You are on page 1of 23

®

OPA

627

OPA627 OPA637

OPA

627

Precision High-Speed Difet ® OPERATIONAL AMPLIFIERS
FEATURES
q VERY LOW NOISE: 4.5nV/√Hz at 10kHz q FAST SETTLING TIME: OPA627—550ns to 0.01% OPA637—450ns to 0.01% q LOW VOS: 100µV max q LOW DRIFT: 0.8µV/°C max q LOW IB: 5pA max q OPA627: Unity-Gain Stable q OPA637: Stable in Gain ≥ 5

APPLICATIONS
q PRECISION INSTRUMENTATION q FAST DATA ACQUISITION q DAC OUTPUT AMPLIFIER q OPTOELECTRONICS q SONAR, ULTRASOUND q HIGH-IMPEDANCE SENSOR AMPS q HIGH-PERFORMANCE AUDIO CIRCUITRY q ACTIVE FILTERS High frequency complementary transistors allow increased circuit bandwidth, attaining dynamic performance not possible with previous precision FET op amps. The OPA627 is unity-gain stable. The OPA637 is stable in gains equal to or greater than five.

DESCRIPTION
The OPA627 and OPA637 Difet operational amplifiers provide a new level of performance in a precision FET op amp. When compared to the popular OPA111 op amp, the OPA627/637 has lower noise, lower offset voltage, and much higher speed. It is useful in a broad range of precision and high speed analog circuitry. The OPA627/637 is fabricated on a high-speed, dielectrically-isolated complementary NPN/PNP process. It operates over a wide range of power supply voltage— ±4.5V to ±18V. Laser-trimmed Difet input circuitry provides high accuracy and low-noise performance comparable with the best bipolar-input op amps.
Trim 1

Difet fabrication achieves extremely low input bias currents without compromising input voltage noise performance. Low input bias current is maintained over a wide input common-mode voltage range with unique cascode circuitry.
The OPA627/637 is available in plastic DIP, SOIC and metal TO-99 packages. Industrial and military temperature range models are available.
7 +VS 5

Trim

Output 6 +In 3 –In 2

Difet ®, Burr-Brown Corp.

–VS 4

International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132

©1989 Burr-Brown Corporation

PDS-998H

Printed in U.S.A. March, 1998

SBOS165

SPECIFICATIONS
ELECTRICAL
At TA = +25°C, and VS = ±15V, unless otherwise noted. OPA627BM, BP, SM OPA637BM, BP, SM PARAMETER OFFSET VOLTAGE (1) Input Offset Voltage AP, BP, AU Grades Average Drift AP, BP, AU Grades Power Supply Rejection INPUT BIAS CURRENT (2) Input Bias Current Over Specified Temperature SM Grade Over Common-Mode Voltage Input Offset Current Over Specified Temperature SM Grade NOISE Input Voltage Noise Noise Density: f = 10Hz f = 100Hz f = 1kHz f = 10kHz Voltage Noise, BW = 0.1Hz to 10Hz Input Bias Current Noise Noise Density, f = 100Hz Current Noise, BW = 0.1Hz to 10Hz INPUT IMPEDANCE Differential Common-Mode INPUT VOLTAGE RANGE Common-Mode Input Range Over Specified Temperature Common-Mode Rejection OPEN-LOOP GAIN Open-Loop Voltage Gain Over Specified Temperature SM Grade FREQUENCY RESPONSE Slew Rate: OPA627 OPA637 Settling Time: OPA627 0.01% 0.1% OPA637 0.01% 0.1% Gain-Bandwidth Product: OPA627 OPA637 Total Harmonic Distortion + Noise POWER SUPPLY Specified Operating Voltage Operating Voltage Range Current OUTPUT Voltage Output Over Specified Temperature Current Output Short-Circuit Current Output Impedance, Open-Loop TEMPERATURE RANGE Specification: AP, BP, AM, BM, AU SM Storage: AM, BM, SM AP, BP, AU θJ-A: AM, BM, SM AP, BP AU RL = 1kΩ VO = ±10V 1MHz –25 –55 –60 –40 200 100 160 ±11 ±10.5 106 112 106 100 40 100 CONDITIONS MIN TYP 40 100 0.4 0.8 120 1 MAX 100 250 0.8 2 100 5 1 50 5 1 50 OPA627AM, AP, AU OPA637AM, AP, AU MIN TYP 130 280 1.2 2.5 116 2 MAX 250 500 2 UNITS µV µV µV/° C µV/° C dB pA nA nA pA pA nA nA

VS = ±4.5 to ±18V VCM = 0V VCM = 0V VCM = 0V VCM = ±10V VCM = 0V VCM = 0V

106

10 2

1 0.5

2 1

10 2

15 8 5.2 4.5 0.6 1.6 30 1013 || 8 1013 || 7 ±11.5 ±11 116 120 117 114 55 135 550 450 450 300 16 80 0.00003 ±15 ±7 ±12.3 ±11.5 ±45 +70/–55 55

