MAX3232 3 V TO 5.

5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION
SLLS410I − JANUARY 2000 − REVISED JANUARY 2004

D RS-232 Bus-Pin ESD Protection Exceeds D D D D D D D D D

±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 µA Typical External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) − SNx5C3232 Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment

D, DB, DW, OR PW PACKAGE (TOP VIEW)

C1+ V+ C1− C2+ C2− V− DOUT2 RIN2

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10 9

VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2

description/ordering information
ORDERING INFORMATION
TA SOIC (D) SOIC (DW) −0°C to 70°C SSOP (DB) TSSOP (PW) SOIC (D) SOIC (DW) −40°C to 85°C SSOP (DB) TSSOP (PW) PACKAGE† Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 Tube of 80 Reel of 2000 Tube of 90 Reel of 2000 Tube of 40 Reel of 2500 Tube of 40 Reel of 2000 Tube of 80 Reel of 2000 Tube of 90 Reel of 2000 ORDERABLE PART NUMBER MAX3232CD MAX3232CDR MAX3232CDW MAX3232CDWR MAX3232CDB MAX3232CDBR MAX3232CPW MAX3232CPWR MAX3232ID MAX3232IDR MAX3232IDW MAX3232IDWR MAX3232IDB MAX3232IDBR MAX3232IPW MAX3232IPWR MB3232I MB3232I MAX3232I MAX3232I MA3232C MA3232C MAX3232C MAX3232C TOP-SIDE MARKING

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright  2004, Texas Instruments Incorporated

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

1

The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. L = low level.SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 MAX3232 3 V TO 5. two line receivers. Open = input disconnected or connected driver off logic diagram (positive logic) 11 DIN1 10 DIN2 12 ROUT1 9 ROUT2 8 RIN2 13 RIN1 7 DOUT2 14 DOUT1 2 POST OFFICE BOX 655303 • DALLAS.5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION description/ordering information (continued) The MAX3232 device consists of two line drivers. TEXAS 75265 . L = low level EACH RECEIVER INPUT RIN L H Open OUTPUT ROUT H L H H = high level. The charge pump and four small external capacitors allow operation from a single 3-V to 5. and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins. including GND).5-V supply. The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. Function Tables EACH DRIVER INPUT DIN L H OUTPUT DOUT H L H = high level.

. . . . . . . . . . . . . . . . NOTE 4: Test conditions are C1−C4 = 0. VCC (see Note 1) . . . . . . . . . . . . . . . . . .3 V or VCC = 5 V. .3 V VCC = 5 V VCC = 3. .6 5. .5 V UNIT NOTE 4: Test conditions are C1−C4 = 0. . .1 µF at VCC = 3. . . . . electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER ICC TEST CONDITIONS MIN TYP‡ MAX 1 UNIT mA Supply current No load. . . . . . . . . . . . . . .3 5 MAX 3. . . . . . . . . . . . . . . 13 V Input voltage range. . . . . 57°C/W PW package . . . . . . . . . . . . . . . . . . . . .3 V to 6 V Receivers . . . . . . . . 2. . . . . . . . . . . . . . . . . . . . . Maximum power dissipation is a function of TJ(max). . . .3 V or 5 V 0. . . . . . . . .3 V to 7 V Negative output supply voltage range. .3 V. . . . . . θJA (see Notes 2 and 3): D package . . C2−C4 = 0. . . . −13. . . .3 V to 6 V Positive output supply voltage range. . . . . . . . . . . . . . . . . . . . . . . 82°C/W DW package . . . . . . . . . . . . . . . . . . . . .1 µF at VCC = 3. . . . .3 V Package thermal impedance. . . The package thermal impedance is calculated in accordance with JESD 51-7. . . .5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range. . . . . . V+ (see Note 1) . . . −0. . . . . . . . . .3 ‡ All typical values are at VCC = 3. . −0. . . . . . . . . . TJ . . . . . . . . . . . .047 µF. . . . . . . . . . . . . . . . . . . . . . . . . Tstg . . . . . . . . . . . recommended operating conditions (see Note 4 and Figure 4) MIN Supply voltage VIH VIL VI TA Driver high-level input voltage Driver low-level input voltage Driver input voltage Receiver input voltage MAX3232C Operating free-air temperature MAX3232I DIN VCC = 3. V− (see Note 1) . . . . . . VO: Drivers .3 V. . . . . . . −0. . . . . . . . . . . θJA. . . . .5 V. . . . . These are stress ratings only. . . . . . .3 V to −7 V Supply voltage difference. . . . . . . . . . . . . . . . .3 V ± 0. . . . POST OFFICE BOX 655303 • DALLAS. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. −0. . . . . .3 V VCC = 5 V DIN DIN 3 4. . . . . . . . . . . . . . . . . . . . . .2 V to 13.8 0 −25 0 −40 5. . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. . VCC = 3. . . . . . . . . . .3 V to VCC + 0. . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. . C2−C4 = 0. . .4 0. . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . All voltages are with respect to network GND. . . . . . . . . . . . . . . −25 V to 25 V Output voltage range. . . . . . . . . . . . . . . . . . . . . . . .2 V Receivers . . . . . . . . . . and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. . . . . . . . . . . . . . C1 = 0. . . . . 3. . . . . . . and TA = 25°C. . . . . 108°C/W Operating virtual junction temperature. . . . .047 µF. . . C1 = 0.3 V ± 0. . . . . . TEXAS 75265 3 . . . . . . . .33 µF at VCC = 5 V ± 0. . . . . 150°C Storage temperature range. . . VI: Drivers . . . . . . . Operating at the absolute maximum TJ of 150°C can affect reliability. . . . . . . . . . and TA. . . . . .MAX3232 3 V TO 5. . . . . NOTES: 1. . . . V+ − V− (see Note 1) . . . . . . . . .5 V. . . . . . . .5 2 2. . . . . . . .5 25 70 85 V °C V V NOM 3. . . . . . 0. . . . . . . . .33 µF at VCC = 5 V ± 0. . .

