1.0 Chapter 01 (: Introduction)

FINAL PROJECT REPORT December 15, 2012
1.0 Chapter 01 (Introduction)

The components inside your PC generate heat. Your standard heat-sink-and-fan combo is usually sufficient for the average user. The term "liquid cooled" sounds automotive oriented; liquid cooling has been an integral part of the common gasoline engine. Why liquid cooling is needed for Pc and server cooling. To find out, we must compare air-cooling to liquid cooling. When comparing the effectiveness of cooling methods, there are two properties that matter the most: thermal conductivity and specific heat capacity. Thermal conductivity is a physical property that describes how well a substance transfers heat. The thermal conductivity of liquid water is about 25 times that of air. Obviously, this gives liquid cooling a huge advantage over air-cooling because liquid cooling allows for a much faster transfer of heat. Specific heat capacity is the other important physical property, which refers to the amount of energy it takes to heat a substance by one degree. The specific heat capacity of liquid water is about four times that of air, which means it takes four times the amount of energy to heat water than it does to heat air. Once again, water's ability to soak up much more heat energy without increasing its own temperature is a great advantage over air-cooling. Therefore this researched property of water has made it the suitable working fluid in liquid cooling system in Pc and servers to eradicate heat and to avoid heating problems.
Figure 1: typical liquid cooled cpu
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2.0 Chapter 02 (Literature Review)

2.1 Designing water cooling system
The design of the water cooling system that is suitable for PC and servers, both tasks will take some time and effort every first time, walk through the details and help you avoid the mistakes that would take the greatest toll on your system.
(www.maximumpc.com) 2.2 Pc liquid cooling system The components inside PC and Servers generate heat. Standard heat sink and fan combo is usually sufficient for the average user, but for tougher components,. If you want more than the clock of your PC to the bleeding edge, you want to build a liquid-cooling system for your PC to ensure that your precious components do not burn out. (www.pcworld.com) 2.3 Thermal effects of Processor Average store-bought PC uses a system of fans to heat subtracting major components such as the CPU (central processing unit), graphics processor and hard disks. Then, the hot air blown to the rear of the machine. That works fine for most computers do most jobs. But it is not always ideal, and it does nothing to impress your friends. The other option is to dissipate heat water cooling or rather, liquid cooling, using a combination of distilled water and propylene glycol is piped through the guts of the machine. Installing a liquid cooling system is not that difficult, but it can be intimidating. Who can really take advantage of this hot-rod project? Mainly, computer users who like to overclock their PCs and run them hard for gaming applications, video processing, sequencing the DNA of Amazonian tree frogs, and the like. Such people often work their processors in a heated rage, so that the fans continue to work - and noisy. (www.popularmechanics)
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3.0 Chapter 03 (Conceptualization & Research Methodology)