40 20 8 6 1.6 2.5 60

20 10 5.6 4.8 0.8 2.5 48 * * * * 100 106 100 * * 110 116 110

nV/√Hz nV/√Hz nV/√Hz nV/√Hz µVp-p fA/√Hz fAp-p Ω || pF Ω || pF V V dB dB dB dB V/µs V/µs ns ns ns ns MHz MHz % V V mA

VCM = ±10.5V VO = ±10V, RL = 1kΩ VO = ±10V, RL = 1kΩ VO = ±10V, RL = 1kΩ G G G G G G –1, 10V Step –4, 10V Step –1, 10V Step –1, 10V Step –4, 10V Step –4, 10V Step G=1 G = 10 G = +1, f = 1kHz = = = = = =

* *

* * * * * * * * * *

±4.5

±18 ±7.5

* * * * * * * * *

* *

±11.5 ±11 ±35

±100

*

*

V mA mA Ω °C °C °C °C ° C/W ° C/W ° C/W

+85 +125 +150 +125

* * * * *

* * *

* Specifications same as “B” grade. NOTES: (1) Offset voltage measured fully warmed-up. (2) High-speed test at TJ = +25°C. See Typical Performance Curves for warmed-up performance. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®

OPA627, 637

2

........ Offset Trim –In +In –VS 1 2 3 4 8 7 6 5 No Internal Connection +VS Output Offset Trim Top View No Internal Connection 8 Offset Trim 1 7 +VS TO-99 PACKAGE/ORDERING INFORMATION PRODUCT OPA627AP OPA627BP OPA627AU OPA627AM OPA627BM OPA627SM OPA637AP OPA637BP OPA637AU OPA637AM OPA637BM OPA637SM PACKAGE Plastic DIP Plastic DIP SOIC TO-99 Metal TO-99 Metal TO-99 Metal Plastic DIP Plastic DIP SOIC TO-99 Metal TO-99 Metal TO-99 Metal PACKAGE DRAWING NUMBER(1) 006 006 182 001 001 001 006 006 182 001 001 001 TEMPERATURE RANGE –25°C to +85°C –25°C to +85°C –25°C to +85°C –25°C to +85°C –25°C to +85°C –55°C to +125°C –25°C to +85°C –25°C to +85°C –25°C to +85°C –25°C to +85°C –25°C to +85°C –55°C to +125°C –In 2 6 Output 3 +In 4 –VS Case connected to –VS........ U Package ........................................................ ® 3 OPA627.. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications..................... 1000mW Operating Temperature M Package .................................................................. Total VS + 4V Power Dissipation ........................ +300°C SOlC (soldering.......... +VS + 2V to –VS – 2V Differential Input Range .................................................................. –55°C to +125°C P.............. or Appendix C of Burr-Brown IC Data Book....... Burr-Brown recommends that all integrated circuits be handled with appropriate precautions.......... ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD.................................................................................................. 10s) ............. +150°C Lead Temperature (soldering....... Failure to observe proper handling and installation procedures can cause damage.. +260°C NOTE: (1) Stresses above these ratings may cause permanent damage........................................................................ U Package ....................................................... 5 Offset Trim NOTE: (1) For detailed drawing and dimension table... –65°C to +150°C P......................... ±18V Input Voltage Range ............... ESD damage can range from subtle performance degradation to complete device failure.......... –40°C to +125°C Junction Temperature M Package ............................... +175°C P........................... U Package .............. please see end of data sheet....... 3s) ........................................................................................................... 637 ...............PIN CONFIGURATIONS Top View DIP/SOIC ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage .... –40°C to +125°C Storage Temperature M Package ..

unless otherwise noted.1Hz to indicated frequency. and VS = ±15V. 1 10 0.1 RMS 1 1 10 100 1k 10k 100k 1M 10M Frequency (Hz) 0.01 1 10 100 1k 10k 100k 1M 10M Bandwidth (Hz) VOLTAGE NOISE vs SOURCE RESISTANCE 1k – OPEN-LOOP GAIN vs FREQUENCY 140 120 Voltage Gain (dB) Voltage Noise (nV/ √ Hz) + 100 RS 100 80 60 40 20 OPA627 OPA637 OPA627 + Resistor 10 Comparison with OPA27 Bipolar Op Amp + Resistor Spot Noise at 10kHz 1M 10M 100M Resistor Noise Only 1 100 1k 10k 100k Source Resistance ( Ω) 0 –20 1 10 100 1k 10k 100k 1M 10M 100M Frequency (Hz) OPA627 GAIN/PHASE vs FREQUENCY 30 –90 OPA637 GAIN/PHASE vs FREQUENCY 30 –90 Phase (Degrees) 10 Gain 0 75° Phase Margin Phase –150 Phase 10 Gain –150 –180 0 –180 –10 1 10 Frequency (MHz) –210 100 –10 1 10 Frequency (MHz) 100 –210 ® OPA627. INPUT VOLTAGE NOISE SPECTRAL DENSITY 1k 100 TOTAL INPUT VOLTAGE NOISE vs BANDWIDTH p-p Voltage Noise (nV/ √ Hz) Input Voltage Noise (µV) 10 100 Noise Bandwidth: 0.TYPICAL PERFORMANCE CURVES At TA = +25 °C. 637 4 Phase (Degrees) 20 Gain (dB) –120 20 Gain (dB) –120 .

