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HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

PRODUCT HE910 (*) HE910-GA HE910-D HE910-EUR HE910-EUD HE910-EUG HE910-NAR HE910-NAD HE910-NAG

(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG

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HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

DISCLAIMER

The information contained in this document is the proprietary information of Telit Communications S.p.A. and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior written consent of Telit, is strictly prohibited. Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the foregoing, Telit does not make any warranty as to the information contained herein, and does not accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information. Telit disclaims any and all responsibility for the application of the devices characterized in this document, and notes that the application of the device must comply with the safety standards of the applicable country, and where applicable, with the relevant wiring rules. Telit reserves the right to make modifications, additions and deletions to this document due to typographical errors, inaccurate information, or improvements to programs and/or equipment at any time and without notice. Such changes will, nevertheless be incorporated into new editions of this application note. All rights reserved. © 2011, 2012 Telit Communications S.p.A.

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HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

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INTRODUCTION ......................................................................................................................................................... 7 1.1 SCOPE ................................................................................................................................................................................ 7 1.2 AUDIENCE ........................................................................................................................................................................... 7 1.3 CONTACT INFORMATION, SUPPORT .......................................................................................................................................... 7 1.4 DOCUMENT ORGANIZATION ................................................................................................................................................... 8 1.5 TEXT CONVENTIONS .............................................................................................................................................................. 9 1.6 RELATED DOCUMENTS........................................................................................................................................................... 9 1.7 DOCUMENT HISTORY .......................................................................................................................................................... 10

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OVERVIEW .............................................................................................................................................................. 11 HE910 MODULE CONNECTIONS ............................................................................................................................... 12 3.1 PIN-OUT ......................................................................................................................................................................... 12 3.1.1 LGA Pads Layout (HE910 and HE910-GA) .............................................................................................................. 18 3.1.2 LGA Pads Layout (HE910-D) ................................................................................................................................... 19 3.1.3 LGA Pads Layout (HE910-EUx and HE910-NAx) ..................................................................................................... 20 3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG) .................................................................................................... 21

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HARDWARE COMMANDS ........................................................................................................................................ 22 4.1 TURNING ON THE HE910 ................................................................................................................................................... 22 4.2 TURNING OFF THE HE910 .................................................................................................................................................. 27 4.3 HE910 UNCONDITIONAL SHUTDOWN .................................................................................................................................... 29

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POWER SUPPLY ....................................................................................................................................................... 32 5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................ 32 5.2 POWER CONSUMPTION ....................................................................................................................................................... 33 5.3 GENERAL DESIGN RULES ...................................................................................................................................................... 34 5.3.1 Electrical Design Guidelines ................................................................................................................................... 34 5.3.2 Thermal Design Guidelines ..................................................................................................................................... 38 5.3.3 Power Supply PCB layout Guidelines ...................................................................................................................... 39

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GSM/WCDMA RADIO SECTION ............................................................................................................................... 40 6.1 HE910 PRODUCT VARIANTS ................................................................................................................................................ 40 6.2 TX OUTPUT POWER ............................................................................................................................................................ 40 6.3 SENSITIVITY ....................................................................................................................................................................... 41 6.4 GSM/WCDMA ANTENNA REQUIREMENTS ............................................................................................................................ 41 6.5 GSM/WCDMA - PCB LINE GUIDELINES ................................................................................................................................ 42 6.6 GSM/WCDMA ANTENNA - INSTALLATION GUIDELINES ........................................................................................................... 43 6.7 ANTENNA DIVERSITY REQUIREMENTS ..................................................................................................................................... 44

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GPS RECEIVER .......................................................................................................................................................... 45 7.1 GPS PERFORMANCES .......................................................................................................................................................... 45 7.2 GPS SIGNALS PINOUT ......................................................................................................................................................... 46 7.3 RF FRONT END DESIGN ....................................................................................................................................................... 46 7.3.1 RF Signal Requirements .......................................................................................................................................... 46 7.3.2 GPS Antenna Polarization ...................................................................................................................................... 47 7.3.3 GPS Antenna Gain .................................................................................................................................................. 48

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..............1................................................... 50 7...... 48 7.......................................................................................0 HS ...............................................................................................All Rights Reserved page 5 of 88 ......1 GPIO LOGIC LEVELS .......................................................................................3.............................................7 Implications of the Pre-select SAW Filter ..................................................................................................................................................................................................................................................................................................................................... 69 13...............3 USING A GPIO PAD AS OUTPUT ......8 ADC CONVERTER ............................................................. 51 7........................................................................................................ 70 14 MOUNTING THE HE910 ON THE APPLICATION ............................ 64 12...............6 EXTERNAL SIM HOLDER IMPLEMENTATION ....4 INDICATION OF NETWORK SERVICE AVAILABILITY ............................................................................................2 Using ADC Converter ................................................................................ 56 10................... 71 14........ 71 14......PCB Line Guidelines ........................................................................................... 66 13.A......................................................11 Shielding ... 57 11 SERIAL PORTS ...........................................................................................1 ELECTRICAL CHARACTERISTICS ................................................................................6 RF Trace Losses................................................... 75 14.......................................................................................................5 GPS Antenna ...........................................................................3........................................................................ 77 14................................................... 69 13.................................................... 55 10 SPI PORT ........................................................................................................................................................ 67 13.....................................................................................3 RECOMMENDED FOOT PRINT FOR THE APPLICATION ......................................3...................... 58 11...............................................................1 CODEC Examples ..............................................................................................................................................................................................4 Active versus Passive Antenna ........... 70 13............................................................................................................................................... 73 14................ 65 13.....................................................HE910 Hardware User Guide 1vv0300925 Rev.............................................. 59 11................................................................... 54 9 USB PORT ............................................................ 52 8 LOGIC LEVEL SPECIFICATIONS .......................................1 HE910 Solder reflow ......................................................................................3.....................................................3.................................. 64 12......................................10 External LNA Enable .............3......... 67 13....................p.......................... 69 13..............................7 VAUX POWER OUTPUT........ 70 13.................................................................................................................................................1 SPI CONNECTIONS ......12 GPS Antenna ..................................................................................19 – 26-06-2012 7....................................... 74 14........................................................................................................ 62 12 AUDIO SECTION OVERVIEW ...............................................9 Powering the External LNA (active antenna) ........................................................................................................................................................................................................................................................ 55 9................... 61 11......4 STENCIL ....................................................................................................3.................................................................8............................................................................................................................5 RTC BYPASS OUT ..................................................................................................................................................................................................................................................................................................................................................................................................... 50 7.....................................................1 Description ......7 SOLDER PASTE .........................................3.................................................1 UNCONDITIONAL SHUTDOWN .............................................................................................................................................................................................................................. 77 Reproduction forbidden without Telit Communications S.....7......................................................................... 50 7.................................................6 PCB PAD DIMENSIONS ...............................1 USB 2......................3 RS232 LEVEL TRANSLATION......................................................... 49 7...2 MODULE FINISHING & DIMENSIONS .............2 USING A GPIO PAD AS INPUT ....................................3................................................................5 PCB PAD DESIGN .............................................................. written authorization ............................Installation .............1 MODEM SERIAL PORT 1 (USIF0) .................... 49 7.................... 53 8...................................................2 MODEM SERIAL PORT 2 (USIF1) ....................................................... 64 13 GENERAL PURPOSE I/O ................................ 71 14.............................................................................................................................................................................8 External LNA Gain and Noise Figure... 52 7......................................... 74 14....................................................................................................................1 GENERAL ...............8....................................... 68 13....................................

... 83 16.......................................1 1999/5/EC DIRECTIVE ........................................................................................................................................... written authorization .......HE910 Hardware User Guide 1vv0300925 Rev......................................................................................................... 82 CONFORMITY ASSESSMENT ISSUES .........................................................................................8 PACKING SYSTEM ..............................9 MOISTURE SENSITIVITY ........................................... 87 Reproduction forbidden without Telit Communications S...................2 FCC/IC REGULATORY NOTICES ............ 79 14...................................................................A.......................All Rights Reserved page 6 of 88 ........................................... 83 16........................................................................................................................................p..........19 – 26-06-2012 14............................................................. 81 15 16 SAFETY RECOMMANDATIONS ...............................

written authorization . use: http://www. Keep us informed of your comments and suggestions for improvements. technical support. Telit appreciates feedback from the users of our information.php For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit: http://www.All Rights Reserved page 7 of 88 . to report documentation errors and to order manuals.com Alternatively.19 – 26-06-2012 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. Our aim is to make this guide as helpful as possible.com/en/products/technical-support-center/contact.telit.A.com TS-APAC@telit.com TS-NORTHAMERICA@telit. about to implement their applications using our HE910 modules. This document is intended for Telit customers.telit. Reproduction forbidden without Telit Communications S.com TS-LATINAMERICA@telit.HE910 Hardware User Guide 1vv0300925 Rev.p. who are integrators.com To register for product news and announcements or for product questions con tact Telit’s Technical Support Center (TTSC). For general contact. contact Telit’s Technical Support Center (TTSC) at: TS-EMEA@telit.

Reproduction forbidden without Telit Communications S. Chapter 13: “General Purpose I/O” How the general purpose I/O pads can be configured.All Rights Reserved page 8 of 88 . target audience. Chapter 14: “Mounting the HE910 on the application board” Mechanical dimensions and recommendations on how to mount the module on the user’s board. Chapter 2: “Overview” provides an overview of the document. contact and support information. Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout.A. and text conventions.19 – 26-06-2012 This document contains the following chapters: Chapter 1: “Introduction” provides a scope for this document.HE910 Hardware User Guide 1vv0300925 Rev.p. Chapter 5: “Power supply” Power supply requirements and general design rules. written authorization . Chapter 15: “Safety Recommendations” Information related to the Safety topics. Chapter 16: “Conformity Assessment Issues” Information related to the Conformity Assessments. Chapter 4: “Hardware Commands” How to operate on the module via hardware. Chapter 9: “USB Port” The USB port on the Telit HE910 is the core of the interface between the module and OEM hardware Chapter 10: “SPI port” Refers to the SPI port of the Telit HE910 Chapter 11: “Serial ports” Refers to the serial ports of the Telit HE910 Chapter 12: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the HE910 Telit Modules. Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic levels for this module. Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the most important parts in the full product design. Chapter 7: “GPS Receiver” This section describes the GPS receiver.

if these points are not followed.HE910 Hardware User Guide 1vv0300925 Rev.e. All dates are in ISO 8601 format. HE910 Digital Voice Interface Application Note HE910 SPI Port Application Note HE910 Product description SIM Holder Design Guides AT Commands Reference Guide Telit EVK2 User Guide 80000NT10050A 80000NT10053A 80378ST10085a 80000NT10001a 80378ST10091A 1vv0300704 Reproduction forbidden without Telit Communications S.19 – 26-06-2012 Danger – This information MUST be followed or catastrophic equipment failure or bodily injury may occur.A. Caution or Warning – Alerts the user to important points about integrating the module. written authorization . the module and end user equipment may fail or malfunction. YYYY-MM-DD.All Rights Reserved page 9 of 88 .p. Tip or Information – Provides advice and suggestions that may be useful when integrating the module. i.

