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OPA

277

OPA

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7

OPA 4277

OPA2 77

OPA2 277

OPA4 277

OPA2

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OPA2

277

OPA277 OPA2277 OPA4277

SBOS079A – MARCH 1999 – REVISED APRIL 2005

High Precision OPERATIONAL AMPLIFIERS
FEATURES
q ULTRA LOW OFFSET VOLTAGE: 10µV q ULTRA LOW DRIFT: ±0.1µV/°C q HIGH OPEN-LOOP GAIN: 134dB q HIGH COMMON-MODE REJECTION: 140dB q HIGH POWER SUPPLY REJECTION: 130dB q LOW BIAS CURRENT: 1nA max q WIDE SUPPLY RANGE: ±2V to ±18V q LOW QUIESCENT CURRENT: 800µA/amplifier q SINGLE, DUAL, AND QUAD VERSIONS q REPLACES OP-07, OP-77, OP-177

DESCRIPTION
The OPA277 series precision op amps replace the industry standard OP-177. They offer improved noise, wider output voltage swing, and are twice as fast with half the quiescent current. Features include ultra low offset voltage and drift, low bias current, high common-mode rejection, and high power supply rejection. Single, dual, and quad versions have identical specifications for maximum design flexibility. OPA277 series op amps operate from ±2V to ±18V supplies with excellent performance. Unlike most op amps which are specified at only one supply voltage, the OPA277 series is specified for real-world applications; a single limit applies over the ±5V to ±15V supply range. High performance is maintained as the amplifiers swing to their specified limits. Because the initial offset voltage (±20µV max) is so low, user adjustment is usually not required. However, the single version (OPA277) provides external trim pins for special applications. OPA277 op amps are easy to use and free from phase inversion and overload problems found in some other op amps. They are stable in unity gain and provide excellent dynamic behavior over a wide range of load conditions. Dual and quad versions feature completely independent circuitry for lowest crosstalk and freedom from interaction, even when overdriven or overloaded. Single (OPA277) and dual (OPA2277) versions are available in DIP-8, SO-8, and DFN-8 (4mm x 4mm) packages. The quad (OPA4277) comes in DIP-14 and SO-14 surface-mount packages. All are fully specified from –40°C to +85°C and operate from –55°C to +125°C.
OPA277AIDRM

APPLICATIONS
q q q q q q q TRANSDUCER AMPLIFIER BRIDGE AMPLIFIER TEMPERATURE MEASUREMENTS STRAIN GAGE AMPLIFIER PRECISION INTEGRATOR BATTERY POWERED INSTRUMENTS TEST EQUIPMENT
OPA277 Offset Trim –In +In V– 1 2 3 4 8-Pin DIP, SO-8 8 7 6 5 Offset Trim V+ Output NC

OPA4277 1 2 A D 12 11 10 B C 9 8 14-Pin DIP, SO-14
V− 4 5

Offset Trim −In

1 Pin 1 Indicator

8

Offset Trim

Out A –In A +In A V+ +In B

14 13

Out D –In D

2

7

V+

+In

3

6

Output

3 4 5 6 7

+In D V– +In C –In C Out C
+In A 3 Out A −In A 1

OPA2277AIDRM
V− 4 5 NC

8 Pin 1 Indicator

Out B
DFN-8 4mm x 4mm (top view) Thermal Pad on Bottom (Connect to V−)

OPA2277 Out A –In A +In A V– 1 2 3 4 8-Pin DIP, SO-8 A B 8 7 6 5 V+ Out B –In B +In B

–In B Out B

2

7

V+ −In B

6

+In B

NC = No connection.