3.1 Problem Identification and Problem Formulation Reduction in processing due to heating:CPU overheating can lead to computer crashes, reboots and possible damage to your processor or other hardware components. A high CPU temperature can suggest a number of problems, ranging from hardware issues to malicious software. Decreasing product life:At elevated temperatures a silicon device can fail catastrophically, but even if it doesn't, its electrical characteristics frequently undergo intermittent or permanent changes. Manufacturers of processors and other computer components specify a maximum operating temperature for their products. Most devices are not certified to function properly beyond 50C-80C (122F-176F). However, in a loaded PC with standard cooling, operating temperatures can easily exceed the limits. Noise created by the air flow fans:The fans connected to the pc normally rotate at normal Rpm but as the heat increases during the run time of the pc the fan speed increases and that causes noise.
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FINAL PROJECT REPORT December 15, 2012 3.2 Objective of Study 1. provide proper cooling system for Pc and Servers:One of the advantages of most liquid cooling systems is that they are expandable and can cool more components than the CPU alone. Even after passing through the CPU's cooling block, the liquid coolant is still able to cool other components such as the motherboard's chipset and VGA card. While these are the basics, it's possible to add even more components to the system if desired, such as a hard drive cooling system. Every component to be cooled simply requires its own cooling block, and perhaps a little planning to make sure the coolant flows well. 2. Reducing the noise levels:Liquid cooling is a much more efficient system at drawing heat away from the processor and outside of the system. This allows for higher clock speeds in the processor as the ambient temperatures of the CPU core are still within the manufacturer's specifications. This is the prime reason why extreme over clockers tend to favor the use of liquid cooling solutions for their processors. 3. A suitable cooling system in different environments:water cooling system is not suitable for different kind of environment because if water cooled in a cold environment the processing and other components might stop working this issue is solved by using a temperature controlled chiller, the chiller does not operate in cold temperature but it will automatically switched on by the temperature controller if heat in the environment increases this then cools the heated liquid.
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FINAL PROJECT REPORT December 15, 2012 3.3 Scope of Study Temperature control of flow based system: The system has been incorporated with a temperature sensor which detect the temperature rise inside the pc system casing using pic micro controller which detects the temperature rise inside and switches on the chiller which in turn it cools the water flowing through it and subsequently the chiller will be switched off if the there is a decrease in the system temperature according to the target temperature of below 650celsius. These sensors use a solid-state technique to determine the temperature. That is to say, they don't use mercury (like old thermometers), bimetallic strips (like in some home thermometers or stoves), nor do they use thermistors (temperature sensitive resistors). Instead, they use the fact as temperature increases, the voltage across a diode increases at a known rate. (Technically, this is actually the voltage drop between the base and emitter - the Vbe - of a transistor. By precisely amplifying the voltage change, it is easy to generate an analog signal that is directly proportional to temperature. There have been some improvements on the technique but, essentially that is how temperature is measured. Because these sensors have no moving parts, they are precise, never wear out, don't need calibration, work under many environmental conditions, and are consistent between sensors and readings. Moreover they are very inexpensive and quite easy to use.
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Figure 2: analog voltage out
Lay out of all of the components of a water-cooling system they are listed below. 1. CPU water block (piece that directly cools the processor) 2. Pump 3. Radiator 4. Tubing 5. Coolant additives 6. Reservoir / T-Line 7. Fans 8. Hose clamps and other miscellaneous hardware The main components of water cooling: 1. The CPU Water block:
Depending on which you choose you can gain up to 10 degrees centigrade (temperature drop) from a poorly designed block to an efficiently designed one. The difference is not usually to such extremes, but these variations do exist. There are two basic designs used for water blocks today. One method is called impingement and the other method doesnt really have a defined name. The fundamental difference between the two is that impingement needs a powerful pump to get good performance, and non-impingement blocks are capable of good performance without a powerful pump. Well the impingement blocks do perform better when fitted with a powerful enough pump.
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Impingent = highest performance but needs a strong pump to get there (Example Here (Swiftech Storm): Outside Picture, Impingement Cups Impingement Jets) Non-Impingement = good performance without much pump requirements (Example Here: Internal picture) 2. The Pump:
