You are on page 1of 1

Wafer Breakages Report

Customer
Lot Number Affected:
Wafer Quantity Affected
Process Step:

1514011490002
6641640
1L
etching

Date Issued:
Wafer ID:
Machine:

02 mei 2015
N/A

Problem Description:
One wafer having chip

Equipment

Handling

Root Cause Analysis:


Found chip at etching process due handling issue while transfering the wafer into PFA cassette, upon transfering operator has early release the vacum wand button and the wafer fall
into the cassette causing it chip but not breaking the wafer

Corrective Action:

Due Date:

Operator to be alert upon transfering all the wafer carefully as this wafer is fragile

02 05 2015

Trainer educate the operator on using proper vacum wand for the new operator

02 05 2015

Preventive Action:

Due Date

Transfer jig for wafer transfer from PFA to black cassette to be use by all operator and purchase new one for etching process

3/5/2015

Report Prepared By:

MANIMARAN

Line Briefing Done By:

SUPERVISOR

Report Verified By:

(
Manufacturing/Process/Equipment

Report Approved By:

(
QA Manager