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AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks

Publication # 43373 Revision: 3.00 Issue Date: September 2008

Advanced Micro Devices

© 2008 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice.

Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Sempron, AMD Turion, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

PID: 43373 Rev 3.00 - September 2008

AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks

Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8 1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9 1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 AMD Turion™ X2 Ultra Dual-Core Mobile Processor . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.3 AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.3.1 TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 AMD Turion™ X2 Dual-Core Mobile Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.2 AMD Turion X2 Dual-Core Mobile Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.3 AMD Turion X2 Dual-Core Mobile Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.3.1 TM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.3.2 TM mmmm DA pnc GK (35 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 AMD Athlon™ X2 Dual-Core Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Description . . . . . 26 4.2 AMD Athlon X2 Dual-Core Processor Thermal and Power Table Guide . . . . . . . . 28 4.3 AMD Athlon X2 Dual-Core Processor Thermal and Power Specifications . . . . . . . 29 4.3.1 AM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 AMD Sempron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 5.1 AMD Sempron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . 33 5.2 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 35 5.3 AMD Sempron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . 36 5.3.1 SM mmmm SA pnc GG (25 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 5.3.2 SM mmmm DA pnc GG (35 W Mobile, S1g2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

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PID: 43373 Rev 3.00 - September 2008

AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks

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Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 6.1 bsmmmmrr M ncdd - Socket S1 Power Supply Operating Conditions . . . . . . . . . . . 40 Power Limit Encoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Contents

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Figure 3. . . . . . . . Figure 8. . . . . . . . . . . . . . .00 . . AMD Athlon X2 Dual-Core Processor Ordering Part Number Example . . . . Figure 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number Example . . . . . . . . . . . . . . Figure 7. . . . . . . . . Figure 5. . . . . . . Figure 4. . . . . .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks List of Figures Figure 1. . . . . . . . . . Figure 2. . AMD Sempron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Diagram . . . . . . . . 11 11 18 18 26 26 33 33 List of Figures 5 . . . . . .PID: 43373 Rev 3. . . . . . . . AMD Turion X2 Dual-Core Mobile Processor Ordering Part Number Diagram . . . . . . . . . . AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . . . . . . . . . . . AMD Turion X2 Ultra Dual-Core Mobile Processor Ordering Part Number Example . . AMD Sempron Processor Ordering Part Number Example . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 AMD Athlon X2 Dual-Core Processor Number of Cores . . Table 12. . . . . . . . . . 34 AMD Sempron Processor Roadmap Options . . . . . . . 19 AMD Turion X2 Dual-Core Mobile Processor Number of Cores . . . . . . . .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks List of Tables Table 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 AMD Turion X2 Dual-Core Mobile Processor Model Number Options . . . . . Table 6. . . . . . . Table 15. . . . . .00 . . . . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor Package Options . . . . . . . . Table 17. Table 21. . . . . . . . . . . . . . . . Table 9. . 27 AMD Athlon X2 Dual-Core Processor Package Options . . Table 11. . . . . . . . . . . . . . Table 10. . . . . Table 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table 26. . . . . . . . . . . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . . . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor Number of Cores . . . . Table 19. 19 AMD Turion X2 Dual-Core Mobile Processor Package Options . . . . . . . . . . . 27 AMD Athlon X2 Dual-Core Processor Roadmap Options . . . . . . . . . . Table 24. . . . . . . Table 22. . . . . . . . . . . . . . . . . . . . . Table 14. . . . . . Table 3. . . . . . 27 AMD Athlon X2 Dual-Core Processor L2 Cache Size Options . 19 AMD Turion X2 Dual-Core Mobile Processor Thermal and Power Table Guide . . . . . . . . . . . Table 13. . . . . . . . . . Table 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . .PID: 43373 Rev 3. . . . . . . . . . . 27 AMD Athlon X2 Dual-Core Processor Thermal and Power Table Guide . . . . . . . . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor Roadmap Options . . . . . . . . . . . . . . . . . . Table 27. . . . . . . . . . . . . . . . . . 19 AMD Turion X2 Dual-Core Mobile Processor L2 Cache Size Options . . . . . . . . . . Table 25. . . . . . . . . . . . . . 34 AMD Sempron Processor Number of Cores . . . . . . . . 40 bsmmmmrr M ncdd VDD0 and VDD1 Power Supply AC Operating Conditions . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor L2 Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 AMD Sempron™ Processor Part Definition Options . . . . . . . . . . . 43 Adjusted Peak Performance (APP) Calculations . . . . . . . . . . . . . . . . . . . . . 41 Composite Theoretical Performance (CTP) Calculations . . . . . . . . . . . . 34 AMD Sempron Processor Package Options . . . . . . Table 33. . . . . . Table 2. . . . . . . . . . . Table 28. . . . Table 5. . . . . . . . . . Table 29. . . . . . . . . . Table 18. . . . 12 AMD Turion X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide . . . . Table 20. . . . . . . . . . . . 20 AMD Athlon™ X2 Dual-Core Processor Part Definition Options . . Table 16. . . . . . . . . . . . . 27 AMD Athlon X2 Dual-Core Processor Model Number Options . . . . AMD Turion™ X2 Ultra Dual-Core Mobile Processor Part Definition Options . . Table 23. . . . . . . . . . . . . . . . . . . 34 AMD Sempron Processor L2 Cache Size Options . . . . . . . . . . . . . . 44 List of Tables 6 . . . . . . Table 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 AMD Turion X2 Dual-Core Mobile Processor Roadmap Options . . 34 AMD Sempron Processor Model Number Options . . . . . . Table 4. . . . . . . . . . . . . . . . . . . . . . . . 40 bsmmmmrr M ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Turion X2 Dual-Core Mobile Processor Part Definition Options . Table 31. . . Table 32. 35 bsmmmmrr M ncdd VDD0 and VDD1 Power Supply DC Operating Conditions . . . . . . . . . . . . . . . . . . . .

00 Description Initial public release Revision History 7 .00 .PID: 43373 Rev 3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Revision History Date September 2008 Revision 3.