DFN-8 4mm x 4mm (top view)

Thermal Pad on Bottom (Connect to V−)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright © 1999-2005, Texas Instruments Incorporated

www.ti.com

ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage .................................................................................... 36V Input Voltage ..................................................... (V–) –0.7V to (V+) +0.7V Output Short-Circuit(2) .............................................................. Continuous Operating Temperature .................................................. –55°C to +125°C Storage Temperature ..................................................... –55°C to +125°C Junction Temperature ...................................................................... 150°C Lead Temperature (soldering, 10s) ................................................. 300°C ESD Rating (Human Body Model) .................................................. 2000V (Machine Model) ........................................................... 100V NOTE: (1) Stresses above these rating may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Short-circuit to ground, one amplifier per package.

ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)
OFFSET VOLTAGE max, µV ±50 ±20 ±50 ±20 ±100 ±50 ±25 ±50 ±25 ±100 ±50 ±50 OFFSET VOLTAGE DRIFT max, µV/°C ±1 ±0.15 ±1 ±0.15 ±1 ±1 ±0.25 ±1 ±0.25 ±1 ±1 ±1

PRODUCT Single OPA277PA OPA277P OPA277UA OPA277U OPA277AIDRM Dual OPA2277PA OPA2277P OPA2277UA OPA2277U OPA2277AIDRM Quad OPA4277PA OPA4277UA

PACKAGE-LEAD

DIP-8 DIP-8 SO-8 Surface Mount SO-8 Surface Mount DFN-8 (4mm x 4mm)

DIP-8 DIP-8 SO-8 Surface Mount SO-8 Surface Mount DFN-8 (4mm x 4mm)

DIP-14 SO-14 Surface Mount

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet or visit the TI web site at www.ti.com.

PIN DESCRIPTIONS
OPA277 Offset Trim –In +In V– 1 2 3 4 8-Pin DIP, SO-8 8 7 6 5 Offset Trim V+
−In A 2 OPA2277AIDRM

Out A

1 Pin 1 Indicator

8

Out B

7

V+ −In B

Output NC(1)
+In A 3 6

OPA4277
V− 4 5 +In B

Out A –In A +In A V+ +In B –In B Out B OPA2277

1 2 A 3 4 5 B 6 7 14-Pin DIP, SO-14 C D

14 13 12 11 10 9 8

Out D –In D +In D V–
OPA277AIDRM DFN-8 4mm x 4mm (top view)

Thermal Pad on Bottom (Connect to V−)

+In C –In C Out C
−In 2 Offset Trim 1 Pin 1 Indicator 8 Offset Trim

7

V+

Out A –In A +In A V–

1 2 3 4 8-Pin DIP, SO-8 A B

8 7 6 5

V+ Out B –In B +In B

+In V−

3

6

Output

4

5

NC

DFN-8 4mm x 4mm (top view)

NOTE: (1) NC = No connection.

Thermal Pad on Bottom (Connect to V−)