unless otherwise noted.TYPICAL PERFORMANCE CURVES (CONT) At TA = +25°C. 637 . OPEN-LOOP GAIN vs TEMPERATURE 125 100 OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY 120 Voltage Gain (dB) Output Resistance (Ω) 80 60 115 40 110 20 105 –75 0 –50 –25 0 25 50 75 100 125 2 20 200 2k 20k 200k 2M 20M Temperature (°C) Frequency (Hz) COMMON-MODE REJECTION vs FREQUENCY 140 COMMON-MODE REJECTION vs INPUT COMMON MODE VOLTAGE 130 Common-Mode Rejection Ratio (dB) 120 100 80 60 40 20 0 1 10 100 1k 10k OPA627 OPA637 Common-Mode Rejection (dB) 120 110 100 90 100k 1M 10M 80 –15 –10 –5 0 5 10 15 Frequency (Hz) Common-Mode Voltage (V) POWER-SUPPLY REJECTION vs FREQUENCY 140 Power-Supply Rejection (dB) 125 POWER-SUPPLY REJECTION AND COMMON-MODE REJECTION vs TEMPERATURE 120 100 80 60 40 20 0 1 10 100 1k 10k 100k 1M 10M Frequency (Hz) 105 –75 –50 PSR –VS PSRR 627 and 637 CMR and PSR (dB) 120 115 CMR +VS PSRR 627 637 110 –25 0 25 50 75 100 125 Temperature (°C) ® 5 OPA627. and VS = ±15V.

and VS = ±15V. unless otherwise noted.5 60 7 40 –IL at VO = 0V 20 –IL at VO = –10V 6.5 6 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) 0 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) OPA627 GAIN-BANDWIDTH AND SLEW RATE vs TEMPERATURE 24 60 120 OPA637 GAIN-BANDWIDTH AND SLEW RATE vs TEMPERATURE 160 Slew Rate Gain-Bandwidth (MHz) Gain-Bandwidth (MHz) Slew Rate 16 55 Slew Rate (V/µs) 80 GBW 60 120 12 GBW 100 8 –75 50 –50 –25 0 25 50 75 100 125 Temperature (°C) 40 –75 –50 –25 0 25 50 75 100 125 Temperature (°C) 80 OPA627 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 0.1 549Ω 100pF 102 Ω 100pF THD+N (%) 0.001 0. 637 6 Slew Rate (V/µs) 20 100 140 .1 VI G = +1 + – VO = ±10V 600 Ω VI G = +10 + – 100pF 549 Ω VO = ±10V 5kΩ 600 Ω OPA637 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1 VI G = +10 + – VO = ±10V 5k Ω 600Ω G = +50 VI + – VO = ±10V 5k Ω 600Ω 0.TYPICAL PERFORMANCE CURVES At TA = +25 °C.0001 G = +1 0.01 100pF 0.00001 20 100 1k Frequency (Hz) 10k 20k 0. (CONT) SUPPLY CURRENT vs TEMPERATURE 8 100 OUTPUT CURRENT LIMIT vs TEMPERATURE 80 Supply Current (mA) +IL at VO = 0V +IL at VO = +10V Output Current (mA) 7.001 Measurement BW: 80kHz G = +10 THD+N (%) 0.0001 20 100 1k Frequency (Hz) G = +10 10k 20k ® OPA627.01 G = +50 Measurement BW: 80kHz 0.