2.2. 14. chapter 4.1 updated Chapter 4.9 Added HE910-EU and NA products Updated paragraph 14.9 Added EUR. Updated par 14.A.8) Added HE910-GA and –D. NAD .8 Pin R13 renamed as HW_SHUTDOWN*. NAR.1. NAD Updated RTT&E info on HE910-NAG. 7.3 Updated Chapter 16. updated Chapter 13 and 14. NAR. A9. updated par 3.HE910 Hardware User Guide 1vv0300925 Rev. Chapter 2.2 removed (now only 1.7.1 and 14. par 4. added Conformity assessment chapter Chapter 5.1 Updated audio.p. D14. updated par 3.1. added Sensitivity and TX Power Class specifications. NAR. 3.2 updated Added ADC in pinout description.2 Reproduction forbidden without Telit Communications S. EUD.3 V par 4.4.3.8/1.3.1.1. Updated SPI pinout Pads A8. 5. on_off/reset and digital sections Added STAT_LED info. written authorization .3 renamed as “unconditional shutdown” USIF0 USIF1 names added to Main and AUX serial ports Updated IO logic levels Updated module’s mechanical drawing IO levels selection 1. Pin P11 now reserved. NAD variants.2. added GPS specification.19 – 26-06-2012 Revision ISSUE#0 ISSUE#1 ISSUE#2 ISSUE#3 ISSUE#4 ISSUE#5 ISSUE#6 Da t e 2011-03-31 2011-05-19 2011-05-25 2011-07-25 2011-07-29 2011-10-18 2011-12-22 2012-01-16 2012-02-03 2012-02-07 2012-03-16 2012-03-26 2012-03-27 2012-03-28 2012-05-08 2012-05-30 2012-06-06 2012-06-14 2012-06-15 2012-06-26 ISSUE#7 ISSUE#8 ISSUE#9 ISSUE#10 ISSUE#11 ISSUE#12 ISSUE#13 ISSUE#14 ISSUE#15 ISSUE#16 ISSUE#17 ISSUE#18 ISSUE#19 Changes Preliminary Version Updated pinout on UART1 Update chapter 13 Added DVI app note references.All Rights Reserved page 10 of 88 . A14 now reserved Power supply extended to 3. Pin P11 renamed Updated RTT&E info on HE910-NAG.

NOTICE: (EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall be done according to the design rules described in this manual. (SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati projektna navodila. (HE) HE910 The information presented in this document is believed to be accurate and reliable. (SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los cuales ha sido deseñado descritos en este manual del usuario.A. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. For further hardware details that may not be explained in this document refer to the Telit HE910 Product Description document where all the hardware information is reported.p. However.HE910 Hardware User Guide 1vv0300925 Rev. In this document all the basic functions of a mobile phone will be taken into account. Reproduction forbidden without Telit Communications S. opisana v tem priročniku. for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. (IT) L’integrazione del modulo cellulare GSM/GPRS /WCDMA HE910 all’interno dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.p.A. instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit HE910 module.p.19 – 26-06-2012 The aim of this document is the description of some hardware solutions useful for developing a product with the Telit HE910 module. nor any infringement of patents or other rights of third parties which may result from its use. This document is subject to change without notice. while the suggested hardware configurations shall not be considered mandatory. (FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur sera faite selon les règles de conception décrites dans ce manuel. written authorization . No license is granted by implication or otherwise under any patent rights of Telit Communications S. other than for circuitry embodied in Telit products. no responsibility is assumed by Telit Communications S. The wrong solutions to be avoided shall be considered as mandatory. for its use. (DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.All Rights Reserved page 11 of 88 .A.

8 1.8V CMOS 1.8V CMOS 1.A.8V CMOS 1. Serial data input from DTE Serial data output to DTE Input for (DTR) from DTE Input for Request to send signal (RTS) from DTE Output for Clear to Send signal (CTS) to DTE Output for (DCD) to DTE Output for (DSR) to DTE Output for Ring (RI) to DTE Auxiliary UART (TX Data to DTE) Auxiliary UART (RX Data from DTE) VDD_IO1 Input 1V8 SEL for VDD_IO1 CMOS 1.8 / 3V Digital Voice Interface (DVI) B9 B6 B7 B8 SPI D15 SPI_MOSI I SPI MOSI CMOS 1.19 – 26-06-2012 PAD Signal I/O Function Type COMMENT USB HS 2.All Rights Reserved page 12 of 88 .8 / 3V 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V To be connected to E13 To be connected to D13 Asynchronous Serial Port (USIF0) .8V CMOS 1.p.8V Shared with TX_AUX DVI_WA0 DVI_RX DVI_TX DVI_CLK I/O I/O I/O I/O CMOS 1. written authorization .8 / 3V 1.Prog.8 / 3V CMOS 1.0 COMMUNICATION PORT B15 C15 A13 USB_D+ USB_DVUSB I/O I/O I USB differential Data (+) USB differential Data (-) Power sense for the internal USB transceiver.8V CMOS 1.8V Reproduction forbidden without Telit Communications S.8V CMOS 1.8V CMOS 1.HE910 Hardware User Guide 1vv0300925 Rev.8V CMOS 1. / Data + HW Flow Control N15 M15 M14 L14 P15 N14 P14 R14 D15 E15 D13 E13 C103/TXD C104/RXD C108/DTR C105/RTS C106/CTS C109/DCD C107/DSR C125/RING TX_AUX RX_AUX VDD_IO1 1V8_SEL I O I I O O O O O I I O Asynchronous Auxiliary Serial Port (USIF1) SIM card interface A6 A7 A5 A4 A3 SIMCLK SIMRST SIMIO SIMIN SIMVCC O O I/O I External SIM signal – Clock External SIM signal – Reset External SIM signal – Data I/O External SIM signal – Presence (active low) External SIM signal – Power supply for the SIM Digital Audio Interface (WA0) Digital Audio Interface (RX) Digital Audio Interface (TX) Digital Audio Interface (CLK) 1.

19 – 26-06-2012 E15 F15 H15 J15 DIGITAL IO C8 C9 C10 C11 B14 C12 C13 K15 L15 G15 ADC B1 RF SECTION K1 F1 ANTENNA ANT_DIV I/O I GSM/EDGE/UMTS Antenna (50 ohm) Antenna Diversity Input (50 ohm) GPS Antenna (50 ohm) Output enable for External LNA supply HW Unconditional Shutdown Input command for power ON VRTC Backup capacitor Supply Output for external accessories / Power ON Monitor RF RF See NOTE 1 ADC_IN1 AI Analog / Digital converter input A/D Accepted values 0 to 1.8V Alternate Function STAT LED SPI_MISO SPI_CLK SPI_MRDY SPI_SRDY O I I O SPI_MISO SPI Clock SPI_MRDY SPI_SRDY CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V CMOS 1.8V Shared with RX_AUX GPS SECTION (see NOTE1) R9 R7 ANT_GPS GPS_LNA_EN I O RF CMOS 1.8V Active low Active low backup for the embedded RTC supply Reproduction forbidden without Telit Communications S.8V CMOS 1.8V CMOS 1.8V CMOS 1.All Rights Reserved page 13 of 88 .8V Miscellaneous Functions R13 R12 C14 R11 Power Supply M1 M2 N1 N2 P1 P2 E1 G1 H1 VBATT VBATT VBATT_PA VBATT_PA VBATT_PA VBATT_PA GND GND GND Main power supply (Baseband) Main power supply (Baseband) Main power supply (Radio PA) Main power supply (Radio PA) Main power supply (Radio PA) Main power supply (Radio PA) Ground Ground Ground Power Power Power Power Power Power Power Power Power HW_SHUTDOWN* ON_OFF* VRTC VAUX/PWRMON I I I O CMOS 1.p.8V CMOS 1.8V CMOS 1.8V Power 1. written authorization .2V DC GPIO_01 GPIO_02 GPIO_03 GPIO_04 GPIO_05 GPIO_06 GPIO_07 GPIO_08 GPIO_09 GPIO_10 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GPIO_01 /STAT LED GPIO_02 GPIO_03 GPIO_04 GPIO_05 GPIO_06 GPIO_07 GPIO_08 GPIO_09 GPIO_10 CMOS 1.A.8V CMOS 1.HE910 Hardware User Guide 1vv0300925 Rev.8V CMOS 1.

p. written authorization .A.All Rights Reserved page 14 of 88 .HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 J1 L1 A2 E2 F2 G2 H2 J2 K2 L2 R2 M3 N3 P3 R3 D4 M4 N4 P4 R4 N5 P5 R5 N6 P6 R6 P8 R8 P9 P10 R10 M12 B13 P13 E14 RESERVED C1 D1 B2 C2 D2 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Power Reproduction forbidden without Telit Communications S.

19 – 26-06-2012 B3 C3 D3 E3 F3 G3 H3 J3 K3 L3 B4 C4 B5 C5 C6 C7 N7 P7 N8 N9 A10 N10 N11 P11 B12 D12 N12 P12 F14 G14 H14 J14 K14 N13 L13 J13 M13 K13 H13 G13 F13 A11 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED Reproduction forbidden without Telit Communications S.All Rights Reserved page 15 of 88 .p. written authorization .HE910 Hardware User Guide 1vv0300925 Rev.A.

R7. R7. written authorization . R9 Reserved Pads:. R9 Reserved Pads: F1 Reserved Pads: F1.All Rights Reserved page 16 of 88 . R7. R9 Reserved Pads: F1 (*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG Reproduction forbidden without Telit Communications S.p.F1.A. NOTE 1: The following table is listing the main Pinout differences between the HE910 variants Product HE910 (*) HE910-D HE910-GA HE910-EUR HE910-EUD HE910-EUG HE910-NAR HE910-NAD HE910-NAG GPS YES NO YES NO NO YES NO NO YES Antenna Diversity YES YES YES NO NO NO NO NO NO Notes Reserved Pads: R7.F1. R9 Reserved Pads:.19 – 26-06-2012 A12 B11 B10 A9 A8 D14 A14 P11 RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED WARNING: Reserved pins must not be connected.HE910 Hardware User Guide 1vv0300925 Rev. R9 Reserved Pads: F1. R7.

M4.R10.P1.L2.G1.P2 E1.E2.P4.M2.K2.H2.P9.N3.J1.P8.R5. The only exceptions are the following pins: PAD M1.D4. almost all pins should be left disconnected. J2.N2.N6.P6.B13.P10.HE910 Hardware User Guide 1vv0300925 Rev.R3.P5.M3.P13.p.F2. R8. written authorization .M12.A.All Rights Reserved page 17 of 88 .L1.E14 R12 R13 B15 C15 A13 N15 M15 L14 P15 D15 E15 D13 E13 K1 F1 R9 signal VBATT & VBATT_PA GND ON/OFF* HW_SHUTDOWN* USB_D+ USB_DVUSB C103/TXD C104/RXD C105/RTS C106/CTS TXD_AUX RXD_AUX VDD_IO1 1V8_SEL MAIN ANTENNA ANT_DIV (if supported by the product) ANT_GPS (if supported by the product) RTS pin should be connected to the GND (on the module side) if flow control is not used.19 – 26-06-2012 If not used. N4.R2. Reproduction forbidden without Telit Communications S.G2. The above pins are also necessary to debug the application when the module is assembled on it.R6.A2.P3.N5.R4.N1.H1.

19 – 26-06-2012 A B C D E F G H J K L M N P R 1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_ PA VBATT_ PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_ PA VBATT_ PA GND 3 SIMVC C RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRS T DVI_TX RES RES RES GPS_LN A_EN 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA 0 GPIO_02 RES GND ANT_GP S 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/P WRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF * 13 VUSB GND GPIO_07 VDD_IO 1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH UTDOW N* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT S C108/DT R C109/DC D C107/DS R C125/RI NG 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR DY SPI_SR DY GPIO_08 GPIO_09 C104/RX D C103/TX D C106/CT S NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application. Reproduction forbidden without Telit Communications S.p.All Rights Reserved page 18 of 88 .A.HE910 Hardware User Guide 1vv0300925 Rev. written authorization . HE910 is the “type name” of the products marketed as HE910 -G & HE910-DG.