The pump is also a very large determining factor in the performance of the cooling system. Getting good flow in the system is essential for the components to function properly and efficiently. There is a wide variety of pumps on the market for different tubing sizing and system requirements. Here I will show you the basic types of pumps and the differences between them. The head pressure is the amount of water that the pump can push in a vertical column. This with a jet shot straight up in the air and the height of it measured. 3. Radiator / Fans The radiator is an essential part of a water-cooling system, as it removes the heat in the water deposited form the water blocks and the pump. Without it the system would overheat in a matter of seconds. Radiators come in many different shapes and sizes. Some are better than others, but it all depends on application and the fans chosen. There are two types of radiators that are commonly used in water-cooling setups. The first are the purpose built radiators that are designed to accommodate 120mm fans (some also use 80mm fans) and have different types of hose barbs for a myriad of applications. The second are heater cores. Heater cores are the heating elements used in car heating systems.
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FINAL PROJECT REPORT December 15, 2012 4. Tubing Tubing is what connects each component together no specific tubing is required, and it comes in multiple shapes and colors. For perfect fitting inner diameter (ID) and outer diameter (OD) are compatible with the inner diameter and outer diameter of the fittings.
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FINAL PROJECT REPORT December 15, 2012 3.4 Deionized Water Deionized water is water that has had its ions removed, including sodium, calcium, iron, copper, chloride, and bromide. The deionization process removes harmful minerals, salts, and other impurities that can cause corrosion or scale formation. Compared to tap water and most fluids, deionized water has a high resistivity. Deionized water is an excellent insulator, which is why it is used in the manufacturing of electrical components where parts must be electrically isolated. Deionized water with pH at approximately 7.0 but will quickly become acidic when exposed to air. The carbon dioxide in air will dissolve in the water, introducing ions and giving an acidic pH of around 5.0. Therefore, when using water that is virtually pure, it is necessary to use a corrosion inhibitor. When using deionized water in a recirculating chiller, special high purity plumbing is needed. The fittings should be nickel-plated and the evaporators should be nickelbrazed. When using deionized water in cold plates or heat exchangers, stainless steel tubing is recommended.
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FINAL PROJECT REPORT December 15, 2012 3.5 Chiller There are two basic types of aquarium chiller. The first is located next to the tank and an external probe is placed inside the aquarium. This probe has the coolant gas passing through it to cool the surrounding water.
The second is plumbed into the aquarium filter hoses and water from the filter passes through the unit back to the tank. These chillers work in a similar way to the domestic refrigerator. Refrigerant gas is compressed and heats up as it is pressurized. As it passes through a radiator grill at the back of the unit the heat is radiated into the room. As the gas cools it is then passed through an expansion valve. The gas expands and becomes cooler still due to the pressure drop. The cold gas is passed through coils, either inside the unit or in the external probe, where it absorbs the heat from the aquarium water surrounding them. The cycle of gas circulation is then repeated.
Figure 3: DIY aquarium chiller
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FINAL PROJECT REPORT December 15, 2012 3.6 Power system PC Power and Cooling has several power supply models The ultra-quiet, high performance Silencer brand of power supply units is available in 360 watt, 470 watt, and 610 watt and 750 watt varieties. The 360 watt and 470 watt versions are also offered in Dell compatible models. PC Power and Cooling also offers a maximum performance line of power supplies, the TurboCool units, which are available in 850 watt, 1000 watt, and 1200 watt versions. A notable feature of PC Power and Cooling units is that their units use a lone, high-current +12 V rail for DC output to the rest of the system, as opposed to multiple lower current rails that run in parallel. This single-rail configuration is reminiscent of high-end power supplies in the early to mid-2000, before an industry shift towards using split +12V rails for reliability, stability, and economical reasons. The shift towards multi-rail power supplies can be seen as when new tech such as the Pentium4 or Athlon64 platforms, along with the introduction of GPU's which required more power than the AGP/PCIe slot could provide, more and more power was needed for that progression. When given a dedicated +12V rail for exclusive use by the GPU, and another dedicated rail for the rest of the system, the increased power demand was met while maintaining a simple design, ideal for (continued) mass production and cost control for a more complex unit.
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4.0 Chapter 04 (Data presentation & Analysis)

