SN65MLVD200A

www.ti.
com
www.ti.com
4
3
1
2
DE
D
RE
R
6
7
A
B
LOGIC DIAGRAM (POSITIVE LOGIC)
5
4
2
3
DE
D
RE
R
12
11
A
B
10
9
Y
Z
SN65MLVD202A, SN65MLVD205A
SN65MLVD200A, SN65MLVD204A
www.ti.com
www.ti.com
www.ti.com
www.ti.com
www.ti.com
V
AB
or V
YZ
A/Y
B/Z
I
A
or I
Y
V
B
or V
Z
V
A
or V
Y
V
OS
V
A
+ V
B
2
V
I
D
V
CC
V
Y
+ V
Z
2
or
I
B
or I
Z
I
I
V
AB
or V
YZ
49.9
3.32 k
3.32 k
_
+
-1 V V
test
3.4 V
A/Y
B/Z
D
V
OS
R1
24.9
A/Y
C3
2.5 pF
V
OS(PP)
nV
OS(SS)
V
OS(SS)
1.3 V
B/Z
A/Y
0.7 V
B/Z
D
R2
24.9
C1
1 pF
C2
1 pF
V
Test
+
-
A/Y
B/Z
I
OS
0 V or V
CC
-1 V or 3.4 V
www.ti.com
Output
A/Y
Output
t
pLH
t
pHL
Input
C3
0.5 pF
B/Z
D
0 V
0.9V
V
0 V
t
f
t
r
V
CC
V
CC
/2
0 V
SS
SS
0 V
0.1V
SS
SS
C1
1 pF
C2
1 pF
V
P(H)
V
P(L)
R1
50
A/Y
B/Z
R1
24.9
t
pZH
t
pHZ
t
pZL
t
pLZ
V
CC
V
CC
/2
0 V
0.6 V
0.1 V
0 V
-0.6 V
0 V
-0.1 V
DE
Output With
D at V
CC
Output 0 V or V
CC
DE
Output With
D at 0 V
C1
1 pF
R2
24.9
C4
0.5 pF
C2
1 pF
D
C3
2.5 pF
www.ti.com
A/Y
B/Z
0 V or V
CC
1.62 k , 1% V
A
, V
B
, V
Y
or V
Z
t
c(n)
1/f0
0 V
0 V
Period Jitter
0 V Diff
Peak to Peak Jitter
1/f0
PRBS INPUT
OUTPUT
V
A
-V
B
or V
Y
-V
Z
V
A
-V
B
or V
Y
-V
Z
CLOCK
INPUT
IDEAL
OUTPUT
ACTUAL
OUTPUT
V
CC
V
CC
/2
t
jit(per)
= t
c(n)
-1/f0
t
jit(pp)
0 V
V
CC
V
CC
/2
0 V
V
A
-V
B
or V
Y
-V
Z
V
A
-V
B
or V
Y
-V
Z
(V
A
+ V
B
)/2
I
O
R
V
CM
V
O
V
ID
V
A
I
A
A
B
I
B
V
B
www.ti.com
1.2 V
1.0 V
t
pLH
0.2 V
-0.2 V
V
A
V
B
V
ID
90%
V
OH
V
OL
t
pHL
10%
t
f
t
r
V
O
V
CC
/2
V
O
V
ID
V
B
V
A
C
L
0 V
15

pF
www.ti.com
15

pF
t
pZL
t
pLZ
V
OL
V
OL
+0.5 V
V
O
R
L
499
_
+
V
TEST
B
A
RE
1.2 V
Inputs
V
CC
1 V
V
CC
V
CC
/2
0 V
V
CC
V
CC
/2
V
TEST
A
RE
R
0 V
1.4 V
A
t
pZH
t
pHZ
0 V
V
OH
-0.5 V
V
CC
V
CC
/2
0 V
V
OH
V
CC
/2
RE
V
O
R
Output
V
TEST
C
L
www.ti.com
t
c(n)
1/f0
Period Jitter
Peak to Peak Jitter
1/f0
PRBS INPUT
OUTPUT
CLOCK INPUT
IDEAL
OUTPUT
ACTUAL
OUTPUT
t
jit(per)
= t
c(n)
-1/f0
t
jit(pp)
V
A
-V
B
INPUTS
V
A
-V
B
0.2 V - Type 1
0.4 V - Type 2
V
IC
1 V
V
OH
V
CC
/2
V
OL
V
OH
V
OL
V
CC
/2
V
OH
V
OL
V
CC
/2
V
A
V
B
SN65MLVD202AD (Marked as MLVD202A)

SN65MLVD205AD (Marked as MLVD205A)
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
NC
R
RE
DE
D
GND
GND
V
CC
V
CC
A
B
Z
Y
NC
NC - No internal connection
1
2
3
4
8
7
6
5
R
RE
DE
D
V
CC
B
A
GND
SN65MLVD200AD (Marked as MF200A)
SN65MLVD204AD (Marked as MF204A)
(TOP VIEW)
www.ti.com
INPUTS OUTPUT
V
ID
= V
A
- V
B
L H
- 50 mV < V
ID
< 50 mV L ?
V
ID
- 50 mV L L
X H Z
TYPE-1 RECEIVER (200A, 202A)
V
ID
50 mV
Open Circuit L
RE
?
R
TYPE-2 RECEIVER (204A, 205A)
H = high level, L = low level, Z = high impedance, X = Dont care, ? = indeterminate
INPUT OUTPUTS
L
H
OPEN
X
X
DRIVER
D DE A OR Y
H
H
H
OPEN
L
L
H
L
Z
Z
H
L
H
Z
Z
ENABLE
B OR Z
X Open Z
INPUTS OUTPUT
V
ID
= V
A
- V
B
L H
50 mV < V
ID
< 150 mV L ?
V
ID
50 mV L L
X H Z
V
ID
150 mV
Open Circuit L
RE
L
R
X Open Z
360 k
400
V
CC
DRIVER INPUT AND DRIVER ENABLE
D or DE
7 V
400
V
CC
RE
7 V
RECEIVER ENABLE
V
CC
7 V
10
10
RECEIVER OUTPUT
360 k
DRIVER OUTPUT
A/Y or B/Z
R
V
CC
200 k
250 k
200 k
250 k
100 k 100 k
V
CC
RECEIVER INPUT
B A
www.ti.com
0
5
10
15
20
25
30
40 15 10 35 60 85
I