TYPICAL PERFORMANCE CURVES At TA = +25°C.9 Beyond Linear Common-Mode Range –25 0. and VS = ±15V. 637 .1 Beyond Linear Common-Mode Range 25 1 0 0. 15 TO-99 10 Plastic DIP. (CONT) INPUT BIAS AND OFFSET CURRENT vs JUNCTION TEMPERATURE 10k 20 INPUT BIAS CURRENT vs POWER SUPPLY VOLTAGE NOTE: Measured fully warmed-up.2 Input Bias Current Multiplier Offset Voltage Change (µV) INPUT OFFSET VOLTAGE WARM-UP vs TIME 50 1.01% Settling Time (µs) 20 10 OPA627 OPA637 10 OPA627 1 OPA637 0 100k 1M Frequency (Hz) 10M 100M 0.1 –50 –25 0 25 50 75 100 125 150 Junction Temperature (°C) 0 ±4 ±6 ±8 ±10 ±12 ±14 ±16 ±18 Supply Voltage (±VS) INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE 1.1 –1 –10 –100 –1000 Closed-Loop Gain (V/V) ® 7 OPA627. SOIC 100 IB IOS 10 Input Bias Current (pA) 1k Input Current (pA) 1 5 TO-99 with 0807HS Heat Sink 0.8 –15 –10 –5 0 5 Common-Mode Voltage (V) 10 15 –50 0 1 2 3 4 5 6 Time From Power Turn-On (Min) MAX OUTPUT VOLTAGE vs FREQUENCY 30 SETTLING TIME vs CLOSED-LOOP GAIN 100 Output Voltage (Vp-p) Error Band: ±0. unless otherwise noted.

– + OPA627 Buffer RI RF < 4RI – + Non-Inverting Amp G<5 OPA627 RF < 4R – + OPA627 RI – + OPA627 Bandwidth Limiting Inverting Amp G < |–4| – + OPA627 – + OPA627 Integrator Filter FIGURE 1. and VS = ±15V. (CONT) SETTLING TIME vs ERROR BAND 1500 RI – SETTLING TIME vs LOAD CAPACITANCE 3 CF +5V RF 2kΩ –5V + Settling Time (ns) 1000 Settling Time (µs) OPA627 RI 2kΩ RF 2kΩ CF 6pF OPA637 500Ω 2kΩ 4pF 2 Error Band: ±0. 637 8 . For example. These applications must use the OPA627 for proper stability. When choosing between the OPA627 or OPA637. Circuits with a feedback capacitor (Figure 1) place the op amp in unity noise-gain at high frequency. In this case.001 OPA627 G = –1 1 OPA627 G = –1 0 0.01 0. the OPA637 may be used. Noise gain refers to the closed-loop gain of a circuit as if the non-inverting op amp input were being driven.1 Error Band (%) 1 10 0 150 200 300 400 500 Load Capacitance (pF) APPLICATIONS INFORMATION The OPA627 is unity-gain stable. ® OPA627. it is important to consider the high frequency noise gain of your circuit configuration. so if the closed-loop gain is equal to five or greater. The OPA637 may be used to achieve higher speed and bandwidth in circuits with noise gain greater than five. Circuits with Noise Gain Less than Five Require the OPA627 for Proper Stability. the closed-loop noise gain remains constant with frequency. where a small feedback capacitance is used to compensate for the input capacitance at the op amp’s inverting input. or an inverting amplifier of gain greater than four. the OPA637 may be used in a non-inverting amplifier with gain greater than five.TYPICAL PERFORMANCE CURVES At TA = +25 °C. An exception is the circuit in Figure 2. unless otherwise noted.01% OPA637 G = –4 500 OPA637 G = –4 0 0.

Above a 2kΩ source resistance.I. This can be seen in the performance curve showing the noise of a source resistor combined with the noise of an OPA627. Teflon® E. The case (TO-99 metal package only) is internally connected to the negative power supply as it is with most common op amps. and TO-99 packages has no internal connection. This adjustment should not be used to compensate for offsets created elsewhere in a system (such as in later amplification stages or in an A/D converter) because this could introduce excessive temperature drift. du Pont de Nemours & Co. Circuits with Noise Gain Equal to or Greater than Five May Use the OPA637. Make short. The OPA627/637 is capable of high output current (in excess of 45mA). Power supply connections should be bypassed with good high frequency capacitors positioned close to the op amp pins. Applications with low impedance loads or capacitive loads with fast transient signals demand large currents from the power supplies.1µF ceramic capacitors are adequate. C2 C1 – + R2 OPA637 C1 = CIN + CSTRAY C2 = R1 C1 R2 R1 FIGURE 2. Connection of Input Guard for Lowest IB. direct interconnections and avoid stray wiring capacitance—especially at the input pins and feedback circuitry. Figure 3 shows the optional connection of an external potentiometer to adjust offset voltage. 637 . Non-inverting Buffer 2 3 – 2 6 Out In 3 – + 6 OPA627 Out In + OPA627 Inverting In 2 3 OPA627 – + TO-99 Bottom View 3 Out 2 4 5 6 7 1 8 No Internal Connection 6 Board Layout for Input Guarding: Guard top and bottom of board. In most cases 0. but both voltage noise and bias current noise contribute to the total noise of a system. NOISE PERFORMANCE Some bipolar op amps may provide lower voltage noise performance. wide bandwidth circuit. This provides optimum noise performance over a wide range of sources. CIRCUIT LAYOUT As with any high speed. op amp noise dominates over the resistor noise. the offset drift will change by approximately 4µV/°C for 1mV of change in the offset voltage due to an offset adjustment (as shown on Figure 3). Alternate—use Teflon® standoff for sensitive input pins. but compares favorably with precision bipolar op amps. ® 9 OPA627. including reactive source impedances. The OPA627/637 is unique in providing very low voltage noise and very low current noise. Generally. Optional Offset Voltage Trim Circuit. Larger bypass capacitors such as 1µF solid tantalum capacitors may improve dynamic performance in these applications. To Guard Drive FIGURE 4. Pin 8 of the plastic DIP. Below 1kΩ. SOIC.OFFSET VOLTAGE ADJUSTMENT The OPA627/637 is laser-trimmed for low offset voltage and drift. the op +VS 100kΩ 7 1 2 3 – + 4 –VS 5 6 OPA627/637 ±10mV Typical Trim Range 10kΩ to 1MΩ Potentiometer (100kΩ preferred) FIGURE 3. careful layout will ensure best performance. amp contributes little additional noise. so many circuits will not require external adjustment.