HE910 Hardware User Guide 1vv0300925 Rev. written authorization .All Rights Reserved page 19 of 88 .A.p.19 – 26-06-2012 A B C D E F G H J K L M N P R 1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_ PA VBATT_ PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_ PA VBATT_ PA GND 3 SIMVC C RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRS T DVI_TX RES RES RES RES 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA 0 GPIO_02 RES GND RES 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/P WRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF * 13 VUSB GND GPIO_07 VDD_IO 1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH UTDOW N* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT S C108/DT R C109/DC D C107/DS R C125/RI NG 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR DY SPI_SR DY GPIO_08 GPIO_09 C104/RX D C103/TX D C106/CT S NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application. Reproduction forbidden without Telit Communications S.

Reproduction forbidden without Telit Communications S.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 A B C D E F G H J K L M N P R 1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_ PA VBATT_ PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_ PA VBATT_ PA GND 3 SIMVC C RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRS T DVI_TX RES RES RES RES 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA 0 GPIO_02 RES GND RES 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/P WRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF * 13 VUSB GND GPIO_07 VDD_IO 1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH UTDOW N* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT S C108/DT R C109/DC D C107/DS R C125/RI NG 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR DY SPI_SR DY GPIO_08 GPIO_09 C104/RX D C103/TX D C106/CT S NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.A.p. written authorization .All Rights Reserved page 20 of 88 .

All Rights Reserved page 21 of 88 . Reproduction forbidden without Telit Communications S.19 – 26-06-2012 A B C D E F G H J K L M N P R 1 ADC_IN1 RES RES GND RES GND GND GND ANT GND VBATT VBATT_ PA VBATT_ PA 2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_ PA VBATT_ PA GND 3 SIMVC C RES RES RES RES RES RES RES RES RES RES GND GND GND GND 4 SIMIN RES RES GND GND GND GND GND 5 SIMIO RES RES GND GND GND 6 SIMCLK DVI_RX RES GND GND GND 7 SIMRS T DVI_TX RES RES RES GPS_LN A_EN 8 RES DVI_CLK GPIO_01 RES GND GND 9 RES DVI_WA 0 GPIO_02 RES GND ANT_GP S 10 RES RES GPIO_03 RES GND GND 11 RES RES GPIO_04 RES RES VAUX/P WRMON 12 RES RES GPIO_06 RES GND RES RES ON_OFF * 13 VUSB GND GPIO_07 VDD_IO 1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH UTDOW N* 14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT S C108/DT R C109/DC D C107/DS R C125/RI NG 15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR DY SPI_SR DY GPIO_08 GPIO_09 C104/RX D C103/TX D C106/CT S NOTE: The pin defined as RES has to be considered RESERVED and not connected on any pin in the application.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .A.p.

19 – 26-06-2012 To turn on the HE910 the pad ON_OFF* must be tied low for at least 5 seconds and then released. The maximum current that can be drained from the ON_OFF* pad is 0. written authorization . The line ON_OFF* must be connected only in open collector or open drain configuration.1 mA.p. Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper power on/off of the module.HE910 Hardware User Guide 1vv0300925 Rev. A simple circuit to do it is: NOTE: Don't use any pull up resistor on the ON_OFF* line. Reproduction forbidden without Telit Communications S. it is internally pulled up.All Rights Reserved page 22 of 88 .A.

the hardware line PWRMON should be monitored. written authorization . TIP: To check if the device has powered on.p.HE910 Hardware User Guide 1vv0300925 Rev. hence have active low signals are labelled with a name that ends with”#". NOTE: It is mandatory to avoid sending data to the serial ports during the first 200ms of the module start-up.All Rights Reserved page 23 of 88 .A.”*” or with a bar over the name. Reproduction forbidden without Telit Communications S.19 – 26-06-2012 NOTE: In this document all the lines that are inverted.

written authorization .A.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 A flow chart showing the proper turn on procedure is displayed below: Modem ON Proc. Y PWMON = ON? N Enter AT<CR> ON_OFF = LOW Y AT answer in 1Sec ? AT init sequence. DELAY= 300mSec Delay = 5 Sec ON_OFF = HIGH N N PWMON = ON? HW unconditional SHUTDOWN Y Delay 1s Start AT CMD. Reproduction forbidden without Telit Communications S.p.All Rights Reserved page 24 of 88 . NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.

19 – 26-06-2012 A flow chart showing the AT command managing procedure is displayed below: Start AT CMD. Modem ON Proc.p.A.All Rights Reserved page 25 of 88 . DELAY= 300mSec Enter AT<CR> Y AT answer in 1Sec ? N HW unconditional SHUTDOWN AT init sequence.HE910 Hardware User Guide 1vv0300925 Rev. written authorization . Reproduction forbidden without Telit Communications S.

A.Let's assume you need to drive the ON_OFF* pad directly with an ON/OFF button: Reproduction forbidden without Telit Communications S.19 – 26-06-2012 For example: 1.HE910 Hardware User Guide 1vv0300925 Rev.p. written authorization .Let's assume you need to drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT1): 2.All Rights Reserved page 26 of 88 .

p. To turn OFF the HE910 the pad ON_OFF* must be tied low for at least 3 seconds and then released. the device issues a detach request to network informing that the device will not be reachable any more.A.All Rights Reserved page 27 of 88 . TIP: To check if the device has been powered off.19 – 26-06-2012 Turning off of the device can be done in two ways: via AT command (see HE910 Software User Guide. Reproduction forbidden without Telit Communications S. AT#SHDN) by tying low pin ON_OFF* Either ways. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. written authorization . the hardware line PWRMON must be monitored.HE910 Hardware User Guide 1vv0300925 Rev. The device is powered off when PWRMON goes low.

p.All Rights Reserved page 28 of 88 . Y Delay 15s Y PWMON = ON? HW unconditional SHUTDOWN N Reproduction forbidden without Telit Communications S. N PWMON = ON? Y ON_OFF = LOW Delay = 3 Sec ON_OFF = HIGH N PWMON = ON? Modem ON Proc.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .19 – 26-06-2012 The following flow chart shows the proper turn off procedure: Modem OFF Proc.A.

The module will shutdown. The HW_SHUTDOWN* is generating an unconditional shutdown of the module without an automatic restart.All Rights Reserved page 29 of 88 . To proper power on again the module please refer to the related paragraph (“Powering ON the HE910”) TIP: The unconditional hardware shutdown must always be implemented on the boards and should be used only as an emergency exit procedure. The line HW_SHUTDOWN* must be connected only in open collector configuration.A. It shall be kept as an emergency exit procedure. the pad HW_SHUTDOWN* must be tied low for at least 200 milliseconds and then released.p.HE910 Hardware User Guide 1vv0300925 Rev. To unconditionally shutdown the HE910. NOTE: Do not use any pull up resistor on the HW_SHUTDOWN* line nor any totem pole digital output. WARNING: The hardware unconditional Shutdown must not be used during normal operation of the device since it does not detach the device from the network. written authorization . Reproduction forbidden without Telit Communications S. but will NOT perform the detach from the cellular network.19 – 26-06-2012 The Unconditional Shutdown of the module could be activated using the HW_SHUTDOWN* line (pad R13). Using pull up resistor may bring to latch up problems on the HE910 power regulator and improper functioning of the module.

Reproduction forbidden without Telit Communications S.19 – 26-06-2012 A typical circuit is the following: For example: 1.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .All Rights Reserved page 30 of 88 .Let us assume you need to drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller (uP_OUT2): NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition.A.p.

19 – 26-06-2012 In the following flow chart is detailed the proper restart procedure: HW unconditional SHUTDOWN HW_SHUTDOWN*= LOW = LOW Delay 200ms HW_SHUTDOWN*= HIGH N PWRMON = ON Y Delay 1s Modem ON Proc.All Rights Reserved page 31 of 88 . Reproduction forbidden without Telit Communications S.A.p. Disconnect PWR supply Modem ON Proc. written authorization .HE910 Hardware User Guide 1vv0300925 Rev.

50 V NOTE: The Operating Voltage Range MUST never be exceeded.40 V÷ 4.8 V 3.p. The external power supply must be connected to VBATT & VBATT_PA signals and must fulfil the following requirements: POWER SUPPLY Nominal Supply Voltage Normal Operating Voltage Range Extended Operating Voltage Range 3. The “Extended Operating Voltage Range” can be used only with completely assumption and application of the HW User guide suggestions. written authorization .A. care must be taken when designing the application’s power supply section to avoid having an excessive voltage drop. Reproduction forbidden without Telit Communications S.20 V 3.All Rights Reserved page 32 of 88 .10 V÷ 4.19 – 26-06-2012 The power supply circuitry and board layout are a very important part in the full product design and they strongly reflect on the product overall performances. NOTE: Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage (regarding MIN Extended Operating Voltage) MUST never be exceeded.HE910 Hardware User Guide 1vv0300925 Rev. If the voltage drop is exceeding the limits it could cause a Power Off of the module. hence read carefully the requirements and the guidelines that will follow for a proper design.

2 Mode description Module supplied but Switched Off IDLE mode (WCDMA) Disabled TX and RX. TX = 0dBm) 494 WCDMA data call (Cat 14. NOTE: The electrical design for the Power supply should be made ensuring it will be capable of a peak current output of at least 2 A. then the device may even shutdown as a consequence of the supply voltage drop. this will reflect on all the audio paths producing an audible annoying noise at 216 Hz. TX = 22dBm) Operative mode (EDGE) 495 484 EDGE Sending data mode Operative mode (GSM) 220 167 580 438 GSM VOICE CALL GPRS Sending data mode The GSM system is made in a way that the RF transmission is not continuous.5 Disabled TX and RX.All Rights Reserved page 33 of 88 . module is not registered on the network 0. if the voltage drop during the peak current absorption is too much. Therefore the power supply has to be designed in order to withstand with these current peaks without big voltage drops.1mA in case of DRX5) Operative mode (WCDMA) 152 WCDMA voice call (TX = 10dBm) 187 WCDMA data call (Cat 14.p. this means that both the electrical design and the board layout must be designed for this current flow. and the relative current peaks can be as high as about 2A. If the layout of the PCB is not well designed a strong noise floor is generated on the ground and the supply. else it is packed into bursts at a base frequency of about 216 Hz.19 – 26-06-2012 HE910 Mode SWITCHED OFF Switched Off AT+CFUN=5 AT+CFUN=1 AT+CFUN=4 AT+CFUN=5 WCDMA Voice WCDMA HSDPA (0dBm) WCDMA HSDPA (22dBm) EDGE 4TX+2RX GSM900 PL5 DCS1800 PL0 CSD TX and RX mode GSM900 CSD PL5 DCS1800 CSD PL0 GPRS 4TX+2RX GSM900 PL5 DCS1800 PL0 Average (mA) 40uA 1. written authorization .8 Disabled TX and RX. Reproduction forbidden without Telit Communications S.HE910 Hardware User Guide 1vv0300925 Rev. DRX7 IDLE mode (GSM/EDGE) 19 Normal mode: full functionality of the module 16.A. DRX9 (1.

The electrical design of the power supply depends strongly from the power source where this power is drained. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks close to the HE910. written authorization .p. A switching power supply will not be suited because of the low drop out requirements.HE910 Hardware User Guide 1vv0300925 Rev. We will distinguish them into three categories: +5V input (typically PC internal regulator output) +12V input (typically automotive) Battery The desired output for the power supply is 3. A protection diode should be inserted close to the power input.A. a proper heat sink shall be provided in order to dissipate the power generated.All Rights Reserved page 34 of 88 . in order to save the HE910 from power polarity inversion. Reproduction forbidden without Telit Communications S. When using a linear regulator. hence there's not a big difference between the input source and the desired output and a linear regulator can be used.8V.19 – 26-06-2012 The principal guidelines for the Power Supply Design embrace three different design steps: the electrical design the thermal design the PCB layout. a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V.

