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Specification

MXM Graphics Module Mobile PCI Express Module Electromechanical Specification

SP-01106-001_v1.0 May 2004

Document Change History

Version
1.0

Date
05/14/04

Reason for Change


Initial Release

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Table of Contents
Document Change History.............................................................................................. i Overview .......................................................................................................................1 Key Features ..................................................................................................................... 1 Configurations ................................................................................................................... 2 Display Options ................................................................................................................. 2 MXM Display options...................................................................................................... 3 IGP and MXM .................................................................................................................... 3 Mechanical Specifications .............................................................................................4 Mechanical Description....................................................................................................... 4 Mounting and Retention ....................................................................................................12 MXM Compatibility ............................................................................................................12 Mechanical .......................................................................................................................12 Keep Out Definitions .........................................................................................................12 Z-Height Restrictions ....................................................................................................13 Surface Keep Outs........................................................................................................15 Mechanical Keep Out Drawings..........................................................................................16 MXM Module Keep Outs ................................................................................................17 Mechanical Requirements..................................................................................................30 Backing Plate ...............................................................................................................30 Thermal Solution Mounting ...........................................................................................30 Electrical Specifications...............................................................................................31 PCI Express Support .........................................................................................................31 Electrical Connector ..........................................................................................................31 Connector Pin Descriptions................................................................................................37 Power Requirements.........................................................................................................39 Power Throttling...............................................................................................................40 System Requirements .......................................................................................................40 Display Requirements ...................................................................................................40 Other Requirements .....................................................................................................41 Additional Function Support...............................................................................................42

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Appendix: Support Information ..................................................................................43 Configuring Notebook for MXM with IGP ............................................................................43 Configurable Option......................................................................................................43 Upgradeable Option......................................................................................................44

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List of Figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Display Options ................................................................................................. 3 MXM Form Factor .............................................................................................. 5 MXM-I Topside.................................................................................................. 6 MXM-II Topside................................................................................................. 7 MXM-II Backside ............................................................................................... 8 MXM-III Topside ..............................................................................................10 MXM-III Backside .............................................................................................11 MXM Side View, Top and Backside Height Restrictions for MXM Modules..............16 MXM-I Top Surface Keep Outs ..........................................................................17 MXM-I Bottom Surface Keep Outs .....................................................................18 MXM-II Top Surface Keep Outs .........................................................................19 MXM-II Bottom Surface Keep Outs ....................................................................20 MXM-III Top Surface Keep Outs ........................................................................21 MXM-III Bottom Surface Keep Outs ...................................................................22 MXM-I Z-Height Restriction Zones .....................................................................23 MXM-II Topside Z-Height Restriction Zones........................................................24 MXM-II Bottomside Z-Height Restriction Zones...................................................25 MXM-III Topside Z-Height Restriction Zones ......................................................26 MXM-III Topside Z-Height Restriction Zones (Continued)....................................27 MXM-III Topside Z-Height Restriction Zones (Continued)....................................28 MXM-III Bottomside Z-Height Restriction Zones .................................................29 MXM Connector Motherboard Footprint..............................................................32 MXM Connector Top Down and Side View ..........................................................33 MXM Card Edge Finger Pattern..........................................................................34 Notebook Output Topology with IGP .................................................................44 Notebook Output Topology with IGP .................................................................44

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List of Tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Board Configurations ......................................................................................... 2 MXM Display Options ......................................................................................... 2 Height Restrictions ...........................................................................................15 Connector Pinout..............................................................................................35 Connector Pin Descriptions ...............................................................................37 Power Requirements ........................................................................................39

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Overview

The Mobile PCI Express Module (MXM) is a consistent graphics interface for PCI Express notebooks. The specification describes the electromechanical interfaces including feature set, dimensions, connector pinouts and electrical interfaces for each MXM Graphics Module. The MXM graphics modules consist of a standard single 230-pin edge connector in which all Input/Outputs are routed through.

Key Features

Low cost Small size Scalable performance 16 lane PCI Express support LVDS panel support Dual DVI support VGA support Video out support Upgradeable graphics

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MXM Electromechanical Specification

Configurations
Table 1 lists the dimensions and maximum power for the three MXM graphics module types.

