Advanced Circuit Materials Division 100 S.

Roosevelt Avenue Chandler, AZ 85226 Tel: 480-961-1382, Fax: 480-961-4533 www.rogerscorp.com

Advanced Circuit Materials

RT/duroid® 5870/5880 Laminates

Data Sheet

RT/duroid® 5870 /5880 High Frequency Laminates

Features:

RT/duroid® 5870 and 5880 glass microfiber reinforced PTFE composites are designed for exacting stripline and microstrip circuit applications. Glass reinforcing microfibers are randomly oriented to maximize benefits of fiber reinforcement in the directions most valuable to circuit producers and in the final circuit application. The dielectric constant of RT/duroid 5870 and 5880 laminates is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5870 and 5880 laminates to Ku-band and above. RT/duroid 5870 and 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

• • • • • • • • • • •

Lowest electrical loss for reinforced PTFE material Low moisture absorption Isotropic Uniform electrical properties over frequency Excellent chemical resistance Commercial Airline Broadband Antennas Microstrip and Stripline Circuits Millimeter Wave Applications Military Radar Systems Missile Guidance Systems Point to Point Digital Radio Antennas

Some Typical Applications:

Normally supplied as a laminate with electrodeposited copper of ¼ to 2 ounces/ ft.2 (8 to 70m) on both sides, RT/duroid 5870 and 5880 composites can also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specified. When ordering RT/duroid 5870 and 5880 laminates, it is important to specify dielectric thickness, tolerance, rolled or electrodeposited copper foil, and weight of copper foil required.

The world runs better with Rogers.®

5) 8. including any warranty of merchantability or fitness for a particular purpose or that the results shown on this data sheet will be achieved by a user for a particular purpose. © 2013 Rogers Corporation.224m) STANDARD COPPER CLADDING ¼ oz. These commodities.5.4.508mm).5.5 ASTM D257 ASTM D257 Process [4] Dielectric Constant.8 1210 (176) ultimate strain % Compressive Modulus 1360 (198) 803 (120) 30 (4. tan  Thermal Coefficient of r Volume Resistivity Surface Resistivity 2 X 107 Test at 23°C Test at 100°C 490 (71) 430 (63) 34 (4.015” (0.2 31.33 ± 0.3) 52 (7. 2 oz.8 9. Contact customer service for available claddings and panel sizes.5.8) 4.4) MPa (kpsi) A ASTM D695 ultimate stress 37 (5.062” (1. technology and software are exported from the United States in accordance with the Export Administration regulations.RT/duroid 5870/5880 Laminates PROPERTY [1] TYPICAL VALUE [2] RT/duroid 5870 2.8 UL94 N/A pli (N/mm) N/A N/A after solder float N/A N/A [1] Specification values are measured per IPC-TM-650. Revised 1001 043013 Publication #92-101 . r Design Dissipation Factor. 2. and the Rogers’ logo are licensed trademarks of Rogers Corporation.96 (0.5. (35m).4) 25 (3.0012 -115 2 X 10 7 RT/duroid 5880 2.2 27. except where noted.23) 0.2) 21 (3.3 3.127mm).20 ± 0. It is not intended to and does not create any warranties express or implied. Refer to Rogers’ technical paper “Dielectric Properties of High Frequency Materials” available at http://www.5. please contact Rogers Corporation.0004 0.41 ASTM D3850 ASTM D792 IPC-TM-650 2. All rights reserved.5 3 X 107 Test at 23°C 1070 (156) 860 (125) 29 (4.005” (0.2 (5. 0.9) 6.com/acm.9) 29 (5.5.5.02 0.5 IPC-TM-650.02 spec. law prohibited.8 17. STANDARD THICKNESS 0.020” (0.9 710 (103) 710 (103) 940 (136) 27 (3.6mm) D48/50 80°C 0-100°C N/A N/A 1 oz (35m) EDC foil Calculated ASTM D570 ASTM C518 IPC-TM-650. 0. (9 m) electrodeposited copper foil.5.1) 43 (6.5.02 spec. The world runs better with Rogers.20 31 48 237 500 2.254mm).150°C C96/35/90 C/96/35/90 TEST METHOD 1 MHz IPC-TM-650 2.010” (0.33 2.20 2. The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials.062” (1.3 8. but for some products these values may be incorrect for design purposes.0005 0. ½ oz.3 10 GHz IPC-TM-2.2) 27 (3.7 12. Diversion contrary to U.0009 -125 2 X 10 7 DIRECTION Z Z Z Z Z Z Z Z UNITS[3] N/A N/A N/A ppm/°C Mohm cm Mohm CONDITION C24/23/50 C24/23/50 8 GHz . 2. r values and tolerance reported by IPC-TM-650 method 2. 1 oz.3 10 GHz IPC-TM 2.7 % Specific Heat Moisture Absorption Thermal Conductivity Coefficient of Thermal Expansion Td Density Copper Peel Flammability Lead-Free Process Compatible 0. 23°C. Testing based on 1 oz. [3] SI unit given first with other frequently used units in parentheses.S.A. We recommend that prototype boards for new designs be verified for desired electrical performance.5.5 are the basis for quality acceptance.3 8. 0.5. 0. r Dielectric Constant.8) 8.1) 9.6 N/A X Y X Y X Y X Y Z X Y Z X Y Z N/A N/A Z X Y Z N/A N/A N/A N/A N/A J/g/K (cal/g/C) % W/m/K ppm/°C °C TGA gm/cm 3 Tensile Modulus 1300 (189) 1280 (185) MPa (kpsi) A ASTM D638 ultimate stress 50 (7.787mm) 0.02 0. [2] Typical values should not be used for specification limits.22 22 28 173 500 2.S. especially microstrip designs.031” (0. (70m) electrodeposited and rolled copper foil.9) 18 (2.4 7.23) 0.175mm) STANDARD PANEL SIZE 18” X 12” (457 X 305mm) 18” X 24” (457 X 610mm) 18” X 36” (457 X 915mm) 18” X 48” (457 X 1. 2. RT/duroid.6 680 (99) 860 (125) 520 (76) 23 (3.3) 8. The user should determine the suitability of Rogers’ circuit materials for each application.3) 54 (7.8) V-0 Yes 0.0 ultimate strain 3. 2.125” (3. If more detailed information is required.7 8.96 (0.5. Printed in U.4.381mm). (17m).5.2 5.40 GHz C24/23/50 C24/23/50 -50 .8) 34 (4.5 7. Thick metal cladding are also available.5 Test at 100°C 450 (65) 380 (55) 20 (2. method 2.5.8 500 (73) 500 (73) 670 (97) 22 (3.6) 7.20 0.0 4. 2. electrodeposited copper foil.7) 37 (5.33 0.3) 42 (6. [4] The design Dk is an average number from several different tested lots of material and on the most common thickness/s.5 @ ~10GHz.5 Differential Phase Length Method 1 MHz IPC-TM-650.575mm) 0.rogerscorp.5) V-0 Yes N/A .3) 4.2 (4.

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