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LCD TV SERVICE MANUAL


CHASSIS : LP91A

MODEL : 32LH20R
CAUTION

32LH20R-LA/TA

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................17 EXPLODED VIEW .................................................................................. 18 SVC. SHEET ...............................................................................................

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit


AC Volt-meter

Before returning the receiver to the customer,


always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)


With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc. 0.15uF

1.5 Kohm/10W

When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

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LGE Internal Use Only

IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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LGE Internal Use Only

SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range
This spec sheet is applied to LCD TV used LP91A chassis.

3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC

2. Specification
Each part is tested as below without special appointment. 1) Temperature : 255C (779F), CST : 405C 2) Relative Humidity : 6510% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.

4. Electrical specification
4.1. General Specification
No 1 2 3 4 5 6 7 Item Screen Size Aspect Ratio LCD Module Operating Environment Storage Environment Input Voltage LDC Module (Maker : LGD) Coating 16:9 32 TFT WXGA LCD Temp.: 0 ~ 40 deg Humidity : 0 ~ 85 % Temp.: -20 ~ 60 deg Humidity : 0~ 85 % AC100-240V~, 50/60Hz 150 W HD 32 HD 760 x 450 x 48 0.17025 x 0.51075 12 EEFL 3H Unit : mm Specification 32 wide Color Display Module Measurement Remark Resolution : 1366*768

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5. Chroma& Brightness (Optical)


5.1. LCD Module the Color Coordinates check condition - 50cm from the surface, Full White Pattern - Picture mode Vivid
No. 1. 2. 3. Item Luminance (W/O PC mode) VIew angle (R/L, U/D) Color Coordinates White RED Green Blue 4. 5. Contrast ratio Luminance Variation Wx Wy Xr Yr Xg Yg Xb Yb 700:1 Typ -0.03 178 / 178 0.279 0.292 0.636 0.335 0.291 0.613 0.146 0.061 1000:1 1.3 Typ +0.03 degree LGD LGD 32(HD) Min. 400 Typ. 500 Max. Unit cd/m2 Maker Remark

6. Component Video Input (Y, PB, PR)


No Resolution 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 720* 480 720* 480 720* 576 720* 480 720* 480 720* 576 1280* 720 1280* 720 1280* 720 1920* 1080 1920* 1080 1920* 1080 1920* 1080 1920* 1080 1920* 1080 Specification H-freq(kHz) 15.73 15.75 15.625 31.47 31.50 31.25 44.96 45.00 37.50 28.125 33.72 33.75 56.25 67.432 67.5 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 50.00 59.94 60.00 50 59.94 60.00 Pixel Clock(MHz) 13.500 13.514 13.500 27.000 27.027 27.000 74.176 74.250 74.25 74.250 74.176 74.25 148.5 148.350 148.5 SDTV, DVD 480I( 525I) SDTV, DVD 480I( 525I) SDTV, DVD 576I( 625I) 50Hz SDTV 480P SDTV 480P SDTV 576P 50Hz HDTV 720P HDTV 720P HDTV 720P 50Hz HDTV 1080I 50Hz, HDTV 1080I HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P Remark

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

7. RGB
7.1. Analog PC, RGB- DTV NOT SUPPORT No Resolution 1 2 3 4 5 6 7 8 9 640* 350 720* 400 640* 480 800* 600 1024* 768 1280* 768 1360* 768 1280* 1024 1920* 1080 Specification H-freq(kHz) 31.468 31.469 31.469 37.879 48.363 47.776 47.72 63.668 66.587 V-freq(Hz) 70.09 70.09 59.94 60.317 60.004 59.87 59.799 59.895 59.934 Pixel Clock(MHz) 25.17 28.32 25.17 40 65 79.5 84.75 109.00 138.50 EGA DOS VESA( VGA) VESA( SVGA) VESA( XGA) VESA( WXGA) VESA( WXGA) XGA WUXGA(Reduced Blanking) Only FHD Model Only FHD Model Proposed Remark

8. HDMI Input
8.1. PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No 1 2 3 4 5 6 7 8 Resolution 640 x 480 800 x 600 1024 x 768 1280 x 768 1360 x 768 1366 x 768 1280 x 1024 1920 x 1080 H-freq(kHz) 31.469 37.879 48.363 47.776 47.72 47.7 63.595 66.647 V-freq.(Hz) 59.94 60.317 60.004 59.87 59.799 60.00 60.00 59.988 Pixel clock(MHz) 25.17 40.00 65.00 79.5 84.62 84.62 108.875 138.625 Proposed VESA( VGA) VESA( SVGA) VESA( XGA) VESA( WXGA) VESA( WXGA) WXGA SXGA WUXGA Remark

8.2. DTV Mode No Resolution 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 720 x 480 720 x 480 720 x 576 720 x 480 720 x 480 720 x 576 1280 x 720 1280 x 720 1280 x 720 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 Specification H-freq(kHz) 15.73 15.75 15.625 31.47 31.5 31.25 44.96 45 37.5 28.125 33.72 33.75 56.25 67.432 67.5 27 33.75 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 50.00 59.94 60.00 50.00 59.94 60.00 24.00 30.00 Pixel Clock(MHz) 13.500 13.514 13.500 27 27.027 27 74.176 74.25 74.25 74.25 74.176 74.25 148.5 148.350 148.5 74.25 74.25 SDTV, DVD 480I(525I) SDTV, DVD 480I(525I) SDTV, DVD 576I(625I) 50Hz SDTV 480P SDTV 480P SDTV 576P HDTV 720P HDTV 720P HDTV 720P HDTV 1080I HDTV 1080I HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P
LGE Internal Use Only

Remark Spec. out but display.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis. (2) Download steps 1) Execute ISP Tool program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the Connect button and confirm Dialog Box

2. Specification
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 5 C of temperature and 6510% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.

3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) Input Tool-Option/Area option. (3) Download the EDID - EDID datas are automatically download when adjusting the Tool Option2 (4) ADC Calibration RGB / Component (4) Check SW Version.

3) Click the Config. button and Change speed I2C Speed setting : 350Khz~400Khz

3.2. SET assembly adjustment items


(1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Intelligent Sensor Inspection Guide (5) Preset CH information (6) Factoring Option Data input

4. PCB assembly adjustment method


4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack
- LH20/ LH30

4) Read and write bin file. Click (1)Read tab, and then load download file(XXXX.bin) by clicking Read.

Filexxx.bin

Fil

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LGE Internal Use Only

1
Filexxx.bin

5) Click (2)Auto tab and set as below 6) Click (3)Run. 7) After downloading, you can see the (4)Pass message.

(3). Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) Refer to Job Expression of each main chassis assy (EBTxxxxxxxx) for Option value Caution : Dont Press IN-STOP key after completing the function inspection.

4.3. EDID D/L method


Recommend that dont connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data 4.3.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds.

4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version. -> S/W download process is executed automatically. 3) Show the message Copy the file from the Memory

4) After Finished the Download, Automatically DC Off -> On 4.3.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear OK, then compele.

5) Check The update SW Version.

4.2. Input tool option.


Adjust tool option refer to the BOM. - Tool Option Input : PCBA Check Process - Area Option Input : Set Assembly Process After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally) (1) Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market (2) Equipment : adjustment remote control. 4.3.3. RS-232C command Method (1) Command : AE 00 10 * Caution Dont connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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LGE Internal Use Only

4.3.4. EDID data (1) Analog(RGB): 128bytes>

4.4. ADC Calibration


4.4.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component1 or 2 mode. 2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2. (MSPG-925F Model: 209 / Pattern: 65 )

(2) HDMI 1 : 256Bytes

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select 0. ADC calibration : Component by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear (3) HDMI 2 : 256Bytes
OK

4.4.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select 0. ADC calibration : RGB by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear
OK

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LGE Internal Use Only

4.5. Check SW Version


(1) Method 1) Push In-star key on Adjust remote-controller. 2) SW Version check Check SW VER : V3.xx LH70

5.2. Adjustment of White Balance


: (For automatic adjustment)

* LP91A~D Support RS-232C & I2C DDC CommunicationWhite Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)

5. PCB assembly adjustment method


5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because being different of each Countrys Language and signal Condition. (2) Equipment : adjustment remote control. (3) Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) Refer to Job Expression of each main chassis assy (EBTxxxxxxxx) for Option value.

