, Sedarapet, PONDICHERRY



Year CSE, Department of Computer Science & Engineering, Sri Manakula Vinayagar Engineering College, Pondicherry


Participants: Ritwik.M Sinivassin.V Elammurugu R.M Prabakaran.G Rajakumar.S GovindRam.N

2nd Year (4th semester) Department of Computer Science & Engineering Sri Manakula Vinayagar Engineering College


CONTENTS INTRODUCTION OVERVIEW 1. QUALITY CHECK (QC) 3. PRODUCT EVALUATION GROUP (PEG) (i) (ii) (iii) (iv) (v) (vi) (vii) (viii) (ix) (i) (ii) (iii) (iv) (v) (i) (ii) (iii) 4. PRODUCT ENGINEERING (PE) 3 . STORES Mechanical Peripheral Desktop Server Notebook Add on Software Certification Benchmarking Inward Quality check (IQC) Reliability Test and Repair Section(T&RS) Final Quality Check (FQC) Customer Satisfaction Cell and Customer Support Final Production Line(FPL) Repairs section Packing 2.

Hariharan(Server. Johnson(IQC. Mr. I am extremely grateful to all of them for providing sufficient information and taking precious time off to enlighten us. Mr.who were very patient with us answering our queries and providing detailed information on various aspects of Computer Hardware. for giving me the right directions and inputs and making this training possible for us.Ms. for arranging the schedule of the In-Plant training and monitoring the entire program. Mr. My special thanks to Mr.R Executive) who got us the official permission and initiated the formal procedure for providing us the in-plant training. INFOSYSTEMS. Shella Jeba Kumari (PE). PEG). Jegan (Testing.QC).C. HCL Infosystems. Gerald (H. I would also like to place on record my thanks to Ms.CONCLUSION ACKNOWLEDGEMENTS: I am thankful to all those who have helped me undergo this comprehensive training program in H. Pondicherry.S. Appandaraj (certification. QC ). PEG). C.L. Sederapet. Mr. Mr.Perumal(software. Mr. Apprentice in the HR Department. Dwivedi. We interacted with several of the Engineers there—experts in various fields-. Vice President.Muthuraman ( IQC. Julius Caesar. PE) and Mr. PEG). PEG)Mr. Gayathri of the HR Department and Mr. Thirugnasamandham of the Stores Department. Suresh from the Product Engineering Group. Among them I would like to mention Mr. 4 . It was Mr. Raja (Desktop.

M.S & GovindRam. Elammurugu R.V. The H. and Rajakumar. Prabakaran. to certain select students of the Sri Manakula Vinayagar Engineering College.N who have currently completed their Second year (4th semester) in Computer Science and Engineering.INTRODUCTION What follows is a report of the in-plant training provided by the HCL Infosystems. The group consisted of Ritwik. The training commenced on 20th June 2007 at 9. Sinivassin. plant at Sedarapet is basically a hardware assembling and packing plant that specializes in CPU and notebook assembling.L. 5 . based in Sedarapet Pondicherry.40 a.M.G.m. Pondicherry.C.

Product Evaluation Group (PEG) 2. we were also taken to the yet another Department which though not related to our field. 6 . Quality Check (QC) 3. yet plays an important role: “The stores”. They were: 1.OVERVIEW On entering the plant and just before the commencement of our actual training we were informed that the plant had 3 major departments that were related to our department. Product Engineering (PE) Though these are the more important department of the plant.

Usually this department receives the sample raw materials from sources. is where the actual products are created according to various requirements of the Market. we were told. First of all. mainly from Taiwan and Singapore with the Head Office at Noida. The selection or creation of a product could be of two types: 1. The idea for system configuration is proposed by PEG to the marketing division or the higher authority division which then either accepts or rejects the proposal. PEG may basically be described as the Research and Development area of the plant. 7 .1. we noted were wearing special footwear which was tagged ESD safe. This ESD. Footwear. PEG also has a direct interaction with Marketing Division which provides them information on the market requirements which helps them assembles products. The marketing division contacts the peg with a specific configuration which is then produced. 2. All employees. as we understood. if worn inside causes Electrostatic Disturbances (ESD) due to static electricity. New products are created on the basis of the market requirement. Product Evaluation Group (PEG): The product evaluation group. we were asked to remove our footwear. we were told affects all electronic devices. especially the RAM and ROM areas of the computer and sometimes causes memory failure or even restarts the system if exposed to for a long time and generally affects the life of the system.