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
C
C
T
A
Free-Air Temperature C
V
CC
= 3.3 V
f = 50 MHz
V
ID
= 200 mV
V
IC
= 1 V
Rx
Tx
0
5
10
15
20
10 20 30 40 50
I
f Frequency MHz

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
C
C
Tx
Rx
V
CC
= 3.3 V
V
ID
= 200 mV
V
IC
= 1 V
T
A
= 25C
90
60
50
40
30
20
0 1 2 4

R
e
c
e
i
v
e
r

H
i
g
h

L
e
v
e
l

O
u
t
p
u
t

C
u
r
r
e
n
t

m
A
V
OH
High Level Output Voltage V
3
I
O
H
80
70
V
CC
= 3.0 V
10
0
V
CC
= 3.6 V
V
CC
= 3.3 V
T
A
= 25C
0
30
40
50
60
70
0 1 2 4

R
e
c
e
i
v
e
r

L
o
w

L
e
v
e
l

O
u
t
p
u
t

C
u
r
r
e
n
t

m
A
V
OL
Low Level Output Voltage V
3
I
O
L
10
20
V
CC
= 3.6 V
V
CC
= 3.3 V
V
CC
= 3.0 V
T
A
= 25C
www.ti.com
3
3.20
3.40
3.60
3.80
4
40 15 10 35 60 85
R
e
c
e
i
v
e
r

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

n
s
T
A
V
CC
= 3.3 V
V
ID
= 200 mV
V
IC
= 1 V
f = 1 MHz
C
L
= 15 pF
t
pLH
t
pHL
2
2.2
2.4
2.6
2.8
40 15 10 35 60 85
D
r
i
v
e
r

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

n
s
T
A
V
CC
= 3.3 V
f = 1 MHz
R
L
= 50
t
pHL
t
pLH
20
28
36
44
52
60
20 40 60 80 100
Signaling Rate Mbps
A
d
d
e
d

D
r
i
v
e
r

P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

p
s
V
CC
= 3.3 V
T
A
= 25C
2
15
-1 PRBS NRZ
0
6
12
18
24
30
10 20 30 40 50
Clock Frequency MHz
A
d
d
e
d

D
r
i
v
e
r

C
y
c
l
e
-
T
o
-
C
y
c
l
e

J
i
t
t
e
r

p
s
V
CC
= 3.3 V
T
A
= 25C
Input = Clock
www.ti.com
10
16
22
28
34
40
10 20 30 40 50
Clock Frequency MHz
A
d
d
e
d

R
e
c
e
i
v
e
r

C
y
c
l
e
-
T
o
-
C
y
c
l
e

J
i
t
t
e
r

p
s
V
CC
= 3.3 V
T
A
= 25C
V
IC
= 1 V
Type-1
V
ID
= 200 mV
Type-2
V
ID
= 400 mV
40
48
56
64
72
80
40 15 10 35 60 85
A
d
d
e
d

D
r
i
v
e
r

P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

p
s
T
A
V
CC
= 3.3 V
V
IC
= 1 V
f = 100 Mbps
2
15
-1 PRBS NRZ
0
60
120
180
240
300
20 40 60 80 100
A
d
d
e
d

R
e
c
e
i
v
e
r

P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

p
s
Signaling Rate Mbps
Type-2
V
ID
= 400 mV
Type-1
V
ID
= 200 mV
V
CC
= 3.3 V
T
A
= 255C
V
IC
= 1 V
2
15
-1 PRBS NRZ
0
60
120
180
240
300
40 15 10 35 60 85
T
A
A
d
d
e
d

R
e
c
e
i
v
e
r

P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

p
s
Type-2
V
ID
= 400 mV
Type-1
V
ID
= 200 mV
V
CC
= 3.3 V
V
IC
= 1 V
2
15
-1 PRBS NRZ
www.ti.com
Horizontal Scale = 2 ns/div
V
e
r
t
i
c
a
l

S
c
a
l
e

=

1
2
7
.
2

m
V
/
d
i
v
Horizontal Scale = 2 ns/div
V
e
r
t
i
c
a
l

S
c
a
l
e

=

4
0
0

m
V
/
d
i
v
www.ti.com
-100
-50
0
50
100
150
200
Type 1
Transition Regions
Type 2
Low
High
Low
High
-

D
i
f
f
e
r
e
n
t
i
a
l

I
n
p
u
t

V
o
l
t
a
g
e

-

m
V
V
I
D
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
SN65MLVD200AD ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65MLVD200ADG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br)
SN65MLVD200ADR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
SN65MLVD200ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 8-Jan-2007
Addendum-Page 1
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 8-Jan-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
SN65MLVD200ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65MLVD200ADR SOIC D 8 2500 340.5 338.1 20.6
SN65MLVD202ADR SOIC D 14 2500 333.2 345.9 28.6
SN65MLVD204ADR SOIC D 8 2500 340.5 338.1 20.6
SN65MLVD205ADR SOIC D 14 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
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regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2012, Texas Instruments Incorporated

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SN65MLVD202AD (Marked as MLVD202A)

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