* White Balance Adjustment


- Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. - Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. - Adjustment mode : Three modes Cool / Medium / Warm - Required Equipment 1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product LCD TV( ch : 9 ), (should be used in the calibrated ch by CS-1000) 3) Auto W/B adjustment instrument(only for Auto adjustment)

5.3. Adjustment of White Balance


(for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing POWER ON key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push Exit key. 3) Change to the AV mode by remote control. 4) Input external pattern (85% white pattern) 5) Push the ADJ key -> Enter 0000 (Password) 6) Select 3. W/B ADJUST 7) Enter the W/B ADJUST Mode 8) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 10) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others 11) When adjustment is completed, Enter COPY ALL. 12) Exit adjustment mode using EXIT key on R/C.
LGE Internal Use Only

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* CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode Cool Medium Warm x y Temp 11,000K 9,300K 6,500K uv 0.000 0.000 0.003 0.2760.002 0.2830.002 0.2850.002 0.2930.002 0.3130.002 0.3290.002

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

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TROUBLESHOOTING
No power (LED indicator off) :

[A] PROCESS

Check 24V, 12V, 5,2V of Power B/D Pass

Fail

Check short of Main B/D or Change Power B/D

Check Output of IC1001, IC1003, IC1007

Fail

Check short of IC1001, IC1003, IC1007 Pass

Fail

Re-soldering or Change defect part of IC1001, IC1003, IC1007

Pass Change IC1002,, Q1003 Fail Check LEDAssy Change LED Assy

Pass

Check P307 Connector

No Raster

[B]: Process

Pass

Check LED status On Display Unit Pass

Fail

Repeat A PROCESS

Check Panel Link Cable Or Module Pass

Fail

Change Panel Link Cable Or Module

Check Inverter Connector Or Inverter Pass

Fail

Change Inverter Connector Or Inverter

Check Output of IC802 Pass Check LVDS Cable

Fail

Change IC802

Fail

Change Module

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No Raster on PC Signal

Pass Check Input source Cable and Jack Pass Check the Input/Output Of J104 Pass Check the Input/Output Of IC100 Pass Check the Input/Output Of IC800 Pass Repeat [A], & [B] Process Re-soldering or Change the defect part Re-soldering or Change the defect part, Check RGB EDID Data Re-soldering or Change the defect part

Fail

Fail

Fail

No Raster on COMMPONENT Signal

No Raster on HDMI Signal Pass Check Input source Cable And Jack Pass Check the Input/Output Of JK301, JK302, JK303 Re-soldering or Change the defect part Re-soldering or Change the defect part

Pass

Check Input source Cable And Jack

Pass Check The Input/Output Of JK101

Fail

Fail

Pass Check the Input/Output Of IC300, IC301, JK302 Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP

Pass Check the Input/Output Of IC800 Re-soldering or Change the defect part

Fail

Pass Check the Input/Output Of IC800 Pass Repeat [A], & [B] Process Re-soldering or Change the defect part

Fail

Fail

Repeat [A], & [B] Process

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 15 -

LGE Internal Use Only

No Raster On AV (Video, S-Video)Signal Pass Check Input source Cable And Jack Pass

No Signal On TV(RF) Signal Pass

Check Input source Cable And Jack Pass

Check The Input/Output Of JK101, JK201

Fail

Re-soldering or Change the defect part

Check The Input/Output Of TU500

Fail

Re-soldering or Change the defect part

Pass Pass Check the Input/Output Of IC800 Re-soldering or Change the defect part Check the Input/Output Of IC800 Re-soldering or Change the defect part

Fail

Fail

Pass Repeat [A], & [B] Process

Pass Repeat [A], & [B] Process

No Sound

Check The Input Sourse.

Fail

Change The Source Input.

Pass

Check The Input/Output Of IC600. Pass

Fail

Re-soldering or Change the defect part.

Check The Speaker.

Fail

Change Speaker.

Pass

Check The Speaker Wire.

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

- 16 -

LGE Internal Use Only

HDMI1 HDMI2 TX HDMI1_SCL/ _ SDA PC_Aud io _L/ R PC_SCL/ SDA PC_R/ G/ B/ HS/ VS COMP1_Y/ Pb / Pr : 1/ 0. 7Vp p COMP2_Y/ Pb / Pr : 1/0. 7Vp p MNT_OUT RIN COMP1_LIN/ COMP2_LIN/ RIN DDR2( 512MB) EEPROM( 256K) Serial Flas h ( 8MByt e)

TMDS TMDS

EEPROM 24C02 IR HDMI_DATA_1 HDMI_DATA_2

HDM 2_SCL/ SDA

PC_Aud io EEPROM 24C02

EEPROM 24C02 PC_Aud io _L/ R :7 00m Vrms

RGB_PC

PC_R/ G/ B/ HS/ VS

Pr : 1/ 0. 7Vp p COMP1_Y/ Pb / P

USB Fo r D/ L

OUT_O_TX_A OUT_O_TX_A OUT_O_TX_B OUT_O_TX_B OUT_O_TX_C OUT_O_TX_C OUT_O_TX_CLK OUT_O_TX_C OUT_O_TX_D OUT_O_TX_D OUT_O_TX_E OUT_O_TX_E

USB EEPROM 24C02 HDMI3_SCL/ SDA

USB_DN/ PN

HDMI3

TMDS

HDMI_DATA_3 IIS_OUT AV2_LIN/ RIN AV2_VIN

L VDS c onnec tor

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
AV1_VIN MNT_VOUT AV1_LIN/ RIN

COMP1 COMP2

COMP2_Y/ Pb /Pr / : 1/ 0. 7Vp p Co mp 1_L/ R : 5 00mVrms Co mp 2_L/ R : 5 00mVrms

AV1_VIN: 1Vp p

MNT_OUT

MNT_OUT: 1Vp p

AV1

AV11_LIN/ RIN :5 00m Vrms

BLOCK DIAGRAM

- 17 MAIN SCALER
MNT_L/ R OUT TU_MAIN SIF TXD / RXD :5V Dig it al AUDIO AMP SUB_SCL / SDA TU_MAIN SIF 232C Driver ST3232C

MNT_LOUT/ ROUT : 500m Vrm s

TV ( RF)

TUNER

OUT_E_TX_A OUT_E_TX_A OUT_E_TX_B OUT_E_TX_B OUT_E_TX_C OUT_E_TX_C OUT_E_TX_CLK OUT_E_TX_CLK OUT_E_TX_D OUT_E_TX_ OUT_E_TX_E OUT_E_TX_

Tx/ Rx : 15Vp p

RS232

PWM NTP3100L R_CH L_CH

R_SPK_OUT L_SPK_OUT

SIDE_L/ SIDE_R : 5 00mVrms

AV2 ( Sid e AV)

LGE Internal Use Only

SIDE_V : 1Vp p

EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400 520

805

540

530

801

804

803

LV1

550

806

200T

802

200

200N

120

300

510

Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes

320

310

500

900

A2

A10

- 18 -

LGE Internal Use Only

EAX56856904 H6 LCD MERCURY

COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100


JK100 PPJ226-01 9A [GN]1P_CAN 4A [GN]O-SPRING_A COMP2_Y
R109 75

3A [GN]CONTACT_A 9B [BL]1P_CAN 8B [BL]C-LUG_A COMP2_PB


ZD101 SD05 R108 75

ZD102 SD05 SD05 ZD103

9C [RD]1P_CAN_1 8C [RD]C-LUG_A COMP2_PR


ZD100 SD05 R107 75

9D [WH]1P_CAN 8D [WH]C-LUG_A_1
R114 10K

COMPONENT1

COMP2_L
R118 12K

9E [RD]1P_CAN_2 4E [RD]O-SPRING_A_1 3E [RD]CONTACT_A_1


R113 10K

MNT_OUT

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
D101 30V R104 220K

COMP2_R
R117 12K

9F [YL]2P_CAN
[YL]O-SPRING_B 5J

ADUC30S03010L_AMODIODE

D100 30V R100 220K

MNT_VOUT
[YL]CONTACT_B 6J

R102 75

4F [YL]O-SPRING_A 3F [YL]CONTACT_A 9G [WH]2P_CAN


ZD104 SD05 SD05 ZD105

16V100uF C102 R110 75

CVBS_VIN

SPK_R-_HOTEL

R103 0 HOTEL_OPT

AV1

MNT_LOUT 9H [RD]2P_CAN
5L
D104 30V R111 220K R119 12K

[WH]C-LUG_B

7K

8G [WH]C-LUG_A_2
R115 10K

16V 10uF

C100

CVBS_LIN

MUTE_LINE
[RD]O-SPRING_B

Q100 RT1C3904-T112

POP NOISE

C B E

C103 100pF READY

D102 30V NON_HOTEL_OPT

4H [RD]O-SPRING_A_2
R116 10K D105 30V R112 220K R120 12K

SPK_R+_HOTEL
[RD]CONTACT_B 6L

CVBS_RIN

MNT_ROUT

R105 0 HOTEL_OPT R106 0 NON_HOTEL_OPT

3H [RD]CONTACT_A_2

AUDIO_R

16V 10uF C101 R101 0 HOTEL_OPT

D103 30V NON_HOTEL_OPT

MUTE_LINE

POP NOISE

Q101 RT1C3904-T112 E

S-VIDEO(China Model)