For car PB battery the input voltage can rise up to 15. For Car applications a spike protection diode should be inserted close to the power input. A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks. This allows the regulator to respond quickly to the current peaks absorption. in order to save the HE910 from power polarity inversion. A switching power supply will be preferable because of its better efficiency especially with the 2A peak current load represented by the HE910. Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. a 100μF tantalum capacitor is usually suited.19 – 26-06-2012 An example of linear regulator with 5V input is: The desired output for the power supply is 3. a linear regulator is not suited and shall not be used. in order to clean the supply from spikes. hence due to the big difference between the input source and the desired output. When using a switching regulator.A.p.8V. In any case the frequency and Switching design selection is related to the application to be developed due to the fact the switching frequency could also generate EMC interferences.All Rights Reserved page 35 of 88 . A protection diode should be inserted close to the power input.HE910 Hardware User Guide 1vv0300925 Rev. a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. Reproduction forbidden without Telit Communications S. This can be the same diode as for spike protection.8V and this should be kept in mind when choosing components: all components in the power supply must withstand this voltage. written authorization .

p.19 – 26-06-2012 An example of switching regulator with 12V input is in the below schematic: Reproduction forbidden without Telit Communications S.All Rights Reserved page 36 of 88 . written authorization .A.HE910 Hardware User Guide 1vv0300925 Rev.

HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the power to the Telit HE910 module.

WARNING: The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage for the HE910 and damage it.

NOTE: DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with HE910. Their use can lead to overvoltage on the HE910 and damage it. USE ONLY Li-Ion battery types.

A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the current absorption peaks, a 100μF tantalum capacitor is usually suited. Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V. A protection diode should be inserted close to the power input, in order to save the HE910 from power polarity inversion. Otherwise the battery connector should be done in a way to avoid polarity inversions when connecting the battery. The battery capacity must be at least 500mAh in order to withstand the current peaks of 2A; the suggested capacity is from 500mAh to 1000mAh.

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 37 of 88

HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

The thermal design for the power supply heat sink should be done with the following specifications: Average current consumption during HSDPA transmission @PWR level max : 600 mA Average current during idle: 1.5 mA NOTE: The average consumption during transmissions depends on the power level at which the device is requested to transmit by the network. The average current consumption hence varies significantly.

Considering the very low current during idle, especially if Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs current significantly only during calls. If we assume that the device stays into transmission for short periods of time (let's say few minutes) and then remains for a quite long time in idle (let's say one hour), then the power supply has always the time to cool down between the calls and the heat sink could be smaller than the calculated one for 600mA maximum RMS current, or even could be the simple chip package (no heat sink). Moreover in the average network conditions the device is requested to transmit at a lower power level than the maximum and hence the current consumption will be less than the 600mA, being usually around 150mA. For these reasons the thermal design is rarely a concern and the simple ground plane where the power supply chip is placed can be enough to ensure a good thermal condition and avoid overheating. For the heat generated by the HE910, you can consider it to be during transmission 1W max during CSD/VOICE calls and 2W max during class10 GPRS upload. This generated heat will be mostly conducted to the ground plane under the HE910; you must ensure that your application can dissipate it.

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 38 of 88

HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct working of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. The Bypass low ESR capacitor must be placed close to the Telit HE910 power input pads or in the case the power supply is a switching type it can be placed close to the inductor to cut the ripple provided the PCB trace from the capacitor to the HE910 is wide enough to ensure a dropless connection even during the 2A current peaks. The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this is not made in order to save power loss but especially to avoid the voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply, introducing the noise floor at the burst base frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from the power loss point of view, the same voltage drop may not be acceptable from the noise point of view. If your application doesn't have audio interface but only uses the data feature of the Telit HE910, then this noise is not so disturbing and power supply layout design can be more forgiving. The PCB traces to the HE910 and the Bypass capacitor must be wide enough to ensure no significant voltage drops occur when the 2A current peaks are absorbed. This is for the same reason as previous point. Try to keep this trace as short as possible. The PCB traces connecting the Switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for switching power supply). This is done in order to reduce the radiated field (noise) at the switching frequency (100-500 kHz usually). The use of a good common ground plane is suggested. The placement of the power supply on the board should be done in such a way to guarantee that the high current return paths in the ground plane are not overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier. The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables.

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 39 of 88

HE910 Hardware User Guide
1vv0300925 Rev.19 – 26-06-2012

The following table is listing the main differences between the HE910 variants:
Product HE910 HE910-D HE910-GA HE910-EUR HE910-EUD HE910-EUG HE910-NAR HE910-NAD HE910-NAG Supported 2G Bands GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 GSM 850, GSM 900, DCS1800, PCS 1900 Supported 3G bands FDD B1, B2, B4, B5, B8 FDD B1, B2, B4, B5, B8 FDD B1, B2, B5, B8 FDD B1, B5, B8 FDD B1, B5, B8 FDD B1, B5, B8 FDD B2, B4, B5 FDD B2, B4, B5 FDD B2, B4, B5 Antenna Diversity FDD B1, B2, B5, B8 GSM 850, GSM 900, PCS 1900 FDD B1, B2, B5, B8 GSM 850, GSM 900, PCS 1900 FDD B1, B2, B5, B8 GSM 850, GSM 900, PCS 1900 NO NO NO NO NO NO

Band GSM 850 / 900 DCS1800 / PCS 1900 EDGE, 850/900 MHz EDGE, 1800/1900 MHz WCDMA FDD B1, B2, B4, B5, B8

Power Class 4 (2W) 1 (1W) E2 (0.5W) Class E2 (0.4W) Class 3 (0.25W)

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 40 of 88

the customer shall use the most suitable antenna for that/those band(s) 70 MHz in GSM850. 170 MHz in DCS & 140 MHz PCS band 70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 460 MHz in WCDMA Band IV 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I 50 ohm > 33dBm(2 W) peak power in GSM > 24dBm Average power in WCDMA ≤ 5:1 (limit to avoid permanent damage) ≤ 2:1 (limit to fulfil all regulatory requirements) Frequency range Bandwidth (GSM/EDGE) Bandwidth (WCDMA) Impedance Input power VSWR absolute max VSWR recommended When using the HE910. The antenna and antenna transmission line on PCB for a Telit HE910 device shall fulfil the following requirements: ANTENNA REQUIREMENTS Depending by frequency band(s) provided by the network operator. 80 MHz in GSM900. written authorization .A.01% BER <0.01% BER <0.p.44% BER Class II <2.44% BER <0.5 dBm -111 dBm -110 dBm -111 dBm -111 dBm -110 dBm Note BER Class II <2.01% The antenna connection and board layout design are the most important aspect in the full product design as they strongly affect the product overall performances.All Rights Reserved page 41 of 88 .19 – 26-06-2012 Band GSM 850 GSM 900 DCS1800 PCS 1900 WCDMA FDD B1 WCDMA FDD B2 WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 Typical -109. Reproduction forbidden without Telit Communications S. hence read carefully and follow the requirements and the guidelines for a proper design.01% BER <0.01% BER <0. since there's no antenna connector on the module.5 dBm -109 dBm -110 dBm -109. the antenna must be connected to the HE910 antenna pad (K1) by means of a transmission line implemented on the PCB.HE910 Hardware User Guide 1vv0300925 Rev.44% BER Class II <2.44% BER Class II <2.

constant cross section.A. Reproduction forbidden without Telit Communications S. Stripline.) can be used for implementing the printed transmission line afferent the antenna. if possible. Keep line on the PCB as short as possible.p. that plane has to be continuous and sufficiently extended. It is wise to surround (on both sides) the PCB transmission line with Ground.19 – 26-06-2012 In the case the antenna is not directly connected at the antenna pad of the HE910. so the geometry can be as similar as possible to the related canonical model. Keep. If possible. at least one layer of the PCB used only for the Ground plane. In order to re-use the Telit FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. since the antenna line loss shall be less than around 0. Coplanar. If antenna is installed with a separation distance of less than 20 cm from all persons or is co-located or operating in conjunction with any other antenna or transmitter then additional FCC/IC testing may be required..All Rights Reserved page 42 of 88 . it shall comply with the FCC and/or IC approval requirements: This device is to be used only for mobile and fixed application. This transmission line shall fulfil the following requirements: ANTENNA LINE ON PCB REQUIREMENTS Characteristic Impedance 50 ohm Max Attenuation 0.3 dB.. avoid having other signal tracks facing directly the antenna line track.3 dB Coupling with other signals shall be avoided Cold End (Ground Plane) of antenna shall be equipotential to the HE910 ground pins Furthermore if the device is developed for the US market and/or Canada market. If a Ground plane is required in line geometry. Line geometry should have uniform characteristics. then a PCB line is needed in order to connect with it or with its connector. Any kind of suitable geometry / structure (Microstrip. use this layer as reference Ground plane for the transmission line. avoid meanders and abrupt curves.HE910 Hardware User Guide 1vv0300925 Rev. written authorization . Make sure that the transmission line’s characteristic impedance is 50ohm . Antennas used for this OEM module must not exceed the gains for mobile and fixed operating configurations as described in “FCC/IC Regulatory notices” chapter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Grounded Coplanar Waveguide.

or shield it with a metal frame cover. Keep the antenna line far away from the HE910 power supply lines. such as fast switching ICs.p. the use of geometries like Microstrip or Grounded Coplanar Waveguide has to be preferred. If the device antenna is located greater then 20cm from the human body and there are no colocated transmitter then the Telit FCC/IC approvals can be re-used by the end product If the device antenna is located less then 20cm from the human body or there are no colocated transmitter then the additional FCC/IC testing may be required for the end product (Telit FCC/IC approvals cannot be reused) Antenna shall not be installed inside metal cases Antenna shall be installed also according Antenna manufacturer instructions. Install the antenna in a place covered by the GSM signal. since they typically ensure less attenuation if compared to a Stripline having same length.19 – 26-06-2012 Avoid crossing any un-shielded transmission line footprint with other signal tracks on different layers.A. If EM noisy devices are present on the PCB hosting the HE910.HE910 Hardware User Guide 1vv0300925 Rev. take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes. If EM noisy devices are not present around the line. The ground surrounding the antenna line on PCB has to be strictly connected to the main Ground Plane by means of via holes (once per 2mm at least). placed close to the ground edges facing line track. Place EM noisy devices as far as possible from HE910 antenna line. written authorization . Reproduction forbidden without Telit Communications S.All Rights Reserved page 43 of 88 .

disable the Diversity functionality using the AT#RXDIV command (ref to the AT User guide for the proper syntax) and leave the pad F1 unconnected. NOTE1: The Diversity is not supported on DCS 1800 in 2G and FDD BAND IV in 3G NOTE: If the RX Diversity is not used/connected. In order to improve Diversity Gain. 80 MHz in GSM900 & 140 MHz PCS band 70 MHz in WCDMA Band V 80 MHz in WCDMA Band VIII 140 MHz in WCDMA Band II 250 MHz in WCDMA Band I 50 ohm Frequency range Bandwidth (GSM/EDGE) Bandwidth (WCDMA) Impedance When using the HE910. since there's no antenna connector on the module. the customer shall use the most suitable antenna for that/those band(s) 70 MHz in GSM850.HE910 Hardware User Guide 1vv0300925 Rev. The second Rx antenna should not be located in the close vicinity of main antenna.p. the two antennas should be located at the maximum reciprocal distance possible. then a PCB line is needed in order to connect with it or with its connector. taking into consideration the available space into the application. Isolation and reduce mutual interaction.19 – 26-06-2012 This product is including an input for a second RX antenna to improve the radio sensitivity. ANTENNA REQUIREMENTS Depending by frequency band(s) provided by the network operator. the antenna must be connected to the HE910 antenna pad (F1) by means of a transmission line implemented on the PCB. Reproduction forbidden without Telit Communications S. The function is called Antenna Diversity. In the case the antenna is not directly connected at the antenna pad of the HE910.A.All Rights Reserved page 44 of 88 . written authorization .

