WELCOME

# MICROELECTROMECHANICAL # SYSTEM (MEMS) A FUTURE TECHNOLOGY
PRESENTED BY : APPU KUMAR PANDEY 3RD YEAR ELECTRICAL ENGG.

AIM OF PRESENTATION
TO INTRODUCE ABOUT MEMS TECHNOLOGY

TO INTRODUCE MEMS DESIGN PROCESS

APPLICATIONS, ADVANTAGES,DISADVANTAGES AND CURRENT CHALLENGES OF MEMS

INTRODUCTION
WHAT ARE MEMS?? MICRO ELECTRO MECHANICAL SYSTEMS
SMALL SIZE,MICRO FABRICATED STRUCTURES ELECTRICAL SIGNAL/CONTROL (IN/OUT) MECHANICAL FUNCTIONALITY (OUT/IN) STRUCTURES,DEVICES AND SYSTEMS

WHAT IS SIZE OF MEMS??
THEY RANGE IN SIZE FROM SUB MICRON LEVEL TO THE MILLIMETER LEVEL, AND THERE CAN BE ANY NUMBER FROM A FEW TO MILLION

MEMS MATERIALS
SILICON :
READILY AVAILABLE, HIGH QUALITY, ABILITY TO INCORPORATE ELECTRONIC FUNCTIONALITY

POLYMERS :
MEMS CAN BE MADE BY PROCESSES SUCH AS MOLDING,EMBOSSING STEREO LITHO GRAPHY ETC.

METALS :
GOLD,NICKEL ALUMINIUM,COPPER,CHROMIUM ,TITANIUM ,COPPER,SILVER ETC.

MEMS BASIC PROCESSES
DEPOSITION

PATTERNING

MEMS BASIC PROCESSES

ETCHING

DEPOSITION : THE ABILITY TO DEPOSIT THIN FILMS OF A MATERIAL ON A SUBSTRATE

PATTERNING/LITHOGRAPHY : TO APPLY A PATTERNED MASK ON TOP OF THE FILMS BY PHOTOLITHOGRAPHIC IMAGING

ETCHING: TO ETCH THE FILMS SELECTIVELY TO THE MASK

TYPES OF DEPOSITION
PHYSICAL VAPOUR DEPOSITION (PVD) PROCESS IN WHICH A TARGET IS REMOVED FROM A MATERIAL AND DEPOSITED ON A SURFACE .PROCESS OF SPUTTERING IS INVOLVED CHEMICAL VAPOUR DEPOSITION (CVD) IT INCLUDES CHEMICAL DEPOSITION IN WHICH A STREAM OF SOURCE GAS REACTS ON A SUBSTRATETO GROW ON DESIRED MATERIAL

TYPES OF LITHOGRAPHY
ELECTRON BEAM LITHOGRAPHY PRACTICE OF SCANNING A BEAM OF ELECTRONS IN A PATTERN FASHION ACROSS A SURFACE COVERED WITH A FILM X-RAY LITHOGRAPHY IT INCLUDES X-RAYS TO TRANSFER A GEOMETRIC PATTERN FROM A MASK TO LIGHT SENSITIVE MATERIAL ION BEAM LITHOGRAPHY HAS CAPABILITY TO WRITE EXTREMLY FINE LINES

ETCHING PROCESS
WET ETCHING
SELECTIVE REMOVAL OF MATERIAL BY DIPPING A SUBSTRATE INTO A SOLUTION THAT DISSOLVES IT.CHEMICAL NATURE OF ETCHING PROCESS PROVIDES A GOOD SELECTIVITY

DRY ETCHING
MATERIAL IS SPUTTERED/DISSOLVED USING REACTIVE IONS OR VAPOUR PHASE ETCHANT

XENON DIFLUORIDE ETCHING PLASMA ETCHING

APPLICATIONS
INKJET PRINTERS USES PIEZOELECTRIC EJECTION TO DEPOSIT INK ACCELEROMETERS AIR BAG DEPLOYMENT CONSUMER ELECTRONIC DEVICES GAME CONTROLS, PERSONAL CELLPHONES,DIGITAL CAMERAS MEMS GYROSCOPES IN MODERN CARS TO DETECT YAWS SILICON PRESSURE SENSORS CAR TIRES PRESSURE SENSORS,DISPOSABLE BLOOD PRESSURE SENSORS OPTICAL SWITCHING TECHNOLOGY FOR SWITCHING TECHNOLOGY AND DATA TECHNOLOGY DISPLAYS PROJECTORS BASED ON MICROMIRRORS HEALTH/MEDICAL BIOSENSORS, MICRONEEDLES, BLOOD PRESSURE SENSORS