The specifications in this document supersede those found in the power roadmaps.2 Thermal and Power Table Guide Overview The thermal and power table guide section contains a table mapping SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers.1.1. A definition of SOPNs is contained in Section 1.1 Organization This document is organized into the following sections: • Document overview (Section 1) • One section for each brand represented in the mobile segment containing the following subsections: • Ordering Part Number (OPN) description (content overview in Section 1. The meaning of each OPN character is detailed in the OPN description section. refer to the appropriate product data sheet and the AMD Family 11h Processor Electrical Data Sheet. order# 40683.00 .1. 1.1.3 on page 9) • Power supply specifications (content overview in Section 1. Overview 8 .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 1 Overview This document contains processor thermal specifications and power specifications. model number. socket compatibility). SOPNs are used to group and organize OPNs into subsections for the thermal and power tables and power supply specifications. For all other electrical specifications. Each OPN identifies a processor with a unique thermal and power specification table entry.1.1 Ordering Part Number Description Section Overview The Ordering Part Number (OPN) description section contains a depiction and description of a valid OPN for the brand contained in that chapter.4 on page 9) • MTOPS section in Table 32 on page 43 • APP section in Table 33 on page 44 1.PID: 43373 Rev 3. 1.1) • Thermal and power specification tables (content overview in Section 1. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN.3 on page 9. Each character or group of characters within an OPN has a specific meaning (for example. The OPN description section also contains a full description of the Subsection Ordering Part Number (SOPN) abstraction characters for the brand contained in that chapter.

CPU COF. socket compatibility. for example: 45F8h. for example: 0110_1100b. respectively. • NB COF. and cache size. An “h” appended to the end of a number indicates that it is a hexadecimal number. Overview 9 . power limit. for example: 0110b. Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that chapter to the appropriate subsection number and page number. • CPU COF. ambient temperature assumptions) and power delivery (for example. A “b” appended to the end of a number indicates that it is a binary number.1. This includes the information necessary for thermal management (for example. SOPNs for the thermal and power tables have the brand. P-states are valid combinations of CPU voltage. • OPN. and power dissipation for each P-state). They do not imply any operation. CPU Current Operating Frequency. Ordering Part Number. 1.1.4 Power Supply Specification Chapter Overview The power supply specification chapter contains the operating conditions and requirements for all voltage planes required by the processor.2 Conventions Following are conventions used with numbers.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 1. • P-state. Within each subsection the OPNs are sorted by model number. Northbridge voltage. Underscores are used to break up numbers to make them more readable. voltage and current.3 Thermal and Power Table Section Overview The thermal and power specification tables contain the thermal and power requirements for each OPN.00 . The thermal and power specification tables are organized into subsections that correspond to Subsection Ordering Part Numbers (SOPNs). 1. heat sink requirements. • Binary numbers.PID: 43373 Rev 3. and NB COF. Northbridge (NB) Current Operating Frequency. and part definition characters defined in the form ABmmmmrrpnc GH. voltage. all numbers are decimal. • Underscores in numbers. Unless specified otherwise. temperature. • Hexadecimal numbers.3 Definitions Following are some key definitions. 1. An OPN uniquely identifies a processor and its associated specifications in the thermal and power tables and power supply specifications section. • Decimal numbers. Processor Performance State.

C0. Power state 0. S0. The abstracted (lower-case) character definitions for SOPNs are contained in the OPN description section of each chapter. power state. • VID_VDD. and Performance state 0.P0 indicates Sleep state 0. All defined characters in an SOPN are bolded and capitalized. The constraining conditions for TDP are specified in the notes in the thermal and power tables. The thermal design power is the maximum power a processor can draw for a thermally significant period while running commercially useful software.00 . • TDC. VDD1 (core 1) and VDDNB (Northbridge) planes are isolated on the platform and controlled as separate voltages through the SVI interface. Thermal Design Current. for VID-tovoltage translation specifications. Subsection Ordering Part Number. The VID_VDD voltage is the VID-requested VDD supply level. The thermal design current is the sustained current limit as measured under the same conditions as TDP.PID: 43373 Rev 3. • State. For example. OPN AB1234CDE5FGH appears under the subsection for SOPN ABmmmmrrpncGH. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. order# 41256. For example. S3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks • SOPN. Information for any OPN that matches all of the defined characters in an SOPN is contained in that subsection. An ‘x’ indicates the related specifications are independent of the associated ACPI state. An SOPN is an OPN with a subset of defined characters. Platforms in which the VDD0 (core 0). Overview 10 . All abstracted characters in an SOPN are in non-bolded lowercase. • Triple-plane.Px indicates Sleep state 3 entered from any power and performance state combination.Cx. Indicates the ACPI defined sleep state. Thermal Design Power. and performance state for the related specifications. • TDP.

1 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 1.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 2 AMD Turion™ X2 Ultra Dual-Core Mobile Processor The following sections contain the OPN description and thermal and power specifications for the AMD Turion™ X2 Ultra dual-core mobile processor. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Example AMD Turion™ X2 Ultra Dual-Core Mobile Processor 11 .1 provides an example of the OPN structure for this processor family. Section 2. 2. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Ordering Part Number Diagram T M ZM80 DA M 2 3 GG Part Definition: GG (see Table 1) Cache Size: 3 (see Table 2) Number of Cores: 2 (see Table 3) Package: M (see Table 4) Roadmap: DA (see Table 5) Model Number: ZM80 (see Table 6) Segment: M = Mobile Brand: T = AMD Turion™ Ultra Mobile Processor Figure 2.PID: 43373 Rev 3.00 . Each column in the thermal and power tables represents a specific Ordering Part Number (OPN).

AMD Turion™ X2 Ultra Dual-Core Mobile Processor Part Definition Options Part Definition Revision GG Rev B1 CPUID 8000_0001h EAX [31:0] (CPUID) 00200F31h Table 2. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Package Options OPN Character M Package S1g2 Table 5. Segment 35 W.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Table 1. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Number of Cores OPN Character 2 Number of Cores 2 Table 4. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Roadmap Options OPN Character DA Power.PID: 43373 Rev 3. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Model Number Options Frequency L2 Cache Size 2100 MHz 2200 MHz 2300 MHz 2400 MHz 1024 KB 1024 KB 1024 KB 1024 KB Model Number ZM80 ZM82 ZM84 ZM86 AMD Turion™ X2 Ultra Dual-Core Mobile Processor 12 . AMD Turion™ X2 Ultra Dual-Core Mobile Processor L2 Cache Size Options OPN Character 3 L2 Cache Size 1024 KB Table 3.00 . Notebook Number of Cores 2 Socket Infrastructure S1g2 Table 6.

00 .2 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 7 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Table Guide SOPN TM mmmm DA pnc GG Power 35 W Revision Rev B1 Thermal/Power Tables Section 2.1 on page 15 AMD Turion™ X2 Ultra Dual-Core Mobile Processor 13 . This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Table 7.PID: 43373 Rev 3.3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 2.

1 on page 11 provides an example of the OPN structure for processors documented in this chapter and Table 7 on page 13 provides a guide to OPN organization in the following subsections. order# 41256. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. order# 40683.3 AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Specifications Refer to the AMD Family 11h Processor Electrical Data Sheet. Refer to Section 1.3 on page 9 for numbering conventions and terminology definitions used in these tables.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 2. Section 2. for power management BIOS requirements. for electrical specifications for the processor. AMD Turion™ X2 Ultra Dual-Core Mobile Processor 14 .2 on page 9 and Section 1.00 .PID: 43373 Rev 3.

