1.

INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of the phones.

1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the LGE or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Theref ore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

E. Notice of Radiated Emissions
The phones complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

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1. INTRODUCTION

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation
An the phones may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the information is ESD handling: sign. Following

Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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1. INTRODUCTION

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply: APC BB BER CC-CV CLA DAC DCS dBm DSP EEPROM EL ESD FPCB GMSK GPIB GPRS GSM IPUI IF LCD LDO LED The phones LGE OPLL PAM PCB PGA PLL PSTN RF RLR RMS RTC SAW SIM SLR SRAM STMR Automatic Power Control Baseband Bit Error Ratio Constant Current – Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing Electrical Erasable Programmable Read-Only Memory Electroluminescence Electrostatic Discharge Flexible Printed Circuit Board Gaussian Minimum Shift Keying General Purpose Interface Bus General Packet Radio Service Global System for Mobile Communications International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode GSM Phone Electronics Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating Static Random Access Memory Side Tone Masking Rating

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1. INTRODUCTION TA TDD TDMA UART VCO VCTCXO WAP Travel Adapter Time Division Duplex Time Division Multiple Access Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol -6- .

2. Min: 150mA(Pwr Level 19).B.5) dBm (Level 0) Class 10(This only applies to G7020) Plug-In SIM 3V/5V Main : 65K Color-STN(128X160) Sub : Mono(96X64) Status Indicator : 7-color LED Key Pad : Status Indicator & KeyPad • 0 ~ 9. Up/Down Side Key • Side Key. EGSM: -108 dBm. Record Key • Send Key.D. 760mAh(820 mAh) Standard Battery Extended Battery AVG TCVR Current Standby Current Talk time Stand by time Charging time RX Sensitivity TX output power GPRS compatibility SIM card type Display Size: 44 T. *. EGSM: 33(32. PERFORMANCE 2. CLA. PERFORMANCE 2.5) dBm (Level 5) DCS: 30(29.1 mA Min : 2hr30min (2hr40min) Max : 5hr(5hr20min) Up to 200 hours 2 hours GSM.1 H/W Features Item Feature Li-Polymer. DCS: -107 dBm GSM. Navigation Key.6 5. #.6 mm Weight: 22 g Comment -7- . Max: 300mA(Pwr Level 5) < 4. Confirm Key. END/PWR Key ANT EAR Phone Jack PC Synchronization Speech coding Data and Fax Vibrator Speaker Voice Recording C-Mic Receiver Travel Adapter Options Fixed Type Ear-Mic connector Yes EFR/FR Yes Yes Yes Yes Yes Yes Yes Hands-free kit. Data Kit @820mAh @760(820)mAh 68.

2 Technical Specification Item Description GSM TX: 890 + n RX: 935 + n 1 Frequency Band 0.2 MHz (n = 512 ~ 885) Specification EGSM TX: 890 + (n .1024) DCS TX: 1710 + (n-512) Rx: 1805 + (n-512) 2 3 Phase Error Frequency Error RMS < 5 degrees Peak < 20 degrees < 0.2 MHz (n = 975 ~ 1024) 0. PERFORMANCE 2.2 MHz 0. 3dB 3dB 3dB 5dB 5dB 5dB 5dB 4 Power Level 12 DCS Level 0 1 2 3 4 5 6 7 Power 30 dBm 28 dBm 26 dBm 24 dBm 22 dBm 20 dBm 18 dBm 16 dBm Toler.1024) RX: 935 + (n .2 MHz 0.2. 3dB 4dB 4dB 4dB 4dB 4dB 5dB 5dB -8- .1 ppm GSM. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 13 14 15 16 17 18 19 Power 17 dBm 15 dBm 13 dBm 11 dBm 9 dBm 7 dBm 5 dBm Toler. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 8 9 10 11 12 13 14 15 Power 14 dBm 12 dBm 10 dBm 8 dBm 6 dBm 4 dBm 2 dBm 0 dBm Toler. EGSM Level 5 6 7 8 9 10 11 Power 33 dBm 31 dBm 29 dBm 27 dBm 25 dBm 23 dBm 21 dBm 19 dBm Toler.2 MHz (n = 1 ~ 124) 0.2 MHz 0.

000 DCS Offset from Carrier (kHz).800 GSM Offset from Carrier (kHz) 400 600 1.200 6 Output RF Spectrum (due to switching transient) 1. (dBm) -19 -21 -21 -24 Max. 100 200 250 400 600 ~ 1.5 -30 -33 -60 -60 -60 -65 -65 -73 Max. Emission Status -9- Max.200 1.800 1.800 ~ 3. (dBm) -22 -24 -24 -27 .2. PERFORMANCE Item Description GSM.000 3.5 -30 -33 -60 -60 -60 -63 -65 -71 Max.000 5 Output RF Spectrum (due to modulation) 6.200 1.200 ~ 1. dBc +0.000 ~ 6.000 6.800 1.000 ~ 6.200 ~ 1. 100 200 250 400 600 ~ 1.800 ~ 3.800 7 Spurious Emissions Conduction.000 GSM.000 3. EGSM Specification Offset from Carrier (kHz). Emission Status Conduction. dBc +0. EGSM Offset from Carrier (kHz) 400 600 1.200 1.

439% @-100 dBm 3 dB 8 3 dB Max.7 33.000 3.(dB) -12 0 2 * 0 2 2 2 Min. level in the range.5 22.000 12 RLR 2 3 dB Frequency (Hz) 100 200 300 500 13 Receiving Response 1.3 33.000 Hz to be Max.5 16 Sending Distortion 17 18 Side tone Distortion System frequency (13 MHz) tolerance Three stage distortion < 10% ≤ 2.400 4.5 ppm .7 25.000 3.(dB) -12 -6 -6 -6 -9 - 8 Bit Error Ratio 9 10 RX Level Report Accuracy SLR Frequency (Hz) 100 200 300 11 Sending Response 1. PERFORMANCE Item Description Specification GSM.000 Max.(dB) -7 -5 -5 -5 -10 * Mean that Adopt a straight line in between 300 Hz and 1.7 31.(dB) -12 0 0 0 4 4 4 0 Min. EGSM BER (Class II) < 2. 14 15 STMR Stability Margin 13 5 dB > 6 dB dB to ARL (dB) -35 -30 -20 -10 0 7 10 Level Ratio (dB) 17.000 2.5 30.2.400 4.000 3.000 3.439% @-102 dBm DCS BER (Class II) < 2.10 - .

62 V 3.03 V (Call) 0.768KHz tolerance Ringer Volume ≤ 30 ppm Specification At least 80 dB under below conditions: 1.82 V ~ 21 Charge Voltage 22 Antenna Display 23 Battery Indicator 24 25 Low Voltage Warning Forced shut down Voltage 26 Battery Type 27 Travel Charger 3.03 V 1 Li-Polymer Battery Standard Voltage = 3. PERFORMANCE Item 19 20 Description 32. Ringer set as ringer. 50/60 Hz Out put: 5.03 V (Standby) Power -85 dBm ~ -90 dBm ~ -86 dBm -95 dBm ~ -91 dBm -100 dBm ~ -96 dBm -105 dBm ~ -101 dBm ~ -105 dBm Voltage ~ 3.73 V 3. Test distance set as 50 cm Fast Charge : < 500 mA Slow Charge: < 60 mA Antenna Bar Number 5 4 3 2 1 0 Batter Bar Number 0 1 2 3 3.2 V Capacity: 760 mAh(820 mAh) Switching-mode charger Input: 100 ~ 240 V.5 3.11 - .35 0.2 V.62 0.73 ~ 3. 600 mA .82 V 3.62 ~ 3.2.7 V Battery full charge voltage = 4. 2.

which contains two LNAs and three direct conversion demodulators for E-GSM. The RF front-end circuit is shown Fig. The demodulated I and Q signals pass two base band AGC amplifiers and a channel filter. two RF SAW filters. a external dual RF VCO and a transceiver IC(TRF6150). TECHNICAL BRIEF 3.1 Receiver The receiver part consists of a dual band(GSM & DCS) antenna switch. The TRF6150 chip set has direct conversion structure. RF front-end circuit. DCS and PCS. Figure 3-1. All active circuits for a complete receiver chain with the exception of RF VCO are contained in the transceiver IC(TRF6150). TECHNICAL BRIEF 3. 3-1. which are on both I and Q signal paths. so the received RF signal is directly converted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz). .12 - .3.

The filtered RF signal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a direct conversion demodulator. When the RX path is turned on. This implies that a parasitic DC offset may appear at the output of the IQ demodulator. The RF received signals (GSM 925MHz ~ 960MHz. DCS band. TECHNICAL BRIEF 3. Table 3-1. two RF SAWs and two LNAs for E-GSM.1. The BB I&Q signals pass via two integrated baseband amplifiers with digitally programmable gain and two fully integrated baseband channel filters to the baseband A/D converters which is contained in baseband chipset. a dual band antenna switch. is filtered by an appropriate RF SAW filter for better stop band rejection. In addition.3.3 DC offset compensation The transceiver IC(TRF6150) is based on direct-conversion architecture. So the RX LO frequency is the same as input radio frequency. The amplified signal at LNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BB signals. the IC includes a hardware DC offset compensation circuit on both I and Q base band paths. The logic and current VC1 GSM TX DCS TX GSM/DCS RX 2. the received RF signal. . The logic and current is given below. VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. which are contained in the transceiver IC (TRF6150). a quadrature demodulator gain mismatch calibration system is used to reduce the signal distortion.1. This process is thecsame both GSM and DCS. Fig.1 RF front end RF front end consists of an antenna.13 - . To reduce the static offset due to components mismatch and LO self-mixing.2 Demodulator and Baseband Processing IF stage is not necessary in this system because the receiver is based on direct conversion architecture. DCS 1805MHz ~ 1880MHz) are input via the antenna or coaxial connector. Table 3-1. An antenna matching circuit is between the antenna and the connector.1.7 V 0V 3. which has passed through the dual band antenna switch.3-2 shows RX path block diagram. 3.7 V 0V 0V VC2 0V 2. The transceiver IC uses a divider by 2 for LO generation in EGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LO radiation.

5 Table 3-3.14 - .2 I. Total Gain and Noise Figure of RX path. Total Gain 22.1 dB Total Noise Figure 7. TECHNICAL BRIEF Figure 3-2.9 dB 19. switch GSM Gain(dB) DCS GSM NF(dB) DCS -0. Gain and Noise Figure of RX path. Table 3-2.5 -3. RX path block diagram. Ant.3.Q demodulator(LNA+Mixer) 26 23 3 3.2 dB GSM. EGSM DCS .6 -0.7 RF SAW Filter -2.2 dB 8.

An buffer amplifier follows the RF VCO. Table 3-4. The main fractional-N synthesizer has frequency band from 1294 MHz to 1356 MHz.3MHz for Rx (or 2.3. The dual band means that it can support GSM. The main fractional-N synthesizer (RF synthesizer). synthesizers use a number of techniques to improve lock time. which is a fractional-N synthesizer. For transmitting operation. which includes a RF VCO with external tank circuits. is necessary for transmitting operation only. The phase frequency detector with charge pump provides programmable output current. which is to give reverse isolation and prevent any frequency pulling of the VCO when the transceiver is powered UP and DOWN. The purpose of the buffer is to give reverse isolation and prevent any frequency pulling of the VCO when the transceiver is powered UP and DOWN. TECHNICAL BRIEF 3. making them well suited to GPRS. The IF VCO is also followed by a buffer amplifier. 3-wire BUS of Synthesizer in the TRF6150 Pin Number 11 12 13 Description Serial clock input to the synthesizer Serial data input to the synthesizer Input latches the serial data transferred to the synthesizer CLK DATA EN . prescaler and counter. Two synthesizers consist of an IF synthesizer. The fractional counter in the RF synthesizer just differs from the IF synthesizer. So. is necessary for transmitting and receiving operation. For receiving operation. A fixed reference frequency of 1. is necessary for both transmitting and receiving operation. and a RF synthesizer. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by 2 for DCS Rx operation before entering into the direct conversion mixer. A dual band external VCO. which could drive the capability and the pulse width. which uses the PLL block of the main fractional-N synthesizer. Output frequency of the RF VCO is set by the factional number.6MHz for Tx) is generated by a reference divider from the external applied 13 MHz crystal oscillator. which includes an IF VCO with external tank circuits. The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wire interface.15 - .2 Synthesizer The TRF6150 includes two synthesizer parts. The auxiliary integer-N synthesizer (IF synthesizer). the external VCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSM Rx. Output frequency of IF VCO is settled by prescaler and counter. DCS frequency operation. The IF VCO has a frequency band from 832 MHz to 858 MHz. the OPLL block of the TRF6150 directly modulates the dual band external VCO with I and Q signals. The TRF6150 is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. The RF VCO works only when the transmitting operation is on. which is an integer-N synthesizer.

TECHNICAL BRIEF Figure 3-3. Synthesizer internal Block Diagram.16 - .3. .

3. which frequency bands are for the transmitting operation only. The frequency setting equations of the IF and RF frequencies are as follows. . The frequency band of the RF VCO is from 1294MHz to 1356 MHz. is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and is the output frequency of the RF VCO (the main fractional-N synthesizer). and the frequency band of the IF VCO is from 832MHz to 858Mhz. Figure 3-4. Synthesizer Circuit.17 - . TECHNICAL BRIEF The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.

dual schottky diode and dual band VCO. Figure 3-5. . A dual band directional coupler is used to control the RF output from the PAM. phase detector.18 - . The TRF6150 active parts consist of the vector modulator and offset phase-locked loop block (OPLL) including down-converter. PAM. and APC IC for power control.3 Transmitter The Transmitter part contains TRF6150 active parts. The peak output power of the PAM is controlled by means of a closed feedback loop. The PAM outputs from the directional coupler pass to the antenna connector via an integrated dual band antenna switch module. The VCO feed the output frequencies into PAM and TRF6150 for Tx local frequency. Transmitter Block Diagram. TECHNICAL BRIEF 3. coupler.3.

The Tx LO signal(1294 – 1356 MHz. TECHNICAL BRIEF 3. where they are modulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadrature mixer inside the U604.19 - .1 Tx Modulator The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator.3. which are multiplied by the BB modulation signal IP/IN and QP/QN. .3. Figure 3-6. TX IF Modulator and OPLL Circuit.4 MHz) is fed from the internal main and aux. The frequency input signal is split into two precise orthogonal carriers. The modulator provides more than 40dBc of carrier and unwanted side-band rejection and produces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets in the I/Q BB signals caused by imperfections in the D/A converters. VCO. 426. The Tx-Modulator implements a quadrature modulator. It is used as reference signal for the OPLL.

4MHz for GSM . EGSM and DCS operation. the control voltage Vapc should be control to less than 0.3.3 Power Amplifier The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to 1785 MHz). centered on the correct RF channel is frequency modulated with the original GMSK data. This voltage controls the transmit VCO such that the VCO output signal. And to get good stability. Power Amplifier and its Control Part Circuits.5 V. before the input is cut off. the through holes should be layouted as many as possible on PCB under the module. all the GND terminals and the metal cap should be soldered to ground plane of PCB.5 dBm for DCS for 3. . To avoid permanent degradation. This module should be operated under the GSM burst pulse. To avoid the oscillation at no input power. The feedback signal passes to one port of the phase detector. CW operation should not be applied.20 - . The error current is filtered by a second order low-pass filter to generate an output voltage. The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.3. The center frequency of the transmit VCO is offset from the RF VCO frequency by 414. The GMSK reference signal from the Tx IF modulator passes via a second limiter to the other input port of the phase detector.3.2 OPLL The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with the RF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM. 3. Figure 3-7.5 V nominal battery use. TECHNICAL BRIEF 3. which depends on the GMSK modulation and the desired channel frequency. The phase detector generates an error current proportional to the phase difference between the feedback signal from the down-converter and the `reference’ signal from the Tx IF modulator.EGSM and DCS operation. We have to improve thermal resistance.

Figure 3-8. The resultant RF output power via a directional coupler (N600). .4 13 MHz Clock The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal Oscillator). (U200) is applied to the APC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds a portion of the RF output signal back to the APC IC and peak detector converts this signal to a low frequency feedback signal that balances the amplifier when this signal equal to the RAMP input signal level. which oscillates at a frequency of 13 MHz. BB Analog chip-set (NAUCICA_CS). SN74AHC1GU04 buffer the output to NAUCICA_CS and CALYPSO. and Digital (CALYPSO). VCTCXO Circuit.4 PA Circuit and Control The power amplifier control circuit ensures that the RF signal is regulated to the required limits of operation.21 - . digital BB chipset. An internal input signal (PA_LEVEL) from CALYPSO. The RF sense voltage is peak detected using an schottky diode of BAT15-099(D600).3. RF power is controlled by driving the power control pins of power amplifier and sensing.3. 3. The 13MHz clock is used within the Synthesizer block of the TRF6150. TECHNICAL BRIEF 3. This detected voltage is compared to the DAC voltage in the TRF6150 to control the output power. The inverter IC.

22 - . The Regulator R1 is used to provide DC power to the receiver. The Regulator R3 is used for the external Rx/Tx VCO. The Regulator R2 is used to provide DC power to the DC offset compensation circuit. .5 Power Supplies and Control Signals Three Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (Regulator R1. the auxiliary synthesizer. External Regulator Circuit. the transmitter and the PA control loop of the TRF6150. Regulator Specification Regulator Regulator R1. TECHNICAL BRIEF 3. VCOs VCTXO RF_ENA. R2.8 V 2.3. Transmitter. the main synthesizer and VCOs. Table 3-5.1 V 0.5 V Powers Receiver. XO_ENA Enable Signal Figure 3-9. R2 R3). Synthesizers. An external regulator is used to provide DC power to the VCTCXO(U605).85 V 0. R3 (These are all integrated in the TRF6150) ADP3330_2V85 (U605) Voltage 2.

The chip will fully support the Full-Rate. 4M bit SRAM memory.1 General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. Top level block diagram of the Calypso G2(HERCROM400G2). Enhanced Full-Rate and Half-Rate speech coding. internal 8Kb of Boot ROM memory. a MicroController core with emulation facilities (ARM7TDMIE).23 - . CALYPSO implements all features for the structural test of the logic (full-SCAN. BIST. JTAG boundary-SCAN).6. a clock squarer cell. TECHNICAL BRIEF 3. several compiled single-port or 2-ports RAM and CMOS gates. .3. PMT. 3.6 Digital Baseband (DBB) Processor Figure 3-10. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories.

