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NASA Microelectronics Reliability Physics-Of-Failure Based Modeling

NASA Microelectronics Reliability Physics-Of-Failure Based Modeling

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Published by: goldpanr8222 on Jun 23, 2011
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As CMOS scaling pushes device performance to technological limits and diminishes reliability

margins, performance and reliability tradeoffs based on the worst-case DC stress analysis are no

longer accurate and will result in more stringent design constraints and increased cost. In real

operating conditions, devices experience time-variant voltage or frequency stresses. The effective

AC stress time during which the transistor undergoes real stresses is only a fraction of worst-case

DC stress time. If a lifetime factor is defined as the ratio of worst-case DC age to AC age, in a 100-

MHz application, the lifetime factors of the n-channel metal oxide semiconductor field effect

transistor (NMOSFET) and the p-channel MOSFET (PMOSFET) reported in [93] are 120 and 300,

respectively. Therefore, to accurately model device lifetime, real-time operating parameters should

be determined from SPICE.

In FaRBS, the process for SPICE simulation is fairly straightforward. After the sensitivity

analysis, the transistor-level schematics or SPICE netlists of reliability critical blocks and the

behavior-level SPICE macro models are fed into the SPICE simulator. MOSFET models and

technology files are then selected according to the system specifications. The DC analysis of

SPICE determines the DC operation point of the circuit. This is automatically performed prior to a

transient analysis to determine the transient initial conditions and prior to an AC small-signal

analysis to determine linearized, small-signal models for nonlinear devices. The AC small-signal

analysis of SPICE computes the AC output variables as a function of frequency. The transient

analysis of SPICE computes the transient output variables as a function of time over a user-

specified time interval [94]. The outputs of these SPICE analyses are device real-time operating

parameters, such as voltage, current, and frequency.

3 Failure Rate Based SPICE (FaRBS) Reliability Simulation


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/*********** DO NOT ALTER ANYTHING BELOW THIS LINE ! ************/ var s_code=s.t();if(s_code)document.write(s_code)//-->