FL100

FILTER,SEPERATOR

SFAY0010002

6

FL101

FILTER,SAW

SFSY0030201

6

FL102

FILTER,SAW

SFSY0031201

6

FL103

DUPLEXER,IMT

SDMY0001202

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. FL104 FL300 FL301 FL302 FL303 J400 L100 L101 L103 L104 L105 L106 L107 L108 L109 L110 L111 L112 L113 L114 L115 L116 L117 L118 L119 L121 L123 L124 L125 L126 L128 L200 L500 L501 L502 L503

Description FILTER,SAW FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER CONN,SOCKET CAP,CERAMIC,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER

Part Number SFSY0031101 SFEY0011601 SFEY0011601 SFEY0011601 SFEY0011601 ENSY0018701 ECCH0000185 ELCH0001035 ELCH0001036 ELCH0001031 ELCH0001036 ELCH0005014 ELCH0001031 ELCH0005014 ELCH0005004 ELCH0004711 ELCH0005004 ELCH0004710 ELCH0004704 ELCH0004707 ELCH0004703 ELCH0004703 ELCH0004708 ELCH0004703 ELCH0004703 ELCH0004721 ELCH0004710 ELCH0004709 ELCH0004703 ELCH0004705 ELCH0004704 ELCH0005009 ELCP0008001 ELCP0008004 ELCP0008001 ELCP0008001

Spec 1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA 2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm,15pF) 6 PIN,ETC , ,2.54 mm,H=1.8 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4.7 nH,S ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 15 nH,J ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP , 22 nH,J ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP , 4.7 nH,S ,1005 ,R/TP , 1.5 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 2.2 nH,S ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP , 3.3 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 8.2 nH,J ,1005 ,R/TP , 4.7 nH,S ,1005 ,R/TP , 100 nH,J ,1005 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD ,2.5X2X1MM ,11MM ,R/TP 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

Color

Remark

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6

Location No. L700 L701 MIC500

Description INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER MICROPHONE

Part Number ELCP0008001 ELCP0008001 SUMY0010603

Spec 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , PIN ,42 dB,4.72*3.76*1.25 ,MEMS MIC , , , ,OMNI ,1.5TO5V , ,SMD TESV ,200 mW,R/TP ,EPITAXIAL PLANAR NPN/PNP TRANSISTOR 12 Kohm,1/16W ,F ,1005 ,R/TP 680 ohm,1/16W ,F ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 68 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 120 ohm,1/16W ,J ,1005 ,R/TP 120 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 68 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,F ,1005 ,R/TP 100 ohm,1/16W ,F ,1005 ,R/TP 1000 Kohm,1/16W ,J ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 150 Kohm,1/16W ,F ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 2 Kohm,1/16W ,J ,1005 ,R/TP 33 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP

Color

Remark

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Q100 R100 R101 R104 R107 R109 R111 R112 R113 R114 R115 R117 R118 R119 R120 R123 R124 R125 R126 R200 R201 R202 R204 R205 R206 R207 R211 R312 R314 R315 R316 R317 R319

TR,BJT,ARRAY RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

EQBA0000602 ERHZ0000212 ERHZ0000310 ERHZ0003801 ERHY0013101 ERHZ0000402 ERHZ0000504 ERHZ0000517 ERHZ0000517 ERHZ0000490 ERHY0003301 ERHZ0000443 ERHZ0000411 ERHZ0000411 ERHZ0000406 ERHZ0000504 ERHZ0000490 ERHZ0000201 ERHZ0000201 ERHZ0000407 ERHZ0000537 ERHZ0000222 ERHZ0000493 ERHZ0000493 ERHZ0000406 ERHZ0000490 ERHZ0000437 ERHZ0000463 ERHZ0000490 ERHZ0000490 ERHZ0000490 ERHZ0000490 ERHZ0000405

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 215 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. R320 R321 R322 R329 R340 R401 R402 R403 R504 R506 R507 R509 R510 R511 R512 R514 R515 R516 R517 R518 R519 R524 R525 R603 R608 R610 R611 R612 R613 R614 R615 R619 R621 R622 R623 R626

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ERHZ0000406 ERHZ0000404 ERHZ0000404 ERHZ0000463 ERHZ0000267 ERHZ0000406 ERHZ0000406 ERHZ0000405 ERHZ0003901 ERHZ0004201 ERHZ0000203 ERHZ0000490 ERHZ0000404 ERHZ0000431 ERHZ0000493 ERHZ0000486 ERHZ0000493 ERHZ0000404 ERHZ0000431 ERHZ0000405 ERHZ0000406 ERHZ0000504 ERHZ0000504 ERHZ0000402 ERHZ0000402 ERHZ0000406 ERHZ0000406 ERHZ0000493 ERHZ0000493 ERHZ0000493 ERHZ0000406 ERHZ0000406 ERHZ0000288 ERHZ0000318 ERHZ0000537 ERHZ0000701