S-VIDEO JK101 PSJ014-01

D107 30V

R122 75

SIDE_C

C-LUG1

S-VIDEO

+3.3V_MULTI_MST

C-LUG2

R123 10K

GND

0-SPRING

S_VIDEO_DET

C-LUG3

C-LUG4

D106 30V

C104 OPT READY

SHIELD

ZD106 SD05

SIDE_Y

R121 75

ZD107 SD05

S-VIDEO

INPUT1 : COMPONENT1, S-VIDEO


MSTAR N-EU INPUT1 2008/12/16 1 9

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX56856904 H6 LCD MERCURY

RS-232C (CI ITEM)


+5V_MULTI

PC
JK200

KCN-DS-1-0088
C204 0.1uF C206 0.1uF C207 0.1uF

JK202 KCN-DS-1-0089
6630TGA004K
C C A A C AC

+3.3V_MST 1
AC AC

ENKMC2837-T112 D210

ENKMC2837-T112 D211

C203 0.1uF

1 11
RED GREEN_GND R211 75

C1+

ENKMC2837-T112 D212

IC200 ST3232CDR
GND_2

6 2
PC_R DSUB_SDA PC_G
30V
R207 68

6
RED_GND

16 VCC

R202

100

V+

C200 0.1uF

15 GND

D200 ADUC30S03010L_AMODIODE 30V

7 2 12
GREEN D204 ADUC30S03010L_AMODIODE DDC_DATA

7 3 8
IR_OUT

C1- 3

14 T1OUT

C2+
BLUE_GND

13 R1IN

R203

100

8 3 13
BLUE H_SYNC

R212 75

C201 0.1uF

C2-

12

R1OUT

D201 ADUC30S03010L_AMODIODE 30V

V- 6

11 T1IN

IR_OUT

4
PC_B
R208 68

ZD200 SD05

R214 4.7K

C213 68pF

PC_HS

9
NC

R213 75

C202 0.1uF

T2OUT

10 T2IN

+3.3V_MST 4 14
GND_1 ZD201 SD05 R215 4.7K V_SYNC

9 5 10
10
SYNC_GND

R2IN 8

9 R2OUT

C211 68pF

PC_VS

R204 4.7K

R205 4.7K

UB01123-4HHS-4F

USB DOWN STREAM

USB_DL_P 4 FAULT/ ENABLE 3


4 5

KJA-UB-4-0004

USB_DP
3

5 4

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5
DDC_GND

15

DDC_CLOCK ADUC30S03010L_AMODIODE 30V D209

RXD TXD
16
SHILED

DSUB_SCL

SIDE AV

JK201

PPJ218-01

PC SOUND JK203
SIDE_V
R227 75

4A[YL]O_SPRING
3 6A 7A
R224 D206 30V R226
12K
READY

PEJ024-01 E_SPRING T_TERMINAL1 B_TERMINAL1 R_SPRING 4 5 T_SPRING 7B 6B 8 B_TERMINAL2 T_TERMINAL2 SHIELD_PLATE

5A[YL]CONTACT

5.6B ZD202

PC_AUD_R
R233 10K D202 30V CDS3C30GTH R231 220K R235 12K

5.6B ZD203

2A[YL]U_CAN
10K R223 220K

3B[WH]C_LUG
SIDE_LIN

2B[WH]U_CAN
R225 D205 30V
READY

PC_AUD_L
R234 10K R236 12K D203 30V CDS3C30GTH R232 220K

4C[RD]O_SPRING
10K R228 12K R222 220K

SIDE_RIN

5C[RD]CONTACT

2C[RD]U_CAN

Close to SIDE_USB

USB
+5V_USB
OCP_READY C AC A Pin to Pin with EAN43439401 KDS226 D213 REAR_USB JK205

L201 500

0 R237 Non_OCP

C214

100uF 16V

PC EDID
IC201 CAT24C02WI-GT3
A0 VCC 1 A1 8

+5VST_MST

C212

220uF 16V

USB DOWN STREAM

JK204 6 VOUT 5 ILIMIT R210 4.7K OCP_READY GND 2 VIN 1

C210 10uF 6.3V R238 510 OCP_READY L200 120OHM OCP_READY C208 0.1uF OCP_READY

IC202 OCP_READY MIC2009YM6-TR

R219 4.7K
READY 2 A2 7 WP

R220 4.7K R216 100


SCL 3 VSS 6

R221 4.7K

C205 0.01uF

**

1A Design

REAR_USB R229

USB_DL_N OCP_READY R206 160 R209 1K OCP_READY

Its possibel to 27~47ohm R200 USB_DN USB_DL_N 0

R217 100

R230

R201

USB_DL_P

C209 10uF OCP_READY

SDA

R218 100

REAR_USB

D207 30V READY

D208 30V READY

DDC_WP DSUB_SCL DSUB_SDA

SIDE_USB

INPUT2 : PC,RS-232C,SIDE AV,USB


MSTAR N-EU INPUT2 2008/12/16

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX56856904 H6 LCD MERCURY


OPTION SW_HPD : USE SW HPD (Default) MST_HPD : USE MST HPD

+5V_MULTI
+5V_HDMI_2 +5V_HDMI_3
A2 A1 A2 A1

+5V_MULTI
+5V_HDMI_3

2SC3875S D301 KDS184S R314 1K R312 10K


B RT1C3904-T112 E A0 1 8 WP VCC C300 0.01uF

+5V_HDMI_2 D302 KDS184S

Q301
C

HPD_MST_2
IC301 CAT24C02WI-GT3

RT1C3904-T112

R303 1K Q302C 2SC3875S


IC302 CAT24C02WI-GT3
C

R301 10K

HPD_MST_3
R327 100 R309 R311 10K 10K
C301 0.01uF

E A0 1 8 WP A1 2 7 SCL VCC

A1 2 7 SCL

DDC_WP
JACK_GND 3 6 SDA 20 VSS 19 HPD 18 +5V_POWER 17DDC/CEC_GND 16 SDA 15 SCL 14 NC 13 CEC 12 CLK11 CLK_SHIELD 10 CLK+ 9 DATA08 DATA0_SHIELD 7 DATA0+ 6 DATA15 DATA1_SHIELD 4 DATA1+ 3 DATA22 DATA2_SHIELD 1 DATA2+ JP305 JP304 4 5 A2

R329 100

R319 R320 10K 10K

DDC_WP

A2 3 6 SDA

R304 100 R305 100 R318 100

R317 100

22 VSS 4 5

19

18

17

JP301

16

15

JP300

DDC_SDA2 DDC_SCL2 CEC TMDS2_RXCCEC TMDS3_RXC-

DDC_SDA3 DDC_SCL3

14

13

12

11 10 CLK+

9 DATA0-

8 DATA0_SHIELD

7 DATA0+

6 DATA1-

5 DATA1_SHIELD

A2

R302 1K
IC300 CAT24C02WI-GT3
A0 1 8 WP VCC C

HPD_MST_1
R315 68K CEC_READY
A1 2 7 SCL

R300 10K

Q300C

RT1C3904-T112

2SC3875S R331 100 R308 R310 10K 10K


C302 0.01uF

A1

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
TMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ TMDS2_RX1TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+
KJA-ET-0-0032 JK303