8bit access. 32bit access. 16bit access. 16bit access.24 - . (25*4 = 100ns) . • TPU(Time Processing Unit) : Processing for GSM time base • TSP(Time Serial Port) : GSM data interface with RF and ABB Memory Interface : External/Internal Memory Interface nCS0 : FLASH1. 0 wait state * Calypso internal 39MHz machine ¡ 3wait state is necessary for the 80ns access because of 25ns machine cycle. 3 wait state ( See Fig 3-2 ) nCS6 : Int SRAM. MIDI IC addressing. Flash or ROM • 4 Mbit Static RAM with write-buffer Application peripherals • ARM General purposes I/O with keyboard interface and two PWM modulation signals • UART 16C750 interface (UART_IRDA) with .2 Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals.3. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core • DSP subchip • ARM peripherals: General purpose peripherals • ARM Memory Interface for external RAM. 3 wait state nCS2 : Ext SRAM.6.IRDA control capabilities (SIR) . CTS/RTS) .autobaud function • SIM Interface.Software flow control (UART mode). TECHNICAL BRIEF 3. 3 wait state nCS1 : FLAHS2.hardware flow protocol (DCD. • UART 16C750 interface (UART_MODEM) with . Sub LCD. 16bit access. 3 wait state nCS3 : Main LCD.

RF Interface Specification TSP (Time Serial Port) Resource TSPDO TSPEN0 TSPEN1 TSPACT00 TSPACT05 Interconnection Description ABB & RF main Chip Control Data ABB ABB Control Data Enable Signal RF main Chip RF Control Data Enable Signal TPU (Time Processing Unit) Parallel Port RESET_RF RF main Chip Reset Signal PA_ON Power Amp ON signal .4 RF Interface (TPU.6. TECHNICAL BRIEF Figure 3-6.25 - . External Device Spec connected to memory interface Interface SPEC Maker Name Access Time TH50VPF5683BASB Toshiba TC58FVB641FT/XB Toshiba TH50VPF5683BASB Toshiba S6B0023/S6B0018 SDI KS0723 SDI YMU762 Yamaha Device FLASH 1 FLASH 2 SRAM MAIN LCD SUB LCD Melody IC Write Access Time 80ns 80ns 70ns TBD 60ns 50ns Read 80ns 80ns 70ns TBD 60ns 80ns 3.3 External Devices connected to memory interface Table 3-6.3.6. TSP block) Calypso uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) with GSM Time Base Table 3-7. Decoding Section Block Diagram 3.

6.UART2 : Handsfree Control / SW trace or IrDA Modem Table 3-9. UART Interface Specification UART MODEM(UART1) Name Note Transmit Data Receive Data Clear To Send Request To Send Data Set Ready Data Carrier Detect UART IRDA(UART2) Infra-Red Transmit Pulse Transmit Data(UART2) Infra-Red Receive Pulse Receive Data(UART2) IRDA transceiver ShutDown Mode Resource TX_MODEM RX_MODEM CTS_MODEM RTS_MODEM GPIO 3 GPIO 2 TXIR_IRDA TX_IRDA RXIR_IRDA RX_IRDA SD_IRDA TXD RXD CTS RTS DSR DCD TXIR_IRDA TX RXIR_IRDA RX SD_IRDA .6.3. TECHNICAL BRIEF 3.5 SIM interface SIM interface scheme is shown in (Fig. SIM_CLK. SIM Interface SIM (Interface between DBB and ABB) SIM card async/sync reset SIM card power activation SIM card bidirectional data line SIM card reference clock SIM_RST SIM_PWCTRL SIM_IO SIM_CLK Figure 3-12.UART1 : Hardware Flow Control / Fax&Data Modem .6 UART Interface The phones has two UART Drivers as follow : . SIM_IO. SIM Interface 3.26 - . SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 3V/5V SIM operation Table 3-8. 3-12).

GPIO Map Table I/O # I/O (0) I/O (1) I/O(2) I/O (3) I/O (4) I/O (5) I/O (6) I/O (7) I/O (8) I/O (9) I/O (10) I/O (11) I/O (12) I/O (13) I/O (14) I/O (15) Application FOLDER MELODY_INT DCD DSR Sub_backlight SIM_PWCTL Jack_Detect LCD_RESET SPK_EN MELODY_RESET SUB_LED1 SUB_LED2 SUB_LED3 HANDSFREE NBHE NBLE I/O I I O I O O O O O O O O O I O O Resource State GPIO GPIO GPIO GPIO GPIO SIM GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO MEMORY MEMORY LOW HIGH LOW HIGH LOW LOW LOW HIGH HIGH LOW HIGH LOW HIGH HIGH HIGH LOW Inactive State HIGH (Open) HIGH LOW HIGH LOW Active State LOW (Closed) LOW HIGH LOW HIGH 3.Audio Signal Processing & Interface .Battery charging control .27 - . quadrature(Q) Signal Processing . the phones GPIO(General Purpose Input/Output) Map.Baseband in-phase(I). TECHNICAL BRIEF 3. is shown in below table.3.7 GPIO map In total 16 allowable resources.Supply voltage regulation . and enable level. GPRS Class 10 with Digital Basband Chip(Calypso G2) Nausica_CS processes GSM modulation/demodulation and power management operations. Block Description .3V/5V SIM card Interface .4 internal & 5external ADC channels .Switch ON/OFF . describing application.7.1 General Description Nausica CS is Analog Baseband (ABB)Chip supports GSM900. I/O state.7 Analog Baseband (ABB) Processor 3. DCS1800. the phones is using 13 resources except 3 resources dedicated to SIM and Memory.6.RF interface with DBB (time serial port) . Table 3-10.

Baseband Codec Block Diagram . Figure 3-14. BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) component and quadrature(Q) component with burst data from DBB.. it performs GMSK demodulation with input analog I&Q signal from RF section. The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker). MICBIAS is 2.3. and then transmit it to DSP of DBB chip with 270KHz data rate through BSP.5Vlevel.7.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path.3 Baseband Codec(BBC) Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL). This transmitted signal is reformed to fit in GSM Frame format and delivered to RF Chip. TECHNICAL BRIEF 3. This modulated signal is transmitted through RF section via air. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip. Audio Interface Block Diagram 3. Figure 3-13.7.28 - . Namely. BDL process is opposite procedure of BUL.

TECHNICAL BRIEF 3.4 Voltage Regulation(VREG) There are 5 LDO(Low Drop Output) regulators in ABB chip. (Figure 3-6) shows the power supply related blocks of DBB/ABB and their interfaces in the phones. Figure 3-15. Power Supply Scheme Table 3-11. The output of these 5 LDOs are as following table.7.0V 2. LDO Output Table Output Voltage VR1 VR1B VR2 VR2B VR3 1.8V 2.7.29 - . .9V Usage Digital Core of DBB Digital Core of ABB Memory Interface of DBB Digital I/Os of DBB & ABB Analog Block 3.9V 2.5 ADC Channels ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.3.9V 2.

Charging current : 420mA 6. Charging time : 2h 4. TECHNICAL BRIEF Table 3-12. Switch-off voltage : 3. Full charge indication current (icon stop current) : 100mA 9. Charger detect voltage : 4. ADC Channel Spec ADC 9 channels Resource VCHG VBAT ICHG VBACKUP ADCIN1 ADCIN2 ADCIN3 ADCIN4/TSCXP ADCIN5/TSCYP VCHG VBAT ICHG VBACKUP Not Use BATT_Themister RADIO_TEMP Hook_Detect Not Use Battery Detect Temperature Sensing HOOK_DETECT Backup Battery Charging Management Name 3. Icon stop current : 100mA 5.2V 7.30 - .62V b. Figure 3-16. ~ -2°C : not charging operation. Battery Block Indication and SPEC of the phones is as follow. -2°C ~ 47°C : charging. b.35V 13. .6 Charging Charging block in ABB processes charging operation by using VBAT. Low battery alarm a. CV voltage : 4. ICHG value through ADC channel. Charging method : CC-CV 2.7. Low battery alarm interval : a. 47°C ~ : not charging operation.3. c. Cutoff current : 40mA 8.50V 11. Charging temperature adc range a.0V 3. Idle : 3. Recharge voltage : 4. Idle : 3min b. Dedicated : 3.16V 10. Dedicated:1min 12. Battery Block Indication 1.

31 - . when a falling edgeis detected on RPWON pin. . Receiver.7. .Switch-ON : mobile powered and waken up from switch-off state.Power-ON : mobile is powered by main battery or backup battery.IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. . Vibrator FPC Interface Between LCD module and main board . TECHNICAL BRIEF 3.ON_REMOTE : After debouncing. 3.4V on VCHG. one of following 4 condition is satisfied.CHARGER_IC : When a charger voltage is above VBAT+0.8 Memories • 64Mbit/32Mbit Flash/SRAM MCP + 64Mbit Flash ¡ 128Mbit Flash + 32Mbit SRAM • 16 bit parallel data bus • ADD01 ~ ADD22 3. . FPC Interface Between LCD module and Speaker. . To enter into Switch-ON state.PWR-ON : pushed after a debouncing time of 30ms.Power-OFF : mobile isn’t any battery. .7.3. .9 Display & FPC Interface LCD module include: Main LCD Sub LCD Main LCD Backlight Sub LCD Backlight 7 color Indicator LED 128 96 160 65K Color STN LCD 64 mono FSTN LCD White LED illumination and AC/DC converter Module EL Backlight KOHA HL006-W11 LCD module is connected to main board with 32 pin FPC and connected to Speaker.7.Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).7 Switch ON/OFF The phones Power State : Defined 4cases as follow . Receiver. Vibrator with 8 pin FPC connector.

3.32 - .0V /CS A(1) D0 D1 D2 D3 D4 D5 D6 D7 /WR /RES VSS LED_EN VBACKUP I_LED1 I_LED2 I_LED3 EL_EN VBAT SUB_CS CS2(A2) VSS1 VBAT1 MOTOR REC(-) REC(+) SPK(-) SPK(+) AUDIO GND BACKLIGHT PWR BACKLIGHT BACKLIGHT BACKLIGHT BACKLIGHT PWR Sub Interface (Parallel) GND PWR VIBRATOR Main Driver Write Enable Main & Sub LCD driver Reset Ground Main LCD backlight Enable (Enable High) Backup Battery Indicator LED Enable 1(Enable High) Indicator LED Enable 2(Enable High) Indicator LED Enable 3(Enable High) Sub LCD EL backlight Enable (Enable High) VBAT for White LED operation Sub LCD Chip Select1 (Low Enable) Sub LCD Chip Select2 (High Enable) Ground VBAT for White LED operation Vibrator Enable Receiver Negative Receiver Positive Speaker Negative Speaker Positive MAIN INTERFACE Data BUS Category PWR Description Driver IC power supply Main Driver Chip Select Instruction/Data Identification(RS) . TECHNICAL BRIEF Table 3-13. FPC Interface Spec Pin # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NAME VDD3.

Keypad Map KBC0 KBR0 KBR1 KBR2 KBR3 KBR4 [ ] KBC1 [ ] [2] [5] [8] [0] KBC2 [ ] KBC3 [ ] KBC4 [CFM] [Voice Memo] [Vol Up] [Vol Down] [F3] [1] [4] [7] [*] [3] [6] [9] [#] [F4] [F1] 1[F2] [SEND] DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).33 - . Figure 3-17.7.3.10 KeyPad Switching & Scanning Table 3-14. TECHNICAL BRIEF 3. Keypad Scanning Scheme .

In addition. this 2. TECHNICAL BRIEF 3. On detecting this 2. Figure 3-19. Audio Section Scheme Uplink The microphone is soldered to the main PCB. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) through switching IC(U404) and R401. The uplink signal is passed to MICIP and MICIN pins of Nausica_CS. When the headset is inserted.11 Audio Figure 3-18.8V high state and it’s input of U404(#1) and Calypso (Jack_Detect). Calypso makes Nausica_CS switches the mic amplifier path from main to auxiliary.8V output. The MICBIAS voltage path is switchable by control the U404.8V output applied to U404(#1) and U404 switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.3.7. U400 outputs 2.34 - . Uplink Path .

8V and EARP signal is passed to speaker through MIDI IC(U403). Figure 3-20. KeyPad and Main LCD Back-light Scheme . TECHNICAL BRIEF Downlink The downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset is inserted and Calypso detects ‘Jack_Detect’ signal(output of U400). Calypso makes ‘SPK_EN’ to 2. which are driven by ‘KEYLIGHT’ line from Calypso. Figure 3-21.7. Calypso makes Nausica_CS switches the downlink path from ‘EARP’ and ‘EARN’ to ‘AUXOP’ and ‘AUXON’.12 KeyPad and Main LCD back-light Illumination There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and Main LCD Back-light respectively.3. Downlink Path Speaker Phone In speakerphone mode.35 - . 3.

Sub-LCD EL Illumination 3. Indicator LED Illuination In the case of power off mode(ON_OFF=Low).3. TECHNICAL BRIEF 3. there is an EL driver in FPCB Board. Green LED and Blue LED.13 Sub_LCD EL Illumination In Sub-LCD EL illumination.7. In other cases(ON_OFF=High). R509 is connected to VCHG and I_LED1(Red LED) is turned-on. which is driven by SUB_BACKLIGHT line from Calypso(GPIO4).7. Figure 3-22. The combination of these LEDs makes 7 colors Figure 3-23.14 Indicator Illumination Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED is controlled by SUB_LED1. SUB_LED2 and SUB_LED3 signal of Calypso . Multi-color LED consists of Red LED.36 - . if TA is inserted.

4.dat. The LAPUTA_Service Tool has five main frames. LAPUTA Service Tool .1. you’ll see the below user interface window titled LAPUTA_Service Tool in figure 4-1. SERVICE S/W AND CALIBRATION 4. are located in window system folder so that these files are loaded automatically.exe.Under Microsoft windows 98 or more than 4. if you execute LaputaService.epm.16Mbyte RAM .2 Hardware and software environment .1 Overview This service S/W is used for Calibration and Standalone test.1.4.37 - . RampTable.Remained more than 10Mbyte in Hard Disk Memory . Start Setup.4 Common Properties of Service Software When you execute this program. 4.3 Software installation Unzip the phones service software provided where folder you want there are some files extracted in that folder. default transmit ramping table. default calibration data. SERVICE S/W AND CALIBRATION 4.exe in Service software setup folder.More than 486 computer . Figure 4-1. and rf_original_L300.1.1.1 Service S/W 4.

Calculate You have to do this work after measuring PM for all 12-channel indexes. The number means ARFCN of base station broadcasting channel. PM window displays the power level measured in baseband chip. . Setting (BCH) You can set BCH of phone. you can see TCH and BCH ARFCN changed automatically. During continuous receiving mode. the box in red below the initialize button will turn into green. PM value is useful to calculate the received absolute power. When you use this program to test the phones. select target (the phones is default) and COM port used at your computer and then click the Initialize button. You can measure PM for all 12-channel indexes by changing Number and clicking PM Start. B. When you click this button. You can change the value by clicking arrow button by one step or just entering the number directly. Target system frame This is for initializing the target phone. The unit of PM is dBd. If target initializing is ended successfully. . .AGC Value Setting You can set AGC gain of phone. The number means ARFCN of Traffic channel. you can control receiver path of target phone. There are 12 pre-defined ARFCNs within Rx band.Serving Freq. .Beacon Freq. . SERVICE S/W AND CALIBRATION A.38 - . The number means gain of AGC amplifier in Rx path. label of Standalone button is changed to Stop. If you want stop receiving mode operating. To initialize target phone.PM Start You can measure Rx power that target received from test equipment. service software calculate the calibration data from measured 12 PM data.Standalone This button makes target operate in Rx mode continuously. Setting (TCH) You can set TCH of phone. click this button one more. .Power Measurement The number means channel index according to pre-defined ARFCN. 4 ARFCNs are for GSM and others for DCS.4. . Rx AGC Test frame At this part. When you click this button the result of power measurement displayed at PM blank in Power Measurement frame. Clicking arrow button to change number. Target will be operated under the condition that you set. . you have to initialize target at first.

Patten is to select data format that is transmitted. . But it is deactivated in service software.Uplink Normal Burst test You can also control the traffic slot number be using by changing TCS value. You can send all data 0. But it is good to you to using the default value because data format doesn’t affect to RF characteristics. Select epm file you want to save into Flash then click Open. Tx APC Test frame At this part. and you want to download into target Flash. You can also see calibration results here. The number means ARFCN of base station broadcasting channel. or 1 or repeating of 1010.Test Transmitting is started when you click this button. Click Ok. E. contains calibrated data. . . Level means GSM/DCS output power level. Ramp Shape button This button is for burst shape table. D. Then you can see RF parameters Save window. . User Command and Results frame Whenever you click button or make some event in service software. DAC value is a factor to determine output power. During saving file into Flash. As successfully ending download. click this button one more. Because GSM has 8-time slot. Setting (BCH) You can set BCH of phone. The number means ARFCN of Traffic channel.Power Level Setting First. Usable range is 5 to 19 for GSM.Serving Freq. information box will be appeared. Then select the Level and adjust the DAC value. Check Flash and click Calib Save button. check Flash and click File Download button. Then you can see RF parameters Save window.Saving Cal. . SERVICE S/W AND CALIBRATION C. The statement bar indicating download process is displayed under the RF Parameter Download frame. . RF Parameter Download frame . Setting (TCH) You can set TCH of phone. every ordered event is displayed in this frame. 0 to 15 for DCS. F. Data to Flash After Rx or Tx calibration. Its variable range is 0 to 1023.4. you have to choose operating mode (GSM or DCS) according to TCH and BCH frequency that you selected before. label of Test button is changed to Stop. TCS value varies 0 to 7. Write the file name and click Save button.Beacon Freq. If you want stop transmitting.Saving epm file into Flash When you have a epm file.39 - . During Transmitting. you can control transmit path of target phone. . you can save the calibration results into Flash and epm file.

so only manual calibration process is possible. any other call equipmen Brand Pentium II class above 300MHz .2. The program also enables writing the default parameters on the Flash.2. CMU200. Calibration Equipment List. The service software turns the phone into the locals mode. Equipment for Calibration Wireless Communication Test Set RS-232 Cable and Test JIG RF Cable Power Service SW (LAPUTA) Test SIM Card PC(for Software Installation) Type / Model HP8960.HP8922. in view of replacement of the circuit. The service software can’t control the equipment. in which case all calibration steps should be carried out. 4. SERVICE S/W AND CALIBRATION 4.g.2 Calibration 4. in which the phone can be outwardly controlled via the test Jig.40 - .2 Equipment List Table 4-1.4. The contents of the Flash can be read by the service software and saved as a file.1 Overview All tuning operations of the phone are carried out using the service software. This is advisable when there is need to retain that information. e. The calibration values of the phone reside on the Flash.