A circuit board “guard” pattern (Figure 4) reduces leakage effects. The high speed and therefore higher quiescent current of the OPA627/637 can lead to higher chip temperature. Driving Large Capacitive Loads.INPUT BIAS CURRENT Difet fabrication of the OPA627/637 provides very low input bias current. Since the gate current of a FET doubles approximately every 10°C. This is most often encountered in non-inverting circuits when the input is driven below –12V. Since a load capacitance presents a decreasing impedance at higher frequency. RF 1kΩ 200pF CF – + G = 1+ RF R1 OPA627 R1 RO 20Ω G = +1 BW ≥ 1MHz CL 5nF Optional Gain Gain > 1 For Approximate Butterworth Response: 2 RO CL RF >> RO CF = RF f–3dB = 1 2π √ RF RO CF CL FIGURE 6. This reduces the IB of TO99 metal package devices to approximately one-fourth the value at ±15V. Leakage currents between printed circuit board traces can easily exceed the input bias current of the OPA627/637. Clamp Circuit for Improved Overload Recovery. The OPA627/637 may also be operated at reduced power supply voltage to minimize power dissipation and temperature rise. The case (TO-99 metal package only) is internally connected to –VS. lowering the IB to one-third its warmed-up value. Many FET-input op amps exhibit a phase reversal when the input is driven beyond its linear common-mode range. recovery ® takes approximately 500ns. Wide copper traces will also help dissipate heat.5V FIGURE 5. Input stage cascode circuitry makes the input bias current of the OPA627/637 virtually constant with wide common-mode voltage changes. See the typical curves showing settling times as a function of capacitive load. This is often useful in reducing the noise of systems which do not require the full bandwidth of the OPA627. When the output is driven into the positive limit. the output voltage of the OPA627/637 smoothly limits at approximately 2. +VS (2) HP 5082-2811 5kΩ ZD1 1kΩ 5kΩ RF VI RI – + OPA627 –VS Diode Bridge BB: PWS740-3 ZD1 : 10V IN961 VO Clamps output at VO = ±11. OPA627. Temperature rise in the plastic DIP and SOIC packages can be minimized by soldering the device to the circuit board. Each rinsing operation should be followed by a 30-minute bake at 85°C. to achieve lowest input bias current. leakage current will flow harmlessly to the lowimpedance node. OUTPUT OVERLOAD When the inputs to the OPA627/637 are overdriven. recovery takes approximately 6µs. Contamination from handling parts and circuit boards may be removed with cleaning solvents and deionized water. causing the output to reverse into the positive rail. See the data sheet on the 807HS for details. 637 10 . so the output limits into the appropriate rail. Many FET-input op amps exhibit large changes in input bias current with changes in input voltage. PHASE-REVERSAL PROTECTION The OPA627/637 has internal phase-reversal protection. The 807HS heat sink can also reduce lowfrequency voltage noise caused by air currents and thermoelectric effects.5V from the positive and negative power supplies. Using ±5V power supplies reduces power dissipation to one-third of that at ±15V. This is ideal for accurate high inputimpedance buffer applications. If driven to the negative swing limit. The input circuitry of the OPA627/637 does not induce phase reversal with excessive commonmode voltage. Diodes at the inverting input prevent degradation of input bias current. Figure 6 shows a circuit for driving very large load capacitance. By surrounding critical high impedance input circuitry with a low impedance circuit connection at the same potential. A simple press-on heat sink such as the Burr-Brown model 807HS (TO-99 metal package) can reduce chip temperature by approximately 15°C. Output recovery of the OPA627 can be improved using the output clamp circuit shown in Figure 5. Input bias current may also be degraded by improper handling or cleaning. the die temperature should be kept as low as possible. The lower bandwidth of the OPA627 makes it the better choice for driving large capacitive loads. This circuit’s two-pole response can also be used to sharply limit system bandwidth. CAPACITIVE LOADS As with any high-speed op amp. best dynamic performance can be achieved by minimizing the capacitive load. a load capacitance which is easily driven by a slow op amp can cause a high-speed op amp to perform poorly.