2

OPA277, OPA2277, OPA4277
www.ti.com
SBOS079A

–40°C to +85°C. G = 1.002 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ dB dB dB TA = –40°C to +85°C FREQUENCY RESPONSE Gain-Bandwidth Product GBW Slew Rate SR Settling Time. f = 10Hz en f = 100Hz f = 1kHz f = 10kHz Current Noise Density. f = 0. UA OPA2277PA. VO = (V–)+1.8 14 16 3 0. U (high grade. UA OPA4277PA. single) OPA2277P.15 ✻ ✻ ✻ ±1 PSRR VS = ±2V to ±18V VS = ±2V to ±18V dc 0.5V to (V+)–1. UA. AIDRM Versions Input Offset Voltage: (all models) vs Time vs Power Supply TA = –40°C to +85°C Channel Separation (dual. and RL = 2kΩ. single) OPA2277P. Boldface limits apply over the specified temperature range. U (high grade. dual) All PA.5V.5 ±0. RL = 2kΩ 126 126 100 || 3 250 || 3 ✻ ✻ ✻ ✻ 140 134 ✻ ✻ 1 0.5 ±0.15 ✻ ✻ ✻ ±1 ±0. U PARAMETER OFFSET VOLTAGE Input Offset Voltage: OPA277P.8 ±4 ±2. G = 1. U (high grade.5 ±1 ±1 ±1 ±1 IB IOS ±1 ±2 ±1 ±2 ✻ ✻ ±2.5V to (V+)–1. f = 1kHz in INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection TA = –40°C to +85°C INPUT IMPEDANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain AOL VCM CMRR TA = TA = TA = TA = –40°C –40°C –40°C –40°C to to to to +85°C +85°C +85°C +85°C ±30 ±50 ±100 ±165 TA = –40°C to +85°C TA = –40°C to +85°C TA = –40°C to +85°C ±0.1 to 10Hz Input Voltage Noise Density.5V to (V+)–1.15 ±0.3 0.01% Overload Recovery Time Total Harmonic Distortion + Noise THD+N ✻ Specifications same as OPA277P. VO = 3. 10V Step VIN • G = VS 1kHz. RL = 2kΩ VS = ±15V. U (high grade. UA. OPA4277 SBOS079A www. U OPA2277P.035 12 8 8 8 0. OPA2277AIDRM TYP(1) MAX UNITS VOS ±10 ±10 ±20 ±25 ±20 ±50 ±35 ±100 µV µV µV µV µV µV µV µV µV/°C µV/°C µV/°C µV/mo µV/V µV/V µV/V nA nA nA nA µVPP µVrms nV/√Hz nV/√Hz nV/√Hz nV/√Hz pA/√Hz Input Offset Voltage Over Temperature OPA277P. 0.5Vrms ✻ ✻ ✻ ✻ ✻ ✻ MHz V/µs µs µs µs % OPA277.2 ±0.5 ±0. dual) All PA. Versions AIDRM Versions Input Offset Voltage Drift dVOS/dT OPA277P. UA MAX MIN TYP(1) MAX MIN OPA277P. quad) INPUT BIAS CURRENT Input Bias Current TA = –40°C to +85°C Input Offset Current TA = –40°C to +85°C NOISE Input Voltage Noise.ELECTRICAL CHARACTERISTICS: VS = ±5V to VS = ±15V At TA = +25°C. OPA277PA.1 ±0.ti.1% 0. NOTE: (1) VS = ±15V. U.8 ±4 0.8 ±4 ±2.1 ±0. U (high grade. single) OPA2277P. 10V Step VS = ±15V.8 ±4 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ 115 115 ±2. Versions AIDRM Versions CONDITION MIN TYP(1) OPA277AIDRM. G = 1. dual) All PA. UA.1 ±0.22 0. RL = 10kΩ VO = (V–)+1. OPA2277.25 ±0.2 (V–) +2 130 128 (V+) –2 140 ✻ 115 115 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ VCM = (V–) +2V to (V+) –2V VCM = (V–) +2V to (V+) –2V ✻ V dB dB MΩ || pF GΩ || pF VCM = (V–) +2V to (V+) –2V VO = (V–)+0. U (high grade.2V.5V.com 3 . unless otherwise noted.

–40°C to +85°C. OPA4277 www. unless otherwise noted.5 +1.ELECTRICAL CHARACTERISTICS: VS = ±5V to VS = ±15V At TA = +25°C. UA OPA2277PA.ti. U PARAMETER OUTPUT Voltage Output TA = –40°C to +85°C TA = –40°C to +85°C Short-Circuit Current Capacitive Load Drive POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current (per amplifier) TA = –40°C to +85°C TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SO-8 Surface-Mount DIP-8 DIP-14 SO-14 Surface-Mount DFN-8(2) CONDITION MIN TYP(1) (CONT) OPA277AIDRM.5 +1. and RL = 2kΩ. UA OPA4277PA. NOTES: (1) VS = ±15V.5 –1. OPA277PA.com SBOS079A . 4 OPA277. Boldface limits apply over the specified temperature range. OPA2277AIDRM TYP(1) MAX UNITS VO RL = 10kΩ RL = 10kΩ RL = 2kΩ RL = 2kΩ (V–) (V–) (V–) (V–) +0. U.5 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ISC CLOAD VS IQ IO = 0 IO = 0 –40 –55 –55 ±5 ±2 ±35 See Typical Curve ±15 ±18 ±825 ±900 +85 +125 +125 150 100 80 100 ✻ ✻ V V V V mA ±790 ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ V V µA µA °C °C °C °C/W °C/W °C/W °C/W °C/W ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ ✻ θJA 45 ✻ Specifications same as OPA277P. UA MAX MIN TYP(1) MAX MIN OPA277P.5 (V+) (V+) (V+) (V+) –1. OPA2277.5 +0. U OPA2277P. (2) Thermal pad soldered to printed circuit board (PCB).2 –1.2 –1.

