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74HC193; 74HCT193

Presettable synchronous 4-bit binary up/down counter


Rev. 03 23 May 2007 Product data sheet

1. General description
The 74HC193 and 74HCT193 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specied in compliance with JEDEC standard no. 7A. The 74HC193 and 74HCT193 are 4-bit synchronous binary up/down counters. Separate up/down clocks, CPU and CPD respectively, simplify operation. The outputs change state synchronously with the LOW-to-HIGH transition of either clock input. If the CPU clock is pulsed while CPD is held HIGH, the device will count up. If the CPD clock is pulsed while CPU is held HIGH, the device will count down. Only one clock input can be held HIGH at any time, or erroneous operation will result. The device can be cleared at any time by the asynchronous master reset input (MR); it may also be loaded in parallel by activating the asynchronous parallel load input (PL). The 74HC193 and 74HCT193 each contain four master-slave JK ip-ops with the necessary steering logic to provide the asynchronous reset, load, and synchronous count up and count down functions. Each ip-op contains JK feedback from slave to master, such that a LOW-to-HIGH transition on the CPD input will decrease the count by one, while a similar transition on the CPU input will advance the count by one. One clock should be held HIGH while counting with the other, otherwise the circuit will either count by twos or not at all, depending on the state of the rst ip-op, which cannot toggle as long as either clock input is LOW. Applications requiring reversible operation must make the reversing decision while the activating clock is HIGH to avoid erroneous counts. The terminal count up (TCU) and terminal count down (TCD) outputs are normally HIGH. When the circuit has reached the maximum count state of 15, the next HIGH-to-LOW transition of CPU will cause TCU to go LOW. TCU will stay LOW until CPU goes HIGH again, duplicating the count up clock. Likewise, the TCD output will go LOW when the circuit is in the zero state and the CPD goes LOW. The terminal count outputs can be used as the clock input signals to the next higher order circuit in a multistage counter, since they duplicate the clock waveforms. Multistage counters will not be fully synchronous, since there is a slight delay time difference added for each stage that is added. The counter may be preset by the asynchronous parallel load capability of the circuit. Information present on the parallel data inputs (D0 to D3) is loaded into the counter and appears on the outputs (Q0 to Q3) regardless of the conditions of the clock inputs when the parallel load (PL) input is LOW. A HIGH level on the master reset (MR) input will disable the parallel load gates, override both clock inputs and set all outputs (Q0 to

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Q3) LOW. If one of the clock inputs is LOW during and after a reset or load operation, the next LOW-to-HIGH transition of that clock will be interpreted as a legitimate signal and will be counted.

2. Features
I I I I Synchronous reversible 4-bit binary counting Asynchronous parallel load Asynchronous reset Expandable without external logic

3. Ordering information
Table 1. Ordering information Package Temperature range 74HC193D 74HC193DB 74HC193N 74HC193PW 74HCT193D 74HCT193DB 74HCT193N 74HCT193PW 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C Name SO16 SSOP16 DIP16 TSSOP16 SO16 SSOP16 DIP16 TSSOP16 Description plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic dual in-line package; 16 leads (300 mil) plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic dual in-line package; 16 leads (300 mil) plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT109-1 SOT338-1 SOT38-4 SOT403-1 SOT109-1 SOT338-1 SOT38-4 SOT403-1 Type number

4. Functional diagram
15 D0 1 D1 10 D2 9 D3 TCU COUNTER TCD 12 13 CPU 14 MR FLIP-FLOPS Q0 3 2 Q1 6 Q2 7 Q3
001aag405

11 5 4

PL CPU CPD

PL 11 5 4 14 MR

D0 15

D1 1

D2 10

D3 9 12 13 TCU TCD

CPD

3 Q0

2 Q1

6 Q2

7 Q3
001aag409

Fig 1. Functional diagram


74HC_HCT193_3

Fig 2. Logic symbol


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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

11 5 4 14 15 1 10 9

C3 2+ G1 1 G2 R 3D

CTR4

3 2 6 7 2CT = 0 1CT = 15 13 12

001aag410

Fig 3. IEC logic symbol

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

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Product data sheet Rev. 03 23 May 2007
CPD MR
NXP B.V. 2007. All rights reserved. 74HC_HCT193_3