RS. LARGE SIGNAL RESPONSE SMALL SIGNAL RESPONSE (A) (B) FPO When used as a unity-gain buffer. The 4nV/√Hz theoretical thermal noise of a 1kΩ resistor will add to the 4. Light falling on the junction of the protection diodes can dramatically increase leakage current. Although in normal operation. OPA627 Dynamic Performance. to limit the current. Input Protection Circuits.INPUT PROTECTION The inputs of the OPA627/637 are protected for voltages between +VS + 2V and –VS – 2V. This causes the rising edge to be slower and falling edges to be faster than nominal slew rates observed in higher-gain circuits. The 2N4117A is specified at 1pA and its metal case shields the junction from light. If the input source can deliver current in excess of the maximum forward current of the protection diodes. Be aware that adding resistance to the input will increase noise. the summing junction should be protected with diode clamps connected to ground. Resistors below 100Ω add negligible noise. common signal diodes may have excessive leakage current.5nV/√Hz noise of the OPA627/637 (by the square-root of the sum of the squares). producing a total noise of 6nV/√Hz. Since the reverse voltage on these diodes is clamped. the amplifier should be protected. the voltage at the summing junction will be near zero (equal to the offset voltage of the amplifier). Even with the low voltage present at the summing junction. G = +1. If the input voltage can exceed these limits. Leakage current in the protection diodes can increase the total input bias current of the circuit. ® 11 OPA627. use a series resistor. The specified maximum leakage current for commonly used diodes such as the 1N4148 is approximately 25nA—more than a thousand times larger than the input bias current of the OPA627/637. Sometimes input protection is required on I/V converters of inverting amplifiers (Figure 7b). In this case. a diode-connected signal transistor can be used as an inexpensive low leakage diode (Figure 7b). Leakage current of these diodes is typically much lower and may be adequate in many applications. Very low leakage can be achieved by using a diode-connected FET as shown. +VS – D + D Optional RS –VS (a) OPA627 D: IN4148 — 25nA Leakage 2N4117A — 1pA Leakage Siliconix = VO IIN – VO D D + OPA627 D: 2N3904 = (b) NC FIGURE 7. large common-mode input voltage steps produce transient variations in input-stage currents. large input transients may cause this node to exceed 2V beyond the power supplies. The diode clamps shown in Figure 7a will prevent the input voltage from exceeding one forward diode voltage drop beyond the power supplies—well within the safe limits. so common glass-packaged diodes should be shielded from ambient light. 637 . – + OPA627 G=1 FIGURE 8.

LARGE SIGNAL RESPONSE +10 VOUT (V) VOUT (V) +10 0 (C) 0 (D) –10 –10 6pF(1) When driven with a very fast input step (left). output slew rate will increase slightly. OPA627 Dynamic Performance. G = –1. 637 12 . ® OPA627. G=5 OPA637 VOUT FIGURE 10. 2kΩ – 2kΩ + OPA627 G = –1 VOUT FIGURE 9. common-mode transients cause a slight variation in input stage currents which will reduce output slew rate. G = 5. OPA637 Dynamic Response. OPA637 LARGE SIGNAL RESPONSE OPA637 SMALL SIGNAL RESPONSE +10 VOUT (mV) VOUT (V) +100 0 (E) 0 (F) FPO –100 –10 4pF(1) 2kΩ – + 500Ω NOTE: (1) Optimum value will depend on circuit board layout and capacitance at inverting input. NOTE: (1) Optimum value will depend on circuit board layout and stray capacitance at the inverting input. If the input step slew rate is reduced (right).