(ii)Peripherals 8 . It is this mechanical division that also specifies the size of the various other internal components. mouse pad formation and CPU artwork.The configuration is approved if it satisfies all criteria and then it is passed on to the quality check team. Measurements and generally deals with the CPU creation. in order to ascertain the quality level of the model. The various groups are: 1) Mechanical 2) Peripheral 3) Desktop 4) Server 5) Notebook 6) Add on 7) Software 8) Certification 9) Benchmarking (i) Mechanical The mechanical division is that which gives the specifications. with the Supplier Specification Sheet (which consists of model specification and the other details of the model) and the Volume Clearance Note. The product evaluation group (PEG) consists of several sub departments each which deals with specific part of the creation of the product.

(iv) Server The server departments division deals with the motherboard and processor required by the Server systems.Other than that. All we understood was that this division is important in the creation of peripherals such as keyboard and mouse and other optical device drives (ODD). Mr. was to have greater speed and storage capacity as compared to the desktop systems as it purpose is to “Serve” the various client systems. Asus (which is golden yellow) and gigabyte (blue color). Raja who was working there took a few minutes from his busy schedule in order to give a brief idea about the work done there. He told us that the motherboard used for the various desktop systems are different in dimensions when compared with the notebook or server motherboards. The motherboard is basically a PCB (Printed Circuit Board having a controller. Mr. IC. The main motherboards used by HCL are from Intel (which is green in color). the personnel were unavailable due to the heavy workload (iii)Desktop This is the division that deals with the preparation of desktop motherboards.How ever before he could give us more information his workload had increased and we were forced to part.Not many details were given about the division. ports and other such connections. Hariharan (an engineer in the division) gave us a detailed view of the work done in this division. The main requirements of a server. Basically the server 9 . we understood.

The north bridge controls dataflow from processor to memory and vise versa while south bridge is the processor to I/O device controller. These 3 ports were parallel communication ports. it is more popular and hence the production. The basic and most important part of the Motherboard is the chipset. The first such peripheral control card slot used was called International Standard Architecture (ISA).systems motherboard consists of an Intel processor and occasionally and AMD processor.An improvement on this is Enhanced ISA (EISA). The Chipset configuration used is adapted according to the latest technology available. Nowadays in most systems PCX is used though in some systems another component called Accelerated Graphics Adaptor (AGA) is used. This is the only I/O port connected to the north bridge. Graphics and VGA. The PLS slot is the I/O communication unit which controls device cards such as LAN. A heat sink is placed above the chipset and processor in order to 10 . Server systems have a large north and south bridge setting which together is called the chipset. a new such interface port was formed called Peripheral Component Express (PCX) which made use of serial communication concept.This was later replaced by Peripheral Components Interfacing (PCI) port. However with the arrival of core 2 duo processor and windows Vista. However as the concept of parallel communication was abandoned in the favor of serial communication concept (Since Data was not corrupted as in case of parallel lines).

The SCAS is a port through which up to 16 head disks can be connected at any given time. 11 . In this case a copy of all documents is placed in an additional Hard disk. The structure was: DATA A C E B D F STRUCTURE OF RAID 0 As that did not serve the purpose of RAID 1 was developed. The ‘coolant quiet technique’ is used by AMD and ‘Speed step technology’ is used by Intel for serve this purpose. RAID 0 was the first version which did not allow data recovery.This FBD is a unique character of Server Systems.This concept is very useful in cases of data loss and for recovery of the lost data. Usually however instead of the modern SATA the older IDE cable are used. The power cable has 14 pins and Data cable has 7 pins. All the serial ports of the server are controlled by the FBD (Fully Buffered Dim). The SATA cache is serial port which is divided into SATA power and SATA data.reduce the amount of heat released. The IDE are parallel ports. Another feature of server systems is the use of Redundant array of inexpensive Disk drives (RAID).

In this case an X-OR value of the data in Raid 0 format was stored is a separate hard disk. The most common type of data recovery technique is Raid 5. However the RAID technique has upgraded and now even RAID 850 is available. 12 . DATA A C E B D F A B C E D F STRUCTURE OF RAID 3 This is an improvement and combines the RAID 0 and RAID 1 techniques. This Enabled easier data recovery. An upgraded version of the RAID 3 Technique is Raid 5 which uses the parity of the 2 data disks to store the data.DATA A B C A B C STRUCTURE OF RAID 1 This was a total of waste of space and so raid 3 was developed.