Table 1.
MXM Type
MXM-I MXM-II MXM-III

Board Configurations
Width
70 mm 73 mm 82 mm

Length
68 mm 78 mm 100 mm

Power
Up to 18 W Up to 25 W Up to 35 W

Display Options
Table 2 lists the MXM graphics boards display options.

Table 2.
VGA

MXM Display Options


MXM Display Solutions
Routed to either VGA or DVI-I connectors on motherboard DVI routed to connector on motherboard and/or through docking station Video out routed to connector on motherboard, Supports Composite, S-Video and HDTV LVDS routed to connector on the motherboard.

Display Options

Two single-link DVI or one dual-link DVI Video out Single dual-link LVDS

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MXM Display options


MXM is capable of supporting the following interfaces: One dual-link LVDS panel display One TV output One VGA output One dual-link TMDS or two single-link TMDS outputs to DVI

All interfaces are routed through the MXMs connector to the motherboard (Figure 1).
TVOut VGA DVI (2 Single or 1 dual Link)

MXM
L V D S

Figure 1.

Display Options

IGP and MXM


The MXM platform has been designed to co-exist with Integrated Graphics Processors (IGP). An IGP notebook designed to support MXM graphics modules can be populated with or without a MXM graphics card. If no MXM graphics module is present, installation of a loop through card is required to complete circuit paths for LVDS signals and enable panel operation.

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Mechanical Specifications

Mechanical Description
The MXM-I and MXM-II form factors (Figure 2 through Figure 5) accommodate GPUs up to 35 mm 35 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.

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Figure 2.

MXM Form Factor

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Figure 3.

MXM-I Topside

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MXM Electromechanical Specification

Figure 4.

MXM-II Topside

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MXM Electromechanical Specification

Figure 5.

MXM-II Backside

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MXM Electromechanical Specification

The MXM-III form factor (Figure 6 and Figure 7) will accommodate GPUs up to 40 mm 40 mm in size. The four holes surrounding the GPU are used to mount the thermal solution. The two holes on the far end of the board are for stand-offs to mount to the notebook.

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Figure 6.
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MXM-III Topside
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Figure 7.

MXM-III Backside

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Mounting and Retention


The MXM mounts to the notebooks motherboard through a 230-pin right angle edge connector. The connector on the MXM is a card-edge connector consisting of only the PCB with plated contacts. The MXM graphics module is inserted at a 20 to 30 degree angle and then rotated towards the motherboard and then screwed into mechanical mounting stand-offs. The stand-offs will maintain separation from the motherboard and also assist in the retention of the MXM. The stand-off locations will be the same for all MXM graphics modules to allow one motherboard to support the three MXM graphics module types.

MXM Compatibility
The MXM has been designed to allow for compatibility between the three MXM graphics module types. The notebooks mounting holes for the MXM are in the same location for all MXM graphics modules. MXM-I can insert into all notebooks that support MXM graphics modules. MXMII can insert into notebooks that support MXM-II and MXM-III modules. MXMIII modules only insert into notebooks that support a MXM-III module volumetric keep outs. MXM-III thermal solutions are incompatible with MXM-I and MXM-II. MXM-III accommodates a maximum of a 40 mm 40 mm GPU package where as MXM-I and MXM-II support a maximum of a 35 mm 35 mm GPU package.

Mechanical Keep Out Definitions


Each of the three Mobile PCI Express modules (MXM) has distinct mechanical keep out zones. These keep out zones are a combination of z-height restrictions and surface keep outs on the MXM PCB. The keep outs are necessary for system and thermal solution integration compatibility. These surface keep out volumes are designed to accommodate thermal solutions that dissipate the maximum power a particular MXM graphics module is designed for and to allow mechanical compatibility between modules with an integrated thermal solution. The rest of this section is devoted to defining the MXM-I, II, and III mechanical restrictions in greater detail. The definitions provided are divided up into zones on the MXM that define z-height restrictions, and surface keep outs. Written definitions are followed by detailed mechanical drawings of each MXM with its associated restricted areas.