OPA4277 SBOS079A www. RL = 2kΩ. and RL = 2kΩ. unless otherwise noted.01 G = 1. Quad measured channel A to D or B to C—other combinations yield similar or improved rejection.1 1 φ –60 –90 –120 –150 –180 10 100 1k 10k 100k 1M 10M 0. 10kΩ 0. 10kΩ 0. 80 60 40 OPA277. RL = 2kΩ.ti.5Vrms Channel Separation (dB) 120 THD+Noise (%) 0.001 10 100 1k 10k 100k 1M 10 100 1k Frequency (Hz) 10k 100k Frequency (Hz) 100 Dual and quad devices.1Hz and 10Hz.1 1 10 100 1k 10k 100k 1M Frequency (Hz) Frequency (Hz) INPUT NOISE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY 1000 INPUT NOISE VOLTAGE vs TIME Voltage Noise (nV/√Hz) Current Noise (fA/√Hz) Current Noise 100 Noise signal is bandwidth limited to lie between 0.TYPICAL CHARACTERISTICS At TA = +25°C. all channels. VS = ±15V. G = 1. OPA2277. CMR (dB) +PSR 100 80 CMR 60 40 20 0 80 60 40 20 0 –20 0.com 5 . OPEN-LOOP GAIN/PHASE vs FREQUENCY 140 120 100 AOL (dB) POWER SUPPLY AND COMMON-MODE REJECTION vs FREQUENCY 140 CL = 0 CL = 1500pF G 0 –30 Phase (°) 120 –PSR PSR.1 G = 10. 50nV/div 10 Voltage Noise 1 1 10 100 Frequency (Hz) 1k 10k 1s/div CHANNEL SEPARATION vs FREQUENCY 140 1 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY VOUT = 3.

OPA2277.8 0. and quad included.9 1. 80 70 60 50 40 30 20 10 0 –50 –25 0 25 50 75 100 125 Temperature (°C) 500 –75 6 OPA277. PSR (dB) AOL.2 0. PSR vs TEMPERATURE 160 150 CMR 140 130 PSR 120 110 100 –75 AOL –50 –25 0 25 50 75 100 125 Temperature (°C) INPUT BIAS CURRENT vs TEMPERATURE 5 4 Quiescent Current (µA) QUIESCENT CURRENT AND SHORT-CIRCUIT CURRENT vs TEMPERATURE 1000 950 900 850 800 750 700 650 600 550 –ISC +ISC ±IQ 100 90 Short-Circuit Current (mA) Input Bias Current (nA) 3 2 1 0 –1 –2 –3 –4 –5 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) Curves represent typical production units. Single.1 0.6 0.0 Offset Voltage (µV/°C) WARM-UP OFFSET VOLTAGE DRIFT 3 Offset Voltage Change (µV) 2 1 0 –1 –2 –3 0 15 30 45 60 75 90 105 120 Time from Power Supply Turn-On (s) AOL. Single. CMR. Percent of Amplifiers (%) 12 10 8 6 4 2 0 Percent of Amplifiers (%) 25 20 15 10 5 0 –50–45–40 –35–30–25–20–15–10 –5 0 5 10 15 20 25 30 35 40 45 50 Offset Voltage (µV) 0 0. and quad included. and RL = 2kΩ.7 0.5 0.com SBOS079A . dual. unless otherwise noted. OFFSET VOLTAGE PRODUCTION DISTRIBUTION 16 14 Typical distribution of packaged units. VS = ±15V. CMR.4 0. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 35 30 Typical distribution of packaged units. OPA4277 www. dual.ti.TYPICAL CHARACTERISTICS (CONT) At TA = +25°C.3 0.