VO = 0 V VO = 0 V DIN = GND DIN = VCC MIN 5 −5 TYP† 5.047 µF.3 V.3 V RL = 3 kΩ. CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ. VO = ±2 V 300 10M W † All typical values are at VCC = 3.SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 MAX3232 3 V TO 5. DOUT at RL = 3 kΩ to GND.01 ±0. V+.1 µF at VCC = 3. NOTE 4: Test conditions are C1−C4 = 0. NOTE 4: Test conditions are C1−C4 = 0.4 −5. and TA = 25°C. TEXAS 75265 . and V− = 0 V. See Figure 1 RL = 3 kΩ to 7 kΩ. One DOUT switching. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. 4 POST OFFICE BOX 655303 • DALLAS. VI = VCC VI at GND VCC = 3.3 V ± 0.33 µF at VCC = 5 V ± 0.5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL IIH IIL IOS‡ High-level output voltage Low-level output voltage High-level input current Low-level input current Short-circuit output current TEST CONDITIONS DOUT at RL = 3 kΩ to GND. and not more than one output should be shorted at a time. VCC = 3. ‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings.3 V or VCC = 5 V.3 V or VCC = 5 V.4 ±0.5 V. See Figure 2 CL = 150 pF to 1000 pF CL = 150 pF to 2500 pF 6 4 MIN 150 TYP† 250 300 30 30 MAX UNIT kbit/s ns V/µs † All typical values are at VCC = 3. C1 = 0. transition region (see Figure 1) TEST CONDITIONS CL = 1000 pF. C1 = 0.6 V.3 V ± 0. C2−C4 = 0. C2−C4 = 0.1 µF at VCC = 3.33 µF at VCC = 5 V ± 0.5 V.3 V. VCC = 5. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER Maximum data rate tsk(p) SR(tr) Pulse skew§ Slew rate.047 µF.01 ±35 ±1 ±1 ±60 MAX UNIT V V µA µA mA ro Output resistance VCC. and TA = 25°C.5 V.

C2−C4 = 0.5 V 0V tTLH VOH VOL t THL NOTES: A. TEXAS 75265 5 .to low-level output Pulse skew‡ CL= 150 pF TEST CONDITIONS MIN TYP† 300 300 300 MAX UNIT ns ns ns † All typical values are at VCC = 3. and TA = 25°C.5 V.4 1. Figure 1. C2−C4 = 0.3 V ± 0.5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL VIT+ VIT− Vhys ri High-level output voltage Low-level output voltage Positive-going input threshold voltage Negative-going input threshold voltage Input hysteresis (VIT+ − VIT−) Input resistance TEST CONDITIONS IOH = −1 mA IOL = 1. B.33 µF at VCC = 5 V ± 0. Driver Slew Rate POST OFFICE BOX 655303 • DALLAS.33 µF at VCC = 5 V ± 0. tf ≤ 10 ns.3 7 V V kW 2.2 1. ZO = 50 Ω.3 V.5 V 1.3 V ± 0.1 µF at VCC = 3. high.3 V VCC = 5 V 0. C1 = 0. low. NOTE 4: Test conditions are C1−C4 = 0.8 1.5 1. and TA = 25°C.5 0. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3) PARAMETER tPLH tPHL tsk(p) Propagation delay time. PARAMETER MEASUREMENT INFORMATION Input Generator (see Note B) RS-232 Output 50 Ω RL CL (see Note A) Output TEST CIRCUIT tTHL 3V −3 V SR(tr) + 6V or t VOLTAGE WAVEFORMS TLH 3V −3 V 3V 1. CL includes probe and jig capacitance.047 µF. tr ≤ 10 ns.3 V. 50% duty cycle.6 V TYP† VCC−0.047 µF. The pulse generator has the following characteristics: PRR = 250 kbit/s.MAX3232 3 V TO 5.6 mA VCC = 3.1 V 0. C1 = 0.5 V.3 V or VCC = 5 V.1 µF at VCC = 3.3 V or VCC = 5 V.4 2.8 MIN VCC−0.to high-level output Propagation delay time. ‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.3 V VCC = 5 V VCC = 3.6 0.4 V MAX UNIT V V VI = ±3 V to ±25 V 3 5 † All typical values are at VCC = 3. NOTE 4: Test conditions are C1−C4 = 0.