A.7 mA @3. Fast Acquisition giving rapid Time-to-First-Fix (TTFF) Capability to monitor up to 28 channels Stand Alone and Assisted mode Integrated LNA The following Table is listing the main characteristics: Characteristic GPS RX Sensitivity GPS Cold Start Autonomous GPS Hot Start Autonomous GPS tracking mode GPS Accuracy TTFF from Cold Start TTF from Warm Start TTF from Hot Start Power Consumption in Acquisition Power Consumption in Tracking Power Consumption in Low Power Tracking Typical Values -164dBm -147dBm -161dBm -166 dBm 3m 42 sec 30sec 1.8 sec 46. The following table is listing the HE910 variants that support the GPS receiver: Product HE910 HE910-D HE910-GA HE910-EUR HE910-EUD HE910-EUG HE910-NAR HE910-NAD HE910-NAG GPS Receiver YES NO YES NO NO YES NO NO YES Advanced real time hardware correlation engine for enhanced sensitivity (better than -165 dBm for A-GPS).p.8 mA @3.8V 25.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 The HE910 module is integrating a GPS receiver that could be used in Standalone mode and in A-GPS (assisted GPS). the receiver is capable to achieve sensitivity values of better than -165 dBm as is required for indoor applications.4 mA @3.8V Reproduction forbidden without Telit Communications S.All Rights Reserved page 45 of 88 .8V 37. written authorization . With the help of advanced digital signal processing algorithms and the use of A-GPS data.

download the necessary ephemeris data and compute the location within a 5 minute period. Each GPS satellite presents its own signal to the HE910. then an active antenna (that is. which is why Cold Start acquisition requires a higher signal level than navigation or tracking signal levels. In the GPS signal acquisition process. Reproduction forbidden without Telit Communications S. The HE910 can achieve Cold Start acquisition with a signal level of -147 dBm at its input.HE910 Hardware User Guide 1vv0300925 Rev.A.p. If assistance data in the form of time or ephemeris aiding is available. The GPS signal is relatively immune to rainfall attenuation and does not really need to be considered.19 – 26-06-2012 The Pads related to this function are the following: PAD R9 R7 Signal ANT_GPS GPS_LNA_EN I/O I O Function GPS Antenna (50 ohm) Output enable for External LNA supply Type RF CMOS 1. written authorization . These received signal levels are determined by : GPS satellite transmit power GPS satellite elevation and azimuth Free space path loss Extraneous path loss such as rain Partial or total path blockage such as foliage or building Multipath caused by signal reflection GPS antenna Signal path after the GPS antenna The first three items in the list above are specified in IS-GPS-200E. an antenna with a low noise amplifier built in) can be used. downloading and decoding the data is the most difficult task. and best performance is obtained when the signal levels are between -125 dBm and -117 dBm. autonomous operation is assumed. For the purposes of this discussion. IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to the receiver when using a linearly polarized antenna with 3 dBi gain.8V The HE910 Module contains an integrated LNA and pre-select SAW filter. If the antenna cannot be located near the HE910. readily available multiple sources online. This means the GPS receiver can find the necessary satellites. then even lower signal levels can be used to compute a navigation solution.All Rights Reserved page 46 of 88 . which makes the Cold Start acquisition level the important design constraint. This allows the module to work well with a passive GPS antenna.

The system designer needs to make tradeoffs in their application to determine which is the better choice. then the RHCP antenna would show a higher signal level than a linearly polarized antenna because the interfering signal is rejected.HE910 Hardware User Guide 1vv0300925 Rev. However. plus any thermal coating applied to the vehicle glass can attenuate the GPS signal by as much as 15 dB. It is this phenomena that makes GPS navigation in urban canyons (narrow roads surround by high rise buildings) so challenging. This variable attenuation is highly dependent upon GPS satellite location. both of these factors will affect the performance of the receiver. the reflecting of the GPS signal causes the polarization to reverse. In general. If the multipath signal is attenuating the line of sight signal. Again. Remember that IS-GPS-200E specifies the receive power level with a linearly polarized antenna. which would be rejected by the RHCP antenna by typically 20 dB or so. terrain or other items in the line of sight to the specific GPS satellite. The implications of this are covered in the next section. An RHCP antenna is better at rejecting multipath than a linearly polarized antenna. say at a lower elevation. A linearly polarized antenna will have 3 dB loss as compared to an RHCP antenna assuming the same antenna gain (specified in dBi and dBic respectively).19 – 26-06-2012 However.A. Multipath is a phenomena where the signal from a particular satellite is reflected and is received by the GPS antenna in addition to or in place of the original line of sight signal. The best antenna to receive the GPS signal is a right hand circularly (RHCP) polarized antenna. or if received in place of the original signal add additional error in determining a solution because the distance to the particular GPS satellite is actually longer than expected. etc. the GPS signal is heavily influenced by attenuation due to foliage such as tree canopies. The GPS signal as broadcast is a right hand circularly polarized signal. This is a case where a bad signal may be better than no signal. The metal roof of the vehicle will cause significant blockage. such as in an urban canyon environment. The multipath signal has a path length that is longer than the original line of sight path and can either attenuate the original signal. This is because the reflected signal changes polarization to LHCP. or all in a general direction. in a vehicular application. the GPS antenna may be placed embedded into the dashboard or rear package tray of an automobile. The HE910 reports this geometry in the form of PDOP.All Rights Reserved page 47 of 88 . For example.p. then the number of satellites in view could drop below that needed to determine a 3D solution. HDOP and VDOP. Reproduction forbidden without Telit Communications S. in the case where the multipath signal is replacing the line of sight signal. written authorization . the geometry of the remaining satellites will result is a lower accuracy of position. If enough satellites are blocked.. as well as outright blockage caused by building.

For example. an active antenna has a low noise amplifier (LNA) with associated gain and noise figure. and gain at a fixed elevation as a function of azimuth. Reproduction forbidden without Telit Communications S. or directly overhead) they should supply antenna pattern curves specifying gain as a function of elevation. or both. The active antenna has its own built in low noise amplifier to overcome RF trace or cable losses after the active antenna. if the antenna needs to be located away from the HE910 then an active antenna may be required to obtain the best system performance. This would normally be the lowest cost option and most of the time the simplest to use. Failure to follow these requirements could result in very poor antenna performance. It is important to know both numbers when designing and evaluating the front end of a GPS receiver. a higher gain antenna would improve the gain and improve the performance of the GPS receiver. A smaller 18mm by 18mm square patch on a reference ground plane (usually 50mm by 50mm) will give an antenna gain at zenith of 2 dBic. a post-select filter. An antenna with higher gain will generally outperform an antenna with lower gain. In addition. However. many active antennas have either a pre-select filter.HE910 Hardware User Guide 1vv0300925 Rev. Antenna Y has an antenna gain of -5 dBiC at azimuth and an LNA gain of 30 dB for a combined total of 25 dB. written authorization . but some combine them into a single number. then a passive antenna can be used.All Rights Reserved page 48 of 88 . a good antenna could mean the difference between being able to use a particular satellite signal or not. antenna X has an antenna gain of 5 dBiC at azimuth and an LNA gain of 20 dB for a combined total of 25 dB. While an antenna vendor will specify a nominal antenna gain (usually at zenith. in the system.p.A. Most antenna vendors will specify these numbers separately. Once the signals are above about -130 dBm for a particular satellite.19 – 26-06-2012 Antenna gain is defined as the extra signal power from the antenna as compared to a theoretical isotropic antenna (equally sensitive in all directions). If the GPS antenna is placed near the HE910 and the RF traces losses are not excessive (nominally 1 dB). a 25mm by 25m square patch antenna on a reference ground plane (usually 70mm by 70mm) will give an antenna gain at zenith of 5 dBic. for those satellites that are below about -125 dBm. It is important to note that GPS antenna gain is not the same thing as external LNA gain. However. Pay careful attention to the requirement to meet these specifications. However. In the case of really weak signals. antenna X will outperform antenna Y by about 10 dB (refer to next chapter for more details on system noise floor). no improvement in performance would be gained. such as ground plane required and any external matching components. However. For example.

use a strip-line on the superficial copper layer for the antenna line. constant cross section. Antenna line must have uniform characteristics. Reproduction forbidden without Telit Communications S. The line attenuation will be lower than a buried one. or shield it with a metal frame cover. if possible. Place EM noisy devices as far as possible from HE910 antenna line. A good rule of thumb would be to keep the RF traces as short as possible. such as fast switching ICs. If you have EM noisy devices around the PCB hosting the HE910. Surround (on the sides. avoid having other signal tracks facing directly the antenna line of track. over and under) the antenna line on PCB with Ground. written authorization .p. avoid meanders and abrupt curves. Keep the antenna line far away from the HE910 power supply lines.All Rights Reserved page 49 of 88 .19 – 26-06-2012 Ensure that the antenna line impedance is 50ohm. Keep the antenna line on the PCB as short as possible to reduce the loss. take care of the shielding of the antenna line by burying it inside the layers of PCB and surround it with Ground planes. Keep one layer of the PCB used only for the Ground plane.HE910 Hardware User Guide 1vv0300925 Rev.A. make sure they are 50 ohms impedance and don’t contain any sharp bends. Keep the antenna line far away from the HE910 GSM RF lines. If you do not have EM noisy devices around the PCB of HE910. RF Trace losses are difficult to estimate on a PCB without having the appropriate tables or RF simulation software to estimate what the losses would be. The ground around the antenna line on PCB has to be strictly connected to the Ground Plane by placing vias once per 2mm at least.

This voltage is not supplied by the HE910. The external LNA. the overall gain (including signal losses past the external LNA) should not exceed 14 dB. that is. then a 6 dB Pi or T resistive attenuator is suggested to improve the impedance match between the two components. The external LNA should have a noise figure better than 1 dB.A. which is generally true in band. either a resistive Pi or T attenuator can be inserted after the LNA to bring the gain down to 14 dB . the overall design should be checked for RF stability to prevent the external amplifier from oscillating. These components are typically specified to operate into 50 ohms impedance. written authorization . rather than the relatively broad and flat return loss presented by the LNA. Levels higher than that can affect the jamming detection capability of the HE910. The amplifier needs to stay in the linear region when presented with these other signals. the GPS signal itself would start to be attenuated and the GPS performance would suffer. If a higher gain LNA is used. The external LNA needs a source of power. If an external filter is to be connected directly to the HE910. needs to be able to handle other signals other than the GPS signal.p. Filter devices pass the desired in band signal to the output. This will give an overall system noise figure of around 2 dB assuming the LNA gain is 14 dB. Many of the active antennas accept a 3 volt or 5 volt DC voltage that is impressed upon the RF signal line. if having no pre-select filter. and reject the out of band signal by reflecting it back to the input. resulting in low reflected energy (good return loss). but can be easily supplied by the host design.All Rights Reserved page 50 of 88 . particularly out of band. but would not be true out of band. Amplifiers that are unconditionally stable at the output will be fine to use with the HE910. care needs to be used in making sure neither the external filter nor the internal SAW filter performance is compromised. Because of the internal LNA. These signals are typically at much higher levels. resulting in high reflected energy (bad return loss). If this were to happen. If an external amplifier is to be used with the HE910.HE910 Hardware User Guide 1vv0300925 Rev. The HE910 can be used with an external LNA such as what might be found in an active antenna. the system designer needs to determine all of the unintended signals and their possible levels that can be presented and make sure the external LNA will not be driven into compression. Any circuit connected to the input of the HE910 would see complex impedance presented by the SAW filter. Again. Reproduction forbidden without Telit Communications S. If there is extra gain associated with the external filter. or if higher the low gain mode is automatically managed by the HE910 with its internal AGC.19 – 26-06-2012 The HE910 module contains a SAW filter used in a pre-select configuration with the built-in LNA. the RF input of the HE910 ties directly into the SAW filter.

