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**Based on IPC-7351A
**

X3-DFN0603-2

X 1 X

Dimensions

Y

G C

C G X X1 Y

Value (in mm) 0.355 0.150 0.230 0.610 0.300

X2-DFN0806-3

X1

Y1

Dimensions C X X1 X2 Y Y1 Y2

Y2 X (2x)

Y (2x)

Value (in mm) 0.350 0.200 0.450 0.550 0.375 0.475 1.000

C X2

X 1 X

X1-DFN1006-2 / X2-DFN1006-2

Dimensions

Y

G C

C G X X1 Y

Value (in mm) 0.70 0.30 0.40 1.10 0.70

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 1 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

**X1-DFN1006-3 / X2-DFN1006-3
**

C X1 X G2

G1 Y Z

Dimensions Value (in mm) Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7

X2-DFN1010-6

X1 C

Y (6x)

Dimensions C G X X1 Y Y1

Y1

Value (in mm) 0.350 0.150 0.200 0.900 0.550 1.250

1

G(4x) X(6x)

W-DFN1114-3

X 1 Y 2 X

Y 1

Y

Dimensions C X X1 X2 Y Y1 Y2

Value (in mm) 0.550 0.400 0.750 0.950 0.450 0.710 1.375

C X 2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 2 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

X1-DFN1212-3

X Y X

X1-DFN1212-3 Type B

Y2 Y1 (2x) C

X1 (2x)

Dimensions Value (in mm) C 0.80 X 0.42 X1 0.32 Y 0.50 Y1 0.50 Y2 1.50

Y X2 Y3 Y2 X1(2x) Y1 (2x) C

Dimensions Value (in mm) C 0.80 X 0.42 X1 0.32 X2 0.90 Y 0.50 Y1 0.50 Y2 0.20 Y3 1.50

X2-DFN1410-6

X1 C

Y(6x)

Dimensions C G X X1 Y Y1

Y1

Value (in mm) 0.500 0.250 0.250 1.250 0.525 1.250

1

G(4x)

X(6x)

X1-DFN1411-3

C

X2 X1 G2 X

Y Z

G1

Dimensions Z G1 G2 X X1 X2 Y C

Value (in mm) 1.38 0.15 0.15 0.95 0.75 0.40 0.75 0.76

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 3 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

**X1-DFN1612-6 / X2-DFN1310-6
**

G2 X2 Y2 G1 b Y1

G3

a

X1

Dimensions G1 G2 G3 X1 X2 Y1 Y2 a b

X1-DFN1612-6 0.15 0.175 0.15 0.60 0.25 0.65 0.45 0.10 0.15

X2- DFN1310-6 0.16 0.17 0.15 0.52 0.20 0.52 0.375 0.09 0.06

U-DFN1616-6

X3

X1-DFN1616-6 Type E

Y X2

C

Y (2x)

Dimensions C X X1 X2 X3 Y Y1 Y2

G X1

Dimensions Value (in mm) Z 1.3 G 0.175 X1 0.50 X2 0.525 Y 0.30 C 0.50

Y2 X2 X1

Y1

Z

X (6x) C

Value (in mm) 0.500 0.300 0.200 0.720 0.400 0.475 0.620 1.900

U-DFN1616-8

X2 Y2 a G2

Y1

G1

Dimensions Value (in mm) G1 0.15 G2 0.20 X1 0.65 X2 0.25 Y1 1.25 Y2 0.50 C 0.40 a 0.10

X1

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 4 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN2018-6

X Y C

Y1

G

Dimensions C G X X1 Y Y1

Value (in mm) 0.50 0.20 0.25 1.60 0.35 1.20

X1

U-DFN2020-3

X X2 X4 Y3 Y4 R3 G Y1 X1 C Y2 Y5 X3 R2 Y R1

Dimensions C G X X1 X2 X3 X4 Y

Value Value Dimensions (in mm) (in mm) 1.00 Y1 0.60 0.15 Y2 0.45 1.40 Y3 0.45 0.35 Y4 0.698 0.45 Y5 0.313 0.322 R1 0.225 0.60 R2 0.05 1.10 R3 0.20