800 V 5.69 A 0.2 W 0.075 V 1.3 W 1.200 V 1.9 A 850 MHz 24.C0.800 V 0.C0.3.950 V 12.0 W S0.61 A 0.00 .19 A 3.P2 S0.6 2 2 6 9 The notes for this table are on page 17.4 A 525 MHz 9.6 A 1050 MHz 15.57 °C/W S0.61 A 0.84 A 300 mW Notes 13 TMZM80DAM23GG 100 °C 0 °C to 35 °C 10 °C 1.C0.950 V 11.0 W 1. S1g2) Thermal and Power Specifications Specification7 Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max I/O Power C1E/S1 Altvid IDD Max IDDNB Max I/O Power S3 I/O Power 4.1 A 1.200 V 15.9 A 800 MHz 22.125 V 25.72 °C/W S0.PID: 43373 Rev 3.0 W TMZM82DAM23GG 100 °C 0 °C to 35 °C 10 °C 1.900 V 2100 MHz 32.6 2 2 6 1 3.900 V 2200 MHz 35.Px 5 1 3.125 V 27.0 W 0.P2 S0.HTC 1.6 W 1.10 11 0.P1 S0.2 A 550 MHz 9.5 A 1.950 V 0.P2 S0.950 V 0.C0.C0.19 A 3.69 A 0.2 W 0.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 2.HTC 1.C0.10 14 0. S0.C0.10 12 8 150 mW 150 mW 4.14 A 300 mW 4.0 W 1.8 A 1100 MHz 16.800 V 5.800 V 0.100 V 1.P0 AMD Turion™ X2 Ultra Dual-Core Mobile Processor 15 .HTC S0.6 2 2 6 1 3.200 V 16.200 V 1.6 2 2 6 1 3.C0.14 A 300 mW 0.C0.1 State TM mmmm DA pnc GG (35 W Mobile.3 W 0.84 A 300 mW 0.

19 A TMZM86DAM23GG 100 °C 0 °C to 35 °C 10 °C 1.P2 S0.C0.10 12 8 300 mW 150 mW The notes for this table are on page 17.2 W 0.4 W 0.0 W 1.57 °C/W S0.9 A 1.PID: 43373 Rev 3.200 V 1.200 V 16.125 V 27.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks State Specification7 Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max I/O Power C1E/S1 Altvid IDD Max IDDNB Max I/O Power S3 I/O Power Notes 13 5 1 3.61 A 0.6 2 2 6 9 TMZM84DAM23GG 100 °C 0 °C to 35 °C 10 °C 1.14 A 300 mW 150 mW S0.69 A 0.0 W 1.100 V 1.14 A 4.200 V 1.0 W 0.6 A 600 MHz 9.900 V 2300 MHz 35.C0.100 V 1.200 V 16.9 A 1.Px 4.950 V 12.0 W 0.9 A 850 MHz 24.10 11 3.8 A 1150 MHz 16.69 A 0.7 W 1.4 W 0.C0.C0.800 V 0.00 .C0.P2 S0.9 A 900 MHz 24.800 V 5.800 V 5.7 W 1.10 14 300 mW 0.HTC 1.19 A 3.6 2 2 6 1 3.61 A 0.C0.P2 S0.2 W 0.800 V 0.6 2 2 6 1 3.57 °C/W S0.950 V 0.C0.C0.C0.HTC S0.P1 S0.8 A 1200 MHz 16. AMD Turion™ X2 Ultra Dual-Core Mobile Processor 16 .P0 S0.950 V 12.6 A 575 MHz 9.84 A 300 mW 0.6 2 2 6 1 3.900 V 2400 MHz 35.125 V 27.HTC 1.950 V 0.84 A 4.

VDD. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. 3. TDP is measured under the conditions of all cores operating at CPU COF. VDDNB. 2. and VLDT supplies are off. 10. memory in self-refresh mode. Not all systems are Altvid capable. VLDT. Variable voltage—any valid voltage between VDD min and VDD max is allowed. AMD Turion™ X2 Ultra Dual-Core Mobile Processor 17 . TDP includes all power dissipated on-die from VDD0. memory in self-refresh mode and DDR2 SDRAM interface tristated. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tdie. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors . 8.max. Assumes 35°C. order# 41256. AltVID. for further details. Assumes 35°C. 6. 13. 9. HyperTransport™ link s disconnected. HyperTransport™ link s disconnected. 5. minimum P-state VID_VDD.00 . VDD1. Power dissipated by the processor VDDIO. VLDT. 12. and VDD at the voltage requested by the processor. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as measured under the same conditions as TDP. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. Assumes 35°C. 11. order# 41323 to ensure compatibility with future processors. VDDIO and VTT are powered. TDP is not the maximum power of the processor.8 V and VTT = VDDIO / 2. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. Platforms should be designed to the TDC defined in the Socket S1g2 Processor Power and Thermal Roadmap. DDR2 SDRAM interface tristated. memory in selfrefresh mode. for details on P-state operation for multi-core processors. minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16. and VDDA power planes only. 14. DDR2 SDRAM interface tristated. Tdie Max is measured using the SB-TSI interface. VTT and VDDA. clock s stopped. TDP values apply to operation in a triple-plane motherboard. Assumes 50°C.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks AMD Turion™ X2 Ultra Dual-Core Mobile Processor Thermal and Power Specification Table Notes: 1.PID: 43373 Rev 3. Assumes VDDIO = 1. Tdie Max. order# 41256 for more information. VDDIO. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. P-state limit when HTC is active. 4. clock s stopped. VTT. VDDA. order# 41256. 7. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tdie conditions for all cores.

Each column in the thermal and power tables represents a specific Ordering Part Number (OPN).1 AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 3 AMD Turion™ X2 Dual-Core Mobile Processor The following sections contain the OPN description and thermal and power specifications for the AMD Turion™ X2 dual-core mobile processor. AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Diagram T M RM70 DA M 2 2 GG Part Definition: GG (see Table 8) Cache Size: 2 (see Table 9) Number of Cores: 2 (see Table 10) Package: M (see Table 11) Roadmap: DA (see Table 12) Model Number: RM70 (see Table 13) Segment: M = Mobile Brand: T = AMD Turion™ Mobile Processor Figure 4.1 provides an example of the OPN structure for this processor family.00 .PID: 43373 Rev 3. Section 3. 3. AMD Turion™ X2 Dual-Core Mobile Processor Ordering Part Number Example AMD Turion™ X2 Dual-Core Mobile Processor 18 .