3 Equipment Setup + - + - Figure 4-2.2. SERVICE S/W AND CALIBRATION 4.4. Calibration Equipment Setup .41 - .

“Please execute after measuring the PM”. 700.Procedure a) Initialize phone by clicking Initialize button. some calibration is necessary. four calibrations are required per transmit band. AGC calibration. i) Saving updated calibration data into phone by clicking Calib Saving button. f) Click the PM Start button. DCS band . temperature compensation and low voltage compensation are not needed in replacement of the circuit and channel compensation is not needed because the transmit power is in GSM specification with enough margin. Of these. 40. same with phone. the service software reports. due to AGC implementation. some AGC specific constants need calibration. 822 and 885. then the service software calculate the channel compensation parameters. And the target powers in dBm for each power level are. NOTE If the calibration does not done for all channels. d) Click the PM Start button.In power compensation.4 Calibration Steps A. : 512. received power by phone. In total. h) Click the Calculate button. the channel numbers used in Tx band are. b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’. E-GSM band : 0. temperature compensation is not needed in replacement of the circuit. SERVICE S/W AND CALIBRATION 4. Of these. and 1023. c) Set the power of GSM test equipment ‘–74dBm’. 975. power calibration.4. channel compensation and temperature compensation. e) Change the BCH and TCH of phone by clicking the Number button and set the channel (BCH & TCH) of equipment to be same. In channel compensation. DCS band : 699. . TX Calibration In order for the Tx power to be within the GSM specifications for each Tx level. three calibrations are required per receive band. E-GSM band : 62.2. then the value.42 - . 5 channels for EGSM900 and 7 channels for DCS1800. the channel numbers in Rx band are. In total. Also. 636. g) Repeat above procedure until the displayed number in Power Measurement window is 12. In AGC calibration the reference power fed into the phone via permanent antenna connector is –74dBm. RX Calibration In order for the RSSI measurements to be within the GSM specifications. temperature compensation and low voltage compensation. is displayed in PM measurement window at service software. B. 574. channel compensation. some calibration is necessary. 760. 124.

43 - . For each power level. Tx targer powers Power level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 32 31 29 27 25 23 21 19 17 15 13 11 9 7 6 GSM DCS 29 28 26 24 22 20 18 16 14 12 10 8 7 6 5 4 -Procedure a) Initialize phone by clicking Initialize button. c) Saving updated calibration data into phone by clicking Calib Saving button. SERVICE S/W AND CALIBRATION Table 4-2.4. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value. . b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. adjust the DAC value to get target power and click Test button. Then you can see the output power displayed on test equipment.

JIG Power Description Power Supply DC Adaptor Usually 4.5V. Indicate date transfer state through the UART MODEM.44 - . 3) Set the 3rd of DIP SW ON state. If the Remote Power On is used.C power Description In ON state. 4) Press the Phone power key. LED Description LED Number LED 1 LED 2 LED 3 LED 4 Name POWER CHARGER UART IRDA UART MODEM Description Power is provided for Test Jig Indicate charging state of the Phone Battery with Travel Charger.2. 2) Set the Power Supply 4. Also DC adapter may be used. switch the 1st of Dip Switch ON. . Turn on for AUDIO TEST.Operation 1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in general. set 4th ON state. JIG DIP Switch Switch Number Switch 1 Switch 2 Switch 3 Switch 4 Name RPWRON HF_DETECT Power Supply D.0 V 9. In case of DC adapter.4.5 Test JIG Operation Table 4-3. Power is provided for phone from Power Supply. phone is awaked.0V. SERVICE S/W AND CALIBRATION 4. Table 4-5. . Indicate date transfer state through the UART IRDA. Power is provided for phone from DC adaptor. 500mA Table 4-4.

1 Download Equipment 1) Data Kit 2) Desktop or Notebook PC 3) Download Monitor Program 4) The phones mobile phone + - . DOWNLOAD 5.5.1 Download Setup 5.45 - .1. DOWNLOAD 5.

2. Otherwise downloading process won’t properly . DOWNLOAD 5. DK-10G that is connected to COM1 or COM2 serial port in the Desktop or Notebook PC.5.2. Note : Target SW* means any necessary software to be downloaded to the mobile phone. Target SW* downloaded to the phones mobile phone.2 Download Procedure 5. 5. Warning You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are provided from LGE.46 - .2 Download Environment In order to download software of the phones. The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC. the following working environments should be prepared: the phones Data Link Kit.1 General Purpose This document gives a guideline for upgrading software of the phones using UART port.

DOWNLOAD 5. choose “Connect” in the Target Menu. And then select the “Target” Menu shown in Figure 5-1. B. Figure 5-2. Execute monitor663.47 - .3 Download Procedure A. C.exe.5. . Then. And press “OK” button.zip) in PC.2. Unzip the phones UART Download monitor program(monitor 663. Figure 5-1. Then press the arrow-button and choose a correct serial port. A table will be displayed as shown in Figure 5-2.

If the connection is succeeded. As the following window shown in Figure 5-3. DK-10G and power on the phones. connect the phones Phone to Data Link Kit.5. Figure 5-3.48 - . DOWNLOAD D. Figure 5-4. is displayed. the following screen will show the contents as shown in Figure 5-4. .

F. DOWNLOAD E.5. Click on “Flash” on the top menu and select “Get type” item as shown in Figure 5-4. Figure 5-6. Figure 5-5. Finally choose the target SW that you want to download.49 - . . And then you can see the following window in Figure 5-6. and select “Erase and Program Appli Only+Boot” item as shown in Figure 5-5.

DOWNLOAD G.50 - . If the downloading procedure is succeeded. then the following window is shown. .5. Figure 5-7.

6.51 - . TROUBLE SHOOTING Figure 6-1. TROUBLE SHOOTING 6. Measurement set-up . Figure 6-1. shows a measurement set-up.

TROUBLE SHOOTING 6.52 - .1 Rx Trouble (EGSM) .6.

53 - .2 Rx Trouble (DCS) . TROUBLE SHOOTING 6.6.

6. TROUBLE SHOOTING

6.3 Tx Trouble

U200 : CALYPSO (BB Digital Main Chip) U201 : NAUSICA CS (BB Analog Main Chip) U601 : PAM (PF08122B) U604 : RF Main Chip (TRF6150) U600 : TXVCO (ENFVZ4LO7) U603 : Antenna S/W (SHS-M090B) N600 : Directional coupler (LDC15D 190A0007A) D600 : Shottky Diode (BAT 15-099)

1

- 54 -

6. TROUBLE SHOOTING

1

- 55 -

6. TROUBLE SHOOTING

6.4 Voice Function Trouble
A. Receiver

B. Speaker

- 56 -

TROUBLE SHOOTING C.57 - . Microphone .6.

5 Display Function Trouble A.6. LCD .58 - . TROUBLE SHOOTING 6.

TROUBLE SHOOTING B.59 - .6. Indicator LED .

TROUBLE SHOOTING 6. Vibrator .6 Other Function Trouble A.6.60 - .

Charger .61 - .6. TROUBLE SHOOTING B.

Set the DC power supply to 4. 6 MHz (CH699) when testing the DCS RX path. QP. QN (see Figure 7-16. RX IP.3 (see Figure 7-7 ) 3. If there are any major difference between the readings taken and those indicated then further investigation of that particular point will be required. Receiver Testing Set-up To check the receiver the following conditions have to be set: 1. IN. It will also be necessary to ensure that all the following power supplies and signals are present which control this part of the receiver circuit: 1.4 MHz (CH62) when testing the GSM RX path or 1842.1 Testing Set-up 7.10. A block diagram showing the locations of the RF measurement points and levels is shown in Figure 7-3. The Control Signal of Antenna switch (see Figure 7-9.7.1. Note: All RF values shown are only intended as a guide figure and may differ from readings taken with other test equipment and leads. On a signal generator or a GSM/DCS test box.0 V. Testing Receiver Using a suitable high frequency probe measure the RF levels at the relevant points shown in Figure 7-2.62 - . EN (see Figure 7-13) 6. Vreg 1. STAND ALONE TEST AND TEST POINTS 7.18) . 2V85_VCTCXO (see Figure 7-8) 4.2. output a CW signal of amplitude = -60 dBm at either: 947.19) 7. 13MHz(see Figure 7-12) 5. STAND ALONE TEST AND TEST POINTS 7. Lead and connector losses should always be taken into account when performing such RF measurements. CLK. and compares your measurements with those shown in the diagram. DATA.11 ) 2.1 Received RF Level and Checks This section shows the typical RF levels expected throughout the receiver path. 2. Vtune(see Figure 7-17.

Set the DC power supply 4. Select GSM or DCS mode on service software. TX IP.63 - .7. 13 MHz (see Figure. Vapc (see Figure. 6.1. Configure the testing equipments as Figure equipment setup. Click Test.3 (see Figure. Set TCH and BCH value to be same with GSM/DCS test equipment on service software. 10. Lead and connector losses should always be taken into account when performing such RF measurements. 2V85_VTCXO (see Figure. 7-12) 5. 8. 7-8) 4. 9. Testing Transmitter Using a suitable high frequency probe measure the RF levels at the relevant points shown in Fig.2 Transmitted RF Level and Checks This section shows the typical RF levels expected throughout the transmitter path. 7-7) 3. A block diagram showing the locations of the RF measurement points and levels is shown in Figure 7-5. Set DAC ‘600’ for EGSM900 or ‘700’ for DCS1800 on service software. QN (see Figure. 7. If there are any major difference between the readings taken and those indicated then further investigation of that particular point will be required. 3. 5. PA_LEVEL. IN. 7-14) 6. 7-4 and compare your measurements with those shown in the diagram. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode). PA_ON. Note: All RF values shown are only intended as a guide figure and may differ from readings taken with other test equipment and leads. 7-15) . The Control Signal of Antenna Switch(see Figure 7-9. Initialize target on service software. Transmitter Testing Set-up To check the transmitter the following conditions have to be set: 1. It will also be necessary to ensure that all the following power supplies and signals are present which control this part of the transmitter circuit: 1.0volts. STAND ALONE TEST AND TEST POINTS 7. 2. Vreg 1. QP. Set the BCH and TCH ARFCN ‘62’ for EGSM900 or ‘700’ for DCS1800 on GSM/DCS test equipment. 11) 2.2. 4.

1 RF components (Component Side) N600 D600 SW600 U603 U607 BPF600 U601 D601 BPF601 U602 U604 U600 U606 U605 U629 D602 Figure 7-1.2.7.2 Testing Points 7. STAND ALONE TEST AND TEST POINTS 7. Table 7-1. RF components Reference U604 U603 U601 N600 U607 U629 U605 D601 RF main chipset Antenna Switch PAM Coupler NOR Gate Inverter LDO Varactor Diode U600 U606 U602 BPF601 BPF600 SW600 D600 D602 Reference Dual RF VCO VCTCXO Balun GSM RF SAW Filter DCS RF SAW Filter Mobile Switch Dual Schottky Diode Varactor Diode . RF components (Component Side).64 - .

2 Test point of Rx Levels 3 2 1 2 4 5 6 Figure 7-2. Test point of Rx Levels.7. .65 - .2. STAND ALONE TEST AND TEST POINTS 7.

699. -60dBm DCS: CH.66 Figure 7-3. -60dBm . Receiver RF Levels .7. STAND ALONE TEST AND TEST POINTS GSM: CH.62.

Test point of TX Levels. STAND ALONE TEST AND TEST POINTS 7.67 - .2.3 Test point of TX Levels 6 13 5 12 4 11 10 1. 8 3 Figure 7-4. 7 9 2. .7.

7. STAND ALONE TEST AND TEST POINTS

GSM: Pwr LvI 5, Ch.62, -32dBm DCS: Pwr LvI 0, Ch.700, -29dBm

- 68 Figure 7-5. Transmitter RF Levels

7. STAND ALONE TEST AND TEST POINTS

7.2.4 Control signal test points
VC2

VC1

VAPC I/Q

Regulator 2V85 LB_SW

13MHz HB_SW Vtune TXRX_SW

PA_LEVEL

PA_ON

CLK, DATA, EN

Vtune

Figure 7-6. Control signal test points

- 69 -

7. STAND ALONE TEST AND TEST POINTS

Figure 7-7. 2V85_Vreg 1, 2, 3 Output

Figure 7-8. 2V85_VCTCXO Supply Voltage

- 70 -

7. STAND ALONE TEST AND TEST POINTS Figure 7-9. Antenna S/W control voltage in EGSM_TX VC1 VC2 Figure 7-10. Antenna S/W control voltage in DCS_TX .71 - .

7.72 - . STAND ALONE TEST AND TEST POINTS VC1 VC2 Figure 7-11. 13MHz Clock . Antenna S/W control voltage in RX Figure 7-12.

STAND ALONE TEST AND TEST POINTS CLK DATA EN Figure 7-13. CLK. DATA. VAPC (GSM Tx Level=7) .73 - .7. EN Figure 7-14. PA_LEVEL. PA_ON.

Rx I / Q Signal .74 - . STAND ALONE TEST AND TEST POINTS Figure 7-15. Tx I / Q Signal Figure 7-16.7.

DCS 512CH) . GSM 1CH) Figure 7-18. Vtune (U600 pin 13. PA_ON. PA_ON. Vtune (U600 pin 13.7.75 - . STAND ALONE TEST AND TEST POINTS Figure 7-17.

STAND ALONE TEST AND TEST POINTS Figure 7-19.7.76 - . RX I/Q Signal(Extended) .

8. 2 1 Figure 8-1. Removing Screws .77 - . DISASSEMBLY INSTRUCTION 8. DISASSEMBLY INSTRUCTION 1. Remove the battery and screws.

Unlock the PCB and remove other components as shown in Figure 8-3. 3. Use a thin plastic sheet to slide and open the gap between front and rear covers. and detach them carefully with both hands.78 - . 2 1 1 2 Figure 8-2.8. Disassembling covers 4. Figure 8-3. DISASSEMBLY INSTRUCTION 2. Then carefully remove the rear cover from the hooks as shown in Figure 8-2. Unlocking and removing the PCB .

8. Assembly of PCB with the cover . Firstly. DISASSEMBLY INSTRUCTION 5.79 - . insert one side of FPCB carefully into the slot. Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2 1 2 Figure 8-4.

80 - . Removing antenna-bushing . DISASSEMBLY INSTRUCTION 6.8. Remove the antenna and use a sharp awl to push away the antenna-bushing. 1 2 3 Figure 8-5.

Insert-nut Figure 8-7. please see the insert-nut next to the button and carefully remove it.81 - . 1 1 2 3 Figure 8-6. Removing a side button . DISASSEMBLY INSTRUCTION 7.8. Removing battery locker 8. Use a tweezers to remove the battery locker. When removing the side button from the main front.

Removing Folder 10. Figure 8-8. and detach screw caps by using a pin. Figure 8-9. DISASSEMBLY INSTRUCTION 9. Push away the hinge to remove the folder.82 - . Removing hinge and screws . Remove the hinge.8.

Then detach them carefully with both hands. Use a thin plastic sheet to slide and open the gap between the folders.8. Disassembling Folders . DISASSEMBLY INSTRUCTION 11. Figure 8-10.83 - .

84 - .8. Disassembly of the rest components . Finally detach the rest components as shown in Figure 8-11. DISASSEMBLY INSTRUCTION 12. Figure 8-11.

Below you can see the block diagram of both PCBs. there is a main board.85 - . And in the upper part of the folder. . there is a FPCB.9.1 Main Board The phones is made up of two PCBs. In lower part of the folder. BLOCK DIAGRAM 9. Figure 9-1. Main Block diagram. BLOCK DIAGRAM 9.

BLOCK DIAGRAM 9. FPCB Block diagram.9.2 FPCB Figure 9-2.86 - . .

RF Block diagram .9. BLOCK DIAGRAM 9.3 RF Figure 9-3.87 - .