The equivalent ton on the cooling tower side actually rejects about 15,000 Btu/h due to the heatequivalent of the energy needed to drive the chiller's compressor. This equivalent ton is defined as the heat rejection in cooling (1,500 pound/hour) of water 10F, which amounts to 15,000 Btu/hour, or a chiller coefficient-of-performance (COP) of 4.0 - a COP equivalent to an energy efficiency ratio (EER) of 13.65. 4.1 Heat Load and Water Flow A water systems heat load in Btu/h can be simplified to: h = cp q dt = (1 Btu/lbm oF) (8.33 lbm/gal) q (60 min/h) dt = 500 q dt (1)
(www.engineeringtoolbox.com) Where h = heat load (Btu/h) cp = 1 (Btu/lbm oF) for water = 8.33 (lbm/gal) for water q = water volume flow rate (gal/min) dt = temperature difference (oF) The sensible heat in a heating or cooling process of air (heating or cooling capacity) can be expressed as hs = 1.08 q dt Where hs = sensible heat (Btu/hr) q = air volume flow (cfm, cubic feet per minute) (1)
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FINAL PROJECT REPORT December 15, 2012 dt = temperature difference (oF) 4.2 Latent Heat The latent heat due to moisture in the air can be expressed as: hl = 0.68 q dwgr or hl = 4,840 q dwlb Where hl= latent heat (Btu/hr) q = air volume flow (cfm, cubic feet per minute) dwgr = humidity ratio difference (grains water/lb dry air) dwlb = humidity ratio difference (lb water/lb dry air) 1 grain = 0.000143 lb = 0.0648 g 4.3 Total Heat - Latent and Sensible Heat Total heat due to both temperature and moisture can be expressed as: ht = 4.5 q dh Where ht= total heat (Btu/hr) q = air volume flow (cfm, cubic feet per minute) dh = enthalpy difference (btu/lb dry air) Total heat can also be expressed as: ht = hs + hl = 1.08 q dt + 0.68 q dwgr Q = mc (T-Ti) (2) (5) (4) (3) (2)
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FINAL PROJECT REPORT December 15, 2012 Where Q = Heat in btus m = mass in pounds c = specific heat in btus/lb/F T = Temperature of the substance after the heat is added. Ti = Initial temperature of the substance in F H = dQ/dt = A (Thot-Tcold)/R Substitute T for Thot because that will be changing as the water cools, and substitute TA for Tcold because A stands for the ambient air temperature outside the insulation. dQ = (A(T-TA)/R) dt Restating equation (2) using differentials: dQ = mc dT We can now equate the two dQ's, but we have to be careful because one is stated as a positive and the other is really a negative, so we have to include a negative sign on one side: mc dT = -(A(T-TA)/R) dt Rearranging: dT/(T-TA) = -(A/(mcR)) dt Taking the indefinite integral of both sides yields: ln(T-TA) = -(A/(mcR))t + C Where C is the constant of integration. Using each side as the exponent of e: T-TA = C'e-(A/(mcR))t Where C' is actually a different constant: C' = eC So
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FINAL PROJECT REPORT December 15, 2012 T (t) = TA + C'e-(A/ (mcR)) t We can solve for C' by setting t=0: T (0) = TA + C' C' = T (0) - TA But T (0) is actually the initial hot water temperature, call it TH So C' = (TH - TA)
Finally: T (t) = TA + (TH - TA) e-(A/ (mcR)) t 4.4 Cost analysis