September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Table 8. AMD Turion™ X2 Dual-Core Mobile Processor Model Number Options Frequency L2 Cache Size 2000 MHz 2100 MHz 2200 MHz 512 KB 512 KB 512 KB Model Number RM70 RM72 RM74 AMD Turion™ X2 Dual-Core Mobile Processor 19 .PID: 43373 Rev 3. AMD Turion™ X2 Dual-Core Mobile Processor Part Definition Options Part Definition Revision GG GK Rev B1 Rev B1 CPUID 8000_0001h EAX [31:0] (CPUID) 00200F31h 00200F31h Table 9. AMD Turion™ X2 Dual-Core Mobile Processor L2 Cache Size Options OPN Character 2 L2 Cache Size 512 KB Table 10. AMD Turion™ X2 Dual-Core Mobile Processor Package Options OPN Character M Package S1g2 Table 12.00 . Notebook Number of Cores 2 Socket Infrastructure S1g2 Table 13. Segment 35 W. AMD Turion™ X2 Dual-Core Mobile Processor Number of Cores OPN Character 2 Number of Cores 2 Table 11. AMD Turion™ X2 Dual-Core Mobile Processor Roadmap Options OPN Character DA Power.

This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN.3.2 on page 24 AMD Turion™ X2 Dual-Core Mobile Processor 20 . Table 14.3. AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Table Guide SOPN TM mmmm DA pnc GG TM mmmm DA pnc GK Power 35 W 35 W Revision Rev B1 Rev B1 Thermal/Power Tables Section 3.1 on page 22 Section 3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 3.2 AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 14 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers.PID: 43373 Rev 3.00 .

3 AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Specifications Refer to the AMD Family 11h Processor Electrical Data Sheet. Section 3.PID: 43373 Rev 3. for electrical specifications for the processor.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 3.2 on page 9 and Section 1. for power management BIOS requirements.3 on page 9 for numbering conventions and terminology definitions used in these tables.1 on page 18 provides an example of the OPN structure for processors documented in this chapter and Table 14 on page 20 provides a guide to OPN organization in the following subsections. AMD Turion™ X2 Dual-Core Mobile Processor 21 . order# 41256. order# 40683. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. Refer to Section 1.00 .

P 2 S 0.57 °C/W S 0.7 A TM RM 72DAM 22GG 100 °C 0 °C to 35 °C 10 °C 1.77 °C/W S 0.075 V 1.5 W 1.00 .1 W 1.14 A 4.950 V 12.61 A 3.HTC 1.6 2 2 6 1 3.P1 S0.C0.900 V 2000 M Hz 31.1 W 0.9 A 800 M Hz 24.C0.C0.2 A 525 M Hz 9. S1g2) Thermal and Power Specifications S pe cifica tion 7 Tdie M ax Tam bient TRis e Therm al Res is tanc e (die-am b) S tartup P -s tate HTC P -s tate Lim it IDDNB M ax V ID_V DDNB CP U COF 1 3.950 V 11.800 V 5.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 3.200 V 1.69 A 0.61 A 4.C0.14 A 300 m W 300 m W 0.HTC 1.800 V 0.7 A 1000 M Hz 15.C0.10 12 8 150 m W 150 m W 300 m W 0.125 V 24.0 W 1.PID: 43373 Rev 3.14 A 4.C0.84 A 0.800 V 0.C0.1 State TM mmmm DA pnc GG (35 W Mobile.4 A 500 M Hz 9.Px TDP V ID_V DD M in V ID_V DD M ax TDC CP U COF TDP V ID_V DD M in V ID_V DD M ax TDC CP U COF TDP V ID_V DD M in V ID_V DD M ax TDC CP U COF TDP V ID_V DD M in V ID_V DD M ax TDC C1 Halt IDD M ax IDDNB M ax I/O P ower C1E /S 1 @ M in P -s tate IDD M ax IDDNB M ax I/O P ower C1E /S 1 A ltvid IDD M ax IDDNB M ax I/O P ower S3 I/O P ower The notes for this table are on page 25.69 A 0.800 V 5.900 V 2100 M Hz 35.200 V 1.950 V 0.10 14 0.84 A 0.6 2 2 6 9 1.61 A 0.200 V 16.0 W 1.3 W 0.200 V 14.19 A 1.4 A 1050 M Hz 16.P 2 S 0.19 A 1.P2 S0. AMD Turion™ X2 Dual-Core Mobile Processor 22 .HTC S0.2 W 0.P0 S0.C0.950 V 0.0 W 1.10 11 0.6 2 2 6 1 3.7 A S0.6 2 2 6 1 3.3.0 W 5 Note s 13 TM RM 70DAM 22GG 100 °C 0 °C to 35 °C 10 °C 1.0 W 0.9 A 750 M Hz 22.125 V 28.14 A 300 m W 3.C0.075 V 1.61 A 0.

P1 S0.950 V 12.PID: 43373 Rev 3.84 A 0.3 A 550 M Hz 9.10 11 3.800 V 5.6 2 2 6 1 3.0 W 1.14 A 4.C0.125 V 28.200 V 16.10 12 8 300 m W 150 m W The notes for this table are on page 25.0 W 0.1 W 0.00 .200 V 1.5 W 1.C0.19 A 1.HTC 1.C0.69 A 0.HTC TDP V ID_V DD M in V ID_V DD M ax TDC CPU COF TDP V ID_V DD M in V ID_V DD M ax TDC CPU COF TDP V ID_V DD M in V ID_V DD M ax TDC CPU COF TDP V ID_V DD M in V ID_V DD M ax TDC C1 Halt IDD M ax IDDNB M ax I/O Power C1E /S1 @ M in P-state IDD M ax IDDNB M ax I/O Power C1E /S1 Altvid IDD M ax IDDNB M ax I/O Power S3 I/O Power 4.57 °C/W S0.P2 S0. AMD Turion™ X2 Dual-Core Mobile Processor 23 .10 14 300 m W 0.6 2 2 6 9 2200 M Hz 35.6 2 2 6 1 3.C0.800 V 0.Px 5 S0.P0 S0.C0.900 V 1 3.4 A 1100 M Hz 16.C0.14 A 4.6 2 2 6 1 3.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks State S pe cifica tion 7 Tdie M ax Tam bient TRise Therm al Res is tance (die-am b) S tartup P -state HTC P-s tate Lim it IDDNB M ax V ID_V DDNB CPU COF Note s 13 TM RM 74DAM 22GG 100 °C 0 °C to 35 °C 10 °C 1.7 A 1.1 W 0.61 A 0.075 V 1.P2 S0.950 V 0.8 A 850 M Hz 24.C0.61 A S0.

