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GAP FILLERS

THERM-A-GAP Gap Filling Materials
TM

The THERM-A-GAP family of thermal interface materials fill air gaps between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates.

Typical Applications
• microprocessors and cache chips • heat pipe interposer plates • laptop PCs and other high density, handheld portable electronics • high speed disk drives

Features/Benefits
• soft material deflects easily for minimal stress on components • reduce PCB “hotspots” by sinking heat to chassis • wide range of material properties cover many applications • UL flammability rated

Typical Properties
THERM-A-GAP™ Material Carriers Color Standard Thicknesses inches (mm) Thermal Conductivity @ 10 psi Features/Typical Applications

V-THERM™

NA

Blue

0.020 (0.51) 0.040 (1.02) 0.060 (1.52)

6.0 W/m-K

• Highest thermal conductivity of all Chomerics interface materials • Well suited for high heat flux densities typical of microprocessor/heat pipe cooling techniques used in laptop PCs

A574 F574

Aluminum Interior Fiberglass

Lt. Gray

0.020 (0.51) 0.040 (1.02) 0.070 (1.78) 0.100 (2.54) 0.130 (3.30) 0.160 (4.06) 0.200 (5.08) 0.020 (0.51) 0.040 (1.02) 0.070 (1.78) 0.100 (2.54) 0.130 (3.30) 0.160 (4.06) 0.200 (5.08) 0.020 (0.51) 0.040 (1.02) 0.070 (1.78) 0.100 (2.54) 0.130 (3.30) 0.160 (4.06) 0.200 (5.08)

1.6 W/m-K 1.4 W/m-K

• Ideal for high heat flux typical of microprocessors, video chips, power semiconductors, etc. • Available with PSA on one side for ease of application

A174 T174 F174

Aluminum Exterior Fiberglass Interior Fiberglass Lt. Purple

1.0 W/m-K

• Well suited for high volume, low cost applications in automotive electronics, laptop PCs, etc. • Flat sheets only

A274 T274

Aluminum Green Exterior Fiberglass

0.9 W/m-K

• Can be molded to meet exact dimensions required for optimum electronics packaging • Low thermal impedance 274 “blankets” eliminate hotspots • Available in ribbed or flat profiles

NA= Not Applicable

US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www.chomerics.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253

Seals

October1999

37

Four standard thicknesses are available. Pressure-sensitive adhesive applied to the aluminum foil carrier side is standard.127 mm) aluminum foil carrier. (46 x 46 cm). metal enclosures and chassis. (0. The foil side is mounted to the chassis or other heat spreader with the compliant silicone surface contacting the component. Pressure-sensitive adhesive on the carrier side is standard. (23 x 23 cm) and 18 x 18 in. More practical and efficient than potting compounds. transferring heat away from individual components or entire boards.050 mm) or 0.chomerics. The exceptional conformability of these advanced materials enables them to blanket highly uneven surfaces. eliminating the need for mounting adhesives. For applications requiring electrical isolation The materials designated “T” are reinforced with a thin. Standard sheet sizes for all flat THERM-A-GAP materials are 9 x 9 in. The foil acts as a heat spreader to eliminate “hotspots” over high heat generating components.005 in. MATERIAL COMPOSITION THERM-A-GAP materials consist of an extremely soft silicone elastomer loaded with ceramic particles. This mesh is filled with the ceramic compound. CHOICE OF PERFORMANCE LEVEL. Pioneered by Chomerics. THERM-A-GAP materials have been shown to be non-nutritive. This property is important in optical applications or those with high compression load. THERM-A-GAP materials are used throughout the world in hundreds of applications where limited air flow. and do not promote fungal growth. Seven standard thicknesses are available. THERM-A-GAP materials contain a lower percentage of free migratory silicone. Six standard thicknesses are available. Solvent extraction studies have shown that compared with similar products. Ribbed profile sheets are 8 x 8 in. or fiberglass carriers. irregular surfaces and/or dense packaging conditions create the need for an efficient heat transfer mechanism. THERM-AGAP materials allow the designer to be less concerned with component proximity to heat sinks or heat spreaders. They are available with aluminum foil. and allowing chassis parts to be used as heat spreaders where space is restricted. OR COMPLETE CUSTOMIZATION Three types of THERM-A-GAP materials are described in the following pages: 174 Series Materials • Good thermal performance • Most economical • Flat sheets • Light purple 274 Series Materials • Moderate thermal performance • Flat or ribbed sheets and custom molded shapes • Green 574 Series Materials • High thermal performance • Softest materials • Flat sheets • Gray 40 October1999 US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www.002 in.GAP FILLERS • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs LEADER IN THERMAL MANAGEMENT: DESIGN. In the materials designated “F” feature an integral fiberglass reinforcing mesh that provides mechanical strength.Thermally Conductive Gap Fillers Chomerics’ THERM-A-GAP elastomers are used to fill air gaps between components or PC boards and heat sinks. Alternate thicknesses and sheet sizes can be produced on request. In addition. thermally conductive fiberglass reinforced insulator that resists puncture and provides electrical isolation.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals . The “A” materials are recommended where maximum adhesive strength is required when mounting a component or heat sink. For applications not requiring electrical isolation The materials designated “A” utilize a 0. These materials are inherently tacky. dielectric film. PROFILE. (0. INNOVATION AND MATERIALS TECHNICAL BULLETIN 70 THERM-A-GAP Interface Materials TM Highly Conformable. (20 x 20 cm).

