Steps in Designing Shielded Enclosures

Praveen Pothapragada Chief Engineer Equipto Electronics Corporation 351 Woodlawn avenue Aurora IL 60506 PH: 630-859-7840 X 122 Email: praveen@equiptoelec.com

Outline
• • • • • • • Reasons for EMC Ways of Reaching EMC Company Background Standards Design of Shielded Enclosures Testing results Questions

Copyright 2010 Equipto Electronics Corporation

2

Why do we need EMC?
• Unintentional Electro Magnetic Interference. • Intentional Electro Magnetic Interference.

Copyright 2010 Equipto Electronics Corporation

3

Unintentional EMI

Copyright 2010 Equipto Electronics Corporation

4

• Intentional Electro Magnetic Interference.Why do we need EMC? • Unintentional Electro Magnetic Interference. Copyright 2010 Equipto Electronics Corporation 5 .

Copyright Equipto Electronics Corporation 6 .

Copyright Equipto Electronics Corporation 7 .

Copyright Equipto Electronics Corporation 8 .

Copyright 2010 Equipto Electronics Corporation 9 .g.: Individual PC boards or chassis) • Shielded enclosures • Anechoic Chambers. Shielded Rooms and Faraday Cages.Ways of reaching EMC • At the component level (e.

• Can be a less expensive solution compared to shielding individual components or the shielded rooms. • Portable compared to Shielded rooms.Advantages of Shielded Enclosures • Can be incorporated after the system is designed. Copyright 2010 Equipto Electronics Corporation 10 .

Applications of Shielded Enclosures • • • • Data centers where we need redundancy Industrial production lines for critical operations Department of Defense (protect communications) Other applications where EMC is critical Copyright 2010 Equipto Electronics Corporation 11 .

• Our Shielded enclosure line started over 25 years ago. Copyright 2010 Equipto Electronics Corporation 12 .ft in Aurora IL and has 50 employees. • We specialize in custom solutions for shielded. shock and vibration and seismic applications. EEC specializes in modular design for electronic packaging solutions.Company Background • Started in 1960. • Our sheet metal fabrication facility is spread over 125.000 sq.

EMC Standards • • • • • • IEEE-299-2006 MIL-STD-461 NSA 94-106 FCC Part 15 Tempest MIL-STD-188 (HEMP) Copyright 2010 Equipto Electronics Corporation 13 .

Design of Shielded Enclosures • • • • • Selection of Enclosure Material Galvanic Compatibility Selection of Gaskets Input/Output Testing Copyright 2010 Equipto Electronics Corporation 14 .

Other mechanical properties Copyright 2010 Equipto Electronics Corporation 15 . Thickness of material.Selection of Enclosure Material • • • • Radiated Emissions/Susceptibility? Shielding levels required.

For Susceptibility we want to choose material that reflects (e.g Aluminum). Copyright 2010 Equipto Electronics Corporation 16 .S or Stainless Steel).g C.R.Selection of Enclosure Material • Radiated Emissions/Susceptibility? For Radiated Emissions we want to choose a material that absorbs (e.

 Field Strength Without Enclosure   Attenuation (dB) = 20Log10    Compliant Field Strength   Copyright 2010 Equipto Electronics Corporation 17 .Selection of Enclosure Material • Shielding levels required.

Copyright Equipto Electronics Corporation 18 .

Selection of Enclosure Material • Shielding levels required.  Field Strength Without Enclosure   Attenuation (dB) = 20Log10    Compliant Field Strength    120 ×103   Shielding Effectiness (dB) = 20Log10  ≈ 88 dB @ 300 MHz   5   Copyright 2010 Equipto Electronics Corporation 19 .

Copyright Equipto Electronics Corporation 20 .

136r1  r Gf  1 G ×106 R P (dB) = 108.2 + 10 log10  fG + 0.Selection of Enclosure Material S.462 µ R H (dB) = 20 log10  + 0.E (dB) = A+ R + B A (dB) = 3.distance between source to shield (in) t – thickness (mils) G R E (dB) = 353.6 + 10 log10 3 2 f µr1  0.338 ×10−3 × t µfG G – relative conductivity (copper) f – frequency (Hz) µ .relative permeability (free space) r1.354   µ  µf Copyright 2010 Equipto Electronics Corporation 21 .

