Samsung System LSI Business

NS (Stephen) Woo, Ph.D. President & GM of System LSI Samsung Electronics
0/32

Disclaimer

The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives, plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties

that could cause actual results to differ materially from those in the presentation files above.
For us, particular uncertainties which could adversely or positively affect our future results include: · The behavior of financial markets including fluctuations in exchange rates, interest rates and commodity prices · Strategic actions including dispositions and acquisitions

· Unanticipated dramatic developments in our major businesses including CE (Consumer Electronics),
IM (IT & Mobile communications), DS (Device Solutions) · Numerous other matters at the national and international levels which could affect our future results These uncertainties may cause our actual results to be materially different from those expressed in this report.

1/32

System Semiconductor Industry
Samsung System LSI : Now Looking Forward

Market of Mobile Device
Smartphone
(billion units)

Tablet
1.3
(billion units)

1.2
1.0 0.8
0.5 0.5
22% 9%

0.6

0.7

0.4
0.3 0.2
0.07
25% 58% 0.19

0.09

0.5 0.3 2012 2013

0.6

0.7

0.1
0.07 0.05 2012

0.06 0.12 2013

0.26

2014(E)

2015(E)

2014(E)

2015(E)

Premium

Mid + Low

Premium

Mid + Low

* Source : Gartner, Strategy Analytics, 2013 3Q

* Source : Gartner, 2013 3Q

3/32

Computing Power
• New applications require higher computing/bandwidth
Computing/Bandwidth

Dual Camcording

1080p Video Single Camcording Location Based Service Web browsing

Voice Command

Resolution
4/32

Display Trend
• Higher resolution
FHD-class Display

Display
Resolution UHD
(3,840x2,160)

WQHD
(2,560x1,440)

FHD
(1,920x1,080)

HD-class Display

HD
(1,280x720)

2011

2013

2015(E)

5/32

Camera Sensor Trend
• Image quality enhancement is also improving
Camera Sensor
20Mp Resolution 16Mp
13Mp 8Mp Wide Dynamic Range

Image Stabilization

Wide Dynamic Range

Face Detection

5Mp 3Mp 2007 2009

Face Detection

Image stabilization 2013 2015(E)

2011

6/32

System Semiconductor Industry

Samsung System LSI : Now
Looking Forward

Three business areas
SOC LSI

Foundry
AP Connectivity

Image Sensor Display Driver IC Smart Card IC Power Management IC

Foundry
8/32

Product Portfolio

• Powerful CPU/GPU • Low Power
Camera Sensor

• Pixel Leadership • Slim Solution

Power Sequence Control & I2C Interface

• PMIC line: AP & OLED • High Efficiency • High Accuracy
PMIC WiFi/BT GPS NFC SIM

• World’s Best Performance • Low Power Consumption • High Density e-SE Module

vt

• Smartphone

Display Driver IC T-Con

• Full line up for next FHD • Lower Power solution • Fast Speed (New Architecture)
eDRAM

• IoT

T-con
Backlight control

9/32

1. AP (Application Processor)
• Focusing on high performance with low power consumption
CPU Leadership
Game changing technology :
big.LITTLE octa core

Powerful GPU
Richer 3D graphics with
Energy efficiency

Low Power
Advanced mobile process &
design methodologies

Low

High

big

LITTLE
Low High

10/32

Computing Power
• Has been leading AP industry since 2009
 Innovation in both Architecture & Silicon Technology
(DMIPS)
30,000

Cortex-A15
2.xGHz

20,000

Cortex-A9 Quad
1.4GHz

Cortex-A15 Octa 1.6GHz

10,000

Cortex-A9 Dual

ARM11
800MHz 2008

Cortex-A8
1.0GHz

1.2GHz

2009

2010 11/32

2011

2012

2013

* Source : Samsung Electronics Co., Ltd., ARM

*DMIPS : Dhrystone Million Instructions Per Second

big.LITTLE Architecture
• Best of both worlds: high performance and low energy
 Heterogeneous architecture for energy efficiency

1 3

2 4
LITTLE
C-A7

C-A15

big

1 3

2
4

12/32

big.LITTLE Architecture
• 20% gain at performance and energy, respectively
Performance
Higher is Better + 20%

Energy
Lower is Better -15 ~ 20%

big.LITTLE

Conventional

big.LITTLE

Conventional

*Source : Samsung Electronics Co., LTD, 2013 2Q

*Source : Samsung Electronics Co., LTD, 2013 2Q

*Conventional : big CPU only

13/32

Advanced Silicon Process
• Leadership in low-power, advanced silicon process
Vdd 90/65nm 45nm 32nm 28nm
Strained Si ULK

20nm m
1st Gen HK/MG
2nd Gen HK/MG 1st Gate Last HK/MG

14nm 10nm

1.2V

1.1V
1.0V 1.0V

1st Gen FinFET

0.9V
0.8V 2006, 2009 2010 2012 2013 2014(E)

2nd Gen FinFET

0.7V

* Source : Samsung Electronics Co., Ltd. *Vdd : Supplying voltage of drain

Process Node
14/32

2. Image Sensor
• Higher resolution & smaller pixel have driven sensor industry
Pixel Pitch (um)
5.6

Back-side Illumination Pixel

12Mp
8Mp 5Mp
2.8 2.25 1.8

13Mp

ISOCELL Wide Dynamic Range

Resolution

3Mp

VGA

1.3Mp

2Mp

1.4 1.1
Sub 1um

Standard Mobile Imaging Architecture (SMIA)

2004

2005

2006

2007

2008

2009 15/32

2010

2011

2012

2013

* Source : Samsung Electronics Co., Ltd.

