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27256 EPROM

27256 EPROM

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M27C256B

256 Kbit (32Kb × 8) UV EPROM and OTP EPROM
Feature summary
■ ■ ■

5V ± 10% supply voltage in Read operation Access time: 45ns Low power consumption: – Active Current 30mA at 5MHz – Standby Current 100µA Programming voltage: 12.75V ± 0.25V Programming time: 100µs/Word Electronic signature – Manufacturer Code: 20h – Device Code: 8Dh ECOPACK® packages available PDIP28 (B)
28
28

1

FDIP28W (F)

■ ■ ■

1

PLCC32 (C)

May 2006

Rev 2

1/24
www.st.com 1

Contents

M27C256B

Contents
1 2 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 PRESTO II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Program inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Erasure operation (applies for UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

3 4 5 6 7

Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . 18 FDIP28WB . . . . . .28 pin Ceramic Frit-seal DIP. . . . . package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ordering information scheme . . . . . . 600 mils width. . . . . . . . . . 19 PDIP28 . . . . . . . . . . . . . . . . . . . . . .32 pin Rectangular Plastic Leaded Chip Carrier. . . . . . . . 22 Document revision history . . . . . . . . . . . . . . Table 13. . . . . . . . . 14 Programming mode DC characteristics . Table 11. Table 3. . . . . . . . . . . . . Table 15. . . . . . . . . . . . . . .28 pin Plastic DIP. . . . . package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 16. . . . . . . . . . . .280"). Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement conditions. . . . . . . . . . . Table 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 7. . . . . . . . . . . . . . Table 10. . . . . Table 2. . . . . . . . . . . . . . . Table 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .M27C256B List of tables List of tables Table 1. . . . . . . Table 14. . . . . . . . . . Table 4. . . 15 Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 12. package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . Table 5. . . . . 16 Read mode AC characteristics 2 . . . . . . . . . . . . . 23 3/24 . . . . . . . . . . . . . . . . . . . . . . . . . . 20 PLCC32 . . . . 6 Operating modes . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . Table 8. . . . . . with window (round 0. . . . . . .

. . . . . . . . . Figure 10. . Figure 3. . . . . . . . . . . . . . . . . . . . Logic diagram . . . 20 PLCC32 . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC connections . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 5. . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify modes AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . .List of figures M27C256B List of figures Figure 1. . . . . . . . . . . . 5 DIP connections . . . .32 pin Rectangular Plastic Leaded Chip Carrier. package outline. . . . . Figure 2. . . . . . . . . . . . . . . . . . . . with window. .28 pin Plastic DIP. 21 4/24 . . . . . . . . . . . Figure 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC testing load circuit . . . . Figure 8. . . . . . . . . . . . . . . . . . . . . . package outline . . . package outline . . . . . . . . . . . . 10 AC testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . 18 FDIP28WB . . . . . Figure 9. . . . . . . . . . . . . . . . . . .28 pin Ceramic Frit-seal DIP. . . 600 mils width. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figure 6. . . . . . . . . . . . . . . . . . . . . Figure 11. . . . 19 PDIP28 . . . . . . . . . . . .

Figure 1. ST offers the M27C256B in ECOPACK® packages. in compliance with JEDEC Standard JESD97. In order to meet environmental requirements. A new pattern can then be written to the device by following the programming procedure.768 by 8 bits. It is ideally suited for microprocessor systems and is organized as 32. Logic diagram VCC VPP 15 A0-A14 8 Q0-Q7 E G M27C256B VSS AI00755B 5/24 . The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK packages are Lead-free. ECOPACK is an ST trademark. For applications where the content is programmed only one time and erasure is not required.com. The category of second Level Interconnect is marked on the package and on the inner box label.st. ECOPACK specifications are available at: www. the M27C256B is offered in PDIP28 and PLCC32 packages.M27C256B Summary description 1 Summary description The M27C256B is a 256 Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). The FDIP28W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern.

