Flex Manufacturing Concepts

Based on a Model completed for the United States Display Consortium (USDC) Titled, Flexible Microelectronics and Roll-to-Roll
Processing Study
AGI Abbie Gregg, Inc.

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Lara York
AGI: VP Advanced Technology
BS Engineering United States Military Academy, West Point MS Systems Management USC Co-Author : Roll to roll manufacturing of Flexible Displays

AGI: Abbie Gregg, Inc High Technology Consulting for 20 years Semi Conductor Nanotechnology Biotechnology
Based in Tempe, Arizona

Background:
Critical Steps in Modeling of Factories for Cost Reduction, Yield Improvement and Output for Flexible Displays and Electronics The race is on to get new applications to market. How do I insure time to market and a successful product launch?
Presented by: Lara York, Vice President Advanced Technology

Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906
Images courtesy of E Ink, Citala, Aveso Displays, Estee Lauder
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Case Studies
Touch Screen-Digitizer
Moving from sheet process in development to either tech transfer to a production line OR outsource to remote foundry
Flexible Reflective Display

Moving from small lab R&D to manufacturing in nearby factory
Flexible Battery
Moving from medium scale sheet based production to high volume, low cost production at several worldwide sites

The Existing Lab Setup

Slow Sheets Manual

Image courtesy of Display Science 6 of 138
Vision of the Roll to Roll Line

Clean Automated High Yield
Images courtesy of Northfield Automation and Creo, Inc. 7 of 138
Baseline Existing/Proposed Processing

List each process (travelers are helpful)
Dont skip even the most trivial step List off line support steps (premixing of inks, pre cut of laminated materials, etc. etc.)
List associated tools and equipment List process parameters

Pareto the most critical parameters for each step- work on top 3 Include
Observations of products- metrology tools and criteria Environmental conditions Settings on equipment Expected defects and faults
List process times (set up, wait time, process) List materials Obtain cost data (equipment, materials, labor, overhead etc)

Example of Process Detail Needed
Etch Process C- Lab process that needs to be scaled up:

Immersion in an etch solution Immersion in DI water baths Rinsing with DI water Drying in the oven Etch process details
Etchant: Hypochlorite solution 2. Temp = 25C3. Time= 45 sec
We do this in our lab in a plastic bath 3 baths one after the other first bath 20 sec, second bath 20 sec, third bath 1 min (Do you know why?) Requires Shaking the film/bath in each stage (video the motions)
Observations:
The material swells in water and becomes sensitive to mechanical stress QC Test etched lines:
Resistance x : 300 Kohm 30 Kohm Resistance between lines: greater than 5Mohm

Process Detail Needed for Lamination

Lamination
Position the y substrate on a milimetric paper Clean with antistatic spray Laminate PSA to the y substrate using an antistatic gun and a laminating roller at Pressure A +/- a, temperature B+/-b Remove PSA residue around the substrate y using a sharp knife Position the film x to film y using positioning aid #1 Remove PSA liner and lamination of film x using antistatic gun and lamination roller. Clean upper side of film with antistatic spray
Parameters
Class 100 Clean Room (probably we can use 1000 but never been tested).
Material type: Adhesives Research PSA1 Equipment

Antistatic spray Laminating roller Antistatic gun Sharp knife Milimetric paper
Positioning aid #1 - Works for specific product dimensions.
Images courtesy of confidential clients 10 of 138
Ask the People Who Inspect the Product

Inspectors see more than they record Identify processes/to ols and materials not on the traveler
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Capture All Visual Aids in Production

Crisp definition of failing and passing units. Communicate to offshore foundries with photos.

Image courtesy of confidential client 12 of 138
Notes on Product Dimensions R&D

Be sure to capture values and engineering comments and any engineering evaluation steps
Registration marks.

Observe Two Different Operators, Especially Manual Tool Setups
Pilot for automation may reveal new variables Operators may not support automation at first
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Baseline Existing Materials

Materials Control
Know your vendors
Who supplies them? What percentage of their volume does your product represent? Now? In a year? Can they ramp fast? Does your product push the statistical control of their product specification? Do the distribution of requirements overlap? Is there a guard band? Have a relationship with at least 2 suppliers for each critical material
Keep looking, dont give up
What new features in the materials would make your next steps easier? How can you evaluate these NOW? Can you and are you identifying lots, batches of material? Do you understand how your suppliers manufacture and qualify their lots? How do you plan to qualify /trace materials in your line?
Risks of multiple simultaneous qualifications are multiplicative if not exponential! Mass markets tolerate few glitches in supply!
Baseline Existing Processing

Device tolerances Define critical parameters
Establish a realistic tolerance for each Add up cumulative tolerances - draw out and review any cumulative mechanical tolerances Plan for iterative product design Create guard bands for all critical tolerances and most secondary tolerances
Define tolerances for each tool/equipment Verify that cumulative tolerances match: Device to equipment Registration Registration Registration
Make Alignment Keys with Metrology
1st Layer: Initial Pattern 2nd Layer: Perfect! 3rd Layer: Misaligned
Image enhanced to show misalignment.

Printer Settings Variables

Know every setting Know tooling parameters
Images courtesy of Litrex Corporation and confidential client 18 of 138
Manufacturing Scale Up Plan

Sheet to roll transition THE BIG STEP
Dont change too many things at once
Product size Product complexity (minimum geometry, registration, number of layers) Sheet size to roll size Tool/equipment type Process method Facility conditions: temperature, relative humidity
Be sure your material handling and tool suppliers understand the product geometry and cleanliness required Do a rigorous layout to be sure equipment and support equipment will fit and be accessible for maintenance. Match rates throughout the system based on number of passes- use a mathematical model.

Layout Space for Tools

Think about maintainability when linking several processes in a roll to roll line Maintenance and Operator Set Back
Image courtesy of PowerPaper / Graphic Solutions, Inc. 20 of 138
Use Vertical Space Wisely

Multi-level roll to roll lines are common Cleanliness and maintenance need to be planned

Technology transfer goals and techniques: Goal is timely start up and yielding product no later than 3rd lot/roll. No surprises regarding product performance in the field. Capability to run 1 Million products per month. More than 10,000 square feet per week in first year.
Techniques: Rigorous tool acceptance

Bring materials and test plan to tool vendors Source inspect Test runs at vendor site
Compare foundry baselines to in house/lab process

Short loop test all different steps Develop metrology to verify product parameters
Simulate roll to roll process with sheets

Use partially completed product staged Keep good product at 30% of process steps spread throughout process to pinpoint failure point: 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15
Stage product at these steps.


How factory and cost modeling can help
Keep track of tools and equipment, and associated parameters including thruput, depreciation and maintenance costs, and required personnel Separate material handling from process costs, space and thruput Keep track of recipes separately from tools to allow mix and match scenarios and change in process flows Keep track of material usage and cost- optimize device size and configuration to eliminate costly raw material waste Be able to vary minor elements and see thruput, cycle time and yield responses Obtain costs per square foot or cost per device Compare roll to roll and sheet based costs, space, headcount, tool sets. Determine where wind/unwind stations should be located, based on thruput matching.

Critical issues in materials supply Waste in roll format vs. Sheet format Slip sheet and protection materials used during processing are critical in most roll to roll products.
Can be costly Can require additional equipment and process steps
Storage and preprocessing of materials

Environmental control organic materials Shelf life Cross contamination

Half meter wide web, scale up of sheet process, multiple lines.
Waste From Roll to Roll Processing

Up to 50% waste is possible Need careful product design, recycle if possible
Capital equipment options for scale up -Timing, cost, and potential pitfalls Sections of the process where roll to roll can be effectively started:
Vacuum deposition- PVD Screen printing Laminating Punching Picking and placing Drying and curing
Process sections with critical alignment and registration will be most difficult.

