www.ti.

com

FUNCTIONAL DIAGRAM
8
2
3
4
7
6
V
CC
A
B
V
BB
Y
Z
2 Gbps
2
23
- 1 PRBS
V
CC
= 3.3 V
V
ID
 = 200 mV
V
IC
= 1.2 V
Horizontal Scale= 200 ps/div
Vert.Scale= 200 mV/div
EYE PATTERN
1 GHz
SN65LVDS100 and SN65LVDS101
2
3
7
6
A
B
Y
Z
110 Ω
SN65LVDT100 and SN65LVDT101

––


•Ω





–°°

www.ti.com

––

±

±

±

±

≤°

°

°
°
°

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––

–°

≤–

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––


°

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Y
Z
A
B V
ID
V
OD
V
IB
V
IA
V
O(Z)
V
O(Y)
I
IB
I
IA
V
IA
+V
IB
V
IC
2
V
OC
I
O
V
BB
V
BB
+
-
V
OD
100 Ω
3.74 kΩ
3.74 kΩ
_
+
0 V ≤ V
(test)
≤ 2.4 V
Y
Z
V
OC
49.9 Ω ±1%
Y
1 pF
V
OC(PP)
V
OC(SS)
V
OC
1.4 V
B
A
1.0 V
49.9 Ω ±1%
Z
A
V
ID
B

––


±

www.ti.com
50 Ω
V
OY
V
OZ
50 Ω
V
OD
+
-
V
CC
- 2V
+
-
1.4 V
1 V
t
PLH
0.4 V
0 V
V
IA
V
IB
V
ID
80%
100%
0%
t
PHL
20%
t
f
t
r
V
OD
0 V
Y
Z
A
B
V
ID
1 pF
V
IB
V
IA
V
OD 100 Ω
-0.4 V
50 Ω
50 Ω
V
CC
- 2V
+
-
OR
V
OD
0 V
CLOCK INPUT
1/fo
IDEAL OUTPUT
0 V
1/fo
ACTUAL OUTPUT
0 V
t
c(n)
0 V
PRBS INPUT
0 V
ACTUAL OUTPUT
0 V
PRBS OUTPUT
Period Jitter Cycle to Cycle Jitter
t
jit(per)
= |t
c(n)
- 1/fo|
t
c(n)
t
c(n+1)
t
jit(cc)
= |t
c(n)
- t
c(n+1)
|
t
jit(pp)

––


±

www.ti.com
Pattern
Generator
Oscilloscope
EVM
Power Supply 1
+
-
Power Supply 2 +
-
VCC
EVM
GND
DUT
GND
1.22V
3.3V
Matched
Cables
SMA to SMA
Matched
Cables
SMA to SMA
J2
J7
J6
J5
J4
J3 J1
100 W
50 W 50 W
DUT
(Note A)
(Note B)
Tektronix
TDS6604
Agilent
E4862B

V
CC
Y
Z
GND
8
7
6
5
1
2
3
4
NC
A
B
V
BB
D AND DGK PACKAGE
(TOP VIEW)
V
CC
Y
Z
GND
8
7
6
5
1
2
3
4
NC
A
B
NC
D AND DGK PACKAGE
(TOP VIEW)
NC = Not Connected
SN65LVDS100 and SN65LVDS101 SN65LVDT100 and SN65LVDT101

––


≤–

www.ti.com

V
CC
V
CC
A
B
INPUT
V
CC
Y Z
OUTPUT
(SN65LVDS100 and SN65LVDT100)
7 V
7 V
7 V 7 V
R R
Y
Z
V
CC
OUTPUT
(SN65LVDS101 and SN65LVDT101)
V
CC
7 V
7 V
R R
V
CC
V
CC
(SN65LVDT only)
215 m A
110 W
350 m A
215 m A
350 m A

––

www.ti.com

15
25
35
45
55
0 200 400 600 800 1200
Frequency - MHz
-

S
u
p
p
l
y

C
u
r
r
e
n
t

-

m
A
I
C
C
1000
LVDS100
LVDS101= Loaded
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
V
ID
 = 200 mV
10
20
30
40
50
60
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - °C
-

S
u
p
p
l
y

C
u
r
r
e
n
t

-

m
A
I
C
C
V
CC
= 3.3 V
V
IC
= 1.2 V
V
ID
 = 200 mV
f = 750 MHz
LVDS101 = Loaded
LVDS100
200
300
400
500
600
700
0 200 400 600 800 1000 1200
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
V
ID
 = 200 mV
LVDS101
LVDS100
300
350
400
450
500
550
600
0 1 2 3 4 5
V
IC
- Common-Mode Input Voltage - V
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
t
PLH
t
PHL
V
CC
= 3.3 V
T
A
= 25°C
V
ID
 = 200 mV
f = 150 MHz
350
400
450
500
550
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - °C
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
V
ID
 = 200 mV
f = 150 MHz
t
PHL
t
PLH
450
500
550
600
650
700
750
0 1 2 3 4 5
V
IC
- Common-Mode Input Voltage - V
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
T
A
= 25°C
V
ID
 = 200 mV
f = 150 MHz
t
PLH
t
PHL
450
500
550
600
650
700
750
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - °C
-

P
r
o
p
a
g
a
t
i
o
n

D
e
l
a
y

T
i
m
e

-

p
s
t
p
d
V
CC
= 3.3 V
V
ID
 = 200 mV
f = 150 MHz
t
PHL
t
PLH
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
2300
V
OC
= 3.3 V
T
A
= 25°C
V
IC
= 400 mV
Input = PRBS 2
23
-1
V
ID
= 0.5 V
V
ID
= 0.3 V
V
ID
= 0.8 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.8 V
V
ID
= 0.5 V
V
ID
= 0.3 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 400 mV
Input = Clock

