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General Note #1 :Different kinds of IC Packages

General Note #1 :Different kinds of IC Packages
Image Name Description & Examples BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.

Ball Grid Array aka BGA

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The Plastic Quad Flat Pack, or PQFP, is an IC package with leads extending from all four sides Plastic Quad of the package body. PQFP's are predominantly Flat Package square in shape, although rectangular variants aka PQFP do exist. The PQFP is just one of the many types of the quad flat pack (QFP) package.

Ceramic Column Grid Array, or CCGA

The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls. These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array'. The CCGA is basically just a CBGA package that has solder columns instead of solder balls.

The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power. PSOP - Power Small Outline Package

PrayogWiki - http://wiki.electroons.com/

It is a rectangular ceramic package that In-line has leads extending from both of its longer Package sides. Typical QSOP lead counts range from 16 to 28 leads for the narrow body and 36 to 44 leads for the wide body. thus forming two sets of in-line pins.electroons. except for the absence of leads protruding from its sides. is a hermetically sealed rectangular ceramic package that has leads extending from both of its longer sides. Ceramic Package. http://wiki. It is basically a quad flat package.electroons.com/doku. is a very small square-shaped or rectangular surface-mount plastic package with no leads.php?id=ic_packages The Ceramic Dual In-line Package. or Cerpack The Ceramic Package. or QFN. Metal pads or lands around the periphery of the bottom of the QFN package serve as electrical QFN .The QSOP comes in two QSOP standard body widths: the narrow body QSOP Quarter Size which has a nominal body thickness of 150 mils Outline and the wide body QSOP which has a nominal Package body thickness of 300 mils. It is therefore a type of dual-in-line package (DIP) like the CerDIP. The Quad Flat No Leads package. it exhibits less inductance than leaded packages and therefore provides a higher electrical performance. Because Flat No Leads the QFN has no leads and has shorter bond wire lengths. The QSOP lead pitch is typically 25 mils. is a small rectangular surface-mount plastic package with gull wing leads protruding out of its longer sides. The QFN package also includes an exposed thermal pad at the package bottom to facilitate heat dissipation from the die.com/ Printed on 2012/09/01 09:46 . The Quarter Size Outline Package.Last update: 2012/09/01 09:17 ic_packages http://wiki. or CerDIP is CerDIP one of the most mature IC packages still in use Ceremic Dual today.Quad connection points to the outside world. or QSOP. or Cerpack. thus forming two sets of in-line pins.

Sidebraze Package The Sidebraze Package. For Ceramic electrical connection to the outside world. Note that aside from these two. is a square or rectangular surface-mount CLCC or LCC ceramic package that has no leads. The CPGA can either have a frit-sealed ceramic lid or a solder-sealed metal lid. the Leadless Chip LCC instead uses flat metal contacts (or Carrier metallized castellations) known as pads around the four sides of the package bottom. CQFP Ceramic Quad Flat Pack The Ceramic Quad Flat Pack. Small Outline Transistor (SOT) packages are very small. is a square or rectangular through-hole ceramic package whose pins or leads are arranged in a square array at the bottom of the package body.2012/09/01 09:46 3/9 General Note #1 :Different kinds of IC Packages The Ceramic Leadless Chip Carrier. Due to their low cost and low profile. Two other widely used DIP's are the PDIP and the CerDIP.The CPGA is just one of several types of the PGA package. although rectangular variants do exist. CQFP's are predominantly square in shape. or CLCC or LCC. (SOT) The SOT-23 and the SC-70 packages are two of Package the most widely used SOT packages today. or CPGA. Transistor SOT's are widely used in consumer electronics.com/ . or CQFP. is one of the most mature IC packages still in use today.electroons. The CQFP is just one of the many types of the quad flat pack (QFP) package. It is a rectangular ceramic package that has leads extending from both of its longer sides. The PGA is a popular choice for devices with high I/O counts such as microprocessors because of its high pin density. there are many other SOT package types used in the IC industry.http://wiki. PrayogWiki . thus forming two sets of in-line pins. It is therefore a type of dual-in-line package (DIP). inexpensive surface-mount plastic-molded packages with leads on their two Small Outline long sides. is a ceramic IC package with leads extending from all four sides of the package body. CPGA Ceramic Pin Grid Array The Ceramic Pin Grid Array.