10 11 0.950 V 0.57 °C/W S 0.2 State TM mmmm DA pnc GK (35 W Mobile.HTC 1.P 2 S 0.0 W 1.P1 S0.C0.C0.PID: 43373 Rev 3.8 W 0.C0.C0.HTC S0.10 14 0.125 V 28.075 V 1.900 V 2000 M Hz 35.14 A 4. AMD Turion™ X2 Dual-Core Mobile Processor 24 .950 V 11.200 V 16.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 3.Px TDP VID_VDD M in VID_VDD M ax TDC CP U COF TDP VID_VDD M in VID_VDD M ax TDC CP U COF TDP VID_VDD M in VID_VDD M ax TDC CP U COF TDP VID_VDD M in VID_VDD M ax TDC C1 Halt IDD M ax IDDNB M ax I/O P ower C1E/S 1 @ M in P -state IDD M ax IDDNB M ax I/O P ower C1E/S 1 A ltvid IDD M ax IDDNB M ax I/O P ower S3 I/O P ower The notes for this table are on page 25.61 A 4.19 A 1.3.7 A S0.200 V 1.C0.6 2 2 6 1 3.6 2 2 6 1 3.84 A 0.C0.800 V 5. S1g2) Thermal and Power Specifications Spe cifica tion 7 Tdie M ax Tam bient TRis e Therm al Resistanc e (die-am b) Startup P-s tate HTC P -state Lim it IDDNB M ax VID_VDDNB CP U COF 1 3.00 .5 W 1.6 2 2 6 1 3.P0 S0.4 A 1000 M Hz 15.8 A 750 M Hz 24.69 A 0.C0.61 A 0.0 W 5 Note s 13 TM RM 70DAM 22GK 100 °C 0 °C to 35 °C 10 °C 1.9 A 500 M Hz 9.P2 S0.10 12 8 150 m W 300 m W 300 m W 3.14 A 4.800 V 0.6 2 2 6 9 1.1 W 0.

and VDDA power planes only.00 . order# 41256. Assumes VDDIO = 1. memory in self-refresh mode and DDR2 SDRAM interface tristated. TDP values apply to operation in a triple-plane motherboard. memory in selfrefresh mode. Assumes 35°C.PID: 43373 Rev 3. 11. Platforms should be designed to the TDC defined in the Socket S1g2 Processor Power and Thermal Roadmap. Power dissipated by the processor VDDIO. Tdie Max is measured using the SB-TSI interface. for details on P-state operation for multi-core processors. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as measured under the same conditions as TDP. 4. clock s stopped. VLDT. Assumes 50°C. TDP is measured under the conditions of all cores operating at CPU COF. and VDD at the voltage requested by the processor. AMD Turion™ X2 Dual-Core Mobile Processor 25 . VDDNB. for further details. memory in self-refresh mode. VTT. clock s stopped. Variable voltage—any valid voltage between VDD min and VDD max is allowed. 5. VTT and VDDA. 12. Assumes 35°C. 14. Tdie Max. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tdie. 6. 10. order# 41256.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks AMD Turion™ X2 Dual-Core Mobile Processor Thermal and Power Specification Table Notes: 1. P-state limit when HTC is active. 9. minimum P-state VID_VDD. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors . TDP is not the maximum power of the processor. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. HyperTransport™ link s disconnected. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. Not all systems are Altvid capable. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. DDR2 SDRAM interface tristated. minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16. 13. order# 41323 to ensure compatibility with future processors.max. VLDT. VDD1. Assumes 35°C.8 V and VTT = VDDIO / 2. DDR2 SDRAM interface tristated. TDP includes all power dissipated on-die from VDD0. VDDIO and VTT are powered. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. 3. 8. AltVID. 2. VDDIO. and VLDT supplies are off. VDD. HyperTransport™ link s disconnected. VDDA. order# 41256 for more information. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tdie conditions for all cores. 7.

September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 4 AMD Athlon™ X2 Dual-Core Processor The following sections contain the OPN description and thermal and power specifications for the AMD Athlon™ X2 dual-core processor.00 . 4. AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Diagram A M QL60 DA M 2 2 GG Part Definition: GG (see Table 15) Cache Size: 2 (see Table 16) Number of Cores: 2 (see Table 17) Package: M (see Table 18) Roadmap: DA (see Table 19) Model Number: QL60 (see Table 20) Segment: M = Mobile Brand: A = AMD Athlon™ Processor Figure 6. AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Example AMD Athlon™ X2 Dual-Core Processor 26 .PID: 43373 Rev 3.1 AMD Athlon™ X2 Dual-Core Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 5. Section 4. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN).1 provides an example of the OPN structure for this processor family.

AMD Athlon™ X2 Dual-Core Processor Part Definition Options Part Definition Revision GG Rev B1 CPUID 8000_0001h EAX [31:0] (CPUID) 00200F31h Table 16. Segment 35 W.00 .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Table 15. AMD Athlon™ X2 Dual-Core Processor L2 Cache Size Options OPN Character 2 L2 Cache Size 512 KB Table 17. Notebook Number of Cores 2 Socket Infrastructure S1g2 Table 20. AMD Athlon™ X2 Dual-Core Processor Number of Cores OPN Character 2 Number of Cores 2 Table 18. AMD Athlon™ X2 Dual-Core Processor Model Number Options Frequency L2 Cache Size 1900 MHz 2000 MHz 2100 MHz 512 KB 512 KB 512 KB Model Number QL60 QL62 QL64 AMD Athlon™ X2 Dual-Core Processor 27 . AMD Athlon™ X2 Dual-Core Processor Package Options OPN Character M Package S1g2 Table 19.PID: 43373 Rev 3. AMD Athlon™ X2 Dual-Core Processor Roadmap Options OPN Character DA Power.

1 on page 30 AM mmmm DA pnc GG 35 W AMD Athlon™ X2 Dual-Core Processor 28 .3.PID: 43373 Rev 3. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN.00 . Table 21.2 AMD Athlon™ X2 Dual-Core Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 21 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. AMD Athlon™ X2 Dual-Core Processor Thermal and Power Table Guide SOPN Power Revision Rev B1 Thermal/Power Tables Section 4.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 4.

Refer to Section 1. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. AMD Athlon™ X2 Dual-Core Processor 29 . Section 4.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 4. for power management BIOS requirements.PID: 43373 Rev 3.3 on page 9 for numbering conventions and terminology definitions used in these tables. order# 40683. for electrical specifications for the processor.00 .1 on page 26 provides an example of the OPN structure for processors documented in this chapter and Table 21 on page 28 provides a guide to OPN organization in the following subsections.3 AMD Athlon™ X2 Dual-Core Processor Thermal and Power Specifications Refer to the AMD Family 11h Processor Electrical Data Sheet. order# 41256.2 on page 9 and Section 1.