NXP Semiconductors

D0

D1

D2

D3

PL

CPU TCU

SD T

Q T

SD

Q T

SD

Q T

SD

Presettable synchronous 4-bit binary up/down counter

FF1 Q RD

FF2 Q RD

FF3 Q RD

FF4 Q RD

74HC193; 74HCT193

TCD

Q0

Q1

Q2

Q3

001aag412

4 of 29

Fig 4. Logic diagram

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

5. Pinning information
5.1 Pinning
74HC193 74HCT193
D1 1 2 3 4 5 6 7 8
001aaf408

74HC193 74HCT193
D1 Q1 Q0 CPD CPU Q2 Q3 GND 1 2 3 4 5 6 7 8
001aag406

16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3 D1 Q1 Q0 CPD CPU Q2 Q3 GND 1 2 3 4 5 6 7 8


001aag407

16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3

74HC193 74HCT193
16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3

Q1 Q0 CPD CPU Q2 Q3 GND

Fig 5. Pin conguration SO16

Fig 6. Pin conguration TSSOP16 and SSOP16

Fig 7. Pin conguration DIP16

5.2 Pin description


Table 2. Symbol D0 D1 D2 D3 Q0 Q1 Q2 Q3 CPD CPU GND PL TCU TCD MR VCC
[1]

Pin description Pin 15 1 10 9 3 2 6 7 4 5 8 11 12 13 14 16 Description data input 0 data input 1 data input 2 data input 3 ip-op output 0 ip-op output 1 ip-op output 2 ip-op output 3 count down clock input[1] count up clock input[1] ground (0 V) asynchronous parallel load input (active LOW) terminal count up (carry) output (active LOW) terminal count down (borrow) output (active LOW) asynchronous master reset input (active HIGH) supply voltage

LOW-to-HIGH, edge triggered.

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

5 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

6. Functional description
Table 3. Function table[1] Inputs MR Reset (clear) Parallel load H H L L L L Count up Count down
[1]

Operating mode

Outputs CPU CPD D0 X X X X L H H L H L H X X H X X L L H H X X D1 X X L L H H X X D2 X X L L H H X X D3 X X L L H H X X Q0 L L L L H H Q1 L L L L H H Q2 L L L L H H Q3 L L L L H H TCU TCD H H H H L H H[2] H L H L H H H H H[3]

PL X X L L L L H H

L L

count up count down

H = HIGH voltage level L = LOW voltage level X = dont care = LOW-to-HIGH clock transition. TCU = CPU at terminal count up (HHHH) TCD = CPD at terminal count down (LLLL).

[2] [3]

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

6 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

MR(1)

PL

D0

D1

D2

D3 CPU(2) CPD(2)

Q0

Q1

Q2

Q3

TCU

TCD 0 CLEAR 13 PRESET 14 15 0 COUNT UP 1 2 1 0 15 14 COUNT DOWN 13


001aag411

(1) Clear overrides load, data and count inputs. (2) When counting up, the count down clock input (CPD) must be HIGH, when counting down the count up clock input (CPU) must be HIGH. Sequence Clear (reset outputs to zero); load (preset) to binary thirteen; count up to fourteen, fteen, terminal count up, zero, one and two; count down to one, zero, terminal count down, fteen, fourteen and thirteen.

Fig 8. Typical clear, load and count sequence

74HC_HCT193_3

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

7 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation DIP16 package SO16 package SSOP16 package TSSOP16 package
[1] [2]
[2] [2] [2] [2]

Conditions VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V VO = 0.5 V to VCC + 0.5 V
[1] [1]

Min 0.5 65 -

Max +7.0 20 20 25 50 50 +150 750 500 500 500

Unit V mA mA mA mA mA C mW mW mW mW

The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For DIP16 packages: above 70 C the value of Ptot derates linearly at 12 mW/K. For SO16 packages: above 70 C the value of Ptot derates linearly at 8 mW/K. For SSOP16 and TSSOP16 packages: above 60 C the value of Ptot derates linearly at 5.5 mW/K.

8. Recommended operating conditions


Table 5. 74HC193 VCC VI VO Tamb tr supply voltage input voltage output voltage ambient temperature rise time inputs VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tf fall time inputs VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 6.0 1000 ns 500 400 ns ns 6.0 1000 ns 500 400 ns ns 2.0 0 0 40 5.0 +25 6.0 VCC VCC V V V Recommended operating conditions Conditions Min Typ Max Unit Symbol Parameter

+125 C

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

8 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 5. 74HCT193 VCC VI VO Tamb tr tf

Recommended operating conditions continued Conditions Min 4.5 0 0 40 inputs; VCC = 4.5 V inputs; VCC = 4.5 V Typ 5.0 +25 6.0 6.0 Max 5.5 VCC VCC 500 500 Unit V V V ns ns