is basically the surface-mount equivalent of the TO-220 through-hole package and is therefore sometimes referred to as 'SMD-220'.electroons. It is one of the most commonly used surface mount packages today.php?id=ic_packages The Single-in-Line Package. is an IC package that has a single row of leads protruding from the bottom of its body. or D2PAK or DDPAK is the successor to the DPAK package. http://wiki. The D2PAK is also known as 'TO-263'. Just like the D2PAK (and the DPAK. The D3PAK is also known by other names such as 'TO-268' and 'Discrete Package 3'. which was designed by Motorola to encase discrete high-power devices. is a bigger version of the D2PAK package. SOJ: Small Outline J-Lead Package The 'Small Outline J-Lead Package'. The leads protrude from the longer edge of the package. The D2PAK. The leads protrude from the longer edge of the package. or D3PAK. or SOJ. It is not Single-in-Line as widely used as dual-in-line packages such as Package (SIP) the PDIP and the CerDIP because of its limited number of pins. or SOIC.com/doku. The SOJ is also sometimes referred to as 'SOIJ'. which has a flat heat sink at the back. or J-leaded small outline IC package. SOIC . the D2PAK's predecessor).electroons. The D2PAK is bigger than the DPAK.com/ Printed on 2012/09/01 09:46 . or SIP. the D3PAK is a surface-mount plastic-molded package intended for high-power discrete devices. is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads.Last update: 2012/09/01 09:17 ic_packages http://wiki. SIP's are often used in packaging networks of multiple resistors.Small Outline Integrated Circuit The 'Small Outline Integrated Circuit'. D3PAK Decawatt Package 3 The Decawatt Package 3. is a small rectangular surface-mount plastic-molded integrated circuit package with J-formed leads. and comes in several versions with different terminal counts. D2PAK or DDPAK Double Decawatt Package The Double Decawatt Package.

2012/09/01 09:46 5/9 General Note #1 :Different kinds of IC Packages The Dual Flat No Leads package. is a rectangular plastic package with leads SPDIP extending from both of its long sides.http://wiki. is a very small square-shaped or rectangular surface-mount plastic package with no leads. having a compressed body and a tightened lead pitch.electroons. However. The SPDIP is Dual-in-Line actually just a 'shrink' version of the PDIP. is an IC package developed by Motorola to encase discrete high-power devices. FBGA Fine-Pitch Ball Grid Array The Fine Pitch Ball Grid Array. DPAK Decawatt Package The Decawatt Package. Metal pads or lands along two sides of the DFN . As Package such. or SSOP. The Shrink Plastic Dual In-line Package. FBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. except that the latter has lands all around the periphery of the package instead of just two sides like the DFN. thus Shrink Plastic forming two sets of in-line pins.com/ . or DPAK. is a smaller version of the ball grid array (BGA) package.DPAKs can have 3 or 5 terminals. As its name implies. or SPDIP. SSOP Shrink Small Outline Package The Shrink Small Outline Package. the SPDIP provides a smaller package size compared to a standard PDIP for the same lead count. PrayogWiki . is a smaller or 'shrunk' version of the SOIC package. The DPAK is also known as the 'TO-252'.Dual bottom of the DFN package serve as electrical Flat No Leads connection points to the outside world. As in all BGA packages. with a smaller and thinner body than the standard BGA package. it also features a finer ball pitch (smaller distance between balls). or DFN. The DFN is similar to the QFN. or FPBGA or FBGA. The acronym 'DPAK' can also stand for the term 'Discrete Package'. the FBGA is near-chip-scale in size.

LFBGA . or JLCC.com/doku. TFBGA's use solder balls Profile that are arranged in a grid or array at the Fine-Pitch bottom of the package body for external Ball Grid electrical connection. The Thin Quad Flat No Leads package. it uses metal pads Quad Flat No around the periphery of the bottom of the Leads package body for electrical connection to the outside world. is a thinner version of the FBGA package. or TDFN.7 mm. is a smaller version of the ball grid array (BGA) package. TDFN . The plastic-molded equivalent of the Carrier JLCC is the PLCC. is a very small and thin square-shaped or rectangular surface-mount plastic package with TQFN . It is therefore thicker than the TFBGA and the VFBGA. Instead of leads. The Thin Profile Fine Pitch Ball Grid Array.Thin Dual Flat No Leads The Thin Dual Flat No Leads package. TFBGA .2 mm and 1. is a JLCC square or rectangular surface-mount ceramic J-Leaded package that has J-formed leads around its Ceramic Chip periphery.electroons. is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads.Low Profile Fine-Pitch Ball Grid Array The Low-Profile Fine Pitch Ball Grid Array. It is basically a thinner version of the quad flat no leads (QFN) package. or TFBGA.php?id=ic_packages The J-Leaded Ceramic Chip Carrier. http://wiki.Thin Like all BGA packages.com/ Printed on 2012/09/01 09:46 . The TFBGA is Array near-chip-scale in size and features ball pitch values that are even tighter than those of the FBGA. or LFPBGA. It is basically a thinner version of the dual flat no leads (DFN) package.electroons. or TQFN.Thin no leads.Last update: 2012/09/01 09:17 ic_packages http://wiki. It is basically an FBGA package that has a package height ranging from 1. it uses metal pads along two sides of the package body for electrical connection to the outside world.