U-DFN2020-6

X2 X1

Y (6x)

Dimensions C X X1 X2 Y Y1 Y2

Y2

Y1

Value (in mm) 0.650 0.350 1.650 1.700 0.525 1.010 2.400

X (6x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 5 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

X2-DFN2020-6

X2 X1

Y

Dimensions C X X1 X2 Y Y1 Y2 Y3

Y3

Y2 Y1

Value (in mm) 0.650 0.400 1.050 1.700 0.500 1.600 1.600 2.300

X (6x)

C

U-DFN2020-3 Type B

X Y1

U-DFN2020-6

Y

C G

Dimensions C G X X1 Y Y1 Y2

Y

G

X1 Y2 C

Value (in mm) 1.30 0.24 0.35 1.52 1.09 0.47 0.50

X2

Dimensions Z G X1 X2 Y C

X1

G Y Z

Value (in mm) 1.67 0.15 0.90 0.45 0.37 0.65

U-DFN2020-6 Type B

Y X2 G1 X1 C

U-DFN2020-6 Type E

Dimensions

G

G Y1 Z

Z G G1 X1 X2 Y Y1 C

Value (in mm) 1.67 0.20 0.40 1.0 0.45 0.37 0.70 0.65

Dimensions C X X1 X2 Y Y1 Y2 Y3

Y3 Y2

X2

Y1

X1

Value (in mm) 0.650 0.400 0.285 1.050 0.500 0.920 1.600 2.300

X (6x)

C

Y (2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 6 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN2030-8

X2 C Y

Dimensions C G X X1 X2 Y Y1 Y2

G Pin1 X

Y2 X1

Y1

Value (in mm) 0.500 0.250 0.350 1.500 1.850 0.600 1.600 3.300

U-DFN2510-8

X1

X X1

U-DFN2523-6

Dimensions

Y Y1 G

c c1

c c1 G X X1 Y Y1

Value (in mm) 0.5 1.0 0.2 0.2 0.4 0.6 1.4

Y1 Y2 Y3

Y C X

Dimensions Value (in mm) C 0.650 X 0.400 X1 1.700 Y 0.650 Y1 0.450 Y2 1.830 Y3 2.700

U-DFN2626-10

X2

Y

Dimensions

X1 Y2 Y1

C X X1 X2 Y Y1 Y2

Value (in mm) 0.500 0.300 2.250 2.300 0.600 1.360 3.000

Pin1

C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 7 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN3016-12

X1

Y (12x)

Dimensions C X X1 X2 Y Y1 Y2

X2

Y1

Y2

Value (in mm) 0.500 0.300 2.800 2.250 0.600 0.450 2.050

C

X (12x)

W-DFN3020-8 Type B

C X Y1 G Y2 Y G1

X1

Dimensions Value (in mm) C 0.650 G 0.285 G1 0.090 X 0.400 X1 1.120 Y 0.730 Y1 0.500 Y2 0.365

W-DFN3020-8 Type K

X5 C X (2x) Y (4x)

Dimensions C X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8

Y8 Y7 Y5 Y6

X4 X3 Y4 Y2 X2 Y3

X1 (6x)

Y1

Value (in mm) 0.650 0.600 0.400 0.825 0.675 1.250 2.750 0.675 0.550 0.850 0.755 1.455 1.000 0.650 1.455 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 8 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN3020-8 Type E

C

Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3

G Y3 Y1 X1 G1 Y (8x) X (8x) X2 Y2

Value (in mm) 0.650 0.200 0.150 0.400 1.100 1.100 0.550 0.900 0.900 2.300

U-DFN3020-8 Type M

X1 (2x) X (8x) Y6 Y (4x)

Dimensions C X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6

X4

Y2 X2 X3 Y4 Y1 (2x) Y3

Y5

Pin1

C X5

Value (in mm) 0.650 0.400 0.600 1.320 1.200 0.200 2.750 0.750 0.550 0.680 0.450 0.430 2.400 0.250

