AREA RATIO FOR STENCILS DESIGNED FOR A VARIETY OF SMT PAD LOCATIONS

MM
PLCC
QFP
QFP
QFP
QFP
402
201
BGA
BGA
BGA
BGA
BGA

MIL
PLCC
QFP
QFP
QFP
QFP
402
201
BGA
BGA
BGA
BGA
BGA

Pitch
1.25
0.65
0.50
0.40
0.30
N/A
N/A
1.50
1.25
1.00
0.65
0.50

Pad
W
0.65
0.35
0.30
0.25
0.20
0.5
0.25
0.75
0.64
0.50
0.33
0.25

L
2.00
1.50
1.25
1.25
1.00
0.7
0.40
0.75
0.64
0.50
0.33
0.25

Thickness Range
Min
Max
0.150
0.250
0.150
0.175
0.125
0.150
0.100
0.125
0.075
0.125
0.1
0.2
0.075
0.100
0.150
0.200
0.150
0.200
0.115
0.135
0.075
0.100
0.075
0.100

Area Ratio Range
Min
Max
1.64
0.98
0.95
0.81
0.97
0.81
1.04
0.83
1.11
0.67
1.13
0.94
1.03
0.77
1.25
0.94
1.07
0.80
1.09
0.93
1.10
0.83
0.83
0.63

Pitch
50.00
25.00
20.00
16.00
12.00
N/A
N/A
60.00
50.00
40.00
25.00
20.00

Pad
W
25.59
13.8
11.8
9.8
7.9
19.7
9.8
30.0
25.0
20.0
12.5
10.0

L
78.74
59.1
49.2
49.2
39.4
25.6
15.7
30.0
25.0
20.0
12.5
10.0

Thickness Range
Min
Max
5.9
9.8
5.9
6.9
4.9
5.9
3.9
4.9
3.0
4.9
4.9
5.9
3.0
3.9
5.9
7.9
5.9
7.9
4.5
5.3
3.0
3.9
3.0
3.9

Area Ratio Range
Min
Max
1.64
0.98
0.95
0.81
0.97
0.81
1.04
0.83
1.11
0.67
1.13
0.94
1.03
0.77
1.27
0.95
1.06
0.79
1.10
0.94
1.06
0.79
0.85
0.64