KIM Drawing Name Drawing No. Data Name Electronics Inc 1 2 3 4 5 6 7 8 .0V MAIN_CS A0 (D/I) MAIN_CS A(1) D(0:7) BATT_TEMP L103 L104 BLM15AG121PN1 BLM15AG121PN1 R101 20K 4 5 VR2B R102 33K 7 5 3 1 D VCHG2 VCHG1 21 BATT2 22 BATT1 AUXI CTS RTS TX TXD 24 23 20 15 14 R103 MNR04 10K 8 6 4 2 R104 10K R105 100R 2 4 6 8 D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) _WR LCD_RESET L105 L106 L107 L108 L109 L110 L111 L112 L113 L114 L190 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 4 5 6 7 8 9 10 11 12 13 14 D0 D1 D2 D3 D4 D5 D6 D7 _WR _RES VSS LED_EN VBACKUP I_LED1 I_LED2 I_LED3 EL_EN VBAT SUB_CS CS2 (A2) VSS1 VBAT1 MOTOR RECREC+ SPKSPK+ 27 26 D R106 47R MNR04 1 3 5 7 AUX_IN CTS RTS TX TXD AUXOP AUXON RXD RX DTR HANDSFREE RPWRON TDO TMS TCK TDI DCD MAIN_BACKLIGHT I_LED1 I_LED2 I_LED3 SUB_BACKLIGHT SUB_CS A(2) MOTOR (REC_N) EARN REC_P SPKN SPKP BLM15AG121PN1 R109 220R 18 AUXOP 17 AUXON 13 RXD 10 RX 3 DSR 2 HANDSFREE POWER_ON 6 R107 R108 R110 2 4 6 8 4.11 Sign & Name D.04.S. CIRCUIT DIAGRAM 10.m 1 3 5 7 MNR04 PCM_TX PCM_SYNC PCM_CLK PCM_RX C108 47p R114 1M HSP513 HSP514 C110 1uF (1608) TDO TMS TCK TDI 11 9 8 7 L117 L118 L119 L120 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 BLM15AG121PN1 25 F J101 LG-IO_CONN_24P L C106 C107 47p 47p R115 0R Section Designer Checked Approved Date 02.7R 4.7R 47R MNR04 1 3 5 7 L124 L115 L116 BLM15AG121PN1 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 BLM15AG121PN1 BLM15AG121PN1 E E R111 R112 2 4 6 8 1K 47R MNR04 1 3 5 7 HSP512 HSP126 HSP128 DCD 16 HSP134 HSP136 HSP135 HSP133 HSP130 HSP131 HSP132 HSP137 HSP127 HSP104 HSP105 HSP106 HSP107 HSP108 HSP110 HSP111 HSP112 HSP113 HSP114 HSP115 HSP116 HSP118 HSP119 HSP120 HSP121 HSP109 HSP117 HSP122 1 AUXGND 12 GND2 19 GND1 R113 2 4 6 8 n.JUNG N. CIRCUIT DIAGRAM 10.2R(1%) (2012) VBAT A(3) U101 SN74HC1GU04DCKR VR2B 3 4 B FOLDER OUT GND VR2B R118 10K B RPWRON R121 10K 5 R120 0R 1 2 U102 1 A0 VCC 14 A2 13 B2 12 O2 11 A3 10 B3 9 O3 8 R119 0R R122 10K A(0) C104 10u (2012) VCC_EXT 3 O0 4 A1 5 B1 6 O1 SUB_CS VCHG VBAT C L100 BLM15AG100PN1 P0402FC12C P0402FC12C 7 GND R124 0R MIDI_CS VBAT _CS3 VBACKUP V102 P0402FC12C ON_OFF U103 NC7SZ32 HSP129 3 Q101 RN1307 MAIN_CS 4 A(2) R123 0R 2 B0 IN C MC74VHC126 V100 L102 BLM15AG100PN1 V101 C105 47p J102 LG_LCD_CON_30P 1 2 3 VDD_3.04.1 BB Circuit 1 2 3 4 5 6 7 8 SIM_CLK SIM_RST SIM_I_O SIM_VDD HSP100 HSP101 HSP102 HSP103 3 2 1 VCHG C100 10u/16V A_case C101 22n A A VCC CLK RST GND IO VPP J100 LG_AMP_SIM C109 100n/16V (2012) C103 150p R100 20K VR2B ICTL 3 1 2 5 4 6 Q100 NDC652P 7 6 5 R117 0R 5 2 VBAT_2 D100 CRS08 VR2B VR2B R116 0.S.11 02.89 - .10. Model Sheet/Sheets 1/6 F BASEBAND INTERFACE LG issue Notice NO.

CIRCUIT DIAGRAM 1 R231 0R 2 3 4 5 6 7 8 9 10 11 12 KEYLIGHT PWT LCD_RESET JACK_DETECT SUB_BACKLIGHT DTR DCD MELODY_INT FOLDER A XO_ENA RF_ENA SUB_LED2 SUB_LED3 SUB_LED1 MELODY_RESET PCM_CLK PCM_SYNC PCM_RX PCM_TX CTS RXD B RTS TXD RXIR_IRDA TXIR_IRDA SD_IRDA RX TX VR2B R672 10K A VDD_RTC C233 100p TP220 VR2B UPR C202 20P X200 MC-146 4 UPR UPR GND TMS _WR TDO UPR B RPWRON VBAT TDO_ARM R223 R222 C203 20P R221 n.10.m 1 TCK TDI 3 2 TP221 VBAT TP222 R224 0R R202 10K _WR R203 10K C204 18p ON_OFF L10 TXD_MCSI_1_09 M10 RXD_MCSI_1_010 K9 FSYNCH_MCSI_1_012 N10 CLK_MCSI_1_011 N3 I_O0_TPU_WAIT P3 I_001_TPU_IDLE L4 I_O2_IRQ4 M4 I_O3_SIM_RnW H10 TSPDI_I_O4 N11 BCLKX_I_O6 N2 I_O7_NRESET_OUT P11 ARMCLK_BCLKR M2 IDDQ C13 OSC32K_IN B13 OSC32K_OUT C12 CLK32K_OUT A13 RFEN_NoPC A12 TCXOEN N1 niBOOT K8 SDO_INT10n M9 SDI_SDA P9 SCLK_INT1n L9 NSCS0_SCL N9 NSCS1_X_A2 A14 C8 D8 B8 C7 A8 B9 E8 D9 A9 C9 K7 L7 TX_IRDA RX_IRDA CLKOUT_DSP_SD_IRDA X_A4_TXIR_IRDA X_A1RXIR_IRDA TX_MODEM RTS_MODEM_TOUT DSR_MODEM_LPG RX_MODEM CTS_MODEM_XF PWT_BU PWL_LT VSSO C CLK DATA J14 TSPCLKX H11 TSPDO H13 TSPEN0 H12 TSPEN1 H14 TSPEN2 G12 nSCS2_TSPEN3 M12 M14 L12 L13 J10 K11 K13 K12 K14 J11 J12 J13 TSPACT00 TSPACT01 TSPACT02 TSPACT03 TSPACT04 TSPACT05 TSPACT06 TSPACT07 TSPACT08 TSPACT09 TSPACT10 TSPACT11 DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 ADD00 ADD01 ADD02 ADD03 ADD04 ADD05 ADD06 ADD07 ADD08 ADD09 ADD10 ADD11 ADD12 ADD13 ADD14 ADD15 ADD16 ADD17 ADD18 ADD19 ADD20 ADD21 ADD22 E13 CLKTCXO F12 START_BIT_CLK13M_OUT F1 B10 A10 J4 K4 A4 TDI TMS TCK TDO HANDSFREE END_ON_OFF RPWRON 13MHZ MCLK VBACKUP TP216 TP217 TP218 TP204 TP205 TP206 R225 1M D201 1SS388 C205 CK13M C EN 1n TP219 OSCAS PWON RPWON TDR TEN RESET_RF F10 ON_OFF D12 nRESPWON B14 INT4n_IT_WAKEUP P1 EXT_FIQ M3 EXT_IRQ D10 ON_OFF F6 RESPWRONZ D7 RTC_ALARM F7 INT1 H4 INT2 F2 C8 B8 A9 B9 C7 A7 B7 A8 PA_ON D TP208 D(0:15) D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) D(8) D(9) D(10) D(11) D(12) D(13) D(14) D(15) A(0) A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10) A(11) A(12) A(13) A(14) A(15) A(16) A(17) A(18) A(19) A(20) A(21) A(22) LCDSYNC TSCYM TSCXM ADIN1 ADIN2 ADIN3 ADIN4_TSCXP ADIN5_TSCYP DAC AFC APC AUXGND C5 A6 B6 B5 A5 E6 D6 C6 F10 F8 F9 G8 BATT_TEMP RADIO_TEMP HOOK_DETECT AFC PA_LEVEL C206 33n D E A(0:22) B7 D7 E7 D6 A6 C6 E6 C5 B5 D5 E5 B4 C4 D4 A3 B3 F3 F2 G5 G4 G2 G3 H1 H3 H2 H4 H5 J1 J2 J3 J4 K3 K2 K4 J5 L1 L2 L3 D2 U200 CALYPSO NEMU0_ NEMU1_ NBSCAN_ TDI TDO TCK TMS B11 E10 D11 D10 C10 B10 E9 TESTRESETZ TEST1 TEST2 TEST3 TEST4 TDO TDI TCK TMS U201 NAUSICA_CS L11 BFSR K10 BDR P12 BFSX M11 BDX P14 VDX N13 VDR M13 VFSRX N12 VCLKRX J5 BFSX K5 BDX G5 BFSR H5 BDR K7 VDR G6 VDX G7 VFS H6 VCK BDLQM BDLQP BDLIM BDLIP BULQM BULQP BULIM BULIP E10 E9 E8 E7 D9 D8 C10 C9 R204 R205 R206 R207 390R 390R 390R 390R C213 270p R280 R281 R282 R283 0R 0R 0R 0R QN QP IN IP C211 270p K9 H7 J7 K8 J8 H9 H8 J9 J10 K10 E MCUDI MCUDO MCUEN0 MCUEN1_I_O8 MCUEN2_I_O13 SIM_IO SIM_CLK SIM_RST SIM_CD_MAS0 SIM_PWCTRL_I_O5 N7 M7 M8 P8 L8 G13 F13 G10 G11 F14 J6 UDX K6 UDR F5 UEN SPK_EN B2 SDIO3 C4 SCLK3 B3 SRST3 MICBIAS AUXI AGNDA1 MICIP MICIN EARP EARN AUXOP AUXON BUZZOP MICBIAS AUXI MICIP MICIN EARP EARN AUXOP AUXON C215 220n C216 1u F VR2B VBAT_2 R208 20K R209 1M UPR VAUX VS2 VS1 SVDD SDIO5 SCLK5 SRST5 A3 A1 B1 A2 D4 B4 D5 (1608) SIM_VDD SIM_I_O SIM_CLK SIM_RST UPR VBAT D200 1SS388 VBACKUP F KBC4_XD1_02 KBC3_XD1_01 KBC2_XD1_00 KBC1_NIRQ KBC0_NFIQ XD1_03_KBR0 XD1_04_KBR1 XD1_05_KBR2 XD1_06_KBR3 XD1_07_KBR4 nBLE_I_O15 nBHE_I_O14 nFWE_X_A0 FDP_nIACK RnW_ nFOE_X_A3 VDDS_MIF0 VDDS_MIF1 VDDS_MIF2 VDDS_MIF3 D13 VDDS_RTC D14 VDD_RTC C14 GND_RTC L14 VDDS_1_1 N5 VDDS_1_2 E11 VDD_ANG E12 GND_ANG F11 VDD_PLL E14 GND_PLL VDDS_2 nCS3_ nCS2_ nCS1_ nCS0_ GND0 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 VDD0 VDD1 VDD2 VDD3 VDD4 VDD5 K3 VCC1 D2 VCC2 G9 VCC3 N.2u (2012) FWE C219 10u (2012) C220 10u (2012) C221 10u (2012) C228 100n C229 100n _BLE _BHE FDP KBC(0:4) KBR(0:4) F3 C230 100n C232 33u/6.11 Sign & Name D.04.m R220 10K R201 220K nBSCAN 10K n.KIM Model Sheet/Sheets 2/6 Drawing Name Drawing No.m G VBACKUP GRND1 GRND2 GRND3 VDD_RTC C218 100n R219 120K 3 U202 OUT GND S-817 IN NC 2 4 1 C231 100n K1 C2 G10 D202 1SS388 KBC(4) KBC(3) KBC(2) KBC(1) KBC(0) KBR(0) KBR(1) KBR(2) KBR(3) KBR(4) C223 100n C224 100n C225 100n C226 100n C227 100n C234 10u (2012) C222 2.04.S.S.C TP209 TP210 TP211 TP212 TP213 TP214 A5 B12 N14 P7 M1 E1 D3 C1 C3 C2 B2 E2 E4 F5 E3 F4 F1 N8 K1 P2 P4 P10 P13 G14 A10 A7 A2 B1 C11 A11 M5 P5 L5 K5 N4 K6 M6 P6 N6 L6 A4 B6 G1 D1 VDD_RTC VR1 VR2B V1B VR3 VR2 R211 20K K2 J1 H3 E2 D3 H1 E1 H10 C1 D1 SWITCH FDBK RESERVED VR2IN VR2SEL VR1OUT VR2OUT VR3OUT VR1BOUT VR2BOUT UPR VBACKUP VBAT VCHG ICTL C3 J3 E5 E4 E3 VCHG ICTL _WR _RD G _CS3 _CS2 _CS1 _CS0 R227 R228 0R 0R R229 0R REFGND BGTR1 BGTR2 BGTR3 BGTR4 BGTR5 IBIAS VREF G4 G3 G2 H2 J2 G1 F4 C217 100n R226 n.JUNG N.11 02. Data Name Electronics Inc 1 2 3 4 5 6 7 8 9 10 11 12 .3V A-CASE H H Section Designer Checked Approved Date 02.90 - . BASEBAND CHIPSET LG issue Notice NO.

Data Name Electronics Inc 1 2 3 4 5 6 7 8 .S.11 02.91 - .04.KIM Drawing Name Drawing No.m E E F Section Designer Checked Approved Date 02.04.11 Sign & Name D.JUNG N. CIRCUIT DIAGRAM 1 2 3 4 5 6 7 8 A A VR2 VR2 B D(0:15) A(1:22) B TP301 U302 TC58FVB641 A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10) A(11) A(12) A(13) A(14) A(15) A(16) A(17) A(18) A(19) A(20) A(21) A(22) G2 F2 E2 C2 D2 F3 E3 C3 D6 C6 E6 F6 D7 C7 E7 F7 G7 D3 E4 F5 F4 E5 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 VDD G3 K3 G4 K4 K5 G5 K6 G6 H3 J3 H4 J4 H5 J6 H6 J7 J5 U301 TH50VSF4683 D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) D(8) D(9) D(10) D(11) D(12) D(13) D(14) D(15) D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) D(8) D(9) D(10) D(11) D(12) D(13) D(14) D(15) J3 G4 K4 H5 H6 K7 G7 J8 K3 H4 J4 K5 J7 H7 K8 H8 J5 J6 K6 J9 G3 A1 A10 B1 B10 C1 F1 F10 G1 G10 L1 L10 M1 M10 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 VCCF VCCS DU_CIOS VSS0 VSS1 NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 G2 F2 E2 D2 F3 E3 D3 C3 C7 E7 F7 C8 D8 E8 F8 D9 G9 F4 E4 D7 E6 E9 C K2 VSS0 K7 VSS1 NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 A1 A2 A7 A8 B1 B7 B8 L1 L2 L7 L8 M1 M2 M7 M8 _CS1 R302 0R A(1) A(2) A(3) A(4) A(5) A(6) A(7) A(8) A(9) A(10) A(11) A(12) A(13) A(14) A(15) A(16) A(17) A(18) A(19) A(20) A(21) A(22) R300 0R _CS0 _RD _WR C H2 CE_ J2 OE_ C5 WE_ H7 BYTE_ C4 RY_BY_ D4 WP_ D5 RESET_ H2 CEF_ H3 OE_ C6 WE_ H9 BYTE_ E5 RY_BY_ C5 WP_ D5 RESET_ LB_ UB_ CE1S_ CE2S_ DU C4 D4 J2 D6 G8 D VR2 D FDP R303 0R _BLE _BHE _CS2 C300 100n R305 10K C304 33n R301 C301 100n n. Model Sheet/Sheets 3/6 F MEMORY DEVICE LG issue Notice NO.10.S.

04.04.KIM Drawing Name Drawing No.11 Sign & Name D. Model Sheet/Sheets 4/6 9 VREF VDD VSS AUDIO LG issue Notice NO.11 02.m VR3 VR3 R419 7.3K C426 1n C424 100n C425 100n F Section Designer Checked Approved Date 02.JUNG N.7R HSP404 HSP405 HSP406 C415 47p V400 V401 2 J400 9001-8905-040 4 3 1 Headset jack HOOK_DETECT C427 47p R420 100R VBAT U401 VCC_EXT 8 7 6 5 D P0402FC05C P0402FC05C 1 2 3 4 SD_ CNIOSE DELAY ERROP_ GND SENSE_ADJ VIN VOUT D C416 220n SI9182 C417 2.92 - .7R 4.m R418 3. CIRCUIT DIAGRAM 1 2 3 VR3 4 5 6 7 8 R400 1K MICBIAS A C400 47p C401 10u (2012) JACK_DETECT 5 2 6 4 C402 47p D401 KDS160E R401 2. Data Name Electronics Inc 1 2 3 4 5 6 7 8 .2K B C406 47p C407 47p HSP400 HSP401 MIC400 OB-22S40-C33 Microphone C405 47p C403 n.S.10.2u (2012) VR3 ON_OFF D(0:7) 2 6 27 26 25 24 23 22 21 20 19 4 3 + 5 C418 22n R414 33K R415 39K R416 82K C419 10n D(0) D(1) D(2) D(3) D(4) D(5) D(6) D(7) R421 0R VIBRATOR 1 SPK_EN R417 10K U402 MAX4624 R450 150K C421 18p _WR MIDI_CS A(1) _RD C420 390p 12 EQ1 13 EQ2 14 EQ3 28 WR_ 29 _CS 30 A0 31 _RD 32 IOVDD D0 D1 D2 D3 D4 D5 D6 D7 MTR E EARP Speaker 18 SPOUT2 17 SPOUT1 E U403 YMU762 SPKP SPKN V402 C422 47p VR2B P0402FC05C P0402FC05C HSP4081 C423 47p V403 HSP407 1 16 SPVSS 15 SPVDD 11 HPOUT-R 10 HPOUT-L 2 2 CLK1 LED -IRQ -RST NC PLLC 1 2 3 4 5 6 7 8 F MCLK SUB_LED1 MELODY_INT MELODY_RESET R422 n.4K A 1 3 U404 MAX4599 MICIP C404 100n C408 100n MICIN B C409 47p R402 1.S.5K C410 33p VR3 R404 18K U400 MAX9075 R405 1M EARN EARN REC_P HSP402 HSP403 C411 47p C412 47p Receiver 5 + 3 JACK_DETECT C 1 2 4 C R407 1M AUXI AUX_IN AUXOP C413 100n R408 R409 R410 C414 47p 4.7R 4.