Due to heavy workload of the personnel detailed study of the division was not possible. Only the performance of the notebooks with the various processors is verified. (vi)Add On This division deals with the verification of various add on parts on the motherboard of Desktop and server systems. Mr. Here they do not create any new varieties or system configuration.On the motherboard around 8 memory slots are present through on some boards up to 16 slots are allowed. Suresh (The person in charge of PEG) was able to help us and some description of the work done in this division was given. Many operating systems are available out of which Microsoft windows and Linux are the most common. He said that windows is more commonly used in personal computers and Linux is used by professionals requiring high security .Due to the release of windows vista. Slots for up to two processors and PC1 slots are also observed up to 8 SATA Hard disk’s can be placed in the server systems (v)Notebooks This division deals with the various notebooks and laptops available in the market. Mr. (vii)Software This division evaluated the various operating systems and software that can be uploaded onto the systems. it is more popular. Perumal (one of the engineers in the division) explained this concept. However due to unavailability of free personnel. He said that the basic operations (After 13 .

(viii) Certification: This is the division of PEG that after various tests on the product get it certified by the main companies involved.P . AMD and then get their approval. This approval is the certification given by the company to the product. “is to first ensure that the product is working properly and then send the configuration with its details to the companies involved such as Microsoft . This division checks if the software is compatible with the Hardware.Intel Inside Programme 14 . This is checked by the score shown by the systems.” He also said that the companies send particular tests on this configuration. BIOS and OS must be in synchronization for the systems to work perfectly. The main guidelines followed are: M. “The procedure”.Appandaraj(an engineer in the division). The software interfacing is final stage before the product goes into production.P – Microsoft Development Programme I. The results of these tests are sent to the company. If it satisfies all the guidelines and the criteria. Minimum acceptable score is 1 while the maximum score possible is only around 5.I. to quote Mr.5 on a scale of 1 to 10.installation) are verified. (ix) Benchmarking: Benchmarking is the division of PEG that verifies the various guidelines set by the companies involved. then it is approved.D. Intel .

which we were introduced to next. It is this division that also ensures that the various stickers are placed in the correct locations and adhere to the regulations. The request from P. sticker being the largest).E.C.These guidelines are adhered to and are verified by the benchmarking. This is achieved by making sure that both the stickers have the same area. For Example: One such guideline is to ensure that Microsoft and Intel Inside stickers are no less than the second largest stickers’ pasted (H C L. It is in this Department that the quality of various equipments and assembly parts are checked. 2. (vi) (vii) (viii) (ix) (x) Inward Quality check (IQC) Reliability Test and Repair Section(T&RS) Final Quality Check (FQC) Customer Satisfaction Cell and Customer Support 15 .L. QUALITY CHECK Quality check is the second department in H.G. is processed and the various individual parts are checked for defects The quality check department has smaller divisions each performing a particular task.

Their objective is to inspect test quality. quantity and materials.(i) Inward Quality Check (IQC) This Division deals with arrival of new materials and tests their electrical and peripheral connections. The general flowchart of their operation will be: START NORMAL INSPECTION ALL CHECKED LOTS EQUAL OR LESS THAN PRESCRIBED LIMIT REDUCED INSPECTION AN Y REJ ECT ION DOUBLE THE ORDER IF SINGLE ORDER TIGHTENED INSPECTION IMPROVE QUALITY REDUCE ORDER IF IT CONTINUES STOP 16 .

server &other hardware would take two hours and the peripherals like printer. This greatly improves production and reduces the time required for checking. a) Green Channel If 40 consecutive loads of materials are passed without any problems then this green channel method of testing is used. mouse would take only one hour. After the usual method of inspection mentioned above the materials are again inspected according to the results of the primary inspection in two methods. Here any 1 piece is checked out of every box. The Goods Received Slip (GRS) is obtained and contains details of the materials including item code and description. Red Channel checking occurs if customer satisfaction or FQC reports any problems with any system. Usually. according to Mr. In general the time taken for checking the motherboard is approximately three hours while the keyboard. b) Red Channel Here specific problem mentioned by user are checked. Approximately thirteen people work in the IQC division. The Average Quality Level (AQL) for the various components is given below: 17 .Here the military standard 105 is followed for instruction. The test sequence for every 100 materials is: Reduced – 3 pieces Normal – 8 pieces Tightened – 16 pieces The inspection method. Muthuraman (an engineer in the division) is mainly of two types.

Some symbols are: The clearance of the material can be: A) Normal – usual clearance B) Provisional – In case of huge sample size c) Partial – If some materials are defective Once cleared the materials are transferred to the next division where they undergo reliability test.4 Mechanical 0.COMPONENTS AQL Peripheral 0.1 IQC not only checks the system peripherals but also checks the packing boxes. It checks if the box is made of the correct material or if the symbols printed on it are correct. 18 .65 Electrical 0.