U-DFN3020-10

X2

Dimensions C G G1 X X1 X2 Y Y1 Y2

G1 Y2 G Y1 X1

Y

C

X

Value (in mm) 0.650 0.150 0.600 0.300 0.350 2.800 0.500 1.000 2.300

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 9 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN3030-4 Dimensions C G1 G2 G3 G4 G5 G6 G7 G8 R X X1 X2 X3 Y Y1 Y2 Y3 Value (in mm) 1.300 0.100 0.150 0.830 0.115 0.135 0.170 0.500 0.500 0.150 0.500 1.375 1.225 1.175 1.980 1.015 0.715 0.650

U-DFN3030-8

C Y3 (2x) G4 X3

G6 G1 R Y G2

Z

Y2

G3

X1

Y1 G7

G5 X2 X1 G8

X2 Y C

Dimensions Value (in mm) Z 2.59 G 0.11 X1 2.49 X2 0.65 Y 0.39 C 0.65

G

X (4x)

U-DFN3030-8 Type E

X (x8) Y (x8) C

Y1

Y2

Dimensions C C1 X Y Y1 Y2

Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75

C1

U-DFN3030-10

Y C X1 G

Y C

U-DFN3030-12

X

G Z

Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.30 C 0.50

X1 G

X

G

Dimensions Value (in mm) Z 2.60 G 0.15 X 1.80 X1 0.60 Y 0.28 C 0.45

Z

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 10 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN3030-14

X2 Y (14x)

Dimensions

X1 Y2 Y1

C X X1 X2 Y Y1 Y2

Value (in mm) 0.400 0.250 2.350 2.650 0.600 1.750 3.400

Pin1

C X (14x)

U-DFN4030-12

X2

Y (12x)

Dimensions

X1

Y1

Y2

C X X1 X2 Y Y1 Y2

Value (in mm) 0.500 0.300 2.800 3.350 0.600 1.750 3.400

Pin1

C

X (12x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 11 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-DFN4030-12 Type B Value (in mm) 0.500 0.350 1.160 0.900 1.720 0.850 3.700 0.700 0.870 0.500 0.550 0.350 1.710 0.940 3.300

Dimensions

C Y X (12X)

Y1 X1(2x)

Y2

X2

Y6 Y5 (2x)

Y7 X3 (2x)

Y3

1

X4 X5

Y4

C X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6 Y7

U-DFN4030-12 Type C

X5 Y6 G X1

DFN322 Value (in mm) 0.500 0.225 0.300 0.800 0.890 0.990 1.150 3.590 0.600 0.600 0.440 1.030 1.750 3.400 0.275

Dimensions C G X X1 X2 X3 X4 X5 Y Y1 Y2 Y3 Y4 Y5 Y6

C

C

Y

X (3x) Y (2x)

Dimensions C G X X1 Y Y1 Y2 Y3 Y4

X2

Y2

X3 Y4 Y3 X4 Y5

G Y4 Y3 Y2 X1 Y1

Y1 (6x)

Value (in mm) 0.65 0.20 0.35 1.52 0.55 0.98 0.47 0.63 2.20

1

C

X (12x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 12 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

W-DFN5020-6

Z

Y X X1 C Y2 Y3 X2 G

W-DFN5060-4

C

Dimensions Value (in mm) C 0.50 G 0.35 X 0.35 X1 0.90 X2 1.80 Y 0.70 Y2 1.60 Y3 3.20

Y1

Dimensions Value (in mm) C 4.00 X 0.75 Y 0.95 Y1 6.20 Z 4.75

X (4x) Y (4x)

U-DFN6040-12

X3 C Y G

Dimensions C G G1 X X1 X2 X3 Y Y1 Y2 Y3

Y1 X1 X2

G1

Y2

Y3

Pin1 X

Value (in mm) 0.500 0.650 0.350 0.250 1.075 1.275 2.750 0.400 1.150 1.000 2.300

MiniMELF / MELF

X 1 X

Dimensions

Y

C G X X1 Y

Value (in mm) MiniMELF MELF 3.50 4.80 2.10 3.30 1.30 1.50 4.70 6.30 1.70 2.70

G C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 13 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