The signal is set to High only when the GPS receiver is active. In case the Application needs to include an additional LNA stage. The electrical characteristics of the GPS_LNA_EN signal are: Level Output high level Output low level Min 1.6V 0V Max 1.HE910 Hardware User Guide 1vv0300925 Rev. written authorization . the module is provided by a digital signal usable to enable the power supply of the external amplifier. In case this is exceeded.All Rights Reserved page 51 of 88 .2V An example of GPS Antenna Supply circuit is shown in the following image: NOTE: The maximum DC voltage applicable to the ANT_GPS pin is 5V. a series capacitor has to be included in the design to avoid exceeding the maximum input DC level.p.A.19 – 26-06-2012 The HE910 is already provided by an internal LNA.9 0. Reproduction forbidden without Telit Communications S.

p. (In any case the sensitivity could be affected by the building characteristics i. written authorization .e. the most sensitive portion of the RF path.All Rights Reserved page 52 of 88 . The antenna cannot be shielded because then it can’t receive the GPS signals. Antenna must be installed also according to the Antenna manufacturer instructions. There are two solutions.19 – 26-06-2012 Shielding the RF circuitry generally is ineffective because the interference is getting into the GPS antenna itself. Reproduction forbidden without Telit Communications S. one is to move the antenna away from the source of interference or the second is to shield the digital interference to prevent it from getting to the antenna. Antenna must not be installed inside metal cases. The Antenna must not be co-located or operating in conjunction with any other antenna or transmitter.HE910 Hardware User Guide 1vv0300925 Rev.A. The HE910 due to its characteristics of sensitivity is capable to perform a Fix inside the buildings. shielding).

19 – 26-06-2012 The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Input level on any digital pin (CMOS 1.9V 0.All Rights Reserved page 53 of 88 .1V Operating Range .5V 0V 1.8) with respect to ground Min -0.HE910 Hardware User Guide 1vv0300925 Rev.p.Interface levels (1. written authorization .2V Current characteristics (Preliminary values) Level Output Current Input Current Typical 1mA 1uA Reproduction forbidden without Telit Communications S.9 0.3V Max 3.8V CMOS) Level Input high level Input low level Output high level Output low level Min 1.A.35V 1.6V 0V Max 1.

HE910 Hardware User Guide 1vv0300925 Rev. without doing any detach operation from the network where it is registered. It may only be used to reset a device already on that is not responding to any command. This behaviour is not a proper shut down because any GSM device is requested to issue a detach request on turn off. If used.p. NOTE: Do not use this signal to power off the HE910.19 – 26-06-2012 Signal HW_SHUTDOWN* Function Unconditional Shutdown of the Module I/O I PAD R13 HW_SHUTDOWN* is used to unconditionally shutdown the HE910. the HE910 is reset. Use the ON/OFF signal to perform this function or the AT#SHDN command. to permit to the internal circuitry the power on reset and under voltage lockout functions. Unconditional Shutdown Signal Operating levels: Signal HW_SHUTDOWN* Input high HW_SHUTDOWN* Input low Min 1.35V * this signal is internally pulled up so the pin can be left floating if not used. If unused.All Rights Reserved page 54 of 88 . then it must always be connected with an open collector transistor. After the release of the line. so there's no need to control this pin on start-up.5V 0V Max 1. but only as an emergency exit in the rare case the device remains stuck waiting for some network response.A. The HW_SHUTDOWN* is internally controlled on start-up to achieve always a proper poweron reset sequence. this signal may be left unconnected. When the device is reset it stops any operation. the HE910 is unconditionally shut down. written authorization . For this reason the HW_SHUTDOWN* signal must not be used to normally shutting down the device. Whenever this signal is pulled low.9V 0. Reproduction forbidden without Telit Communications S.

The impedance value should be as close as possible to 90 Ohms differential.3V 5V NOTE Accepted range: 4. The signal traces should be routed carefully.All Rights Reserved page 55 of 88 . Type 3.3V 3. Trace lengths. Reproduction forbidden without Telit Communications S. The USB 1. The following table is listing the available signals: PAD B15 C15 A13 Signal USB_D+ USB_DVUSB I/O I/O I/O AI Function USB differential Data (+) USB differential Data (-) Power sense for the internal USB transceiver.25V The USB_DPLUS and USB_DMINUS signals have a clock rate of 480 MHz. written authorization .p.4V to 5.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 The HE910 includes one integrated universal serial bus (USB) transceiver: USB 2.A. number of vias and capacitive loading should be minimized.0 HS This port is compliant with the USB 2.0 HS only.1 is not supported.

Reproduction forbidden without Telit Communications S.8V CMOS 1. it is not possible to use the AUX_UART port. that is. it supplies the clock.All Rights Reserved page 56 of 88 . The AP has the master role.HE910 Hardware User Guide 1vv0300925 Rev.p. written authorization .19 – 26-06-2012 The HE910 Module is provided by one SPI interface. when the SPI port is used.8V CMOS 1.8V CMOS 1. NOTE: Due to the shared functions. The SPI interface defines two handshake lines for flow control and mutual wake-up of the modem and the Application Processor: SRDY (slave ready) and MRDY (master ready).8V COMMENT Shared with TX_AUX Shared with RX_AUX The signal 1V8_SEL must be connected to the VDD_IO1 input pin to properly supply this digital section.A. The following table is listing the available signals: PAD D15 E15 F15 H15 J15 Signal SPI_MOSI SPI_MISO SPI_CLK SPI_MRDY SPI_SRDY I/O I O I I O Function SPI MOSI SPI MISO SPI Clock SPI_MRDY SPI_SRDY Type CMOS 1.8V CMOS 1.

19 – 26-06-2012 E15 D15 F15 SPI_MISO SPI_MOSI SPI_CLK H15 SPI_MRDY SPI_SRDY HE910 J15 AP VDD_IO1 1V8_SEL D13 E13 D14 nc Reproduction forbidden without Telit Communications S.HE910 Hardware User Guide 1vv0300925 Rev.All Rights Reserved page 57 of 88 . written authorization .p.A.

p.19 – 26-06-2012 The HE910 module is provided with by 2 Asynchronous serial ports: MODEM SERIAL PORT 1 (Main) MODEM SERIAL PORT 2 (Auxiliary) Several configurations can be designed for the serial port on the OEM hardware.1V Operating Range .All Rights Reserved page 58 of 88 .A.3V Max 3.8.9V 0.8) with respect to ground Min -0.6V 0V Max 1.. The electrical characteristics of the Serial ports are explained in the following tables: Absolute Maximum Ratings -Not Functional Parameter Input level on any digital pin (CMOS 1.Interface levels (1.8V Depending from the type of serial port on the OEM hardware a level translator circuit may be needed to make the system work.8V (Universal Asynchronous Receive Transmit) microcontroller UART @ 5V or other voltages different from 1. written authorization . but the most common are: RS232 PC com port microcontroller UART @ 1. On the HE910 the ports are CMOS 1.HE910 Hardware User Guide 1vv0300925 Rev.2V Reproduction forbidden without Telit Communications S.35V 1.9 0.8V CMOS) Level Input high level Input low level Output high level Output low level Min 1.5V 0V 1.

written authorization .p.All Rights Reserved page 59 of 88 .A. P13. E14 … P14 P15 L14 R14 Name Data Carrier Detect Transmit line *see Note Receive line *see Note Data Terminal Ready Ground Data Set Ready Clear to Send Request to Send Ring Indicator Usage Output from the HE910 that indicates the carrier presence Output transmit line of HE910 UART Input receive of the HE910 UART Input to the HE910 that controls the DTE READY condition Ground Output from the HE910 that indicates the module is ready Output from the HE910 that controls the Hardware flow control Input to the HE910 that controls the Hardware flow control Output from the HE910 that indicates the incoming call condition The following table shows the typical input value of internal pull-up resistors for RTS DTR and TXD input lines and in all module states: RTS DTR TXD STATE ON OFF RESET POWER SAVING 5K to 12K Schottky diode Schottky diode 5K to 12K Pull up tied to 1V8 1V8 Reproduction forbidden without Telit Communications S.19 – 26-06-2012 The serial port 1 on the HE910 is a +1. B13. It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.8V UART with all the 7 RS232 signals. RS232 Pin # 1 2 3 4 5 6 7 8 9 Signal C109/DCD C104/RXD C103/TXD C108/DTR GND C107/DSR C106/CTS C105/RTS C125/RING HE910 Pad Number N14 M15 N15 M14 M12.HE910 Hardware User Guide 1vv0300925 Rev.

19 – 26-06-2012 The input line ON_OFF and RESET state can be treated as in picture below NOTE: According to V.p.A. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. some signal names are referred to the application side.HE910 Hardware User Guide 1vv0300925 Rev. Reproduction forbidden without Telit Communications S. written authorization . RXD lines can be connected. therefore on the HE910 side these signal are on the opposite direction: TXD on the application side will be connected to the receive line (here named C103/TXD) RXD on the application side will be connected to the transmit line (here named C104/RXD) NOTE: For a minimum implementation.All Rights Reserved page 60 of 88 . only the TXD. the other lines can be left open provided a software flow control is implemented.24.

Reproduction forbidden without Telit Communications S.A.p. it is not possible to use the SPI functions. when the Modem Serial port is used. NOTE: Due to the shared pins.All Rights Reserved page 61 of 88 .8V COMMENT SHARED WITH SPI_MTSR SHARED WITH SPI_MRST The signal 1V8_SEL must be connected to the VDD_IO1 input pin in order to use this port. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. The signals of the HE910 serial port are: PAD D15 E15 Signal TX_AUX RX_AUX I/O O I Function Auxiliary UART (TX Data to DTE) Auxiliary UART (RX Data from DTE) Type CMOS 1.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .8V CMOS 1.8V with only the RX and TX signals.19 – 26-06-2012 The secondary serial port on the HE910 is a CMOS1.

8V to +15/-15V.All Rights Reserved page 62 of 88 . Change the level from 0/1. This level translator must: invert the electrical signal in both directions. the RS232 UART 16450. written authorization . There are a multitude of them.19 – 26-06-2012 In order to interface the HE910 with a PC com port or a RS232 (EIA/TIA-232) application a level translator is required.p. The receiver is the translator from the RS232 level to 0-1. The simplest way to translate the levels and invert the signal is by using a single chip level translator.8V UART to the RS232 level. 16550. 16650 & 16750 chipsets accept signals with lower levels on the RS232 side (EIA/TIA-562).HE910 Hardware User Guide 1vv0300925 Rev. differing in the number of drivers and receivers and in the levels (be sure to get a true RS232 level translator not a RS485 or other standards). Actually. allowing a lower voltage-multiplying ratio on the level translator.A. In order to translate the whole set of control lines of the UART you will need: 5 drivers 3 receivers Reproduction forbidden without Telit Communications S. Note that the negative signal voltage must be less than 0V and hence some sort of level translation is always required.8V UART. By convention the driver is the level translator from the 0-1.