C0.61 A 0.6 2 2 6 9 3.C0.10 12 8 250 mW 250 mW 1.0 W 1.8 W 1.3 W 0.2 W 1.6 2 2 6 1 3.900 V 2000 MHz 35.200 V 17.125 V 28.200 V 16.2 W 3.73 A 0.PID: 43373 Rev 3.075 V 1.14 A 1.950 V 11.Px TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max IDDNB Max I/O Power S3 I/O Power The notes for this table are on page 32.11 A 3.P1 S0.200 V 1.P0 S0.HTC 1.075 V 1.950 V 14.5 W 1.4 A 1000 MHz 15.6 2 2 6 1 3.950 V 0.C0.9 A 750 MHz 24.0 W 3.C0.73 A 0.0 A AMQL62DAM22GG 100 °C 0 °C to 35 °C 10 °C 1.0 W 1.P1 S0.C0.8 W 0.950 V 0.C0.125 V 28.200 V 1.61 A 0.HTC 1.4 A 950 MHz 18.900 V 1900 MHz 35.5 A 700 MHz 24.P1 S0.00 .HTC S0.57 °C/W S0.7 A S0. AMD Athlon™ X2 Dual-Core Processor 30 .C0.3.1 State AM mmmm DA pnc GG (35 W Mobile.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 4.14 A 4. S1g2) Thermal and Power Specifications Specification7 Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF 1 3.11 A 4.57 °C/W S0.0 W 5 Notes 13 AMQL60DAM22GG 100 °C 0 °C to 35 °C 10 °C 1.10 11 1.C0.

C0.Px 5 S0.HTC TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max IDDNB Max I/O Power S3 I/O Power 4.200 V 1.1 A 800 MHz 24.6 2 2 6 9 2100 MHz 35.PID: 43373 Rev 3.900 V 1 3.61 A 0.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks State Specification7 Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF Notes 13 AMQL64DAM22GG 100 °C 0 °C to 35 °C 10 °C 1.950 V 0.73 A 0.57 °C/W S0.075 V 1.C0.200 V 16.P1 S0.950 V 12.14 A 4.C0.11 A S0.0 W 1.C0.0 W 0.0 W 1.6 2 2 6 1 3.5 W 1.2 W 250 mW The notes for this table are on page 32. AMD Athlon™ X2 Dual-Core Processor 31 .00 .C0.125 V 28.7 A 3.10 11 3.4 A 1050 MHz 16.C0.10 12 8 1.P0 S0.6 2 2 6 1 3.HTC 1.P1 S0.

VDD. Tdie Max is measured using the SB-TSI interface. DDR2 SDRAM interface tristated. VLDT. for more information. 10. clock divider set to 512. 7.max. AMD Athlon™ X2 Dual-Core Processor 32 . VTT. HyperTransport™ link s disconnected. 2. Tdie Max. 5.8 V and VTT = VDDIO / 2. order# 41256. TDP is measured under the conditions of all cores operating at CPU COF. Assumes VDDIO = 1. Platforms should be designed to the TDC defined in the Socket S1g2 Processor Power and Thermal Roadmap. 12. VDDIO. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. VDDA. and VDDA power planes only. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tdie. Variable voltage—any valid voltage between VDD min and VDD max is allowed. memory in self-refresh mode. Power dissipated by the processor VDDIO. minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16. Assumes 35°C. and VDD at the voltage requested by the processor.PID: 43373 Rev 3. TDP values apply to operation in a triple-plane motherboard. order# 41323 to ensure compatibility with future processors. P-state limit when HTC is active. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. 13. TDP is not the maximum power of the processor. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tdie conditions for all cores. 6. 8. minimum P-state VID_VDD. order# 41256. VDDIO and VTT are powered.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks AMD Athlon™ X2 Dual-Core Processor Thermal and Power Specification Table Notes: 1. VLDT. and VLDT supplies are off. memory in self-refresh mode and DDR2 SDRAM interface tristated. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as measured under the same conditions as TDP. for details on P-state operation for multi-core processors. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. Assumes 35°C.00 . VDD1. TDP includes all power dissipated on-die from VDD0. 4. VDDNB. 9. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. VTT and VDDA. 11. Assumes 50°C. 3.

00 .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 5 AMD Sempron™ Processor The following sections contain the OPN description and thermal and power specifications for the AMD Sempron™ processor. AMD Sempron™ Processor Ordering Part Number Diagram S M SI40 SA M 1 2 GG Part Definition: GG (see Table 22) Cache Size: 2 (see Table 23) Number of Cores: 1 (see Table 24) Package: M (see Table 25) Roadmap: SA (see Table 26) Model Number: SI40 (see Table 27) Segment: M = Mobile Brand: S = AMD Sempron™ Processor Figure 8. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN).1 provides an example of the OPN structure for this processor family. 5.PID: 43373 Rev 3.1 AMD Sempron™ Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 7. Section 5. AMD Sempron™ Processor Ordering Part Number Example AMD Sempron™ Processor 33 .

September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Table 22. AMD Sempron™ Processor Number of Cores OPN Character 1 2 Number of Cores 1 2 Table 25. Segment 25 W. AMD Sempron™ Processor Roadmap Options OPN Character SA DA Power. AMD Sempron™ Processor Package Options OPN Character M Package S1g2 Table 26. Notebook 35 W. AMD Sempron™ Processor Part Definition Options Part Definition Revision GG Rev B1 CPUID 8000_0001h EAX [31:0] (CPUID) 00200F31h Table 23. Notebook Number of Cores 1 2 Socket Infrastructure S1g2 S1g2 Table 27. AMD Sempron™ Processor L2 Cache Size Options OPN Character 1 2 L2 Cache Size 256 KB 512 KB Table 24.PID: 43373 Rev 3. AMD Sempron™ Processor Model Number Options Frequency L2 Cache Size 1800 MHz 2000 MHz 512 KB 512 KB Model Number NI52 SI40 AMD Sempron™ Processor 34 .00 .

2 AMD Sempron™ Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 28 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 5. AMD Sempron™ Processor Thermal and Power Table Guide SOPN SM mmmm SA pnc GG SM mmmm DA pnc GG Power 25 W 35 W Revision Rev B1 Rev B1 Thermal/Power Tables Section 5. Table 28. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN.3.2 on page 38 AMD Sempron™ Processor 35 .1 on page 37 Section 5.00 .PID: 43373 Rev 3.3.

for electrical specifications for the processor.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 5. order# 41256.3 AMD Sempron™ Processor Thermal and Power Specifications Refer to the AMD Family 11h Processor Electrical Data Sheet. Section 5.PID: 43373 Rev 3. for power management BIOS requirements.1 on page 33 provides an example of the OPN structure for processors documented in this chapter and Table 28 on page 35 provides a guide to OPN organization in the following subsections. Refer to Section 1. AMD Sempron™ Processor 36 . Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors.3 on page 9 for numbering conventions and terminology definitions used in these tables. order# 40683.00 .2 on page 9 and Section 1.

