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Samsung eMMC

Managed NAND Flash memory solution supports mobile applications

FBGA QDP Package


MMC user BROCHURE 2 . Samsung has a wide range of eMMC solutions based on performance requirements. Finally. smartphones. Developers may also encounter issues related to die shrinkage. In addition. they need superior storage capabilities to augment device production. Conversely.High efficiency. • Small. Samsung eMMC is designed to be easy to adopt. particularly when implementing wear leveling. To focus on these demands. Simplify mass storage designs Conventional NAND Flash memory can be challenging to adopt. robust and small: • Dense. bad block management. The eMMC helps simplify mass storage designs for the latest consumer electronics. Standardized packaging and device specifications plus intelligent firmware ease design work and provide a common footprint for the use of embedded and removable NAND. including tablets. Today’s fastest and most demanding embedded uses require strong memory management solutions. Samsung eMMC incorporates a mature interface standardized by JEDEC. Samsung eMMC is produced in very compact sizes (typically smaller than a postage stamp) to create room within devices for additional parts. reduced costs and quicker time to market Expand device development with capable memory solutions To meet current trends for advanced mobile device designs. Samsung eMMC provides enhanced storage capabilities. NAND Flash memory eMMC interface Samsung embedded multimedia card (eMMC) addresses these needs with advanced embedded NAND Flash. These products use eMMC to expand computing power and content storage. The Joint Electron Device Engineering Council (JEDEC) encourages memory to be produced in extremely compact sizes to allow space for other components. They also use eMMC to provide booting functionality. It is suitable for the latest consumer electronics. Sophisticated mobile devices require high-density content storage that supports high-definition video playback and other high-end multimedia features. a reduced controller footprint and streamlined data reads and writes. memory densities are rapidly advancing. Developers may have some difficulty controlling software development. including page size and error correcting code (ECC) management. Developers also require the ability to create efficient mobile device designs with minimal costs and brief time to market. Key applications that can benefit from Samsung eMMC include advanced mobile devices and handsets. embedded storage and external mass storage in one device. Chipset validation means that eMMC is a thoroughly tested solution. GPS systems and e-readers. Samsung offers a wide range of eMMC solutions based on low (4GB or 8GB) to high (16GB. 32GB. Embedded uses include multifunctional smartphones. developers need an efficient way to control software development by simplifying mass storage designs and improving device production. manufacturers require memory that is increasingly dense. • Robust. Samsung offers a single footprint combining boot. HOST interface layer Flash transfer layer Virtual address Virtual Flash layer Physical address Flash interface layer NAND Flash memory Figure 1. 64GB or 128GB) density requirements. and key functionality yields strong power management and performance optimization. As a result. device mapping and error handling. portable media players and tablet computers.

The changes then needed to be tested at the NAND level. This interface turns memory accesses into straightforward read-write operations with advanced security and reliability features.5. leading to faster overall time to market. In contrast. Enhanced storage solutions for mobile devices that provide high-density solid state memory can be integrated into system designs. and helps control costs. and an intelligent MMC controller in a Ball Grid Array (BGA) package. including low-cost legacy chipsets. Samsung eMMC simplifies system design and integration of 2-bit and 3-bit multi-level cell (MLC)-type NAND memory. Including SSDs enables increased storage densities. Product concept NAND porting Flash translation layer Platform adaptation (Chipset dependent) OS adaptation (OS dependent) Low level driver (NAND dependent) NAND level testing Figure 3. and 5. reduced costs and low power consumption. a product using NAND memory required changes in the chipset or the OS. This approach makes Samsung eMMC memory an excellent choice for deployment across a variety of segments. Increase storage capabilities for diverse applications Advanced mobile devices and handsets can use Samsung eMMC to expand computing power and content storage. Samsung eMMC memory enables users to proceed from product concept directly to product testing. which could lead to significant delays in product-level testing. the NAND memory also required changes to be made in the Flash translation layer (FTL). Samsung eMMC isolates the host from changes in NAND memory technology and bypasses the FTL. Samsung eMMC operates at standard 4. developers using Samsung eMMC can move directly from product concept to product testing. 4. Content storage supports high-definition video playback and other complex multimedia features. 10nm-class eMMC Product level testing Figure 2. At times. Traditional storage media. as a result of the high storage capacity of eMMC. Samsung eMMC comprises high-density 2-bit and 3-bit MLC NAND. development and testing time.0 voltage levels. BROCHURE 3 . can be replaced by lower-power solid-state drives (SSDs). which reduces design.41. so there is no need to develop or use separate firmware. Computing power provides booting functionality.Enhanced ability to proceed directly from concept to testing Reduce development time and control costs In the past. and triple-level cell (TLC) memory.