04.2K HSP511 VIBRATOR ON_OFF SUB_LED1 SUB_LED2 SUB_LED3 VR2B R512 R513 10K 10K R516 33R MOTOR U501 CIM-80S7B 1 2 LEDA 3 LEDK 4 TXD 5 RXD 6 SD 7 VCC GND L500 100N LOCKUP 2 1 SW526 END-ON/OFF PROTECTION 3 VBAT E C502 56p L502 100N D521 ISS302 E VR2B FOLDER SWITCH R518 0R TXIR_IRDA RXIR_IRDA SD_IRDA R517 4.11 02.m R520 1.S.KIM Drawing Name Drawing No.93 - .JUNG N.5K VIBRATOR 2 1 R521 100K Section Designer Checked Approved Date 02.S.5K Q500 2 1 6 R501 100K IMX9 R502 27R R503 27R HSP507 KBR(3) 4 3 5 HSP506 KBR(2) HSP516 HSP505 SW509 1 SW503 2 SW504 3 SW501 MAIL P0402FC12C V404 2 SIDE_KEY B 1 SW505 4 SW506 5 SW507 6 SW508 F1 P0402FC12C V407 P0402FC12C V406 HSP508 P0402FC12C V405 SW510 7 SW514 8 SW511 9 SW512 F2 C SUB LCD BACKLIGHT C R504 270R R505 100K HSP509 MAIN_BACKLIGHT KBR(4) SW515 KBR(0) * SW516 0 SW517 # SW518 SEND SW519 F3 VBAT C500 100n 2 6 4 HSP510 R530 U502 MAX4599 OUT 5 OUT IN GND IN GND OUT 180R 62R 27R I_LED2 I_LED1 I_LED3 D R531 R532 SW520 LEFT SW521 RIGHT SW522 UP SW523 DOWN SW524 CFM 1 D VCHG R508 10K R509 10K 3 1 IN Q504 RN1307 Q503 RN1307 GND Q502 RN1307 END_ON_OFF VBAT VBAT 1 2 R510 6.10. Data Name Electronics Inc 1 2 3 4 5 6 7 8 . Model Sheet/Sheets 5/6 FOLDER R519 47K 3 Q506 2SC5585TL F 3 C505 100n SW500 A3212 C504 100n C503 1u (1608) 2 1 F MMI LG issue Notice NO.7R PWT R533 n.04. CIRCUIT DIAGRAM 1 2 3 4 5 6 7 8 KEYPAD BACKLIGHT A VBAT HSMR-C197X21 D500 D501 D502 D503 D504 D505 D506 D507 D508 D509 D510 D511 D512 D513 D514 D515 D516 D517 D518 D519 D520 KBC(0:4) KBC(0) KBC(1) KBC(2) KBC(3) KBR(0:4) 1 KBC(4) A DOME SWITCH 2 1 2 1 2 1 2 1 2 HSP500 KBR(1) HSP501 HSP502 HSP503 HSP504 SW502 1 2 VM 3 VU 4 VD CO 2 HSP515 MAIN LCD BACKLIGHT B KEYLIGHT R500 1.11 Sign & Name D.

7N 3.04.11 Sign & Name Y.2K A2 A1 C681 4.3V A-CASE C C638 C692 1n C641 PA_LEVEL PA_ON CLK DATA EN VR2B VBAT D C663 C661 2.2K 27p 27p 27p C624 2.3N 2 1 R646 2.5p 6 2 DCS_TX GND1 EGSM_TX GND2 GND3 GND4 DCS_RX GND5 EGSM_RX GND6 VC1 VC2 1 7 C614 330p VBAT VBAT C619 1n R615 C620 C621 C622 R610 0R C615 12n (3216) B 2.m D R635 C670 1K 1.8N TXRXSW LBSW HBSW LB_LP 1 0 1 LB_HP 0 0 1 HB_LP 1 1 0 HB_HP 0 1 0 LBSW VREG3 C683 100n R673 270k F R677 R676 0R n.KIM Drawing Name Drawing No.2u (2012) R656 R657 R629 R630 R631 1K 1K 1K 1K 1K C647 C623 100n R678 0R R679 n.5p n. CIRCUIT DIAGRAM 10.2u (2012) B C626 4.2n C674 1n (2012) HBSW TXRXSW 1 2 U607 NC7WZ02 8 7 E 13MHZ R642 1K C679 12p R643 1M C675 1n C680 1n C678 n.2K 4.m 6 5 4 3 4 U603 SHS-M090B ANT 13 12 11 9 5 3 7 9 10 C608 47p U601 PF08122B 8 10 2 C611 C612 1.H.94 - .76K(1%) R638 2. Model Sheet/Sheets 6/6 F RADIO_TEMP Approved RF MAIN LG issue Notice NO.m R674 680R R675 4.8N R648 2.11 02.10.3N 1 3 5 U605 ADP3330_2V85 BPF601 SAFSD942MCL0T00R00 L633 3.m R617 51R D600 BAT15-099 4 2 C627 1n C628 1n C634 R620 R621 R619 C632 C633 100n 100n C635 4.2u (2012) 100n 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 C637 39p 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 R624 620K C643 7p BPF600 SAFSD1G84CB0T00R00 L632 2.9N C658 C660 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 2 5 1 IN NR GND 3 -ERR -SD OUT C666 C667 C668 1n XO_ENA VR3 AFC 1n R637 1K R640 n.2 RF Circuit 1 2 3 4 5 VBAT C603 R600 18R R602 300R U602 LDB32942M05D-429 8 2 4 DCS GSM NC1 GND1 1 OUTN NC2 OUTP GND2 3 7 6 5 6 7 ANT600 ANT_PAD_LGX L600 0R N600 4. Data Name Electronics Inc 1 2 3 4 5 6 7 8 .2u (2012) 100n R632 0R C664 2.7p L612 6.m C648 C657 100n 100n 3p L606 18N L609 3.CHO D.m 4 4 1 VCC CTL GND 2 OUT U606 VC-TCXO-208C 3 R636 2.3p 4 3.m R608 51R R609 0R C690 0.3N 2 3.7N 6 1 3 5 C R625 1K R626 1K 100n 100n RESETZ QN QP IN IP VCC7 AUXVCOP AUXVCON RXMIXQP RXMIXQN RXMIXIP RXMIXIN TESTVCO DECRXMIX BIASREF BANDGAP HB-SW TXRX-SW VCC10 MAINSPUP1 MAINCP VBAT2 VREG2 APC APCEN VR4IN CLK DATA EN AUXCP VCC9 CRF U604 TRF6150 VAPC FILT DETD DETR DCSLNAN DCSLNAP VCC3 PCSMIXN PCSMIXP GNDLNAN VCC2 GSMLNAN GSMLNAP MAINVCO VCC1 VCC8 C642 15p C645 7p L602 L603 C646 100n L605 18N C649 C662 3p 2 AN CAT 1 C639 n.m C687 2.6n (1608) 100n 100n RF_ENA R633 n.7N LDC15D190A0007A 47p 4 7 6 1 5 2 3 8 8 C600 C601 C602 SW600 MHC-173 2 1 R603 A TXRXSW HBSW LBSW VREG3 8 9 10 11 12 13 10p 1K R601 300R R605 68R R607 100R R606 100R C605 12p 8 1 470u 3 PIN_DCS PIN_GSM 6 VAPC VDD1 VCTL GND1 GND2 VDD2 POUT_DCS 5 POUT_GSM 4 47p 12p L635 C609 1n C604 27p A U600 ENFVZ4L07 PWR_SW DCS_SW GSM_SW VCC GND3 VT GND4 7 14 H_H_PWR GND2 H_L_PWR L_L_PWR GND1 L_H_PWR GND5 6 5 4 3 2 1 R604 L601 12n C606 n.7p n.m C613 C610 1.3N 4 2 2.m C685 100n CAT C686 12p TH601 22K_NTC R647 3.m 6 C665 10n C672 1.m LB-SW VCC5 VREG3 VBAT3 R3 TXRXCP R2 MAINSPUP2 GNDTXCP VCC6 RXLOP RXLON VCC4 OMIXRF VBAT1 VREG1 C636 33u/6.2p n.04.7u P-CASE C625 1n (1608) R616 n.7p C682 4.2K 3 D602 HVB387BWK C698 100n Section Designer Checked Date 02.m R622 120R 1 3 R623 n.m R641 390R(1%) 6 3 4 5 E 5 4 2 3 R644 1.5K RESET_RF QN QP IN IP R645 1K U629 SN74HC1GU04DCKR TP610 L611 6.7u P-CASE 33R 1.7K(1%) C673 5.M.7k C684 n.m R649 10R C629 27P C630 n.2n (1608) C669 D601 HVC369B C691 1.3p 6 C640 n.2n R634 9.2K(1%) C671 12n (3216) L608 3.

95 - .11.1 TOP . PCB LAYOUT 11. PCB LAYOUT 11.

96 - . PCB LAYOUT 11.2 BOTTOM .11.

97 - .12.1 Exploded View M28 M31 M32 M27 M30 M23 M22 M26 M20 M19 M29 M16 M12 M13 M11 M10 M4 M34 M18 M17 M21 M24 M25 M2 M15 M8 M1 M3 M5 M6 M33 M14 M9 M7 M35 . EXPLODED VIEW & REPLACEMENT PART LIST 12. EXPLODED VIEW & REPLACEMENT PART LIST 12.

LITHIUM PCB ASSY.5 dBd.N .FOLDER(UPPER) HINGE.12*15 .32.4(t).BATTERY WINDOW COVER ASSY.PRISMATIC .PRISMATIC .P426C .6*1.G7000 ANTENNA G7000 LG-510.FIXED ANTENNA.-2.FLEXIBLE PCB ASSY.512 LG-510.GSM.1 CELL.7 V.ANTENNA CAP.LI-POLYMER TAPE.5 dBd.5 mm.511.4 65K COLOR (LG Brand) G7000 Cobalt Blue Metal Silver Red G7000 G7000 Pearl White Color Cobalt Blue Metal Silver Red M18 M19 MDAC00 MCCC00 M20 M21 M22 M23 M24 M25 ABGA00 ADCA00 SAKY00 SAFY00 SUMY00 MLEA00 OK key + i (English version) G7000 G7000 65K color PCB ASSY MAIN FPCB.5*58.7 V.G7000 SPEAKER 3.FOLDER LCD MODULE SPEAKER RECEIVER VIBRATOR.2 mAh.G7000-BATTERY PACK (CB) 3.5 mm.METAL PCB ASSY.512 LG-510.1 CELL.7X3.G7000 ANTENNA 1.7+0.DIAL DOME ASSY.COIN .80 mA.-2. M1. 96*64 .P426C .3. diameter=2.SCREW BUMPER BUMPER WINDOW. M1.G7000-BATTERY PACK (SV) 3..5 DIA3.SIDEKEY PCB ASSY.EARPHONE JACK CAP.ASAHI BATTERY (ML414NB/F9D) G7000 Receiver G7000 LCD Cobalt Blue Metal Silver Red 3.REAR ANTENNA.5 mm. 65K COLOR LCD ASSY .5 DIA3.common use for METALIC SILVER.20 .7 V.FOLDER(UPPER) COVER ASSY.LI-POLYMER BATTERY PACK.BATTERY LOCKER. M1 M2 Location No. EXPLODED VIEW & REPLACEMENT PART LIST < Parts List Of Exploded View > No.N .G7000-BATTERY PACK (RD) G7020 G7028 Common use M35 ACGG00 .7*6.SIDE COVER ASSY.15 mm.G7000 ANTENNA (PANTONE 427C) 1.86 dB. MWAF00 MWAF0005701 ACGJ00 ACGJ0016302 ACGJ0016301 ACGJ0016303 MHFD00 MHFD0002101 SVLM00 SVLM0003701 SUSY00 SUSY0006001 SACY00 SURY0004501 SJMY00 SJMY0002801 SBCL00 SBCL0001001 SACY00 SACY0004601 SACY01 SACY0004501 ACGH00 ACGH0006702 ACGH0006703 ACGH0006704 GMZZ00 GMZZ0003201 MCCH00 MCCH0003902 MCCH0003903 MCCH0003904 MBHY00 MWAC00 ABGC00 ACGK00 MBHY0003503 MBHY0003505 MWAC0021401 ABGC0000701 ACGK0014702 ACGK0014703 ACGK0014704 MDAC0005001 MCCC0003502 MCCC0003501 MCCC0003503 ABGA0000901 ADCA0006001 SAKY0001101 SAFY0050102 SUMY0003503 MLEA0003802 MLEA0003803 MLEA0003804 MWAZ0001701 ACGM0011902 ACGM0011903 ACGM0011904 SNGF0000702 SNGF0000701 SNGF0000702 ACFY0000701 MCCF0002002 MCCF0002003 MCCF0002005 GMZZ0003201 SBPP0005103 SBPP0005102 SBPP0005104 MTAE0004901 MCCZ0002702 MCCZ0002703 MCCZ0002704 ACGG0021702 ACGG0021701 ACGG0021703 Description WINDOW.SCREW CAP.EARPHONE JACK CAP.512 3.FOLDER(UPPER) COVER ASSY.512.MOBILE SWITCH CAP.MOBILE SWITCH CAP.TOLERANCE +-2 Cobalt Blue Metal Silver Red G7000 IrDA Cobalt Blue MetalSilver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red M26 M27 MWAZ00 ACGM00 M28 SNGF00 M29 M30 ACFY00 MCCF00 M31 M32 GMZZ00 SBPP00 M33 M34 MTAE00 MCCZ00 1.FLEXIBLE COVER ASSY.511.511.98 - .FRONT COVER ASSY.SIDE CAP.5 3.LCD BUTTON ASSY.5 dBd.0 V.5 .FIXED ANTENNA.8 ohm.EARPHONE JACK BUTTON ASSY.BATTERY LOCKER.3.12.P427 .7X3.FIXED CONTACT ASSY.CELL.MAIN MICROPHONE LOCKER.LI-POLYMER BATTERY PACK.PRISMATIC .FRONT DECO.WINDOW(SUB) CAP CAP CAP COVER ASSY.FOLDER QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 Specification G7020 G7028 Common use (ALL BRAND) Color Cobalt Blue Metal Silver Red G7000 5 PHI 128*160.LCD(SUB) COVER ASSY.height 2.820 mAh.FOLDER(LOWER) SCREW MACHINE CAP.MSWR3(FN) ..MOBILE SWITCH SCREW MACHINE BATTERY PACK.39.GSM..511.FOLDER(LOWER) COVER ASSY.MOTOR BATTERY.1 CELL.SCREW CAP.1T 3 V.STR ..5 Cobal Blue Metal Silver Red Cobalt Blue Metal Silver Red Sevice Remark Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 M13 M14 M15 M16 M17 LG-510.FOLDER COVER ASSY.FOLDER COVER ASSY.820 mAh.1.FRONT COVER ASSY.8.STR .diameter=2.820 mAh.511.-2.REAR COVER ASSY.5 mm.5 .5 .512.REAR COVER ASSY.GSM.MSWR3(FN) .05*40.common use.FOLDER(LOWER) COVER ASSY.4 LG-510.-40 dB. Part No.

850 mA. G5200 3P EAR MIC (EM-412GS) 100-240V.2 Accessories Portable Handsfree Travel Adapter Cigar Lighter Adapter Data-cable < Accessories > No.850 mA. 50/60 Hz.AC-DC TRAVEL ADAPTOR.5.2 V. Part No. 2 2 2 2 Location No.CE (Europe: TA-20G) 100-240V.CE (Russian(CIS): TA-20GR) CLA (CLA-20G) (DK-20G) Color Service Remark Yes Yes Yes Yes Yes . EXPLODED VIEW & REPLACEMENT PART LIST 12.12.99 - . 50/60 Hz.AC-DC CIGARETTE LIGHT ADOPTER DATACABLE QTY 1 1 1 1 1 Specification EG890B.2 V.5. SGEY00 SGEY0002901 SSAD00 SSAD0007806 SSAD0007807 SGCC00 SGCC0001802 SGDY00 SGDY0004401 Description EAR PHONE/EAR MIKE SET TRAVEL ADAPTOR.

WINDOW(SUB) TAPE QTY 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1 1 1 1 1 1 Service Y Y Y Y Y Y Y Y Y Y Y N N N N G7000 N G7000 N G7000 N G7000 N G7000 RECEIVER N G7000 FOLDER(LOWER) N G7000 FRONT N G7000 FOLDER(LOWER) N G7000 RECEIVER N G7000 SIDE N NITTO No.SPEAKER TAPE.LED INSERT. G7020 INDICATOR PAD (Common use) N G7010 N G7020 folder uppper (Electro Forming) ) N G7020 FOLDER UPPER SUS (#615 OR#668) N Please refer to the 'Exploded View' Y G7000 MAGNET SWITCH N Specification Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Color Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Remark M20 M35 M11 M14 M13 Pearl White Metal Silver Red Pearl White Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red M2 Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red M34 M33 .RECEIVER PAD.DECO TAPE.G7020 COMMON USE N UPPER DECO(LEATHER ASSY) N Please refer to the 'Exploded View' Y Please refer to the 'Exploded View' Y Please refer to the 'Exploded View' Y N G7028 (EASTCOM BRAND) N N W7020 LG-COLOR DISPLAY (RUSSIA) N G7020 G7028 Common use (SUS) N G7020 G7028 COMMON USE N LG-G510.DECO TAPE.FOLDER(UPPER) DECO.FOLDER(UPPER) COVER ASSY. — — — — — — — — — — — MCJH0004203 MDAF0000702 MDAF0000703 MDAF0000704 MDAH0000201 MFBB0001901 MPBG0004801 MPBJ0003201 MTAA0006801 MTAA0006501 MTAA0006401 MTAA0006501 MTAA0006801 MTAA0006701 MTAD0010301 — — — ADBY0001202 ADBY0001201 ADBY0001203 MDAE0009802 MDAE0009801 MDAE0009803 MFBC0001901 MTAA0016601 — — — MCJJ0010202 MCJJ0010201 MCJJ0010203 MDAE0008403 MDAY0004201 MIAA0006701 MICA0001201 MMAA0000901 MPBQ0005501 MPBZ0017401 MPFD0001001 MTAA0015501 MTAA0015601 — MTAZ0005401 Description BUTTON ASSY.3REPLACEMENT PARTS <Mechanic components> Level Location No.FOLDER(LOWER) DECO.FOLDER(LOWER) BUMPER CAP.FOLDER(LOWER) COVER ASSY.RECEIVER FILTER.FOLDER(UPPER) COVER.DECO TAPE.511.DIAL COVER ASSY.FOLDER(UPPER) FILTER.DECO TAPE.LCD PAD.5000NS (t=0.16) N Please refer to the 'Exploded View' Y Please refer to the 'Exploded View' Y Please refer to the 'Exploded View' Y Y PROJECTION ASSY (RUSSIA) Y Y N PROJECTION N N G7010.FOLDER(UPPER) DECO.LCD(SUB) PAD PLATE.3t N G7000 12x2x0. DIA = 1.FOLDER COVER ASSY.SWITCH PAD.GROUND TAPE.FOLDER(UPPER) COVER ASSY.MOTOR TAPE.FOLDER(UPPER) COVER.512 common use. 3 ABGA00 3 ACGG00 3 ACGG00 3 ACGG00 4 ACGH00 4 ACGH00 4 ACGH00 5 MBHY00 4 MCCH00 4 MCCH01 4 MCCH02 5 MCJH00 5 MDAF00 5 MDAF00 5 MDAF00 5 MDAH01 5 MFBB00 5 MPBG00 5 MPBJ00 5 MTAA00 5 MTAA00 5 MTAA00 5 MTAA01 5 MTAA01 5 MTAA01 5 MTAD00 4 ACGJ00 4 ACGJ00 4 ACGJ00 5 ADBY00 5 ADBY00 5 ADBY00 6 MDAE00 6 MDAE00 6 MDAE00 6 MFBC00 6 MTAA00 5 MCCZ00 5 MCCZ00 5 MCCZ00 5 MCJJ00 5 MCJJ00 5 MCJJ00 5 MDAE00 5 MDAY00 5 MIAA00 5 MICA00 5 MMAA00 5 MPBQ00 5 MPBZ00 5 MPFD00 5 MTAA00 5 MTAA01 5 MTAE00 5 MTAZ00 Part No.FOLDER COVER ASSY.DECO TAPE.FOLDER COVER ASSY.SCREW COVER.7t N G7010 & G7020 SUB LCD PAD N G7010.DECO TAPE.FOLDER(UPPER) DECO.FOLDER(LOWER) DECO.SCREW CAP.100 - .7mm+2.FRONT MAGNET.FOLDER(UPPER) DECO ASSY DECO ASSY DECO ASSY DECO.FOLDER(LOWER) DECO.FOLDER(UPPER) DECO INDICATOR.SCREW CAP.FOLDER(LOWER) COVER ASSY.12.DECO TAPE.WINDOW COVER ASSY. EXPLODED VIEW & REPLACEMENT PART LIST 12.DECO CAP CAP CAP COVER.FOLDER(LOWER) DECO.DECO TAPE.