Table 1: cost analysis
Components Tubing Reservoir Copper Block Machining Chiller Pump
Allocated Cost 2,000Rs 500Rs 4,000Rs 3,000Rs 3,000Rs 15,00Rs 14,000Rs
Actual cost 1,850Rs 850Rs 3,250Rs 3,000Rs 2,500Rs 960Rs 12,410Rs
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FINAL PROJECT REPORT December 15, 2012 4.5 Hardware and software design control system System Overview for Microcontroller Most of the structures are made using the microcontroller. In this series, I would like to share the microcontroller PIC 16F873A, features, description and diagram PIN so on. Features High-performance RISC CPU All single cycle instructions except for program branches which are 2 cycle Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle Up to 4K x 14 words of Flash Program Memory, Up to 128 x 8 bytes of EEPROM data memory Interrupt capability -up to 13 internal/external Eight level deep hardware stack Direct, indirect, and relative addressing modes Power-on Reset (POR) Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) Watchdog Timer (WDT) with its own on-chip RC Oscillator for reliable operation Programmable code-protection Power saving SLEEP mode Selectable oscillator options Low-power, high-speed CMOS EPROM/EEPROM technology Fully static design In-Circuit Serial Programming (ICSP) via two pins Only single 5V source needed for programming capability In-Circuit Debugging via two pins Processor read/write access to program memory Wide operating voltage range: 2.5V to 5.5V High Sink/Source Current: 25 mA
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FINAL PROJECT REPORT December 15, 2012 Commercial and Industrial temperature ranges
PIN Diagram:
Figure 4: PIN diagram
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FINAL PROJECT REPORT December 15, 2012 4.6 PIN description
Table 2: PIN description
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FINAL PROJECT REPORT December 15, 2012 All microprocessor systems, regardless of their complexity, based on similar components. These are shown in Figure 1 and consists of the following: CPU - the part that makes all the logic functions and arithmetic RAM - for storing programs and / or program variables ROM - read-only segments of programs I / O - connection to external devices
The CPU or microprocessor is the core component of any microprocessor and external demands components such as ROM, RAM, I / O, etc. to achieve its purpose. A microcontroller is a stripped-down version of the very same architecture, with all major features available in a chip. The microcontroller system requires no additional input circuit, except a watch and may in many cases, regional exits leading directly. The microcontroller will investigate is the PIC16F873A, which is located at the upper end of mid-range series of microcontrollers developed by Microchip Inc. Characterized by a RISC architecture instead of the CISC architecture used, for example, the Motorola 6809. (en.wikipedia.org) 4.7 Architecture of the PIC microcontroller The history of the PIC microcontroller series began in 1965 when General Instruments (GI) formed a part of Microelectronics, and used this section to create some of the first viable EPROM and EEPROM memory architectures. DG also did a 16-bit microprocessor, called the CP1600, in early 1970. Although this was a reasonable microprocessor, was not particularly good at handling I / O. Therefore, about 1975, GI designed a Peripheral Interface Controller (or Futures for short) for writing a very c application where good management I / O needed. Was designed to be very fast, as it was I / O to handle a machine 16-bit, but do not need much of the functionality, so micro coded instruction set was small. The architecture was PIC16C5x essentially the architecture of today. The market for futures remained for a short the coming years. During the 1980's GI restructure their businesses to focus more their main activity, which was a power semiconductor. As a result of restructuring, the GI Microelectronics Division became GI Microelectronics Inc (subsidiary) which, 1985, Nally sold to venture capitalists. The sale includes a manufacturing unit Chandler, Arizona. The new owners decided to focus on
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FINAL PROJECT REPORT December 15, 2012 pictures, serial and parallel -EEPROM and parallel EPROM. The decision was taken later to start a new company, named Arizona Microchip Technology, integrated control with a di erentiator from the rest of industry. Under this strategy, the family Futures redesigned to use one of the other things that the company was good edging , i.e. EPROM. With the addition of CMOS technology and erasable EPROM program memory, PIC family as we know, was born. The range of PIC microcontrollers are RISC processors with a battery (also called the employment record, W), using the architecture Harvard3? Therefore the microcontroller has program memory data bus and the memory data bus. Separate buses means that the simultaneous access program and data can be done, which gives more bandwidth over traditional von Neumann architecture. The separation of program and data memory, allowing instructions to be sized di erently from the 8-bit wide data word. This separation means that the words may be teaching ideal size for writing c CPU / application. This is necessary since RISC architectures require that the instructions are the source and destination operands to be codified into teaching. The Futures op codes for mid-range processors are 14-bits wide, and 14-bit wide bus program produces a directive in a single cycle.
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FINAL PROJECT REPORT December 15, 2012 4.8 Temperature sensor LM 35 The LM35 series are precision integrated-circuit temperature sensors, whose output voltage is linearly proportional to the Celsius (Centigrade) temperature. The LM35 thus has an advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to subtract a large constant voltage from its output to obtain convenient Centigrade scaling. The LM35 does not require any external calibration or trimming to provide typical accuracies of C at room temperature and C over a full -55 to +150C temperature range. Low cost is assured by trimming and calibration at the wafer level. The LM35's low output impedance, linear output, and precise inherent calibration make interfacing to readout or control circuitry especially easy. It can be used with single power supplies, or with plus and minus supplies. As it draws only 60 A from its supply, it has very low self-heating, less than 0.1C in still air. The LM35 is rated to operate over a -55 to +150C temperature range, while the LM35C is rated for a -40 to +110C range (-10 with improved accuracy). The LM35 series is available packaged in hermetic TO-46 transistor packages, while the LM35C, LM35CA, and LM35D are also available in the plastic TO-92 transistor package. The LM35D is also available in an 8-lead surface mount small outline package and a plastic TO-220 package. (www.ti.com) Features Calibrated directly in Celsius (Centigrade) Linear + 10.0 mV/C scale factor 0.5C accuracy guarantee able (at +25C) Rated for full -55 to +150C range Suitable for remote applications Low cost due to wafer-level trimming Operates from 4 to 30 volts Less than 60 A current drain Low self-heating, 0.08C in still air Nonlinearity only C typical Low impedance output, 0.1 [Ohm] for 1 mA load
Figure: 5 1LM35 temp sensor
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Table 3: temperature sensors features LM35 4 Supply Voltage (Min) (V) 30 Supply Voltage (Max) (V) 56 Iq (Typ) (uA) Analog Output Interface Local Sensor Type 10 Sensor Gain (mV/Deg C) 0.5 Local Sensor Accuracy (Max) (+/- C) 0.4 Output Impedance (Ohm) -40 to 110,-55 to 150,0 to 100,0 to 70 Operating Temperature Range (C) 3TO, 3TO-92, 8SOIC Pin/Package 0.56 | 1ku Approx. Price (US$) Military Rating
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Figure 6: connection diagram
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4.9 Specification for temperature controller using PIC16F877A Sample specification for the prototype development A. The prototype should maintain the temperature within 60C to 65C. B. If temperature exceeds 65C then the system should switch ON the Chiller. C. If temperature falls below 60C then the system should switch OFF the Chiller. D. The sensor data as well as the temperature should be displayed on LED Display for every 0.5seconds. Hardware design for temperature controller using PIC16F877A Block diagram
LM 35
LED display
PIC 16F877A Chiller
Figure 7: block diagram of chiller function
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Figure 8: block diagram
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FINAL PROJECT REPORT December 15, 2012 4.10 Software design for temperature controller using PIC16F877A Flowchart Start
Read Temperature
Tem A<65
ADC
LED Display
Tem A>65
ON Chiller
Wait 0.5s
Figure 9: flow chart for temperature controller. ICBT Page 26
FINAL PROJECT REPORT December 15, 2012 4.12 Program
Figure 10: temperature controller program
Figure 11: temperature controller program
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FINAL PROJECT REPORT December 15, 2012 4.13 Build successful
Figure 12: build successful
Figure 13: proto type
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5.0 Chapter 05 (Conclusion & Recommendation)