4 DATA1+

3 DATA2-

2 DATA2_SHIELD

1 DATA2+

20 JACK_GND

TMDS3_RXC+ TMDS3_RX0TMDS3_RX0+ TMDS3_RX1TMDS3_RX1+ TMDS3_RX2TMDS3_RX2+

21

JK302 QJ41193-CFEE1-7F

+5V_MULTI
+5V_HDMI_1 +3.3V_MST

+5V_HDMI_1 D300 KDS184S

DDC_WP

R316 56K CEC_READY D303 MMBD301LT1G 30V CEC_READY R313 0

A2 3 6 SDA

R306 100 R307 100

CEC_C CEC
D304 CDS3C30GTH 30V CEC_READY

22 VSS 4 5

19

Q303 BSS83 CEC_READY D B G S

18 JP302

17

16 JP303

15

DDC_SDA1 DDC_SCL1

14

13

12

11 10 CLK+

9 DATA0-

8 DATA0_SHIELD

7 DATA0+

6 DATA1-

5 DATA1_SHIELD

4 DATA1+

3 DATA2-

2 DATA2_SHIELD

CEC TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ TMDS1_RX1TMDS1_RX1+ TMDS1_RX2TMDS1_RX2+

1 DATA2+

20 JACK_GND

21

JK301 QJ41193-CFEE1-7F

MSTAR N-EU HDMI

2008/12/16 3 9

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX56856904 H6 LCD MERCURY

PANEL WAFER
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4P401 TF05-51S FF10001-30

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-

+5V_+12V_LCD
P402 1 1 2 2 3 3 4 4 5 5 6 7 TXCE3+ TXCE36 7 8 TXCLKETXCLKE+ TXCE3TXCE3+ TXCE2TXCE2+ TXCLKE14 14 15 TXCE2+ 16 17 18 TXCLKE+ 19 20 21 TXCLKETXCE3+ TXCE3TXCE4+ 23 24 25 25 26 27 28 28 29 30 31 26 27 TXCE422 TXCE0+ TXCE0TXCE1TXCE1+ TXCE2+ TXCE2TXCE1+ TXCE2TXCE1TXCLKE+ 15 16 17 18 19 20 21 TXCE0TXCE0+ 22 23 24 9 10 11 12 13

+5V_+12V_LCD

+5V_+12V_LCD

P403
SMW200-28C

1 2 3 4 5 6 7

IR(Non 19/22/26) CONTROL KEY(Non 19/22/26)


HD(26/32/37/42/47")
8 9 10 11 12 13

SUB_SCL
+3.3V_MST
8 9

L411 500-ohm NON_19_22_26" L410 500-ohm NON_19_22_26" R421 4.7K


10

SUB_SDA

NON_19_22_26"

L403 120ohm

R420 4.7K

KEY1
11 12

NON_19_22_26"

L406 120ohm

NON_19_22_26" 13 14 15 16 17 18 19 20 21 22

C404 470pF TXCE1C411 0.1uF


NON_19_22_26"

C412 470pF

NON_19_22_26"

KEY2

NON 22/27" FHD R419 0 R422 0 NON 22/27" FHD TXCE0+ TXCE0TXCE1+

NON_19_22_26"

C408 0.1uF

NON_19_22_26"

P400

12507WS-12L

+5VST_MST

SCL

ZD401

SDA

L404 120-ohm +3.3V_MULTI_MST R401 4.7K 10BIT

3 23 24 25 26 27 28

GND

ZD402

C406 47uF 16V

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
IR
+5VST_MST +5VST_MST
29 30

KEY1

KEY2

FHD
NON 22/27" FHD R425 0 R431 0 NON 22/27" FHD TXCO0+ TXCO0TXCO1+ TXCO1-

5V_ST

R401 R402 0 8 B I T o r 5 2 s h a r p 10BIT(FHD) 4.7K

+3.3V_MULTI_MST

GND

8 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 READY 52 TXCO4TXCO4+ TXCO3TXCLKO-

WARM_ST(LED_R_BIG)

R429 10K IR-OUT R430 22 IR-OUT

IR

ZD400 R428 10K IR-OUT B TXCLKO+ C E Q405 2SC3052 IR-OUT TXCO3+ C Q404 2SC3052 E IR-OUT

L402 120ohm C403 C407 47pF R427 10K IR-OUT

IR_OUT
TXCO2+ TXCO2-

8BIT(HD) 8BIT(FHD) 52 sharp 32 sharp

X X X X

R402 X 0 0 0 X

R435 470 OPC_ENABLE R405 READY 0 R411 1K

+3.3V_MULTI_MST B

0.1uF READY +3.3V_MST

*8BIT(FHD):22/27"

OPC_EABLE C B OPC_EN OPC_ENABLE E Q400 RT1C3904-T112 OPC_ENABLE

10

GND

11

ST_3.3V(LED_B)

NON_19_22_26" NON_19_22_26" R417 0

R426 47K IR-OUT

L407 120-ohm

R400

OPC_OUTPUT

12

POWER_ON(LED_R_SMALL)

C414

READY

OPC_OUT
R412 0 OPC_ENABLE

HD(19/22")
E-DIM
External VBR

0.1uF NON_19_22_26" 16V R403

13

0 NON_19_22_26"

+3.3V_MULTI_MST NON 22/27" FHD R423 0 R409 100 R407 4.7K JEIDA R424 0 VESA

19_22_26" P405

IR(19/22/26")

KEY1

READY R413 0

KEY2

GND

5V_ST

GND

+3.3V_MULTI_MST

IR

LED_B

19_22_26" L408 BG1608B121F

SUB_SCL

8 19_22_26" P404 SMAW200-03 19_22_26" L400 BG1608B121F KEY1 1 KEY1 LED_R KEY2 19_22_26" 19_22_26" 3 C400 100pF 50V C401 GND 100pF 19_22_26" 50V 2 L401 BG1608B121F KEY2

LED_R

C405 100pF 50V 19_22_26"

R404 10K 19_22_26" R416 0 READY C R410 10K 19_22_26" B Q401 E 19_22_26" 2SC3052

+3.3V_MST

CONTROL KEY (19/22/26")

19_22_26" L405 BG1608B121F

R414 10K 19_22_26"

+3.3V_MST

C402 100pF 50V

R406 4.7K 19_22_26"

19_22_26"

C B Q402 E 2SC3052 19_22_26"

R415 10K 19_22_26"

R418 0 READY

MSTAR LVDS,CTR KEY

2008/12/16 4 9

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX56856904 H6 LCD MERCURY

TU500-*1 TAFT-H203F

TU500 TAFT-Z203D
1 2
+5V_TUNER

NC_1 GND_1 +B[5V] NC_2 RF_AGC TP[3.3V_OPT] NC_3 GND_2 SDA SCL MOPLL_AS NC_4 V-OUT NC_5 A-OUT SIF-OUT NC_6

1 NC_1 2 GND_1
3 4 5 6 NTSC_TUNER 7 8
+5V_TUNER

Near the pin


C508 10uF 16V

3 +B[5V] 4 NC_2
C505 100uF 16V C506 100uF 16V C509 100uF 16V

C501 0.01uF

L500

5 RF_AGC

120-ohm

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
9 10
L501
L501-*1 120-ohm 0 0 Ohm

