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The XTR110 is a precision voltage-to-current converter designed for analog signal transmission. It accepts inputs of 0 to 5V or 0 to 10V and can be connected for outputs of 4mA to 20mA, 0mA to 20mA, 5mA to 25mA, and many other commonly used ranges. A precision on-chip metal film resistor network provides input scaling and current offsetting. An internal 10V voltage reference can be used to drive external circuitry. The XTR110 is available in 16-pin plastic DIP, ceramic DIP and SOL-16 surface-mount packages. Commercial and industrial temperature range models are available.
VIN2 (5V) Common 5 R6 2 VREF Force 15 R9 VREF Sense 12 VREF Adjust 11 VIN1 (10V) VREF In 4 3 R1 R5 R3 6 R4 R2 8 R7 A1 Span Adjust A2 +10V Reference R8 1 Source Resistor 16 +VCC

13 Source Sense 14 7 Gate Drive Offset (zero) Adjust

10 4mA Span 9 16mA Span

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PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 1984-2009, Texas Instruments Incorporated

...ti.ti.... or see the TI website at www................ 40V Input Voltage....... Storage Temperature Range: A......... Gate Drive and VREF Force .... +VCC See text regarding safe negative input voltage range..... Continuous to common and +VCC Output Current Using Internal 50Ω Resistor ..................... U ................................... see the Package Option Addendum at the end of this document... –40°C to +85°C Output Short-Circuit Duration............ VIN2............... Texas Instruments recommends that all integrated circuits be handled with appropriate precautions......................ABSOLUTE MAXIMUM RATINGS(1) Power Supply............ PACKAGE/ORDERING INFORMATION(1) PRODUCT XTR110AG XTR110BG XTR110KP XTR110KU PACKAGE-LEAD DIP-16 Ceramic DIP-16 Ceramic DIP-16 Plastic SOL-16 Surface-Mount PACKAGE DESIGNATOR JD JD N DW TEMPERATURE RANGE –40°C to +85°C –40°C to +85°C 0°C to +70°C 0°C to +70°C NOTE: (1) For the most current package and ordering PIN CONFIGURATION TOP VIEW Source Resistor Common VREF In VIN1 (10V) VIN2 (5V) Zero Adjust Zero Adjust Span Adjust 1 2 3 4 5 6 7 8 16 +VCC 15 VREF Force 14 Gate Drive 13 Source Sense 12 VREF Sense 11 VREF Adjust 10 4mA Span 9 16mA Span 2 XTR110 www. +VCC ............. –55°C to +125°C K. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD.. ESD damage can range from subtle performance degradation to complete device failure.. VIN1................ B . Exposure to absolute maximum conditions for extended periods may degrade device SBOS141C ...... VREF IN .... 40mA NOTE: (1) Stresses above these ratings may cause permanent damage............. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.. Failure to observe proper handling and installation procedures can cause damage....

0005 100 +10. unless otherwise specified.01 +0. XTR110 SBOS141C www. VCC Quiescent Current TEMPERATURE RANGE Specification: AG.3 0. KU PARAMETER TRANSMITTER Transfer Function Input Range: VIN1(5) VIN2 Current. BG KP.100 10 +13.003 * 0.25 +9.95 Line Regulation Load Regulation –0.0009 * * * * * * * * +10.05 0.1 0.0003 0.02 * * 0.5 Excluding IO –40 0 –55 –25 +10 35 0.02 30 * * * Specified Performance * * * * * * V ppm/°C %/V %/mA ppm/1k hrs V mA V mA °C °C °C °C 3 +40 4.003 10 x 109 27 22 19 15 20 1. NOTES: (1) Including internal reference. KU +9. (5) For extended IREF drive circuit see Figure 4. VCC vs Output Current vs Time Trim Range Output Current POWER SUPPLY Input Voltage.005 0.005 0. See Input Voltage Range section. VCC Span Error Initial vs Temperature vs Supply.5 +85 +70 +125 +85 * * * * * Specifications same as AG/KP grades.005 0. (5) Unit may be damaged.98 * 15 * * * * * * * 0. (2) Span is the change in output current resulting from a full-scale change in input voltage.0025 0. IOS Initial vs Temperature vs Supply. (3) Within compliance range limited by (+VCC – 2V) +VDS required for linear operation of the FET. KU Operating: AG.0002 0. KP.005 0.01% of Span Dynamic Response Settling Time Slew Rate VOLTAGE REFERENCE Output Voltage vs Temperature vs Supply.1% of Span To 0. VCC Output Resistance Input Resistance CONDITIONS MIN TYP MAX MIN XTR110BG TYP MAX UNITS Specified Performance Specified Performance Specified Performance(1) Derated Performance(1) 16mA/20mA Span(2) IO = 4mA(1) (1) (1) (1) 0 0 4 0 IO = 10 [(VREFIn/16) + (VIN1/4) + (VIN2/2)] /RSPAN +10 * +5 * 20 * 40 * 0.ELECTRICAL CHARACTERISTICS At TA = +25°C and VCC = +24V and RL = 250Ω**.3 0. XTR110AG. BG KP.0005 0.005 0.4 3 .01 0. (4) For VREF adjustment circuit see Figure 3.6 0.025 0.002 0.2 0.05 50 0.2 0. IO Nonlinearity Offset Current. ** Specifications apply to the range of RL shown in Typical Performance Curves.ti.005 0.003 * V V mA mA % of Span % of Span % of Span/°C % of Span/V % of Span % of Span/°C % of Span/V Ω kΩ kΩ kΩ µs µs mA/µs IO = 20mA (1) (1) (1) From Drain of FET (QEXT)(3) VIN1 VIN2 VREF In To 0.