Spec 100 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 33 ohm,1/16W ,J ,1005 ,R/TP 3300 ohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012 ,R/TP 121000 ohm,1/16W ,F ,1005 ,R/TP 10 Kohm,1/16W ,F ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 18 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 47 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 18 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 68 ohm,1/16W ,J ,1005 ,R/TP 68 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,F ,1005 ,R/TP 80.6 Kohm,1/16W ,F ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 0 ohm,1/10W ,J ,1608 ,R/TP

Color

Remark

LGE Internal Use Only

- 216 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6

Location No. R726 R728 R730 R731 SW100

Description RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP CONN,RF SWITCH

Part Number ERHZ0000476 ERHY0000147 ERHY0000147 ERHY0000147 ENWY0005301

Spec 39 Kohm,1/16W ,J ,1005 ,R/TP 56K ohm,1/16W,F,1005,R/TP 56K ohm,1/16W,F,1005,R/TP 56K ohm,1/16W,F,1005,R/TP ,SMD , dB,H=1.85 ,; ,3.00MM ,STRAIGHT ,RF ADAPTER ,SMD ,R/TP ,AU , , 4 V,300 mA,HORIZONTAL , G,Slide Switch ,; ,1C3P ,[empty] ,[empty] ,[empty] ,1.5N , ,TP QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge SON5-P-0.50 ,5 PIN,R/TP ,INVERTER GATE, Pb Free -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~ 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz, HSDPA CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS/EDGE/HSDPA Base Band FPBGA ,180 PIN,R/TP ,5M Camera,VGA30,Multi audio codec FBGA ,225 PIN,ETC ,2G(LB/128Mx16/2.7V) NAND+1G(8Mx4x32) SDRAM ,; ,IC,MCP WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET & DUAL Transistor BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree QFN ,32 PIN,R/TP ,CODEC,3D, 5band equalizer,Stereo HP AMP, Stereo SPKAMP ,; ,IC,Audio Codec SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free SSOP5-P-0.65 ,5 PIN,R/TP ,XOR GATE, Pb Free QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP DFN33-12 ,12 PIN,R/TP ,DUALDCDC_DMBpower,400mA,600mA,1Mhz 5.6 V, ,SMD ,360pF, 1005 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 5 V,<0.5pF ,SMD , 5 V,<0.5pF ,SMD , 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

Color

Remark

6

SW600

SWITCH,SLIDE

ESSY0004701

6 6 6 6

U100 U101 U102 U104

IC PAM IC COUPLER,RF DIRECTIONAL PAM

EUSY0300502 SMPY0013501 EUSY0278501 SCDY0003403

6

U105

SMPY0013301

6

U200

IC

EUSY0295601

6

U302

IC

EUSY0330701

6

U402

IC

EUSY0333402

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

U500 U501 U502 U603 U605 U606 U701 VA300 VA301 VA500 VA501 VA502 VA503 VA504 VA505 VA506 VA507

IC IC IC IC IC IC IC VARISTOR DIODE,TVS VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR DIODE,TVS

EUSY0332901 EUSY0306302 EUSY0342001 EUSY0140901 EUSY0140901 EUSY0335701 EUSY0251501 SEVY0004101 EDTY0009401 SEVY0007301 SEVY0007301 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 EDTY0008606

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 217 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6

Location No. VA508 VA601 VA603 VA604 VA605 X100

Description DIODE,TVS VARISTOR VARISTOR VARISTOR VARISTOR VCTCXO

Part Number EDTY0008606 SEVY0004301 SEVY0001001 SEVY0001001 SEVY0001001 EXSK0007802

Spec DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE 18 V, ,SMD ,10pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM ,2.8V , , , , ,SMD ,P/TP 48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap 27 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppm at -20'C ~ +70'C, Pb Free 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 ,

Color

Remark

6

X200

RESONATOR

EXRY0002401

6

X300

X-TAL

EXXY0023301

6 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

X500 SAFD00 C109 C113 C114 C115 C150 C151 C157 C158 C166 C171 C172 C210 C211 C212 C213 C215 C216 C217 C220 C221 C224 C225 C226 C227 C228