1.5 0. unless otherwise noted.5 0.5nA to +0. CHANGE IN INPUT BIAS CURRENT vs POWER SUPPLY VOLTAGE 2. Typical IB may range from –05.5 1.nA to +0.0 –1.0 –0.5 –2.0 Curve shows normalized change in bias current with respect to VCM = 0V.0 1.5 –2. Typical IB may range from –0.0 –1. OPA2277.5 0.ti. VS = ±15V.0 0 5 10 15 20 25 30 35 40 Supply Voltage (V) VCM = 0V VS = ±15V –1.5nA at VCM = 0V. VS = ±5V ∆IB (nA) Curve shows normalized change in bias current with respect to VS = ±10V (+20V).0 –15 –10 –5 0 5 10 15 Common-Mode Voltage (V) QUIESCENT CURRENT vs SUPPLY VOLTAGE 1000 per amplifier Quiescent Current (µA) 900 Settling Time (µs) 50 100 SETTLING TIME vs CLOSED-LOOP GAIN 10V step CL = 1500pF 0.5 1.0 –0.TYPICAL CHARACTERISTICS (CONT) At TA = +25°C.5 –1.0 ∆IB (nA) CHANGE IN INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 2. and RL = 2kΩ.01% 0.0 0. OPA4277 SBOS079A www.1% 800 700 20 600 500 0 ±5 ±10 Supply Voltage (V) ±15 ±20 10 ±1 ±10 Gain (V/V) ±100 MAXIMUM OUTPUT VOLTAGE vs FREQUENCY 30 25 Output Voltage (VPP) OUTPUT VOLTAGE SWING vs OUTPUT CURRENT (V+) (V+) – 1 Output Voltage Swing (V) VS = ±15V (V+) – 2 (V+) – 3 (V+) – 4 (V+) – 5 (V–) + 5 (V–) + 4 (V–) + 3 (V–) + 2 (V–) + 1 125°C 125°C 25°C 25°C –55°C 20 15 10 5 0 1k 10k Frequency (Hz) 100k 1M VS = ±5V –55°C (V–) 0 ±5 ±10 ±15 ±20 ±25 ±30 Output Current (mA) OPA277.com 7 .5nA at VS = ±10V.

VS = +15V Overshoot (%) 40 30 20 Gain = ±10 10 0 10 100 1k Load Capacitance (pF) 10k 100k 10µs/div SMALL-SIGNAL STEP RESPONSE G = +1.com SBOS079A . VS = ±15V 2V/div Gain = +1 SMALL-SIGNAL STEP RESPONSE G = +1. VS = ±15V 20mV/div 1µs/div 20mV/div 1µs/div 8 OPA277. CL = 1500pF. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE 60 Gain = –1 50 LARGE-SIGNAL STEP RESPONSE G = +1. CL = 0. CL = 1500pF. unless otherwise noted. and RL = 2kΩ. OPA4277 www.ti.TYPICAL CHARACTERISTICS (CONT) At TA = +25°C. OPA2277. VS = ±15V.