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Z-Height Restrictions
Topside

Zone A: Maximum Z Height on Topside of PCB. The maximum height from the surface of the MXM PCB that any surface mounted component, or other attribute of the MXM may extend above the PCB surface. The thermal solution is not restricted by this blanket height restriction. Zone C: GPU Spreader Plate. A thermal spreader plate is required to assist in cooling the GPU. This restriction defines the maximum topside component height under this spreader plate. Zone D: Memory Area Opposite the Edge Connector. A restriction is defined on all three MXM graphics modules under memory spreader plates. The memory spreader plates are broken into two separate keep out regions because of unique geometric requirements for each. The D zone is associated with the memory located directly opposite the PCBs edge connector. On the highest power consuming modules, the zone D memory spreader plate will be an integral part of the GPU spreader. On the lowest power MXM-I and II modules, the memory spreaders could be made design options or removable. Zone D-I Defines the z-height restriction in the D-zone for MXM-I. This zone is designed to accommodate power supply components for configurations with two memories on the MXM PCB. Zone D-II Defines the z-height restriction in the D-zone for MXM-II and is equivalent to Zone D-I in order to maintain thermal solution compatibility between MXM-I and MXM-II. Zone D-III Defines the z-height restriction in the D-zone for MXM-III and is not required to be compatible with the thermal solution for MXM-I or MXM-II, and has unique requirements. Zone E: Memory Area on Topside to Right of the Edge Connector Defines the z-height restriction for all components except for memories. This area is along the right-hand edge of the MCM PCB as viewed from the topside of the MXM with the connector edge at the bottom position. Zone F: Topside System Integration. There are two holes in each MXM graphics module set aside for mechanically attaching the MXM to a notebook computer system. A cylindrically shaped zero height keep out region has been defined on the topside of the MXM in order to allow for an attachment feature from the notebook system to extend onto the MXM and in combination with a fastener to hold the MXM securely in place.

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Zone G: Topside Heat Pipe Exit Routing If a heat pipe(s) is (are) used as a portion of the cooling solution or some other similar means is used to transfer heat from the GPU spreader plate to a remote heat exchanger, this height restriction defines the maximum component height restriction in the three locations where the heat pipe may transition off of the PCB. The zones are oriented with the edge connector down in the 6 o-clock position. Zone G1 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the left/9-oclock of the GPU beyond the GPU spreader plate. Zone G2 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the top/12 o-clock of the GPU beyond the memory or GPU spreader plate. Zone G3 Defines the maximum height of any board component in the area of the MXM and the restriction extends to the right/3 o-clock of the GPU beyond the memory or GPU spreader plate.

Backside
Zone B: Maximum Z-Height on Backside of the MXM PCB The maximum height from the surface of the MXM PCB that any surface mounted component and/or other attribute of the MXM may extend below the MXM surface with the exception of back side memory and that memory's associated thermal solution. Zone B defines the general z-height restriction. For the MXM-III only, the backing plate may exceed the 1.2 mm height restriction. Zone H: Backside Memory Near the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB opposite the edge connector. Zone J: Backside Memory Opposite the Edge Connector Z-height restriction under the thermal spreader centered on the memory on the backside of the PCB not opposite of the edge connector.

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Surface Keep Outs


Topside
Surface Keep Out 1: Thermal Solution Attach. Surface keep outs are defined surrounding the thermal integration through holes in the PCB in order to accommodate varied thermal solution designs and grounding of the thermal solutions to reduce EMI. Surface Keep Out 2: System Integration - Top. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are topside surface keep outs defined surrounding these system integration through holes. Surface Keep Out 3: Edge Connector. This is space reserved on the topside of the MXM for appropriate edge connector design and integration.

Backside
Surface Keep Out 4: System Integration - Bottom. Holes in the MXM PCB have been defined for mechanical integration of the MXM into a notebook system. There are bottomside surface keep outs defined surrounding these system integration through holes Surface Keep Out 5: Edge Connector. This is space reserved on the bottomside of the MXM for appropriate edge connector design and integration.

Table 3 defines the height restrictions and surface keep outs on the top and back of MXM-I, MXM-II and MXM-III.

Table 3.

Height Restrictions

MXM Z-Height Restriction Keep Out Zones Topside (mm)


A,F C D-I, D-II D-III, E G 3.5 1.84 2.00 0.66 2.64

Bottomside (mm)
B H J 1.2 0.66 0.66

Note:

There is a 0.25 mm air gap maintained between the maximum allowed zheight from the backside of the MXM and the maximum z-height allowed on the topside of the motherboard directly under the MXM.