Receiver Propagation Delay Times 6 POST OFFICE BOX 655303 • DALLAS. tr ≤ 10 ns. tf ≤ 10 ns. B. The pulse generator has the following characteristics: ZO = 50 Ω.5 V −3 V tPLH VOH 50% VOLTAGE WAVEFORMS 50% VOL NOTES: A. Figure 2. TEXAS 75265 . The pulse generator has the following characteristics: PRR = 250 kbit/s.5 V 1. 50% duty cycle.5 V 0V tPLH VOH 50% VOL NOTES: A. Figure 3. tr ≤ 10 ns. 50% duty cycle. Driver Pulse Skew Input Output Generator (see Note B) 50 Ω CL (see Note A) Output TEST CIRCUIT tPHL 3V 1.SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 MAX3232 3 V TO 5. CL includes probe and jig capacitance. tf ≤ 10 ns.5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL CL (see Note A) Output TEST CIRCUIT Input tPHL 50% VOLTAGE WAVEFORMS 1. CL includes probe and jig capacitance.5 V 1. B. ZO = 50 Ω.

VCC vs CAPACITOR VALUES VCC 3.1 µF 0.3 V 5 V ± 0.5 V MULTICHANNEL RS 232 LINE DRIVER/RECEIVER WITH ±15 kV ESD PROTECTION SLLS410I − JANUARY 2000 − REVISED JANUARY 2004 APPLICATION INFORMATION 1 VCC 16 + CBYPASS − = 0. Typical Operating Circuit and Capacitor Values POST OFFICE BOX 655303 • DALLAS. NOTES: A.47 µF Figure 4. B.33 µF 0. C3. Nonpolarized ceramic capacitors are acceptable.047 µF 0. If polarized tantalum or electrolytic capacitors are used. TEXAS 75265 7 .5 V C1 0.3 V ± 0. they should be connected as shown.5 V 3 V to 5.1 µF 0.1 µF C2.MAX3232 3 V TO 5. C4 0. Resistor values shown are nominal.1µF 2 †+ C3 − 3 V+ GND 15 C1+ + C1 − 14 C1− 13 C2+ 5 kΩ DOUT1 4 + C2 − RIN1 5 C2− 12 6 C4 DOUT2 − + 7 10 DIN2 V− 11 ROUT1 DIN1 RIN2 8 5 kΩ 9 ROUT2 † C3 can be connected to VCC or GND.

com 14-Aug-2009 PACKAGING INFORMATION Orderable Device MAX3232CD MAX3232CDB MAX3232CDBE4 MAX3232CDBG4 MAX3232CDBR MAX3232CDBRE4 MAX3232CDBRG4 MAX3232CDE4 MAX3232CDG4 MAX3232CDR MAX3232CDRE4 MAX3232CDRG4 MAX3232CDW MAX3232CDWG4 MAX3232CDWR MAX3232CDWRG4 MAX3232CPW MAX3232CPWE4 MAX3232CPWG4 MAX3232CPWR MAX3232CPWRE4 MAX3232CPWRG4 MAX3232ID MAX3232IDB MAX3232IDBE4 Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SSOP SSOP SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP SOIC SSOP SSOP Package Drawing D DB DB DB DB DB DB D D D D D DW DW DW DW PW PW PW PW PW PW D DB DB Pins Package Eco Plan (2) Qty 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 40 80 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 40 40 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 40 40 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 90 90 90 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 40 80 80 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Addendum-Page 1 .PACKAGE OPTION ADDENDUM www.ti.

