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Techni cal Support Note
TS-BSC-HW-0211
Mi ni mum HW Requi rements for BSC
RG40 Rel ease
Radi o Cont rol l ers
Mul t i cont rol l er BSC, Mul t i cont rol l er TC, Fl exi BSC,
BSC3i , TCSM3i , TCSM2
S16, S16. 1, S16_2

Approval date: (06-Mar-2014)

This document contains following
type of information

Informative X
Preventive
Corrective
Additional categorization
Urgent
Security
Release Upgrade
SW Update
Parameterization
Information is classified as
Internal
Public X
Customer Specific



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Table of Contents
1. Validity......................................................................................................................................... 3
2. Compatibility / Dependencies to other products ........................................................................... 3
3. Keywords .................................................................................................................................... 3
4. Executive Summary ..................................................................................................................... 3
5. Detailed description ..................................................................................................................... 3
6. Solution / Instructions .................................................................................................................. 6
7. Note .......................................................................................................................................... 15
8. References ................................................................................................................................ 15

Contact:

Contact your local Nokia Solutions and Networks support

Summary of changes:

06-Mar-2014 1.0 Approval date
17-Sep-2014 2.0 Recommendations updated; 4GB to all deliveries


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Purpose
This document contains generic information about products. These can be instructions that
explain problem situations in the field, instructions on how to prevent or how to recover from
problem situations, announcements about changes or preliminary information as requirements
for new features or releases.

1. VALIDITY
This document is valid for BSC3i, Flexi BSC, Multicontroller BSC, TCSM2, TCSM3i and
Multicontroller TC product configurations with RG40 / S16_2 SW release

2. COMPATIBILITY / DEPENDENCIES TO OTHER PRODUCTS
None.

3. KEYWORDS
BSC, BSC3i, Flexi BSC, Multicontroller BSC, TCSM2, TCSM3i, Multicontroller TC, minimum,
S16_2, RG40, CPU, PCU, memory, hard disk, application software

4. EXECUTIVE SUMMARY
This Technical Support Note describes minimum HW requirements together with
recommended memory amounts for BSC SW release S16_2 providing support for RG40
release. This Technical Support note covers the RG40 SW release.

5. DETAILED DESCRIPTION
Multicontroller BSC, Flexi BSC, BSC3i, TCSM3i, Multicontroller TC and TCSM2 products are
supported with S16_2 / RG40.

Minimum memory configurations for Flexi BSC CPU units are 2GB in all functional units (same
as RG30EP1). Minimum memory configurations for BSC3i 1000/2000 CPU units are 2GB in all
functional units (changed from RG30EP1). Minimum memory configurations for BSC3i 660
CPU units are 1GB in all functional units (same as RG30EP1).

However Nokia recommends upgrade all BSC3i 660 units to 2GB and all BSC3i 1000/2000
and Flexi BSC units to 4GB. Recommended amounts are also maximum capacity which can
be equipped. CP816-xx and CP1D-A units in Flexi BSC and BSC3i 1000/2000 maximum
equipment is 4x 1GB. CP710-xx units in BSC3i 660 maximum equipment is 4x 512MB
memory modules. Equipping recommended amounts will remove all possible further upgrade
needs in the future.

All Flexi BSC deliveries will include 4GB memory per CP1D-A as default starting from
beginning of November 2014.

There are no new memory configuration specific HW requirements for Multicontroller BSC and
Multicontroller TC in S16_2 / RG40 when compared to Multicontroller BSC and Multicontroller
TC configurations in RG20 / RG30 / RG30EP1. Additionally HW requirements for new
Application Software features are presented.



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Central processor and minimum memory requirements
Allowed Central Processing Unit (CPU) types:

CPU type Micro-
processor
Clock
Frequency, MHz
BSC Product
CP710-A/-AB/AC Pentium III 800 BSC3i 660
CP816-A/AC Pentium M 1000-1800 BSC3i 660/1000/2000
Flexi BSC (S14/RG10)
CP1D-A Penryn 1600-2260 Flexi BSC (S15/RG20)

Below are the requirements for minimum memory amounts in BSC3i 660 product
configurations with S16_2 / RG40 SW release:

Computer
unit
BSC3i 660 S16.1 /
RG30 EP1
Memory amount,
Mbytes
BSC3i S16_2 /
RG40
Memory amount,
Mbytes
Recommended
Memory amount,
Gbytes
OMU 1024 1024 2
MCMU 1024 1024 2
BCSU 1024 1024 2

Below are the requirements for minimum memory amounts in BSC3i 1000/2000 product
configurations with S16_2 / RG40 SW release:

Computer
unit
BSC3i 1000/2000
BSC3i S16.1 /
RG30 EP1
Memory amount,
Mbytes
BSC3i S16_2 /
RG40
Memory amount,
Mbytes
Recommended
Memory amount,
Gbytes
OMU 1024 2048 4
MCMU 1024 2048 4
BCSU 1024 2048 4