5) .070 in.8) . E140244) Adhesive Peel Strength.05) . While custom molding is not available for the 174 Series.18) T174 Aluminum Oxide Filled Silicone on Fiberglass Reinforced Carrier Light Purple .25) .130 (3.004 (.1) . Vac/mil (ASTM D149) Hardness.010 (.0 –55 to +150 >300 <30 2. (These materials are also offered in 100 foot [30 m} rolls.3 V-1 (min.18) 2. but availability is limited to flat sheets.007 (.25) 2.040 (1.07 MPa) (Modified ASTM D5470) Thermal Conductivity.040 (1.2 (7.6) .130 (3. these materials can be provided die-cut to customer specification.0 0.7) A174 Aluminum Oxide Filled Silicone on Aluminum Foil Carrier Light Purple .0) . (45 x 45 cm). 3. ± inch (mm) Thermal Impedance 1.070 in. These products have been designed into numerous applications.8) (16.1) .0 (12.1) . Performance properties are similar to those of the 274 Series materials.100 (2.2 2. Figure 1b THERM-A-GAP F174 (.9 (11.51) .3) .007 (.6 3.1) (18.002 (.0 (64) F174 Aluminum Oxide Filled Silicone with Interior Fiberglass Mesh Light Purple .THERM-A-GAPTM Highly Conformable.8) .070 (1.8 (16.3 2. inch (mm) .05) 1.010 (.9) .3 °C-in2/W @ 10 psi (8.100 (2.) TYPICAL PROPERTIES Composition Color Thickness.6) (14.4 (15.010 (.010 (.200 (5.8) .25) . including laptop computers and automotive electronics packages.5) .1) .8) (19. Pressure-sensitive adhesive is standard on A174 and T174.18) 1.3 V-0 (min.010 (. (23 x 23 cm) and 18 x18 in. Standard sheet sizes are 9 x 9 in. Shore A (ASTM D2240) Specific Gravity (ASTM D792) Flammability Rating (UL 94 – File No.1 (7.3 HB Not Applicable Not Applicable Typical Compression/Deflection Characteristics Figure 1a THERM-A-GAP T174 and A174 (.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals October1999 41 . Standard thicknesses for each of these materials are shown in the table below. A174 AND F174 MATERIALS Most Economical – Moderate Performance The 174 Series materials are ideal for highvolume.160 (4.1) 1.010 (.100 (2.10) .3) (5.1) .020 (.1 (13.007 (.0 –55 to +200 >300 <15 2. thickness. W/m-K @ 10 psi initial pressure (Modified ASTM D5470) Operating Temperature Range. Thermally Conductive Gap Fillers continued THERM-A-GAPTM T174.004 (.5 2.5 mm) 12 (345) 6 months 1.10) 1.) Material 70 MECHANICAL ELEC.070 (1.2) (14.25) 2.) Material 350 Compressive Force (psi) Compressive Force (psi) 300 250 200 150 100 50 0 0 10 20 Deflection (%) 30 40 56 42 28 14 0 0 8 16 24 Deflection (%) 32 40 US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www.25) 2.3 (14.5) .002 (.8 2.0 mm) 16 (454) 12 months 1. thickness.010 (.040 (1.020 (.8) .chomerics. 3. while the F174 material is inherently self-adhering.°C Dielectric Strength.25) .25) .5 (9.8) 2.200 (5. oz/in (gm/in) (PSTC-1) Adhesive Shelf Life THERMAL 1.070 (1.004 (.0 –55 to +200 Not Applicable <15 2.0) .010 (.5) CONSTRUCTION Thickness Tolerance.160 (4.8) .3) .10) 1. Batch.51) .25) . cost-sensitive applications that do not require the interface material to possess a special profile.25) .010 (.4) (°C-cm2/W @ 0.0) .