com 14-Aug-2009 Orderable Device MAX3232IDBG4 MAX3232IDBR MAX3232IDBRE4 MAX3232IDBRG4 MAX3232IDE4 MAX3232IDG4 MAX3232IDR MAX3232IDRE4 MAX3232IDRG4 MAX3232IDW MAX3232IDWE4 MAX3232IDWG4 MAX3232IDWR MAX3232IDWRE4 MAX3232IDWRG4 MAX3232IPW MAX3232IPWE4 MAX3232IPWG4 MAX3232IPWR MAX3232IPWRE4 MAX3232IPWRG4 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SSOP SSOP SSOP SSOP SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP Package Drawing DB DB DB DB D D D D D DW DW DW DW DW DW PW PW PW PW PW PW Pins Package Eco Plan (2) Qty 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 80 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 40 40 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 2500 Green (RoHS & no Sb/Br) 40 40 40 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 90 90 90 Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Addendum-Page 2 . or Green (RoHS & no Sb/Br) .ti. and a lifetime-buy period is in effect. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan . LIFEBUY: TI has announced that the device will be discontinued.com/productcontent for the latest availability information and additional product content details. Samples may or may not be available. Pb-Free (RoHS Exempt). NRND: Not recommended for new designs.please check http://www. Device is in production to support existing customers. but TI does not recommend using this part in a new design.PACKAGE OPTION ADDENDUM www. PREVIEW: Device has been announced but is not in production.ti.The planned eco-friendly classification: Pb-Free (RoHS).

TI and TI suppliers consider certain information to be proprietary. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.com 14-Aug-2009 TBD: The Pb-Free/Green conversion plan has not been defined. -. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Where designed to be soldered at high temperatures.The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.1% by weight in homogeneous materials. and peak solder temperature.ti. Aerospace and Medical Applications Addendum-Page 3 . TI bases its knowledge and belief on information provided by third parties.PACKAGE OPTION ADDENDUM www. OTHER QUALIFIED VERSIONS OF MAX3232 : • Enhanced Product: MAX3232-EP NOTE: Qualified Version Definitions: • Enhanced Product . Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. Peak Temp. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. Efforts are underway to better integrate information from third parties. and thus CAS numbers and other limited information may not be available for release.Supports Defense. and makes no representation or warranty as to the accuracy of such information.1% by weight in homogeneous material) (3) MSL. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible). TI Pb-Free products are suitable for use in specified lead-free processes. including the requirement that lead not exceed 0. or 2) lead-based die adhesive used between the die and leadframe. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances.

7 5.6 P1 (mm) 12.0 330.4 16.2 10.0 8.6 10.1 2.5 2.ti.0 8.0 16.0 6.0 12.4 12.0 330.0 W Pin1 (mm) Quadrant 16.4 8.4 12.0 330.9 8.6 K0 (mm) 2.75 7.0 Q1 Q1 Q1 Q1 Q1 Q1 Q1 Q1 MAX3232CDBR MAX3232CDWR MAX3232CPWR MAX3232CPWR MAX3232IDBR MAX3232IDR MAX3232IDWR MAX3232IPWR 2000 2000 2000 2000 2000 2500 2000 2000 Pack Materials-Page 1 .0 16.3 10.0 330.0 12.0 16.5 2.6 1.0 8.7 1.0 330.0 16.0 12.0 12.9 B0 (mm) 6.6 6.6 5.4 16.0 16.0 330.6 2.4 16.7 1.0 330.com 8-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SSOP SOIC TSSOP TSSOP SSOP SOIC SOIC TSSOP DB DW PW PW DB D DW PW 16 16 16 16 16 16 16 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.6 10.0 12.4 12.2 6.75 6.4 16.0 8.PACKAGE MATERIALS INFORMATION www.0 12.5 10.7 5.

0 Width (mm) 346.0 364.0 29.0 346.0 28.0 346.0 346.0 346.0 346.0 364.2 346.6 33.0 345.0 33.PACKAGE MATERIALS INFORMATION www.com 8-Jul-2011 *All dimensions are nominal Device MAX3232CDBR MAX3232CDWR MAX3232CPWR MAX3232CPWR MAX3232IDBR MAX3232IDR MAX3232IDWR MAX3232IPWR Package Type SSOP SOIC TSSOP TSSOP SSOP SOIC SOIC TSSOP Package Drawing DB DW PW PW DB D DW PW Pins 16 16 16 16 16 16 16 16 SPQ 2000 2000 2000 2000 2000 2500 2000 2000 Length (mm) 346.0 27.ti.0 Pack Materials-Page 2 .0 346.0 346.9 346.0 33.0 346.0 29.0 333.0 Height (mm) 33.

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05 MIN 0.95 0.22 15 0. This drawing is subject to change without notice.MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) 28 PINS SHOWN 0.50 12.90 6.90 A MIN 5.55 Seating Plane 2.25 0. B.50 7. Body dimensions do not include mold flash or protrusion not to exceed 0.09 5.40 Gage Plane 1 A 14 0°– 8° 0.60 5.00 MAX 0. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS.20 7.15 M PLASTIC SMALL-OUTLINE 0.30 4040065 /E 12/01 NOTES: A.90 7.38 0.00 8. All linear dimensions are in millimeters.25 0.10 PINS ** DIM A MAX 14 16 20 24 28 30 38 6.50 8.65 28 0.90 9.50 10.90 5.90 9.50 10.90 12.15. C. D.50 6. TEXAS 75265 .

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