1 A SMSI42SAM12GG 100 °C 0 °C to 35 °C 10 °C 2.C0.53 A 3.14 2 2 6 1 3.200 V 1.C0.14 2 2 6 1 3.C0.1 State SM mmmm SA pnc GG (25 W Mobile.950 V 0.1 A 1000 MHz 14.8 W 1.C0.125 V 19.PID: 43373 Rev 3.6.20 °C/W S0.950 V 10.2 W 1.2 W 3.14 2 2 6 9 1.2 A 750 MHz 17.125 V 19.950 V 0.10 12 8 250 mW 250 mW 1.C0.200 V 1.900 V 2100 MHz 25.00 .53 A 4.1 W 0.Px TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max I/O Power S3 I/O Power The notes for this table are on page 39.HTC S0.61 A 0. S1g2) Thermal and Power Specifications Specification Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF 1 3.P1 S0.200 V 11.09 A 1.8 W 0.C0.075 V 1.6.6.200 V 11.950 V 8.8 A 800 MHz 17.HTC 1.6 W 1.3.10 11 1.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 5.C0.075 V 1.0 W 5 Notes 13 SMSI40SAM12GG 100 °C 0 °C to 35 °C 10 °C 2.1 A 1050 MHz 12.0 W 1.C0.900 V 2000 MHz 25.0 W 1.P1 S0.61 A 0.09 A 4.P0 S0.20 °C/W S0.P1 S0. AMD Sempron™ Processor 37 .HTC 1.0 W 1.0 A S0.

C0.P1 S0.HTC 1.10 11 1.075 V 1.6 2 2 6 9 3.C0.5 W 0.10 12 8 250 mW 1.PID: 43373 Rev 3.150 V 28.6 2 2 6 1 3.2 State SM mmmm DA pnc GG (35 W Mobile.Px TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC CPU COF TDP VID_VDD Min VID_VDD Max TDC C1 Halt IDD Max I/O Power C1E/S1 @ Min P-state IDD Max I/O Power S3 I/O Power The notes for this table are on page 39.C0.P1 S0.C0.3.61 A 0.HTC S0.32 A 4.C0.C0.6 A 650 MHz 24.0 W 5 Notes 13 SMNI52DAM21GG 100 °C 0 °C to 35 °C 10 °C 1.P0 S0.6 2 2 6 1 3. S1g2) Thermal and Power Specifications Specification7 Tdie Max Tambient TRise Thermal Resistance (die-amb) Startup P-state HTC P-state Limit IDDNB Max VID_VDDNB CPU COF 1 3.83 A 4.5 W 1.57 °C/W S0. AMD Sempron™ Processor 38 .200 V 16.950 V 0.2 W 3.00 .200 V 1.900 V 1800 MHz 35.0 W 1.7 A S0.4 A 900 MHz 15.950 V 11.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 5.

Assumes 35°C. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. 3. TDP values apply to operation in a triple-plane motherboard In which each voltage plane is running at the voltage requested by the processor. TDP is measured under the conditions of all cores operating at CPU COF. for more information. and VDD at the voltage requested by the processor. minimum P-state VID_VDD. TDP includes all power dissipated on-die from VDD0. Variable voltage—any valid voltage between VDD min and VDD max is allowed.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks AMD Sempron™ Processor Thermal and Power Specification Table Notes: 1. VDDIO and VTT are powered. HyperTransport™ links disconnected. 10. VDDIO. 11. DDR2 SDRAM interface tristated. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. 4. Assumes VDDIO = 1. order# 41323 to ensure compatibility with future processors.PID: 43373 Rev 3. minimum P-state VID_VDD and minimum P-state and a core clock divisor of 16. P-state limit when HTC is active. 5. 12. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tdie conditions for all cores. Platforms should be designed to the TDC defined in the Socket S1g2 Processor Power and Thermal Roadmap. 7. VTT. order# 41256. 6. 13. memory in self-refresh mode. Assumes 35°C. VLDT. and VDDA power planes only. 8. order# 41256. 2.00 . Frequency reported to the OS is rounded to the nearest 100-MHz boundary. clock divider set to 512. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. TDP is not the maximum power of the processor. Power dissipated by the processor VDDIO. AMD Sempron™ Processor 39 . The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tdie. 14. Assumes 50°C. for details on P-state operation for multi-core processors. and VLDT supplies are off. VLDT. 9. Tdie Max.max. TDP values apply to operation in a triple-plane motherboard. VDDNB. VDD. Thermal Design Current (TDC) is the sustained current limit drawn by VDD0 and VDD1 as measured under the same conditions as TDP. VTT and VDDA.8 V and VTT = VDDIO / 2. memory in self-refresh mode and DDR2 SDRAM interface tristated. VDDA. VDD1. Tdie Max is measured using the SB-TSI interface.

VDD1 Supply V Voltage Metal Mask VID V VDDNB Supply voltage VDDNB Supply voltage V V Min Typ Max Refer to the thermal/power tables under the appropriate SOPN section for this OPN specific parameter.PID: 43373 Rev 3. V o lta g e rip p le a n d tra n sien t even ts o u tsid e th e DC sp ecifica tio n mu st rema in w ith in th e AC sp ecifica tio n a t a ll times.Socket S1 Power Supply Operating Conditions Table 29. Power Supply Specifications 40 .05 1. V o lta g e rip p le a n d tra n sien t even ts o u tsid e th e DC sp ecifica tio n mu st rema in w ith in th e AC sp ecifica tio n a t a ll times.05 1. Tra n sien ts a b o ve V DDN B _ d c ma x mu st retu rn to w ith in th e DC sp ecifica tio n w ith in 2 0 μ S .25 Notes 1 2 1 VDDNB_PON Metal Mask VDDNB V 2 Notes: 1) The processor drives a VID code corresponding to this voltage. VDD1 Su p p ly Vo ltag e VDDNB Su p p ly Vo ltag e V V VID_ VDD – 125 mV VID_ VDDNB – 100 mV VID_ VDD VID_ VDDNB VID_ VDD + 125 mV VID_ VDDNB + 100 mV 1 2 No tes: 1 ) Th e vo lta g e set-p o in t mu st b e co n ta in ed w ith in th e DC sp ecifica tio n in o rd er to h elp en su re p ro p er o p era tio n .25 VID_VDDNB VID_VDDNB VID_VDDNB –25 mV + 25 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPN specific parameter. 1. Test b y d ifferen tia lly p ro b in g th e VDD0 _ F B_ H/L a n d VDD1 _ FB _ H/L sig n a ls u sin g 2 0 -M Hz sco p e b a n d w id th limit.00 .1 bsmmmmrr M ncdd .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 6 Power Supply Specifications 6. bsmmmmrr M ncdd VDD0 and VDD1 Power Supply DC Operating Conditions Symbol VID_VDD VDD_dc VDD_PON VDDNB_dc VID_VDDNB Parameter Units VID-Requested VDD0.VDD0.10 1. Test b y d ifferen tia lly p ro b in g th e VDDN B_ F B _ H/L sig n a ls u sin g 2 0 -M Hz sco p e b a n d w id th limit. 2) After PWROK assertion. Table 30. bsmmmmrr M ncdd VDD0 and VDD1 Power Supply AC Operating Conditions VDD_ ac VDDNB_ ac VDD0.10 1. VDD1 Supply V Level DC Tolerance . the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2 ) Th e vo lta g e set-p o in t mu st b e co n ta in ed w ith in th e DC sp ecifica tio n in o rd er to h elp en su re p ro p er o p era tio n . Tra n sien ts a b o ve V DD_ d c ma x mu st retu rn to w ith in th e DC sp ecifica tio n w ith in 2 0 μ S . VID_VDD VID_VDD VID_VDD –25 mV + 25 mV 1.