Pixel Architecture
• To increase sensitivity and decrease light loss & crosstalk
Gap-less u-lens
Increase sensitivity

Deep PD
Reduce loss in Si

Light-guide
Reduce metal layer reflection
u-lens C/F
Metal Photo-diode

Without color interference

Conventional

Light-guide

ISOCELL
No light loss

Back-side illumination
Remove metal layer reflection
G R

With color interference

G

R

Photo Photo Diode Diode

Photo Photo Diode Diode

Back-side illumination

ISOCELL
16/32

Front-side Back-side illumination illumination

New Products for 2014-15

• 16Mp ISOCELL Sensor with 1.12um pixels
- Main sensor for smartphones - Wide dynamic range & Auto focus

• Next APS-C sensor
- Sensor for mirror-less cameras

17/32

3. Foundry
Advanced technology and continuous capacity growth

Customers

One stop IP shopping and design support

Technology & Capacity
IP & Design Support

Best service for development and mass production

Partnership with customers
Service

18/32

14nm Achievement
• World’s leading 14nm FinFET solution via collaboration

Samsung : 14nm FinFET test sample & Design Infrastructure ready

ARM , Cadence, Synopsys & Mentor
 FinFET Design Enablement Platform  First Cortex-A7 implementation

19/32

Technology & Capacity

Samsung

IBM

ISDA

Giheung, KR

STMicro.

GlobalFoundries Austin, Texas, USA
* ISDA : International Semiconductor Development Alliance

Hwaseong, KR

20/32

System Semiconductor : Introduction Samsung System LSI : Now

Looking Forward

1

“Widcon” & TSV (Through Silicon Via)
64-bit CPU

2

3

FinFET Process

22/32

“Widcon” with TSV
• Wide connection between logic and memory
 Higher bandwidth, lower power consumption
Memory Stacking with TSV

Short Connection with TSV

Micro Bump

DRAM u-bump

AP Package PCB

23/32

Widcon in reality
• World’s 1st AP using Widcon & TSV

Performance
Higher is Better 14% 33% Lower is Better 60%

Power

43%

Widcon1 LPDDR3

Widcon2 LPDDR4

Widcon1

LPDDR3

Widcon2 LPDDR4

*Source : Samsung Electronics Co., Ltd., JEDEC, 2013 1Q

24/32

64-bit CPU core for Smart Devices
• 2-step approach:
 AP with ARM’s 64-bit core
 AP with Samsung’s own 64-bit core

Samsung

25/32

14nm FinFET Technology
• FinFET technology leadership
 Lower Vdd and delay than a planar process
Structure
FinFET
Delay

Advantage
20nm Planar

Gate

Source

Drain

Less Delay Lower Vdd
Vdd

26/32

New Business

1

ModAP (Cellular Modem + AP) IoT Foundry 2.0

2

3

27/32

1. ModAP (Modem + AP)
• Dual tracks for modem collaboration
 High-end : 2-chip strategy with Tier-1 modem suppliers  Mid/low-end : ModAP using system company’s modem
Existing Products Additional Products

AP
Memory

ModAP Modem
AP Modem

Memory

Memory

28/32

ModAP
• System LSI’s 1st ModAP was shipped in 3Q’13

Exynos 4 Quad + System Company’s Modem

29/32

2. IoT (Internet of Things)
• Smart building, Smart community, . . . • Total connectivity solutions
Air conditioning and Temperature control Energy Generation Energy Storage

Lighting Control

Control of Elevators and Escalators

Total Solutions
Security Control Disaster Prevention Monitoring Cameras

30/32

3. Foundry 2.0
• Technical leadership … 14FF and beyond
Foundry 2.0
1

Follower Tier 1 only Silicon

 Technology Leadership  Tier 1 + Tier 2/3  Silicon + IP Provider

2

3

31/32

Foundry 2.0
• 10nm FinFET Leadership
 Schedule
*SRD: Semiconductor Research & Development

SRD

 Performance, power and area ISDA

• Early EUV Adoption

32/32

Concluding Remarks
• Samsung S.LSI provides total solution for connected world
 Mobile AP (Application Processor)  Image Sensor

 ModAP
 IoT

• Samsung S.LSI offers attractive foundry solution
 Leading-edge technology: 14FF  Capacity

33/32

Sign up to vote on this title
UsefulNot useful