X-TAL PCB ASSY,MAIN,SMT TOP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

EXXY0018701 SAFD0091001 ECCH0000122 ECCH0000122 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000155 ECCH0000182 ECCH0004904 ECZH0000813 ECZH0000841 ECZH0000826 ECCH0000155 ECCH0000155 ECCH0000182 ECCH0000155 ECCH0000182 ECCH0000182 ECCH0000143 ECCH0000155 ECCH0000155 ECCH0004904 ECCH0004904 ECCH0000143 ECCH0000143 ECCH0000182

47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 27 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

LGE Internal Use Only

- 218 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C229 C230 C234 C302 C304 C305 C306 C307 C312 C313 C314 C315 C316 C317 C318 C319 C327 C328 C329 C330 C331 C332 C333 C334 C335 C336 C337 C338 C400 C401 C402 C412 C413 C516 C517 C520 C521

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000182 ECCH0000182 ECCH0004904 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000110 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000110 ECCH0000182 ECCH0004904 ECCH0000182 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000115 ECCH0004904 ECCH0004904 ECCH0000137 ECCH0000137 ECCH0000155 ECCH0004904 ECCH0004904 ECZH0000830 ECZH0000830 ECCH0004904 ECCH0000155 ECCH0000155 ECCH0007801 ECCH0000182 ECCH0007801 ECCH0000182

Spec 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color

Remark

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 219 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C562 C563 C564 C565 C566 C567 C568 C570 C571 C572 C573 C574 C575 C576 C577 C578 C579 C580 C581 C583 C584 C585 C588 C603 C604 C605 C606 C607 C608 C609 C610 C611 C612 C614 C615 C616 C617

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP DIODE,TVS DIODE,TVS CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0002004 ECCH0005604 ECCH0000122 ECCH0006201 ECCH0004904 ECCH0000179 ECCH0000179 ECCH0004904 ECCH0004904 ECCH0004904 EDTY0008606 EDTY0008606 ECZH0000830 ECCH0000110 ECCH0004904 ECCH0002004 ECTH0003701 ECCH0000122 ECCH0000155 ECCH0000110 ECCH0000182 ECZH0001215 ECCH0000110 ECCH0004904 ECCH0004904 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0004904 ECCH0000182 ECCH0000110 ECCH0000110 ECCH0000110 ECCH0000182 ECCH0004904 ECCH0004904 ECCH0004904

Spec 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

- 220 -

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C618 C621 C622 C700 C701 C709 C710 C711 C712 C713 C714 C715 D500 FB300 FB301 FB502 FB503 FL600 FL601 FL700 FL701 L120 L127 L300 L504 LD700 LD701 LD702 LD703 LD704 LD705 R121 R122 R208 R217

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP DIODE,SWITCHING FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,BEAD,CHIP FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ECCH0004904 ECCH0000182 ECCH0000182 ECCH0004904 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000110 ECCH0000110 ECCH0000110 ECCH0000110 EDSY0011901 SFBH0000903 SFBH0000903 SFBH0000903 SFBH0000903 SFEY0011701 SFEY0011701 SFEY0011701 SFEY0011701 ELCH0004722 ELCH0009114 ELCH0010401 ELCH0010401 EDLH0011901 EDLH0007901 EDLH0014501 EDLH0007901 EDLH0011901 EDLH0014501 ERHZ0000405 ERHZ0000204 ERHZ0000406 ERHZ0000443

Spec 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 600 ohm,1005 , 600 ohm,1005 , 600 ohm,1005 , 600 ohm,1005 , SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) SMD ,SMD ,18 V,4ch. EMI_ESD Filter (10 Ohm,7.5pF) 47 nH,J ,1005 ,R/TP , 100 nH,J ,1005 ,R/TP ,coil 2.2 uH,M ,1005 ,R/TP , 2.2 uH,M ,1005 ,R/TP , WHITE ,1608 ,R/TP ,PB-FREE(ZENER) RED ,1608 ,R/TP ,Indicator,0.4T Red LED GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty] ,[empty] ,2P RED ,1608 ,R/TP ,Indicator,0.4T Red LED WHITE ,1608 ,R/TP ,PB-FREE(ZENER) GREEN ,1608 ,R/TP , ,; ,[empty] ,2.85~3.25 , , , , ,[empty] ,[empty] ,2P 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP

Color

Remark

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 221 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. R218 R310 R331 R336 R338 R339 R345 R400 R505 R522 R528 R529 R530 R601 R602 R604 R607 R701 R703 R704 R705 R706 R707 R708 R709 R710 R711 R712 R713 R714 R715 R716 R717 R718 R719 R720 R724