SIDE DECO.B to B CNT (SOCKET) 30 PIN.0X6. .REAR CONTACT ASSY.EARPHONE JACK CAP.3t) (6.FRONT DECO.0. .MOTOR PCB.FLEXIBLE RECEIVER BATTERY.FRONT COVER.FRONT DECO.MOBILE SWITCH CAP.7mm+2.FLEXIBLE PCB. — — — — — — — MCJK0006602 MCJK0006603 MCJK0006604 — MDAG0000902 MDAG0000903 MDAG0000904 MICA0001201 MPBH0001101 MTAA0006401 MTAA0006701 — MGAD0006001 — MTAB0005101 MTAB0005001 MTAB0005201 — — — — — — SPCY0007304 — — ENBY0011001 ENBY0010901 SPCY0007202 SPCY0013401 — — — — — MBIA0000301 MCCF0002002 MCCF0002003 MCCF0002005 MCIA0003701 MCJN0005402 MCJN0005403 MCJN0005404 MGAD0011901 MGAD0012001 MIDZ0008001 MIDZ0008101 — Description COVER ASSY.G7000 Receiver Please refer to the 'Exploded View' Please refer to the 'Exploded View' 30 PIN.DECO SCREW MACHINE GASKET.0.0X3.SHIELD FORM GASKET.B to B CNT (HEAER) POLYI .MOBILE SWITCH CONTACT.GND FPCB Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' G7000 (KS-D-5101 C3603B ).3 mm.512 common use.07 mm.DOUBLE .LITHIUM VIBRATOR.ANTENNA COVER.FRONT BUTTON ASSY.PROTECTION TAPE.8X7.PROTECTION TAPE.FLEXIBLE CONNECTOR.ANTENNA BUSHING.BOARD TO BOARD CONNECTOR.0.3t G7000 FRONT G7000 FRONT G7000 SIDE Please refer to the 'Exploded View' G7000 10x5x1.5X0.DECO TAPE.511.EARPHONE JACK CAP.FOLDER TAPE.DOUBLE .BOARD TO BOARD PCB. DIA = 1. 4 ACGK00 4 ACGK00 4 ACGK00 5 ABGC00 5 MCCC00 5 MCCC00 5 MCCC00 5 MCJK00 5 MCJK00 5 MCJK00 5 MDAC00 5 MDAG00 5 MDAG00 5 MDAG00 5 MICA00 5 MPBH00 5 MTAA00 5 MTAA01 4 GMZZ00 4 MGAD00 4 MHFD00 4 MTAB00 4 MTAB01 4 MTAB02 4 MWAC00 4 MWAF00 4 SACY00 5 SACY00 5 SBCL00 5 SJMY00 5 SPCY00 5 SUSY00 4 SACY01 5 ENBY00 5 ENBY01 5 SPCY00 4 SPCY00 4 SVLM00 3 ACGM00 3 ACGM00 3 ACGM00 4 ACFY00 5 MBIA00 3 MCCF00 3 MCCF01 3 MCCF02 5 MCIA00 4 MCJN00 4 MCJN00 4 MCJN00 4 MGAD00 4 MGAD01 4 MIDZ00 4 MIDZ01 4 MLEA00 Part No.MOBILE SWITCH CAP.DOUBLE .FRONT PAD.FLEXIBLE LCD MODULE COVER ASSY.SHIELD FORM HINGE.FRONT DECO.REAR COVER ASSY.0.STRAIGHT .LCD WINDOW.12.STRAIGHT .5t Please refer to the 'Exploded View' G7000 FOLDER UPPER PROTECTION TAPE G7000 MAIN LCD WINDOW PROTECTION TAPE G7000 sublcd window tape Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' POLYI .REAR GASKET. Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' G7000 Service Y Y Y Y Y Y Y N N N Y N N N N N N N Y N Y Y N N Y Y Y Y Y Y N Y Y N N N N Y Y Y Y Y N Y Color Cobalt Blue Metal Silver Red Cobalt Blue Pearl White Red Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red Remark M17 M16 M19 M18 M12 M3 M15 M1 M9 M6 M8 M7 M5 M10 Cobalt Blue Metal Silver Red M4 M27 M29 Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red M30 (2.FRONT COVER ASSY.CELL.G7000 LCD FR-1 .FLEXIBLE SPEAKER PCB ASSY.BATTERY QTY 1 1 1 1 1 1 1 1 1 1 2 1 1 1 4 1 1 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' 1 1 1 1 1 1 1 1 1 LG-G510.PROTECTION WINDOW.FRONT COVER.SIDE CAP.REAR COVER ASSY.0t) G7000 BB INSULATOR G7000 RF INSULATOR Please refer to the 'Exploded View' N N N N N N N N Y Cobalt Blue M25 .5 mm.REAR COVER.ANTENNA CAP.0. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No.SHIELD FORM INSULATOR INSULATOR LOCKER.101 - .REAR COVER.LCD(SUB) PCB ASSY.FRONT INSERT.FRONT COVER ASSY.5 mm.3 mm.MIKE TAPE.EARPHONE JACK COVER.

4 MLEA00 4 MLEA00 4 MPBH00 4 MSAZ00 4 MSAZ01 4 MSDB00 4 MWAZ00 3 ADCA00 3 GMZZ00 3 MLAK00 3 SAKY00 3 SUMY00 2 SBPP00 2 SBPP00 2 SBPP00 2 SNGF00 2 SNGF00 2 SNGF00 Part No.8 0.0*0.GSM.MIKE SHEET SHEET SPRING.COIL WINDOW DOME ASSY.GSM.54-1R) Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' Service Y Y N N N N Y Y Y Y Y Y Y Y Y Y Y Y Color Metal Silver Red Remark M26 M21 M31 M22 M24 M32 Cobalt Blue Metal Silver Red Cobalt Blue Metal Silver Red M28 .25t) G7000 Please refer to the 'Exploded View' Please refer to the 'Exploded View' Please refer to the 'Exploded View' LG (30.LI-POLYMER BATTERY PACK.GSM.25t) FDK Company (PE72 4.0*11.BATTERY LOCKER.FIXED QTY 1 1 1 1 1 1 1 1 4 1 1 1 1 1 1 1 1 1 Specification Please refer to the 'Exploded View' Please refer to the 'Exploded View' G7000 BACK FDK Company(PE72 11.2*11.BATTERY PAD.FIXED ANTENNA.SIDEKEY MICROPHONE BATTERY PACK. — — MPBH0001201 MSAZ0007603 MSAZ0007602 MSDB0001701 — — — MLAK0006301 — — — — — — — — Description LOCKER.METAL SCREW MACHINE LABEL.MODEL PCB ASSY.102 - .LI-POLYMER ANTENNA.Level Location No.LI-POLYMER BATTERY PACK.FIXED ANTENNA.5x21.

10V .CHIP CAP.CERAMIC.CHIP VARISTOR CAP.K .HD .NP0.R/TP 2.HD.R/TP 1 nF.3V .R/TP 2.TC.STD .R/TP 0.K .R/TP 2.CHIP.CERAMIC.R/TP 47 pF. 10 uF.K .CHIP CAP.Y5V.CHIP CAP.X7R .CHIP.2 uF.103 - .CERAMIC.CERAMIC.J .50V.R/TP 47 pF.K .R/TP 150 pF.TC.10V .5 MHz.NP0.R/TP 0.HD .CHIP CAP.HD .CERAMIC.J .J .X5R .6.1005 .K .CERAMIC.CERAMIC.J .1005.50V .CERAMIC.1005 .1 uF.CHIP CAP.TC.M .X5R .HD .SMD .K.CERAMIC.CHIP CAP.X5R .50V.NP0.R/TP 47 pF.X5R .2012 .J.X5R .X7R.3V .CHIP CAP.TC.2012 . — SAFA0015702 SFSY0012301 SFSY0012201 SFSY0014101 ECTZ0003901 ECCH0000179 ECCH0000130 ECCH0000379 ECCH0000122 ECCH0000122 ECCH0000122 ECCH0000143 ECZH0003902 ECCH0000276 ECCH0000186 ECCH0000186 ECCH0000186 SEVY0004901 ECCH0000114 ECCH0000114 ECCH0000113 ECCH0000143 ECCH0000161 ECCH0000135 ECCH0000135 ECCH0001811 ECCH0000276 ECCH0000182 ECCH0000182 ECCH0000379 ECCH0000379 ECCH0000379 ECCH0000379 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECTZ0003101 ECCH0000128 ECCH0000379 ECCH0000182 ECCH0000182 ECCH0000161 ECCH0000122 ECCH0000379 ECCH0000122 ECCH0000182 ECCH0000122 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000122 ECCH0000189 ECCH0000189 ECCH0000189 Description PCB ASSY.CERAMIC.0 .TC.X5R .HD .X5R .R/TP 0.1005.X5R . .50V.R/TP 47 pF.2.50V .CERAMIC.2012 .1005 .CERAMIC.1005 .HD .16V .CERAMIC.CHIP CAP.HD .CHIP CAP.1 uF.K .2012 .50V.HD .K .K .50V .CHIP CAP.CHIP CAP.CERAMIC.CHIP CAP.K .16V.TC .CERAMIC.X7R .CERAMIC.J .K .CHIP CAP.1 uF.MAIN PCB ASSY.CHIP CAP.1 uF.HD .CERAMIC.X5R .NP0 .R/TP 2.HD.DCS BAND 942.STD .2 uF.K .CHIP CAP.K .50V .J .1 uF.8 .5 MHz.2.CERAMIC.CHIP CAP.1005 .R/TP 1 uF.CHIP CAP.50V.CERAMIC.CERAMIC.X5R .1005 .CHIP CAP.CERAMIC.50V.10V .TC.CHIP CAP.X5R .CERAMIC.CERAMIC.CERAMIC.R/TP 0.22 uF.1005 .CHIP CAP.X7R .TC.CERAMIC.1005 .R/TP 680 pF.R/TP 1 nF.6.CHIP QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification Please refer to 'Exploded View' 65K color PCB ASSY MAIN AUTO 1842.J.16V.HD .1005 .1005.CHIP CAP.CERAMIC.R/TP 2.K .1 uF.TANTAL.1005.HD .1005 .K .CERAMIC.HD .ETC .1 uF.NP0.ETC .R/TP 5.X7R.1005.J.CHIP CAP.10V .X7R .50V.SAW CAP.K .K .1005.NP0.X5R .CERAMIC.CHIP CAP.1005 .TC.10V .1005 .1005.6 V.R/TP 0.10V .CERAMIC.1 uF.1005.10V .3V .R/TP 18 pF.CHIP CAP.CHIP CAP.CHIP CAP.TC.R/TP 0.6.Z. 3 SAFY00 4 SAFA00 5 BPF600 5 BPF601 5 BPF602 5 C100 5 C101 5 C103 5 C104 5 C105 5 C106 5 C107 5 C108 5 C109 5 C110 5 C118 5 C119 5 C120 5 C124 5 C202 5 C203 5 C204 5 C205 5 C206 5 C211 5 C213 5 C215 5 C216 5 C217 5 C218 5 C219 5 C220 5 C221 5 C222 5 C223 5 C224 5 C225 5 C226 5 C227 5 C228 5 C229 5 C230 5 C231 5 C232 5 C233 5 C234 5 C300 5 C301 5 C304 5 C400 5 C401 5 C402 5 C404 5 C405 5 C406 5 C407 5 C408 5 C409 5 C410 5 C411 5 C412 Part No.1005.5*1.CERAMIC.CAP=370pF+-30% 20 pF.1005 .HD .CHIP CAP.J.R/TP 1 uF.HD .K.2 uF.10V .K .Z.1 uF.K .50V.CERAMIC.K .CERAMIC.R/TP 33 uF.HD .50V .HD .0*1.3V .HD.J.16V .NP0.1005 .K .R/TP 33 nF.1 uF.50V .K .CHIP CAP.NP0.1005 .CHIP CAP.R/TP 33 pF.CERAMIC.J.10V .10V .R/TP 0.X5R .6.3V .10V .CHIP CAP.1608.1 uF.CHIP CAP.CERAMIC.HD .1005 .R/TP 0.5*1.TANTAL.1005 .2 uF.CHIP CAP.R/TP 33 nF.1005.10V .NP0 .50V.CERAMIC.0*2.X7R .K .HD .1 uF.MAKER CAP.HD .R/TP 100 pF.50V .CERAMIC.1005.K .CERAMIC.NP0.TC.CHIP CAP.CHIP CAP.NP0.K.50V.R/TP 47 pF.R/TP 33 pF.CERAMIC.R/TP 47 pF.HD .CERAMIC.R/TP 2.TC.2 uF.CHIP CAP.Z .GSM BAND 897 MHz.2012 .NP0.R/TP 0.CERAMIC.R/TP 0.CERAMIC.R/TP 0.R/TP 33 pF.SMD .MAKER CAP.< Main PCB > Leve Location No.R/TP 270 pF.2.1005 .10V .R/TP 0.CHIP CAP.SL.R/TP 0.HD .CERAMIC.CHIP CAP.0 .3V .CHIP CAP.HD .CHIP.R/TP Service Remark Y M23 N Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y .CERAMIC.1005.K .HD .1005.R/TP 22 nF.6.X5R .CERAMIC.M .1005 .J.AUTO FILTER.6.CHIP CAP.1005 .2 uF.HD .CERAMIC.1005.TC.1 uF.HD .NP0.R/TP 270 pF.X5R .HD .CHIP CAP.J.CERAMIC.0*2.10V .HD .CHIP CAP.6.NP0.R/TP 47 pF.SMD .R/TP 2.50V.HD.CHIP CAP.CHIP CAP.X7R.X5R .HD.CERAMIC.K .CHIP CAP.HD .1 uF.TC .TC.50V .2 uF.SMD .1005 .10V .1005.J.CERAMIC.50V.X5R .50V .X5R .CERAMIC.SAW FILTER.K.TC .NP0 .X7R .J.1005.K .X7R.3V .X5R .CERAMIC.J.MAKER CAP.R/TP 47 pF.CHIP CAP.0*2.NP0.CHIP CAP.CHIP CAP.CERAMIC.2012 .Y5V.Y5V .1005 .CHIP CAP.J.1 uF.R/TP 680 pF.X5R .1608.1005 .50V.10V .2012 .TC.HD .X5R .50V.J.1005 .1 uF.R/TP 680 pF.CHIP CAP.J.50V.10V.X5R .2012 .R/TP 20 pF.50V.10V.CERAMIC.50V .1005.X5R .HD .R/TP 0.R/TP 0.MAIN.CHIP CAP.SAW FILTER.R/TP 0.1005 .R/TP 0.1005.R/TP 47 pF.HD.