A0-A14 Q0-Q7 E G VPP VCC VSS NC DU M27C256B Signal names Address Inputs Data Outputs Chip Enable Output Enable Program Supply Supply Voltage Ground Not Connected Internally Don’t Use Figure 2.Summary description Table 1. DIP connections VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 28 2 27 3 26 4 25 5 24 6 23 7 22 M27C256B 8 21 9 20 10 19 11 18 12 17 13 16 14 15 AI00756 VCC A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3 6/24 .

M27C256B Figure 3. LCC connections A7 A12 VPP DU VCC A14 A13 Summary description 1 32 A6 A5 A4 A3 A2 A1 A0 NC Q0 A8 A9 A11 NC G A10 E Q7 Q6 9 M27C256B 25 17 Q1 Q2 VSS DU Q3 Q4 Q5 AI00757 7/24 .

The M27C256B is placed in the standby mode by applying a CMOS high signal to the E input. 2. When in the standby mode. while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. this product features a 2 line control function which accommodates the use of multiple memory connection. both of which must be logically active in order to obtain data at the outputs. Output Enable (G) is the output control and should be used to gate data to the output pins. independent of device selection. the address access time (tAVQV) is equal to the delay from E to output (tELQV). The two line control function allows: ● ● the lowest possible memory power dissipation. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature. Assuming that the addresses are stable. independent of the G input. 8/24 . This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is desired from a particular memory device. E should be decoded and used as the primary device selecting function. For the most efficient use of these two control lines.3 Two-line output control Because EPROMs are usually used in larger memory arrays. A single power supply is required in the read mode. complete assurance that output bus contention will not occur.2 Standby mode The M27C256B has a standby mode which reduces the supply current from 30mA to 100µA. 2.1 Read mode The M27C256B has two control functions. Chip Enable (E) is the power control and should be used for device selection. 2.Device operation M27C256B 2 Device operation The operating modes of the M27C256B are listed in the Operating Modes. assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. Data is available at the output after delay of tGLQV from the falling edge of G. the outputs are in a high impedance state.

G is at VIH and E is pulsed to VIL. all bits of the M27C256B are in the "1" state.1µF ceramic capacitor be used on every device between VCC and VSS. VCC is specified to be 6.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices.25V ± 0. The M27C256B is in the programming mode when VPP input is at 12. 9/24 . ICC. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. the active current level. Although only "0"s will be programmed. Programming with PRESTO II involves the application of a sequence of 100µs program pulses to each byte until a correct verify occurs (see Figure 4. The supply current. No overprogram pulse is applied since the verify in MARGIN MODE provides necessary margin to each programmed cell. both "1"s and "0"s can be present in the data word. During programming and verify operation. in a typical time of 3. has three segments that are of interest to the system designer: the standby current level.5 Programming When delivered (and after each erasure for UV EPROM). It is recommended that a 0. a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. The magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM).6 PRESTO II programming algorithm PRESTO II Programming Algorithm allows to program the whole array with a guaranteed margin. The levels required for the address and data inputs are TTL. Data is introduced by selectively programming "0"s into the desired bit locations. The data to be programmed is applied to 8 bits in parallel to the data output pins. 2. and transient current peaks that are produced by the falling and rising edges of E. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. a 4.4 System considerations The power switching characteristics of Advance CMOS EPROMs require careful decoupling of the devices. 2. In addition.M27C256B Device operation 2. The bulk capacitor should be located near the power supply connection point.25 V. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible.5 seconds.75V.).