READY

6 TP[3.3V_OPT] 7 NC_3 8 GND_2


M_SDA M_SCL
C503 0.1uF 50V

R504 47

C502 27pF

R505 47 R506 220 R507 220


C504 READY

11

TV_MAIN
13 14 15 16

12

9 SDA 10 PAL_TUNER SCL C500 27pF 11 MOPLL_AS 12 NC_4 13 V-OUT


E B Q502 ISA1530AC1 C

14 NC_5 MAIN_SIF
17 18 19 20 21 SHIELD

L502 10uH READY

R502 4.7K

C507 82pF READY

NC_7 NC_8 NC_9

15 A-OUT 16 SIF-OUT 17 NC_6 18 NC_7

19 NC_8

20 NC_9

21

SHIELD

MSTAR TUNER

2008/12/16 5 9

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX56856904 H6 LCD MERCURY

AMP :GAIN X 4
+12V_AUDIO

IC601
HOTEL_OPT

+1.8V

L606 +16V_NTP
Q600 RT1C3904-T112 R607 1K NON_HOTEL_OPT E C627 6800pF R605 4.7K B C

120-ohm

MLB-201209-0120P-N2 R613 10K C631 33pF R618 6.8K


READY

C620 0.1uF R613-* 12K

1 OUT1 LM324DOUT4 14 2 INPUT1- INPUT4- 13 3 INPUT1+ INPUT4+ 12 4 VCC GND 11

+1.8V_AVDD
C642 10uF 35V

0LCML00003B C615 0.1uF C613 0.01uF R608 12 R611 12 L603 2S DA-8580 2F R626 3.3 R625 3.3 C671 0.01uF
SPK_L-

L605

C617 0.1uF

R604 3.3 C612 330uF 35V

120-ohm

+1.8V_DVDD C672 0.01uF

MNT_LOUT
SPK_L+
C637 0.1uF C632 0.47uF +12V_AUDIO C635 0.01uF C669 0.1uF R623 4.7K R663 4.7K

MLB-201209-0120P-N2 0LCML00003B

C619 390pF C621 390pF R610 R638 12 12 1S 1F EAP38319001

MNT_L_AMP

R614 5.6K

+3.3V_MST C616 22000pF C618 1uF C633 33pF +12V_AUDIO


NON_HOTEL_OPT

SPK_L-

R630 10K R616 10K


HOTEL_OPT C B E R609 1K

C611

22000pF

MNT_R_AMP

R615 5.6K

5 INPUT2+ INPUT3+ 10 6 INPUT2- INPUT3- 9


R622 6.8K

C BST1B 44 43 VDR1B

PGND1A_2

PGND1A_1 OUT1A_2

OUT1A_1

PVDD1A_2

PVDD1A_1 PVDD1B_2

PVDD1B_1 OUT1B_2

OUT1B_1

PGND1B_2 46 45

E 55 54 53 52 51 50 49 48 47 C622 0.1uF
Q601 RT1C3904-T112

Q603 RT1C3904-T112

56

PGND1B_1

R629

B 10K

R616-* 12K

READY

SW_RESET
42 41 40 39 38 37 36 35 34 33 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2 R621 12 C643 0.1uF C647 0.01uF R667 4.7K C626 0.1uF C629 0.1uF R635 3.3 C634 390pF C673 0.47uF 1S 1F EAP38319001 R654 12 PVDD2A_1 R671 3.3 PVDD2A_2 +16V_NTP C644 0.1uF R628 4.7K C648 0.01uF OUT2A_1 R658 R653 12 12 C630 L607 390pF 2S DA-8580 2F OUT2A_2 PGND2A_1 C625 22000pF PGND2A_2 BST2A C624 1uF
R606 4.7K C628 6800pF

R624 NC VDR2A

7 OUT2

OUT3 8

BST1A

15

16

17

18

19

20

21

22

23

24

25

26

27

C604 10uF 16V DVDD WCK BCK SDA SCL FAULT SDATA VDR2B BST2B MONITOR_0 MONITOR_1 MONITOR_2 PGND2B_1 28

+1.8V_DVDD

DVSS_2

100

100

100

R676

R677

R678

R656 0 HOTEL_OPT

I2S_SDO I2S_WS I2S_SCK M_SDA M_SCL AMP_MUTE_HOTEL

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
MNT_ROUT
SPK_R+

READY

VDR1A

MULTI_PW_SW

0 R631 22K READY R627

RESET

C608 R601 100 1uF C606 1000pF

AD

DVSS_1

VSS_IO

I2S_MCLK

CLK_I

+3.3V_MULTI_MST

VDD_IO

IC600 NTP-3100L

+1.8V_AVDD

DGND_PLL

AGND_PLL

10

C605 C603 0.1uF 1000pF C601 100pF R600 3.3K

LFM 31 30 29

11

Main AMP
32

+1.8V_AVDD

AVDD_PLL

12

C600 10uF 16V

C602 0.1uF

DVDD_PLL

13

SPK_R-

TEST0

14

+1.8V_DVDD

C607 0.1uF 50V

C609 10uF 16V

C610 0.1uF

C614 1uF

C623 22000pF

R602 R603 100 100

R673 0 C651 1000pF 50V

MULTI_PW_SW

Chinese Hotel Option


+16V_NTP P601 12505WR-09A00 HOTEL_OPT 1 R620 0 C636 HOTEL_OPT 0.1uF HOTEL_OPT 2

P600

SMAW250-04

SPK_RC638 33pF 50V READY C639 33pF 50V READY

AUDIO_R
+3.3V_MULTI_MST
HOTEL_OPT

3 4 R619 0 5 6

SPK_R+

SPK_L-

SPK_L+

AMP_MUTE_HOTEL

R612 200 B HOTEL_OPT

R617 SW_RESET 10K HOTEL_OPT C Q602 RT1C3904-T112 HOTEL_OPT E

SPK_R+_HOTEL SPK_R-_HOTEL

8 9 10

MSTAR N-EU AUDIO

2008/12/16 6 9

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

DDR2_A[6] DDR2_A[4] DDR2_A[2] DDR2_A[0]

EAX56856904 H6 LCD MERCURY


DDR2_A[3] DDR2_A[7] DDR2_A[12] DDR2_A[9] DDR2_A[5] DDR2_A[10] DDR2_A[1] POWER_SW DDR2_A[11] DDR2_A[8]

*H/W OPTION
Close to IC as close as possible
+1.2V_VDDC_MST +1.8V_DDR
DDR2_CASZ DDR2_RASZ DDR2_ODT

4.7K R8010 4.7K R8011 +3.3V_MULTI_MST R896 4.7K R898 4.7K +3.3V_MULTI_MST Small_HD Non_Small_FHD Small_HD Small_FHD R898-*2 R8010-*3 R896-*2 R8011-*3 4.7K 4.7K 4.7K 4.7K 100Hz Non_Small_HD Apollo DDR2_A[0-12] 100Hz R8010-*2 R8011-*2 R898-*1 R896-*1 4.7K 4.7K 4.7K 4.7K Small_FHD Non_Small_FHD Apollo Apollo R8010-*1 R8011-*1 4.7K 4.7K Small_FHD +5VST_MST Non_Small_HD DDR2_CKE DDR2_BA0

SERIAL FLASH 64M


R867 1K
** Small HD : 19/22/26 Inch ** Non Small FHD : Normal(non 100Hz) FHD Model C811 0.1uF

IC802 MX25L6405DMI-12G R8003 10K C857 0.01uF C878 0.01uF +3.3V_MULTI_MST +1.8V_DDR
56 0.1uF 0.1uF AR812 56 AR813 56 AR814 56 AR815 56 AR800 56 1K

+3.3V_MULTI_MST I2S_OUT
TXD LED_R KEY2 KEY1 SYS_RESET CEC_C PC_VS PC_HS IR DSUB_SDA RXD TXD RXD EEP_SCL EEP_SDA RL_ON I2S_SDO I2S_SCK

DDR2_BA1 DDR2_WEZ

Small HD Small FHD (27) Non Small HD Non Small FHD Apollo 100HZ
+3.3V_MST C859 0.01uF C877 0.01uF C879 0.01uF
R8020 10K

R896 4.7K 4.7K 4.7K X X X R898 X X X 4.7K 4.7K 4.7K


+3.3V_MST

R8010 R8011 X 4.7K 4.7K 4.7K X 4.7K 4.7K X 4.7K 4.7K X 4.7K

1 HOLD
I2S_WS I2S_MCLK PANEL_STATUS

SCLK 16

C807 0.01uF
R852 C844 C863 R868 C817 20pF C816 20pF
L802 120-ohm

SPI_CLK
C864 0.01uF +1.2V_VDDC_MST
100

2 VCC C858 0.01uF C860 0.01uF

SI.SIO0 15

SPI_DI
+1.8V_DDR
X801 12MHz

3 NC_1 +3.3V_MULTI_MST
0 0 100 100 100 100 100 100 R8022 R8021 R839 1M 100 100 0.1uF

NC_8 14

C862 0.01uF

C865 0.01uF

4 NC_2
0 0 READY READY R8016 R8017

NC_7 13

+3.3V_MULTI_MST
R8035 R8034 R895 R849 R850 R8012 R824 R825 C883
C867 0.1uF C866 10uF

+3.3V_MULTI_MST
R829

5 NC_3

NC_6 12

R877 4.7K
L800 120-ohm

6 NC_4

NC_5 11

R878 4.7K

SPI_DO
R851 R854 R856 R858 AR805 56 C853 AR806 56 0.1uF R859 R862 10 10 DDR2_MCLKZ DDR2_MCLK DDR2_D[5] DDR2_D[2] DDR2_D[0] DDR2_D[7]