25) 4.°C Dielectric Strength.160 (4.010 (.200 (5.9 (12.3) .0) .8) 0.020 (. Pressuresensitive adhesive is standard on both A274 and T274.010 (.1) 2.070 . avionics packages.8) RIBBED 3. Standard sheet sizes for flat materials are 9 x 9 in.6 (15. and the ability to be molded into virtually any shape or special profile.3 (14.1) . Standard thicknesses for each material are shown in the table below.6) 4. For ribbed materials. (20 x 20 cm).040 (1. inch (mm) Thickness Tolerance.200 (5.2 (27.010 .1 (13. (23 x 23 cm) and 18 x 18 in.5) (3.chomerics.100 .5) (3. Typical Compression/Deflection Characteristics Figure 2a 30 THERM-A-GAP T274 or A274 Material Compressive Force (psi) 25 20 15 10 5 0 Thickness: 4 .6 (29.8 (20.130 (1.0 V-0 16 (454) 12 months .25) FLAT 2.1 (26.200 20 42 October1999 US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www.8) enabled these materials to meet extremely challenging performance requirements.7) .5 (29.9 –50 to +200 >300 <15 2.3) . Thermally Conductive Gap Fillers continued THERM-A-GAPTM T274 AND A274 MATERIALS Moderate Performance.0 (12.1 3.040 (1. they have been designed into applications as divergent as cellular phone infrastructure equipment.3) Green/Aluminum .010 .010 (.8) (16.007 .4) 4.7) . Vac/mil (ASTM D149) Hardness. E140244) Adhesive Peel Strength.010 (.10) 1.10) 1.4 (28.25) 4. A274 Aluminum Oxide Filled Silicone on Aluminum Foil Carrier .2 (20.1) . the widely used 274 Series offers good thermal performance.6) RIBBED 4.18) 2. Shore A (ASTM D2240) Specific Gravity (ASTM D792) Flammability Rating (UL 94 – File No.25) FLAT 2.8) (2.8) 3. ± inch (mm) Thermal Impedance °C-in 2/W @ 10 psi (°C-cm2/W @ 0. automotive electronics. a choice of standard flat or ribbed profiles. Ribbed Profile Option.100 .010 (.0) 2.1) .25) 3.0) (24.18) (.004 (.2 (20.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals .1) .070 (1.05) 0. such as efficient cooling of multi-processor workstations. oz/in (gm/in) (PSTC-1) Adhesive Shelf Life NA MECHANICAL ELEC.5) 0.3 (27.1) .1 2.25) (.5) 2.0) 4.007 (. (46 x 46 cm). and advanced HPLC instrumentation systems.3) 1.5) (14.07 MPa) (Modified ASTM D5470) Thermal Conductivity.160 (4.4) CONSTRUCTION THERMAL Composition Color Thickness.130 (2.3 2.6 (10.9 (5. Custom Molded Shapes The “original” THERM-A-GAP materials.25) 3. Batch.040 8 12 Deflection (%) 16 .4 (15.0 (25.2 V-0 12 (345) 6 months .5) (16.002 (.25) (.5) Blue/Green . Special profiles have TYPICAL PROPERTIES T274 Aluminum Oxide Filled Silicone on Fiberglass Reinforced Carrier .0) .010 (.9) . the standard sheet size is 8 x 8 in.004 (. Both materials can be provided in non-standard sheet sizes or die-cut to customer specification.51) .8) .4 2.7 (11.4) 4. W/m-K @ 10 psi initial pressure (Modified ASTM D5470) Operating Temperature Range.GAP FILLERS THERM-A-GAP™ Highly Conformable.5 (13. Used as PCB “blankets” or in elaborate molded configurations.9 –50 to +200 Not Applicable <15 2.0 (19.

