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1. COMPANY PROFILE: Intel Corporation, incorporated in 1968, designs and manufactures integrated digital technology platforms. A platform consists of a microprocessor and chipset. The Company sells these platforms primarily to original equipment manufacturers (OEMs), original design manufacturers (ODMs), and industrial and communications equipment manufacturers in the computing and communications industries. The Company’s platforms are used in a range of applications, such as personal computers (PCs) (including Ultrabook systems), data centers, tablets, smartphones, automobiles, automated factory systems and medical devices. The Company also develops and sells software and services primarily focused on security and technology integration. The Company offers platforms that incorporate various components and technologies, including a microprocessor and chipset. A microprocessor-the central processing unit (CPU) of a computer system-processes system data and controls other devices in the system. It offers microprocessors with one or multiple processor cores. Its second and third generation Intel Core processor families integrate graphics functionality onto the processor die. In contrast, some of its previous-generation processors incorporated a separate graphics chip inside the processor package.

The Company also offers graphics functionality as part of a separate chipset outside the processor package. Processor packages may also integrate the memory controller. A chipset sends data between the microprocessor and input, display, and storage devices, such as the keyboard, mouse, monitor, hard drive or solid-state drive, and compact disc (CD), digital versatile disc (DVD) or Blu-ray drive. The Company offers and develops System-on-Chip (SoC) products that integrate its core processing functions with other system components, such as graphics, audio, and video, onto a single chip. The Company offers Intel vPro technology, a computer hardware-based security technology for the notebook and desktop market segments. During 2011, it introduced the second generation Intel Core vPro processor family. The Company offers components and platforms for mobile phones and connected devices. Key mobile phone components include baseband processors, radio frequency transceivers and power management integrated circuits. It also offers mobile phone platforms, including Bluetooth wireless technology and global positioning system (GPS) receivers, software solutions, customization, and essential interoperability tests. The Company competes with Taiwan Semiconductor Manufacturing Company, Ltd., GlobalFoundries Inc., Advanced Micro Devices, Inc., International Business Machines Corporation, Oracle Corporation, ARM Limited, NVIDIA Corporation, MIPS Technologies, Inc., QUALCOMM Incorporated, Texas Instruments Incorporated and Symantec Corporation.

2. Statistics.

Most Recent Fiscal Year Results Revenue $ 53.34B Research and Development 10.15B Expense $ EPS $ 2.13 Dividend Per Share $ 0.87 5-Year Financial Results 5-Year Revenue Growth 8.75 Rate % EPS (5 year GAAP ratio of 19.98 EPS growth) % Dividend % 12.07 Dividends 5-Year Average Dividend 0.68 Dividend Yield % 3.80 Dividends Per Share $ 0.87 Dividend Change % 10.07 Financial Strength Quick Ratio 1.60 Current Ratio 2.30 LT Debt/Equity 24.00 Total Debt/Equity 24.00

Price & Volume Recent Price $ 23.88 52 Week High $ 25.98 52 Week Low $ 19.23 Average Vol 34.43M Valuation Ratios Price/Earnings 12.90 Price/Sales 2.27 Price/Book 2.21 Per Share Ratios Dividends Per Share 0.87 $ Book Value $ 11.13 EPS $ 2.13 Revenue/Share $ 10.51 Share Related Items Market Cap. (Mil) $ 118,945.25 Shares Out (Mil) 4,982.00 Efficiency Asset Turnover 0.70 Inventory Turnover 2.90 Return on Assets 11.10

dollars Intel has a market value of 107.MARKET SHARE OF INTEL IN MOBILE CPU FOR 2013. The 100 largest companies in the world by market value in 2013 in million U. .S.995.80 million U.S Dollars.

and this represented the majority of its business until 1981. 4.3. EXPERTISE OF COMPANY Intel was an early developer of SRAM and DRAM memory chips. Although Intel created the world's first commercial microprocessor chip in . MARKET STATUS OF INTEL.