Curing and Drying in Roll Format Oven

Engineered to have high degree of control and minimize space


Worldwide partnering strategies Find partners with core skills that you need
Printers Makers of plastic film Converters Materials experts: fabric, paper, foils Cleanliness and cleaning experts Test and measurement of electronic devices including test device design
Develop a collaboration strategy for tool and material vendors. Provide real materials to be tested on tools under development. License product with critical specs defined, but less than specific processes defined to capitalize on partner ideas for processing.
Creative Scale Up Approach

To make a million units per month, tool vendor developed a process based on pick and place from lead frame and IC packaging industry, adapting flexible roll to roll materials from sheet based process
Power correcting patch for deeper eye lines/wrinkles.

Product utilizes flexible battery.
Images courtesy of Estee Lauder and PowerPaper / Graphic Solutions, Inc. 30 of 138

Intellectual property caveats
Process - Methods not understood Materials - Beware the secret goo Tests - Test patterns not developed

Cost Reduction
Traditional printers are seeking new markets and have valuable equipment and process skills. Seek capital equipment and materials suppliers from least cost industry. Impact of ubiquitous RFID will be that roll to roll electronic products will develop low cost techniques - reducing 10x in next 5 years. Convergence with consumer applications and pricing such as clothing, skin patches, blankets, cell phones, books/ebooks.
RFID tag courtesy of Graphic Solutions, Inc. 32 of 138
Technology Improvement
Recent Accomplishments
Web handling control and alignment of patterns and layers Improved cameras and optics for in line data collection and immediate response alignment of web Improved web handling mechanisms Temperature and Humidity controlled environments
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Technology Improvement
Recent Accomplishments that can be used in modeling
Sophisticated inks, fluids and gels with both electronic and physical properties
Inks with electronic properties Gels with various methods of cure to seal temporarily, permanently Viscosity control of inks and gels by temperature and RH control
Substrates and surfaces with engineered properties to facilitate product design or process.
Temperature hardened to minimize shrinkage Impregnated with Aluminum Oxides for translucency/opacity Polished surfaces to reduce defects Moisture barrier coatings Punched, laser drilled and formed surface cavities
Inlays for small semi flexible applications

Credit cards with chip/display/battery/interconnect

Images courtesy of Aveso Displays 34 of 138
Based on a Model completed for the United States Display Consortium (USDC) Titled, Flexible Microelectronics and Roll-to-Roll Processing Study

Technical Contributors
Dr. M. Robert Pinnel Chief Technical Officer , USDC Jeff Innocenzo Staff Research Engineer, DuPont Technologies Charlie Lang Senior Research Associate, DuPont Displays Dr. Michael Carmody Sr. Laboratory Head, Eastman Kodak Company Janice Mahon - VP, Technology Commercialization, Universal Display Corporation Stewart Hough VP, Business Development, Cambridge Display Technology Paul Wickboldt VP, Equipment Engineering, FlexICs Dr. Peter Slikkeveer Principal Scientist, Philips Research The Netherlands Emiel Lenders Group Manager, Philips Research The Netherlands Malcolm Thompson, MJT Associates Robert F. Praino, Jr. - VP Operations, Vitex Systems Inc. Michelle Moore Associate Industrial Engineer, AGI Mark Winter Process Engineer, AGI Bernie Kaplan Senior Equipment Engineer, AGI

Study Scope
The purpose of this study is to provide the United States Display Consortium (USDC) with the industrial design parameters related to Roll-to-Roll processing of flexible displays and microelectronics. Completed in Fall of 2003

Study Task
Develop a cost and capacity model to determine the following:
Individual Product Cost per Square Foot Overall Factory Cost Estimates Equipment Cost Labor Cost Substrate and Outsourcing Costs Approximate Cleanroom Space/Cost Required by Clean Class

Study Scope
Members of AGI and selected members of the USDC team jointly developed the device scenario and AGI researched the manufacturing methods
Active Matrix and/or Passive Matrix Small Molecule OLED (OLED) and/or Polymer OLED (PLED) Lamination Encapsulation and/or Masked Deposition Encapsulation Substrate Material PET (1000 roll by 24) Display 3.25 by 3.25

Active Matrix versus Passive Matrix

Active Matrix
TFT transistor to address each pixel Less power since no external circuitry Faster refresh rates More difficult to manufacture Better product lifetime
Example of Active backplane (not LED)
Passive Matrix
Anode/ cathode strips at right angles, intersections make-up pixels Suffer from ghosting with fast refresh rates Easier to make Shorter lifetimes
Example of Passive backplane (not LED)

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Active Matrix
Top Gate Cross Section

Active Matrix
Bottom Gate Cross Section

Passive Matrix
Cross Section

Process Flows - Active Matrix

Step
100 130
Operation
Staging Area Web Punch and Clean Vacuum Dep Dielectric Barrier Layer and Cure Sputter Dep Gate 1 Metal Clean, Coat & Cure Align and Expose Develop, Etch (Gate Metal),Strip the photoresist then dry with air knives with extra clean rinse Silicon Nitride, Amorphous Polysilicon, N+ dopant PolySi Anneal Clean, Coat & Cure Align and Expose
Tool
Stage Clean, Aqueous Web
Tool Action
Stage Unwind, Punch, Aqueous Web Cleaner, Unpatterned inspect, Wind
140 150 160 170
PECVD, Microwave Sputter, DC Magnetron Roll Coat Exposure, Step and Repeat
Unwind, Microwave PECVD, Rewind Unwind, DC Magnetron Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, PECVD Deposit, Wind Unwind, XeCl Pulsed Excimer Laser, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized develop system w/rinse, dry system for reel to reel transport, Inspect, Wind
180 190 200 205 210
Develop, Etch, Strip Line PECVD Deposit Laser, Pulsed Excimer Roll Coat Exposure, Step and Repeat
215
Develop, Rinse and dry with air knives
Develop

Process Flow - Active Matrix Cont.

Step
220 Ultrasonic Clean 225 Clean, Coat & Cure 230 240 Align and Expose Develop, Etch (Nitride), Strip the photoresist then dry with air knives with extra clean Sputter Dep/ ITO Clean, Coat & Cure 255 260 Align and Expose Develop, Etch (ITO), Strip the photoresist then dry with air knives with extra clean Sputter Dep Interconnect Clean, Coat & Cure 275 280 Align and Expose Exposure, Step and Repeat Exposure, Step and Repeat Develop, Etch, Strip Line Exposure, Step and Repeat Develop, Etch, Strip Line Roll Coat Clean, Ultrasonic Unwind, Conveyorized Ultrasonic clean w/rinse &dry system, Inspect, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/ extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind
Operation
Dry Etch (RIE Si) and Resist Strip
Tool
Reactive Ion Etch
Tool Action
Unwind, Reactive Ion Etch, Dry Strip, Wind
245 250
Sputter, ITO Roll Coat
265 270
Sputter, Interconnect Roll Coat

Process Flow - Active Matrix Cont.

Step Operation
Develop, Etch (Interconnect Metal), Strip the photoresist then dry with air knives with extra clean PECVD Passivation Layer Clean, Coat & Cure Align and Expose
Tool
Tool Action
Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, PECVD, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized develop system w/rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Reactive Ion Etch, Dry Strip, Wind Unwind, Conveyorized Ultrasonic clean w/rinse & dry system, Inspect, Wind Unwind, TFT Active Device Test, wind Unwind, Laser Repair, Wind
285 290 295 300
Develop, Etch, Strip Line PECVD Deposit Roll Coat Exposure, Step and Repeat
305 310
Develop, Rinse and dry with air knives Dry Etch (RIE Passivation) and Resist Strip
Develop Reactive Ion Etch
315 320 330
Ultrasonic Clean Test and Review Laser Repair Shorts
Clean, Ultrasonic Test, TFT Laser Repair

