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I: Overview Traditional thermal conductive material for metals and metal oxides, as well as other non-metallic material, such

as graphite, carbon black, A1N, SiC, etc.. With the development of science and technology and the production of many products of the thermal conductivity of the material put forward higher requirements, has excellent overall performance, light weight, chemical resistance, and excellent electrical insulating properties, impact resistance, and easy processing molding . The thermal conductivity of insulating polymer composite materials because of their excellent overall performance is more and more widely used. However, due to the polymer material is more than a poor conductor of heat, limiting its application in thermal conductivity, and thus the development of new polymer materials with good thermal conductivity, become an important development direction of the thermal conductivity of the material now. Especially in recent years, with the rapid development of high-power electronics, electrical products, is bound to appear more and more heating products, leading to product efficacy to reduce life shortening. Some data indicate that the electronic components temperature is increased by 2 , its decreased reliability 10%; 50 C when the life expectancy is only 25 C when the 1/6. The heat conductive filler is mainly divided into two: one is a thermal insulating filler, such as a metal oxide filler, a metal nitride filler. Another is the thermal conductivity of non-insulating filler, such as carbon-based filler, and various metal filler and the like. The former is mainly used for electronic components encapsulated materials electrical insulation performance requirements of the occasion, the latter mainly used in chemical equipment, heat exchangers lower electrical insulation performance requirements of the occasion. The type of filler, the particle size and distribution, the filling amount and the filler and matrix interface between the performance of the thermal conductivity of the composite material has an impact. The thermally conductive plastic using the matrix polymer: PA (nylon), the FEP (perfluoro polypropylene), PPS, PP, PI epoxy resin, POM, PS and PS and PE composite material or the like. Research status of the thermal conductivity of polymer matrix composites: polymer matrix composite thermal conductivity through conductive filler was added to increase the thermal conductivity of the polymer materials. General is a polymer (such as a polyolefin, an epoxy resin, polyimide, polytetrafluoroethylene, etc.) as the substrate, the better thermal conductivity of the metal oxides, such as A1203 MgO, good, thermal conductivity and insulating properties of metal nitride AIN, BN, and a metal material of high thermal conductivity such as Cu, the AI as a heat conductive filler, and a composite of the two-phase or multiphase system. Europe and Japan and the United States have companies reported have mature products promote the use of. For example: Royal Dutch DSM Engineering Plastics introduced the first new polymer of the 21st century: Stanyl TC Series conductive plastic can be used for LED; become a leading global supplier of plastic thermal management solutions for LED lighting applications. Advanced ceramic companies in the United States and the EPIC developed thermal conductivity rate 20.35W / (m K) BN / polybutylene (PB) composite engineering plastics used ordinary processes such as molding preparation derived mainly used for electronic packaging The integrated circuit boards, electronic control components, computer housing.