Symbol Parameter supply voltage input voltage output voltage ambient temperature rise time fall time

+125 C

9. Static characteristics
Table 6. Static characteristics type 74HC193 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC Ci VIH input leakage current supply current input capacitance HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 1.5 3.15 4.2 0 0 0 0.15 0.16 3.5 0.1 0.1 0.1 0.26 0.26 0.1 8.0 V V V V V A A pF V V V Min 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 Typ 1.2 2.4 3.2 0.8 2.1 2.8 2.0 4.5 6.0 4.32 5.81 Max 0.5 1.35 1.8 V V V V V Unit V V V V V V Tamb = 25 C

Tamb = 40 C to +85 C

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

9 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 6. Static characteristics type 74HC193 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIL Parameter LOW-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC input leakage current supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC input leakage current supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0.1 0.1 0.1 0.4 0.4 1.0 160 V V V V V A A 1.9 4.4 5.9 3.7 5.2 V V V V V 0.1 0.1 0.1 0.33 0.33 1.0 80 V V V V V A A 1.9 4.4 5.9 3.84 5.34 V V V V V Min Typ Max 0.5 1.35 1.8 Unit V V V

Tamb = 40 C to +125 C VIH HIGH-level input voltage 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 7. Static characteristics type 74HCT193 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH VIL VOH Parameter HIGH-level input voltage LOW-level input voltage HIGH-level output voltage Conditions VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR Ci VIH VIL VOH input capacitance HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR Tamb = 40 C to +125 C VIH VIL
74HC_HCT193_3

Min 2.0 4.4 3.98 -

Typ 1.6 1.2 4.5 4.32 0 0.15 -

Max 0.8 0.1 0.26 0.1 8.0

Unit V V V V V V A A

Tamb = 25 C

2.0 4.4 3.84 -

35 140 65 105 3.5 -

126 504 234 378 0.8 0.1 0.33 1.0 80

A A A A pF V V V V V V A A

Tamb = 40 C to +85 C

2.0 -

157.5 630 292.5 472.5 0.8

A A A A V V
11 of 29

HIGH-level input voltage LOW-level input voltage

VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V


Rev. 03 23 May 2007

NXP B.V. 2007. All rights reserved.

Product data sheet

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 7. Static characteristics type 74HCT193 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter HIGH-level output voltage Conditions VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR 171.5 686 318.5 514.5 A A A A 0.1 0.4 1.0 160 V V A A 4.4 3.7 V V Min Typ Max Unit

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

10. Dynamic characteristics


Table 8. Symbol tpd Dynamic characteristics type 74HC193 Parameter propagation delay Conditions Min CPU, CPD to Qn; see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPU to TCU; see Figure 10 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD to TCD; see Figure 10 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL to Qn; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to Qn; see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Dn to Qn; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL to TCU, PL to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to TCU, MR to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
74HC_HCT193_3

25 C Typ Max
[1]

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

63 23 18 215 43 37 270 54 46 325 65 55 ns ns ns

39 14 11

125 25 21

155 31 26

190 38 32

ns ns ns

39 14 11

125 25 21

155 31 26

190 38 32

ns ns ns

69 25 20

220 44 37

275 55 47

330 66 56

ns ns ns

58 21 17

200 40 34

250 50 43

300 60 51

ns ns ns

69 25 20

210 42 36

265 53 45

315 63 54

ns ns ns

80 29 23

290 58 49

365 73 62

435 87 74

ns ns ns

74 27 22

285 57 48

355 71 60

430 86 73

ns ns ns

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 8. Symbol tpd

Dynamic characteristics type 74HC193 continued Parameter propagation delay Conditions Min Dn to TCU, Dn to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 29 23 19 7 6 19 7 6 290 58 49 75 15 13 75 15 13 365 73 62 95 19 16 95 19 16 435 87 74 110 22 19 110 22 19 ns ns ns ns ns ns ns ns ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

tTHL

HIGH to LOW see Figure 12 output transition VCC = 2.0 V time VCC = 4.5 V VCC = 6.0 V LOW to HIGH see Figure 12 output transition VCC = 2.0 V time VCC = 4.5 V VCC = 6.0 V pulse width CPU, CPD (HIGH or LOW); see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR (HIGH); see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL (LOW); see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V

tTLH

tW

100 20 17

22 8 6

125 25 21

150 30 26

ns ns ns

100 20 17

25 9 7

125 25 21

150 30 26

ns ns ns

100 20 17

19 7 6

125 25 21

150 30 26

ns ns ns

trec

recovery time

PL to CPU, CPD; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to CPU, CPD; see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 50 10 9 0 0 0 65 13 11 75 15 13 ns ns ns 50 10 9 8 3 2 65 13 11 75 15 13 ns ns ns

