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Fundamentals of heat and mass transfer seventh edition bergman lavine incropera dewitt

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27

KNOWN: Operating conditions for a board mounted chip. FIND: (a) Equivalent thermal circuit, (b) Chip temperature, (c) Maximum allowable heat dissipation for dielectric liquid (ho = 1000 W/m2⋅K) and air (ho = 100 W/m2⋅K). Effect of changes in circuit board temperature and contact resistance. SCHEMATIC:

ASSUMPTIONS: (1) Steady-state conditions, (2) One-dimensional conduction, (3) Negligible chip thermal resistance, (4) Negligible radiation, (5) Constant properties. PROPERTIES: Table A-2, Aluminum oxide (polycrystalline, 358 K): kb = 32.4 W/m⋅K. ANALYSIS: (a)

& & (b) Applying conservation of energy to a control surface about the chip ( Ein − E out = 0 ) , q′′ − q′′ − q′′ = 0 c i o

q′′ = c

1 h i + ( L k )b + R ′′ t,c

Tc − T∞,i

+

Tc − T∞,o 1 ho

With q ′′ = 3 × 10 4 W m 2 , ho = 1000 W/m2⋅K, kb = 1 W/m⋅K and R ′′ = 10−4 m 2 ⋅ K W , c t,c 3 × 104 W m 2 =

(1 40 + 0.005 1 + 10−4 ) m2 ⋅ K W

Tc − 20o C

+

Tc − 20o C

(1 1000 ) m 2 ⋅ K

W

**3 × 104 W m 2 = ( 33.2Tc − 664 + 1000Tc − 20, 000 ) W m 2 ⋅ K 1033Tc = 50,664
**

Tc = 49°C. (c) For Tc = 85°C and ho = 1000 W/m2⋅K, the foregoing energy balance yields

< <

2

q′′ = 67,160 W m 2 c

2 2

with q′′ = 65,000 W/m and q′′ = 2160 W/m . Replacing the dielectric with air (ho = 100 W/m ⋅K), the i o following results are obtained for different combinations of kb and R ′′ . t,c

Continued...

PROBLEM 3.27 (Cont.)

kb (W/m⋅K)

R ′′ t,c

q ′′ (W/m2) i

q ′′ (W/m2) o

q ′′ (W/m2) c

(m2⋅K/W)

1 32.4 1 32.4

10-4 10-4 10-5 10-5

<

2159 2574 2166 2583 6500 6500 6500 6500 8659 9074 8666 9083

COMMENTS: 1. For the conditions of part (b), the total internal resistance is 0.0301 m2⋅K/W, while the outer resistance is 0.001 m2⋅K/W. Hence

T − T∞,o q′′ o = c q′′ Tc − T∞,i i

( (

) )

R ′′ o R ′′ i

=

0.0301 = 30 . 0.001

and only approximately 3% of the heat is dissipated through the board. 2. With ho = 100 W/m2⋅K, the outer resistance increases to 0.01 m2⋅K/W, in which case q ′′ q ′′ = R ′′ R ′′ o i i o = 0.0301/0.01 = 3.1 and now almost 25% of the heat is dissipated through the board. Hence, although ′′ measures to reduce R i would have a negligible effect on q ′′ for the liquid coolant, some improvement c may be gained for air-cooled conditions. As shown in the table of part (b), use of an aluminum oxide board increase q ′′ by 19% (from 2159 to 2574 W/m2) by reducing R ′′ from 0.0301 to 0.0253 m2⋅K/W. i i

′′ Because the initial contact resistance ( R ′′ = 10 −4 m 2 ⋅ K W ) is already much less than R i , any reduction t,c in its value would have a negligible effect on q ′′ . The largest gain would be realized by increasing hi, i since the inside convection resistance makes the dominant contribution to the total internal resistance.

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