18) 1.1) .3 (8.05) 2.7) 2.010 (.6 (3.THERM-A-GAP™ Highly Conformable.010 (.130 in. (23 x 23 cm) and 18 x 18 in. coated onto a 5-mil (.7 V1 for Thickness > 0.1) .1) .004 (.0) .040 in.002 (. Thermally Conductive Gap Fillers continued THERM-A-GAPTM A574 AND F574 MATERIALS Superior Performance – Highly Conformable The 574 Series materials provide superior thermal performance and are softer than the other THERM-A-GAP materials.160 .130 32 40 .020 (.010 (.5) 0.100 Thickness: 16 24 Deflection (%) . while the F574 material is inherently self-adhering.chomerics. E140244) Adhesive Peel Strength oz/in (gm/in) (PSTC-1) Adhesive Shelf Life .200 Thickness: Deflection (%) US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www. A574 material consists of an extremely soft silicone elastomer loaded with ceramic particles.25) 0.5 HB Not Applicable Not Applicable These products contain migratory silicone compounds.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals October1999 43 .200 (5.3) CONSTRUCTION Composition Color Thickness.040 (1. video chips and power devices.070 100 80 60 40 20 0 0 10 .26 (14. W/m-K @ 10 psi (Modified ASTM D5470) Operating Temperature Range.040 20 30 .070 (1.040 .2) . Vac/mil (ASTM D149) Hardness.10) .010 (.070 40 50 . Contact Chomerics for information concerning custom sheet dimensions or rolls.34 (15.007 (.070 (1.127 mm) aluminum carrier. Standard sheets are 9 x 9 in.100 .73 (11.4) 1.25) 2. °C-in2/W @ 10 psi (°C-cm2/W @ 0.8) .4 -55 TO +200 >200 <2 100 1. mm Specific Gravity (ASTM D792) Flammability Rating.160(4.10) 1.100 (2.6 (10.07 MPa) (Modified ASTM D5470) Thermal Conductivity. ± inch (mm) Thermal Impedance.6 –55 to +200 Not Applicable <5 1.100 (2.010 (.25) .°C Dielectric Strength. F574 Ceramic-Filled-Silicone with Interior Fiberglass Mesh Light Gray .130 (3.3) .25) 1. 16 (454) 12 months 1.004 (. Both sizes are offered in standard and custom die-cut configurations.86 (18.8) . drawing away and transferring heat from components such as microprocessors. elastic nature allows them to blanket highly uneven surfaces.18) . (UL 94 – File No.040 (1. Shore A (ASTM D2240) Penetration (150 g). Typical Compression/ Deflection Characteristics Figure 3a 25 THERM-A-GAP A574 Material Figure 3b 120 THERM-A-GAP F574 Material Compressive Force (psi) Compressive Force (psi) 20 15 10 5 0 0 8 . MECHANICAL ELEC. (46 x 46 cm).25) .007 ( .6) consists of a ceramic blend filling a fiberglass mesh carrier. Standard thicknesses for each material are shown in the table below. Batch.9 (5.8) 1.1) .5) . inch (mm) Thickness Tolerance.81 (11.9) THERMAL 1. The F574 material TYPICAL PROPERTIES A574 Ceramic-Filled-Silicone Elastomer on 5 mil Aluminum Carrier Light Gray . V0 for Thickness > 0. Their flexible.51) .0) .5) .10 (7. Pressure-sensitive adhesive is standard on A574.