EDUCATION: Ph. 1953. it was not until the success of the personal computer (PC) that this became its primary business. was a partial homophone for "more noise" – an ill-suited name for an electronics company. Intel's third employee was Andy Grove. raising $6.1971. 2. the first successful semiconductor company in the region. During the 1990s. since noise in electronics is usually very undesirable and typically associated with bad interference. Robert N. The total initial investment in Intel was $2.8 million ($23. Rock was not an employee. In 1968 Noyce and colleague Gordon Moore formed Intel. Moore and Noyce initially wanted to name the company "Moore Noyce". Gordon E. Bachelor's degree in mathematics. a chemist and physicist). particularly against Advanced Micro Devices (AMD). before deciding to call their company Integrated Electronics or "Intel" for short. Intel completed their initial public offering (IPO). and Max Palevsky. Moore (of "Moore's Law" fame. Moore and Noyce came from Fairchild Semiconductor and were Intel's first two employees. they had to buy the rights for the name. Robert Noyce (a physicist and co-inventor of the integrated circuit). but he was an investor and Chairman of the Board. There Noyce invented a process for making integrated circuits. Grinnell College. California in 1968 by Gordon E. Instead they used the name NM Electronics for almost a year. Massachusetts Institute of Technology. 5. 1. EVENTS CHANGING THE COURSE OF INTEL INC. The name.000 from Rock. who later ran the company through much of the 1980s and the high-growth 1990s. AGE: 1927-1990 (died at age 62). Since "Intel" was already trademarked by the hotel chain Intelco. Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry. Just 2 years later. as well as a struggle with Microsoft for control over the direction of the PC industry. During this period Intel became the dominant supplier of microprocessors for PCs. 1949. however.D in physics.50 per share). At the time of his death Noyce was president of Sematech. Noyce CEO: 1968-1975 CAREER: Noyce first worked at Shockley Semiconductor. Arthur Rock (investor and venture capitalist).5 million convertible debentures and $10. but he and seven others left Shockley to start Fairchild Semiconductor in 1957. CEO’S (Intel has just 6 CEO’s till its inception to 2013).a chemical engineer. Moore . A. He was the president and chief executive from 1968 until 1975. DESCRIPTION OF EVENTS AND PRODUCTS Intel was originally founded in Mountain View. and was known for aggressive and sometimes illegal tactics in defense of its market position.

Paul S. He was a co-founder of Fairchild Semiconductor. Barrett CEO. California Institute of Technology. in materials science. 1939 5. with the late Dr. 1998-2005 CAREER: Joined Intel in 1974 and is credited with perfecting the manufacturing process for Intel's powerful microprocessors. University of California-Berkeley. 1954. 1929 3.S. .CEO. 1960. 1950. AGE: Born September 2.A. president from 1997 to 1998. EDUCATION: Ph. chief executive from 1998 through 2005. B.. in chemical engineering. City College of New York. 2005-2013 CAREER: Otellini spent his career at Intel. he cofounded Intel. creating the company's chip manufacturing operation. In 1968. AGE: Born January 3.. He was named chief operating officer in 1976 and president in 1979.D in chemistry and physics. and was chairman of the board from 1979 until 1997. 1975-1987 CAREER: Moore joined Shockley Semiconductor Laboratory in 1956. EDUCATION: Ph. Andrew S. He became chief executive in 1987 and was chairman of the board from 1997 to 2005. which produced the world's first commercial integrated circuit. Stanford University. co-inventor of the transistor. He was chief executive from 1979 until 1987. Robert Noyce. 1964 AGE: Born August 29. Craig R. University of California-Berkeley. B. Otellini CEO. He became CEO in May 2005.D. and chairman from 2005 until 2009. 1987-1998 CAREER: Grove originally worked at Fairchild Semiconductor and joined Intel in 1968. 1963. working on semiconductor process technology with William Shockley. Otellini served as Intel's president and chief operating officer from 2002 to 2005 and was also elected to Intel's board of directors in 2002. 1936 4. He served as chief operating officer from 1993 to 1997. Grove CEO.D. in chemistry. joining the finance department in 1974 and holding a variety of management positions including chief operating officer and manager of several divisions. EDUCATION: Ph.

While Intel created the first commercially available microprocessor (Intel 4004) in 1971 and one of the first microcomputers in 1972. 1972 AGE: Born Oct. increased competition from Japanese semiconductor manufacturers had. still dominated by various memory devices. Krzanich CEO: Will become the chief executive officer on May 16.EDUCATION: MBA. He previously held senior leadership positions in manufacturing with the company and began his career at Intel in 1982 as a process engineer. University of California-Berkeley. Intel embarked on a 10-year period of unprecedented growth as the primary (and most profitable) hardware supplier to the PC industry.In the same year Intel also produced the 3301 Schottky bipolar 1024-bit read-only memory (ROM) and the first commercial metal–oxide– semiconductor field-effect transistor (MOSFET) silicon gate SRAM chip. by the early 1980s its business was dominated by dynamic random-access memory chips. its line of Pentium processors had become a household name. 1950 6. CAREER: Has been chief operating officer of Intel since January 2012. was the 3101 Schottky TTL bipolar 64-bit static random-access memory (SRAM). TIMELINE: . EDUCATION: B. PRODUCTS. which was nearly twice as fast as earlier Schottky diode implementations by Fairchild and the Electrotechnical Laboratory in Tsukuba. Japan. B. Its first product. in economics. At its founding. Intel's business grew during the 1970s as it expanded and improved its manufacturing processes and produced a wider range of products. and to change fundamental aspects of that business model. so that by the end of the 1990s.A. the 256-bit 1101. 1974. Brian M. and the sudden success of the IBM personal computer convinced then-CEO Andrew Grove to shift the company's focus to microprocessors. However. in 1969.A. By launching its Intel Inside marketing campaign in 1989. dramatically reduced the profitability of this market. Buoyed by its fortuitous position as microprocessor supplier to IBM and IBM's competitors within the rapidly growing personal computer market. 1982 AGE: 52 B. 12. in chemistry. By the end of the 1980s this decision had proven successful. Intel was able to associate brand loyalty with consumer selection. Intel was distinguished by its ability to make semiconductors. University of San Francisco. by 1983. San Jose State University.