DF-S / MiniDIP

X

X

MSOP-8

C

Y

Z

Dimensions DF-S MiniDIP Z 10.26 6.91 X 1.2 0.60 Y 1.52 0.76 C 5.2 2.67

Dimensions C X Y Y1

Y1

Y C

Value (in mm) 0.650 0.450 1.350 5.300

MSOP8-EP

X C

MSOP-10

G

Y

Dimensions C G X X1 Y Y1 Y2

Y2 X1

Y1

**Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300
**

Y

X

Dimensions

C1

C2

X Y C1 C2

Value (in mm) 0.30 1.4 4.4 0.50

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 14 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

POWERDI 5

X

®

POWERDI 123 / POWERDI 323

®

®

Y

X1

G

X2

Y2

X1 (2x) Y1 (2x) C

Y1

G

Dimensions C G X X1 Y Y1

Value (in mm) 1.840 0.852 3.360 1.390 4.860 1.400

Dimensions POWERDI®123 POWERDI®323 G 1.0 0.5 X1 2.2 2.0 X2 0.9 0.8 Y1 1.4 0.8 Y2 1.4 1.1

**POWERDI 123 Type B
**

X

®

Dimensions

Y

G X X1 Y

Value (in mm) 2.000 1.050 4.100 1.500

G X1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 15 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

POWERDI 3333-8

®

**POWERDI 3333-8 Type B X1
**

G Y1 X2 (3x)

®

X G

8 Y2 G1

5 Y1 Y

Y3 Y4

X3

Y2

Y6 X4 Y5

1 Y3 X2 C

4

Y (5x) X (5x)

C

Dimensions C G G1 Y Y1 Y2 Y3 X X2

Value (in mm) 0.650 0.230 0.420 3.700 2.250 1.850 0.700 2.370 0.420

Dimensions C G X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5 Y6

Value (in mm) 0.650 0.230 0.420 2.370 0.420 1.890 2.710 0.700 0.400 1.160 1.850 0.405 1.295 3.700

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 16 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

POWERDI 5060-8

®

**POWERDI 5060-8 Type B
**

X 1 Y 1

®

X Y2

Y 3

Y 2

Y1 Y

X1

Y 6 Y 4 Y 5

G1 C Y3 (4x)

Y

︵

5 x

︶

X2 (8x)

Dimensions C G G1 X X1 X2 Y Y1 Y2 Y3

G

Value (in mm) 1.270 0.660 0.820 4.420 4.100 0.610 6.610 3.810 1.020 1.270

C X

Dimensions C X X1 Y Y1 Y2 Y3 Y4 Y5 Y6

Value (in mm) 1.270 0.610 4.420 0.910 0.910 0.895 2.130 0.585 2.550 6.550

POWERDI 3030-8

C

®

Y (8x)

Dimensions C X Y Y1

Y1

X (8x)

Value (in mm) 0.650 0.400 0.850 3.400

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 17 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

QSOP-16

X1 Y 16x

Dimensions Value (in mm) 0.635 0.350 4.795 1.450 6.400

Y C

C X X1 Y Y1

1

X 16x

QSOP-20

X 1

Y 2 0 x

Dimensions

Y 1 C

C X X1 Y Y1

Value (in mm) 0.635 0.350 6.065 1.450 6.400

1

X 2 0 x

SM-8

Y (8x) C1 Y1

Dimensions C C1 X Y Y1

C

Value (in mm) 1.52 4.6 0.95 2.80 6.80

X (8x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 18 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

X 1 X

SMA/SMAF/SMB

Dimensions

Y G C

C G X X1 Y

Value (in mm) SMA/SMAF SMB 4.00 4.30 1.50 1.80 2.50 2.50 6.50 6.80 1.70 2.30

SMC

X 1 X

Dimensions

Y

C G X X1 Y

Value (in mm) 6.80 4.40 2.50 9.40 3.30

G C

SO-8

X

C1 C2 Y

Dimensions Value (in mm) X 0.60 Y 1.55 C1 5.4 C2 1.27

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 19 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