Process Flows - Passive Matrix

Step
400 410
Operation
Staging for PET Web Punch and Clean Vacuum Dep Dielectric Barrier Layer and Cure Sputter Dep/ ITO Clean, Coat & Cure Align and Expose
Tool
Tool Action
430 440 460 470
PECVD, Microwave Sputter, ITO Roll Coat Exposure, Proximity
Unwind, Microwave PECVD, Wind Unwind, Sputter/ITO, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind
480 490 500 510
Develop, Etch (ITO), Strip the photoresist then dry with air knives with extra clean Vacuum Dep SiO2 Clean, Coat & Cure Align and Expose
Develop, Etch, Strip Line PECVD, Microwave Roll Coat Exposure, Proximity
Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Microwave PECVD, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind
520 530 540 550
Develop, Etch (SiO2) ,Strip the photoresist then dry with air knives with extra clean Sputter Dep Metal Clean, Coat & Cure Align and Expose
Develop, Etch, Strip Line Sputter Roll Coat Exposure, Proximity
Unwind, Conveyorized DES system w/ extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Sputter, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind
560 570
Develop, Etch (Metal) ,Strip the photoresist then dry with air knives with extra clean Test and Review
Develop, Etch, Strip Line Passive Electrical Test
Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Passive Device Test, Wind

OLED versus PLED

OLED
Material applied using vacuum evaporation through a shadow mask or other vacuum based transfer process More mature process Used in the majority of applications
PLED
Material typically applied using Ink Jet Printing Technology is still maturing Scale up has presented mechanical and material control challenges
We have included both in our model for completeness

Process Flow - OLED

Step Operation
Incoming Active or Passive Roll Mechanical and UV Ozone Clean Plasma Clean
Tool
Tool Action
700 705 710
Incoming Clean, Corona Clean, Plasma
Incoming Unwind, Tacky Roller, Corona Treating System, Wind Unwind, Plasma Clean, Wind Unwind, Clean, Evaporate Color 1 Hole, LE, Transport Layer, Evaporate Color 2 Hole, LE, Transport layers, Evaporate Color 3 Hole, LE, Transport Layer, Evaporate Cathode, Send to encapsulation interface
720
Evap Multiple Layers for Three Colors and Evaporate Cathode
Evap, OLED
Small Molecule OLED (OLED) is a three color scenario

Evaporation method with shadow mask was selected for the model

Electro Luminescent Displays

Organic Electro Luminescent Displays: OLEDs
Why OLEDs?
Because crystalline order is not required, organic materials, both molecular and polymeric, can be deposited far more cheaply than the inorganic semiconductors of conventional LEDs. Patterning is also easier, and may even be accomplished by techniques borrowed from the printing industry. Displays can be prepared on flexible, transparent substrates such as plastic. High Brightness ( 150 candela/square meter), Self emitting materials, do not require backlight like LCD. High contrast (>100:1) Can be deposited on Active or Passive matrix structures OLEDs have a wide viewing angle (up to 160 degrees), even in bright light! Their low power consumption (only 2 to 10 volts) provides for maximum efficiency, and helps minimize heat and electric interference in electronic devices Faster response (100 to 1000 times faster than LCD). Wide operating-temperature range (-80C to +80C) unlike LCDs.
Electro Luminescent Displays

Organic Electro Luminescent Displays: OLEDs
Challenges
OLEDs must be hermetically sealed from exposure to humidity and oxygen or cathode fails and dark spots occur over time. OLED devices are current driven rather than voltage driven, requiring parameter control over current rather than voltage, making driver design different than LCD or Plasma displays Scale up of small molecule processes requires large vacuum equipment with high levels of process control and mask positioning.

OLED Technology Basics

Organic EL is obtained simply by placing a charge-transporting and light emitting organic materials between two electrodes (one of which is transparent) and applying a suitable bias. The organic material may be a polymer, deposited by various solution processing techniques, or low molecular weight molecules (commonly called small molecules), deposited by evaporation or sublimation in vacuum. Total device thickness (excluding the substrate) is less than 1 micron. Active films are very thin, less than 1000 angstroms. When biased, charge is injected into the highest occupied molecular orbital (HOMO) at the anode (positive), and the lowest unoccupied molecular orbital (LUMO) at the cathode (negative), and these injected charges (referred to as holes and electron, respectively) migrate in the applied field until two charges of opposite polarity encounter each other, at which point annihilate and produce a radioactive state- light.


ElectroLuminescent (EL) Displays Elemental Structure of Color EL

(a) Line-up Method Using the R,G, and B Luminescent Materials (EL)
7) Color Filter 6) Metal Electrode 5) The Second Insulation Film 4) Light Emitting Layer 3) The First Insulation Film 2) Transparent Electrode 1) Glass Substrate
(b) White Color EL / Color Filter Method
Light
R G B
Light

OLED Process Flow

OLEDs are typically fabricated on a transparent substrate on which the first electrode (usually indium-tin-oxide which is both transparent and conductive) is first deposited. Passive matrix has only patterned electrode substrate Active matrix has TFT substrate with pixel area (electrode) on which OLED structure is created Then one or more organic layers are coated by either thermal evaporation in the case of small organic dye molecules, or spin coating of polymers. In addition to the luminescent material itself, other organic layers may be used to enhance injection and transport of electrons and/or holes. The total thickness of the organic layers is of order 100 nm. Lastly, the metal cathode (such as magnesium-silver alloy, lithium-aluminum or calcium) is evaporated on top. These metals are chosen for their low workfunctions in order that they provide efficient injection of electrons. The two electrodes add perhaps 200 nm more to the total thickness of the device. Therefore the overall thickness (and weight) of the structure is mostly due to the substrate itself. After deposition the samples are encapsulated and operated under a nitrogen atmosphere in order to prevent damage due to oxidation.
Process Flows - PLED

Step Operation
Incoming Active or Passive Roll Mechanical and UV Ozone Clean Plasma Clean
Tool
Tool Action
600
Incoming
Incoming
610 620
Clean, Corona Clean, Plasma
Unwind, Tacky Roller, Corona Treating System, Wind Unwind, Plasma Clean, Wind Unwind, Deposit First Quarter Buffer Layer, Deposit Second Quarter Buffer Layer, Tension Adjust, Deposit Third Quarter Buffer Layer, Deposit Final Quarter Buffer Layer, Oven Cure, Send to Ink Jet Receive Station
630
Buffer layer dep and bake
Inkjet Buffer Layer Deposit
640
Color 1 Dep, Color 2 Dep, Color 3 Dep and Cure
Inkjet Color Layers Deposit
Ink Jet Receive Station, Deposit First Quarter Color 1 Layer, Deposit Second Quarter Color 1 Layer, Tension Adjust, Deposit Third Quarter Color 1 Layer, Deposit Final Quarter Color 1 Layer, Tension Adjust, First Quarter Color 2 Layer, Deposit Second Quarter Color 2 Layer, Tension Adjust, Deposit Third Quarter 2 Color Layer, Deposit Final Quarter Color 2 Layer, Tension Adjust, First Quarter Color 3 Layer, Deposit Second Quarter Color 3 Layer, Tension Adjust, Deposit Third Quarter Color 3 Layer, Deposit Final Quarter Color 3 Layer, Tension Adjust, Cure, Inspect, Send to Thermal Evap Interface Thermal Evap Receive interface, Reorient Roll, Evaporate Cathode, Interface with encapsulation
650
Thermal evap cathode
Evap, Cathode
Polymer OLED (PLED) is three color scenario

Ink Jet Process for PEDOT Buffer and Color application Evaporation of the Cathode Metals
Lam versus Dep

Lamination (LAM)
A lamination process is used to enclose or encapsulate the finished devices. Multi-layer films provide good protection but add cost.
Deposition (DEP)
A chemical vapor deposition is used to protect the finished devices High initial capital equipment cost has limited widespread use
The model includes both options

Process Flow - Lamination Encapsulation

Step 800 Operation Unwind top roll (Encapsulant) Mechanical and UV Ozone Clean, Screen print adhesive and partial cure Incoming OLED or PLED Devices are bottom roll Cut bottom roll into sheets (18" by 24"), laminate top roll to bottom (device) sheet, Cure the Seal Free Contacts Cut Sheets Into Individual Devices Cut Shorting Bars Inspection of Devices Test each Device Tool Unwind Top Roll Tool Action Unwind top roll
810 820
Screen Printer Receive from evaporator
Tacky Roller, Corona Treatment, Screen Printer, UV Cure Align Device Roll
830 850 860 870 871 873 875
Laminate, Combine Sheets Seal Oven Die Punch 1 Die Punch 2 Die Punch 3 Device Inspection Test, Active Device
Cut bottom sheet, Align and Tack, Laminate, cut the top sheet and push off Load Sheets, Cure Seal, Unload Sheets Die Punch top sheet, pull off excess Die Punch Device out of bottom sheet Die Punch cut of shorting bars Device Inspection Active Device Test