8 Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0. VPP = 12. all like inputs including G of the parallel M27C256B may be common. All other address lines must be held at VIL during Electronic Signature mode. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C256B.5V on address line A9 of the M27C256B. To activate the ES mode.25V.75V and VCC at 6.25V.75V. A TTL low level pulse applied to a M27C256B's E input. VPP at 12. For the STMicroelectronics M27C256B. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. will program that M27C256B. Programming flowchart VCC = 6.Device operation Figure 4. the programming equipment must force 11.9 Electronic signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. with VPP at 12. Except for E.7 Program inhibit Programming of multiple M27C256Bs in parallel with different data is also easily accomplished. The verify is accomplished with G at VIL. 2.5V to 12. E at VIH. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. with VCC = VPP = 5V. A high level E input inhibits the other M27C256Bs from being programmed.75V M27C256B n=0 E = 100µs Pulse NO ++n = 25 YES NO VERIFY YES Last Addr NO ++ Addr FAIL YES CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4. 2. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH.2V AI00760B 2. 10/24 .

The recommended erasure procedure for the M27C256B is exposure to short wave ultraviolet light which has wavelength 2537Å. Electronic signature A0 VIL VIH Q7 0 1 Q6 0 0 Q5 1 0 Q4 0 0 Q3 0 1 Q2 0 1 Q1 0 0 Q0 0 1 Hex Data 20h 8Dh Identifier Manufacturer’s Code Device Code 11/24 . The integrated dose (i.5V.M27C256B Device operation 2. E VIL VIL VIL Pulse VIH VIH VIH VIL G VIL VIH VIH VIL VIH X VIL A9 X X X X X X VID VPP VCC VCC VPP VPP VPP VCC VCC Q7-Q0 Data Out Hi-Z Data In Data Out Hi-Z Hi-Z Codes Table 3. Operating modes(1) Mode Read Output Disable Program Verify Program Inhibit Standby Electronic Signature 1. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. it is suggested that opaque labels be put over the M27C256B window to prevent unintentional erasure. The M27C256B should be placed within 2. while it would take approximately 1 week to cause erasure when exposed to direct sunlight.e. Table 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. VID = 12V ± 0. If the M27C256B is to be exposed to these types of lighting conditions for extended periods of time. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C256B in about 3 years. X = VIH or VIL.10 Erasure operation (applies for UV EPROM) The erasure characteristics of the M27C256B is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å.

Maximum rating M27C256B 3 Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Table 4. 2. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.5 –2 to 14 Unit °C °C °C V V V V Temperature Under Bias Storage Temperature Input or Output Voltage (except A9) Supply Voltage A9 Voltage Program Supply Voltage 1.5V with possible undershoot to –2. Symbol TA TBIAS TSTG VIO(2) VCC VA9(2) VPP Ambient Operating Absolute maximum ratings Parameter Temperature(1) Value –40 to 125 –50 to 125 –65 to 150 –2 to 7 –2 to 7 –2 to 13.5V with possible overshoot to VCC +2V for a period less than 20ns. Minimum DC voltage on Input or Output is –0. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Depends on range. 12/24 .

M27C256B DC and AC parameters 4 DC and AC parameters This section summarizes the operating and measurement conditions.4V 13/24 . AC testing input output waveform High Speed 3V 1.5V Standard ≤20ns 0. and the DC and AC characteristics of the device. Table 5.8V AI01822 0. AC measurement conditions High Speed Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref.4V 0. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Voltages ≤10ns 0 to 3V 1.0V 0. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.4V to 2.8V and 2V Figure 5.5V 0V Standard 2.4V 2.