........ .................. .... .. ................ ........... . .......com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals ........ ........... ........... ...... .... ............... such as surface mount devices..... .. ... ........... ............................ ............... ......chomerics........ ... . .................135" Thick THERM-A-GAP Pad (Ribbed Profile) ........070 8 12 16 Ribbed . Reinforced Layer 3-mil Aluminum Foil Tape Molded THERM-A-GAP Pad PCB ..... ...... ........... Microwave Cellular Unit Top Cover Uncooled PCB Side View Laptop Computer THERM-A-GAP Pad Profiled ..................... ......... Molded THERM-A-GAP Pad Plastic Quad Flat Pack (PQFP) .... .............................GAP FILLERS THERM-A-GAP™ Highly Conformable....... ...... .050".......... ......... ..100" ............................ . ......... replacing liquid-filled “bags............. .. ........................... ...... .. .......... ... ........ Used to fill gap between the case and surface mounted D-Pak transistors in an automotive engine control unit. Figure 4 Comparison of Compression/Deflection Characteristics of Ribbed Profile vs Flat Profile of THERM-A-GAP T274 Material 30 Compressive Force (psi) 25 20 15 10 5 0 4 Flat ................. ......... .. .... Thermally Conductive Gap Fillers continued TYPICAL APPLICATIONS FOR THERM-A-GAP MATERIALS Shown below are just a few of the extensive and varied ways in which THERM-A-GAP materials have solved difficult heat transfer problems. .. ..” Used to dampen vibration in addition to cooling PCBs in an electronic monitoring device for oil drill bits.. . ....... ... ......... PCB with Hot Components on Bottom Case Custom Fit on PQFPs .... ...... a ribbed profile is offered as a standard option on THERM-A-GAP 274 Series materials...... ...... Used to fill numerous gaps of various heights between surface mounted memory and logic devices on an outdoor microwave cellular unit... ............. .... ... Used as an electrically isolating PCB “blanket” in a laptop computer to handle heat dissipation on a PC board in which components were operating at up to 40°C over design limits............................. .... ......... ............................... . ........ ........ .... ....... ............. ......... ................ .......... ........... ...... ..... ............... .. ..... . ........ ..... .. ....040" THERM-A-GAP Pad ............................. .................... ... .. ....... . ...................... ... ........ ............................ ....... .......135" ...... ................................. . THERM-A-GAP Pad W/Center Reinforcing PC Board Chiller Plate Automotive Engine Control Unit THERM-A-GAP Pad Memory Circuit Card Circular Cross Section of Electronic Monitoring Equipment THERM-AGAP Pad Foil Tape Metal Rail Used for cost-effective heat transfer from multiple memory chips on a circuit card to a water-cooled chiller plate......... Ribbing reduces the amount of compressive force needed for certain applications................ RIBBED PROFILE Designed for extremely low closure force applications To promote greater design flexibility....... .....040" THERM-A-GAP Pad THERM-A-GAP Pad Profiled . ............. ........ . ............ ..... .................................................. conducting heat to a cast finned case.... ...... . .............. Among the applications which have benefited from specifying THERM-A-GAP materials in a ribbed profile are: I laptop computer processors I automotive engine management control systems I cooling of large PC boards in telecommunications switching gear Rib dimensions for standard thicknesses are provided in the Ordering Information section on the rear page. ........ .070 20 Deflection (%) Thickness: 44 October1999 US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www............. ... ...................... ...... ..... ...... .................. . ..................100" Thick Cast Case Acting as Heat Sink ........ ........ .... .... .....