SO-14

X

C1 C2 Y

Dimensions Value (in mm) X 0.60 Y 1.50 C1 5.4 C2 1.27

SO-16

X1

Dimensions

Y1

Y Pin 1 X C

C X X1 Y Y1

Value (in mm) 1.270 0.670 9.560 1.450 6.400

SO-20

Y

Dimensions

Y1 G

C G X Y Y1

Value (in mm) 1.27 8.00 0.60 1.50 11.00

X

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 20 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

SOD123

X1 X Y

Dimensions Value (in mm) G 2.250 X 0.900 X1 4.050 Y 0.950

G

SOD323

X1 X Y

**Dimensions Value (in mm) G 1.520 X 0.590 X1 2.700 Y 0.450
**

G

SOD323F

X Y

X1

**Dimensions Value (in mm) G 1.280 X 0.710 X1 2.700 Y 0.403
**

G

SOD523

X1 X

Y

Dimensions Value (in mm) G 0.80 X 0.60 X1 2.00 Y 0.70

G

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 21 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

SOT143

X

Y1

SOT223

X1

X2 Y G

Z

C

C1

Y2

X1

X2

C2 X2

Dimensions Z G X X1 X2 Y C

Value (in mm) 2.70 1.30 2.50 1.0 0.60 0.70 2.0

Dimensions X1 X2 Y1 Y2 C1 C2

Value (in mm) 3.3 1.2 1.6 1.6 6.4 2.3

SOT523 / SOT323 / SOT23 / SC59

Y

Z

C

X

E

Dimensions Z X Y C E

SOT523 1.8 0.4 0.51 1.3 0.7

SOT323 2.8 0.7 0.9 1.9 1.0

SOT23 2.9 0.8 0.9 2.0 1.35

SC59 3.4 0.8 1.0 2.4 1.35

SOT23F

C

Y1

Y (3x)

Dimensions Value (in mm) C 0.95 X 0.60 Y 0.80 Y1 1.80

X (3x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 22 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

**SC74R / SOT26 / SOT363 / SOT563
**

C2 C2

**SOT25 / SOT353 / SOT553
**

C2 C2

Z

G

C1

Z

G

C1

Y X

Y X

Dimensions Z G X Y C1 C2

SC74R / SOT26 3.20 1.60 0.55 0.80 2.40 0.95

SOT363 2.5 1.3 0.42 0.6 1.9 0.65

SOT563 2.2 1.2 0.375 0.5 1.7 0.5

Dimensions Z G X Y C1 C2

SOT25 3.20 1.60 0.55 0.80 2.40 0.95

SOT353 2.5 1.3 0.42 0.6 1.9 0.65

SOT553 2.2 1.2 0.375 0.5 1.7 0.5

SOT666

C Y (6x)

G

Dimensions Value (in mm) C 0.50 G 0.80 X 0.35 Y 0.50

X (6x)

SOT953

C C

Y1

Y (5X)

Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100

X (5X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 23 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

SOT963

C C

Y1

Y (6X)

Dimensions Value (in mm) C 0.350 X 0.200 Y 0.200 Y1 1.100

X (6X)

SOT89-3

X1

X1

SOT89-5

X2 (2x) Y1 Y3 Y Y2 C X (3x) Y4

Dimensions Value (in mm) X 0.900 X1 1.733 X2 0.416 Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950 Y4 1.125 C 1.500

Y4

Y1 X2 Y2 X3 C Y3

Dimensions Value (in mm) X1 1.7 X2 0.55 X3 0.4 Y1 4.6 Y2 1.2 Y3 0.5 Y4 1.1 C 3.0

T-MiniDIP

X

C 1

Dimensions C C1 X Y

Value (in mm) 4.00 5.60 0.750 0.450

Y C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 24 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

TO252 (DPAK)

X2

Y2 C Y1 Z

Dimensions Z X1 X2 Y1 Y2 C E1

Value (in mm) 11.6 1.5 7.0 2.5 7.0 6.9 2.3

X1

E1

TO263 (D PAK)