2. With about 25% (mass) Silicon is –after Oxygen –the second most frequent chemical element in the earth’s crust. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms. The resulting mono crystal is called Ingot. Wafer– Scale: wafer level (~300mm/ 12 inch) . An ingot has been produced from Electronic Grade Silicon. Melted Silicon – Scale: wafer level (~300mm/ 12 inch) 1. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.7. 2. The Ingot is cut into individual silicon discs called wafers. 2. Ingot Slicing – Scale: wafer level (~300mm / 12 inch) 1. Sand –especially Quartz -has high percentages of Silicon in the form of Silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing. Mono-crystal Silicon Ingot – Scale: wafer level (~300mm/ 12 inch) 1. Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon.9999%. UPGRADATION STRATEGY Sand 1.

Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). The photo resist finish is exposed to ultra violet (UV) light. 2. controlling the flow of electrical current in a computer chip. masks create the various circuit patterns on each layer of the microprocessor. Intel buys those manufacturing ready wafers from third party companies. mirror-smooth surfaces. The wafers are polished until they have flawless. resulting in decreased costs per chip. Exposure– Scale: transistor level (~50-200nm) 1. this picture story will only focus on a small piece of a microprocessor from now on –on a transistor or parts thereof. Exposure– Scale: wafer level (~300mm / 12 inch) 1. The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. 2. Now the company uses 300mm wafers. 2. Intel researchers have developed transistors so small that about 30 million of them could fit on the head of a pin. When used with UV light. 2. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern. . 4. The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button. A transistor acts as a switch. 3. The exposure is done using masks that act like stencils in this process step. the company printed circuits on 2-inch (50mm) wafers. The wafer spins during this step to allow very thin and even application of this photo resist layer. Applying Photo Resist – Scale: wafer level (~300mm / 12 inch) 1. A lens (middle) reduces the mask’s image. When Intel first began making chips.1. Although usually hundreds of microprocessors are built on a single wafer. The photo resist finish that’s exposed to UV light will become soluble.

After the etching the photo resist is removed and the desired shape becomes visible. the exposed areas of the silicon wafer are bombarded with various chemical impurities called Ions. 2. Ions are shot onto the surface of the wafer at very high speed.000 km/h (~185.000 mph) Removing Photo Resist – Scale: transistor level (~50-200nm) 1. Revealed material will be etched away with chemicals. Through a process called ion implantation (one form of a process called doping). This reveals a pattern of photo resist made by the mask. 3. 2. Etching– Scale: transistor level (~50-200nm) 1. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity. 2. Ion Implantation – Scale: transistor level (~50-200nm) 1.Washing off of Photo Resist – Scale: transistor level (~50-200nm) 1. Removing Photo Resist – Scale: transistor level (~50-200nm) 1. There’s photo resist (blue color) applied. The gooey photo resist is completely dissolved by a solvent. An electrical field accelerates the ions to a speed of over 300. The photo resist will protect material that should not get ions implanted. The photo resist is protecting material that should not be etched away. 2. exposed and exposed photo resist is being washed off before the next step. After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color). Applying Photo Resist – Scale: transistor level (~50-200nm) 1. .