RL = 250Ω. VCC = 24VDC. TJ = +175°C 1 AG 0 BG 40 VCC = +24V VCC = +15V –1 AG 20 0 0 2 4 –2 6 8 10 –40 –20 0 20 40 60 80 VREF Output Current (mA) (IOUT has minimal effect on TJ) Temperature (°C) ICC vs TEMPERATURE 5 IO = 20mA MAXIMUM RL vs VCC 2500 ICC (mA) (excluding IO) 4 2000 IO MAX = 20mA IO = 4mA 2 R L (Ω ) 3 1500 1000 IO MAX = 40mA 1 0 –40 –20 0 20 40 60 80 Temperature (°C) 500 0 15 20 25 +VCC (V) 30 35 40 4 XTR110 www.01 0. VREF LINE REGULATION vs FREQUENCY 10 IO POWER SUPPLY REGULATION vs FREQUENCY 10 ∆ VREF/∆ VCC (%/V) 1 ∆ IO /∆ VCC (% of span/V) 1 0.TYPICAL PERFORMANCE CURVES TA = +25°C.1 0.ti.001 1 10 100 1k 10k 100k Ripple Frequency (Hz) JUNCTION TEMPERATURE RISE vs VREF OUTPUT CURRENT 100 2 TOTAL OUTPUT ERROR vs TEMPERATURE Junction Temperature Rise Above Ambient (°C) Max. unless otherwise SBOS141C . Temp.001 1 10 100 1k 10k 100k Ripple Frequency (Hz) 0.1 0.01 0. Rise for +85°C Ambient 80 θJA = 70°C/W 60 VCC = +40V Error (% of span) Max.

RL = 250Ω. SETTLING TIME WITH NEG VIN STEP VIN 0V VIN 0V PULSE RESPONSE 0V IO Error (0. VCC = 24VDC.TYPICAL PERFORMANCE CURVES (Continued) At TA = +25°C.ti. unless otherwise 5 .01% of Span/Box) XTR110 SBOS141C www.01% of Span/Box) IO into 500Ω 0V SETTLING TIME WITH POS VIN STEP VIN 0V 0V IO Error (0.