This composite amplifier uses the OPA603 current-feedback op amp to provide extended bandwidth and slew rate at high closed-loop gain. 637 .RI / Error Out 2kΩ CF OPA627 RI . R2 – A1 VI + + *Minimize capacitance at this node. Gain = 1000 CMRR ≈ 116dB Bandwidth ≈ 400kHz 2 10kΩ INA106 Differential Amplifier 3 – RF 5kΩ OPA637 10kΩ 1 100kΩ 5 –In + – OPA637 RF 5kΩ Input Common-Mode Range = ±10V RG 101Ω 3pF – + 100kΩ 6 Output +In + Differential Voltage Gain = (1 + 2RF /RG) • 10 FIGURE 13. Settling Time and Slew Rate Test Circuit. –15V FIGURE 11.99 4. The feedback loop is closed around the composite amp. Use separate power supply bypass capacitors for each op amp. Gain = 100 CMRR ≈ 116dB Bandwidth ≈ 1MHz 2 25kΩ INA105 Differential Amplifier 3 – +In + RF 5kΩ OPA637 Differential Voltage Gain = 1 + 2RF /RG 25kΩ 1 25kΩ 5 –In + – OPA637 RF 5kΩ Input Common-Mode Range = ±5V RG 101Ω 3pF – + 25kΩ 6 Output FIGURE 12. VO – OPA603 R1 R3 * RL ≥ 150Ω for ±10V Out GAIN (V/V) 100 1000 A1 OP AMP OPA627 OPA637 R1 (Ω ) 50. R 1 CF Error Band (0. Gain = 1000. a fixed capacitor may be used.5(1) 49. FIGURE 14.2mV HP50822835 2kΩ +15V High Quality Pulse Generator RI – 51Ω ±5V Out + NOTE: CF is selected for best settling time performance depending on test fixture layout.99 R3 (Ω ) 20 12 R4 (kΩ ) 1 1 –3dB (MHz) 15 11 SLEW RATE (V/µs) 700 500 R4 NOTE: (1) Closest 1/2% value. High Speed Instrumentation Amplifier. High Speed Instrumentation Amplifier.01%) 2kΩ 6pF ±0. preserving the precision input characteristics of the OPA627/637. Composite Amplifier for Wide Bandwidth.5mV OPA637 500Ω 4pF ±0. Gain = 100.9 R2 (kΩ) 4. Once optimum value is determined. ® 13 OPA627.

ti.PACKAGE OPTION ADDENDUM www.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device OPA627AM OPA627AP OPA627APG4 OPA627AU OPA627AU/2K5 OPA627AU/2K5E4 OPA627AUE4 OPA627AUG4 OPA627BM OPA627BP OPA627BPG4 OPA627SM OPA637AM OPA637AM2 OPA637AP OPA637APG4 OPA637AU OPA637AU/2K5 Status (1) Package Type Package Pins Package Drawing Qty TO-99 PDIP PDIP SOIC SOIC SOIC SOIC SOIC TO-99 PDIP PDIP TO-99 TO-99 TO-99 PDIP PDIP SOIC SOIC LMC P P D D D D D LMC P P LMC LMC LMC P P D D 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 50 50 75 2500 20 50 50 75 2500 2500 75 75 1 50 50 20 20 Eco Plan (2) Lead/Ball Finish AU Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU AU Call TI Call TI AU AU Call TI Call TI Call TI CU NIPDAU CU NIPDAU MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples NRND ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE NRND ACTIVE ACTIVE NRND NRND OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) N / A for Pkg Type Call TI Call TI Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR Level-3-260C-168 HR N / A for Pkg Type Call TI Call TI N / A for Pkg Type N / A for Pkg Type Call TI Call TI Call TI Level-3-260C-168 HR Level-3-260C-168 HR -25 to 85 -25 to 85 -25 to 85 -25 to 85 -25 to 85 -25 to 85 -25 to 85 OPA627AM OPA627AP OPA627AP OPA 627AU OPA 627AU OPA 627AU OPA 627AU OPA 627AU OPA627BM OPA627BP OPA627BP OPA627SM OPA637AM OPA637AP OPA637AP OPA 637AU OPA 637AU Addendum-Page 1 .