2. 13. Bonnell(Tock). Architectures releases until now: 1. The copper ions are deposited onto the transistor thru a process called electroplating. After Electroplating – Scale: transistor level (~50-200nm) 1. Haswell(Tock). P6. On the wafer surface the copper ions settle as a thin layer of copper. 2. Saltwell(Tick). 3. Larrabee(Tock). 11. 10. 5. IvyBridge(Tick).Ready Transistor – Scale: transistor level (~50-200nm) 1.Netburst(Tock). The wafers are put into a copper sulphate solution as this stage. The Tick-Tock Model Through the Years Intel’s ―tick-tock‖ model inspires confidence in the future of microprocessors and the devices that depend on them. 6. 3. These three holes will be filled with copper which will make up the connections to other transistors. 4. 7. CannonLake(Tick). 14. Nehalem(Tock). 2. 8. Skylake(Tock). 9. Westmere(Tick). Electroplating– Scale: transistor level (~50-200nm) 1. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer. 3. Core(Tock). Following this model. Sandy bridge(Tock). 12. Penryn(Tick). This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. Broadwell(Tick). . Intel commits to—and has successfully delivered—continued innovations in manufacturing process technology and processor microarchitecture in alternating ―tick‖ and ―tock‖ cycles.

connectivity. and launch and ramp IA solutions in smartphones. and computing is becoming an increasingly personal experience. End users value consistency across devices that connect seamlessly and effortlessly to the Internet and to each other. and lead the transformation to open data centers and cloud computing. 1. 16. Grow the PC and data center business with new users and uses. Extend Intel solutions into adjacent markets. Create a continuum of personal computing. Intel’s philosophy is that achieving platform leadership requires that a firm continuously innovate through internal processes on its own core product and successfully encourage complementors not only to supply but to keep innovating on complementary products. Extend Intel’s PC platform leadership and develop exciting innovations to deliver new user experiences. Silvermont(Tock). 4. our strong rela tionships across the industry.15. 5. tablets. . the microprocessor. 3. Expand IA differentiation with new capabilities across devices. and security. The analysis of the data suggests that the strategic goal of Intel is to obtain consensus in the industry while maintaining some degree of directional control over interfaces. excite leading software developers to create the best user experiences and applications on IA. Intel helps to enable this experience by innovating around three pillars of computing: energy-efficient performance. 8. is crucially dependent upon the continuous supply of complementary products by other firms. MANAGEMENT STRATEGY The number and variety of devices connected to the Internet are growing. smart TVs. Intel as an organization is extremely aware that the demand for its own main product. and vehicles. our architecture and platforms. and deliver new usage models with multi-communications connectivity. Airmont(Tock). Transform the embedded industry with Intel® architecture (IA) in new market segments. we are using our core assets: our silicon and process technology. our global presence. 6. 7. and our brand recognition. To meet these objectives. 2.

The informal... and not rival. deciding whether the product’s interface specification is ―proprietary‖ or ―open‖ to thirdparties) radically affects the incentives and costs for potential complementors to innovate on complementary products. New layout might be also moving the integrated voltage regulator (iVR) off-die and back onto the motherboards. In an industrial setting where the definition of roles is ambiguous. it frequently chooses not to make any profit. acting towards another firm as a competitor or a complementor). even as the Intel microprocessor evolves. 8. For example. the boundary of the product). Intel makes several kinds of interrelated decisions to achieve platform leadership: design decisions (where to put the interface — i. There are no official details regarding this microarchitecture's development.e. intellectual property choices in interface design (e. Intel aims to nurture their incentives to innovate on products that are complementary to Intel. Intel is able to maintain an increasing supply of quality complementary products. The first Skylake processors are expected in 2015-2016. on ―half-products‖ such as APIs or SDKs). later. longterm relationships that are developed between Intel and third-parties provide a setting that fosters innovation and protects both from each other’s opportunism. with feature size reduced to 14 nanometers. 10. if any. 11. and can induce either more competition — or a greater supply of complements. Intel has also set in place specific processes by which it initiates the design of interface standards and then rallies the consensus of other firms.e.g. products. 9.Skylake will use a 14 nm process.affecting a large number of third-parties’ design decisions. . there is plenty of room for strategic choices.. Skylake Architecture: Skylake is the codename for a processor micro architecture to be developed by Intel as the successor to the Hasswell architecture. in an attempt to reduce CPU's heat production. by a careful balancing act of competition and cooperation with third-parties. Where complementors have a choice. In keeping with Intel's tick-tock principle. intellectual property decisions (whether the specification of this interface will be open or closed). Broadwell will adopt the Multi-Chip Package (MCP) design. Broadwell Architecture: Broadwell is Intel's codename for the second processor in its Haswell microarchitecture. Intel often invests heavily up front in designing internal interfaces on which. Relinquishing royalty rights on the specifications and carefully integrating the technical input early and gradually in the process facilitates the endorsement of key players. Intel also maintains loyalty from third-parties by signaling the low likelihood of Intel’s behaving against them opportunistically in the short term. pricing decisions (how much Intel will charge for royalties. Intel seems to enjoy high returns for building and sustaining its reputation as a firm that does not impulsively or carelessly step out of its product boundaries into the territory of its complementors. 12. Broadwell is the next step in semiconductor fabrication. UPCOMING PROJECTS a. 13. and mode of behavior decisions (i. 9. b.