Process Flow - Deposition Encapsulation

Step 900 Operation Incoming OLED or PLED Devices as bottom roll Laminate Mask Pattern to the bottom roll Tool Receive from evaporator Tool Action Align Device Roll Unwind, Align mask sheet, Laminate Mask Sheet, Send to PECVD
910
Laminate Mask Pattern
920 935 940 942 945 955
Vacuum Coat Organic and Inorganic layers and Durable Overcoat and Cure Peel off laminate Cut Sheets Into Individual Devices Cut shorting bars Inspection of Devices Test each Device
PECVD, Microwave Inert Laminate, Remove Die Punch 2 Die Punch 3 Device Inspection Test, Active Device
Receive Masked Roll, Microwave PECVD Delaminate and wind mask, Send Bottom Roll to Die Punch Die Punch Device out of bottom sheet Die Punch cut of shorting bars Device Inspection Active Device Test

Active Matrix w/ OLED
Active matrix
The minimum geometry for the Active Matrix display desired was 2 microns on the contacts only and 4-micron lines and spaces. The 2-micron contacts may still be problematic for some tools. See notes below for Align and Expose tools.

Passive Matrix w/PLED

The Passive Matrix display device geometries are: 330 m (13 mil) lines with 25.4 m (1 mil) spaces

Devices on Web
There are 35 displays for each 24 x 18 area (5 rows and 7 columns) There are areas for optical alignment marks and mechanical punch alignment locations at the edges, outside of the device array.

Substrate Material Concerns

Substrate material (both processed and purchased) assumed as standard PET substrate with protective coatings
transparent coating high resistance permeation barrier to oxygen, moisture and chemicals flexibility of coatings (no coating cracking/fatigue)
Improved thermal stability is assumed in the model Standard TFT fabrication requires temperatures above those that can be tolerated by most polymers.

Model Assumptions
Due to temperature constraints of the PET web, the tool selection for deposition of materials (evaporation or sputter) for the Active and Passive matrix substrates was limited to tool vendors who had experience with the required cooling of the web during processing.
Batch type web coater for EB deposition Picture from Von Ardenne Anlagentechnik GmbH AIMCAL Presentation, Richter 2002

Model Assumptions
Wind and unwind location choices have been made by reviewing actual processing tools and methods for the following product types:
TAB (Tape Automated Bonding), Chip on flex, Lead frame, food packaging/labeling, medical device packaging, touch screens, TV and display antiglare films, etc.

Model Assumptions
Pricing, Throughput, Footprint of Tools
Firm tool supplier proposals were used from tool database developed over past three years Vendor discussions were documented for new or developing tools Benchmarking to roll to roll tools from other industries, and PC board processing for HDI/Flex
Cleanliness/process from FPD base tools
Integration costs were well benchmarked due to recent AGI roll to roll projects AGI Abbie Gregg, Inc. were not completed in time for the Some RFPs study and unofficial estimates were received for these tools
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Model Assumptions
Layout, Cleanliness and Pattern protection
Combined Industry standards for roll-to-roll industry with the clean classifications required for display and microelectronics processing. Standard Industrial practices for tool groupings and workflow resulting in layouts. Interleafs are included during wind/unwind of the rolls to control sticking, scratching and contamination at the following steps: Coat, Align and Expose and Develop before dry etch.
Web Speed versus Output

The output of the line will depend on the speed of the web. If the entire line runs at 1 foot/minute and assume an overall utilization of 92% and a 90% yield, the output would be:
1 ft/min * 1440 min/day * 7 days * .92 (utilization) * .90 (yield) Equals 8,346 linear feet per week
Since the web is 2 foot wide, each linear foot equals 2 square feet The output is 8,346 lf * 2 ft equals 16,692 square feet per week Since the devices are 3.25 by 3.25 inches, there are 35 devices for every 18 by 24 inch web section. This is 11.67 devices per square foot.
The output equates to 194,795 devices per week.

Web Speed versus Multiple Use Tools

Multiple use tools have a significant impact on actual throughput. If a tool can support 6 linear feet of web per minute, the impact of multiple uses is:
Number of Uses Effective Thruput 6 ft/min 3 ft/min 2 ft/min 1.5 ft/min 1.2 ft/min 1.0 ft/min 1 2 3 4 5 6

Line Balance Dictates Multiple Tools:

Tool Counts: Active Matrix @ Volume: 66k/week
Throughput Rates
6 ft/min 6 ft/min
Aqueous Clean
Roll Coat Roll Coat Roll Coat Roll Coat Roll Coat Roll Coat
3.5 ft/min 1.2 ft/min

Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Develop Develop Develop Develop Develop Develop Develop Develop TFT Test Develop
3.0 ft/min
TFT Test
Tool Counts
23
Note: Line Balanced to full Clean utilization (.92 Aqueous Clean)

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Jupiter 3.x
TM
Jupiter 3.xTM was developed by AGI to help our clients make better decisions.
Based on standard industrial engineering methods and practices Combines cost, capacity, and space allocation modeling in one user-friendly package Developed in Microsoft Excel to allow ease of use and customization to clients individual requirements Includes Material Handling data, analysis, and impact for roll to roll and individual substrate processing
Jupiter 3.xTM allows the user to modify inputs in a given model and immediately see the results.
Jupiter 3.x
TM
All data which is not scenario-specific, such as tool costs, uptimes, process times, etc. are contained in a stand-alone file which acts as a central database, allowing apples-to-apples comparison of different scenarios based on the same tool set. Some examples of different types of scenarios are:
Different factory schedules Different demands per product Ramp plans Rolls vs. sheet handling in same tool type or process
72 of 138

Jupiter 3.xTM Inputs

Jupiter 3.xTM Outputs

Jupiter 3.x
TM
Switch to live model demonstration

Possible Flows
Flow Number 1 2 3 4 5 6 7 8 Backplane Active Active Active Active Passive Passive Passive Passive LED PLED OLED PLED OLED PLED OLED PLED OLED Encapsulation Lam Lam Dep Dep Lam Lam Dep Dep

Process Yield Assumptions

Start-up Mature Product
Used for < 5000 sq ft/wk

Yield Assumptions: Inspection Test,TFT Test, Passive Test, Active Ink Jet Dep OLED Evap 97.0% 85.0% 90.0% 90.0% 95.0% 95.0%
Used for 5000 or more sq ft/wk

Yield Assumptions: Inspection Test,TFT Test, Passive Test, Active Ink Jet Dep OLED Evap 99.4% 97.0% 98.0% 97.0% 98.5% 98.5% Resulting Product Yield: Active Passive PLED OLED Lam Dep Cumulative Yields 93.4% 96.2% 98.5% 98.5% 96.4% 96.4%
Resulting Product Yield: Active Passive PLED OLED Lam Dep Cumulative Yields Passive Start Up Active Start Up 70.8% 82.1% 95.0% 95.0% 87.3% 87.3%
68.1% 58.7%
Passive Mature Active Mature
91.4% 88.9%

Device Cost Results

($ per Square Foot versus Volume)
We did not include the detail of each of these models. We only ran them to identify the slope of the Price to Volume Chart.
USDC Cost per Sq Ft Sq Ft pe r We e k: De vice s pe r We e k: Active PLED Lam Active OLED Lam Active PLED Dep Active OLED Dep Passive PLED Lam Passive OLED Lam Passive PLED Dep Passive OLED Dep 2,000 23,332 $365.82 $378.44 $365.82 $384.14 $244.91 $258.09 $250.76 $264.72 6,000 69,996 10,000 14,000 116,660 163,324 20,000 233,320 40,000 466,640 70,000 816,620 100,000 1,166,600 $61.71 $74.36 $61.79 $74.44 $34.23 $46.44 $34.32 $46.56
$152.94 $90.79
$111.68 $100.07 $61.11 $48.65
$85.43 $40.31
$79.95 $36.47
$74.73 $35.47