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 8. Symbol tsu

Dynamic characteristics type 74HC193 continued Parameter set-up time Conditions Min Dn to PL; see Figure 13; note: CPU = CPD = HIGH VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 16 14 22 8 6 100 20 17 120 24 20 ns ns ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

th

hold time

Dn to PL; see Figure 13 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPU to CPD, CPD to CPU; see Figure 15 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 16 8 22 8 6 100 20 17 120 24 20 ns ns ns 0 0 0 14 5 4 0 0 0 0 0 0 ns ns ns

fmax

maximum frequency

CPU, CPD; see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 4.0 20 24
[2]

13.5 41 49 24

3.2 16 19 -

2.6 13 15 -

MHz MHz MHz pF

CPD

power dissipation capacitance

VI = GND to VCC; VCC = 5 V; fi = 1 MHz

[1] [2]

tpd is the same as tPHL and tPLH. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

15 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 9. Symbol tpd

Dynamic characteristics type 74HCT193 Parameter propagation delay Conditions Min CPU, CPD to Qn; see Figure 9 VCC = 4.5 V CPU to TCU; see Figure 10 VCC = 4.5 V CPD to TCD; see Figure 10 VCC = 4.5 V PL to Qn; see Figure 11 VCC = 4.5 V MR to Qn; see Figure 12 VCC = 4.5 V Dn to Qn; see Figure 11 VCC = 4.5 V PL to TCU, PL to TCD; see Figure 14 VCC = 4.5 V MR to TCU, MR to TCD; see Figure 14 VCC = 4.5 V Dn to TCU, Dn to TCD; see Figure 14 VCC = 4.5 V 32 7 58 15 73 19 87 22 ns ns 29 55 69 83 ns 31 55 69 83 ns 27 46 58 69 ns 22 40 50 60 ns 26 46 58 69 ns 15 27 34 41 ns 15 27 34 41 ns
[1]

25 C Typ Max

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

23

43

54

65

ns

tTHL

HIGH to LOW see Figure 12 output transition VCC = 4.5 V time LOW to HIGH see Figure 12 output transition VCC = 4.5 V time pulse width CPU, CPD (HIGH or LOW); see Figure 9 VCC = 4.5 V MR (HIGH); see Figure 12 VCC = 4.5 V PL (LOW); see Figure 11 VCC = 4.5 V

tTLH

15

19

22

ns

tW

25

11

31

38

ns

20

25

30

ns

20

25

30

ns

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 9. Symbol trec

Dynamic characteristics type 74HCT193 continued Parameter recovery time Conditions Min PL to CPU, CPD; see Figure 11 VCC = 4.5 V MR to CPU, CPD; see Figure 12 VCC = 4.5 V 10 0 13 15 ns 10 2 13 15 ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

tsu

set-up time

Dn to PL; see Figure 13; note: CPU = CPD = HIGH VCC = 4.5 V 16 8 20 24 ns Dn to PL; see Figure 13 VCC = 4.5 V CPU to CPD, CPD to CPU; see Figure 15 VCC = 4.5 V 16 7 20 24 ns 0 6 0 0 ns

th

hold time

fmax

maximum frequency power dissipation capacitance

CPU, CPD; see Figure 9 VCC = 4.5 V 20


[2]

43 26

16 -

13 -

MHz pF

CPD

VI = GND to VCC 1.5 V; VCC = 5 V; fi = 1 MHz

[1] [2]

tpd is the same as tPHL and tPLH. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.

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Product data sheet

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

11. Waveforms
1/fmax VI CPU, CPD input GND tW t PHL VOH Qn output VOL VM
001aag413

VM

t PLH

Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 9. The clock (CPU, CPD) to output (Qn) propagation delays, the clock pulse width, and the maximum clock pulse frequency

VI CPU, CPD input GND tPHL VOH TCU, TCD output VOL VM
001aag414

VM

tPLH

Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 10. The clock (CPU, CPD) to terminal count output (TCU, TCD) propagation delays

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Product data sheet

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

VI Dn input GND VI PL input GND tW VI CPU, CPD input GND t PLH VOH Qn output VOL
001aag415

VM

VM t rec VM

t PHL

VM

Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 11. The parallel load input (PL) and data (Dn) to Qn output propagation delays and PL removal time to clock input (CPU, CPD)

VI MR input GND tW VI CPU, CPD input GND t PHL VOH Qn output VOL 90 % VM 10 % t THL t TLH
001aag416

VM

t rec VM

Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 12. The master reset input (MR) pulse width, MR to Qn propagation delays, MR to CPU, CPD removal time and output transition times

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Product data sheet

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

VI Dn input GND VI PL input GND VOH Qn output VOL


001aag417

VM tsu th VM tsu th

The shaded areas indicate when the input is permitted to change for predictable output performance. Measurement points are given in Table 10. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 13. The data input (Dn) to parallel load input (PL) set-up and hold times

VI PL, MR, Dn input GND tPLH VOH TCU, TCD output VOL
001aag418

VM

tPHL

VM

Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.