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Mechanical Keep Out Drawings


The mechanical drawings shown in this section explicitly define the z-height restricted zones and surface keep outs. Figure 8 shows the general z-height restrictions for all MXM graphics modules.

Figure 8.

MXM Side View, Top and Backside Height Restrictions for MXM Modules

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MXM Module Keep Outs


Figure 9 through Figure 14 define the top and bottom surface keep outs for MXMI, MXM-II and MXM-III.

Figure 9.

MXM-I Top Surface Keep Outs

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Figure 10.

MXM-I Bottom Surface Keep Outs

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Figure 11.

MXM-II Top Surface Keep Outs

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Figure 12.

MXM-II Bottom Surface Keep Outs

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Figure 13.

MXM-III Top Surface Keep Outs

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Figure 14.

MXM-III Bottom Surface Keep Outs

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Figure 15 through Figure 21 show the mechanical drawings of the top and back of the MXM-I, MXM-II, MXM-III and define the z-height restriction zones. In cases where z-height restriction zones overlap, the most restrictive of the overlapping zones will always take precedence.

Figure 15.

MXM-I Z-Height Restriction Zones

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Figure 16.

MXM-II Topside Z-Height Restriction Zones

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Figure 17.

MXM-II Bottomside Z-Height Restriction Zones

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Figure 18.

MXM-III Topside Z-Height Restriction Zones

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Figure 19.

MXM-III Topside Z-Height Restriction Zones (Continued)

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Figure 20.

MXM-III Topside Z-Height Restriction Zones (Continued)

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Figure 21.

MXM-III Bottomside Z-Height Restriction Zones

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Mechanical Requirements
Backing Plate
Each MXM graphics module requires a mechanical backing plate design that shall be implemented as needed to compensate for a warped board resulting from thermal solution loading requirements. For MXM-I and MXM-II the backing plate is contained within the 1.2 mm universal z-height restriction. For MXM-III only, the backing plate is allowed to exceed the 1.2 mm height restriction. This backing plate can be unique for each MXM design. In MXM configurations that have memory on the backside of the PCB, the memory and the portion of the cooling solution covering the memory may exceed the Zone-C height restriction.

Thermal Solution Mounting


The thermal solution is mounted to the MXM with M2.5 screws from the bottomside of the PCB. A specific screw size is defined to ensure inter-board compatibility because the backing plates may be unique to each MXM.

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Electrical Specifications

PCI Express Support


The Mobile PCI Express Module (MXM) supports a link of up to sixteen bidirectional PCI Express differential signaling lanes. It is compliant with PCI Express Base Specification 1.0a except for power delivery and power management. Notebook power requirements supercede PCI Express power specifications. The MXM does not support Hot-Plug insertion.

Electrical Connector
The Mobile PCI Express Module (MXM) utilizes a 230 circuit card-edge connection system. The contacts are rated for 0.5 A steady state current. The connector accommodates card thicknesses of 1.2 mm and will initially have three different connector height options. The connector heights are 5 mm, 2.7 mm and 1.5 mm surface to surface spacing between the MXM and the motherboard. Different connector heights can be developed in the future. All external and internal notebook interfaces are routed through the MXMs connector and down to the motherboard. The motherboard will then connect these signals from the MXM to the appropriate circuitry. Figure 22 through Figure 24 describe the MXM connector. Table 4 lists the connector pinout.

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Figure 22.

MXM Connector Motherboard Footprint

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Figure 23.