The supplier to plan communication is handled by 19 . (iii) Test and Repairs Section (T&RS) This section tests all the failed components and finds the reason for the failure and proposes possible solution. Reason for failure.(ii) Reliability test In this division the entire functionality of the materials are verified . A probe near the processor for and RAM measures the temperature. a) Pre-release Here the new parts are tested as requested by the marketing department which performs New Batch Reliability Test (NBRT) on the basis of customer configuration. Johnson (an engineer in the division) the functionality test is of two types. customer support. b) Post Release In this method every part of the system is re-checked. The Ongoing Reliability Test (ORT) is also performed in order to check the material for at least three days. Field escalation simulates the user usability of the system and records its results and proposed solutions. Once everything is verified the material is released and the Material Released Sign (MRS) is pasted on it.According to Mr. The thermal check ensures that the components are safe with that specification at around 40-50` C and the cold specification about -15`C. based on the component.

as one employee equips. The list for Desktop check includes: • • • • • • • • • • Security check Reset /Dower check Front Doors (Hardware check) OS/BIOS/Vector Speed CPU Clock Speed. 20 .this division. (v) Customer Satisfaction Test and Customer Support This division deals with Customer support. Touch pad check. This division also advices the procurement division on the materials required and the quantity of the materials required. clarification and system maintenance. If a product fails the defective materials are sent back to the suppliers with a note about the reason for failure. Each system is tested for three to four hours based on the customer requirement and specification. User Satisfaction is the primary goal and here. Memory support Memory Capacity CPU temperature ( should be 48`C) Speed(2755 RPM) DXDAIG Tool test Check idle state The list for Notebook check is similar to the Desktop except that it contains checks such as Battery check. (iv) Final Quality Check (FQC) This division checks the system after complete assembly. Desktop Systems and Notebooks are tested individually with various check lists.

“The Customer is the King”. It is this division that plays a very important role in customer satisfaction and hence the name. Shella Jeba Kumari (the person in charge of that division) explained that it has 3 main divisions. 3. PRODUCTION ENGINEERING This is the department that deals with the assembly and final production of all the systems. They are: (a) Disk Duplication (b) Kitting (c) Reliability testing (a) DISK DUPLICATION Here customer configuration is first recorded into a Machine Configuration Card (MCC) which consists of the minute details such as the type of the 21 . It comprises of further three more units. They are i) ii) iii) Final Production Line(FPL) Repairs section Packing (i) FINAL PRODUCTION LINE This division is where the central processing unit is finally assembled. Ms. The Customer Support division is the division that prepares the warranty cards and caters to the customer or user requirements and complaints. Periodical surveys and product analysis is conducted by this group in order to perfect any product.

Some of the more common software uploaded are: Word power.This is the most important section and comes directly after QC. MR1: Here the SMPS and external exhaust fan is fixed on to the CPU and all physical verification is done. first a master disk is prepared and it interfaces the configured mother board with the operating system required. In the assembly section the corresponding hardware are placed first in the various compartments within the CPU cabinet reserved for it along with the GRS and HCL logo. vista etc…. This is then copied to other hard disks (also known as the slaves). In this division. MSoffice. This is initial section may also be called MR0. The battery on the motherboard is also checked before it is sent to the next section.screws required. Here there two sections. 22 . (b) KITTING This is the second unit in the FPL. The next 6 digits is the actual number of the component. the fifth digit refers to the unit and the 6th digit is the material code. Kitting or Sub Kitting and Assembly. OS recovery software. Antivirus. The serial number of the MCC is arranged in such a way that the first 4 digits correspond to the month and year of the production. In the sub kitting section the various hardware are classified and stored with various references for easier access. If any material defective then it is pasted with a yellow tag containing details of error and continues to the Machine Release (MR) levels.

Here physical verification off all components of cabinet is done. All on board connection including motherboard fan and processor are fixed onto the motherboard. MR4: Front panel connections. MR3: Here the motherboard is mounted on the CPU. MR6: Since all connections are now completed. MR5: Here the peripheral connection such as CD ROM and Floppy drive are done. MR7 This can also be called the quality check section. the wires are neatly arranged by routing in this section.MR2: The motherboard is focused on in this section. internal LED and speaker connection are dealt with here. Scanning updates the serial number of each machine in the database of completed machines MR8 23 . No external connections are given. The hard disk is also prepared for attachment here.