TI bases its knowledge and belief on information provided by third parties.com 11-Apr-2013 Orderable Device OPA637AU/2K5E4 OPA637AUE4 OPA637AUG4 OPA637BM OPA637BM1 OPA637BP OPA637BPG4 OPA637SM Status (1) Package Type Package Pins Package Drawing Qty SOIC SOIC SOIC TO-99 TO-99 PDIP PDIP TO-99 D D D LMC LMC P P LMC 8 8 8 8 8 8 8 8 50 50 20 75 20 2500 Eco Plan (2) Lead/Ball Finish CU NIPDAU Call TI CU NIPDAU AU Call TI Call TI Call TI AU MSL Peak Temp (3) Op Temp (°C) -25 to 85 -25 to 85 -25 to 85 Top-Side Markings (4) Samples ACTIVE OBSOLETE ACTIVE NRND OBSOLETE ACTIVE ACTIVE NRND Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD TBD Green (RoHS & no Sb/Br) Level-3-260C-168 HR Call TI Level-3-260C-168 HR N / A for Pkg Type Call TI Call TI Call TI N / A for Pkg Type OPA 637AU OPA 637AU OPA637BM OPA637BP OPA637BP OPA637SM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. Pb-Free (RoHS Exempt). Where designed to be soldered at high temperatures. OBSOLETE: TI has discontinued the production of the device. Device is in production to support existing customers. TI has taken and Addendum-Page 2 . Efforts are underway to better integrate information from third parties. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package. (4) Multiple Top-Side Markings will be inside parentheses.The planned eco-friendly classification: Pb-Free (RoHS). TI Pb-Free products are suitable for use in specified lead-free processes. Samples may or may not be available. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device.The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications. and a lifetime-buy period is in effect.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. -.1% by weight in homogeneous material) (3) MSL. PREVIEW: Device has been announced but is not in production. or Green (RoHS & no Sb/Br) . The component is otherwise considered Pb-Free (RoHS compatible) as defined above. and makes no representation or warranty as to the accuracy of such information. NRND: Not recommended for new designs. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0. (2) Eco Plan . LIFEBUY: TI has announced that the device will be discontinued.ti.please check http://www. Peak Temp. or 2) lead-based die adhesive used between the die and leadframe.1% by weight in homogeneous materials. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances. including the requirement that lead not exceed 0. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible).PACKAGE OPTION ADDENDUM www. but TI does not recommend using this part in a new design. and peak solder temperature.

TI and TI suppliers consider certain information to be proprietary.com 11-Apr-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. Addendum-Page 3 .PACKAGE OPTION ADDENDUM www. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. and thus CAS numbers and other limited information may not be available for release.ti.

PACKAGE MATERIALS INFORMATION www.0 Q1 Q1 OPA627AU/2K5 OPA637AU/2K5 2500 2500 Pack Materials-Page 1 .2 5.0 330.0 8.4 6.0 W Pin1 (mm) Quadrant 12.2 K0 (mm) 2.1 2.0 12.4 12.4 B0 (mm) 5.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SOIC SOIC D D 8 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.4 6.ti.1 P1 (mm) 8.0 12.

0 367.com 26-Jan-2013 *All dimensions are nominal Device OPA627AU/2K5 OPA637AU/2K5 Package Type SOIC SOIC Package Drawing D D Pins 8 8 SPQ 2500 2500 Length (mm) 367.0 Width (mm) 367.0 Pack Materials-Page 2 .0 Height (mm) 35.PACKAGE MATERIALS INFORMATION www.ti.0 367.0 35.

.

.

.

.

com/computers www. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties. mask work right. In any case of use of non-designated products.com/space-avionics-defense www.com/communications www. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.com/security www. latest issue.com www. Use of such information may require a license from a third party under the patents or other intellectual property of the third party.ti. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal.com/consumer-apps www. limitations.ti. mainly for automotive use. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. and to discontinue any product or service per JESD48.IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections. Except where mandated by applicable law. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk. conditions. and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.com dsp. To minimize the risks associated with Buyers’ products and applications. and any use of TI components in its applications.ti.com/wirelessconnectivity Mailing Address: Texas Instruments. regulatory and safety-related requirements concerning its products.ti. either express or implied. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. Buyers are responsible for their products and applications using TI components.ti.com www.com logic.com/industrial www.ti.ti. Texas Instruments Incorporated Applications Automotive and Transportation Communications and Telecom Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space. in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.ti. is granted under any patent right. Post Office Box 655303.com/medical www.ti.dlp.ti. improvements and other changes to its semiconductor products and services per JESD46.ti. such components are subject to these terms.com microcontroller. Information of third parties may be subject to additional restrictions.ti-rfid.ti. In some cases. monitor failures and their consequences. TI is not responsible or liable for any such statements.com www. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures. TI warrants performance of its components to the specifications applicable at the time of sale.ti.ti.com power. notwithstanding any applications-related information or support that may be provided by TI. Dallas. machine.ti. lessen the likelihood of failures that might cause harm and take appropriate remedial actions.ti.com www. Products Audio Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity www. TI components may be promoted specifically to facilitate safety-related applications.ti.com dataconverter. TI has specifically designated certain components as meeting ISO/TS16949 requirements. testing of all parameters of each component is not necessarily performed. Texas 75265 Copyright © 2013.com www. or other intellectual property right relating to any combination.ti.com/energy www. TI will not be responsible for any failure to meet ISO/TS16949. Buyers should provide adequate design and operating safeguards.com/omap TI E2E Community e2e.com/automotive www. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.ti. or a license from TI under the patents or other intellectual property of TI. TI does not warrant or represent that any license.ti.ti. Avionics and Defense Video and Imaging www.com/video . With such components.com/clocks interface. and notices. or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. enhancements. TI is not responsible or liable for such altered documentation. copyright. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.com/audio amplifier. TI assumes no liability for applications assistance or the design of Buyers’ products. latest issue. Nonetheless. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.ti.