8 SO/SIO1 WP/ACC 9
10 10 10 10 R843 R844 33 33

HDMI_2

EEPROM
C833 0.1uF TMDS2_RX2TMDS2_RX2+ TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ R869 R871 R872 R873 R874 R879 10 10 10 10 10 10

TMDS2_RXCTMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ HPD_MST_2 TMDS2_RX1TMDS2_RX1+

IC801 24LC256-I/SM

+3.3V_MULTI_MST

HWRESET CEC VSYNC1 HSYNC1 VSYNC0 HSYNC0 IRIN GPIO140 GPIO139 GPIO138 GPIO135 GPIO134 XIN XOUT AVDD_MPLL SAR3 SAR2 SAR1 SAR0 USB0_DP USB0_DM GND_18 GND_17 UART1_TX/GPIO87 UART1_RX/GPIO86 UART2_TX/I2CM_SCK UART2_RX/I2CM_SDA SPDIFO I2S_OUT_SD I2S_OUT_BCK VDDC_7 GND_16 VDDP_5 I2S_OUT_WS I2S_OUT_MCK I2S_IN_SD I2S_IN_BCK/GPIO68 I2S_IN_WS/GPIO67 VDDC_6 A_MCLKE A_MADR[3] A_MADR[7] A_MADR[12] A_MADR[9] A_MADR[5] AVDD_DDR_6 A_MADR[10] A_MADR[1] A_BADR[0] A_BADR[1] A_WEZ A_MADR[11] A_MADR[8] A_MADR[6] GND_15 A_MADR[4] A_MADR[2] A_MADR[0] A_CASZ A_RASZ A_ODT MVREF AVDD_MEMPLL GND_14

READY

R828 C B E 10K Q805 READY RT1C3904-T112


256 255 254 253 252 251 250 249 248 247 246 245 244 243 242 241 240 239 238 237 236 235 234 233 232 231 230 229 228 227 226 225 224 223 222 221 220 219 218 217 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193

SPI_CZ

7 CS

GND 10

DDC_WP

DDR2_D[0-15]

DDR2_D[13] DDR2_D[10] DDR2_D[8] DDR2_D[15]

A0

VCC

A1

WP

C803 0.01uF

A2

SCL

HDMI_1

R8027 4.7K
C815 TMDS1_RX1TMDS1_RX1+ C849 0.1uF 0.1uF R880 R890 10 10

R8028 4.7K

DDR2_DQS1M DDR2_DQS1P

R812
TMDS1_RX2TMDS1_RX2+ HPD_MST_1 IC800 C819 0.1uF MST99A88ML(MATRIX BASIC) R891 R892 10 10

22

EEP_SCL

R845 C841 0.01uF

22K

P_24V_SMALL_15V P_12V_SMALL_15V

NON 19_22"

AUL0 AUR0 AUL1 AUR1 AUL2 AUR2 AUL3 AUR3 AUCOM AUL4 AUR4 GND_4 AUVRP AUVAG AVDD_AU GND_5 VDDC_2 DDCA_CK DDCA_DA DDCDA_CK DDCDA_DA DDCDB_CK DDCDB_DA GPIO20 VDDP_1 VDDC_3 UART2_RX UART2_TX DDCDC_CK RXCCKN RXCCKP DDCDC_DA RXC0N RXC0P GND_6 RXC1N RXC1P AVDD_DM RXC2N RXC2P HOTPLUGC USB1_DM USB1_DP SCK SDI SDO SCZ PWM0 PWM1 PWM2 PWM3 LVA4P LVA4M LVA3P LVA3M LVACKP LVACKM LVA2P LVA2M LVA1P LVA1M LVA0P LVA0M VDDP_2

C871 4.7uF 10V READY

D801 KDS181

R885

150

R860

1K

D802 KDS181

+5VST_MST

POWER_DET
+1.2V_VDDC_MST

GND

1K

Q803 RT1C3904-T112

Q800 ISA1530AC1

3 1

R886 C812 4.7uF

+5VST_MST

10uF 16V 0.1uF 1000pF 4.7uF

R861

1K

B E C

SW800 JTP-1127WEM

C8000 READY

2.2uF 16V

SYS_RESET

C823 2.2uF 65 CVBS_LIN 66 C824 2.2uF CVBS_RIN 67 68 69 C802 2.2uF COMP2_L 70 C873 2.2uF COMP2_R 71 C874 2.2uF 72 C875 2.2uF 73 C808 0.1uF 74 C821 2.2uF PC_AUD_L 75 C822 2.2uF PC_AUD_R 76 77 78 79 C840 0.01uF L801 80 120-ohm 81 82 R894 0 DSUB_SCL 83 R899 0 DSUB_SDA 84 R8023 100 DDC_SCL1 85 R8024 100 DDC_SDA1 86 R8025 100 DDC_SCL2 87 R8026 100 DDC_SDA2 88 R8033 0 READY POWER_DET 89 C882 0.1uF 90 R806 0 91 R870 0 92 R8039 100 HDMI3_SIDE 93 DDC_SCL3 R801 10 HDMI3_SIDE 94 TMDS3_RXCR805 10 HDMI3_SIDE 95 TMDS3_RXC+ R8040 100 HDMI3_SIDE 96 DDC_SDA3 R820 10 HDMI3_SIDE 97 TMDS3_RX0R821 10 HDMI3_SIDE 98 TMDS3_RX0+ 99 R822 10 HDMI3_SIDE 100 TMDS3_RX1R823 10 HDMI3_SIDE 101 TMDS3_RX1+ C876 0.01uF 102 R841 10 HDMI3_SIDE 103 TMDS3_RX2R848 10 HDMI3_SIDE 104 TMDS3_RX2+ 105 HPD_MST_3 106 R826 0 USB_DN 107 USB PART USB_DP R827 0 108 SPI_CLK 109 AR818 SPI_DI 33 110 SPI_DO 111 SPI_CZ 112 113 114 I-DIM 115 E-DIM 116 117 118 119 120 121 122 123 124 125 126 127 128

C809 C813 C818 C820

R8000 10K

HWRESET

CEC

VSYNC1

HSYNC1

VSYNC0

HSYNC0

IRIN

GPIO140

GPIO139

GPIO138

GPIO135

GPIO134

XIN

XOUT

AVDD_MPLL

SAR3

SAR2

SAR1

SAR0

USB0_DP

USB0_DM

GND_18

GND_17

UART1_TX/GPIO87

UART1_RX/GPIO86

UART2_TX/I2CM_SCK

UART2_RX/I2CM_SDA

SPDIFO

I2S_OUT_SD

I2S_OUT_BCK

VDDC_7

GND_16

VDDP_5

I2S_OUT_WS

I2S_OUT_MCK

I2S_IN_SD

I2S_IN_BCK/GPIO68

I2S_IN_WS/GPIO67

VDDC_6

A_MCLKE

A_MADR[3]

A_MADR[7]

A_MADR[12]

A_MADR[9]

A_MADR[5]

AVDD_DDR_6

A_MADR[10]

A_MADR[1]

A_BADR[0]

A_BADR[1]

A_WEZ

A_MADR[11]

A_MADR[8]

A_MADR[6]

GND_15

A_MADR[4]

A_MADR[2]

A_MADR[0]

A_CASZ

A_RASZ

A_ODT

MVREF

AVDD_MEMPLL

256

255

254

253

252

251

250

249

248

247

246

245

244

243

242

241

240

239

238

237

236

235

234

233

232

231

230

229

228

227

226

225

224

223

222

221

220

219

218

217

216

215

214

213

212

211

210

209

208

207

206

205

204

203

202

201

200

199

198

197

196

195

194

193

GND_14

R888 C814 0.1uF D803 KDS181

100

R887 33K

Close to IC with width trace

M_SDA M_SCL

116

117

118

119

120

121

122

123

124

125

126

127

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

SDI

SCK

AUL0

AUL1

AUL2

AUL3

AUR0

AUR1

AUR2

AUR3

AUL4

AUR4

SDO

SCZ

PWM0

PWM1

PWM2

PWM3

115

LVA4P

LVA3P

LVA2P

LVA1P

RXC0P

RXC1P

GND_4

GND_5

RXC0N

GND_6

RXC1N

AUVRP

GPIO20

RXC2N

RXC2P

LVA4M

LVA3M

LVA2M

LVA1M

LVA0P

AUVAG

LVA0M

A U C O M

VDDC_2

VDDP_1

VDDC_3

RXCCKN

RXCCKP

USB1_DP

LVACKP

DDCA_CK

AVDD_AU

DDCA_DA

UART2_RX

UART2_TX

AVDD_DM

DDCDB_CK

DDCDA_CK

DDCDB_DA

DDCDC_CK

DDCDA_DA

DDCDC_DA

HOTPLUGC

USB1_DM

LVACKM

VDDP_2

128

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
DDR2_DQS0M DDR2_DQS0P DDR2_DQM0 DDR2_DQM1 AR809 56