9 and 10 as shown in the table of Figure 1. is required as shown in Figure 1.25kΩ 7 R3 20kΩ R4 10kΩ 8 IO/10 R7 6250Ω 10 9 R6 1562. This impedance varies depending on how pins 8. Typical operating region configurations are shown in Figure 1. TABLE I. Available P-Channel MOSFETs. ZVP1304A ZVP1304B ZVP1306A ZVP1306B IRF9513 MTP8P08 RFL1P08 RFT2P08 VP0300B VP0300L VP0300M VP0808B VP0808L VP0808M VP1304N2 VP1304N3 VP1306N2 VP1306N3 BVDSS(1) 40V 40V 60V 60V 60V 80V 80V 80V 30V 30V 30V 80V 80V 80V 40V 40V 60V 60V BVGS(1) 20V 20V 20V 20V 20V 20V 20V 20V 40V 40V 40V 40V 40V 40V 20V 20V 20V 20V PACKAGE TO-92 TO-39 TO-92 TO-39 TO-220 TO-220 TO-39 TO-220 TO-39 TO-92 TO-237 TO-39 TO-92 TO-237 TO-220 TO-92 TO-220 TO-92 International Rectifier Motorola RCA RSPAN is the total impedance seen at the emitter of the internal NPN transistor. This transistor conducts the output signal current. Other input voltage and output current ranges require changes in connections of pins SBOS141C . 5. QEXT.5 to 40V IO Short Connection (see text) QEXT P-Channel MOSFET (see text) IO 4 to 20mA RL (250Ω typ) Span Adjust 4mA Span 16mA Span Zero Adjust R2 5kΩ 5 2 INPUT OUTPUT RANGE (V) RANGE (mA) 0-10 2-10 0-10 0-10 0-5 1-5 0-5 0-5 0-20 4-20 4-20 5-25 0-20 4-20 4-20 5-25 PIN 3 Com Com +10V Ref +10V Ref Com Com +10V Ref +10V Ref PIN 4 Input Input Input Input Com Com Com Com PIN 5 Com Com Com Com Input Input Input Input PIN 9 Com Com Com Com Com Com Com Com PIN 10 Com Com Open Com Com Com Open Com FIGURE 1.APPLICATIONS INFORMATION Figure 1 shows the basic connections required for 0V to 10V input and 4ma to 20mA output.5Ω 6 R9 50Ω +10V Reference R8 500Ω 16 1 13 14 + 1µF +VCC 13. 11 4 VIN 0 to 10V IO/10 3 R1 15kΩ R5 16. +VCC Force 15 Sense 12 VREF Adj. An external RSPAN can be connected for different output current ranges as described later. EXTERNAL TRANSISTOR An external pass transistor. 9 and 10 are configured. A P-channel MOSFET transistor is recommended. BVGS—Gate-source breakdown voltage. It must Siliconix (preferred) Supertex NOTE: (1) BVDSS—Drain-source breakdown voltage. Various recommended types are shown in Table I. 4. 6 XTR110 www. MANUFACTURER Ferranti PART NO. Basic Circuit Connection. The complete transfer function of the XTR110 is: 10 IO = (VREF IN) 16 + (VIN1) 4 RSPAN + (VIN2) 2 (1) have a voltage rating equal or greater than the maximum power supply voltage.ti.

Integrated Darlington transistors are not recommended because their internal base-emitter resistors cause excessive error. FIGURE 3.5V below common (0V). Set the input voltage to zero and then adjust R1 to give 4mA at the output. a clamp diode can be connected from the negative-going input to common to clamp the input voltage. The circuit in Figure 3 shows adjustment of the voltage reference. The voltage at the input of A1 is: VA1 = (VREF IN) 16 + (VIN1) 4 + (VIN2) 2 (3) NOTE: (1) RS gives higher resolution with reduced range. Optional Adjustment of Reference Voltage. FIGURE 2. QEXT could fail. QEXT can be protected with a 12V zener diode connected from gate to source. QEXT Using PNP Transistors. FIGURE 4. TRANSISTOR DISSIPATION Maximum power dissipation of QEXT depends on the power supply voltage and full-scale output current. If necessary. Excellent: For prolonged maximum stress. If the gate-tosource breakdown voltage is lower than +VCC. The exception is the IOUT return. +VCC. It can be returned to any point where it will not modulate the common at pin 2. IOUT RL Common 47nF TIP30B etc. and the output connection (drain of QEXT) is broken. Assuming that the load resistance is low.If the supply voltage. This could occur if input pins 3. Good: Adequate for majority of designs. +VCC VREF Force VREF Sense VREF Adjust VREF R 20kΩ RS (1) 15 16 12 11 XTR110 PACKAGE TYPE TO-92 TO-237 TO-39 TO-220 TO-3 ALLOWABLE POWER DISSIPATION Lowest: Use minimum supply and at +25°C. To preserve accuracy. Adjust Range ±5% Optimum 2 Common TABLE II. Increasing Reference Current Drive. VOLTAGE REFERENCE The reference voltage is accurately regulated at pin 12 (VREF SENSE).ti. This can be extended if desired by adding an external NPN transistor shown in Figure 4. 3 should be connected to this point. +VCC 16 1 XTR110 13 14 2 0. Note that an additional capacitor is required for stability. the power dissipated by QEXT is: PMAX = (+VCC) IFS (2) The transistor type and heat sinking must be chosen according to the maximum power dissipation to prevent overheating. shown in Figure 5. R1. set RS = 0Ω for larger range. The current drive capability of the XTR110’s internal reference is 10mA. exceeds the gate-to-source breakdown voltage of QEXT. COMMON (Ground) Careful attention should be directed toward proper connection of the common (grounds). any load including pin For 100mA with VCC up to 40V use 2N3055 for QREF. All commons should be joined at one point as close to pin 2 of the XTR110 as possible. See Table II for general . For spans starting 7 XTR110 SBOS141C www. OFFSET (ZERO) ADJUSTMENT The offset current can be adjusted by using the potentiometer. Acceptable: Trade-off supply and temperature. 4 or 5 were driven with an op amp whose output could swing negative under abnormal conditions. External Transistor Package Type and Dissipation. QREF Force Sense 15 12 XTR110 2 16 +VCC +10VREF This voltage should not be allowed to go more negative than –0.047µF 2N2907 etc. INPUT VOLTAGE RANGE The internal op amp A1 can be damaged if its non-inverting input (an internal node) is pulled more than 0. Use if hermetic package is required. Two PNP discrete transistors (Darlington-connected) can be used for QEXT—see Figure 2.