3) VDDIO current is consumed by I.5*VDDIO_dc and stays within the range of 0. etc.00 750 1. 6) Power supply A/C measurements use a 20-MHz scope bandwidth limit. if the inaccuracy and IR drop amounts to 50 mV. the voltage regulator setting must be set 20 mV higher so that VTT still tracks 0.5 40 8 5. if the inaccuracy and IR drop amounts to 20 mV.80 VDDIO_dc 1. DLL. DLL. 5) VDDIO_ac and VTT_ac parameters are measured over a 60 second time frame with all data bus bits switching. 4. then the voltage regulator setting for VDDIO should not be lower than 1.60 2. 7) All voltages are referenced to VSS. and stays within the specified maximum and minimum range. 4) VTT current is consumed by I. As such. Power Supply Specifications 41 . level-shifters. In order to help ensure proper functionality. 9) This specification reflects the values published in the appropriate power roadmap document. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin tracks 0. 9 9 Notes: 1) ILDT is specified for one 16x16-bit Gen3 link.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks Table 31. O. factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range.40 Typ 1. etc.PID: 43373 Rev 3.95 V. Factors such as voltage regulator inaccuracy and IR drop have to be carefully considered and compensated for.5*VDDIO_dc.90 Notes 7 VDDIO_dc +150 5. I/O switching current and on-chip functions (PDL.85 V and 0.).00 . For example.90 VTT_dc 2.50 Max 1.85 VTT_dc –75 mV 2.). 2) VTT must both sink and source current. 6 3. 9 1. level-shifters.14 0.75 V to avoid violating the VDDIO_dc minimum spec of 1.95 VTT_dc +75 mV 2. bsmmmmrr M ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc VDDIO_ac VLDT VTT_dc VTT_ac VDDA IDDIO1 ITT1 ILDT IDDA Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply voltage VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals VTT Supply Voltage VDDA Supply Voltage VDDIO Power Supply Current VTT Power Supply Current VLDT Power Supply Current VDDA Power Supply Current Units V V V V V V A mA A mA Min 1. I/O switching current and on-chip functions (PDL. 6 mV 1. For example. O.26 0.70 V.20 0. 8) All voltages are referenced to VSS. 9 2.70 VDDIO_dc –150 mV 1.

order# 41256.00 .September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 7 Power Limit Encoding IddValue and IddDiv are available for each P-state in Pstate registers MSRC001_00[6B:64]. Power Limit Encoding 42 . refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 11h Processors. For more details.PID: 43373 Rev 3.

334 9.500 MTOPS 43 .775 3. The calculations are stated in millions of theoretical operations per second (MTOPS) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4).September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 8 MTOPS Table 32 shows the composite theoretical performance (CTP) calculations.242 5. incidental.500 11.859 6. INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY.017 8.334 16.00 .750 16. AMD makes no representation or warranty as to the accuracy or reliability of such calculations.084 11. or consequential.834 13.584 8.475 6. loss of anticipated profits or other economic loss occurring in connection with use of the calculations. THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES WHATSOEVER.417 14.000 7.634 8. No license.392 3. FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.400 7.000 14. EXPRESS OR IMPLIED.625 4.584 15.550 5. punitive. even if AMD has been advised in advance of the possibility of such damages.317 4.084 3. Table 32. express or implied. by estoppel or otherwise. Composite Theoretical Performance (CTP) Calculations Frequency 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 MTOPS S ingle-Core 2.092 7.167 8. Furthermore.250 5.917 17.467 2.667 5.PID: 43373 Rev 3.250 12.417 7. special.700 4.934 5.009 4.250 MTOPS Dual-Core 4.709 8.750 9. such as but not limited to. NONINFRINGEMENT.325 8.167 15. indirect.667 12. All calculations contained herein are subject to change without notice.784 7. AMD shall have no liability for any losses or damages including direct.167 6.917 10.834 6.942 9. to any intellectual property rights is granted herein.

0011 0.0013 0. Table 33.0014 0. AMD Turion™ X2 dual-core mobile processor.0028 0. THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES WHATSOEVER.0029 0. such as but not limited to. Adjusted Peak Performance (APP) Calculations Frequency 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 APP Single-Core 0.0019 0. Furthermore.0016 0.0010 0. AMD makes no representation or warranty as to the accuracy or reliability of such Calculations.0013 0.0008 0.0025 0.0013 0.0010 0. loss of anticipated profits or other economic loss occurring in connection with use of the Calculations.0031 0.0007 0.0011 0.0035 0.0018 0.0020 0. FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.0016 0.0024 0.0012 0.September 2008 AMD Family 11h Processor Power and Thermal Data Sheet for Notebooks 9 APP Table 33 shows the Adjusted Peak Performance (APP) calculations (“Calculations”) for the AMD Turion™ X2 Ultra dual-core mobile processor.00 . by estoppel or otherwise.0017 0.0012 0.0015 0.0023 0.0017 0. even if AMD has been advised in advance of the possibility of such damages. express or implied.0036 APP 44 . INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY. incidental.0005 0.0034 0. indirect.0007 0.0032 0. EXPRESS OR IMPLIED.0008 0.0011 0.0017 0.PID: 43373 Rev 3. All Calculations contained herein are subject to change without notice. NONINFRINGEMENT.0005 0. or consequential. to any intellectual property rights is granted herein.0014 0.0018 APP Dual-Core 0.0014 0. No license. punitive.0026 0. AMD shall have no liability for any losses or damages including direct.0016 0.0030 0.0006 0.0022 0. special. The Calculations are stated in Millions of Weighted Teraflops (WT) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4).0010 0.0009 0. AMD Athlon™ X2 dual-core processor and Mobile AMD Sempron™ processor.