19 – 26-06-2012 An example of RS232 level adaptation circuitry could be done using a MAXIM transceiver (MAX218) In this case the chipset is capable to translate directly from 1. The RS232 serial port lines are usually connected to a DB9 connector with the following layout: Reproduction forbidden without Telit Communications S.HE910 Hardware User Guide 1vv0300925 Rev.8V to the RS232 levels (Example done on 4 signals only). written authorization .A.All Rights Reserved page 63 of 88 .p.

The product is providing the Digital Audio Interface (DVI) on the following Pins: Digital Voice Interface (DVI) PAD B9 B6 B7 B8 Signal DVI_WA0 DVI_RX DVI_TX DVI_CLK I/O I/O I O I/O Function Digital Audio Interface (Word Alignment / LRCLK) Digital Audio Interface (RX) Digital Audio Interface (TX) Digital Audio Interface (BCLK) Note Type CMOS 1. written authorization .8V CMOS 1. Reproduction forbidden without Telit Communications S.8V CMOS 1.19 – 26-06-2012 The Audio of the HE910 Module is carried by DVI digital audio interface.8V CMOS 1.p.All Rights Reserved page 64 of 88 . The audio port can be directly connected to end device using digital interface.A. or via one of the several compliant codecs (in case an analog audio is needed).HE910 Hardware User Guide 1vv0300925 Rev.8V Please refer to the HE910 Digital Audio Application note.

1 mA 0.8V CMOS 1.19 – 26-06-2012 The HE910 module is provided by a set of Digital Input / Output pins Input pads can only be read.8V CMOS 1.1 mA 0.HE910 Hardware User Guide 1vv0300925 Rev.1 mA 0.8V CMOS 1.A.1 mA 0. written authorization .8V Drive strength 0.1 mA 0.p.8V CMOS 1.1 mA 0.1 mA Default State INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT INPUT VDD_IO1 has to be connected to 1V8_SEL VDD_IO1 has to be connected to 1V8_SEL VDD_IO1 has to be connected to 1V8_SEL Note Alternate function STAT LED GPIO_01 I/O Configurable GPIO GPIO_02 I/O Configurable GPIO GPIO_03 I/O Configurable GPIO GPIO_04 I/O Configurable GPIO GPIO_05 I/O Configurable GPIO GPIO_06 I/O Configurable GPIO GPIO_07 I/O Configurable GPIO GPIO_08 I/O Configurable GPIO GPIO_09 I/O Configurable GPIO GPIO_10 I/O Configurable GPIO Reproduction forbidden without Telit Communications S. Output pads can only be written or queried and set the value of the pad output.1 mA 0.8V CMOS 1. An alternate function pad is internally controlled by the HE910 firmware and acts depending on the function implemented.8V CMOS 1. The following table shows the available GPIO on the HE910: PAD C8 C9 C10 C11 B14 C12 C13 K15 L15 G15 Signal I/O Function Type CMOS 1.1 mA 0.8V CMOS 1.8V CMOS 1.1 mA 0.8V CMOS 1. they report the digital value (high or low) present on the pad at the read time.All Rights Reserved page 65 of 88 .

A.p.HE910 Hardware User Guide 1vv0300925 Rev.2V Reproduction forbidden without Telit Communications S.9V 0.All Rights Reserved page 66 of 88 .5V 0V 1. written authorization . The following table shows the logic level specifications used in the HE910 interface circuits: Absolute Maximum Ratings -Not Functional Parameter Input level on any digital pin (CMOS 1.8V CMOS logic levels.6V 0V Max 1.9 0.3V Max 3.35V 1.1V Operating Range . all the interface circuits work at 1.Interface levels (1.8V CMOS) Level Input high level Input low level Output high level Output low level Min 1.8) with respect to ground Min -0.19 – 26-06-2012 Where not specifically stated.

If the digital output of the device to be connected with the GPIO input pad has interface levels different from the 1. Reproduction forbidden without Telit Communications S.A.8V.HE910 Hardware User Guide 1vv0300925 Rev.p. when used as inputs.8V CMOS. can drive 1. provided this device has interface levels compatible with the 1.19 – 26-06-2012 The GPIO pads.All Rights Reserved page 67 of 88 . When set as outputs. NOTE: In order to avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the HE910 when the module is powered off or during an ON/OFF transition. when used as outputs. the pads have a push-pull output and therefore the pull-up resistor may be omitted.8V CMOS digital devices or compatible hardware. The GPIO pads. written authorization .8V CMOS levels of the GPIO. can be connected to a digital output of another device and report its status. then it can be buffered with an open collector transistor with a 47K pull up to 1.

Ton 0.p.5s) Slow blinking (Period 3s. Therefore.3s) Permanently on Device Status Device off Net search / Not registered / turning off Registered full service a call is active A schematic example could be: Reproduction forbidden without Telit Communications S.19 – 26-06-2012 The STAT_LED pin status shows information on the network service availability and Call status. written authorization .All Rights Reserved page 68 of 88 .A. the STAT_LED needs an external transistor to drive an external LED. Ton 0. the status indicated in the following table is reversed with respect to the pin status. LED status Permanently off Fast blinking (Period 1s. The function is available as alternate function of GPIO_01 In the HE910 modules.HE910 Hardware User Guide 1vv0300925 Rev.

80V 1uF Max 1.19 – 26-06-2012 The VRTC pin brings out the Real Time Clock supply.78V Typical 1.HE910 Hardware User Guide 1vv0300925 Rev. The signal is present on Pad R11 and it is in common with the PWRMON (module powered ON indication) function.p.All Rights Reserved page 69 of 88 .A. which is separate from the rest of the digital part.82V 60mA Reproduction forbidden without Telit Communications S. The operating range characteristics of the supply are: Level Output voltage Output current Output bypass capacitor (inside the module) Min 1. allowing having only RTC going on when all the other parts of the device are off. To this power output a backup capacitor can be added in order to increase the RTC autonomy during power off of the battery. Please refer to the related User Guide (SIM Holder Design Guides. written authorization . This output is always active when the module is powered ON. NO Devices must be powered from this pin. A regulated power supply output is provided in order to supply small devices from the module. 80000NT10001a).

The command is AT#ADC=1.2 10 1 Units Volt bits Mohm pF Input Voltage range AD conversion Input Resistance Input Capacitance The input line is named as ADC_IN1 and it is available on Pad B1 An AT command is available to use the ADC function. It is able to read a voltage level in the range of 0÷1.A. store and convert it into 10 bit word. The following table is showing the ADC characteristics: Min 0 1 Typical Max 1.2 volts applied on the ADC pin input.2 The read value is expressed in mV Refer to SW User Guide or AT Commands Reference Guide for the full description of this function. Reproduction forbidden without Telit Communications S.All Rights Reserved page 70 of 88 .HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 The HE910 is provided by one AD converter.p. written authorization .

A.p.All Rights Reserved page 71 of 88 . Pin B1 Bottom view Dimensions in mm Lead-free Alloy: Surface finishing Ni/Au for all solder pads Reproduction forbidden without Telit Communications S.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 The HE910 modules have been designed in order to be compliant with a standard lead-free SMT process. written authorization .

19 – 26-06-2012 Reproduction forbidden without Telit Communications S. written authorization .p.All Rights Reserved page 72 of 88 .A.HE910 Hardware User Guide 1vv0300925 Rev.

All Rights Reserved page 73 of 88 . written authorization . to avoid having a mechanical part of the application in direct contact with the module.5 mm placement inhibit area around the module.p. NOTE: In the customer application.A. Reproduction forbidden without Telit Communications S.19 – 26-06-2012 TOP VIEW In order to easily rework the HE910 is suggested to consider on the application a 1.HE910 Hardware User Guide 1vv0300925 Rev. It is also suggested. the region under WIRING INHIBIT (see figure above) must be clear from signal or ground paths. as common rule for an SMT component.

written authorization . we suggest a thickness of stencil foil ≥ 120 µm. Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.p.HE910 Hardware User Guide 1vv0300925 Rev.19 – 26-06-2012 Stencil’s apertures layout can be the same of the recommended footprint (1:1).All Rights Reserved page 74 of 88 . Copper Pad Solder Mask PCB SMD (Solder Mask Defined) NSMD (Non Solder Mask Defined) Reproduction forbidden without Telit Communications S.A.

p. written authorization .All Rights Reserved page 75 of 88 .HE910 Hardware User Guide 1vv0300925 Rev.A.19 – 26-06-2012 The recommendation for the PCB pads dimensions are described in the following image (dimensions in mm) Solder resist openings Reproduction forbidden without Telit Communications S.

Generally. high shear force values The PCB must be able to resist the higher temperatures which are occurring at the lead-free process. written authorization . This issue should be discussed with the PCB-supplier. however in that case it is suggested to use milled contours and predrilled board breakouts. It is not necessary to panel the application’s PCB.3 mm around the pads unless it carries the same signal of the pad itself (see following figure). Inhibit area for micro-via Holes in pad are allowed only for blind holes and not for through holes.All Rights Reserved page 76 of 88 . the wettability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.p.HE910 Hardware User Guide 1vv0300925 Rev.15 Properties good solder ability protection. Reproduction forbidden without Telit Communications S.A. scoring or v-cut solutions are not recommended.19 – 26-06-2012 It is not recommended to place via or micro-via not covered by solder resist in an area of 0. Recommendations for PCB pad surfaces: Finish Electro-less Ni / Immersion Au Layer thickness [µm] 3 –7 / 0.05 – 0.

19 – 26-06-2012 Solder paste Lead free Sn/Ag/Cu We recommend using only “no clean” solder paste in order to avoid the cleaning of the modules after assembly. written authorization .p. Recommended solder reflow profile: Reproduction forbidden without Telit Communications S.All Rights Reserved page 77 of 88 .A.HE910 Hardware User Guide 1vv0300925 Rev.

8 minutes max. written authorization . All temperatures refer to topside of the package. measured on the package body surface WARNING: The HE910 module withstands one reflow process only. Reproduction forbidden without Telit Communications S.19 – 26-06-2012 Profile Feature Average ramp-up rate (TL to TP) Preheat – Temperature Min (Tsmin) – Temperature Max (Tsmax) – Time (min to max) (ts) Tsmax to TL – Ramp-up Rate Time maintained above: – Temperature (TL) – Time (tL) Peak Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature NOTE: Pb-Free Assembly 3°C/second max 150°C 200°C 60-180 seconds 3°C/second max 217°C 60-150 seconds 245 +0/-5°C 10-30 seconds 6°C/second max.HE910 Hardware User Guide 1vv0300925 Rev.p.A.All Rights Reserved page 78 of 88 .

These trays can be used in SMT processes for pick & place handling.19 – 26-06-2012 The HE910 modules are packaged on trays of 20 pieces each.A.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .All Rights Reserved page 79 of 88 . Reproduction forbidden without Telit Communications S.p.

p.All Rights Reserved page 80 of 88 .19 – 26-06-2012 Reproduction forbidden without Telit Communications S.A.HE910 Hardware User Guide 1vv0300925 Rev. written authorization .