Device Cost Results

$ per Square Foot versus Volume For Volumes 0 to 100,000 SF per week
USDC Results
$400 $350 $300
Act, OLED, Dep Pass, PLED, Lam
$ per Sq Ft
$250 $200 $150 $100 $50 $0
$ 74.44 $ 34.23
0 20,000 40,000 60,000 80,000 100,000
Sq Ft/Wk

Device Cost Results

At an output level of 100,000 square feet/per week, the cost per square
foot breaks down as: Backplane:
Active Matrix Passive Matrix $45.35 $18.19
2.5 X 2.0 X
Light Emitting Post Processing:

OLED PLED $25.30 $12.45
Encapsulation:
Dep Lam $ 3.79 $ 3.59
1.1 X

Cost Contributors at 100k Sq Ft/ Wk

Flow Number 5, Lowest Cost Combination, Passive, PLED, Lam
Category Materials Equipment Overhead Direct Labor Direct Facilities Percent
Materials
43.3% 31.6% 11.9% 7.0% 6.2%
Equipment Overhead Direct Labor Direct Facilities
Flow Number 4, Highest Cost Combination, Active, OLED, Dep

Materials
55.9% 25.7% 8.4% 6.0% 3.9%

Overall Model Results

High Cost Flow #4
(Active, OLED, Dep)
Minimum Number of Tools Low Cost Flow #5

(Passive, PLED, Lam)
High Volume High Cost Flow #4

(Active, OLED, Dep)
Low Cost Flow #5

(Passive, PLED, Lam)
Device Demand (Sq Ft per wk)
10,000
14,000
100,000
100,000
30
25
127
80
Number of Tools
Tool Cost ($M)
$113.1M
$68.3M
$496.7M
$282.0M
$61.8M
$49.7M
$304.0M
$219.1M
Facility Cost ($M)
Total Square Ft
118,182
97,833
561,255
426,689
13
11
127
68
Operators per Shift
Product Cost per Sq Ft
$111.68
$48.65
$74.44
$34.23

General Model Results

Tools per Square Foot
The average for this model is 0.51 tools per 1,000 square foot. The Semiconductor Benchmark for 200mm wafer tools is 5 tools per 1,000 square foot
Material handling costs

Wind/ Unwind robots cost $125,000 each The average for this model is 1.37 robots per tool
Material Costs (Cost Contributor per square foot of web)

OLED Evaporation sources Chemicals (Dev, Etch, Strip) Cathode Evaporation sources $16.56 $ 5.88 to 7.84 (depending on flow) $ 2.15

Tool Results
Slowest Throughput per Machine
For Passive, PLED, Dep

Inkjet Color Dep Inkjet Buffer Dep Sputter Steps 1.5 Ft/min 1.5 Ft/min 2.0 Ft/min
For Active, OLED, Lam

Exposure, S & R PECVD Deposit Sputter Steps 1.2 Ft/min 2.0 Ft/min 2.0 Ft/min

Pareto of Tool Throughput

16 14 12 15
Quantity of Tools
10 8 6 4 2 0 1 2 1
9 7 6
Fe e t pe r Minute

Tool Results
Largest Cost per Individual Tool

Evap, OLED PECVD Deposit $ 23.7M $ 9.2M

Inkjet Color Deposit Inkjet Buffer Deposit $ 11.1M $ 6.8M

Pareto of Tool Cost

16 14
Number of Tools in Each Cost Category
14
12 10 8 6 4 4 2 0 < $ 1M $ 1M $ 2M $ 4M $ 5M $ 10M 3 2 1
*
7 4
>$ 23M
Tool Cost in Millions

*InkJet includes: Buffer, Color, Cathode Tool Cost
87 of 138
Largest Percent of Total Tool Cost

(At an output level of 100,000 square feet per week)

PECVD Deposit Evap, OLED 19.8% 19.1%

Inkjet Color Deposit Inkjet Buffer Deposit Total for All Tools 25.8% 15.7%
Total of All Tools
$ 374.2M
$ 215.2M

Tools are much larger

Tool Discussions Problematic Tools

Off Shore Vendors seem most responsive, best capitalized and willing to develop clean web tools for: Develop, Etch, Strip and other wet processes Step and repeat expose OLED Evap Cathode Evap Domestic Development Stretches into the future for some new tools Ink Jet printing of PLED Laser polysilicon anneal Test and repair flex displays Deposit barrier coatings

Tool Selection Photo Patterning Concerns No align and expose tools were capable of meeting the resolution and registration range needed for Active Matrix Devices on flex (2 to 4 micron and 1 micron registration). Now 5-8 micron line/space limit
Need to optimize
Light Intensity Resist Thickness Pre-alignment time
Can we Mix/ Match with Proximity?
Expect a Japanese tool vendor to get there first (Ushio, Toray) USDC funding domestic effort (Azores)

Tool Selection Specialty Process Deposition Concerns

Background of deposition tools: PVD and CVD: Well known technology (solar cells have used long web processing tools for decades) Sputtering/PECVD tool is large and expensive Cooled Drums used for PET cooling during deposition Some linear sources and round targets are in use for other materials Cathode/OLED Evaporation tools in design (Tokki, Applied Films, Ulvac, CHA) Roll to roll decoupled from OLED research Expect a Japanese tool vendor to get there first (Tokki, Ulvac) USDC funding domestic effort CHA

Tool Selection Specialty Tools
Niche Market Tools - Research and development effort is ongoing

Ink Jet Patterning : Seiko Epson, Litrex, MicroFab, Spectra- Other applications. Environment, thruput concerns. XeCl Pulsed Laser: GAM for changing amorphous silicon into polysilicon. Thruput, temp of web, and integration concerns Integration Technology Other experts (Northfield, ECD, Preco) in process/web need to be supported Creation of Inert Environment Web Handling Automation

Bottleneck - Ink Jet PLED printing

Although InkJet printing is without a doubt the most cost effective method, the throughput of the InkJet tool in its proposed state is roughly 0.25 feet per minute. AGI optimized this throughput by providing partial processing in redundant tools to improve the web speed revealing the deposition line, which is :
Litrex 80L
source: www.litrex.com
423 feet long!

Bottleneck - Step and Repeat Align/Expose

Step and Repeat exposure shot size is now limited to about 200mm round, 141 x 141mm square. With a reticle/shot of 170 x 170 mm, 4 PDA devices can be exposed in one shot without stitching.
6 5 4
7 10 3
8 11 2
9 12 1

Bottleneck- Re-entrant Photo Flows
Multiple tools required immediately due to reentrant flows:

Photo
Step and Repeat, Align and Expose for Active Matrix (6 layers) One Develop Dry Etch One Develop Wet Etch
Standardization of chemicals will become critical to minimize bottleneck issues

Web Movement vs. Sheet Handling

Tool Cost Sheets lower Throughput Web higher Yield Advantage to sheet due to ability to not continue processing rejects Advantage to the web. Material Cost Materials: Photoresist applied with Roller coater will have large, costly waste for sheets Sput targets cost will increase since not as much from a given target hits a sheet vs a web. Material Handling Sheets may cost more to handle Factory layout More flexible with sheet handling

What do we gain in Web Flex Display Manufacturing? PET without barrier PET with barrier 1737f Aluminosilicate Glass Glass TFT (AGI benchmark) Active Matrix Back Plane (100k/wk) Glass TFT is more than AM (Web) Pull out the Glass Cost ($32.57 - $9.70): Delta is $22.87 .07 sf .30 sf $10.00 sf $77.92 sf $45.35 sf $32.57 sf (savings)
PET is cheaper than glass by $9.70 a sf

What If?
Area m nroo Clea 5%? The up 1 goes Direct Labor Cos ts are cut
OLE cos D Eva t 30% goes p tool dow ? n
ctor Fa
in half?
Th cu e St t in ep ha per lf? th rup ut is
ruput Jet th k he In s 5x? T prove im

5th Annual Flexible Displays & Microelectronics Conference February 6-9, 2006 | Phoenix, Arizona
Are We There Yet?