MXM Connector Top Down and Side View

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Card Edge Finger Pattern, Topside

Card Edge Finger Pattern, Bottomside

MXM Card Edge Finger Pattern, Side View

Figure 24.
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MXM Card Edge Finger Pattern


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Table 4.
Pin# Signal Name
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 79 81 83 85 PWR_SRC PWR_SRC PWR_SRC PWR_SRC PWR_SRC PWR_SRC PWR_SRC PWR_SRC GND GND GND GND KEY KEY KEY KEY KEY KEY PEX_RX15# PEX_RX15 GND PEX_RX14# PEX_RX14 GND PEX_RX13# PEX_RX13 GND PEX_RX12# PEX_RX12 GND PEX_RX11# PEX_RX11 GND PEX_RX10# PEX_RX10 GND PEX_RX9# PEX_RX9 GND PEX_RX8# PEX_RX8 GND PEX_RX7#

Connector Pinout
Signal Name
1V8RUN 1V8RUN 1V8RUN 1V8RUN 1V8RUN 1V8RUN 1V8RUN RUNPWROK 5VRUN GND GND GND KEY KEY KEY KEY KEY KEY PRSNT2# PEX_TX15# PEX_TX15 GND PEX_TX14# PEX_TX14 GND PEX_TX13# PEX_TX13 GND PEX_TX12# PEX_TX12 GND PEX_TX11# PEX_TX11 GND PEX_TX10# PEX_TX10 GND PEX_TX9# PEX_TX9 GND PEX_TX8# PEX_TX8 GND

Pin#
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86

Pin# Signal Name


87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 121 123 125 127 129 131 133 135 137 139 141 143 145 147 149 151 153 155 157 159 161 163 165 167 169 171 PEX_RX7 GND PEX_RX6# PEX_RX6 GND PEX_RX5# PEX_RX5 GND PEX_RX4# PEX_RX4 GND PEX_RX3# PEX_RX3 GND PEX_RX2# PEX_RX2 GND PEX_RX1# PEX_RX1 GND PEX_RX0# PEX_RX0 GND PEX_REFCLK# PEX_REFCLK CLK_REQ# PEX_RST# RSVD RSVD SMB_DAT SMB_CLK THERM# VGA_HSYNC VGA_VSYNC DDCA_CLK DDCA_DAT IGP_UCLK# IGP_UCLK GND RSVD RSVD RSVD IGP_UTX2#

Pin#
88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 122 124 126 128 130 132 134 136 138 140 142 144 146 148 150 152 154 156 158 160 162 164 166 168 170 172

Signal Name
PEX_TX7# PEX_TX7 GND PEX_TX6# PEX_TX6 GND PEX_TX5# PEX_TX5 GND PEX_TX4# PEX_TX4 GND PEX_TX3# PEX_TX3 GND PEX_TX2# PEX_TX2 GND PEX_TX1# PEX_TX1 GND PEX_TX0# PEX_TX0 PRSNT1# TV_C/HDTV_Pr GND TV_Y/HDTV_Y GND TV_CVBS/HDTV_Pb GND VGA_RED GND VGA_GRN GND VGA_BLU GND LVDS_UCLK# LVDS_UCLK GND LVDS_UTX3# LVDS_UTX3 GND LVDS_UTX2#

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Pin# Signal Name


173 175 177 179 181 183 185 187 189 191 193 195 197 199 201 203 205 IGP_UTX2 GND IGP_UTX1# IGP_UTX1 GND IGP_UTX0# IGP_UTX0 GND IGP_LCLK# / DVI_B_CLK# IGP_LCLK / DVI_B_CLK DVI_B_HPD / GND RSVD RSVD GND IGP_LTX2# / DVI_B_TX2# IGP_LTX2 / DVI_B_TX2 GND

Pin#
174 176 178 180 182 184 186 188 190 192 194 196 198 200 202 204 206

Signal Name
LVDS_UTX2 GND LVDS_UTX1# LVDS_UTX1 GND LVDS_UTX0# LVDS_UTX0 GND LVDS_LCLK# LVDS_LCLK GND LVDS_LTX3# LVDS_LTX3 GND LVDS_LTX2# LVDS_LTX2 GND

Pin# Signal Name


207 209 211 213 215 217 219 221 223 225 227 229 231 233 235 237 239 241 IGP_LTX1# / DVI_B_TX1# IGP_LTX1 / DVI_B_TX1 GND IGP_LTX0# / DVI_B_TX0# IGP_LTX0 / DVI_B_TX0 DVI_A_HPD DVI_A_CLK# DVI_A_CLK GND DVI_A_TX2# DVI_A_TX2 GND DVI_A_TX1# DVI_A_TX1 GND DVI_A_TX0# DVI_A_TX0 GND

Pin#
208 210 212 214 216 218 220 222 224 226 228 230 232 234 236 238 240 242

Signal Name
LVDS_LTX1# LVDS_LTX1 GND LVDS_LTX0# LVDS_LTX0 GND DDCC_DAT DDCC_CLK LVDS_PPEN LVDS_BL_BRGHT LVDS_BLEN DDCB_DAT DDCB_CLK 2V5RUN GND 3V3RUN 3V3RUN 3V3RUN

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Connector Pin Descriptions


Table 5 contains pin descriptions for each signal type. All Input/Output classifications are relative to the MXM graphics module.