2. Test. and Communicate. Suppliers are required to ship a specific quantity of a material to an Intel site by a specified date. Each Partner must fulfill all obligations specified in a PIP. INTEL BUSINESS CONTINUITY PRINCIPLES: Intel’s business continuity program is based upon five key principles:Assess. If any one party fails to perform a service as specified in the approved RosettaNet PIP documentation then the business transaction is null and void. MRP data is pulled into the ARM replenishment system.10. and the master production schedule (MPS) to calculate time-phased material requirements. bill of material (BOM) information. Prepare: A process of creating a business continuity plan based on the findings from the Risk and Impact Assessment 3. 2. 1. This is a component of the Web Suite application. It includes forecast information from Outsourcing Enterprise Solutions Systems Manufacturing (OeS SM). enabling ARM to create replenishment forecasts for Suppliers. Prepare. 1. Web Forecast. Improve: The process of strengthening our plans based upon discoveries made During tests or real life events. The RosettaNet model that depicts the activities. 1. 1. Improve. 1. and Materials Auto Replenishment (MAR). INTEL’S RELATION TO MATERIAL REQUIREMENT PLANNING Material Replenishment Method. . 2. Test: Exercising the business continuity plan through realistic drill scenarios. Edge to Edge Capacity Exchange Planning (e2e CapX).Assess:Accomplished through a Risk and Impact Assessment process. 2. 2. MRP is a set of techniques using inventory position. This MRP driven procurement method is used with select direct materials suppliers across Intel's Systems Manufacturing and Assembly/Test sites. decisions and Partner Role interactions that fulfill an eBusiness transaction between two partners in a supply chain. 3. 3. Material Requirements Planning.Every Designated organization is required to annually review and update their Risk and Impact Assessments for core business functions. This forecast is communicated with suppliers via RosettaNet XML PIP 4A3 and/or the Web Forecast application's Delivery Schedule Report. Partner Interface Process. 4.

MARKET EVALUATIONS 12. World’s Most Ethical Companies 2013 11.#5! (Workforce Diversity) 8. Veterans Magazine*) 6. AWARDS AND RECOGNITIONS: 1.Intel Israel ranked 2nd! . Top 100 Veteran-Friendly Companies (U. Most InDemand Employers among Software Engineers (LinkedIn*) 3. National Top 50 list (US EPA) 9. Greenest Companies in America list -Top ten! (Newsweek) 5.S.11.Intel India #2 10. Best Place to Work . Intel is ranked 68 on FORTUNE Magazine's 100 Best Companies to Work for List! 2. Top 50 Employer . World’s Greenest Companies list (Newsweek*) 4. India’s Best Places to Work For . World’s Most Attractive Employers 2013 (Universum) 7.

00 $1.000.00% 7.27% 25.00 $550.52% .870.375.393.00% 10.41% 1.12.500.73% 61.00 $5.00% 25.00 $3.33% 55.29 $69. WORKING CONDITIONS Income for a Software Engineer at Intel (Mid Thirties) How Much House Can I Afford? Annual Household Income Monthly Gross Income Monthly State Income Tax (4%) Monthly Federal Income Tax (25%) Monthly minimum debt Monthly car payment Monthly student loan payment Minimum monthly credit card debt payment Total monthly salary left after debt and taxes Down Payment Amount Maximum I can pay for PITI a month (34% of your gross monthly income) Monthly Property Taxes Homeowner's insurance premium Maximum Principal and Interest Payment Maximum Loan Amount Maximum Purchase Price I can afford $66.64 $1.355.00% 7.00 $220.00 $150.14% 2.74% 12.27% 0.00 $250.00 $1.00 $488.00 $407.00 $0.00 % of monthly gross % of monthly gross after taxes and debt 4.000.07 $238.00% 2.00 $400.00% 34.750.750.08% 41.

Cash left each month after taxes.00% .00 27. and PITI paid $1. debt.485.

in/content/www/in/en/corporate-responsibility/corporate-responsibility-2007report.stm 9.html 5. 20.html?wapkw=intel+museum A 19.html 3.cnn.pdf 7.html 13. http://www.html http://news. 12. 24.html 2. http://www. http://media. http://www.html?_r=1 http://beforeyoubuypc.html In.intc. wiki List of Intel microprocessors 23.REFERENCES: 1. http://www. http://www. http://www. 6.cfm .reuters. http://semiaccurate.html 11.appliancedesign.