6.R/TP 22 nF.K.D.TC.R/TP 470 uF.50V.NI .K.50V.10V .R/TP 7 pF.X7R.J.50V.HD .CERAMIC.7 uF.K .50V.M .TC .R/TP 1 nF.1005 .50V .R/TP 12 pF.1005.1005 .HD.50V.1005.HD.CHIP CAP.SMD .2012 .C .1005 .TC.50V.R/TP 47 pF.R/TP 47 pF. ECCH0000182 ECCH0000122 ECCH0000122 ECCH0001811 ECCH0000379 ECCH0000179 ECCH0000155 ECCH0000113 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000182 ECCH0000143 ECCH0000122 ECCH0000143 ECCH0003401 ECCH0000182 ECCH0000143 ECCH0000124 ECCH0000276 ECCH0000182 ECCH0000182 ECCH0000122 ECCH0000111 ECCH0000143 ECTZ0003801 ECCH0000117 ECCH0000111 ECCH0000117 ECCH0000117 ECCH0000103 ECCH0000701 ECCH0000137 ECFD0000101 ECCH0000143 ECCH0000117 ECCH0000117 ECCH0000117 ECCH0000182 ECCH0000379 ECFD0000601 ECTZ0003401 ECCH0000143 ECCH0000143 ECCH0000117 ECCH0000181 ECCH0000182 ECCH0000182 ECTZ0003401 ECTZ0003101 ECCH0000120 ECCH0000182 ECCH0000182 ECCH0000112 ECCH0000108 ECCH0000108 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000104 ECCH0000182 ECCH0000180 ECCH0000180 ECCH0000379 Description CAP.K.CHIP CAP.HD .10V .CERAMIC.1005.HD .50V.R/TP 56 pF.NP0.R/TP 0.1005.1005 .1005.CHIP CAP.J.R/TP 0.16V.J .CERAMIC.R/TP 1.R/TP 0.2012 .CERAMIC.HD .TC.J.CHIP CAP.50V.K .10V.CHIP CAP.10V .2012 .CHIP CAP.50V.Z .6.CERAMIC.CHIP CAP.C .M .NP0.10V .50V.K .X5R .CERAMIC.10V .R/TP 0.1 uF.CHIP CAP.CERAMIC.CHIP CAP.CERAMIC.CERAMIC.HD .CHIP CAP.R/TP 1 nF.CHIP CAP.3V .CHIP CAP.NP0. EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.1 uF.CHIP CAP.CHIP CAP.CERAMIC.J.1005.R/TP 27 pF.M .NP0.1 uF.1005 .X7R.TC.1005.R/TP 4.HD .1005.K .STD .16V .CERAMIC.CHIP CAP.CERAMIC.CHIP CAP.CERAMIC.CHIP CAP.1005 .50V.K .R/TP 1 uF.HD.TC.1005 .CERAMIC.X5R .CHIP CAP.NP0 .R/TP 27 pF.CHIP CAP.CERAMIC.X5R .R/TP 47 pF.NP0.Y5V .R/TP 2.M .R/TP 1 nF.50V.J.1 uF.K .CHIP CAP.CHIP CAP.CERAMIC.10V .1005.CERAMIC.R/TP 1 nF.12.10V .HD.CERAMIC.R/TP 4.CHIP CAP.1005.CERAMIC.CERAMIC.50V.50V.50V.1 uF.6.X5R .R/TP 0.CHIP CAP.HD .1005.NP0.X5R .HD.J.CHIP CAP.50V.K .R/TP 0.STD .1 uF.7 uF.CHIP CAP.50V.J.50V.HD.K .HD .CERAMIC.J.CERAMIC.CERAMIC.Z.CERAMIC.CHIP CAP.50V.TC.CERAMIC.TC.C .Y5V .J.X5R .CHIP.1005 .HD .X7R.1005.CERAMIC.1005.C.CHIP CAP.CHIP CAP.1 uF.50V .CHIP CAP.50V .2 uF.HD .CERAMIC.R/TP 1 nF.1005.50V.1005.CERAMIC.CHIP CAP.CERAMIC.R/TP 27 pF.TC .1608.1005.104 - .X7R.TC.TC.C.NP0.R/TP 3 pF.R/TP 33 uF.1 uF.1005 .CERAMIC.R/TP 0.CHIP CAP.1005.K .HD .1 uF.HD .X5R .NP0.CERAMIC.TC .50V.HD.CERAMIC.MAKER CAP.CHIP QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification 0.NP0 .TC.3V .X5R .J.NP0.2012 mm.HD .1005.NP0.3V .1005.R/TP 2.J.CERAMIC.6.NP0.J.K .R/TP 4.R/TP 1 nF.K.TANTAL.NP0.R/TP 27 pF.R/TP 15 pF.CHIP CAP.Z .HD .10V .J.7 pF.R/TP 1.1005 .CERAMIC.Y5V.TC.NP0.50V.CERAMIC.CERAMIC.HD.3 pF.CHIP CAP.CHIP CAP.CERAMIC.R/TP 0.CHIP CAP.CHIP CAP.CHIP.TC.TC.NI .CERAMIC.K .CHIP CAP.CERAMIC.R/TP 1 nF.CHIP.1 uF.TC.R/TP 27 pF.J.1005.TANTAL.10V .NP0.HD .HD .NP0.1005.SMD .R/TP Service Remark Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y .R/TP 47 pF.1 uF.NP0.CERAMIC.CHIP CAP.CERAMIC.1005 .K .50V .X5R .NP0.TANTAL.R/TP 0.CERAMIC.J.MPP CAP.5 pF.3V .X7R .J.STD .50V.2012 .FILM.CHIP CAP.NP0 .X5R .10V .10V .1005.TC.MAKER CAP.1005 .K.CHIP CAP.TC.3 pF.TC.CHIP CAP.NP0.K .CHIP CAP.1608 mm.CERAMIC.MAKER CAP.X7R.1005.K .CERAMIC.1 uF.10V .ETC .TC.2 uF.CHIP CAP.CHIP CAP.R/TP 27 pF.1005.X5R .K .R/TP 0.1005.X5R .NP0 .1 uF.HD .X7R.K .CERAMIC.K.R/TP 27 pF.ETC .50V.NP0.50V.CHIP CAP.50V.CHIP CAP.2 uF.16V .C .2012 .1005.NP0.K .CHIP.X5R .CERAMIC.TC.6.R/TP 2.3V .10V .CERAMIC.CHIP CAP.HD .HD .3V .X5R .22 uF.K.1005.R/TP 39 pF.R/TP 47 pF.50V .R/TP 1 nF.CHIP CAP.J.1005 .CERAMIC.R/TP 7 pF.CHIP CAP.6.1005.X5R .1005 .CERAMIC.TC.TC .X5R .R/TP 18 pF.1005 .2012 .1 uF.CERAMIC.TC.K .CHIP CAP.J .CERAMIC.NP0.CHIP CAP.TANTAL.K.1005 .CERAMIC.R/TP 10 uF.1 uF.R/TP 0.2 pF.1005.X5R .R/TP 3.R/TP 0.CERAMIC.J.NP0.HD .6.1005 .MPP CAP.50V.R/TP 0.50V.3V .X5R .D.R/TP 330 pF.CHIP CAP.R/TP 0.1005.1005 .R/TP 8200 pF.CHIP CAP. 5 C413 5 C414 5 C415 5 C416 5 C417 5 C418 5 C419 5 C421 5 C422 5 C423 5 C424 5 C425 5 C426 5 C427 5 C428 5 C450 5 C500 5 C501 5 C502 5 C503 5 C504 5 C505 5 C600 5 C601 5 C602 5 C603 5 C604 5 C605 5 C608 5 C609 5 C611 5 C613 5 C614 5 C615 5 C619 5 C620 5 C621 5 C622 5 C623 5 C624 5 C625 5 C626 5 C627 5 C628 5 C629 5 C632 5 C633 5 C634 5 C635 5 C636 5 C637 5 C638 5 C641 5 C642 5 C643 5 C645 5 C646 5 C647 5 C648 5 C649 5 C657 5 C658 5 C660 5 C661 Part No.L_ESR .HD.1005.10V .50V.K .10V .CHIP CAP.FILM.CERAMIC.R/TP 3.CHIP CAP.50V .16V .X7R.R/TP 10 nF.MAKER CAP.R/TP 0.1005 .CHIP CAP.NP0.HD .K .CERAMIC.CERAMIC.R/TP 47 pF.CERAMIC.10V .R/TP 12 pF.50V.1005 .1005 .HD .1005 .X7R.TC.X5R .TC.CERAMIC.CHIP CAP.J.

65 pF.BEAD.TC.BEAD.105 - .diode capacitance:C1:4.R/TP .HD.J .7 pF.1/16W.LED.NP0.Ferrite Bead Y 120 ohm.1608 .X7R.1 uF.K .K.85~2.SWITCHING DIODE.3V .LED.SWITCHING DIODE.BEAD.40 V.1608 .0.LED.2 nF.R/TP Y 1 nF.SMD .1005.SWITCHING DIODE.HD .X7R.LED.R/TP Y 6 PIN.X5R .JACK/PLUG.R/TP .1608 .0.HD .R/TP .R/TP .R/TP Y 1 nF.0.CHIP FILTER.CHIP CAP.CHIP CAP.Ferrite Bead Y 120 ohm.1005 .LED.35T Y BLUE .R/TP Y 1.35T Y BLUE .R/TP .CHIP DIODE.Ferrite Bead Y 10 ohm.35T Y BLUE .50 pF.CERAMIC.50V.SWITCHING DIODE. .CERAMIC.Silicon Epitaxial Schottky Barrier Type Diode Y 1-1G1A .3216 mm.X7R.K.1 uF. 5 C662 5 C663 5 C664 5 C665 5 C666 5 C667 5 C669 5 C670 5 C671 5 C672 5 C673 5 C674 5 C675 5 C679 5 C680 5 C681 5 C682 5 C683 5 C685 5 C686 5 C687 5 C690 5 C691 5 C692 5 C698 5 D100 5 D200 5 D201 5 D202 5 D401 5 D501 5 D502 5 D503 5 D505 5 D506 5 D507 5 D508 5 D511 5 D512 5 D513 5 D514 5 D517 5 D518 5 D519 5 D520 5 D521 5 D600 5 D601 5 D602 5 HSP402 5 J100 5 J101 5 J102 5 J400 5 L100 5 L102 5 L103 5 L104 5 L105 5 L106 5 L107 5 L108 5 L109 5 L110 Part No.HD .X5R .35T Y BLUE .CHIP CAP.R/TP .1608.CHIP DIODE.300 A.1608 .K.30 V.54 mm.R/TP .1 A.BEAD.1.35T Y BLUE .CERAMIC.Ferrite Bead Y 120 ohm.SWITCHING DIODE.50V.EARPHONE FILTER.3V .R/TP Y 12 pF.CHIP DIODE.50V.CHIP FILTER.R/TP .15pF/C4:1.NP0 .R/TP Y 2.1005.1005 .CHIP DIODE.ETC .CERAMIC.R/TP .TC.K .X7R.5 pF. Y SOT-143 .50V.CERAMIC.X5R .CHIP CAP.CERAMIC.CHIP FILTER.CHIP DIODE.35T Y BLUE ..CERAMIC.K .CERAMIC.1608 .0.6.1005.CHIP CAP.10V .1005 .R/TP Y 12 pF.50V.0.C .Ferrite Bead Y 120 ohm.LED.R/TP .35T Y BLUE .K.HD .HD .0.CERAMIC.1005 .K .R/TP Y 0.4t) Y 24 PIN.6 nF.R/TP .K .C.R/TP .NP0.1608 .TC .BEAD.G7000 SIM CNT (2.R/TP .Silicon Dual Schottky Diode Y UFP . Y 30 PIN.G7000 EAR JACK 3 pole.1005 .CHIP CAP.1005.BOARD TO BOARD CONN.B to B CNT (HEAER) Y 3.1608 .50V.CHIP CAP.1005 .CHIP CAP.CHIP DIODE.0.HD.35T Y BLUE .CHIP CAP.I/O CONNECTOR.R/TP Y 10 nF.R/TP .1005.6*0.5 mm.CERAMIC.HD.K.50V.1005 .1005 .CHIP CAP.R/TP .VARIABLE CAP RES.CHIP FILTER.BEAD.50V .50V .2 uF.35T Y BLUE .1 uF.R/TP Y 12 nF.300 A.16V .1.0.R/TP Y 5.CHIP CAP.LED.1608 .CERAMIC.85~2.HD.4 V.R/TP Y 1 nF.R/TP Y 0.50V.LED.2.CHIP CAP.50V.50V.X7R.TC.0.50V.SOCKET .CHIP DIODE.CHIP CONN.35T Y BLUE .CHIP CAP.1005.1005.R/TP .K .10V .5 mm.0.1005 .CHIP DIODE.Ferrite Bead Y 120 ohm.X5R .X7R.10V .CERAMIC.5 A.R/TP .LED.CERAMIC.J.NI .1005.HD.R/TP .Ferrite Bead Y .0.8*0.CHIP FILTER.CHIP CAP.HD.CERAMIC.X7R.FILM.1608 .R/TP Y 4.CERAMIC.6.K.R/TP Y 2.1005 .C .CERAMIC.LED.TC.SWITCHING DIODE.Ferrite Bead Y 120 ohm.HD .LED.Ferrite Bead Y 120 ohm.X5R .R/TP Y 0.CHIP CAP.0.R/TP .Ferrite Bead Y 120 ohm.R/TP Y 0.1608 .HD.R/TP .Silicon Epitaxial Schottky Barrier Type Diode Y 1-1G1A .0.CHIP CAP.80pF Y 0 ohm.HD.Silicon Epitaxial Schottky Barrier Type Diode Y ESC .2012 .HD.STRAIGHT .BEAD.CERAMIC.R/TP .SWITCHING DIODE.16V.15pF Y CMPAK .12.LED.R/TP Y 1 nF.K . 5 pin KSD Y 10 ohm.R/TP .LED.CERAMIC.diode capacitance:C1:4.X5R .1608 .R/TP Y 4.1 uF.CHIP CAP.R/TP Y 0.50V.CHIP CAP.CHIP FILTER.MPP CAP.R/TP Y 1 nF.7 pF.CHIP DIODE.X5R .1005 .35T Y SC-70 .1 uF.CERAMIC.BEAD.BEAD.CHIP CAP.2 nF.SMD .1005 .0.1608.1005.1608 .16V .1005.R/TP Y 0.35T Y BLUE .CHIP FILTER.NP0 .1005 .50V.TC .35T Y BLUE .X7R. ECCH0000104 ECCH0000182 ECCH0000379 ECCH0000155 ECCH0000143 ECCH0000143 ECCH0000182 ECCH0000144 ECFD0000701 ECCH0000248 ECCH0000256 ECFD0000601 ECCH0000143 ECCH0000111 ECCH0000143 ECCH0000181 ECCH0000181 ECCH0000182 ECCH0000182 ECCH0000111 ECCH0000379 ECCH0000101 ECCH0000144 ECCH0000143 ECCH0000182 EDSY0005201 EDSY0010401 EDSY0010401 EDSY0010401 EDSY0009901 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDSY0005301 EDSY0010301 EDVY0001201 EDVY0001401 ERHY0000201 ENSY0007601 ENRY0000901 ENBY0010901 ENJE0002301 SFBH0007102 SFBH0007102 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 Description CAP.CHIP CAP.2012 .1005. Y 1-1G1A .CERAMIC.LED.00pF/C3:1.HD.SOCKET CONNECTOR.X7R.ETC .6(t) Y BLUE .5 PIN.40 V.CHIP DIODE.80 V.4.J.NP0.CHIP QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification Service Remark 3 pF.R/TP Y 1 nF.1005 .FILM.R/TP Y SMD .35T Y BLUE .MPP CAP.1608 mm.CHIP DIODE.CHIP DIODE.CHIP DIODE.C.0.1005.CERAMIC.BEAD.300 A.1005 . .0.K.2 nF.CHIP DIODE.0.0.4.HD .CHIP CAP.CERAMIC. EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.80 V.40 V.R/TP .CHIP CAP.65~5.10V .CHIP FILTER.VARIABLE CAP DIODE.35T Y BLUE .K.K.CHIP DIODE.NP0.2 uF.X7R.1005 .LED.1608 .CERAMIC.K.1608 .10V .1005.11 A.1608 .300 A.NI .J .R/TP .J.1005 .50~5.R/TP Y 1.CHIP FILTER.R/TP Y 1.CHIP DIODE.

CHIP RES.J.BJT.1005 . SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 SFBH0007101 ELCH0005009 ELCH0005009 ECCH0000112 ELCH0005003 ELCH0005002 ELCH0005002 ELCH0001402 ELCH0001402 ELCH0001405 ELCH0005012 SFBH0007101 ELCH0001003 ELCH0001003 ELCH0001405 ELCH0001405 ELCH0005013 SCHY0000101 EQFP0003301 EQBN0007001 EQBN0004801 EQBN0007001 EQBN0007001 EQBN0007001 EQBN0007101 ERHY0000265 ERHY0000265 ERHY0000299 ERNR0000403 ERHY0000261 ERHY0000220 ERNR0000401 ERHY0000202 ERHY0000202 ERHY0000226 ERNR0000401 ERHY0000241 ERNR0000401 ERHY0000296 ERHY0000201 ERHY0001102 ERHY0000201 ERHY0000250 ERHY0000201 ERHY0000250 ERHY0000261 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000287 ERHY0000299 Description FILTER.1005.BEAD.1005.J.CHIP FILTER.1005 .CHIP RES.J .4 A. Y 2.1005.R/TP Y 33000 ohm.CHIP RES.1005.CHIP INDUCTOR.R/TP .J. Y 2.CHIP RES.R/TP Y 1M ohm.BJT.CHIP INDUCTOR.R/TP Y 100 ohm. 5 L111 5 L112 5 L113 5 L114 5 L115 5 L116 5 L117 5 L118 5 L119 5 L120 5 L124 5 L190 5 L500 5 L502 5 L600 5 L601 5 L602 5 L603 5 L605 5 L606 5 L608 5 L609 5 L610 5 L611 5 L612 5 L632 5 L633 5 L635 5 N600 5 Q100 5 Q101 5 Q500 5 Q502 5 Q503 5 Q504 5 Q506 5 R100 5 R101 5 R102 5 R103 5 R104 5 R105 5 R106 5 R107 5 R108 5 R109 5 R110 5 R111 5 R112 5 R114 5 R115 5 R116 5 R117 5 R118 5 R120 5 R121 5 R122 5 R123 5 R124 5 R150 5 R151 5 R152 5 R201 5 R202 Part No.S.1/32 W .J.R/TP Y 3.CHIP INDUCTOR.BEAD.J.50V.Ferrite Bead Y 120 ohm.FET.1005.1005.R/TP Y 0 ohm.J.CHIP FILTER.BJT.ARRAY.J.R/TP .1005 . Y 19.1005 .1/16W.1005.1005 .R RES.1005.1005.Ferrite Bead Y 120 ohm.CHIP RES.R/TP Y 3.1/16W.CHIP INDUCTOR.1005 .1/16W .1005 .CHIP FILTER.CHIP RES.S.J .1/16W.1/16W.1005.1005 .CHIP INDUCTOR.1005.R/TP Y 4.0 dB.Ferrite Bead Y 6.CHIP INDUCTOR.CHIP INDUCTOR.SMD .106 - .95 .NPN RES.0*1.1/4W .CHIP INDUCTOR. Y 18 nH.1/16W.0 dB.R/TP Y 20K ohm.BJT.R/TP Y 3.LOW FREQUENCY Y 20K ohm.1/16W.R/TP Y 4.CHIP FILTER.R/TP .1005 .1/16W.R/TP Y 0 ohm.R/TP Y 0 ohm.R/TP .J.3 nH.R/TP Y 1K ohm.1005.NPN TR.3 nH.1 W.8 nH.CHIP COUPLER.ARRAY.SMD .J.BEAD. Y 120 ohm.S .R RES.S.CHIP RES.1/32 W .1005.SMD .CHIP CAP. ohm. Y SMT6 .BEAD.1005 .1005.1005.Ferrite Bead Y 120 ohm.1005 .J.CHIP INDUCTOR.BEAD.1005. Y 15 pF.R/TP Y 47 ohm.1005.1/16W.6 W.BEAD.CHIP RES.R/TP Y 3.CHIP RES.2 W.1 W.7 nH.BEAD.NPN TR.R/TP Y .J.9 nH.BEAD.S .25*0.8 PIN.CHIP RES.8 PIN.R/TP Y 3.1/16W.8 nH.CHIP RES.0.R/TP Y 220 ohm.7 ohm.R/TP Y 10K ohm.CHIP INDUCTOR.1005 .NP0.R/TP .R/TP Y 12 nH.R/TP Y 33000 ohm.15 W.J. ohm.1.1/16W.R/TP .R/TP Y 6.R/TP .1/32 W .S .CHIP RES.7 ohm.12.0.J.1/16W.0.J .BEAD.1005.BEAD.35 dB.R/TP Y 47 ohm.CHIP QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification Service Remark 120 ohm.R/TP Y 18 nH.Ferrite Bead Y 120 ohm.J.J.Ferrite Bead Y 120 ohm.CHIP RES.CHIP RES.R/TP Y 0 ohm.R/TP .0.2.1/16W.1/32 W .1/16W.CHIP FILTER.R/TP .1005.7 nH.CHIP INDUCTOR.CHIP RES.1005 .1005 .1 W.R/TP Y 4.1/16W.J .Ferrite Bead Y 120 ohm.CHIP INDUCTOR.1005.CHIP FILTER.Ferrite Bead Y 120 ohm.ARRAY.CHANNEL FET Y SC-70 .CHIP FILTER.P-CHANNEL TR.J .CHIP INDUCTOR.R/TP Y 220K ohm.J.1005 .R/TP Y 3.R RES.Ferrite Bead Y 120 ohm.J.1/16W.CHIP FILTER.use for charge P.BJT. ohm.1/16W.3K ohm.1005 .DUAL COUPLER Y SOT-6 .24.J.1005 .ARRAY.R/TP Y 0. EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.F .0.1005 .J.3K ohm.0.R/TP .R/TP Y 0 ohm.1005.CHIP RES.J.NPN TR.7 nH.BEAD.1/16W.1005.RF HYBRID TR.J .1005.BEAD.R/TP Y 47 ohm. Y SC-70 .R/TP .R RES.Ferrite Bead Y 120 ohm.CHIP FILTER.J. ohm.CHIP FILTER.R/TP Y 0 ohm.R/TP Y 10K ohm.1 W.NPN TR.1/16W .8 PIN.R/TP Y 0 ohm.1005.1/16W.0.Ferrite Bead Y 120 ohm.BJT.BEAD. Y SC-70 .1005.CHIP RES.CHIP RES. Y 100 nH.J .CHIP FILTER.J.R/TP .1005.CHIP RES.1005.1005.CERAMIC.TC.1005 .CHIP RES.SMD .1005 .CHIP INDUCTOR.8 PIN.R/TP Y 0 ohm.J.J.2 ohm.2.1/16W.1005 .NPN TR. Y SC-70 .J.CHIP FILTER.J .1005. Y EMT3 .1005 .1/16W.R/TP .2012 .R/TP .30 V.S .Ferrite Bead Y 120 ohm.SMD .Ferrite Bead Y 100 nH.CHIP RES.J .R/TP Y 10000 ohm.CHIP RES.3 nH.CHIP RES.J.1/16W.