Table 5.
Signal Name
DVI_A_TX0-2, DVI_A_TX0-2# DVI_A_CLK, DVI_A_CLK# DVI_A_HPD DVI_B_TX0-2, DVI_B_TX0-2#

Connector Pin Descriptions


Input/Output
Output, 100 Ohm Diff Output, 100 Ohm Diff Input Output, 100 Ohm Diff

Description
TMDS output for either single link DVI or dual link DVI TMDS clock for either single link DVI or dual link DVI DVI hot plug detect for DVI_A TMDS output for either single link DVI or dual link DVI, upper bits for dual-link. Note: these pins are shared with IGP LVDS loop through pins TMDS clock, only used for second single-link DVI. Note: these pins are shared with IGP LVDS loop through pins DVI hot plug detect for DVI_B. Tie to GND on motherboard if notebook is configured for IGP LVDS pass through Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information. Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information. Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information. Serial link, can connect to VGA, DVI_A or DVI_B. Configuration needs to be stored in MXM system information. LVDS Panel Power enable LVDS Panel backlight enable LVSD Panel brightness control, duty cycle determines output level LVDS output for dual link LVDS input that loops back to LVDS_UTX02, LVDS_UTX0-2# to provide path for LVDS with IGP only. LVDS clock for dual link

DVI_B_CLK, DVI_B_CLK# DVI_B_HPD

Output, 100 Ohm Diff

Input/GND

DDCA_CLK

Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module, Output, 3.3 V logic levels 2.2K Pull-up required on MXM graphics module BI-Directional 3.3 V logic levels 2.2K Pull-up required on MXM graphics module Output, 3.3 V logic levels Output, 3.3 V logic levels PWM Output, 3.3 V logic levels Output, 100 Ohm Diff Input, 100 Ohm Diff

DDCA_DAT

DDCB_CLK

DDCB_DAT

LVDS_PPEN LVDS_BLEN LVDS_BL_BRGHT LVDS_UTX0-3, LVDS_UTX0-3# IGP_UTX0-2, IGP_UTX0-2# LVDS_UCLK, LVDS_UCLK#

Output, 100 Ohm Diff

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Signal Name
IGP_UCLK, IGP_UCLK# LVDS_LTX0-3, LVDS_LTX0-3# IGP_LTX0-2, IGP_LTX0-2#

Input/Output
Input, 100 Ohm Diff

Description
LVDS input that loops back to LVDS_UCLK, LVDS_UCLK# to provide path for LVDS with IGP only. LVDS output for either single link or dual link LVDS input that loops back to LVDS_LTX02, LVDS_LTX0-2# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins LVDS clock for either single link or dual link LVDS input that loops back to LVDS_LCLK, LVDS_LCLK# to provide path for LVDS with IGP only. Note: these pins are shared with DVI_B pins

Output, 100 Ohm Diff Input, 100 Ohm Diff

LVDS_LCLK, LVDS_LCLK# IGP_LCLK, IGP_LCLK#

Output, 100 Ohm Diff Input, 100 Ohm Diff

TV_Y/HDTV_Y TV_C/HDTV_Pr TV_CVBS/HDTV_Pb DDCC_CLK

Output, 37.5 Ohm +/- 2 Ohms Output, 37.5 Ohm +/- 2 Ohms Output, 37.5 Ohm +/- 2 Ohms Output, 3.3 V logic levels 2.2K pull-up required on motherboard BI-Directional 2.2K pull-up required on motherboard Output, 37.5 Ohm +/- 2 Ohms Output, 37.5 Ohm +/- 2 Ohms Output, 37.5 Ohm +/- 2 Ohms Output, 3.3 V logic levels Output, 3.3 V logic levels Input, 5 V tolerant