Updates to the Roll to Roll Manufacturing Cost Model for Flexible Displays Updated Fall 2005 Presented Spring 2006
Image courtesy of Plastic Logic Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 100 of 138
Introduction
Background
In 2003, we developed and presented a roll-to-roll model at the USDC conference to determine:
Individual Product Cost per Square Foot Overall Factory Cost Estimates Equipment Cost Labor Cost Substrate and Outsourcing Costs Approximate Cleanroom Space/Cost Required by Clean Class
For 2006, we have updated that study

Are We There Yet?

Process Is there a process consistent with roll-to-roll that can be used? R&D Low volume production High volume production Roll-to-roll Equipment Do all the necessary tools exist? Application Is there an application that requires rollto-roll volumes? Financial Do the numbers justify the necessary investment?
The Last Three Years

What has happened since the first report?: Flexible Display Center at ASU CAMM established at Binghamton University Number of Flexible Display Conferences increased, so has attendance Roll-to-roll Process Lines added
Flexible Batteries - Solicore, Power Paper Solar Cells - Unisolar RFID Tags - Alien
Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 Display image courtesy of SiPix 103 of 138
The Last Three Years

What did not happen: No killer application identified
Smart Card eBooks - Signage - Curved Watches
No obvious best process identified OLED/PLED moisture effects on plastic not solved No major tool orders placed for display processing in Roll-to-Roll format
Should we change the basic process flows?
The process flows and tools were reviewed to see if there were compelling reasons to add or eliminate items from the sequence presented in 2003. There is no obvious perfect or home run process that everyone is using. The main changes to the flows will be presented The tradeoffs between the flows will be presented.
What flow combinations are included?

Flow Number 1 2 3 4 5 6 7 8 Backplane Active Active Active Active Passive Passive Passive Passive LED PLED OLED PLED OLED PLED OLED PLED OLED Encapsulation Lam Lam Dep Dep Lam Lam Dep Dep
All flows use 1000 ft by 2 ft rolls of PET to make a 3.25 inch by 3.25 inch display on 18 inch by 24 inch format
Changes in the Active Matrix Flow

Changes in Active Matrix Photolithography
The exposure system is the cornerstone of the active matrix photo process Previous vendor for active matrix exposure (Ushio) no bid Azores
Has made good progress Preliminary results at FDC look good
Azores now used for active matrix exposure

Images courtesy of the Flexible Display Center @ ASU Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 107 of 138
Changes in the PLED Flow

Changes in PLED Process
Litrex has seen significant progress in ink jet tools New tools reduce overall footprint required for PLED process

Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 Image courtesy of Litrex 108 of 138
Other Changes in the Model

Labor
Labor rates increased by 8.6%
Tools
Average tool price for similar tools increased by 1.1%
Materials
Average material cost was up 7.7%

Do I Use Active Matrix or Passive Matrix ?

If Passive Matrix will work in your application, go with passive. It offers significant cost advantages. If not, go Active Matrix. Basic model includes both flows

Images courtesy of E Ink (top) and Universal Display Corp Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 110 of 138
2006 Device Cost Results

($ per Square Foot versus Volume)
Results presented by flow and volume.

Sq Ft per Week: Devices per Week: Active Active Active Active Passive Passive Passive Passive PLED OLED PLED OLED PLED OLED PLED OLED Lam Lam Dep Dep Lam Lam Dep Dep 2,000 23,332 $370.30 $410.60 $378.64 $418.10 $230.29 $266.12 $237.95 $274.62 100,000 1,166,600 $64.80 $80.76 $65.00 $80.96 $31.24 $46.72 $31.42 $46.94


$ per Square Foot versus Volume For Volumes 0 to 100,000 SF per week
USDC Results
$400 $350 $300
Act, OLED, Dep Pass, PLED, Lam
$ per Sq Ft
$250 $200 $150 $100 $50 $0
$ 80.96 $ 31.24 0 20,000 40,000 60,000 80,000 100,000
Sq Ft/Wk


At an output level of 100,000 square feet per week, the cost per square foot breaks down as: Backplane:
Active Matrix $50.04 Passive Matrix $16.79
3.0 X
Light Emitting Post Processing:

OLED PLED $26.84 $10.68
2.5 X
Encapsulation:
Dep Lam
$ 4.05 $ 3.76
1.1 X
113 of 138
Active, OLED, Dep Flow 2003 / 2006 Comparison

2002/2003 2005/2006 Comments
130
114
16 Less Exposure Tools
Number of Tools
Tool Cost ($M)
$ 505 M
$ 677M
Plus $167 M for Active

Facility Cost ($M)
$ 310 M
Total Square Ft
$ 275 M 518 K
$ 35 M Less for Active Space 56K Less for Active
574 K
129
109
20 Less for Active Line
Operators per Shift
$ 75.04
$ 80.96
Model results at 100K square feet per week

Active Matrix Modeling Options

We compared the cost difference for three of the main options to be considered using the Active Matrix flow. Here is a summary of the options we reviewed.
Baseline Process Laser versus no Laser
Decision driven by mobility
Stepper versus Blanket Exposure
Example of JPSA Laser (not R2R)
Decision driven by what size geometries you require

Q:/Marketing/Pres/Tradeshow & Conf Pres/Cornell Flex Electronics Class - May 2006/Flexible Manufacturing Concepts 041906 Image courtesy of JPSA 115 of 138
Active Matrix Flow Options

Process Flow Designation Description Cost at 100,000 sq ft/ wk $ 80.96 Percent Change in Device Cost
AM 1
Baseline
N/A
AM 2
Baseline process without Laser Recrystallization Steps
$ 80.80
-0.2%
AM 3
Baseline process using large area exposure rather than a Stepper for all of the photo layers
$ 67.14
-17.1%

Changes to PLED Line

Item Printers Tension adjusts Cure Ovens Inspection Cost Length
2002 / 2003 20 10 2 1 $ 17.9 M 417 ft
2005 / 2006 4 4 4 1 $ 13.5 M 251 ft
Passive, PLED, Lam Flow 2003 / 2006 Comparison

2002/2003 2005/2006 Comments
80
80
No Change Less $ 26 M for PLED Plus $ 12 M for Passive
Number of Tools
Tool Cost ($M)
$ 282 M
$ 267 M
$ 219 M
Total Square Ft
$ 169 M 322 K
Less $ 51 M for PLED Space Less 104 K for PLED
Facility Cost ($M)
427 K
68
68
No Change Model results at 100K square feet per week
Operators per Shift
$ 34.23
$ 31.24

One-Up Tool Sets

What does a one-up tool set require? What is the output? Item Number of tools Sq Ft Required Tool Cost Facility Cost Total Investment Output (Sq Ft/wk) Product Cost per Sq Ft
Active, OLED, Dep 28 112K $ 124M $ 57 M $ 181 M 5,300 $ 177
Passive, PLED, Lam 25 77 K $ 67 M $ 39 M $ 106 M 14,200 $45
Cost Contributors at 100k Sq Ft/ Wk

Flow Number 5, Lowest Cost Combination, Passive, PLED, Lam
Materials
41.9% 32.9% 11.6% 8.4% 5.2%
Flow Number 4, Highest Cost Combination, Active, OLED, Dep

Category Materials Equipment Overhead Direct Labor Direct Facilities AGI Abbie Gregg, Inc. Percent
Materials
50.5% 32.2% 8.9% 5.2% 3.3%
120 of 138
Major Cost Contributors

(At an output level of 100,000 square feet per week)
Tools for Active, OLED, Dep

Exposure PECVD Deposit Evap, OLED $171 M $115 M $ 71 M
Tools for Passive, PLED, Lam

Inkjet Sputter PECVD $ 67 M $ 35 M $ 28 M
Materials
OLED Evap Sources Develop, etch, strip chemicals Cathode Evap Source $17.82 / sq ft $3.75 to $5.92 / sq ft $2.31 / sq ft