X1

2

Y

Y2 X Y1 C

Dimensions C X X1 Y Y1 Y2

Value (in mm) 5.08 1.10 10.41 3.50 7.01 15.99

TO252-4

X1

Y1 Y2 c1 Y3 Y X (4x) c

Dimensions c c1 X X1 Y Y1 Y2 Y3

Value (in mm) 1.27 2.54 1.00 5.73 2.00 6.17 1.64 2.66

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 25 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

TO252-5

X

TO263-5

X

Y1 Y Y C1

Y1

Y2 X1 C2

Y2 X1 C

Dimensions X X1 Y Y1 Y2 C1 C2

Value (in mm) 5.6 0.6 11.0 5.6 2.0 7.2 1.27

Dimensions X X1 Y Y1 Y2 C

Value (in mm) 10.9 1.05 15.7 9.1 2.5 1.7

TSOT25

C C

Y1

**Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
**

Y (5x) X (5x)

TSOT26

C C

Y1

**Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199
**

Y (6x) X (6x)

TSSOP-14

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 26 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

X

C1 C2 Y

Dimensions Value (in mm) X 0.45 Y 1.45 C1 5.9 C2 0.65

TSSOP-16

X1

Dimensions

Y1 Y (16x)

C X X1 Y Y1

Value (in mm) 0.650 0.350 4.900 1.400 6.800

1

X (16x)

C

TSSOP-16EP

X2

Y (16x)

Dimensions C X X1 X2 Y Y1 Y2 Y3

Y3 X1

Y1

Y2

Value (in mm) 0.650 0.450 3.290 5.000 1.450 3.290 4.450 7.350

C X (16x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 27 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

TSSOP-20

X (20x) C

Dimensions C X X1 Y Y1 Y2

Y1

Y2

Y (20x)

Value (in mm) 0.650 0.420 6.270 1.780 4.160 7.720

X1

TSSOP-20EP

X (20x) C

Dimensions C X X1 X2 Y Y1 Y2 Y3

Y1 X1

Y2

Y3

Y (20x)

Value (in mm) 0.650 0.420 4.490 6.270 1.780 3.290 4.160 7.720

X2

U-QFN3030-16 Type B

C G G1

Dimensions

Y1

X1

C G G1 X X1 Y Y1

Y (16x)

Value (in mm) 0.500 0.150 0.150 0.350 1.800 0.600 1.800

X (16x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 28 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-QFN4040-16 Type C

C X (8x) Y (4x)

Dimensions C X X1 X2 X3 X4 Y Y1 Y2 Y3 Y4 Y5

Y1 (8x)

Y5

Y2 X1 X2 (8x) Y4 (4x) 1 X4 X3

Y3

Value (in mm) 0.650 0.400 2.075 0.550 2.075 4.400 0.650 0.400 1.225 2.075 0.550 4.400

U-QFN4040-20

X3

X1(10x)

Value (in mm) 0.500 0.350 0.600 2.500 4.300 0.600 0.350 2.500 4.300

Dimensions

Y1(10x)

Y2 Y3 X2

C X X1 X2 X3 Y Y1 Y2 Y3

Y(10x)

1

X(10x)

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 29 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

X2-WLB0505-3

X1

Y Y2

Dimensions X X1 Y Y1 Y2

Value (in mm) 0.17 0.50 0.22 0.12 0.50

Y1 X X

X2-WLB0808-4

4 X - Ø D

C

Dimensions C D

Value (in mm) 0.40 0.20

C

U-WLB1010-4

ØD

C

Dimensions C D

Value (in mm) 0.50 0.25

C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 30 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

U-WLB1510-6

D

Dimensions

C1 C

C C1 D

Value (in mm) 0.50 1.00 0.25

C

X2-WLB1818-4

D

A

1

C

2

Value (in mm) 0.65 0.30

C

B

Dimensions C D

X2-WLB2718-6

D 6 x

1

A

2

︵

︶

C B C C C

Dimensions C D

Value (in mm) 0.65 0.30

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 54 31 of 31 www.diodes.com Suggested Pad Layout

© Diodes Incorporated

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