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ERHZ0000443 ERHZ0000405 ERHZ0000406 ERHZ0000406 ERHZ0000509 ERHY0000170 ERHZ0000406 ERHZ0000422 ERHZ0000487 ERHZ0000422 ERHZ0000406 ERHZ0000422 ERHZ0000443 ERHZ0000402 ERHZ0000402 ERHZ0000402 ERHZ0000463 ERHZ0000493 ERHY0003601 ERHY0003601 ERHZ0000493 ERHZ0000493 ERHZ0000484 ERHZ0000484 ERHZ0000484 ERHZ0000484 ERHZ0000483 ERHZ0000527 ERHZ0000483 ERHZ0000527 ERHZ0000483 ERHZ0000483 ERHZ0000402 ERHZ0000402 ERHZ0000402 ERHZ0000402 ERHZ0000402

Spec 2200 ohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 75 ohm,1/16W ,J ,1005 ,R/TP 390 ohm,1/16W ,F ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 33 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 2700 ohm,1/16W ,J ,1005 ,R/TP 2700 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/16W ,J ,1005 ,R/TP 470 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 200 ohm,1/6W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP

Color

Remark

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6

Location No. R725 SPFY00 U103

Description RES,CHIP,MAKER PCB,MAIN IC

Part Number ERHZ0000402 SPFY0151801 EUSY0335301

Spec 10 ohm,1/16W ,J ,1005 ,R/TP FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , , WLCSP(Coated) ,25 PIN,R/TP ,FM Tuner(RDS), 3.35*3.3, Pb Free HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save LDO , PIN,R/TP , ,; ,IC,Charge Pump SON1612 ,6 PIN,R/TP ,1.9V 150mA Single LDO ,; ,IC,LDO Voltage Regulator uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF 6.5ohm 1.4X1.8 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75 TQFN ,16 PIN,R/TP ,Quad Analog switch, Pb Free SON1612 ,6 PIN,R/TP ,3.3V, 150mA LDO Pb-Free, Active High QFN,130mW Capless Stereo Headphone Driver ,16 PIN,R/TP ,Capless hp amp TLLGA ,8 PIN,R/TP ,OVP MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1 MUX/DEMUX, Pb Free uMLP ,10 PIN,R/TP ,High Speed USB Siwitch 2.0 3.7pF 6.5ohm 1.4X1.8 HVSOF5 ,5 PIN,R/TP ,150mA, 2.8V, Auto Power Save LDO SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1 MUX/DEMUX, Pb Free MICROPAK ,6 PIN,R/TP ,SPDT ANALOG SWITCH / 2:1 MUX/DEMUX, Pb Free CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/D Converter 18 V, ,SMD ,10pF, 1005 18 V, ,SMD , 14 V,10% ,SMD , 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V,10% ,SMD ,

Color

Remark

6 6 6

U300 U301 U303

IC IC IC

EUSY0290701 EUSY0336502 EUSY0346001

6 6 6 6

U304 U400 U401 U503

IC IC IC IC

EUSY0338301 EUSY0317101 EUSY0271201 EUSY0333001

6 6 6

U504 U505 U506

IC IC IC

EUSY0303901 EUSY0333701 EUSY0175301

6

U507

IC

EUSY0338301

6 6 6 6

U600 U601 U602 U604

IC IC IC IC

EUSY0290701 EUSY0338701 EUSY0338701 EUSY0175301

6

U607

IC

EUSY0175301

6 6 6 6 6 6 6 6 6 6 6 6

U700 VA600 VA602 VA700 VA701 VA702 VA703 VA704 VA705 VA706 VA707 VA708

IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR

EUSY0337101 SEVY0004301 SEVY0003801 SEVY0000702 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0000702

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 223 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 5 3 4 5 6 6 6 6 6 5 5 5 5 4 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. VA709 VA710 VA711 VA712 VA713 VA714 VA715 WSYY00 SAJY00 SAJB00 AFBA00 MFEA00 MPBJ00 MPBU00 MPBU01 MPBZ00 MPBU00 MPBZ00 SMZY00 SUSY00 SAJE00 SAJC00 C901 C902 C903 C904 C905 CN800 MIC900 R800 R904 R905 R906 R907 S800 U900

Description VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR SOFTWARE PCB ASSY,SUB PCB ASSY,SUB,INSERT FRAME ASSY,SHIELD FRAME,SHIELD PAD,MOTOR PAD,CONNECTOR PAD,CONNECTOR PAD PAD,CONNECTOR PAD MODULE,ETC SPEAKER PCB ASSY,SUB,SMT PCB ASSY,SUB,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,ETC MICROPHONE RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER CONN,SOCKET IC