It is basically a thinner version of the MQFP and LQFP. TQFP . hence the name 'land grid array'. are arranged in a grid or array at the bottom of the package body. The Type II TSOP has its leads protruding from the longer edges of the package. LQFP .Thin mm.Land Grid Array The Land Grid Array. The MLP belongs to the same 'no leads' package family as the QFN and the DFN.0 TSOP .com/ . near-CSP square-shaped or rectangular surface-mount plastic package uses metal pads instead of leads for electrical connection to the outside world.http://wiki. PrayogWiki . or MLP. The Thin Small Outline Package. making it a popular packaging option for devices with high I/O requirements. which are called 'lands'. is a JEDEC-compliant.Thin Quad Flat Pack The Thin Quad Flat Pack. is a Profile Quad surface-mount IC package with leads extending Flat Pack from all four sides of the package body.2012/09/01 09:46 7/9 General Note #1 :Different kinds of IC Packages LGA . or TQFP. is a rectangular IC package with a thickness of 1. is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array).Micro Leadframe Package The Micro Leadframe Package. very thin. The grid arrangement of the lands of the LGA package allows it to have a high land count. There are two types of TSOP's. is a surface-mount IC package with gull wing leads on all four sides of the package body. or TSOP. or LGA. MLP . These metal pads. The Type I Small Outline TSOP has its leads protruding from the shorter Package edges of the package.electroons. or LQFP.Low The Low Profile Quad Flat Pack.

It is basically a thinner version of the thin dual flat no leads (TDFN) package. It has a smaller body and smaller lead pitch than the standard SOIC package. The MSOP is a miniaturized Package version of the SSOP package. it uses metal Thin Dual pads along two sides of the package body for Flat No Leads electrical connection to the outside world. is a very small and thin square-shaped or rectangular surface-mount plastic package UTDFN .Thin Shrink Small Outline Package The Thin Shrink Small Outline Package.com/ Printed on 2012/09/01 09:46 .Last update: 2012/09/01 09:17 ic_packages http://wiki.electroons. The Ultra Thin Dual Flat No Leads package. having a smaller footprint than the latter. or TSSOP. or micro-SOP or MSOP. is a rectangular surface mount plastic package with gull-wing leads.php?id=ic_packages TSSOP . or UTDFN.com/doku. MQFP Metric Quad Flat Pack The Metric Quad Flat Pack. or MQFP. http://wiki. It is also smaller and thinner than a TSOP with the same lead count. The Micro Small Outline Package. is a surface-mount IC package with gull wing leads on all four sides of the package body. is a very small rectangular plastic MSOP .Ultra with no leads.electroons.Micro package with gull wing leads protruding out of Small Outline its longer sides. Instead of leads.

or UTQFN.Very of several smaller versions of the SOIC package. It is basically a thinner version of the thin quad flat no leads (TQFN) package.Plastic less board space than the gull-wing leads that Leaded Chip other packages like the SOIC have.php?id=ic_packages Last update: 2012/09/01 09:17 PrayogWiki . is a very small and thin square-shaped UTQFN or rectangular surface-mount plastic package Ultra Thin with no leads.http://wiki.electroons. or VSOP.Plastic the most mature plastic IC packages still in use Dual-in-Line today. PLCC lead Carrier counts range from 18 to 84. These “J” leads occupy PLCC .electroons.electroons. Another smaller version of the SOIC is the SSOP. it uses metal Quad Flat No pads around the periphery of the package body Leads for electrical connection to the outside world. Small Outline having a compressed body and a tightened Package pitch for its gull wing leads. is one VSOP . or PLCC is a four-sided plastic package that has “J” leads around its periphery. The ceramic equivalent of the PLCC is the JLCC.com/ . Instead of leads.com/doku. PLCC packages can either be square or rectangular in shape. The Plastic Leaded Chip Carrier.PrayogWiki Permanent link: http://wiki. It is rectangular in shape and has leads Package extending from both sides along its length. From: http://wiki.com/ . or PDIP. The Very Small Outline Package. is one of PDIP . thus forming two sets of in-line pins. he Plastic Dual In-line Package.2012/09/01 09:46 9/9 General Note #1 :Different kinds of IC Packages The Ultra Thin Quad Flat No Leads package.