Tool Selection Photo Patterning

Concerns from 2003 Presentation
No align and expose tools were capable of meeting the resolution and registration range needed to Active Matrix Devices on flex (2 to 4 and 1 registration). Assumed 5 to 8 line/space limit.
- Need to Optimize: - Light Intensity - Resist Thickness - Pre-alignment Time - Can we mix/match with Proximity?
- Expected a Japanese tool vendor to get these first (Ushio, Toray). Model used Ushio UX-5040 SC at $1.5 M with a throughput of 1.3 ft/min - USDC funding domestic effort (Azores)

Tool Selection Photo Patterning

Update for 2006
Ushio no bid, Toray no response. Azores installed at FDC (plate format). They are working on roll-toroll. For the 2006 model we used the Azores tool at 2.5 ft/ min, resolution down to 1.5 , and a cost of $9M. ORC Proximity Large Area Exposure at 4.5 ft/min, resolution to 12 , and a cost of $422K. Still to be resolved Cost of Azores in volume Is there something in between? Resolution? Cost? Mix and match? How to match coat, align, develop capacity
Line Balance Dictates Multiple Tools:

Tool Counts: Active Matrix @ Volume: 62k/week
Throughput Rates
6 ft/min
Roll Coat Roll Coat Roll Coat Roll Coat Roll Coat Roll Coat
2.5 ft/min
Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper Stepper
3.5 ft/min
Develop Develop Develop Develop Develop Develop Develop Develop Develop
Tool Counts
12

Conclusions
Financial gap in capital investment still prohibitive
Benchmark R2R electronics lines < $10M
Screen Print segmented passive display capable Outsource ITO No PECVD Insulators
Current Model shows once photolithography is introduced:

Minimum Passive matrix line investment = $ 106 M Minimum Active matrix line investment = $ 181 M
Killer App not yet in mass market. Likely applications:

Credit Cards Signage, eBook, Curved watch face
Likely Process
Probably passive Probably not OLED / PLED Probably electrophoretic, electrochromic, cholesteric LCD
Active matrix process technology on flex still advancing in development mode

Recommendations
Continue funding improvements in photolithographic align / expose tools for flexible processing Continue funding materials research Fund active and passive matrix development with electrophoretic, electrochromic, and cholesteric LCD based display technologies Continue to improve OLED/PLED
Materials Stability Moisture resistance Cost

Are We There Yet?

Process NO, process is still to be determined. Equipment NO, very limited orders, vendors hard pressed to spend significant amounts on NRE. Application POSSIBLY, on Passive Matrix - Credit card market willing to spend $1 for 1.5 inch by 1.5 inch display. - Layout gives 64 displays per square foot. - Cost needs to be below $64 per square foot. - One-up tool set for Passive, PLED, Lam results in $45 per square foot forecast. Financial POSSIBLY, is anyone willing to spend $106M for a one-up tool set to find out?
Acknowledgements
Support from the United States Display Consortium (USDC) and the Army Research Labs (ARL) Tool and material vendors for their inputs

Appendices

Baseline Process Flow - Active Matrix (AM 1)

Step
100 130
Operation
Staging Area Web Punch and Clean Vacuum Dep Dielectric Barrier Layer and Cure Sputter Dep Gate 1 Metal Clean, Coat & Cure Align and Expose Develop, Etch (Gate Metal),Strip the photoresist then dry with air knives with extra clean rinse Silicon Nitride, Amorphous Polysilicon, N+ dopant PolySi Anneal Clean, Coat & Cure Align and Expose
Tool
Tool Action
140 150 160 AM 3 170
PECVD, Microwave Sputter, DC Magnetron Roll Coat Exposure, Step and Repeat
Unwind, Microwave PECVD, Rewind Unwind, DC Magnetron Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, PECVD Deposit, Wind Unwind, XeCl Pulsed Excimer Laser, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized develop system w/rinse, dry system for reel to reel transport, Inspect, Wind
180 190 AM 2 200 205 AM 3 210
Develop, Etch, Strip Line PECVD Deposit Laser, Pulsed Excimer Roll Coat Exposure, Step and Repeat
215
Develop, Rinse and dry with air knives
Develop
column indicates step is changed for alternate flows AM 2 or AM 3

Baseline Process Flow - Active Matrix (AM 1) Cont.

Step
220 225 Clean, Coat & Cure 230 AM 3 240 Align and Expose Develop, Etch (Nitride), Strip the photoresist then dry with air knives with extra clean 245 250 255 AM 3 260 Align and Expose Develop, Etch (ITO), Strip the photoresist then dry with air knives with extra clean 265 270 275 AM 3 280 Align and Expose Exposure, Step and Repeat Sputter Dep Interconnect Clean, Coat & Cure Sputter, Interconnect Roll Coat Unwind, Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Exposure, Step and Repeat Develop, Etch, Strip Line Sputter Dep/ ITO Clean, Coat & Cure Sputter, ITO Roll Coat Unwind, Sputter, Rewind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Exposure, Step and Repeat Develop, Etch, Strip Line Roll Coat
Operation
Tool
Tool Action
Dry Etch (RIE Si) and Resist Strip Ultrasonic Clean
Reactive Ion Etch Clean, Ultrasonic
Unwind, Reactive Ion Etch, Dry Strip, Wind Unwind, Conveyorized Ultrasonic clean w/rinse &dry system, Inspect, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized DES system w/ extra clean rinse, dry system for reel to reel transport, Inspect, Wind

Baseline Process Flow - Active Matrix (AM 1) Cont.

Step Operation
Develop, Etch (Interconnect Metal), Strip the photoresist then dry with air knives with extra clean PECVD Passivation Layer Clean, Coat & Cure Align and Expose Develop, Rinse and dry with air knives Dry Etch (RIE Passivation) and Resist Strip
Tool
Tool Action
Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, PECVD, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, step and repeat exposure, Wind Unwind, Conveyorized develop system w/rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Reactive Ion Etch, Dry Strip, Wind Unwind, Conveyorized Ultrasonic clean w/rinse & dry system, Inspect, Wind Unwind, TFT Active Device Test, wind Unwind, Laser Repair, Wind
285 290 295 AM 3 300
Develop, Etch, Strip Line PECVD Deposit Roll Coat Exposure, Step and Repeat
305 310
Develop Reactive Ion Etch
315 320 330
Ultrasonic Clean Test and Review Laser Repair Shorts
Clean, Ultrasonic Test, TFT Laser Repair

Process Flows - Passive Matrix

Step
400 410 430 440 460 470
Operation
Staging for PET Web Punch and Clean Vacuum Dep Dielectric Barrier Layer and Cure Sputter Dep/ ITO Clean, Coat & Cure Align and Expose
Tool
Stage Clean, Aqueous Web PECVD, Microwave Sputter, ITO Roll Coat Exposure, Proximity
Tool Action
Stage Unwind, Punch, Aqueous Web Cleaner, Unpatterned inspect, Wind Unwind, Microwave PECVD, Wind Unwind, Sputter/ITO, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind
480 490 500 510
Develop, Etch (ITO), Strip the photoresist then dry with air knives with extra clean Vacuum Dep SiO2 Clean, Coat & Cure Align and Expose
Develop, Etch, Strip Line PECVD, Microwave Roll Coat Exposure, Proximity
Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Microwave PECVD, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind
520 530 540 550 560 570
Develop, Etch (SiO2) ,Strip the photoresist then dry with air knives with extra clean Sputter Dep Metal Clean, Coat & Cure Align and Expose Develop, Etch (Metal) ,Strip the photoresist then dry with air knives with extra clean Test and Review
Develop, Etch, Strip Line Sputter Roll Coat Exposure, Proximity Develop, Etch, Strip Line Passive Electrical Test
Unwind, Conveyorized DES system w/ extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Sputter, Wind Unwind, Dip, Spray rinse, Dry, Roll Coat, Heat, Dry, Wind Unwind, Proximity Exposure, Wind Unwind, Conveyorized DES system w/extra clean rinse, dry system for reel to reel transport, Inspect, Wind Unwind, Passive Device Test, Wind