The domestic use of molded prepared epoxy (EP) system thermal conductivity, thermal conductivity of composite materials, AIN content, particle size, silane coupling agent, and processing of aluminum nitride. The study showed that as A1N content, the increase of the particle size, the thermal performance of the system and continuously improve; coupling agent enhances the interfacial bonding properties of AIN and epoxy, and the thermal resistance between the interface is reduced, thereby facilitating system thermal performance improvement. When AIN particle diameter of 5.3 microns content 67v01%, the rate of the thermal conductivity of the thermally conductive composite material AIN / EP 14W / (m K). Second: the conduction mechanism The thermal conductivity of the thermal conductivity of the polymer materials eventually be jointly decided by the polymer matrix, thermal conductive filler, and the interactions between them. No uniform heat transfer required in the polymer matrix substantially dense ordered crystal structure or load sub, thermal performance is relatively poor. As the thermally conductive filler is concerned, it is irrelevant whether the presence of a granular, flake, fibrous, thermal conductivity than the polymer matrix itself must be high. When the filling amount of the heat conductive filler is very small, can not be formed between the thermal conductive filler of the real contact and interaction, and this to the improved performance of the thermal conductivity of the polymer material is almost meaningless; only when the polymer matrix, the filling amount of the heat conductive filler to a certain critical value, the thermally conductive filler only true sense of the interaction of the system in order to form a similar mesh or chain the form of a thermal conductivity network chain. When the thermal network chain orientation is consistent with the direction of heat flow, thermal conductivity improve soon; system not formed in the direction of heat flow, thermal conductivity network chain will cause great thermal resistance on the direction of heat flow, thermal conductivity is poor. Therefore, how to maximize the system formed in the direction of heat flow, thermal conductivity network chain becomes key to improve the thermal conductivity of polymer material thermal conductivity. Heat conduction theory model: the thermal conductivity adhesive mainly filled thermal adhesive, the structured thermal conductivity adhesive also rarely reported. Many researchers have proposed various models predict, but filled with thermally conductive material the thermal conductivity of the filling amount of the theoretical model discussed generally concentrated in the low fill-or mediumfilled (volume fraction of 10% to 30%), but rarely mention consistent and high fill and under ultrahigh fill of the theoretical and experimental results. The Agari Y "a theoretical model suitable for highly filled and ultra-high fill level. This theoretical model that: in the filled polymer systems, if all of the filler particles formed by aggregation conducting block polymer conduction block in the direction of heat flow is parallel, and the highest thermal conductivity composites; if the heat flow direction is perpendicular to, the composite The rate of the thermal conductivity of the material to a minimum. The theoretical model is fully consider the impact of the particles on the thermal performance of the composite material, and assumes the state of dispersion of the particles is uniform, thereby obtaining a theoretical equation. Its expression is: A = VfC21g) 2 + (1 a) lg (c1A1,) Formula, A is the coefficient of thermal conductivity of the composite material, A and A,

respectively, for the coefficient of thermal conductivity of the polymer and filler, the volume fraction of the filler, c crystallized to affect the degree of crystallinity and the polymer to the size of the factor, C for the formation of particles thermal chain free factor. c The closer to 1, the particles the easier to form a thermally conductive chain, the greater the influence of the thermal conductivity of the composite material. In later studies found: low filled to ultra-high fill within the MaxwELlEucken, Bruggeman, Cheng-Vochen Nielsen's theoretical model with other theoretical models compared to the theoretical curve with the experimental data match, several other kinds of theoretical models and experimental data have a certain bias. Third: The purpose of this study The current domestic and international power LED industry lamps commonly used aluminum as a heat sink material of the shell, using thermal plastic shell can save a lot of energy and improve production efficiency, reduce the cost of LED products have a very real economic significance. Use plastic could greatly expand the lighting engineers to develop products Ling and creativity, more lightweight design beautiful products for faster promotion to the mass consumer. Based on the basis of extensive research, we propose to use cooling plastic mold production 8 watts, whether the temperature of the various parts of the 10-watt LED downlight base, check product conform to the requirements for eligibility to test heat plastic for mass production.

Fourth: the results of the test This article uses self-developed heat sink material produced 8 watt, 10-watt LED downlight base to replace the original cast aluminum base made 8 watts, 10-watt LED downlight Low Block, the temperature rise of the multi-channel tester lights, according to the standard IEC60598 12.4 temperature cup of points. Photo:

Test results: 1:8 watt LED downlight temperature test: Test records 1, the test conditions and requirements: recording the highest temperature of the points in the sample is energized (220V/50Hz) until the temperature stable, requiring no more than the temperature limit 2, the standard terms and conditions: IEC60598 12.4 3, test instruments: multiple temperature rise tester Maximum temperature difference of 3.4 degrees The 2:10-watt LED downlight temperature test:

Maximum temperature difference of 5.1 degrees

Fourth: the results of analysis See from the test results of two different wattage downlights, the the cooling materials production with homemade downlights and downlight cast aluminum housing production in the temperature of each test point or less, the maximum temperature difference of no more than six degrees The temperature of all test points are lower than the limit temperature can be used. So as to achieve the purpose of cooling plastic instead of aluminum to produce LED downlight.