Figures 6 and 7 show graphically how offset is adjusted. For low TC operation. IO (mA) Third Wire + 20 R1 = 100kΩ R2 = 100kΩ R3 = 49. Zero and Span of 0V to +10VIN. and a few iterations may be necessary. R8. LOW TEMPERATURE COEFFICIENT OPERATION Although the precision resistors in the XTR110 track within 1ppm/°C. and R4 for adjusting the span are determined as follows: choose R4 in series to slightly decrease the span. 4mA to 20mA Output Configuration (see Figure 5). VIN1 (V) FIGURE 6. the internal 50Ω resistor (R9) may be replaced by an external resistor connected between pins 13 and 16. Therefore. Self-heating of REXT can cause nonlinearity.ti.9kΩ R4 = 31. Its value can be calculated as follows: REXT = R9 (SpanOLD/SpanNEW) Since the internal thin-film resistors have a 20% absolute value SBOS141C . R3. For the circuit shown. This adjustment is interactive with the offset adjustment. 8 XTR110 www. Figures 6 and 7 show graphically how span is adjusted.8% of Span 4mA Offset −2. R7. then choose R2 and R3 to increase the span to be adjustable about the center value. Output Current. 4mA to 20mA Output. the TC of the output current can have 20ppm/°C drift. When the input is zero the output will be zero. R2. at 0mA.1µF Tantalum 15 16 12 3 4 5 6 7 8 2 R4 R1 R3 R2 Offset Adjust Span Adjust 1 24V 13 XTR110 14 G S – Output Current. the following special procedure is recommended: set the input to a small nonzero value and then adjust R1 to the proper output current. measure R9 before determining the final value of REXT.5 0 2 4 6 8 10 Input Voltage. the output current depends upon the absolute temperature coefficient (TC) of any one of the resistors. Zero and Span of 0V to +10V Input. connect pins 9 and 10 together. maximum. See Figure 10 for application.45% as shown 15 16mA Span 10 0V to +10V 9 D 4mA to 20mA Out RL 250Ω 1V to +5V Out 5 Zero Adjust ±1. Since the absolute TC of the output current can have 20ppm/°C. zero TC resistors can be substituted for either the span resistors (R6 or R7) or for the source resistor (R9) but not both. FIGURE 5. and R9. EXTENDED SPAN For spans beyond 40mA. choose one with a low TC and adequate power rating. 0mA to 20mA Output Configuration (see Figure 5). Offset and Span Adjustment Circuit for 0V to +10V Input. The values of R2. VIN1 (V) FIGURE 7. 15 10 20mA Span Span Adjust 5 Zero Adjust 0mA Offset 0 2 4 6 8 10 Input Voltage.6Ω Span Adjust ±0. set the input voltage to +10V full scale and adjust R2 to give 20mA fullscale output. SPAN ADJUSTMENT The span is adjusted at the full-scale output current using the potentiometer. R6. In addition. IO (mA) 20 See values in Figure 6. shown in Figure 5.