6 VCC – 0. Capacitance(1) (2) Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF 1. VPP = VCC.DC and AC parameters Figure 6.5V. (TA = 25 °C. not 100% tested. –40 to 85°C.2V VPP = VCC –0. f = 5MHz E = VIH E > VCC – 0.3 2 Min Max ±10 ±10 30 1 100 100 0. Sampled only.3V M27C256B 1N914 3. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.7V Test Condition 0V ≤VIN ≤VCC 0V ≤VOUT ≤VCC E = VIL.8 VCC + 1 0. Symbol CIN COUT 2.4 Unit µA µA mA mA µA µA V V V V V 1. G = VIL. f = 1 MHz) Table 7. Symbol ILI ILO ICC ICC1 ICC2 IPP VIL VIH(3) VOL VOH Read mode DC characteristics(1) (2) Parameter Input Leakage Current Output Leakage Current Supply Current Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL Output High Voltage CMOS IOL = 2. TA = 0 to 70°C. AC testing load circuit 1. Maximum DC voltage on Output is VCC +0.3kΩ DEVICE UNDER TEST CL OUT CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance AI01823B Table 6. –40 to 105°C or –40 to 125°C.1mA IOH = –1mA IOH = –100µA 3. VCC = 5V ± 5% or 5V ± 10%. IOUT = 0mA. 2. 14/24 . 3.

25V ± 0. VCC = 6.M27C256B Table 8.75V ± 0.5 E = VIL –0.4 Unit µA mA mA V V V V V 1.8 VCC + 0. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.6 11. VPP = 12. 2.5 0. Symbol ILI ICC IPP VIL VIH VOL VOH VID DC and AC parameters Programming mode DC characteristics(1) (2) Parameter Input Leakage Current Supply Current Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL A9 Voltage IOL = 2. 15/24 .1mA IOH = –1mA 3.25V.5 12.3 2 Test Condition VIL ≤VIN ≤VIH Min Max ±10 50 50 0. TA = 25 °C.25V.

VPP = VCC 2. Speed obtained with High Speed AC measurement conditions. G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL. Sampled only. –40 to 85°C. ) Read mode AC characteristics(1) (2) M27C256B Test Condition Symbol Alt Parameter -45(3) -60 -70 -80 Unit Min Max Min Max Min Max Min Max tAVQV tELQV tGLQV tEHQZ(4) tGHQZ(4) tACC tCE tOE tDF tDF Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z E = VIL. G = VIL 0 0 45 45 25 25 25 0 0 60 60 30 30 30 0 0 70 70 35 30 30 0 0 80 80 40 30 30 ns ns ns ns ns tAXQX Address Transition tOH to Output Transition 0 0 0 0 ns 1. 3. –40 to 105°C or –40 to 125°C. 16/24 . A0-A14 M27C256B Read mode AC waveforms VALID tAVQV tAXQX VALID E tGLQV G tELQV Q0-Q7 tGHQZ Hi-Z tEHQZ AI00758B Table 9. VCC = 5V ± 5% or 5V ± 10%. not 100% tested. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. TA = 0 to 70°C.DC and AC parameters Figure 7. 4.

–40 to 85°C. not 100% tested. ) DC and AC parameters Read mode AC characteristics 2(1) (2) M27C256B Symbol Alt Parameter Test Condition -90 -10 -12 -15/-20/-25 Unit Max 150 150 ns ns Min Max Min Max Min Max Min tAVQV tELQV tACC tCE Address Valid to Output Valid Chip Enable Low to Output Valid E = VIL. –40 to 105°C or –40 to 125°C. G = VIL 0 0 0 0 ns 1. VPP = VCC 2. VCC = 5V ± 5% or 5V ± 10%. 3. Sampled only. TA = 0 to 70°C. 17/24 .M27C256B Table 10. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. G = VIL G = VIL 90 90 100 100 120 120 tGLQV tEHQZ(3) tGHQZ(3) Output Enable tOE Low to Output Valid tDF Chip Enable High to Output Hi-Z E = VIL 40 50 60 65 ns G = VIL 0 30 0 30 0 40 0 50 ns Output Enable tDF High to Output Hi-Z Address tOH Transition to Output Transition E = VIL 0 30 0 30 0 40 0 50 ns tAXQX E = VIL.