INPUT BIAS CURRENT CANCELLATION The input stage base current of the OPA277 series is internally compensated with an equal and opposite cancellation circuit. The resulting input bias current is the difference between the input stage base current and the cancellation current. OPA4277 SBOS079A www. The protection diodes will. Offset voltage can be adjusted by R2 R1 Op Amp R1 R2 OPA277 RB = R2 || R1 No bias current cancellation resistor (see text) (b) OPA277 with no external bias current cancellation resistor. (a) Conventional op amp with external bias current cancellation resistor. These thermal potentials can be made to cancel by assuring that they are equal in both input terminals. Parameters which vary significantly with operating voltage or temperature are shown in typical performance curves. This adjustment should not be used to compensate for offsets created elsewhere in a system since this can introduce additional temperature drift.com 9 . In addition. • Shield op amp and input circuitry from air currents such as cooling fans. the OPA277 series is specified for real-world applications. V+ Trim Range: Exceeds Offset Voltage Specification 0. Use offset adjust pins only to null offset voltage of op amp—see text. key parameters are assured over the specified temperature range. This allows a customer operating at VS = ±10V to have the same assured performance as a customer using ±15V supplies. OFFSET VOLTAGE ADJUSTMENT The OPA277 series is laser-trimmed for very low offset voltage and drift so most circuits will not require external adjustment. INPUT PROTECTION The inputs of the OPA277 series are protected with 1kΩ series input resistors and diode clamps. but will not damage the op amp. OPERATING VOLTAGE OPA277 series op amp operate from ±2V to ±18V supplies with excellent performance. Applications with noisy or high impedance power supplies may require decoupling capacitors close to the device pins. To achieve highest performance. A resistor added to cancel input bias current errors may actually increase offset voltage and noise. The OPA277 series has very low offset voltage and drift. Most behavior remains unchanged through the full operating voltage range (±2V to ±18V). As a result. a single limit applies over the ±5V to ±15V supply range. making it easy to use in a wide range of applications.ti. The inputs can withstand ±30V differential inputs without damage. connecting a potentiometer as shown in Figure 1.1µF 20kΩ 7 2 3 0. Offset voltage and drift can be degraded by small thermoelectric potentials at the op amp inputs. FIGURE 2.1µF capacitors are adequate.APPLICATIONS INFORMATION The OPA277 series is unity-gain stable and free from unexpected output phase reversal.1µF 1 8 OPA277 4 6 OPA277 single op amp only. Connections of dissimilar metals will generate thermal potential which can degrade the ultimate performance of the OPA277 series. it is not necessary to use a bias current cancellation resistor as is often done with other op amps (Figure 2). However. circuit layout and mechanical conditions should be optimized. This residual input bias current can be positive or negative. the input bias current and input offset current are approximately the same magnitude. In most cases 0. OPA277. Input Bias Current Cancellation. Unlike most op amps which are specified at only one supply voltage. V– FIGURE 1. This may disturb the slewing behavior of unity-gain follower applications. • Locate heat sources as far as possible from the critical input circuitry. –40°C to +85°C. offset voltage trim connections are provided on pins 1 and 8. OPA277 Offset Voltage Trim Circuit. conduct current when the inputs are over-driven. OPA2277. of course. When the bias current is canceled in this manner. • Keep thermal mass of the connections made to the two input terminals similar. This adjustment should be used only to null the offset of the op amp.

ti. IREG ∼ 1mA 5V 12 V+ Type J 1/2 OPA2277 RF 10kΩ R 412Ω 13 VLIN + VIN 1 IR1 14 IR2 11 VREG 10 V+ 4 RG 1250Ω 3 RG XTR105 RG – VIN RF 10kΩ B E IO 9 8 1kΩ 50Ω 25Ω RCM = 1250Ω 1/2 OPA2277 V– 2 7 6 + – IO = 4mA + (VIN – VIN) 40 RG IRET (G = 1 + 0. 10 OPA277. OPA4277 www. Low Drift Loop Measurement with Diode Cold Junction Compensation. Thermocouple Low Offset. Load Cell Amplifier.com SBOS079A . INA2126 (dual) INA125 (on-board reference) INA122 (single-supply) FIGURE 3.01µF 2RF = 50) R FIGURE 4. OPA2277.V+ 1/2 OPA2277 R2 V– VOUT = (V1 – V2)(1 + R2 R1 ) R–∆R V1 R+∆R Load Cell R+∆R V2 R–∆R V+ R1 1/2 OPA2277 V– R2 R1 For integrated solution see: INA126.

