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A subsidiary of TT electronics plc

Thermal Solutions
Excellence in Technology
Insulated Aluminum Substrates
Thermal Solutions for
Power Applications
T.T. Electronics is a leading designer and
manufacturer of electronic components.
As a result of our experience with power
components, Anotherm

substrates, an
innovative method of addressing thermal
problems was developed.
Anotherm

substrates consist of a highly
thermally conductive aluminum alloy
substrate, with a special anodized
aluminum oxide electrically insulating
layer chemically grown on the aluminum
core. This high temperature anodized
layer offers good electrical isolation and
excellent thermal transfer. Screen-printed,
solderable conductors are then applied to
the board and fired at 600°C.
Anotherm™ substrates offer Anotherm™ substrates offer Anotherm™ substrates offer Anotherm™ substrates offer Anotherm™ substrates offer
very high thermal conductivities very high thermal conductivities very high thermal conductivities very high thermal conductivities very high thermal conductivities
with low thermal resistance from with low thermal resistance from with low thermal resistance from with low thermal resistance from with low thermal resistance from
the die or chip to the substrate. the die or chip to the substrate. the die or chip to the substrate. the die or chip to the substrate. the die or chip to the substrate.
This results in: This results in: This results in: This results in: This results in:
• •• •• Reduced Operating T Reduced Operating T Reduced Operating T Reduced Operating T Reduced Operating Temperature emperature emperature emperature emperature
• •• •• Higher operating power density Higher operating power density Higher operating power density Higher operating power density Higher operating power density
• •• •• Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks
• •• •• Improved reliability and Improved reliability and Improved reliability and Improved reliability and Improved reliability and
reduced failures due to reduced failures due to reduced failures due to reduced failures due to reduced failures due to
thermally induced problems. thermally induced problems. thermally induced problems. thermally induced problems. thermally induced problems.
• •• •• Lower assembly cost by Lower assembly cost by Lower assembly cost by Lower assembly cost by Lower assembly cost by
eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks
and mounting hardware and mounting hardware and mounting hardware and mounting hardware and mounting hardware
The result is a low cost, rigid circuit board
with unsurpassed thermal efficiency. The
completely inorganic construction results
in substrate characteristics, that maintain
their properties even at high continuous
operating temperatures.
Traditional methods of removing excess
heat from components have centered on
the use of heat sinks with thermal grease
or polymer pads to thermally connect the
device to the heatsink. With Anotherm

substrates, the entire board becomes the
heat sink with no extra hardware (clips,
screws, etc) required. In addition, the
characteristics of the printed thick film
conductors allow direct wirebonding from
dies to the printed conductors.
Thermal Solutions
Solder Masks: Printed solder masking is available using
a polymeric formulation.
Heatsinks: One interesting characteristic of this
technology is the capability of printing solderable
conductors directly onto heatsinks, thereby simplifying the
assembly of power systems.
Reliability: Anotherm

substrates have been proven
through use in millions of unit-hours of successful
operation in use as power resistors for automotive HVAC
fan speed applications, many in very harsh applications.
They have successfully passed requirements presently in use
for automotive, and class 8 truck applications.
Soldering: Components can be soldered to traces
printed on Anotherm

substrates. The use of solder alloys
containing silver is strongly recommended, such as
62Sn36Pb2Ag or Sn96Ag4.
l a i r e t a M
t n e i c i f f e o C n o i s n a p x E l a m r e h T
) K / m p p (
y t i v i t c u d n o C l a m r e h T
) K - m / W (
d r a o B . C . P 4 - R F 0 2 - 6 1 8 . 0
m r e h t o n A ® ®®®®
m u n i m u l A 1 6 0 6 / 3 0 0 3
4 . 3 2 3 7 1
l e e t S s s e l n i a t S 4 0 3 4 . 6 1 3 . 7 1
c i m a r e C a n i m u l A % 6 9 5 . 6 1 2
r e p p o C 5 . 6 1 6 8 3
The base material for the Anotherm® substrates is an aluminum alloy, either 3003 or 6061. This aluminum alloy
has a high thermal conductivity and low cost. The thermal expansion coefficient of this material corresponds favorably
with traditional P.C. board materials as shown in the table below. Long term thermal shock testing confirms the
ruggedness of the dielectric medium.
Dielectric Layer: The Insulation system used on the
Anotherm® substrate system is an anodically grown
coating (similar to hard coat anodizing), that deposits a
dense, thin film of aluminum oxide approximately 0.0014"
thick (0.035mm) onto the aluminum surface. This inorganic
dielectric layer gives a high quality insulation that is not
affected by temperature or chemicals.
Multiple Layers: Anotherm

substrates are ideal for
applications requiring single layer or front and backside
traces. When multiple layers or printed crossovers are
required, polymer materials are used. As a result, the
excellent thermal conductivity properties of Anotherm

substrates are lost in the additional layers. However, these
traces can be used for carrying low power and control
signals.
Substrate Characteristics
Magnified sectioned view of Anotherm Magnified sectioned view of Anotherm Magnified sectioned view of Anotherm Magnified sectioned view of Anotherm Magnified sectioned view of Anotherm

substrate and substrate and substrate and substrate and substrate and
trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent
continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners

Printed traces on finned heatsink available.
Thermal Solutions
Specifications
g n i t a r e p O m u m i x a M
e g a t l o V
C A V 0 5 2
s u o u n i t n o C m u m i x a M
e r u t a r e p m e T g n i t a r e p O
) t n a k s a M r e d l o S o / w ( C ° 0 0 4
) t n a k s a M r e d l o S / w ( C ° 5 7 1
e c n a d e p m I l a m r e h T t t a W / C ° 2 . 0 * *
e n i L m u m i n i M
g n i c a p S / h t d i W
" 6 0 0 . 0 / " 6 0 0 . 0
) m m 5 1 . 0 / m m 5 1 . 0 (
s s e n k c i h T e c a r T r o t c u d n o C
0 7 4 ( d r a d n a t s s n o r c i m 2 ± 2 1
0 5 1 o t p u , ) s e h c n i o r c i m
h g i h r o f ) " 6 0 0 . 0 ( s n o r c i m
s n o i t a c i l p p a t n e r r u c
e c a r T r o t c u d n o C
y t i v i t s i s e R
l i m / . q s / s m h o 7 1 0 0 . 0
s s e n k c i h t
s s e n k c i h T c i r t c e l e i D
) s n o r c i m 5 3 ( " 4 1 0 0 . 0
l a n i m o N
e z i S e t a r t s b u S m u m i x a M
" 0 1 x " 8
) m m 4 5 2 x m m 3 0 2 (
e t a r t s b u S m u m i x a M
s s e n k c i h T
" 5 7 . 0
) m m 9 1 (
* * , e r o c m u n i m u l a o t d a p d e t n i r p m o r f e c n a d e p m I l a m r e h T
. n i . q s 1 . 0 = e z i s d a p
Applications:
• Solid State Relays
• Automotive Power Electronics
• L.E.D. Displays
• DC-DC Switching Power Supplies
• Power Amplifiers
• Low Voltage Motor Controls
• High Temperature Electronics such as “down-hole”
oilfield telemetry and automotive engine
compartment applications
Anotherm Anotherm Anotherm Anotherm Anotherm

substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy
singulation. singulation. singulation. singulation. singulation.
Anotherm Anotherm Anotherm Anotherm Anotherm

substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly. .. ..
Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed
Anotherm Anotherm Anotherm Anotherm Anotherm

substrates. substrates. substrates. substrates. substrates.
Thermal Solutions
Excellence in Technology
IRC Inc. (AFD)
4222 South Staples Street
Corpus Christi, Texas 78411, USA
Telephone: 361 992 7900
Facsimile: 361 992 337
Email: ircafd@irctt.com
Website: www.irctt.com
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of TT electronics plc
Performance Data
Issue September 2002
c i t s i r e t c a r a h C d o h t e M t s e T y r a m m u S t s e T e c n a m r o f r e P
k c o h S l a m r e h T B 7 0 1 d o h t e M 2 0 2 - d t S - l i M
C ° 0 5 1 + o t C ° 5 6 -
s e l c y c 0 0 0 1
% 2 < ∆ R / R
) l a i t i n i ( n o i s e h d A t s e T C R I
m m 8 . 0 , d a p m m 2 X m m 2
l l u p l a c i t r e v , e r i w d e r e d l o s
f g k 6 . 3 >
) d e g a ( n o i s e h d A t s e T C R I
m m 8 . 0 , d a p m m 2 X m m 2
, l l u p l a c i t r e v , e r i w d e r e d l o s
C ° 0 5 1 t a s r h 0 0 1 d e g a
f g k 8 . 1 >
e r u s o p x E e r u t a r e p m e T h g i H 2 4 3 5 5 - R - l i M C ° 0 5 1 @ s r H 0 0 0 1
% 5 3 . 0 ∆ R / R
y t i v i t s i s e R t s e T C R I
n o y t i v i t s i s e r e t a l u c l a C
n w o n k f o e c a r t d e t n i r p
m u n i m u l a n o s s e n k c i h t
m 7 . 1 Ω l i m / q s /
g n i t t e W r e d l o S
) 2 g A / 6 3 b P / 2 6 n S (
8 0 2 d o h t e M 2 0 2 - d t S - l i M
r e d l o s s d n o c e s 5 r o f C ° 5 4 2
p i d
e g a r e v o c m u m i n i m % 5 9 >