LCD & DLP Projectors
Programmable Solutions for the Broadcast Industry
LCD Projector Anatomy
Projection Optics Mirror Mirror Mirror High Intensity White Light Source (a Super Backlight!)
Red LCD
Green LCD
Blue LCD
Condenser Optics
Transmissive Full Image Grayscale LCD Arrays
Lens
Lens
Lens
Mirror Mirror Dychroic Mirror (wavelength selective) Dychroic Mirror (wavelength selective)
LCD Projection Pixel Structure
Cross Sectional View
Thin Film Transistor Polarizer Pixel Electrode Polarizer Scanning Electrode
Wavelength Filtered Glass Substrate Projection Beam
Liquid Crystal Slurry
How the LCD Projector Pixel Works
Cross Sectional View
Wavelength filtered projection light enters the back of the pixel (Green case shown)
How the LCD Projector Pixel Works
Cross Sectional View
The light proceeds to the polarizing filter unimpaired.
How the LCD Projector Pixel Works
Cross Sectional View
At the polarizing filter only a portion of the light is able to pass through. This light is properly aligned for the LCD slurry to affect its transmission.
How the LCD Projector Pixel Works
Cross Sectional View
Light passes through LCD slurry in proportion to twist imposed on matrix by driver circuit. In this example no twist is applied and all of the light is able to pass.
How the LCD Projector Pixel Works
Cross Sectional View
Light then proceeds out of LCD and continues along optical projection path.
How the LCD Projector Pixel Works
Cross Sectional View
By controlling the LCD slurry twist through the driver circuit, intensity of light escaping can be controlled.
How the LCD Projector Pixel Works
Cross Sectional View
By controlling the LCD slurry twist through the driver circuit the intensity of light escaping can be controlled.
How the LCD Projector Pixel Works
Cross Sectional View
By controlling the LCD slurry twist through the driver circuit the intensity of light escaping can be controlled.
How the LCD Projector Pixel Works
Cross Sectional View
By controlling the LCD slurry twist through the driver circuit the intensity of light escaping can be controlled.
How the LCD Projector Pixel Works
Cross Sectional View
No Light at All
Until no light is emitted at all.
DLP & Digital Micromirrors
The Heart of Digital Light Processing
Micro Electro-Mechanical (MEM) devices
The structure is capable of a physical motion Manufactured using semiconductor technology
Digital Micromirrors feature and control small aluminum mirrors
16m in size +/-10 degrees of rotation Switch in 15s physically, 2s optically
Image courtesy of Texas Instruments
Digital Micromirror Device (DMD)
An array of digital micromirrors packaged in single device Digital images created by reflecting a light off the device
TI DLP - Single DMD System
Color images can be made by shining colored light onto DMD greyscale image Light from source bulb is filtered using spinning color wheel Combination of red, green or blue light is then reflected to optics from DMD
TI DLP - 3 DMD System
Light from source bulb is diffracted using filtering prism Each RGB color component is reflected from its own dedicated DMD Reflected R,G and B light combined (reflected along same axis) and passed through optics to display Reduced mechanics (no spinning wheel) means system more reliable Dedicated mirrors also mean higher quality pictures
DLP Projector Anatomy
High Intensity White Light Source Projection Optics Mirror Mirror Mirror
Condenser Optics
Selective Red Reflection Selective Green Reflection Selective Blue Reflection
Mirror
Dychroic Mirror
Dychroic Mirror
Mirror
Light Trap
Light Trap
Red DMD
Green DMD
Blue DMD
Light Trap
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mir ror
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mir ror A
Mir ror
High Intensity Light Source
Intensity is Controlled by Pulsing the Output Cross Sectional View
Low High Intensity Intensity
Mirror A
Mirror B
High Intensity Light Source
Projection Display Systems
Projection System Data Flow
Source File
- RGB - MPEG, JPEG, etc.
Input transport
- External: USB 2.0, IEEE 1394, Home Networking options, etc. - Internal: IDE, LVDS, AGP, PCI, FLASH, SDRAM, etc. DCT/IDCT, color space conversion, decryption, etc.
Raw RGB
(Decompress/decrypt)
Decoding
System transport Display Technology Optimization
- HSTL, LVDS, AGP, PCI, etc. Scaling, gamma/color correction, dithering, brightness, contrast, sharpness, etc.