(1. (160 mil) in. (230 x 230 mm) and 18 x 18 in. ORDERING INFORMATION THERM-A-GAP T174 and T274 materials are available in the following standard thicknesses. x 8 in.200 in. Voltage Breakdown As measured according to ASTM D149. Thermally Conductive Gap Fillers continued DISCUSSION OF TYPICAL PROPERTIES Thermal Impedance Thermal impedance is measured according to ASTM D5470. (70 mil) in.062 (1. A274 material is offered flat or ribbed. x 18 in. (1. US Headquarters TEL: 781-935-4850 FAX: 781-933-4318 • www.062 (1.02 mm) . The lower the thermal impedance. (Contact Chomerics Applications Engineering to review your requirements. (3.54 mm) .) All materials are offered in standard and custom die-cut configurations.062 (1. = . (3.025 mm Sheet Size Flat Sheet Ribbed Sheet Y072 Y073 Y074 Y075 Y076 Y077 = = = = = = 8 8 8 8 8 8 0909 = 9 in. (1.130 in. 1818 = 18 in. A274 and A574 materials are available in the following standard thicknesses.070 in.17) . (5.125 (3.100 in. (1. (274 Series Only) (thickness) in.062 (1.125 (3. It is important to understand that voltage breakdown as determined by ASTM D149 is an average value of a number of test specimens. (130 mil) in. THERM-A-GAP materials can be deflected up to 40% depending on thickness.com Europe TEL: +(44) 1628 404000 FAX: +(44) 1628 404090 Asia Pacific TEL: +(852) 2 423 8008 FAX: +(852) 2 423 8253 Seals October1999 45 .08 mm) THERM-A-GAP F174 and F574 materials are available in four standard thicknesses shown here. Contact Chomerics for information concerning custom sheet dimensions or rolls. x 8 in. x 8 in.30) Y076 . Thermal impedance is a measure of the temperature change in a unit area per watt of power dissipated. Individual specimen values can range above and below the values noted in the Tables. (. flatness and smoothness of mating surfaces.125 (3.7 MPa). (1.78) Y074 . Standard sheet sizes for 174. (. (5.30 mm) . (1.57) .160 in.508 mm) flat only .THERM-A-GAP™ Highly Conformable.160 (4.17) . .17) . (4.040 in.06 mm) . (2.30 mm) . Compression / Deflection Compression/deflection is a measure of material deflection when a given compressive load is applied in the Z axis.787) . (46 x 46 cm). The plates deflect the material at a rate of 10% of initial thickness per minute.54) Y075 .031 (.160 in.17) .54 mm) . x 8 in. (0. SHEET STOCK ORDERING PART NUMBERS 62 – XX – YYYY – ZZZZ Sheet Stock Thickness in mils* 02= 20 mils † 04= 40 mils 07= 70 mils 10= 100 mils 13= 130 mils 16= 160 mils 20= 200 mils * 1 mil = . (2.040 (1.040 in.06) Y077 . and conformability of the interface material. x 9 in.78 mm) .070 in.062 (1. A C B A B C RIB DIMENSIONS. (2.78 mm) .02 mm) .508 mm) .062 (1. .78 mm) .06 mm) . as well as custom thicknesses.100 (2. .57) .070 (1.57) .070 in.02 mm) .020 in.020 in. mounting pressure. diameter metal plates.001 in.200 (5.chomerics. The test is conducted with 1in2 circular disks of material located between two 5in. voltage breakdown is defined as the voltage required to break down or cause a short in the insulating material under test.08) * See table above for complete P/N. 274 (flat) and 574 Series materials are 9 x 9 in. x 8 in. A574 material is unavailable in .508 mm) thickness. (200 mil) Material T174 A174 F174 T274 A274 A574 F574 † Not available in T174. Deflection is expressed as a percentage of initial thickness.54 mm) THERM-A-GAP materials can be produced in custom thicknesses.08 mm) THERM-A-GAP A174.02) Y073 . (4. (40 mil) in. T274 material is offered flat or ribbed. the better the heat transfer of the medium. or the better the thermal performance.125 (3.57) . Several parameters dictate the heat transfer across an interface: thickness and thermal conductivity of the interface material. T274 and A574 material.57) .031 (.200 in.130 in. x 8 in. At pressures up to 100 psi (. (100 mil) in.100 in.787) .100 in. inch (mm) 274 Series Only * Y072 .130 (3.020 in.57) .040 in.