which is a QFN package with contacts on only two sides of the package bottom.com. OPA277. Additionally. OPA2277. both available for download at www. the absence of external leads eliminates bent-lead issues. and improved electrical parasitics.ti. Quad Flatpack No-Lead Logic Packages (SCBA017). The exposed leadframe die pad on the bottom of the package should be connected to V–.ti. DFN packages are physically small. See Application Note. LAYOUT GUIDELINES The leadframe die pad should be soldered to a thermal pad on the PCB. The DFN package can be easily mounted using standard printed circuit board (PCB) assembly techniques. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. such as SO and MSOP. package shear. QFN/SON PCB Attachment (SLUA271) and Application Report. and similar board-level tests.DFN PACKAGE The OPA277 series uses the 8-lead DFN (also known as SON). OPA4277 SBOS079A www. Even with applications that have low-power dissipation. key push. Soldering the exposed pad significantly improves board-level reliability during temperature cycling. have a smaller routing area.com 11 . improved thermal performance. with a pinout scheme that is consistent with other commonly-used packages. near-chip-scale package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. This leadless. the exposed pad must be soldered to the PCB to provide structural integrity and longterm reliability.

ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device OPA2277AIDRMT OPA2277AIDRMTG4 OPA2277P OPA2277PA OPA2277PAG4 OPA2277PG4 OPA2277U OPA2277U/2K5 OPA2277U/2K5G4 OPA2277UA Status (1) Package Type Package Pins Package Qty Drawing VSON VSON PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC DRM DRM P P P P D D D D 8 8 8 8 8 8 8 8 8 8 250 250 50 50 50 50 75 2500 2500 75 Eco Plan (2) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU Call TI Call TI Call TI Call TI MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR -40 to 85 -40 to 85 -40 to 85 BHZ BHZ OPA2277P OPA2277P A OPA2277P A OPA2277P OPA 2277U OPA 2277U OPA 2277U OPA 2277U A OPA 2277U A OPA 2277U A OPA 2277U A OPA 2277U A OPA 2277U OPA2277UA/2K5 ACTIVE SOIC D 8 2500 Call TI Level-3-260C-168 HR -40 to 85 OPA2277UA/2K5E4 ACTIVE SOIC D 8 2500 Call TI Level-3-260C-168 HR -40 to 85 OPA2277UAE4 ACTIVE SOIC D 8 75 Call TI Level-3-260C-168 HR -40 to 85 OPA2277UAG4 ACTIVE SOIC D 8 75 Call TI Level-3-260C-168 HR -40 to 85 OPA2277UG4 ACTIVE SOIC D 8 75 Call TI Level-3-260C-168 HR -40 to 85 Addendum-Page 1 .PACKAGE OPTION ADDENDUM www.

com 24-Jan-2013 Orderable Device OPA277AIDRMR OPA277AIDRMRG4 OPA277AIDRMT OPA277AIDRMTG4 OPA277P OPA277PA OPA277PAG4 OPA277PG4 OPA277U OPA277U/2K5 OPA277U/2K5G4 OPA277UA Status (1) Package Type Package Pins Package Qty Drawing VSON VSON VSON VSON PDIP PDIP PDIP PDIP SOIC SOIC SOIC SOIC DRM DRM DRM DRM P P P P D D D D 8 8 8 8 8 8 8 8 8 8 8 8 3000 3000 250 250 50 50 50 50 75 2500 2500 75 Eco Plan (2) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR -40 to 85 NSS NSS NSS NSS OPA277P OPA277P A OPA277P A OPA277P OPA 277U OPA 277U OPA 277U OPA 277U A OPA 277U A OPA 277U A OPA 277U A OPA 277U A OPA277UA/2K5 ACTIVE SOIC D 8 2500 CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA277UA/2K5E4 ACTIVE SOIC D 8 2500 CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA277UAE4 ACTIVE SOIC D 8 75 CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA277UAG4 ACTIVE SOIC D 8 75 CU NIPDAU Level-3-260C-168 HR -40 to 85 Addendum-Page 2 .ti.PACKAGE OPTION ADDENDUM www.