The most suitable method of cooling system according to design specification and customer requirement is Compact Liquid Cooling System because this system is compatible with most of the micro controllers and Pc components and this cooling system can cool more than two or three Pc components and the effect of corrosion in this flow system is very less.
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6.0 References
Temperature sensor Avalable at : http://www.ti.com/lit/ds/symlink/lm35.pdf(assed on 1st feb 2013). Pic microcontroller Available at: http://en.wikipedia.org(assed on 1st feb 2013). Microprocessor settings Available at: http://www.eng.uwi.tt/depts/elec/staff/feisal/ee25m/resources/ee25m-lect2.pdf (assed on 1st feb 2013). Calculating Cooling Loads Available at: http://www.engineeringtoolbox.com/cooling-loadsd_665.html(assed on 1st feb 2013). POWER SYSTEM Available At http://en.wikipedia.org/wiki/PC_Power_and_Cooling#Power_Supply_Models(assesd on 1st feb 2013). Chiller Available at: http://www.ez-saltwater-aquarium.com(Assed on 1st feb 2013). Tools and technique Available at: http://www.lytron.com/Tools-and-TechnicalReference/Application-Notes/The-Best-Heat-Transfer-Fluids-for-Liquid-Cooling(assed on 1st feb 2013). Radiator and fans Available at:http://www.xtremesystems.org/forums/showthread.php?54331Guide-To-WaterCooling-and-Leak-Testing-ALL-New-WaterCooler-s-Read-BeforePosting!(Assed on 1st feb2013). Water block available at http://www.engineersgarage.com/articles/temperaturesensors?page=2(Assed on 1st feb2013). System reliability Available at http://www.pcpower.com/technology/optemps/(Assed on 1st feb 2013). What is liquid cooling Available at http://compreviews.about.com/od/cpus/a/LiquidCooling.htm(Assed on 1st feb 2013). Operating temperature Available at: http://www.pcpower.com/technology/optemps/(assed on 1st feb 2013). Why My CPU Temperature Is Too High Available at: http://www.ehow.com/facts_7576368_cputemperature-high.html (assed on 1st feb 2013). Guide for water cooling, Available at: http://www.tomshardware.com/reviews/a-beginnersguide-for-watercooling-your-pc,1573.html(assed on 28th Jan 2013).
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FINAL PROJECT REPORT December 15, 2012 Water cooling goes wrong, implementing flow available at:http://www.pcpro.co.uk/blogs/2011/02/03/why-you-should-be-wary-of-water-cooledpcs/(Assessed 22nd august 2012) IBM Research, Hot water cooled super computer available at: http://www.zurich.ibm.com/news/12/superMUC.html(Assessed 22nd august 2012) Water cooling set up, Tubing available at:http://www.overclockers.co.uk/productlist.php?groupid=962(Assessed Designing water cooling system:http://www.maximumpc.com/article/howtos/howto_water_cool_your_pc:(Viewd and Assed on 27/9/2012). Pc liquid cooling system: http://www.pcworld.com/article/227964/pc_liquid_cooling_system_do_it_yourself.html(Viewd and assed on 27/9/2012). Thermal effects of Processor: http://www.popularmechanics.com/technology/how-to/build-pc/4213273(viewd and Assed on 29/9/2012). Water cooling goes wrong, implementing flow available at: http://www.pcpro.co.uk/blogs/2011/02/03/why-you-should-be-wary-of-water-cooledpcs/(Assessed 22nd august 2012) Water cooling set up, Tubing available at:http://www.overclockers.co.uk/productlist.php?groupid=962(Assessed 23rd august 2012)
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7.0 Appendices
MPLAB Programmer
#include <pic.h> #define _XTAL_FREQ 4000000 // ****select variables******* unsigned int count; unsigned int a2d_result; unsigned int value; unsigned char dig1; unsigned char dig2; unsigned char dig3; unsigned char dig_value[10]={0x3F,0x06,0x5B,0x4F,0x66,0x6D,0x7D,0x07,0x7F,0x6F}; double temp; void get_result(); void dis_value(); void b2d_convesion(); void data_out(unsigned char tx_data); void tx_data(); void main(){ // ******A to D conveter pin select******** TRISB=0; PORTC=0; TRISA=0x20; TRISC=0x80; ADCON0= 0B01100001; ICBT // RA5/AN4(7pin) input //RC7 input, RC6 output(Tx & Rx) // Fosc/8, RA5/AN4 input, AD on Page 33 // PORTB output