embedded storage and external mass storage in one device Enables developers to move directly from product concept to product testing Reduces design. reduce controller footprint and streamline data reads and writes. development and testing time Optimized for very low power consumption Enhanced storage capabilities Intelligent firmware Single footprint Isolation of the host from changes in NAND memory technology FTL bypass Mobile-Centric BROCHURE 4 .0 Features and benefits Features Density of 4 GB to 128 GB Small size Benefits Contributes to a variety of mobile & consumer designs Helps meet today’s mobile design requirements Frees up space for other components Enhances robust mobile devices Enables traditional storage media to be replaced by lower-power SSDs Helps simplify mass storage designs Advanced embedded NAND Flash Aids in expanding computing power and content storage Is designed for easier adoption Standard.Intelligent mobile device development Create an efficient way to develop well-designed mobile devices To maintain the required data rates and throughput for high-density chips. The intelligent interface is designed for ease of use. eMMC Interface Bandwidth 400 (MB/s) 400 200 200 104 0 52 eMMC 4. enabling developers to stay competitive by building better and faster. Standard Specifications for device features. and package pinout Facilitates easier design work Provides a common footprint for the use of embedded and removable NAND Combines boot. the eMMC standard was developed to enhance storage capabilities. Samsung eMMC contributes to successful mobile device development.5 eMMC 5. and enhanced storage solutions improve device designs.3 eMMC 4. function. Samsung eMMC also helps developers go straight from concept to testing. mature interface by JEDEC Provides strong power management and performance optimization Open.41 eMMC 4. reducing time to market. Advanced Samsung technology helps reduce the cost of application development and increase work efficiency.

5x13x1.0 MMC Class* 700 700 2000 2000 2000 2000 Seq R/W (MB/s) 150/10 180/20 240/40 240/60 240/60 150/50 Ran R/W IOPS Pkg Size (mm) Status 4000/700 4000/700 6000/2500 6000/2500 6000/2500 3500/2000 11x10x0. RPMB. SDR x4/x8 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Vendor Specific N/A eMMC 5. 512KB data transfer.5x13x1.5 5.0 400MB/s 200MHz HS400.0 11. device is full w/o file system overhead *** eMMC 5.5x13x1.8 11.5x13x1.5x13x1.0 11. Mode Bus Width H/W Reset Multi-Partition Enhanced Mode (SLC + MLC) Alternative Boot Security Features (Trim.2 11.5x13x0.5x13x1.5x13x1.5.0 MMC Class* 200 200 700 1500 1500 Seq R/W (MB/s) 100/6 100/6 170/11 200/50 200/50 Ran R/W IOPS Pkg Size (mm) Status 2500/200 2500/200 4000/500 4000/1500 4000/1500 11.5x13x0.0 11.0 is JEDEC Compliant and is backwards compatible with older eMMC versions such as 4.5 200MB/s 200MHz HS200.5x13x0. DDR x4/x8 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes-standardized Yes-standardized Samsung eMMC Part Number Matrix Standard eMMC: Density Part Number 4 GB 8 GB 16 GB 32 GB 64 GB KLM4G1YEMD-C031 KLM8G1WEMB-B031 KLMAG2WEMB-B031 KLMBG4WEBC-B031 KLMCG8WEBC-B031 Flash 32Gb*1 64Gb*1 64Gb*2 64Gb*4 64Gb*8 5.8 11.41 & 4.0 11. BROCHURE 5 . Secure Erase.8 11. Secure Trim) Secure Trim Refinement High Priority Interrupt Back Ground Operation Packed Command Cache Handling Discard Dynamic Capacity Sanitize Smart Report F/W Update eMMC 4. cache on.Samsung eMMC eMMC Features Interface Speed/Max Bandwidth Clock Frequency Data Rate.8 11.0 MP MP MP MP MP High-Performance eMMC-Pro: Density Part Number 4 GB 8 GB 16 GB 32 GB 64 GB 128 GB KLM4G1FEAC-B031 KLM8G1GEAC-B031 KLMAG2GEAC-B031 KLMBG4GEAC-B031 KLMCG8GEAC-B031 KLMDGAGEAC-B001 Flash 32Gb*1 64Gb*1 64Gb*2 64Gb*4 64Gb*8 64Gb*16 4.4 MP MP MP MP MP MP * eMMC Class refers to RW IOPS ** eMMC Performance Conditions: Bus width x8.

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