NRND: Not recommended for new designs. or 2) lead-based die adhesive used between the die and leadframe. including the requirement that lead not exceed 0. Where designed to be soldered at high temperatures. OBSOLETE: TI has discontinued the production of the device. Only one of markings shown within the brackets will appear on the physical device.1% by weight in homogeneous materials.com/productcontent for the latest availability information and additional product content details.The planned eco-friendly classification: Pb-Free (RoHS). (2) Eco Plan . PREVIEW: Device has been announced but is not in production.PACKAGE OPTION ADDENDUM www.com 24-Jan-2013 Orderable Device OPA277UG4 OPA4277PA OPA4277PAG4 OPA4277UA OPA4277UA/2K5 OPA4277UA/2K5E4 OPA4277UAE4 OPA4277UAG4 Status (1) Package Type Package Pins Package Qty Drawing SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC D N N D D D D D 8 14 14 14 14 14 14 14 75 25 25 50 2500 2500 50 50 Eco Plan (2) Lead/Ball Finish CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Level-3-260C-168 HR N / A for Pkg Type N / A for Pkg Type Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 OPA 277U OPA4277PA OPA4277PA OPA4277UA OPA4277UA OPA4277UA OPA4277UA OPA4277UA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances. (4) Addendum-Page 3 .The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications. -. but TI does not recommend using this part in a new design.ti. Pb-Free (RoHS Exempt). Device is in production to support existing customers. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.ti. TBD: The Pb-Free/Green conversion plan has not been defined. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible). LIFEBUY: TI has announced that the device will be discontinued. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0. Peak Temp. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. or Green (RoHS & no Sb/Br) . TI Pb-Free products are suitable for use in specified lead-free processes. and peak solder temperature. Samples may or may not be available.please check http://www. and a lifetime-buy period is in effect.1% by weight in homogeneous material) (3) MSL.

TI bases its knowledge and belief on information provided by third parties.ti.PACKAGE OPTION ADDENDUM www. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.com 24-Jan-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. Addendum-Page 4 . TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI and TI suppliers consider certain information to be proprietary. and thus CAS numbers and other limited information may not be available for release.

4 12.0 Q2 Q2 Q2 Q1 OPA2277AIDRMT OPA277AIDRMR OPA277AIDRMT OPA4277UA/2K5 250 3000 250 2500 Pack Materials-Page 1 .0 330.15 1.25 6.0 12.4 4.15 2.0 8.0 8.0 K0 (mm) 1.25 4.25 4.0 16.0 330.PACKAGE MATERIALS INFORMATION www.1 P1 (mm) 8.0 W Pin1 (mm) Quadrant 12.25 4.ti.15 1.0 180.0 8.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing VSON VSON VSON SOIC DRM DRM DRM D 8 8 8 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.5 B0 (mm) 4.0 12.4 12.25 9.4 16.25 4.0 12.

0 Height (mm) 35.0 35.0 Width (mm) 185.0 185.0 367.0 35.0 367.0 Pack Materials-Page 2 .PACKAGE MATERIALS INFORMATION www.0 210.com 8-Apr-2013 *All dimensions are nominal Device OPA2277AIDRMT OPA277AIDRMR OPA277AIDRMT OPA4277UA/2K5 Package Type VSON VSON VSON SOIC Package Drawing DRM DRM DRM D Pins 8 8 8 14 SPQ 250 3000 250 2500 Length (mm) 210.ti.0 367.0 38.0 367.

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