Part Number SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0003801 SEVY0004301 SEVY0003801 WSYY0636510 SAJY0024902 SAJB0012001 AFBA0007701 MFEA0015601 MPBJ0045901 MPBU0007801 MPBU0007901 MPBZ0190001 MPBU0008001 MPBZ0187201 SMZY0016801 SUSY0026002 SAJE0019001 SAJC0017301 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000182 ENZY0015301 SUMY0010507 ERHZ0000401 ERHZ0000406 ERHZ0000405 ERHZ0000407 ERHZ0000530 ENSY0015801 EUSY0294701 MOLD, ABS MP-211, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 18 V, ,SMD , 18 V, ,SMD ,10pF, 1005 18 V, ,SMD ,

Spec

Color

Remark

52

Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color 51 46 55 UNIT ,8 ohm,83 dB,16 mm,19.85*18.75*6.1 Module SPK ,; , , , , , , ,[empty] 50 45 48 49

1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4 PIN,2.2 mm,ETC , ,H=2.3 UNIT ,42 dB,4*1.35 ,SMD 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 1000 Kohm,1/16W ,J ,1005 ,R/TP 5.1 Kohm,1/16W ,J ,1005 ,R/TP 8 PIN,ETC , ,1.1 mm,H=1.9, Detect Pin SON1612-6 ,6 PIN,R/TP ,1.8V 150mA LDO Pb-Free

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 5

Location No. U901 U902 ZD900 SAJD00 BAT900 C801 C802 C803 C804 C805 C806 C807 C808 C809 C810 C811 C812 C813 C814 C900 CN801 M800 R801 R802 R803 R804 R805 R806 R808 R809 R810 R811 SPJY00 IC IC

Description

Part Number EUSY0338701 EUSY0250501 EDTY0008610 SAJD0019601 SBCL0001701 ECCH0000143 ECCH0000143 ECZH0001215 ECZH0001215 ECZH0000830 ECZH0000830 ECCH0004904 ECZH0000830 ECZH0000830 ECZH0000830 ECZH0000813 ECCH0000182 ECZH0000813 ECZH0001421 ECCH0004904 ENBY0029401 SMZY0012601 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000406 ERHZ0000405 ERHZ0000405 ECZH0000830 ECZH0000830 SPJY0042101

Spec SON1612-6 ,6 PIN,R/TP ,2.7V 150mA LDO Pb-Free SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 SOD-523 ,5 V,250 W,R/TP ,PB-FREE

Color

Remark

DIODE,TVS PCB ASSY,SUB,SMT TOP BATTERY,CELL,LITHIUM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CONNECTOR,BOARD TO BOARD MODULE,ETC RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER PCB,SUB

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 40 PIN,0.4 mm,ETC , ,H=3.0 4.5x3.2x1.2 Bluetooth RF Module 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,

Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level 5 3 3 3

Location No. MCHZ00 MCJA00 MHBY00 MPHY00

Description
COMPACT DISK COVER,BATTERY HANDSTRAP PROTECTOR

Part Number
MCHZ0040301 MCJA0047601 MHBY0004310 MPHY0011301 COMPLEX, (empty), , , , , PRESS, Al, , , , , COMPLEX, (empty), , , , ,

Spec

Color SILVER SNOW
Black Without Color Without Color

Remark

85

COMPLEX, (empty), 0.1, , , ,

3

SBPL00

BATTERY PACK,LI-ION

SBPL0091101

3.7 V,1000 mAh,1 CELL,PRISMATIC ,KU990(NYX) BATT, Europe Label, Pb-Free ,; ,3.7 ,1000 ,0.2C ,PRISMATIC ,46x34x55 , ,BLACK ,Innerpack ,Europe(Reverse insert OK) ; ,[empty] ,[empty] ,[empty] ,18pin 6.2mm. NYX Box Package ,BLACK , ,N ; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK ,18P MMI CONNECTOR ,Plug Mold( Abnormal) ,Earphone,Stereo 100-240V ,5060 Hz,5.1 V,.7 A,CE ,England, 18pin plug, Nyx packing ,; , , , , , ,WALL 2P ,I/O CONNECTOR ,

Black

3

SGDY00

DATA CABLE

SGDY0010908

3

SGEY00

EAR PHONE/EAR MIKE SET

SGEY0005546

3

SSAD00

ADAPTOR,AC-DC

SSAD0025003

LGE Internal Use Only

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Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes

Note

Note

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