Selection of Enclosure Material Other mechanical properties • Weldability • Formability • Availability • Protection against magnetic fields (Aluminum. 300 series Stainless steels) Copyright 2010 Equipto Electronics Corporation 22 .

Design of Shielded Enclosures • • • • • Selection of Enclosure Material Galvanic Compatibility Selection of Gaskets Input/Output Testing Copyright 2010 Equipto Electronics Corporation 23 .

Copyright Equipto Electronics Corporation 24 .

Design of Shielded Enclosures • • • • • Selection of Enclosure Material Galvanic Compatibility Selection of Gaskets Input/Output Testing Copyright 2010 Equipto Electronics Corporation 25 .

Selection of Gaskets • Reason for having gaskets • Type of opening – Wiping or compression • Shielding effectiveness • Galvanic Compatibility Copyright 2010 Equipto Electronics Corporation 26 .

Copyright 2010 Equipto Electronics Corporation 27 . • Use of heavier gauge material.Door Opening Design Advantages: • High level of Shielding Effectiveness Disadvantages: • Must be manufactured precisely.

Design of Shielded Enclosures • Input/Output – Vents – Power Line Filters – Connectors Copyright 2010 Equipto Electronics Corporation 28 .

92 .125 D Since 10 GHz < 55. 32 × L 32 ×1 SE (dB) ≈ ≈ ≈ 256 dB D 0.36 GHz 0.Vents Example: Determine SE @ 10 GHz for 1/8”Honeycomb 1” Long.125 Rule of thumb for vents L ≥5 D Cutoff Frequency C = = Copyright 2010 Equipto Electronics Corporation 29 6. 6.36 GHz the honeycomb is usable.92 = 55.

Design of Shielded Enclosures • Input/Output – Vents – Power Line Filters – Connectors Copyright 2010 Equipto Electronics Corporation 30 .

Design of Shielded Enclosures • • • • • Selection of Enclosure Material Galvanic Compatibility Selection of Gaskets Input/Output Testing Copyright 2010 Equipto Electronics Corporation 31 .

Testing • IEEE-299-2006 • NSA 94-106 Copyright 2010 Equipto Electronics Corporation 32 .

Copyright Equipto Electronics Corporation 33 .

Vertical Door Hinge Side.01 0. Horizontal Door Top Center.1 1 Frequency MHz Copyright Equipto Electronics Corporation 10 100 34 . Horizontal Door Latch Top Corner. Vertical Door Hinge Top Corner.Equipto R6 Magnetic Field Shielding Effectiveness Door Latch Top Corner. Horizontal 120 100 80 dB 60 40 20 0 0. Middle. Vertical Door Hinge Top Corner.

Resonant Range and High Frequency Shielding Door Latch Edge. Vertical Door Latch Edge. Horizontal 180 160 140 120 100 dB 80 60 40 20 0 10 100 1000 Copyright Equipto Electronics Corporation 10000 100000 35 Frequency (MHz) .

Copyright Equipto Electronics Corporation 36 .

Copyright Equipto Electronics Corporation 37 .

Electric Field Shielding Effectiveness 160 140 120 100 dB 80 60 40 20 0 1 kHz 10 kHz 100 kHz 1 MHz 10 MHz Measurement Location Copyright Equipto Electronics Corporation 38 .

Plane Wave Shielding Effectiveness .Horizontal Polarization 160 140 120 100 dB 400 MHz 100 MHz 80 1 GHz 60 40 20 0 10 GHz Measurement Location Copyright Equipto Electronics Corporation 39 .

Plane Wave Shielding Effectiveness .Vertical Polarization 160 140 120 100 dB 400 MHz 100 MHz 80 1 GHz 60 40 20 0 10 GHz Measurement Location Copyright Equipto Electronics Corporation 40 .

diehl.References • • • • • • • • The design of shielded enclosures by Louis T.de Copyright 2010 Equipto Electronics Corporation 41 .APELC. Gnecco Chomerics (EMI Shielding Theory) MIL-F-14072D NSA 94-106 MIL-STD-461F EMPrimus SCADA/DCS Testing www.com www.

Questions Copyright 2010 Equipto Electronics Corporation 42 .

Sign up to vote on this title
UsefulNot useful