Bucks./min Speed = 0. psi Speed = 2.chomerics. UK TEL +(44) 1628 404000 FAX +(44) 1628 404090 Asia Pacific • Hong Kong TEL +(852) 2 428 8008 FAX +(852) 2 423 8253 South America• São Paulo. This unique material is ideal for applications where typical gap filling pads cause too much stress on component solder joints and leads. T630 is a highly conformable. Medium and High Compression (Strain) Rates 12 10 8 Load.Leader in EMI Shielding and Thermal Management Preliminary Product Information THERM-A-GAP™ T630 Thermally Conductive Form-in-Place Gap Filler DESCRIPTION THERM-A-GAP T630 is Chomerics’ latest development in thermally conductive gap fillers. This viscoelastic paste is a form stable. one component pre-cured silicone that can be dispensed to fill large and uneven gaps in electronics assemblies.025 in. THERM-A-GAP T630G contains 0. Woburn./min 6 Speed = 0. Both products have low extractable silicone levels and pass the Bellcore silicone extractable specification for the telecom industry. used for a compression stop for applications requiring electrical isolation. MA 01888-4014 TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 Europe• Marlow.5 in.010” Ø Low extractable silicone levels Ø Form stable Ø No filler settling issues T630 Compression Deflection Characteristics at Low. Brazil TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817 ./min 4 2 0 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% % Deflected www.010” glass beads. FEATURES Ø Requires no curing Ø Highly conformable at low pressures Ø Dispensable for any gap size > 0. resulting in damage to the printed circuit board. fully cured silicone material that takes little to no compressive force to deform during assembly.25 in.com North America• 77 Dragon Court.

However. UK TEL +(44) 1628 404000 FAX +(44) 1628 404090 Asia Pacific • Hong Kong TEL +(852) 2 428 8008 FAX +(852) 2 423 8253 South America• São Paulo. Test Method Visual -ASTM D5470 (modified) -ASTM C165 (modified) ASTM D792 ASTM D6375 (modified) UL94. The ease of application of this material is also ideal for rework and field repair situations.010” (0. Typical Properties Color Composition Thermal Conductivity. °C Compression/ Deflection Characteristics 50% Deflection Specific Gravity TGA Weight Loss. nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use. T630G White Ceramic Filled Silicone with 0. Apply pressure to the back of the cartridge. Bucks. of fitness for a particular purpose or otherwise. and except to the extent otherwise stated on Chomerics’ invoice. 0.7 -50 to 150 1 psi 2.25mm) glass beads 0. Refer to our Applications Note for more detailed information about using this material. dispense the desired amount onto the component.2% V0 10cc/min 6% 1000 1 X 10 14 18 mos.com North America• 77 Dragon Court. We disclaim any and all liability incurred in connection with the use of information contained herein. and swipe the tip along the component to break the bead of material. except that this product shall be of standard quality. MA 01888-4014 TEL +(1) 781-935-4850 FAX +(1) 781-933-4318 Europe• Marlow. stores at room temperature and has no filler settling issues.chomerics. Excess material can be wiped up with a rag. or order acknowledgement.25 0. and ship your product.2% V0 10cc/min 6% 1000 1 X 10 14 18 mos. since the varied conditions of potential use are beyond our control. Furthermore. all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. W/m-K Operating Temperature Range. Vac/mil @ 10mil Volume Resistivity.130 inch orifice at 90 psi. File E140244 -Telcordia GR78-CORE ASTM D149 ASTM D257 -- *30cc taper tip syringe. T630 requires no refrigeration.THERM-A-GAP™ T630 Thermally Conductive Form-in-Place Gap Filler APPLICATION T630 and T630G are supplied in 30cc and 300cc aluminum cartridges. simply dispense the gap filling material onto the component. 150 °C Flammability Rating Flow Rate* Extractable Silicones Dielectric Strength. Woburn. T630 White Ceramic Filled Silicone 0.25 0. quotation.7 -50 to 150 1 psi 2. Brazil TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817 NOTICE: The information contained herein is to the best of our knowledge true and accurate. or otherwise. www. All risks of such are assumed by the user. No mixing or cure cycles are required. ohm-cm Shelf Life @ Room Temp. HANDLING To use. This product is sold without warranty either expressed or implied. . assemble and secure the heat sink or chassis in place. 24 hours.