TV_OUT Luma/HDTV_OUT Luma TV_OUT Chroma/HDTV_OUT


Chroma Red

TV_OUT Composite/HDTV_OUT Chroma Blue


Serial link, connect to EDID LVDS Panel and to MXM System Information ROM. This link is not to be used for external interfaces Serial link, connect to EDID LVDS Panel and to MXM System Information Rom. This link is not to be used for external interfaces VGA Blue Output VGA Red Output VGA Green Output

DDCC_DAT

VGA_BLU VGA_RED VGA_GRN VGA_HSYNC VGA_VSYNC SMB_CLK

VGA Horizontal Sync VGA Vertical Sync


Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Clock signal. Serial link for thermal sensor on GPU. Connect to motherboard's SMBus Data signal. Indicates a thermal alert. Connect to motherboard's SMBus Alert signal. Card present detect, indicates if MXM graphics module is present. Tie to pull-up on motherboard. If high then MXM is not present. If low then MXM is present. Can be used to control IGP upgrade multiplexers Tied to Ground on both motherboard and MXM. Reserved for future functionality.

SMB_DAT THERM# PRSNT1#

Bi-Dir, 5 V tolerant Open Collector Output, active low, 5 V tolerant GND

PRSNT2#

GND

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Signal Name
CLK_REQ# PEX_RST# PEX_REFCLK, PEX_REFCLK# PEX_TX0-15, PEX_TX0-15# PEX_RX0-15, PEX_RX0-15# RUNPWROK 3V3RUN 5VRUN 2V5RUN 1V8RUN PWR_SRC

Input/Output
Output, active low Input, active low Input, 100 Ohm Diff Input, 100 Ohm Diff

Description
Indicates need for PEX_REFCLK PCI_Express reset PCI Express reference clock. PCI Express 16 lanes, output from northbridge. DC blocking capacitiors need to be placed on the motherboard. PCI Express 16 lanes, input to northbridge. DC blocking capacitors need to be placed on the MXM graphics module. Indicates that all power to the MXM is within the specified tolerances 3.3 V run power 5 V run power 2.5 V run power 1.8 V run power Battery power

Output, 100 Ohm Diff

Input Power input Power input Power input Power input Power input

Power Requirements
The Mobile PCI Express Module (MXM) requires the following power to be provided by the notebook (Table 6).

Table 6.
Voltage Rail 3V3RUN 5VRUN 2V5RUN 1V8RUN PWR_SRC Voltage
3.3 V +/- 5% 5 V +/- 5% 2.5 V +/- 5% 1.8 V +/- 5% 7.5 V* to 22 V

Power Requirements
Current
1.5 Amps 0.5 Amps 0.5 Amps 3.5 Amps Up to 4 Amps

Power
4.95 W 2.5 W 1.25 W 6.3 W 8.9 W to 38.9 W

Notes
3.3 V run 5 V run 2.5 V run 1.8 V run Battery, store power capability in MXM system information.

* For a platform MXM input budget greater than 30 W, the minimum PWR_SRC voltage is input budget/4A. For example, an input budget of 35 W, the PWR_SRC Vmin = 8.75 V

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Power Throttling
The MXM will automatically detect power supply limitations and thermal limitations of the notebook platform and will automatically throttle its clocks to stay within the power and thermal limits. If the notebook platforms power supply and MXM thermal cooler are equal too or exceeds the MXMs power requirements, the MXM will run at full speed. The MXM system information data contains the necessary information for MXM throttling. This data is stored in either the SBIOS or the MXM system information ROM on the Notebooks motherboard.

System Requirements
Display Requirements Panel Type
The MXM system only supports EDID Panels.

LVDS Panel Power


The motherboard shall provide power to the notebooks LVDS panel. The power is optionally controlled by LVDS_PPEN.

VGA, TV_Out Impedance


The motherboard shall route all RGB signals and TV_OUT signals with 37.5 Ohms impedance. A 75 Ohm termination resistor shall be placed at the end of the trace as close as possible to the output filters which should be as close as possible to the output connectors. For notebooks configured to support TV_Out, 75 Ohm termination resistors are required on any unused TV_Out signals. The MXM graphics module shall route all RGB signals and TV_OUT signals with 37.5 Ohms.

