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43G Balanced Photo-receiver for DPSK-WDM long haul transmissions

Context
With the constant custormer needs of higher capacity for long haul optical networks, the use of advanced formats based on differential detection like DPSK, DQPSK, in todays a reality. It is the reason why high speed balanced photoreceiver is one of the new keys optical components for the deployment of high speed WDM transmissions, today at 40 Gb/s and in the near furture at 100 Gb/s. This innovative product was developed in the frame of an internal venture.

Challenge
The challenge was two folds: the first one linked to the design and fabrication of high speed dual-photodiodes (Dual-Pin) and Differential Trans-Impedande Amplifier (DTIA) based on InP technologies as well as their integration using high frequency packaging rules; the second one was to transfer the packaging technoloy to a packager manufacturer for the volume production of cost effective balancedphotoreceiver.

Figure 1: III-V Lab prototype module system performances

Innovation
State-of-the-art OSNR system performances were demonstrated by the Alcatel-Lucent Thales III-V Lab balanced photo-receiver modules with a competitive advantage identified in term of tolerance to the electronic demultiplexer. These results rely on high performances InP chips (Dual-Pin and Differential HBT Trans-impedance Amplifier) as well as high frequency expertise for their integration in a single package. Typical prototype modules characteristics Edge Dua-Pin InP based technology High responsivity ( >0.6A/W over C-Band) Low polarization sensitivity (< 0.3 dB) Differential TIA InP based HBT technology Differential conversion gain: 1500 V/W (linear regime) Differential output : 700 mV (limiting regime) Low optical path delay ( < 1 ps) Power consumption : 500 mW State of the art 43 Gb/s OSNR system performances up to 70C with wide tolerance to CDR threshold.

Product
This innovative photo-receiver is currently commercially available thanks to packaging technology transfer to TELEOPTIX-LINKRA and qualified InP chips fabricated and sold by AlcatelLucent Thales III-V Lab.

Figure 2: Teleoptix-Linkra Balanced photoreceiver product with III-V Lab chips inside

BENEFIT:This Bell Labs innovation gives access to


Alcatel-Lucent to a key optical technology required for the deployment of 40-100 Gb/s optical networks. Moreover, from a strategic point of view it is an important leverage for cost reduction of optical components
Contact: Franck.Mallecot@alcatel-lucent.fr Alcatel-Lucent Bell Labs

Bell Labs June 2009