MEMS AS STORAGE DEVICE AS FLASH MEMORY UNITS, SMART SENSORS

INDUSTRY STRUCTURE
GLOBAL MARKET 2006 ± $40 MILLION 2011 - $72 MILLION ACCELEROMETERS 2011 ± 22% OF TOTAL MARKET OPTICAL MEMS 2010 ± 20% OF MARKET MEMS PRESSURE SENSORS 2010 ± 18% OF MARKET MEMS INKJET HEADS 1.8$ OR 40% OF MARKET

ADVANTAGES
MINIMIZES ENERGY AND MATERIALS IMPROVES REPRODUCIBILITY HIGH PERFORMANCE GREATER ACCURACY AND RELIABILITY LITTLE HARM TO ENVIRONMENT EXPANDED DATA GATHERING AND SENSING EASY TO INTEGRATE INTO SYSTEMS

DISADVANTAGES
FARM ESTABLISHMENT REQUIRES HUGE INVESTMENT MICRO COMPONENTS ARE COSTLY PRIOR KNOWLEDGE IS REQUIRED TO HANDLE MEMS NOT WIDELY ACCEPTED DESIGN INCLUDES COMPLEX PROCEDURES

CURRENT CHALLENGES
LIMITED OPTIONS LIMITED OPTIONS FOR MANUFACTURING AND PROTOTYPING DUE TO HIGH INVESTMENT A MECHANISM IS ESSENTIAL FOR SMALLER ORGANISATION TO HAVE AFFORDABLE ACCESS PACKAGING NEED TO IMPROVE FROM ITS PRIMITIVE STATE MORE CHALLENGING THAN IC PACKING DUE TO SMALLER EQUIPMENTS FABRICATION KNOWLEDGE REQUIRED REQUIRES HIGH LEVEL OF FABRICATION KNOWLEDGE IN ORDER TO CREATE A SUCCESSFUL DESIGN

THE FUTURE
HAS POTENTIAL TO CHANGE OUR DAILY LIVES AS MUCH AS COMPUTER HAS. MATERIALS USED FOR MEMS ARE AT PRELIMINARY STAGE NEEDS PROPER ATTENTION AND UNDERSTANDING

FUTURE MEMS WILL HAVE GREATER FUNCTIONALITY MEMS WILL BE EMBEDDED INTO LARGER NONMEMS COMPONENTS SUCH AS AUTOMOBILES AND BIO MEDICAL EQUIPMENTS

CONCLUSION
VARIOUS FIELDS ARE AFFECTED BY MEMS LIKE 1.MEDICAL 2.WIRELESS TECHNOLOGY 3.BIOTECHNOLOGY 4.COMPUTER 5.AUTOMOTIVE INDUSTRIES 6.AEROSPACE INDUSTRIES

IT PROMISES TO REVOLUTIONIZE NEARLY EVERY PRODUCT CATEGORY BY COMBINING SILICON BASED MICROELECTRONICS WITH ICROMACHINING TECHNOLOGY (SYSTEM ON A CHIP)

REFERENCES
ONLINE RESOURCES : BSAC http://www-bsac.eecs.berkeley.edu/ DARPA MTO http://www.darpa.mil/mto/ IEEE Explore http://ieeexplore.ieee.org/Xplore/DynWel.jsp Introduction to Micro engineering http://www.dbanks.demon.co.uk/ueng/ MEMS Clearinghouse http://www.memsnet.org/ MEMS Exchange http://www.mems-exchange.org/ MEMS Industry Group http://www.memsindustrygroup.org/ MOSIS http://www.mosis.org/ MUMPS http://www.memscap.com/memsrus/crmumps.html Stanford Centre for Integrated Systems http://wwwcis.stanford.edu/ USPTO http://www.uspto.gov/ Trimmer http://www.trimmer.net/

JOURNALS: Journal of Micromechanical Systems , Journal of Micromechanics and Micro engineering Micro machine Devices Sensors Magazine

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