19 – 26-06-2012 The HE910 is a Moisture Sensitive Device level 3.A.p. c) The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected d) Baking is required if conditions b) or c) are not respected e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more Reproduction forbidden without Telit Communications S. the customer has to take care of the following conditions: a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).HE910 Hardware User Guide 1vv0300925 Rev. written authorization .All Rights Reserved page 81 of 88 . take care all the relatives requirements for using this kind of components. b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5. Moreover. in according with standard IPC/JEDEC JSTD-020.

please refer to the technical documentation and the regulations in force. Do not insert or remove the SIM when the product is in power saving mode.int/comm/enterprise/electr_equipment/index_en. therefore. as well as of any project or installation issue. airports. The use of this product may be dangerous and has to be avoided in the following areas:  Where it can interfere with other electronic devices in environments such as hospitals.int/comm/enterprise/rtte/dir99-5. The system integrator is responsible of the functioning of the final product. because the risk of disturbing the GSM network or external devices or having impact on the security. written authorization . The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). aircrafts. checking carefully the instruction for its use.htm Reproduction forbidden without Telit Communications S. Same cautions have to be taken for the SIM. Every module has to be equipped with a proper antenna with specific characteristics. Should there be any doubt. etc  Where there is risk of explosion such as gasoline stations. We recommend following the instructions of the hardware user guides for a correct wiring of the product. while the applicable Directives (Low Voltage and EMC) are available at: http://europa. All the relevant information’s are available on the European Community website: http://europa.eu. the system integrator has to assess the final product against the SAR regulation. Do not disassemble the product.htm The text of the Directive 99/05 regarding telecommunication equipments is available. In case of this requirement cannot be satisfied. care has to be taken to the external components of the module. etc It is responsibility of the user to enforce the country regulation and the specific environment regulation.p.A.eu. avoiding any contact with the pins because electrostatic discharges may damage the product itself.All Rights Reserved page 82 of 88 .19 – 26-06-2012 READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The product has to be supplied with a stabilized voltage source and the wiring has to be conforming to the security and fire prevention regulations. oil refineries. any mark of tampering will compromise the warranty validity. The product has to be handled with care.HE910 Hardware User Guide 1vv0300925 Rev. The European Community provides some Directives for the electronic equipments introduced on the market.

že tento 2G/3G module je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES.p.p. hogy a 2G/3G module megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. dass sich das Gerät 2G/3G module in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. at følgende udstyr 2G/3G module overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. HE910-EUD.A.A.A.p. seadme 2G/3G module vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele.A. Hiermit erklärt Telit Communications S.p. sem gerðar eru í tilskipun 1999/5/EC Con la presente Telit Communications S. декларира..p. déclare que l'appareil 2G/3G module est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE.A. Telit Communications S. Bulgarian С настоящето Telit Communications S.A.A.p. dichiara che questo 2G/3G module è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE.A. че 2G/3G module отговаря на съществените изисквания и другите приложими изисквания на Директива 1999/5/ЕС. HE910NAR. Käesolevaga kinnitab Telit Communications S. ΜΕ ΣΗΝ ΠΑΡΟΤ΢Α Telit Communications S. Hér með lýsir Telit Communications S. Hereby.p. Hierbij verklaart Telit Communications S.p.HE910 Hardware User Guide 1vv0300925 Rev. Czech Danish Dutch English Estonian German Greek Hungarian Finnish French Icelandic Italian Reproduction forbidden without Telit Communications S.p. tímto prohlašuje.A. HE910-EUR. HE910-EUG. Alulírott.19 – 26-06-2012 The HE910.p. erklærer herved. Telit Communications S.A.p. HE910-D. written authorization . ΔΗΛΩΝΕΙ ΟΣΙ 2G/3G module ΢ΤΜΜΟΡΦΩΝΕΣΑΙ ΠΡΟ΢ ΣΙ΢ ΟΤ΢ΙΩΔΕΙ΢ ΑΠΑΙΣΗ΢ΕΙ΢ ΚΑΙ ΣΙ΢ ΛΟΙΠΕ΢ ΢ΥΕΣΙΚΕ΢ ΔΙΑΣΑΞΕΙ΢ ΣΗ΢ ΟΔΗΓΙΑ΢ 1999/5/ΕΚ.A.. Undertegnede Telit Communications S. HE910-NAD modules have been evaluated against the essential requirements of the 1999/5/EC Directive. HE910-NAG. Telit Communications S. Telit Communications S. declares that this 2G/3G module is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Par la présente Telit Communications S. dat het toestel 2G/3G module in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG.A.All Rights Reserved page 83 of 88 . yfir því að 2G/3G module er í samræmi við grunnkröfur og aðrar kröfur.A. HE910-GA.A.p.p. vakuuttaa täten että 2G/3G module tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen.p. nyilatkozom.

A.p. Spanish Por medio de la presente Telit Communications S.1 EN 301 489-7 V1.A.All Rights Reserved page 84 of 88 .p.A. deklarē. 3. declara que este 2G/3G module está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE.1 EN 301 489-24 V1. Latvian In order to satisfy the essential requirements of 1999/5/EC Directive.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 Reproduction forbidden without Telit Communications S.2 EN 301 908-1 V4. Norwegian Telit Communications S.8. oświadcza. izjavlja. že 2G/3G module spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES.A. Lithuanian Šiuo Telit Communications S.p. erklærer herved at utstyret 2G/3G module er i samsvar med de grunnleggende krav og øvrige relevante krav i direktiv 1999/5/EF. 3.2) EN 300 440-2 V1. da je ta 2G/3G module v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES.A. jiddikjara li dan 2G/3G module jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid -Dirrettiva 1999/5/EC.8.4. 3. ka 2G/3G module atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.1 EN 301 511 V9. written authorization .1 EN 301 489-3 V1.A.19 – 26-06-2012 Ar šo Telit Communications S.1 EN 301 511 V9.2) EN 300 440-2 V1. że 2G/3G module jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC Portuguese Telit Communications S.2. Polish Niniejszym Telit Communications S..1 EMC (R&TTE art.1 Health & Safety (R&TTE art. Swedish Härmed intygar Telit Communications S.1b) EN 301 489-1 V1. 3. 3. týmto vyhlasuje. Slovenian Telit Communications S. kad šis 2G/3G module atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.A.A. Telit Communications S.p.1 EN 301 908-2 V4. the HE910.4.0. HE910-EUG modules are compliant with the following standards: RF spectrum use (R&TTE art.4.A. deklaruoja. Maltese Hawnhekk. the HE910-NAG modules are compliant with the following standards: RF spectrum use (R&TTE art.2.1 Health & Safety (R&TTE art.2 EMC (R&TTE art.p. 3.3.p. Slovak Telit Communications S.p.p.3.p.A.1a) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 In order to satisfy the essential requirements of 1999/5/EC Directive.HE910 Hardware User Guide 1vv0300925 Rev.1 EN 301 489-7 V1.0.1b) EN 301 489-1 V1.p. att denna 2G/3G module står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG.A.1 EN 301 489-3 V1.p.5. declara que el 2G/3G module cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE.4. HE910-GA.

1 EN 301 489-24 V1. HE910-NAD modules are compliant with the following standards: RF spectrum use (R&TTE art. 3. 3.A.A.1b) Health & Safety (R&TTE art.1 EN 301 908-2 V4. HE910-D.1 EN 301 489-7 V1. 3.telit.8.1b) Health & Safety (R&TTE art. 3. HE910-NAG.p.1 EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 The conformity assessment procedure referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC has been followed with the involvement of the following Notified Body: AT4 wireless. HE910-EUD.All Rights Reserved page 85 of 88 .3.1a) The HE910-NAR.02 EN 301 489-1 V1.1a) EN 301 511 V9. HE910-NAR. S. HE910-EUR. HE910-EUR.2.5.com/ There is no restriction for the commercialisation of the HE910.2. HE910-NAD modules in all the countries of the European Union. HE910-GA.1 EN 301 489-7 V1.1 EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 EMC (R&TTE art. HE910-EUG.HE910 Hardware User Guide 1vv0300925 Rev. 3.19 – 26-06-2012 The HE910-D.8.1 EN 301 489-1 V1. written authorization . the following marking is included in the product: 1909 The full declaration of conformity can be found on the following address: http://www.2) EN 301 511 V9. Parque Tecnologico de Andalucía C/ Severo Ochoa 2 29590 Campanillas – Málaga SPAIN Notified Body No: 1909 Thus.02 EN 301 908-1 V4. 3. Reproduction forbidden without Telit Communications S.2) EMC (R&TTE art.3. HE910-EUD modules are compliant with the following standards: RF spectrum use (R&TTE art.

It should be noted that assessment does not necessarily lead to testing.1b) Health & Safety (R&TTE art.19 – 26-06-2012 Final product integrating this module must be assessed against essential requirements of the 1999/5/EC (R&TTE) Directive.p. 3.HE910 Hardware User Guide 1vv0300925 Rev. 3.2) EMC (R&TTE art.p.A.1b) and Electrical safety (Art.A. Telit Communications S. 3. assessment of the final product against EMC (Art. written authorization .All Rights Reserved page 86 of 88 . 3. recommends carrying out the following assessments: RF spectrum use (R&TTE art.1a) It will depend on the antenna used on the final product.1a) essential requirements can be done against the essential requirements of the EMC and the LVD Directives: Low Voltage Directive 2006/95/EC and product safety Directive EMC 2004/108/EC for conformity for EMC Reproduction forbidden without Telit Communications S. Testing Testing Alternately. 3.

The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. HE910-D 5. Any changes or modifications could void the user’s authority to operate the equipment.45 dBi HE910-GA 5. même si le brouillage est susceptible d'en compromettre le fonctionnement. HE910-NAD. quelle qu’en soit la nature.p. Telit n’approuve aucune modification apportée à l’appareil par l’utilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s).31 dBi HE910-NAR.22 dBi 3.A. Antenna gain must be below: Frequency band GSM 850/FDD V PCS 1900/FDD II FDD IV HE910. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage. Tout changement ou modification peuvent annuler le droit d’utilisation de l’appareil par l’utilisateur. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. HE910-NAG 5. Operation is subject to the following two conditions: (1) this device may not cause interference.22 dBi 3.HE910 Hardware User Guide 1vv0300925 Rev. and (2) this device must accept any interference.29 dBi 4.32 dBi This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.31 dBi 6.All Rights Reserved page 87 of 88 . et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi. written authorization .02 dBi 6. Wireless notice This equipment complies with FCC and IC radiation exposure limits set forth for an uncontrolled environment. Reproduction forbidden without Telit Communications S.19 – 26-06-2012 Modification statement Telit has not approved any changes or modifications to this device by the user. including interference that may cause undesired operation of the device.

may cause harmful interference to radio communications. which can be determined by turning the equipment off and on. there is no guarantee that interference will not occur in a particular installation.All Rights Reserved page 88 of 88 . if not installed and used in accordance with the instructions. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device. Increase the separation between the equipment and receiver. pursuant to part 15 of the FCC Rules. However.22 dBi 3.32 dBi L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur. Reproduction forbidden without Telit Communications S. HE910-NAG 5.45 dBi HE910-GA 5.29 dBi 4. written authorization .22 dBi 3. Gain de l'antenne doit être ci-dessous: Bande de fréquence GSM 850/FDD V PCS 1900/FDD II FDD IV HE910. the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna.19 – 26-06-2012 Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. uses and can radiate radio frequency energy and. HE910-NAD. HE910-D 5. This equipment generates.31 dBi 6. Consult the dealer or an experienced radio/TV technician for help.31 dBi HE910-NAR. If this equipment does cause harmful interference to radio or television reception.02 dBi 6. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.A.HE910 Hardware User Guide 1vv0300925 Rev. These limits are designed to provide reasonable protection against harmful interference in a residential installation.p.