TA = 25 °C. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.25V ± 0. VCC = 6. 18/24 .25V. 2.75V ± 0. Symbol tAVEL tQVEL tVPHEL tVCHEL tELEH tEHQX tQXGL tGLQV tGHQZ tGHAX Programming mode AC characteristics(1) (2) Alt tAS tDS tVPS tVCS tPW tDH tOES tOE tDFP tAH Parameter Address Valid to Chip Enable Low Input Valid to Chip Enable Low VPP High to Chip Enable Low VCC High to Chip Enable Low Chip Enable Program Pulse Width Chip Enable High to Input Transition Input Transition to Output Enable Low Output Enable Low to Output Valid Output Enable High to Output Hi-Z Output Enable High to Address Transition 0 0 Test Condition Min 2 2 2 2 95 2 2 100 130 105 Max Unit µs µs µs µs µs µs µs ns ns ns 1.25V.DC and AC parameters Figure 8. A0-A14 tAVEL Q0-Q7 DATA IN tQVEL VPP tVPHEL VCC tVCHEL E tELEH G tQXGL tGLQV tEHQX DATA OUT M27C256B Programming and Verify modes AC waveforms VALID tGHQZ tGHAX PROGRAM VERIFY AI00759 Table 11. VPP = 12.

45 – 0.055 0.18 1.18 3.30 37. Drawing is not to scale.50 0.06 2. package mechanical data millimeters inches Max 5.437 – – 0.300 0.28 pin Ceramic Frit-seal DIP.11 – 4° 28 1.009 1.470 – – 0.41 1. package outline A2 A3 A1 B1 B D2 D S N ∅ 1 FDIPW-a A L α eA eB C e E1 E 1.526 – – 0.600 0. FDIP28WB .57 4.154 0.016 – 0.28 pin Ceramic Frit-seal DIP.36 – – 18.161 0.72 0.514 – – 0.34 – – 13.180 0.02 15.50 33.89 0.637 0. Table 12.022 – 0. with window.710 0.03 4.100 0.91 3.177 0.56 – 0.54 14.153 0.24 – – 13.M27C256B Package mechanical 5 Package mechanical Figure 9. with window (round 0.012 1.020 0.225 0.52 7.51 3.49 – 11° 0.060 – 4° 28 Typ Min Max 0.280").098 – 11° Symbol Typ A A1 A2 A3 B B1 C D D2 E E1 e eA eB L S ∅ α N Min 19/24 .280 0.99 – – 16.125 0.40 4.590 1.23 36. FDIP28WB .10 2.057 0.

070 0° 28 0.270 20/24 .6567 0.0091 1.240 13.540 15.Package mechanical Figure 10.480 – 15.0248 3.4598 – 0.810 0. package mechanical data millimeters Typ Min Max Typ 0.5984 0.720 2.5402 0.630 3.000 12.5000 – 0.050 4.08 10° 14.28 pin Plastic DIP.4402 – 0.680 0. Drawing is not to scale.5827 0.0177 0.230 36.700 – 14.080 – 1.200 16. PDIP28 .6000 0.0122 1.78 0° 28 2.310 37.300 1.020 15.5906 0. 600 mils width. 600 mils width.1750 0. package outline A2 A1 B1 B D2 D S N M27C256B A L α eA eB C e1 E1 1 E PDIP 1.580 – 0.1500 0.1000 0. Symbol PDIP28 .28 pin Plastic DIP.200 3.445 0.4500 1.570 0.082 10° 36.5984 0.800 15. Table 13.450 1.1201 0.830 33.0500 0.3000 0.1299 0.1799 inches Min Max A A1 A2 B B1 C D D2 E E1 e1 eA eB L S α N 4.5701 – 0.