T1: International Rectifier IR9513(1). The compact design and low price of the XTR110 allow versatility with a minimum of external components and design engineering expense. +15V 15 12 11 4 3 R9 15kΩ R10 1kΩ A3 R3 20kΩ 5 2 +10V Reference 16 1 13 14 7 6 R1 2Ω VIN A4 T1 8 10 9 R7 4. R7: Low TC resistors.TYPICAL APPLICATIONS The XTR110 is ideal for a variety of applications requiring high noise immunity current-mode signal 9 . R6. NOTE: (1) Or other adequate power rating MOS transistor. T3: International Rectifier IRFF9113(1). The precision +10V reference can be used to excite bridges and transducers.99Ω –15V 200 IO (mA) 0 5 10 VIN (V) R1.75kΩ R8 200Ω Fine Trim RH 50kΩ Coarse Trim Offset Adjust R5 2MΩ Span Adjust R6 402Ω T3 A2 IO A1 R4 2kΩ T2 R2 4. A1 . Selectable ranges make it very useful as a precision programmable current source. scale both resistors proportionately. R2: Low TC resistors to dissipate 0. For other current ranges. R11: 10-turn trimpots for greatest sensitivity.A4: 1/4 LM324 (powered by ±15V). XTR110 SBOS141C www. T2: International Rectifier IR513(1).ti. R8. Figures 8 through 10 show typical applications of the XTR110. –200 FIGURE 8. R10.32W continuous power. ±200mA Current Pump.

ti. Isolated 4mA to 20mA Channel. 0A to 10A Output Voltage-to-Current Converter. FIGURE 10. 10 XTR110 www.Isolation Barrier +15V Isolated Power Supply (722) 1µF –15V +15V –15V +15V 15 16 12 3 15 0 to –10V 16 ISO122 8 7 4 5 9 2 XTR110 1 13 S 14 G D 4mA to 20mA Out RL VL FIGURE SBOS141C . +24V 15 16 12 4 0V to +10V 3 5 9 2 XTR110 S 14 G D 13 REXT 0.1Ω 0A to 10A Out See extended span section.

XTR110 SBOS141C www.ti. Changed text in third paragraph.Revision History DATE 9/09 REVISION PAGE C 6 SECTION Front Page Applications Information DESCRIPTION Changed front page to standard 11 . NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

-. Pb-Free (RoHS Exempt). and a lifetime-buy period is in effect. PREVIEW: Device has been announced but is not in production. Samples may or may not be 8-Sep-2009 PACKAGING INFORMATION Orderable Device XTR110AD XTR110AG XTR110BG XTR110KP XTR110KPG4 XTR110KU XTR110KU/1K XTR110KU/1KG4 XTR110KUG4 (1) Status (1) OBSOLETE NRND NRND ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type DIESALE CDIP SB CDIP SB PDIP PDIP SOIC SOIC SOIC SOIC Package Drawing Y JD JD N N DW DW DW DW Pins Package Eco Plan (2) Qty 0 16 16 16 16 16 16 16 16 1 1 25 25 40 TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Lead/Ball Finish Call TI AU AU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Call TI N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR 1000 Green (RoHS & no Sb/Br) 1000 Green (RoHS & no Sb/Br) 40 Green (RoHS & no Sb/Br) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible). NRND: Not recommended for new designs. Efforts are underway to better integrate information from third parties. Peak Temp. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.please check http://www.1% by weight in homogeneous materials. TBD: The Pb-Free/Green conversion plan has not been defined. including the requirement that lead not exceed 0. Where designed to be soldered at high temperatures.1% by weight in homogeneous material) (3) MSL. but TI does not recommend using this part in a new design. or 2) lead-based die adhesive used between the die and leadframe. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0. Addendum-Page 1 . (2) Eco Plan . TI Pb-Free products are suitable for use in specified lead-free processes. TI bases its knowledge and belief on information provided by third parties.ti. Device is in production to support existing customers. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.ti.PACKAGE OPTION ADDENDUM www. LIFEBUY: TI has announced that the device will be discontinued. TI and TI suppliers consider certain information to be proprietary. OBSOLETE: TI has discontinued the production of the device. and thus CAS numbers and other limited information may not be available for for the latest availability information and additional product content details.The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications. and makes no representation or warranty as to the accuracy of such information. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances. or Green (RoHS & no Sb/Br) .The planned eco-friendly classification: Pb-Free (RoHS). and peak solder temperature. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.

0 W Pin1 (mm) Quadrant 16.4 10.ti.75 B0 (mm) 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.0 Q1 XTR110KU/1K 1000 Pack Materials-Page 1 .7 P1 (mm) 12.PACKAGE MATERIALS INFORMATION www.7 K0 (mm) 2.

com 14-Jul-2012 *All dimensions are nominal Device XTR110KU/1K Package Type SOIC Package Drawing DW Pins 16 SPQ 1000 Length (mm) 367.0 Pack Materials-Page 2 .PACKAGE MATERIALS INFORMATION www.0 Width (mm) 367.0 Height (mm) 38.ti.





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