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Bringing Your MEMS to Market

Thin Film Metallization Systems


Custom Thin Film Metallization

Overview Custom Thin Film


Micralyne offers a range of Custom metallization and patterned substrates are offered to meet a wide range
thin film metallization systems of material system and circuit fabrication needs. Dicing and packaging are also a
for different types of substrate part of Micralyne’s technical capabilities.
materials (including silicon,
alumina, aluminum nitride, and Custom metallization consists of sputtered coatings with patterns made to
diamond). These solutions customer specifications. Micralyne routinely deposits a wide variety of films on
offer access to a range of many different substrate materials. Engineers use tri-target sputtering systems to
thermal management options provide consistent film quality and access to custom adhesion, barrier and
while facilitating a higher conductive layers.
degree of passive component
integration. Patterning is done to match customer specifications using wet chemical etch or
liftoff techniques.

Experience
Micralyne’s experienced engineering staff can provide assistance in choosing
substrates and metallization systems at the inception of a project. If difficulties
are encountered, the engineering team will also help troubleshoot a customer’s
process.

Thin Film Laser Submount

Quality
Micralyne’s quality assurance program is registered with ISO 9001:2000 standards
and will meet most existing military and aerospace requirements.

www.micralyne.com ETDS307_Rev040-0907_ThinFilm
Bringing Your MEMS to Market

Thin Film Metallization Systems


Specifications

About Micralyne Specifications


Micralyne is a world leading
independent MEMS foundry. Substrates Coated Adhesion Layers
From its state-of-the-art Silicon SOI Chromium (Cr)
50,000 ft2 manufacturing Glass Quartz Titanium (Ti)
facility, Micralyne develops and Sapphire Diamond Titanium/Tungsten (TiW)
manufactures MEMS-based AlN Alumina
components in volume. Other Solder Layers
Micralyne is a profitable and Gold Tin (AuSn) - electroplated
growing company located in Conductive Layers
Edmonton, Alberta, Canada. Gold (Au) Resistive Layers
Copper (Cu) Tantalum Nitride (TaN)
Aluminum (Al)

Barrier Layers
Titanium/Tungsten (TiW)
Platinum (Pt)
Molybdenum (Mo)
Nickel Copper (NiCu)

For More Information...


Design Guidelines
Micralyne Inc.
1911 – 94 Street Micralyne can pattern on both the top and bottom sides of a substrate. Patterning
Edmonton, Alberta can be done with a shadow mask, a wet etch, or a liftoff procedure depending on
Canada T6N 1E6 the specific metal stack and design requirements.

Tel: +1.780.431.4400 Line resolution and dimensional tolerance varies widely depending on the metal
Fax: +1.780.431.4422 thickness, the metal stack and the patterning procedure used. Please contact us
for more information specific to your design.
info@micralyne.com
www.micralyne.com

ETDS307_Rev040-0907_ThinFilm
www.micralyne.com