Output Filters
The motherboard is required to have output filters on all VGA output lines and on all TV output lines. These filters should be placed as close as possible to the external connectors.

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Other Requirements MXM System Information ROM


The motherboard is required to store the MXM System Information in either the SBIOS or in the MXM System Information ROM. The implementation is a design decision left to the system providers discretion. Information regarding the data stored in the MXM System Information is found in the MXM Software Specification. For MXM System Information ROM implementations, the Motherboard is required to place a 256 Byte serial ROM that connects to DDCC_CLK and DDCC_DAT with a device address of 0xAC. The ROM must be compatible to an Atmel 24C02 and operate with 3.3 V signaling

5 V Tolerance
The motherboard shall provide back drive isolation and level shifting for all DDC lines, VGA_HSYNC and VGA_VSYNC. The MXM graphics modules do not drive output signals at 5 V output levels and its inputs are not 5 V tolerant unless specifically stated.

DVI_B/IGP_LVDS Pin Sharing


The MXM must not power up DVI_B interfaces until it has verified that the notebook is configured for DVI_B. This information will be stored in the MXM system information ROM. IGP LVDS pass through and DVI_B can not co-exist in the same notebook, they are mutually exclusive. When configured for IGP LVDS pass through, DVI_B_HPD must be tied to GND on the motherboard.

DVI Detection Circuitry


The motherboard is required to have input filters on both DVI_HPD lines. The MXM graphics module is required to provide level shifting and clamping for these signals.

MXM Cooling Fan


If it is necessary for the MXM graphics module to have its own dedicated fan in the notebooks chassis, the motherboard is required to provide power and speed control for the fan.

MXM Grounding
The MXM graphics module is grounded through the MXM connector and the two mounting holes. The thermal solution will be grounded through the thermal mounting holes and the landing area around the holes.

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Power Up Sequencing
There is no requirement for power up sequencing on the motherboard to support MXM graphics modules. If power up sequencing is required, each MXM graphics module is responsible for its own power up sequencing.

Additional Function Support


In order to facilitate additional functions implemented with GPIOs not supported in this specification, such as Japan-D connector or multiplexing TV out to separate connectors for Component out and S-Video, the motherboard is required to place a serial link GPIO Expander that connects to DDCC_CLK and DDCC_DAT with a device address of 0x4C. This address allows the motherboard designer to utilize GPIO and ROM combination devices to reduce overall implementation costs. The specific function of each GPIO shall be stored in the MXM System Information Structure. The MXM System Information Structure is found in the MXM Software Specification.

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Appendix: Support Information

Configuring Notebook for MXM with IGP


Configurable Option
Use of the MXM platform will allow maximum flexibility in configuring different graphics capabilities all with the same motherboard. Through the use of zero Ohm stuffing resistors the manufacturer can easily decide if the notebook will be configured with an IGP or a MXM graphics module all with the same motherboard platform. Refer to Figure 25 for the notebook output topology with IGP.

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Figure 25.

Notebook Output Topology with IGP

Upgradeable Option
To facilitate possible upgrades to the notebook a LVDS pass through feature was added to the MXM system. This pass through capability was needed since active devices that work at LVDS data rates are very expensive. To support LVDS pass through, the IGPs LVDS output signals will need to be routed over to the MXM connector and connect to the IGP_LVDS signals. An extremely low cost passive PCB will be inserted into the MXM connector that will complete the circuit path between the IGPs output signals and the LVDS panel input signals. VGA and TV_out signals are switched by an active device between the IGP and MXM. When a MXM is installed at a later date the Mux will switch over to the MXM output signals and the MB_LVDS signals will be interrupted by the MXM card. If PRSNT#1 is low then the MUX will connect the VGA and TV circuit paths to the MXM. If DVI is supported on an IGP platform, the TMDS transmitter will reside on the LVDS pass through card and drive TMDS outputs on DVI_A signals. The IGP would need to multiplex TMDS data over PCI Express lines. See Figure 26

Figure 26.

Notebook Output Topology with IGP

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Notice ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS AND OTHER DOCUMENTS (TOGETHER AND SEPARATELY, "MATERIALS") ARE BEING PROVIDED "AS IS." NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.

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