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Discussion on LED Lamp Heat Dissipation Design

Foreword on LED

LED belongs to the semiconductor component.LED luminous principle in simple terms is composed of a hole of P type of semiconductor and electronic N type semiconductor combine into the P-N diode. In P-N diode ends with forward bias, when an electric current passes through, the electron and holes will flow to the engagement surface emits energy and light. LED itself is a monochromatic light source, with light effect to enhance and blue LED. Its application is gradually tend to diversification, from the previous low power indicator lamp evolved into LED backlight module and led rope lighting. LED is known as the twenty-first Century new lighting source, and it has high efficiency, long life, energy saving, and it is not easy to be damaged, environmental protection without mercury and other traditional light source cannot be compared with the advantages of it.

LED Lamp Heat Dissipation Design

Due to the high power LED technology development, the LED lamps industry is facing the thermal management and the thermal design of a harsh challenge, because the temperature will not only result in decreasing of brightness, but when the temperature exceeds 100 degrees Celsius will also hasten the lamp body and the encapsulation material deterioration. Therefore, in addition to the LED package heat dissipation technology, LED lamp heat dissipation and thermal design is the key to maintain the service life of lamps. In lighting design, the led ground light, chip package substrate, circuit design, system board, heat radiating fins to the shell of the lamp again all occur to test the LED industry, downstream of the R & D capability. The LED which is traditionally used for indicator lamp is usually in the shell structure, and it is covered by the epoxy package. The LED grain heat energy is produced mainly by two metal wires to below the conduction to the system circuit board direction from. However, when LED entered the field of illumination of higher power than 1W LED into the mainstream, in order to increase the heat conduction area lighting purposes, LED will adopt a plate type package so that the LED chip substrate and system circuit board can have bigger patch and the area.

Conclusion

Some commercial LED lamp heat dissipation design will be easy to ignore some of the details, such as neglecting the heat conduction temperature uniformity, namely the radiating fin temperature distribution in grossly inhomogeneous, which led to a portion of the fin on the heat dissipation effect is limited, and even not play radiating effect. Some errors in design can bring risk, especially the LED street lamp is usually installed on the 8~12 meters high if the radiator core rod is poorly designed, and it may lead to excessive weight and drag, increasing risk, when encountering a typhoon and earthquake may result in serious accidents.

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