––

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0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 400 mV
Input = Clock
V
ID
= 0.5 V
V
ID
= 0.8 V
V
ID
= 0.3 V
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 400 mV
Input = PRBS 2
23
-1
2300
V
ID
= 0.3 V
V
ID
= 0.5 V
V
ID
= 0.8 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.5 V
V
ID
= 0.8 V
V
ID
= 0.3 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
Input = PRBS 2
23
-1
V
ID
= 0.3 V
V
ID
= 0.8 V
2300
V
ID
= 0.5 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.5 V
V
ID
= 0.8 V
2300
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 1.2 V
Input = PRBS 2
23
-1
V
ID
= 0.3 V
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 2.9 V
Input = Clock
0
5
10
15
20
25
30
200 400 600 800 1000
f - Frequency - MHz
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 2.9 V
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 2.9 V
Input = PRBS 2
23
-1
2300

––

www.ti.com
0
10
20
30
40
50
-40 -20 0 20 40 60 80 100
T
A
- Free-Air Temperature - °C
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V
V
IC
= 1.2 V
V
ID
 = 200 mV
Input = 2 Gbps 2
23
-1
LVDS100
LVDS101
0
50
100
150
200
250
300
350
400
0 500 1000 1500 2000 2500
0
10
20
30
40
50
60
70
80
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
P
e
r
i
o
d

J
i
t
t
e
r

-

p
s
Added Random Jitter
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25°C,
Input = Clock
0
10
20
30
40
50
60
300 800 1300 1800
Data Rate - Mbps
P
e
a
k
-
T
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
ID
= 0.3 V
V
ID
= 0.8 V
V
ID
= 0.5 V
V
CC
= 3.3 V
T
A
= 25°C
V
IC
= 2.9 V
Input = PRBS 2
23
-1
2300
300
380
460
540
620
700
0 400 800 1200 1600 2000
0
10
20
30
40
50
f - Frequency - MHz
-

D
i
f
f
e
r
e
n
t
i
a
l

O
u
t
p
u
t

V
o
l
t
a
g
e

-

m
V
V
O
D
P
e
r
i
o
d

J
i
t
t
e
r

-

p
s
Added Random Jitter
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25°C,
Input = Clock
0
20
40
60
80
100
0 1000 2000 3000 4000
Data Rate - Mbps
P
e
a
k
-
t
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25°C,
Input = PRBS 2
23
-1
0
20
40
60
80
100
0 1000 2000 3000 4000 5000
Data Rate - Mbps
P
e
a
k
-
t
o
-
P
e
a
k

J
i
t
t
e
r

-

p
s
V
CC
= 3.3 V,
V
IC
= 1.2 V,
|V
ID
| = 200 mV,
T
A
= 25°C,
Input = PRBS 2
23
-1

––

www.ti.com
LVPECL-to-LVDS
Horizontal Scale= 200 ps/div
LVPECL-to-LVDS
Horizontal Scale= 100 ps/div
LVDS-to-LVPECL
Horizontal Scale= 200 ps/div
LVDS-to-LVPECL
Horizontal Scale= 100 ps/div

––

www.ti.com
0
-5
-15
-20
0 1 2 3 4 5
I
n
p
u
t

V
o
l
t
a
g
e

T
h
r
e
s
h
o
l
d

-

m
V
5
15
20
Common-Mode Input Voltage - V
10
-10
3 V, 85°C
3 V, 85°C
3.6 V, 85°C
3.6 V, 85°C
3.6 V, -40°C
3.6 V, -40°C
3 V, -40°C
3 V, -40°C
V
IT+
V
IT-
|V
OD
| = 250 mV,
R
L
= 100 Ω,
Nominal Process

––

www.ti.com

V
CC
V
EE
50 W 50 W
V
CC
-2 V
SN65LVDS100
100 W
SN65LVDS100
ECL
LVDS
50 W 50 W
SN65LVDT101
LVDS
3.3 v
PECL
V
EE
50 W 50 W
3 V
SN65LVDS101
50 W 50 W
ECL
5 V
3.3 v
PECL
50 W 50 W
V
TT
SN65LVDS100 or
SN65LVDS101
CML

––

www.ti.com
LVDS
V
EE
SN65LVDS100
50 W
ECL
3.3 V
V
BB
22 kW
0.01 mF
Z
0
= 50 W
100 W
* closest standard value
LVDS 100 W
CMOS
1 V < V
DD
< 4 V
V
DD
SN65LVDS100
V
DD
/600 mA*
V
DD
/600 mA* 0.01 mF
* closest standard
value
CMOS
1 V < V
DD
< 4 V
V
DD
SN65LVDS101
V
DD
/600 mA*
V
DD
/600 mA* 0.01 mF
50 W 50 W
3.3 v
PECL
C
C
0.01 mF
50 W
50 W
22 kW
SN65LVDS100 or
SN65LVDS101
V
BB

––

www.ti.com

1.6 kΩ
1.6 kΩ
100 Ω
3.3 V

––



ΩΩ

www.ti.com

––

PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN65LVDS100D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS100DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDS101DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN65LVDT100DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT100DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN65LVDT101DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 3

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
SN65LVDS100DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDS100DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDS101DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDS101DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDT100DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDT100DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
SN65LVDT101DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
SN65LVDT101DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN65LVDS100DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDS100DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDS101DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDS101DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDT100DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDT100DR SOIC D 8 2500 367.0 367.0 35.0
SN65LVDT101DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
SN65LVDT101DR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2012
Pack Materials-Page 2
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