VSS

SDA

R813

22

EEP_SDA
C804/C805/C806:Close to IC as close as possible
PC_B PC_G PC_R R814 R803 R816 R818 R838 R833 47 C827 0.047uF

HDCP EEPROM

+3.3V_MULTI_MST

R840 C804 C805 C806 47 C843 470 C846 47 C845 47 C847 47 C825

390 0.1uF 0.1uF 0.1uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF

DDR2_D[14] DDR2_D[9] DDR2_D[12] DDR2_D[11]

R8004 4.7K
R836 47 C829 0.047uF

IC803 CAT24WC08W-T

R817 4.7K

AR810 56

A0

VCC

DDR2_D[6] DDR2_D[1] DDR2_D[3] DDR2_D[4]

A1

WP

C848
R8038 R8042

0.1uF
1K 100

R8018

C838 COMP2_PB COMP2_Y COMP2_PR SIDE_C SIDE_Y CVBS_VIN SIDE_V

0.1uF

1K

A2

SCL

R8005

22

EEP_SCL

+3.3V_MULTI_MST

VSS

SDA

R8006

22

EEP_SDA

R832 R834 R835 R837 R804 R815 R897 R802

47 47 470 47 47 47 47 47

C826 C828 C835 C830 C800 C801 C831 C832

0.047uF 0.047uF 1000pF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF

MUTE_LINE R865 4.7K SUB_SCL R866 4.7K SUB_SDA S_VIDEO_DET PANEL_ON R819 3.3K DISP_EN/VAVS_ON SW_RESET DDC_WP R893 4.7K OPC_EN

GAIN X 4
C810 MNT_VOUT_T MAIN_SIF R875 R876 C856 C861 2.2uF 2.2uF 47 47 C868 C869 0.1uF 0.1uF 0.01uF

+12V_AUDIO

TV_MAIN

R831 R857 R830

47 47 47

C834 C836 C837

0.047uF 0.047uF 0.047uF

C850

0.01uF

E B C Q801 ISA1530AC1
SIDE_LIN SIDE_RIN MNT_L_AMP MNT_R_AMP R842 C839 22K 0.01uF

R809 470

MNT_VOUT
R882 R881 R846 R847 100 100 100 100

R808

220

R8041 C B E 47 Q802 RT1C3904-T112

MNT_VOUT_T

R807 402 READY

R810 68

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11 B_DDR2_DQM[0] B_DDR2_DQM[1] AVDD_DDR_2 B_MDATA[14] B_MDATA[9] GND_10 B_MDATA[12] B_MDATA[11] AVDD_DDR_1 B_MDATA[6] B_MDATA[1] GND_9 B_MDATA[3] B_MDATA[4] VDDC_5 VDDP_3 GPIO58 GPIO57 GPIO56 GPIO55 GPIO54 GPIO53 GPIO52 GPIO51 GND_8 GPIO152/I2C_OUT_SD3 GPIO151/I2C_OUT_SD2 GPIO150/I2C_OUT_MUTE VDDC_4 GND_7 AVDD_LPLL LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129

RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA REXT VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 S-VIDEO CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 AUVRM AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1

TXCO4TXCO4+ TXCO3TXCO3+ TXCLKOTXCLKO+ TXCO2TXCO2+ TXCO1TXCO1+ TXCO0TXCO0+

R8001

C842

0.1uF

R800 READY 0

Q804 NON 19_22" RT1C3904-T112 R8037 C B R8007 33K E NON 19_22" 0

RL_ON

R855 10K

TXCE4TXCE4+ TXCE3TXCE3+ TXCLKETXCLKE+ TXCE2TXCE2+ TXCE1TXCE1+ TXCE0TXCE0+

R8036 20K 19_22_26"

C870 47uF 25V

+5VST_MST

R853

MULTI_PW_SW

HDMI_3

+3.3V_MULTI_MST

4.7K 4.7K

R863 R864

+3.3V_MULTI_MST

+3.3V_MULTI_MST

2K

R811 1K READY

R883 1K

RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172

B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11

R889 1K

R884 1K READY

REXT

22

171

B_DDR2_DQM[0]

VCLAMP

23

170

B_DDR2_DQM[1]

REFP

24

169

AVDD_DDR_2

IC800-*1 LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]


REFM 25 168 B_MDATA[14] BIN1P 26 SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 A U V R M AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 167 B_MDATA[9] 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 GND_10 B_MDATA[12] B_MDATA[11] AVDD_DDR_1 B_MDATA[6] B_MDATA[1] GND_9 B_MDATA[3] B_MDATA[4] VDDC_5 VDDP_3 GPIO58 GPIO57 GPIO56 GPIO55 GPIO54 GPIO53 GPIO52 GPIO51 GND_8 GPIO152/I2C_OUT_SD3 GPIO151/I2C_OUT_SD2 GPIO150/I2C_OUT_MUTE VDDC_4 GND_7 AVDD_LPLL LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P

RESET

[MODE SELECTION]

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MSTAR N-EU MSTAR

2008/12/16 7 9

EAX56856904 H6 LCD MERCURY

DDR2_D[0-15]
DDR2_D[0-15]

1K R907

DDR2
1K R908 C904 0.01uF C905 1000pF C918 0.1uF 50V

+1.8V_DDR

V_REF

V_REF Close to DDR2 IC


VREF J2 G8 G2 DDR2_A[0] A0 M8 M3 M7 N2 N8 N3 N7 P2 P8 P3 M2 P7 R2 B9 DQ15 B1 DDR2_D[15] DQ14 D9 DDR2_D[14] DQ13 D1 DDR2_D[13] DQ12 D3 DDR2_D[12] DQ11 DDR2_D[11] D7 DQ10 C2 DDR2_D[10] DQ9 C8 DDR2_D[9] DQ8 F9 DDR2_D[8] DQ7 DDR2_D[7] F1 DQ6 H9 DDR2_D[6] DQ5 H1 DDR2_D[5] DQ4 H3 DDR2_D[4] DQ3 DDR2_D[3] A1 A2 A3 A4 A5 A6 A7 A8 A9 A10/AP A11 A12 H7 DDR2_A[1] DDR2_A[2] DDR2_A[3] DDR2_A[4] DDR2_A[5] DDR2_A[6] DDR2_A[7] DDR2_A[8] DDR2_A[9] DDR2_A[10] DDR2_A[11] DDR2_A[12] DQ2 DDR2_D[2] DQ1 DDR2_D[1] DQ0 DDR2_D[0]

IC900 HYB18TC512160B2F-2.5

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Close to DDR2 IC +1.8V_DDR
DDR2_BA0
L2 L3 A1 E1 CK J8 J9 M9 R1 VDD1 VDD2 K8 K2 VDD3 CK READY CKE C901 0.01uF C902 0.01uF C903 0.01uF C906 0.01uF VDD4 VDD5 C907 0.01uF C908 0.01uF C909 0.01uF C910 0.01uF C911 0.01uF C912 0.01uF C913 0.01uF C914 0.01uF C915 0.01uF C916 0.01uF C917 0.01uF BA0 BA1 R906 150

DDR2_A[0-12]

+1.8V_DDR

DDR2_BA1 DDR2_MCLK DDR2_MCLKZ DDR2_CKE DDR2_ODT


CS L8 A9 C1 C3 C7 C9 R900 LDQS F7 B7 G3 G7 LDM F3 G9 B3 VDDQ1 UDM VDDQ2 VDDQ3 G1 VDDQ4 UDQS E9 VDDQ5 56 R901 56 VDDQ6 VDDQ7 VDDQ8 VDDQ9 K7 L7 K3 VDDQ10 RAS CAS WE ODT K9