223 – 0.11 14.89 – 32 12.78 7.32 pin Rectangular Plastic Leaded Chip Carrier.62 – 14.53 0.595 0.51 (.125 0. PLCC32 .026 Max 0.060 0.238 – – 0.400 0.86 13.020) 1.05 6.140 0.015 0. PLCC32 .16 1.485 0.66 – 15.93 – – 0.M27C256B Package mechanical Figure 11.585 0. package mechanical data millimeters inches Max 3.66 21/24 .050 0.32 pin Rectangular Plastic Leaded Chip Carrier.032 0.300 0.495 0.89 6.51 5.035 0.33 0.021 0. Drawing is not to scale.10 12.547 0.81 0.005 – Symbol Typ A A1 A2 B B1 CP D D1 D2 D3 E E1 E2 E3 e F R N Min 3.14 (.004 0.00 0.013 0.273 – – 0.17 1.27 – – 0.000 – 32 Typ Min 0.53 0.35 4.553 0.453 0.41 – 0.05 10.56 2.188 – 0.38 0.32 11. package outline D D1 1 N A1 A2 B1 E2 E3 E1 E e F 0. Table 14.095 – 0.57 11.447 0.045) D3 R CP A E2 B D2 D2 PLCC-A 1.13 – 0.

Part numbering M27C256B 6 Part numbering Table 15. etc) or for further information on any aspect of this device. High Speed. please contact the STMicroelectronics Sales Office nearest to you. see AC Characteristics section for further information. Example: Device Type M27 Supply Voltage C = 5V Device Function 256B = 256 Kbit (32Kb x 8) Speed -45 (1)= 45 ns -60 = 60 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns -20 = 200 ns -25 = 250 ns VCC Tolerance blank = ± 10% X = ± 5% Package F = FDIP28W B = PDIP28 C = PLCC32 Temperature Range 1 = 0 to 70 °C 3 = –40 to 125 °C 6 = –40 to 85 °C Options TR = Tape & Reel Packing 1. Ordering information scheme M27C256B -70 X C 1 TR For a list of available options (Speed. Package. 22/24 .

Figure 11. information moved).4 First Issue AN620 Reference removed PLCC codification changed (Table 15.) Document converted to new template (sections added.) FDIP28W mechanical dimensions changed (Table 12. PLCC32 (Table 14.3 1. TSOP28 package removed.1 1. Revision Details 18-May-2006 2 23/24 .) and TSOP28 (Table 15.M27C256B Revision history 7 Revision history Table 16. Packages are ECOPACK® compliant..2 1..) Package mechanical data clarified for PDIP28 (Table 13. X option removed from Table 15: Ordering information scheme. Date July 1998 20-Sep-2000 29-Nov-2000 02-Apr-2001 29-Aug-2002 Document revision history Version 1.0 1.). Figure 13.

COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. and the products and services described herein at any time.All rights reserved STMicroelectronics group of companies Australia . corrections. OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). to any intellectual property rights is granted under this document. to this document.Singapore .United States of America www.Japan Malaysia . Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST. All other names are the property of their respective owners. without notice. Information in this document supersedes and replaces all information previously supplied.Brazil . ST PRODUCTS ARE NOT DESIGNED. OR INFRINGEMENT OF ANY PATENT.Hong Kong . If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services.Sweden . LIFE SAVING.China .Belgium .United Kingdom . The ST logo is a registered trademark of STMicroelectronics. © 2006 STMicroelectronics .M27C256B Please Read Carefully: Information in this document is provided solely in connection with ST products. by estoppel or otherwise.Spain . any liability of ST. modifications or improvements. AUTHORIZED OR WARRANTED FOR USE IN MILITARY. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes. AIR CRAFT.Germany . All ST products are sold pursuant to ST’s terms and conditions of sale.India .Italy .Finland .Malta . UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY. and ST assumes no liability whatsoever relating to the choice. express or implied. NOR IN PRODUCTS OR SYSTEMS. selection and use of the ST products and services described herein.France . ST and the ST logo are trademarks or registered trademarks of ST in various countries.Israel .Morocco . or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.Switzerland . OR LIFE SUSTAINING APPLICATIONS.com 24/24 . WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY. DEATH. Purchasers are solely responsible for the choice.st. selection or use of the ST products and services described herein. SPACE.Czech Republic .Canada . No license.

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