Fig 14. The data input (Dn), parallel load input (PL) and the master reset input (MR) to the terminal count outputs (TCU, TCD) propagation delays

VI CPU or CPD input GND th VI CPD or CPU input GND VM


001aag419

VM

Measurement points are given in Table 10.

Fig 15. The CPU to CPD or CPD to CPU hold times

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Product data sheet

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Table 10. Type 74HC193 74HCT193

Measurement points Input VM 0.5 VCC 1.3 V VI GND to VCC GND to 3 V Output VM 0.5 VCC 1.3 V

VI negative pulse 0V

tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM

VI positive pulse 0V

VCC

VCC

PULSE GENERATOR

VI

VO

RL

S1

DUT
RT CL

open

001aad983

Test data is given in Table 11. Denitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch

Fig 16. Load circuitry for measuring switching times Table 11. Type 74HC193 74HCT193 Test data Input VI VCC 3V tr, tf 6 ns 6 ns Load CL 15 pF, 50 pF 15 pF, 50 pF RL 1 k 1 k S1 position tPHL, tPLH open open

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

12. Application information


data input D0 D1 D2 D3 up clock down clock CPU CPD PL asynchronous parallel load reset data output
001aag420

D0 D1 D2 D3 CPU CPD PL TCU carry borrow

TCU

IC1 TCD
MR

IC2 TCD
MR

Q0 Q1 Q2 Q3

Q0 Q1 Q2 Q3

Fig 17. Application for cascaded up/down counter with parallel load

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

13. Package outline


SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

A X

c y HE v M A

Z 16 9

Q A2 pin 1 index Lp 1 e bp 8 w M L detail X A1 (A 3) A

2.5 scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3

0.010 0.057 0.069 0.004 0.049

0.019 0.0100 0.39 0.014 0.0075 0.38

0.244 0.041 0.228

0.028 0.004 0.012

8 o 0

ISSUE DATE 99-12-27 03-02-19

Fig 18. Package outline SOT109-1 (SO16)


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Product data sheet

Rev. 03 23 May 2007

23 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

A X

c y HE v M A

Z 16 9

Q A2 A1 pin 1 index Lp L 1 bp 8 w M detail X (A 3) A

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 o 0
o

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION

ISSUE DATE 99-12-27 03-02-19

Fig 19. Package outline SOT338-1 (SSOP16)


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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

D seating plane

ME

A2

A1

c Z e b1 b 16 9 b2 MH w M (e 1)

pin 1 index E

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.03

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION

ISSUE DATE 95-01-14 03-02-13

Fig 20. Package outline SOT38-4 (DIP16)


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Product data sheet

Rev. 03 23 May 2007

25 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

c y HE v M A

16

Q A2 pin 1 index A1 Lp L (A 3) A

1
e bp

8
w M detail X

2.5 scale

5 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18

Fig 21. Package outline SOT403-1 (TSSOP16)


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Product data sheet

Rev. 03 23 May 2007

26 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

14. Revision history


Table 12. Revision history Release date 20070523 Data sheet status Product data sheet Change notice Supersedes 74HC_HCT193_CNV_2 Document ID 74HC_HCT193_3 Modications:

The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Family specication included Product specication -

74HC_HCT193_CNV_2

19970828

74HC_HCT193_3

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Product data sheet

Rev. 03 23 May 2007

27 of 29

NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

15. Legal information 16. Data sheet status


Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualication Production

Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.1 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.

malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

16.2 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

16.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

17. Contact information


For additional information, please visit: http://www.nxp.com For sales ofce addresses, send an email to: salesaddresses@nxp.com

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Product data sheet

Rev. 03 23 May 2007

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NXP Semiconductors

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

18. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Recommended operating conditions. . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 22 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information. . . . . . . . . . . . . . . . . . . . . 28 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

NXP B.V. 2007.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 May 2007 Document identifier: 74HC_HCT193_3