Without Hard Disks With FEB Without FEB Without Hard Disks 24 . the person in charge told us that AMIDAG (American Incorporated Diagnosis). The are 3 methods for testing i) ii) iii) With FEB In this case the processor is self booting and a floppy is inserted which checks all the hardware. are some of the tools used for hardware diagnosis. The testing makes use of the CMOS and BIOS in the hard disks to run.Display verification occurs here. Mr. Without FED In this case a server is used to start the system before the tools are run on the system. All internal verification of motherboard is checked using BIOS and checks if configuration is what is required by user and buttons up the CPU The safety test involves checking if leakage current is less than 1. Jegan. Incorporated) and Western Digital. (c)RELIABILITY The process of using software in order to test the hardware of the system is called Reliability test.5 and if ground continuity is ten times the visible value. STI (Seagate Tech.

This section is completely ESD safe.In this case the CPU is started and the memory and batch files are also tested other than the usual tests. Function keys. Electrical section In this section the electrical connections of the various defective machines are selected and checked. This is a very time consuming process. They are electrical and mechanical. colors) e) FED test v) BIOS re-update (DMA serial no and sink updated) (ii) REPAIR SECTION: Any problem with CPU is checked in the repairs section. There are 2 sections for repairs. commands. The general steps for testing are: i) ii) iii) iv) Test system files BIOS update CMOS extracted and restored a)AMIDAG test (includes com port and IDE tests) b) CPU test (DMA control) c) Memory (RAM/ROM) d) VGA test (Monitor. Mechanical section 25 .

After it is verified it is then sent for cleaning. After verification of repairs the products are sent for the final testing. Here the monitors. The stores work begins with the security clearance as soon as a truck load of materials arrive. 26 . mouse. CPU are packed in ESD safe plastic foams and finally sealed in a cardboard box. Then it is sent the plan customs engineers.V. according to Mr. keyboards. ports and several configuration of the systems is checked. then the buyer is contacted to get a copy of the invoice. STORES The store is the department where all the new material or rejected materials are placed. then the exercise exempt form is obtained from the buyer.In this section the various physical components such as sticks and screw alignment or size defects are checked. Here all CD drives. The packed systems is then taken to the stores and stored for distribution.Thirugnasamandham (the person in charge of the division). The materials are classified according to the duty amount. (iii) PACKING This is the final stage of production. If the invoice or papers are not available. Then the various addresses and invoices are checked and verified. If the amount is available. 4. The engineers test the machines from the customer point view and does not comprise even on small matters. Cleaning is the part where all unnecessary stickers and tags are removed.

Approximately 25 vehicles arrive at the stores everyday for unloading. orders for more. This is then presented to the government for refunds.Once goods are unloaded. As product assembly rate increases. the contents of the WIP stock pile reduce. The completed machines are moved into the finished goods store and transferred according to the orders. The MLGP takes an inventory and if materials are unavailable.. Then if all are cleared. In such cases the exercise duty payment is checked. shelf) CICP (Critical Item Control Process) is where items of small size but high value are stored. The accepted materials are placed in the OK stores (main store) while those rejected are placed in the rejection store from where they are shipped to the supplier. they are given to IQC for accepting or rejecting. If it’s paid then Chelan 57A4 is issued. Once the piece is moved to the OK store then it has an address (row no. CONCLUSION: 27 . the stock is moved to the Work In Progress (WIP) stack. a bill of entry from customs serves better than an invoice after which the GR is issued. Stores also collect defective materials and issues the NonReturnable Gate Pass (NRGP). The receipt is obtained on unlading materials and it contains all details of the consignment. In case of impacts from other countries. the materials are moved to the main stack pile otherwise they are returned to the sender without any payment and if exercise is paid the amount is returned. If the goods are in repairable condition the Returnable Gate Pass (RGP) is issued. If ok.

C. requirements and procedure involved in the assembly of a particular computer system. was indeed very useful in understanding the various needs. The extensive testing methods performed at each step of assembly. and to that extent we benefited a great deal.L Company plant in Sederapet. once viewed and experienced practically. Usually it is seen that most courses in Computer Science & Engineering lay more emphasis on the software part so much so that the basic hardware part of the field is given less importance.L Infosystems Ltd. Pondicherry. 28 . Hence we could clearly comprehend the complete processes that go into the working of a computer. The officials were kind enough to oblige me and allow me to study the functioning of an assembling unit and I am indeed happy to report that the entire training programme has been most illuminating. We were able to visit the various divisions and departments of the plant.. are more clearly understood than the very same methods studied as theory.C. Hence it was my decision to undergo training in the H.Any Computer Engineer must be familiar with all aspects of a computer—the hardware as well as the software--in order to be effective. We could therefore study the procedures at close quarters and have a hands-on experience of the workings of the plant. Therefore the In-Plant Training Program offered by H. where the various processes involved were explained to us. The major aim of this in-plant training program was to help us understand the process of assembling a computer system and the various safety measures and precautions taken in the process of building up a computer until it was delivered to the user.

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