Process Flow - OLED

Step
700 705 710
Operation
Incoming Active or Passive Roll Mechanical and UV Ozone Clean Plasma Clean Evap Multiple Layers for Three Colors and Evaporate Cathode
Tool
Incoming Clean, Corona Clean, Plasma
Tool Action
Incoming Unwind, Tacky Roller, Corona Treating System, Wind Unwind, Plasma Clean, Wind Unwind, Clean, Evaporate Color 1 Hole, LE, Transport Layer, Evaporate Color 2 Hole, LE, Transport layers, Evaporate Color 3 Hole, LE, Transport Layer, Evaporate Cathode, Send to encapsulation interface
720
Evap, OLED

Process Flow - PLED

Step
600 610 620
Operation
Incoming Active or Passive Roll Mechanical and UV Ozone Clean Plasma Clean Buffer layer dep and bake
Tool
Incoming Clean, Corona Clean, Plasma Inkjet Buffer Layer Deposit
Tool Action
Incoming Unwind, Tacky Roller, Corona Treating System, Wind Unwind, Plasma Clean, Wind Unwind, Deposit First Quarter Buffer Layer, Deposit Second Quarter Buffer Layer, Tension Adjust, Deposit Third Quarter Buffer Layer, Deposit Final Quarter Buffer Layer, Oven Cure, Send to Ink Jet Receive Station Ink Jet Receive Station, Deposit First Quarter Color 1 Layer, Deposit Second Quarter Color 1 Layer, Tension Adjust, Deposit Third Quarter Color 1 Layer, Deposit Final Quarter Color 1 Layer, Tension Adjust, First Quarter Color 2 Layer, Deposit Second Quarter Color 2 Layer, Tension Adjust, Deposit Third Quarter 2 Color Layer, Deposit Final Quarter Color 2 Layer, Tension Adjust, First Quarter Color 3 Layer, Deposit Second Quarter Color 3 Layer, Tension Adjust, Deposit Third Quarter Color 3 Layer, Deposit Final Quarter Color 3 Layer, Tension Adjust, Cure, Inspect, Send to Thermal Evap Interface Thermal Evap Receive interface, Reorient Roll, Evaporate Cathode, Interface with encapsulation
630
640 650
Color 1 Dep, Color 2 Dep, Color 3 Dep and Cure Thermal evap cathode
Inkjet Color Layers Deposit Evap, Cathode
Reduced footprint significantly Improved Ink Jet application to multiple head on single tool jetting speed and footprint reduction. AGI Abbie Gregg, Inc.
Process Flow - Lamination Encapsulation

Step 800 Operation Unwind top roll (Encapsulant) Mechanical and UV Ozone Clean, Screen print adhesive and partial cure Incoming OLED or PLED Devices are bottom roll Cut bottom roll into sheets (18" by 24"), laminate top roll to bottom (device) sheet, Cure the Seal Free Contacts Cut Sheets Into Individual Devices Cut Shorting Bars Inspection of Devices Test each Device Tool Unwind Top Roll Tool Action Unwind top roll Tacky Roller, Corona Treatment, Screen Printer, UV Cure Align Device Roll Cut bottom sheet, Align and Tack, Laminate, cut the top sheet and push off Load Sheets, Cure Seal, Unload Sheets Die Punch top sheet, pull off excess Die Punch Device out of bottom sheet Die Punch cut of shorting bars Device Inspection Active Device Test
810 820
Screen Printer Receive from evaporator
830 850 860 870 871 873 875
Laminate, Combine Sheets Seal Oven Die Punch 1 Die Punch 2 Die Punch 3 Device Inspection Test, Active Device
Multiple layer laminate sandwich would use same flow but would be fabricated off-line as an added incoming material cost.

Process Flow - Deposition Encapsulation

Step 900 Operation Incoming OLED or PLED Devices as bottom roll Laminate Mask Pattern to the bottom roll Vacuum Coat Organic and Inorganic layers and Durable Overcoat and Cure Peel off laminate Cut Sheets Into Individual Devices Cut shorting bars Inspection of Devices Test each Device Tool Receive from evaporator Tool Action Align Device Roll Unwind, Align mask sheet, Laminate Mask Sheet, Send to PECVD
910
Laminate Mask Pattern
920 935 940 942 945 955
PECVD, Microwave Inert Laminate, Remove Die Punch 2 Die Punch 3 Device Inspection Test, Active Device
Receive Masked Roll, Microwave PECVD Delaminate and wind mask, Send Bottom Roll to Die Punch Die Punch Device out of bottom sheet Die Punch cut of shorting bars Device Inspection Active Device Test

Process Yield Assumptions

Start-up Mature Product
Used for < 5000 sq ft/wk

Yield Assumptions: Inspection Test,TFT Test, Passive Test, Active Ink Jet Dep OLED Evap 97.0% 85.0% 90.0% 90.0% 95.0% 95.0%
Used for 5000 or more sq ft/wk

Yield Assumptions: Inspection Test,TFT Test, Passive Test, Active Ink Jet Dep OLED Evap 99.4% 97.0% 98.0% 97.0% 98.5% 98.5% Resulting Product Yield: Active Passive PLED OLED Lam Dep Cumulative Yields 93.4% 96.2% 98.5% 98.5% 96.4% 96.4%
Resulting Product Yield: Active Passive PLED OLED Lam Dep Cumulative Yields Passive Start Up Active Start Up 70.8% 82.1% 95.0% 95.0% 87.3% 87.3%
68.1% 58.7%
Passive Mature Active Mature
91.4% 88.9%

Thank You


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Flex Manufacturing Concepts

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Based on a Model completed for the United States Display Consortium (USDC) Titled, Flexible Microelectronics and Roll-to-Roll

AGI Abbie Gregg, Inc.

AGI Abbie Gregg, Inc.

AGI Abbie Gregg, Inc.

Presented by: Lara York, Vice President Advanced Technology

Images courtesy of E Ink, Citala, Aveso Displays, Estee Lauder

Flexible Reflective Display

AGI Abbie Gregg, Inc.

The Existing Lab Setup

AGI Abbie Gregg, Inc.

Image courtesy of Display Science 6 of 138

Vision of the Roll to Roll Line

AGI Abbie Gregg, Inc.

Images courtesy of Northfield Automation and Creo, Inc. 7 of 138

Baseline Existing/Proposed Processing

List associated tools and equipment List process parameters

AGI Abbie Gregg, Inc.

Example of Process Detail Needed

Etch Process C- Lab process that needs to be scaled up:

Etchant: Hypochlorite solution 2. Temp = 25C3. Time= 45 sec

AGI Abbie Gregg, Inc.

Process Detail Needed for Lamination

Material type: Adhesives Research PSA1 Equipment

Positioning aid #1 - Works for specific product dimensions.

Images courtesy of confidential clients 10 of 138

Ask the People Who Inspect the Product

Capture All Visual Aids in Production

AGI Abbie Gregg, Inc.

Image courtesy of confidential client 12 of 138

Notes on Product Dimensions R&D

AGI Abbie Gregg, Inc.

Image courtesy of confidential client 13 of 138

Observe Two Different Operators, Especially Manual Tool Setups

AGI Abbie Gregg, Inc.

Images courtesy of confidential client 14 of 138

Baseline Existing Materials

AGI Abbie Gregg, Inc.

Images courtesy of confidential clients 15 of 138

Baseline Existing Processing

Make Alignment Keys with Metrology

Image enhanced to show misalignment.

AGI Abbie Gregg, Inc.

Image courtesy of confidential client 17 of 138

Printer Settings Variables

AGI Abbie Gregg, Inc.

Images courtesy of Litrex Corporation and confidential client 18 of 138

Manufacturing Scale Up Plan

AGI Abbie Gregg, Inc.

Layout Space for Tools

AGI Abbie Gregg, Inc.

Image courtesy of PowerPaper / Graphic Solutions, Inc. 20 of 138

Use Vertical Space Wisely

AGI Abbie Gregg, Inc.

Images courtesy of confidential clients 21 of 138

Manufacturing Scale Up Plan

Techniques: Rigorous tool acceptance

Compare foundry baselines to in house/lab process

Simulate roll to roll process with sheets

Stage product at these steps.

Manufacturing Scale Up Plan

Manufacturing Scale Up Plan

Storage and preprocessing of materials

Manufacturing Scale Up Plan