DDR2_RASZ DDR2_CASZ DDR2_WEZ DDR2_DQS0P DDR2_DQS1P


R902 56 R903 56 LDQS E8 A3 E3 J3 NC4 L1 R3 R7 B2 B8 A7 D2 D8 VSSQ6 VSSQ5 VSSQ4 VSSQ3 VSSQ2 VSSQ1 E7 F2 F8 H2 VDDL J1 H8 C900 0.01uF 50V C919 10uF 10V VSSQ7 VSSQ8 VSSQ9 VSSQ10 P9 VSS1 NC5 NC6 N1 VSS2 VSS3 VSS4 A8 VSS5 UDQS

DDR2_DQM0 DDR2_DQM1
R904 56 R905 56

DDR2_DQS0M DDR2_DQS1M

NC1 A2 E2 R8 NC2 NC3

+1.8V_DDR
VSSDL J7

DDR2 MEMORY

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MSTAR DDR2

2008/12/16 8 9

P_24V_SMALL_15V C1006 68uF 35V +12V_AUDIO


120-ohm

EAX56856904 H6 LCD MERCURY


+16V_NTP C1046 0.01uF
C1001 0.1uF 50V L1012 MLB-201209-0120P-N2

L1000 CIC21J501NE EAM58113401

P_12V_SMALL_15V C1002 47uF 25V C1007 0.01uF

**5V_MULTI->3.3V->1.2V
IC1001 BD9130EFJ-E2
ADJ 1 PVCC L1002 2.2uH R1009 2K 1/10W 1% R2 10K R1006 8 EN

P1001 FM20020-24

P_5V 120-ohm C1008 0.01uF C1003 10uF 16V

L1001 +5VST_MST C1011 0.01uF

NC

Power ON

GND

GND

GND

GND

5.2V

5.2V

5.2V

10

5.2V

GND

11

12

GND

12V VCC 2 7 SW

13

14

12V

GND

15

16

GND

*ST 5V->3.3V
+5V_MULTI
ITH IC1007 AP2121N-3.3TRE1 C1017 10uF 16V R1008 12K GND 4 5 C1018 10uF 16VR1010 3.3K 1% 1/10W R1 PGND C1012 560pF 50V C1004 10uF 16V 3 6

24V

17

18

24V

NC

19

20

Inverter ON

A.Dim

21

22

Error Out

NC

23

24

PWM Dim

OUT:1.27V +1.2V_VDDC_MST C1036 1uF 25V READY

25

+5VST_MST
GND

VIN 3 2 MAX 300mA 1

VOUT

26"

C1052 10uF 16V

C1053 0.01uF

+3.3V_MST C1034 1uF 25V READY

MAX 2A V0 = 0.8*(1+(R2/R1))
IC1003 AZ1085S-3.3TR/E1

R1078 3.3 READY C1055 2200pF 50V READY C1014 0 . 1 u F C1013 10uF 16V 16V

P1000 FW20020-24S
P_5V
NON 19_22"

NC
P1002

1
AP1117EG-13 IN 3 MAX 1A 2 1 C1016 10uF 10V ADJ/GND C1015 0.1uF 50V R1 OUT

2
SMAW200-11

R1077 0 READY

Power ON
ADJ/GND

R1000 2.2K C1054 0.1uF 1 C1028 100uF 16V OUT:1.85V R1004 120 5%
R2 IC1002

19_22"

R1073
MAX 3A

INPUT 3

2 OUTPUT OUT:3.3V

R1013 0

+3.3V_MULTI_MST
L1013 MLB-201209-0120P-N2

GND

GND

+1.8V_DDR
120-ohm C1022 10uF 6.3V C1023 0.1uF 50V
DDR2, Vref

GND
15V 1

5
P_5V
15V 2
NON 19_22"

GND

P_5V

5.2V

5.2V

3 R1003 10K 12 NON 19_22" Q1000 2SC3875S

RL_ON

C1037 1uF 25V READY R1007 56 1%

+1.8V
NTP,AUDIO DSP

5.2V

10

5.2V

GND
R1074 0 1/4W 5% 19_22"

11
P_12V_SMALL_15V
GND 3

12

GND

P_12V_SMALL_15V

12V

13

14

12V

V0 = 1.25*(1+(R2/R1))
4

GND
P_24V_SMALL_15V
GND

15

16

GND

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5V 5 5V 6

P_24V_SMALL_15V

24V

17

18

24V

NC

19

20

Inverter ON

A.Dim

21

22

Error Out

NC

23

24

PWM Dim

**Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V


P_5V P_12V_SMALL_15V L1006 L1005 120-ohm 120-ohm 19/22"(HD)/22"(FHD)/32"(Sharp) 26/27/32(LPL)/37/42/47/52" R1049 33K S1 G1 1 2 S2 3 G2 4 C1056 1uF 25V
C1027 68uF 35V READY Close to Q1003

NON_19_22_26"
7 NC 8

NC

Inverter_ON 9

Q1003 SI4925BDY EBK32753101 8 D1_2 7 D1_1 6 D2_2 5 D2_1 C1019 C1021 10uF 16V 0.01uF +5V_MULTI C1005 0.1uF L1007 MLB-201209-0120P-N2 0LCML00003B R1050 2.2K R1051 2.2K R1052 2.2K C1009 100uF16V C1010 0.01uF +5V_+12V_LCD

PWM_Dim 10

PANEL_ON
R1020 10K

R1048

A.Dim 11

R1065 33K NON 19_22" R1065-*1 19_22" 10K C 10K B Q1001 RT1C3904-T112 E P_5V

R1070 22K R1069 1.6K R1068 10K C B E

C1048 1uF

R1001 0 NON CMO 57"

PANEL_STATUS POWER_SW

R1054 4.7K NON SHARP 32&52",AUO 25V R1053 C1043 0 0.47uF SHARP 52",AUO NON SHARP 52",AUO R1014 0 CMO 32,42,47,57 +5V_MULTI R1040 0 CMO 57" 3 R1047 10K 1 2 Q1002 2SC3875S R1046 3K

Q1004 RT1C3904-T112

R1064

V0 = 0.8*(1+(R1/R2))
C1026 100uF 16V READY

OUT:5V +5V_MULTI R1056 10 R1059 10K NON 19_22"


C1000 10uF 16V C1020 10uF 16V C1025 0.1uF 16V

L1010 MLB-201209-0120P-N2 C1038 1uF 25V READY

+5V_TUNER

R1041 0 CMO 57"

DISP_EN/VAVS_ON
R1023 0 NON (CMO 32,42,47,57, SHARP 32")

**DC-DC CONVERTER 12V->5V_TUNER/USB


R1

R1042 0 R1044 1K DC_DIM


OPC_DISABLE R1076 1K

R1039 0 CMO 32,42,47

+5V_USB

R1043 0 NON CMO 32,42,47,57

E-DIM OPC_OUT
R1022 1K OPC_ENABLE R1079 10K

LED Block
C1045 2.2uF 16V R1044-*1 100 DC_DIM PWM_DIM
OPC_ENABLE R1021 1K OPC_DISABLE

R1075 1K

R1057 30K R1058 5.6K 19_22" D1001


R2

IC1006 MP2212DN FB 1
C1032 560pF 50V MAX 3A

C1024 0.1uF 50V READY R1018 2K NON 19_22"

+5VST_MST

+5V_MULTI

*SHARP32":DC DIMMING I-DIM


C1044 2.2uF 16V

8 EN/SYNC GND2 S2A 50V


R1012

+5V_MULTI 7 SW_2 L1008 CIC21J501NE P_12V_SMALL_15V IN 3


0 NON 19_22"

L1009 3.6uH +5V_MULTI 6 SW_1 C1030 10uF 25V C1031 10uF 25V BS 4 5 VCC C1035 1uF 25V
R1011 0 C1029 0.1uF 50V

19_22"

Small(19_22")
R1015 10
19_22"

R1002 10K

R1005 1.2K

R10450 CMO 32,42,47,57

R1016 4.7K R1024 10 C1033 0.1uF 50V

**OPC_ENABLE : USE LGD Module

3 R1017 10K 12 19_22" Q1005 2SC3875S


19_22"

RL_ON

D1002 SAM2333

LGE Internal Use Only

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MSTAR

2008/12/16

POWER

P/NO : MFL60021510

Feb., 2009 Printed in Korea