(Image adjustment)
Adjusted RGB
Driver transport
- LVDS, AGP, PCI, etc. XY timing and output waveform generation XY array driver circuit
Display Driver
LCD/DLP Projector
Digital Image Processing Board (Wireless)
5-GHz IEEE 802.11a/ HiperLAN2
Video In Wireless LAN Chipset I/O Control MPEG Decoder Scan Conversion Color Space Conversion Scaling
DMD / ILA / LCD / GLV Red Display Device Green Display Device Blue Display Device
Frame Buffers SDRAM
Degamma
SDRAM
Memory Controller
SDRAM
Projection Design Challenges
System and Component Connectivity
Which interface options should you support? Can you support more options to increase the accessible market? How do you integrate the best selection of components to address your application?
Video and Image Processing
formats and standards?
How do meet the performance challenge? How do you maintain compatibility with geographically divergent and continuously evolving
User Interface
How do you implement the best possible user interface to your design?
System Control
How do you control the system?
Display Driver circuitry
How do you best implement the driver circuit to get to market quickly and achieve supplier
flexibility for this high dollar BOM component?
General System Challenges
Integrating different standards
Broadband access Home networking System interfaces
Supporting new and evolving specifications Supporting different memory and storage types
EMI signal management Power management Competitive pressures to bring new features rapidly to market Supply chain management Overall cost management
Each can be addressed with Xilinx solutions
Peripheral Interfacing and System Glue
Ethernet Ethernet USB USB Memory Memory Memory Memory Card Card Modem Modem HDD HDD
Main Processor Main Processor or or Embedded uP Embedded uP
Bluetooth Bluetooth
A/D A/D
Interface features to the host processor Quickly add new capabilities to existing products
Component Integration
Design Flexibility
I/O Standard A
FPGA Logic Integration Resources
Controllers
UserSelect I/O I/O Designed UserSelect I/O I/O Designed
PCI-X AGP SDRAM SRAM PCI-X AGP SDRAM SRAM
Buffers & Memories
Block RAM
Controllers
PCI
DLL Clock DLL DLL Mgmt. DLL
PCI
I/O
IDE
RAM
Xilinx Select I/OTM Technology
Chip to backplane PCI 33MHz 3.3V PCI 33MHz 5.0V PCI 66MHz 3.3V GTL, GTL+, AGP Chip to Memory HSTL-I, -III, -IV SSTL3-I, -II SSTL2-I, -II CTT Chip to Chip LVTTL LVCMOS LVDS LVDS BLVDS LVPECL
I/O
FLASH
Distributed
FLASH IDE
I/O Standard B
Storage Reference Designs
PCMCIA
Card-side (Spartan & CPLD) Host-side (Spartan only)
Memory Stick PCMCIA
CompactFlash+
Card-side (Spartan & CPLD) Host-side (Spartan only)
SD/MMC
Card-side (Spartan & CPLD) Host-side (Spartan only)
SD Card Hard Disk Drive
IDE/ATA
Host-side only (Spartan)
Multimedia Card Compact Flash
Memory Controller Reference Designs
DRAM reference designs
64-bit DDR DRAM controller 16-bit DDR DRAM controller SDRAM controller
Embedded memory reference designs
CAM for ATM applications CAM using shift registers CAM using Block SelectRAM Data-width conversion FIFO 170MHz FIFO for Virtex High speed FIFO for Spartan-IIE
SRAM reference designs
ZBT SRAM controller QDR SRAM controller
Flash controller (FPGAs/CPLDs)
NOR / NAND flash controller
Download from Download from xilinx.com/memory xilinx.com/memory
Experimenting with Tradeoffs
It would be nice to have a fully flexible device to use for video processing designs
Allows changing of parameters like colour depth, bit accuracy (truncation) Allows exploration of new compression techniques or acceleration of existing algorithms to improve throughput Supports various frame rates and resolutions Implements a wide range of new or existing filters for enhancement or noise reduction
Welcome to Xilinx FPGAs
FPGAs are a key enabling technology for digital video processing Allow experimentation for prototypes leading to differentiation for production And still enable higher level of system integration with support for:
video interfaces, LAN/WAN technologies, other DSP, simple glue, memory control and state machines, backplane protocols the list is only limited by the imagination
FIR Filters for Xilinx FPGAS
Most audio, image and video processing can be done based around finite impulse response (FIR) filters
Programmability allows experimentation with different coefficients, filter windows etc to get the best quality
256 Tap FIR Filter Example
IP Core or Reference Design XAPP219 Transposed Form FIR Filters MAC FIR Serial Distributed Arithmetic FIR Filter Parallel Distributed Arithmetic FIR Filter Distributed Arithmetic FIR Filter
See www.xilinx.com/ipcenter for more details
Why FPGAs for A/V Processing?
