REFLOW SOLDERING PROFILE DOCUMENTATION

CUSTOMER NAME : IS IT TIN-LEAD OR LEAD-FREE BUILD ? BUILD DATE : PRODUCT NAME : PRODUCT CODE: WORK ORDER #

MACHINE PARAMETERS
ZONES TEMPERATURE

REFLOW PROCESS PARAMETERS
PROCESS Peak temperature Time above 217°C Time - 50°C to 220°C Gradient in Preheat Max gradient in reflow Max gradient in Cooling T/C #1 T/C #2 T/C #3 T/C #4 T/C #5 T/C #6 AVG #DIV/0! #DIV/0! #DIV/0! #DIV/0! #DIV/0! #DIV/0!

ZONE 1 ZONE 2 ZONE 3 ZONE 4 ZONE 5 ZONE 6 ZONE 7 ZONE 8 ZONE 9 ZONE 10 ZONE 11 ZONE 12 CONVEYOR SPEED COMMENTS:

DRAW THE PICTURE OF PCB PANEL WITH T/C LOCATIONS BELOW:
.

PC INDEX

#DIV/0!

WAVE SOLDERING PROFILE DOCUMENTATION
CUSTOMER NAME : IS IT TIN-LEAD OR LEAD-FREE BUILD ? BUILD DATE : PRODUCT NAME : PRODUCT CODE: WORK ORDER #

PREVENTIVE MAINTENANCE VERIFICATION
Check Flux Level in Tank Check For Bent Fingers Flux Coverage (on Glass Plate) Solder Level in Pot with wave OFF De-dross Solder Pot Preheaters are clean Fingers are clean Ceramic Glass Plate Cleaned Flux Nozzles are clear

MACHINE PARAMETERS
PARAMETERS Conveyor Speed Flux Flow Rate Flux Pressure Flux Spray Width Fluxer Conveyor Speed Setting Convection Pre Heater 1 Convection Pre Heater 2 Topside IR Pre Heater Lambda Pump Speed Solder Temperature Lead Clearance (Pb-Free Pot only) Flux Penetration Test Result VALUES

PROCESS PARAMETERS
PROCESS PARAMETERS
TOPSIDE BOARD TEMPERATURE (TSBT) MAXIMUM TSBT OVER THE WAVE DWELL TIME (GLASS PLATE) FLUX DEPOSITION RATE (µgms/inch2)

T/C #1 T/C #2 T/C #3 T/C #4 T/C #5 T/C #6

AVG

DRAW THE PICTURE OF PCB PANEL WITH T/C LOCATIONS BELOW:

COMMENTS:

PROCESS VERIFICATION / VALIDATION

Temperature Profile done

Run First Ariticle

Run 3 boards for Process Verification

PROCESS CONFORMANCE INDEX