ADCON1= 0B10001001; & Vss ref) OPTION=0x07; TMR0=0; TXSTA=0x24; SPBRG=25; RCSTA=0x90; //// // Tx enable, BRGH=1(High speed) // 9600bps baud rate (BR=Fosc/16(X+1)) // RX enable, continuous receive // Timer0 on // right justify, RA5/AN4 Pin analog In put (Vdd
***********Timer select********** // Internal clock (Fosc/4) // Prescaler 1:8
TMR1CS=0; T1CKPS1=1; T1CKPS0=1; TMR1H=0x0B;
TMR1L=0xDC;// 3036 load to timer1 (65536-62500=3036)/get 0.5 second count=0; TMR1ON=1; TMR1IF=1; while(1){ get_result(); dis_value(); if(TMR1IF==1){ TMR1H=0x0B; TMR1L=0xDC; count++; if(count==7200){ 7200coont=1hour tx_data(); count=0; } } ICBT Page 34 // send deta to PC //reload timer value // count=count+1 // 2 count=1second because //Timer1 overflow? // Timer1 on

} } void get_result() { if(T0IF==1){ ADGO=1; while(ADGO==1){ } a2d_result=0;//right justify the analog result in 10 bit a2d_result=ADRESH; a2d_result=a2d_result<<8; a2d_result=a2d_result+ADRESL; temp=((double)999/(double)1023)*a2d_result; value=(unsigned int)temp; b2d_convesion(); T0IF=0; } } void b2d_convesion()/ analog result devide to 3 7-segment display { dig1=value/100; value=value%100; dig2=value/10; dig3=value%10; } void dis_value() value on 7 segments { ICBT Page 35 //display the tempreger // get point value // to get real value // call new funtion // wait for cap charge? // A2D coversion start //wait for "GO bit 0"
//ready to get new analog result

PORTA=0; //digits off
PORTB=dig_value[dig1]; RA1=1; RA1=0; //digit1 on //dig1 off __delay_ms(1);
PORTB=dig_value[dig2]; RA2=1; RB7=1; __delay_ms(1); RA2=0; //dig2 off // digit2 on
PORTB=dig_value[dig3]; RA3=1; RA3=0; } void tx_data() { data_out(dig1+0x30); data_out(dig2+0x30); data_out('.'); data_out(dig3+0x30); data_out(' '); data_out('C'); data_out('e'); data_out('l'); data_out('s'); data_out('i'); data_out('u'); data_out('s'); data_out(' '); ICBT Page 36 //display "Celsius" in computer //display temreture value in computer // digit3 on //dig3 off __delay_ms(1);

data_out(' '); } void data_out(unsigned char tx_data) { while(TXIF==0){ //buffer empty? } TXREG=tx_data; } ****************END***************************
ICBT
Page 37
ICBT
Page 38
Water cooling system for Pc and servers

8.0 Time plan for the project
Table 4: time plan Work Selecting Relevant Project title and report submission Identifying problems and Preparing the report Identifying Design Parameters Identifying Conceptual designs Identifying the Optimum operating Conditions Applying relevant Mathematical Modeling Finding relevant Workshop to Manufacture components Finishing Manufacturing and Machining Works Finishing design with Assemble and Testing Evaluation and cost analysis Final project report Final Presentation AUG Months SEP OCT NOV
1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4
ICBT
Page 39

1.0 Chapter 01 (: Introduction)

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FINAL PROJECT REPORT December 15, 2012