High Computational Workloads
Conventional DSP Processor - Serial
1 GHz 256 clock cycles
= 4 MSPS
FPGA-based DSP - Parallelism
500 MHz 1 clock cycle
= 500 MSPS
Xilinx Programmable Solutions Provide Several Benefits
Accelerating time-to-market
Consumer devices require fast time-to-market ASICs & ASSPs take 12-18 months to spin out
Immediate production upon design release
Fast design iterations Rich, IP portfolio and efficient tools for design and synthesis
System integration Testing and verification
Re-programmable allows risk aversion/reduction Solutions are built on a proven FPGA technology with preverified silicon and IP that guarantees performance
Time-to-Market Value
Fastest Time-to-Market Additional Profit from Field Upgrades 1st to Market Profit Reduced Profit for Late Introduction
Revenue
Longest Time-in-Market
Time
Quicker time-to-market and reprogrammability provide the best chance of achieving full product profit potential
Xilinx Programmable Solutions Provide Several Benefits
Increased flexibility
Product customization to meet customer needs Accommodate multiple standards & spec updates/changes Feature upgrades through field upgradability
Remote update of software and hardware Increased lifetime for a product (time-in-market) and allows new, interesting applications Enable product features per end-user needs
Broad product line Broad IP and tools solutions
Xilinx Projector Solutions
Issues in creating a stand-alone ASIC/ASSP
Which standards and formats will win in which geographies? Choosing the right solution: over-design, under-design Product customization Development cost and amortization Flexible and customizable solutions possible in reprogrammable logic Multiple sourcing for key high $ BOM components Reduced support costs via reconfiguration over networks Commodity component flexibility Programmable logic solutions are standard parts
System cost management and assured source of supply
Low cost!
Xilinx in the Broadcast Chain
Gamma Correction Codecs Scaling/Resampling Colour Space Network Interfacing Chip Interfacing Video Filtering Effects (Wipe/Key) Memory Control FEC/Modulation System Control
Real Time HD/Multichannel DSP
Highest performance on-chip DSP blocks, multipliers and memory Reduce size of DSP farms Support real time HD processing Support multiple channels of SD processing through resource sharing Reduce cost-per-channel for FEC and modulation
DVB-S2 FEC & Modulation
Mode Adapt Stream Adapt
FEC
BCH
LDPC
Interleave
Mapper
Framing
Modulator
Medium Access Controller (PowerPC) Gigabit Network Interface
Cost Effective Connectivity
Significant cost-per-channel reductions Portfolio of audio/video connectivity solutions
SDI, HD-SDI and DVB-ASI Video-over-IP
SDI Equalizer $10 SDI Equalizer $10 SDI Equalizer $10
XC3S1000-5 $40
Wide range of general telecom, datacom and backplane solutions available
Ethernet, PCI Express, ATM, Fibre Channel, SONET, SPI RapidIO, HyperTransport
SDI Equalizer $10
~70% cheaper than ~70% cheaper than ASSP SDI solutions! ASSP SDI solutions!
Flexible Embedded Processing
8-bit Microcontroller Simple state-machines and localised on-chip control Pixel processing & display control
32-bit Microprocessors Cost/performance tradeoffs Extensive peripherals, RTOS & bus structures Networking & wireless comms, control & instrumentation
GbE MAC GbE MAC
Buffer
Filter
Remapper
LVDS Backplane I/F
Baseband Processing
VxWorks O/S Data Path Ctrl
Xilinx in Broadcast
Programmable Solutions for the Broadcast Industry
Interfaces & Connectivity
Codecs
Video & Audio Processing
Transmission & Reception
End Applications
More info on a wide range of applications and technologies www.xilinx.com/broadcast
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