R/TP 0 ohm.CHIP RES.R/TP 0 ohm.CHIP RES.J.1005.R/TP 1M ohm.1005.J.R/TP 39K ohm.1005 .1005.R/TP 120K ohm.CHIP RES.1/16W. 5 R203 5 R204 5 R205 5 R206 5 R207 5 R208 5 R209 5 R211 5 R219 5 R220 5 R222 5 R225 5 R227 5 R228 5 R229 5 R231 5 R250 5 R280 5 R281 5 R282 5 R283 5 R300 5 R302 5 R303 5 R305 5 R400 5 R401 5 R402 5 R404 5 R405 5 R407 5 R408 5 R409 5 R410 5 R414 5 R415 5 R417 5 R418 5 R419 5 R420 5 R421 5 R450 5 R500 5 R501 5 R502 5 R503 5 R504 5 R505 5 R508 5 R509 5 R510 5 R512 5 R513 5 R516 5 R517 5 R518 5 R519 5 R520 5 R521 5 R530 5 R531 5 R532 5 R535 5 R600 Part No.1005.R/TP 10K ohm.R/TP 10K ohm.J.5K ohm.J.CHIP RES.CHIP RES.J.1/16W .J.1005.CHIP RES.1005.J.1/16W .3K ohm.1/16W.R/TP 0 ohm.1/16W.1/16W.1005.CHIP RES.1/16W.1005.1005.CHIP RES.CHIP RES.1/16W.CHIP RES.CHIP RES.J.J.1005.R/TP 7.J.J.1/16W.CHIP RES.1/16W.R/TP 100 ohm.J.R/TP 10K ohm.J.R/TP 0 ohm.1/16W.J.J.R/TP 6200 ohm.1/16W.R/TP 270 ohm.1/16W.CHIP RES.1005.1005.1005.1/16W.1005.1/16W .J.CHIP RES.R/TP 390 ohm.CHIP RES.1/16W.1005.1005.J.J.1005.1/16W.1005.CHIP RES.1/16W.R/TP 100K ohm.R/TP 2400 ohm.J.1/16W.J.R/TP 10K ohm.CHIP RES.CHIP RES.R/TP 4.J.1/16W .J.1/16W.J.1/16W.CHIP RES.1005 .1005.R/TP 0 ohm.J.1005.CHIP RES.CHIP RES.R/TP 47K ohm.1005.5K ohm.1/16W.1/16W.1005.1/16W.J.1005.1/16W.1/16W.1005.J.1005.J .CHIP RES.CHIP RES.1/16W.CHIP RES.CHIP RES.R/TP 33000 ohm.R/TP 18 ohm.J .R/TP 1M ohm.1/16W.R/TP 220K ohm.CHIP RES.CHIP RES.R/TP 10K ohm.1/16W.R/TP 1.R/TP 4.J.CHIP RES.J.CHIP RES.1005.R/TP 0 ohm.R/TP 390 ohm.1/16W.1005.R/TP 3.R/TP Service Remark Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y .CHIP RES.1/16W.1005.J.CHIP RES.R/TP 180 ohm.CHIP RES.J.1/16W.1005.R/TP 33 ohm.1/16W.1005.J.J .1005.1/16W.CHIP RES.R/TP 27 ohm.1/16W.CHIP RES.J .1005.CHIP RES.R/TP 0 ohm.1005.1/16W.1005.1005 .1/16W.J.7 ohm.J.R/TP 0 ohm.1005.1005.R/TP 0 ohm.R/TP 100K ohm.J.J.1005.J.1/16W.CHIP RES.J.R/TP 10K ohm.CHIP RES.1005.R/TP 0 ohm.1005.1/16W.1005.CHIP RES.2K ohm.7 ohm.R/TP 1.J.1/16W.CHIP RES.R/TP 18 ohm.R/TP 1.1005.J.1/16W.CHIP RES.1/16W.1005.CHIP RES.1005.J.CHIP RES.J.1/16W. ERHY0000261 ERHY0000231 ERHY0000231 ERHY0000231 ERHY0000231 ERHY0000265 ERHY0000296 ERHY0000265 ERHY0000282 ERHY0000261 ERHY0000261 ERHY0000296 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000261 ERHY0000241 ERHY0006701 ERHY0000243 ERHY0000264 ERHY0000280 ERHY0000286 ERHY0000202 ERHY0000202 ERHY0000202 ERHY0000299 ERHY0000271 ERHY0000261 ERHY0000250 ERHY0000258 ERHY0000220 ERHY0000201 ERHY0000287 ERHY0000244 ERHY0000280 ERHY0000206 ERHY0000206 ERHY0000228 ERHY0000280 ERHY0000261 ERHY0000261 ERHY0006601 ERHY0000261 ERHY0000261 ERHY0000211 ERHY0000202 ERHY0000201 ERHY0000273 ERHY0000244 ERHY0000280 ERHY0000224 ERHY0008202 ERHY0000209 ERHY0000201 ERHY0000206 Description RES.CHIP RES.1005.1005.J.1/16W.1/16W.CHIP RES.R/TP 18 ohm.J.12.1/16W.1005 .J.1005.R/TP 0 ohm.1/16W.1/16W.1/16W.J.J.1005.CHIP RES.CHIP RES.J.CHIP RES.1005.1005.R/TP 390 ohm.J.1005.CHIP RES.R/TP 0 ohm.5K ohm.J.1005.CHIP RES.1/16W.7 ohm.1005.1/16W.1/16W.CHIP RES.1/16W.1/16W.1005.1005.CHIP RES.R/TP 0 ohm.J.J.R/TP 200K ohm.R/TP 62 ohm.107 - .CHIP RES.R/TP 1K ohm.J.1/16W.7 ohm.1/16W.CHIP RES.CHIP RES.R/TP 0 ohm.R/TP 4.J.CHIP RES.CHIP RES.R/TP 18K ohm.J. EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.R/TP 390 ohm.CHIP QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification 10K ohm.CHIP RES.R/TP 100K ohm.CHIP RES.R/TP 10K ohm.R/TP 0 ohm.1/16W.CHIP RES.J.1/16W.J.1005.J.1/16W.J.1005.1005.CHIP RES.1005.CHIP RES.J.R/TP 100K ohm.CHIP RES.1/16W.1/16W.1005.R/TP 20K ohm.R/TP 4.R/TP 20K ohm.1/16W.1/16W.CHIP RES.1005.R/TP 10K ohm.J.

7 Kohm.R/TP 1K ohm.CHIP RES.2K ohm.6 PIN.J.R/TP 1K ohm.CHIP RES.1/16W.R/TP 51 ohm.1005.J.6 PIN. NTC .108 - .1005.SMD .R/TP 390 ohm.J.1/16W.1/16W.CHIP RES.1005.CHIP RES.CHIP RES.1005.CHIP RES.12.R/TP .CHIP RES.CHIP RES.1/16W.R/TP 4.J.J.1/16W .CHIP RES.J.2K ohm.2K ohm.1005.1005.J.1/16W.R/TP 270K ohm.SPDT ANALOG SWITCH 32-PIN QFN .76 Kohm.R/TP 10 ohm.R/TP 51 ohm.1/16W .R/TP .4 PIN.CHIP RES.J.BK . QUAD BUS BUFFER WITH 3_STATE CONTROL INPUTS SC70 .CMOS LDO 1.1/16W.R/TP .CHIP RES.69 PIN.R/TP 680 ohm.CHIP RES.J.8 mm.R/TP 1K ohm.1005.R/TP 33 ohm.1/16W.R/TP 1K ohm.J.1005.1/16W.R/TP .MULTI-8 .1/16W.5 PIN.J.R/TP 1K ohm.R/TP 9.J.CHIP PCB.1/16W.R/TP 120 ohm.J.R/TP 10K ohm.1/16W.CHIP CAP.3 PIN.R/TP 51 ohm.J.1005 .J.5 / NSM4 SERIES SOT(DCK) .1005.1005.R/TP 1.CERAMIC.14 PIN.1/16W.J.1005.8V OUTPUT/ 2.DIGITAL BB CHIP 100GGM PBGA .1005.R/TP 10 pF.R/TP 2.J.1/16W.50V.F .R/TP 1K ohm.R/TP .R/TP .1005.D.CHIP RES.1/16W.CHIP RES.CHIP RES.1005. 5 R601 5 R602 5 R603 5 R604 5 R606 5 R607 5 R608 5 R609 5 R610 5 R615 5 R617 5 R620 5 R621 5 R622 5 R624 5 R625 5 R626 5 R629 5 R630 5 R631 5 R632 5 R634 5 R635 5 R636 5 R637 5 R638 5 R641 5 R642 5 R643 5 R644 5 R645 5 R646 5 R647 5 R648 5 R649 5 R656 5 R657 5 R672 5 R673 5 R674 5 R675 5 R677 5 R678 5 SPFY00 5 SW500 5 SW600 5 TH601 5 U101 5 5 5 5 5 5 5 5 5 5 5 5 U102 U103 U200 U201 U202 U301 U302 U400 U401 U402 U403 U404 Part No.1/16W.1005.8 PIN.CHIP RES.MAIN IC CONN.J . MA-3 / 40 TONES / FM + WAVEFORM TABLE SC70-6/SOT23-6 .63 PIN.R/TP 1K ohm.1/16W.Ver1.1005.1005.CHIP RES.J.R/TP 1.R/TP 51 ohm. 250mA CMOS LDO WIHT ERROR FLAG / 3.J.R/TP 0 ohm.R/TP 0 ohm.S.R/TP . EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.J.J.CHIP RES.1/16W.1/16W.3 SC-74A FIT .R/TP 2.CHIP RES.F .1005.R/TP .1/16W. 64M FLASH 32M PSRAM / BOTTOM BOOT P-TFBGA63 .R/TP 51 ohm.J.1/16W.R/TP 1M ohm.CHIP RES.1/16W.CHIP RES.CHIP RES.1/16W.1/16W.J. Service Remark Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y Y N N Y N N Y Y Y Y Y .1005.0.2 Kohm.CHIP RES.R/TP .CHIP RES.J.179 PIN.64 M-bit CMOS FLASH / 70 ns SC70-5 . MSOP-8 .J.3 nH.32 PIN.CHIP RES.1005.1005 .1005.R/TP 2.1005.R/TP 2.1005.CHIP RES.R/TP 2.UHS 2-INPUT OR GATE 179GHH PBGA .CHIP RES.1005.NP0.1005.R/TP 0 ohm.1/16W.1005.R/TP 300 ohm.J.1005.1005.CHIP RES.1/16W.R/TP 1K ohm.1/16W.R/TP FR-4 .1/16W.3V SOT23-6 .J.2K ohm.J.1005.1/16W.7K ohm.J.1005.100 PIN.J.BK .1/16W.1/16W.J.5K ohm.CHIP RES.CHIP RES.CHIP RES.CHIP RES.R/TP 3.R/TP .1.1/16W.1/16W .22 Kohm.0*0.R/TP 1K ohm.1005.1 P-FBGA69 .J.1005.1005.F .R/TP .5 PIN.R/TP 0 ohm.5 PIN.R/TP .CHIP INDUCTOR.1005.CHIP RES.CHIP RES.1005.J.1/16W .1005 .J.R/TP 0 ohm.1005 .0.1/16W.1005.0 X 2.J.1/16W. ERHY0000229 ERHY0000229 ECCH0000110 ERHY0000214 ERHY0000214 ERHY0000214 ERHY0000214 ERHY0000201 ERHY0000201 ERHY0000247 ERHY0000214 ERHY0000211 ERHY0000243 ERHY0000222 ERHY0006602 ERHY0000241 ERHY0000241 ERHY0000241 ERHY0000241 ERHY0000241 ERHY0000201 ERHY0008503 ERHY0000241 ERHY0008502 ERHY0000241 ERHY0008501 ERHY0000231 ERHY0000241 ERHY0000296 ERHY0000244 ERHY0000241 ERHY0000247 ELCH0001405 ERHY0000247 ERHY0000203 ERHY0000241 ERHY0000241 ERHY0000261 ERHY0000289 ERHY0000237 ERHY0000254 ERHY0000201 ERHY0000201 SPFY0031306 EUSY0129501 ENWY0000101 SETY0001201 EUSY0077201 EUSY0111901 EUSY0100504 EUSY0116401 EUSY0116501 EUSY0122401 EUSY0134901 EUSY0105201 EUSY0077701 EUSY0077602 EUSY0077401 EUSY0111601 EUSY0077301 Description RES.1/16W.CHIP RES.CHIP RES.CHIP RES. TSSOP .R/TP 1K ohm.1/16W.CHIP RES.TC.CHIP RES.5 dB.1/16W.HALL EFFECT SWITCH ANGLE .1005.R/TP 620 Kohm.1005.J.CHIP RES.1005.ANALOG BB CHIP SC-82AB .1/16W.SMD .RF SWITCH THERMISTOR IC IC IC IC IC IC IC IC IC IC IC IC IC QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification 300 ohm.R/TP 1K ohm.J.

7 PIN.6 V.10 pF. .8*8.6 PIN.4*4.CAP=370pF+-30% 0.3 LOW POWER TRANSCEIVER / 115.SMD . .R/TP .0 MHz.R/TP .20 PPM. 1887 MHz.12 PIN. 5.CAP=370pF+-30% 5.0*3. . Service Remark Y Y VCO Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y .5mm DUAL 880/960 .6 V. RF POWER AMPLIFIER / E-GSM:55%.6 PIN.SMD .5.CAP=370pF+-30% 5.32768 MHz.2*1.6 V.6 V. .0*1.2*2.6.12.9. pF.5 . 8-LEAD US8 . . PPM.5 PIN.SMD .R/TP . EUSY0122301 EUSY0077301 EXSC0005101 EUSY0100102 STMY0018201 SFAY0001201 EUSY0116701 EUSY0076701 EXSK0000801 EUSY0100503 EUSY0077201 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 SEVY0004901 EXXY0004601 Description IC IC VCO IC TRANSFORMER.25 dB. .ETC .1.CAP=370pF+-30% 5.3 dB. DCS1800:50% 8 PIN.2kb/s SC70-6/SOT23-6 .5 pF.5.SMD .R/TP .6 V.1710/1880 .SMD .SMD .6 V. .SMD .5 dB.3 .CAP=370pF+-30% 5. IRDA DATA 1.6 V.R/TP .5*1.12. 13.CAP=370pF+-30% 5.SMD .R/TP .0*1.SMD .MATCHING FILTER.RF TRANSCEIVER SOT-23-6 .SMD .3. EXPLODED VIEW & REPLACEMENT PART LIST Leve Location No.65000 ohm. 30 dB.CAP=370pF+-30% 5.109 - .CAP=370pF+-30% 5.UHS DUAL 2-INPUT NOR GATE SOT(DCK) . QUAD VCO( TX/RX )897/921/1747/1885 QUAD RF-K .6 V.8 .64 PIN.1.SEPERATOR IC IC VCTCXO IC IC VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR X-TAL QTY 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Specification SURFACE MOUNT .SMD . PPM.9*1. .CAP=370pF+-30% 5.SMD . .6 V. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 U501 U502 U600 U601 U602 U603 U604 U605 U606 U607 U629 V102 V400 V401 V402 V403 V404 V405 V406 V407 X200 Part No.R/TP .8 Antenna switch S-PQFP .SMD .8 PIN.4*1.

EXPLODED VIEW & REPLACEMENT PART LIST    .12.110 - .

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