Below are the requirements for minimum memory amounts in Flexi BSC product configurations
with S16_2 / RG40 SW release:

Computer
unit
Flexi BSC S16.1 /
RG30 EP1
Memory amount,
Mbytes
Flexi BSC S16_2 /
RG40
Memory amount,
Mbytes
Recommended /
Delivered Nov 2014
onwards,
Gbytes
OMU 2048 2048 4
MCMU 2048 2048 4
BCSU 2048 2048 4

CP710 CPU models memory bank can consist of either 256MB or 512MB memory modules.
Existing CP710 CPU model configurations are equipped either 256MB or 512MB. Total
memory amounts required for CP710 CPU models:

 4 pcs of 256MB memory module MR256M C103756 or
 2 pcs of 512MB memory module MR512M C103757


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CP816 CPU models memory bank can consist of 512MB modules or 1GB modules. Total
memory amounts required for CP816 CPU models:
 4 pcs of 512MB memory module MRD512A C109053 or
 4 pcs of 512MB memory module MRD512B C111692 or
 2 pcs of 1GB memory module MRD1GBA C109054 or
 2 pcs of 1GB memory module MRD1GBB C111693

CP1D-A CPU models memory bank are equipped with one 1GB as standard. Total memory
amounts required for CP1D-A CPU models:

 2 pcs of 1GB memory module MRA2B01 C111696

New memory modules can be ordered with following BSC Sales Items:

 BSC3172 contains 1pcs of 512MB (MR512M) C103757 module for CP710
 BSC3224 contains 1pcs of 1GB (MRD1GBB) C111693 module for CP816
 BSC3313 contains 1pcs of 1GB (MRA2B01) C111696 module for CP1D-A

Detailed memory update instructions are presented in Instructions chapter in this document.

Hard disk size requirements

The minimum disk space requirement is 18GB. All BSC3is have been originally delivered with
at least 18GB size hard disks. Flexi BSCs have been delivered with at least 73 GB hard disks.
No need for any disk upgrades.

There are no new hard disk size specific HW requirements for Multicontroller BSC and
Multicontroller TC in S16_2 / RG40 when compared to Multicontroller BSC and Multicontroller
TC configurations in RG20 / RG30 / RG30EP1.

PCU hardware requirements

All existing PCU units PCU1, PCU2 can be used with the basic S16_2 supporting RG40
release. As with earlier SW releases the PCU Basic SW (BSW) is controlled by license keys.
PCU1 and PCU2 have different BSW each having own sales item.

HW requirements for new Application Software products

As for previous software releases, certain software products set requirements for the BSC
hardware. All new Packet Switched related features require PCU2 hardware units or
Multicontroller BSC. New application SW features introduced with RG40 / S16_2 SW release
do not require any other additional new HW. Application SW products might also require some
other application SW product, which has hardware requirements.

HW requirements for existing Application Software products

Hardware requirements for software features introduced in earlier software releases should be
reviewed separately.



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O&M Link Capacity Requirements

As BSC SW releases have introduced new functionality with increasing number of radio
network objects and measurement data, more O&M link capacity may be needed.

O&M link capacity of the BSC is mainly dependent on Base Station TRX amount connected to
the BSC. Minimum link capacity for the each 1000 TRX is about 500 kbit/s. Recommended link
capacity for the 1000 TRX connectivity is about 1 Mbit/s.

Please note that figures presented here are only calculated estimates. Please also note that
deviations to the figures might exist due to the implications such as number of managed
objects under BSC, activated features, customer-specific data collection settings or work
processes.

LAN based O&M connection is currently recommended and most powerful link option method.
LAN based interfaces are available as standard HW in all BSCs. Alternatively digital X.25
connection is still feasible when multiple 64 kbit/s timeslots are used for less than 1024 kbit/s
data link needs with BSC3i and Flexi BSC products with optional HW. Analog X.25
connections with limited link capacity cannot be used anymore.

With Multicontroller BSC only LAN based O&M connection is supported.

6. SOLUTION / INSTRUCTIONS
This procedure explains how to do memory upgrade in case if not done already earlier.

Memory modules are very sensitive. Use always an antistatic mat, tools and wristband when
handling CPUs and memory modules. See how to take care ESD issue properly from BSC
Product Documentation (ESD and handling of electrostatic sensitive units).

To minimize risk of incompatibility between different memory modules it is recommended to
use same manufacturer of memory modules and same manufacturer’s module type inside
each CPU. This is possible if during memory upgrade you remove all memory modules and
install only new modules to first CPU. You can use the removed modules in another CPU.

All modules inside each CPU must be same general type e.g. MRD512A and MRD512B
cannot be mixed in same CPU.




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Procedure for CP710-A, CP710-AB and CP710-AC memory upgrade

There are two different layouts of CP710-A/AB/AC. Memory module equipping is similar for
both layouts models.

Insert first memory module to the slot 1, closest to front panel.



Equipping order of memories is: 1 - 2 - 3 – 4 (Sockets)

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SDRAM-
memory size
total
Socket 1 Socket 2 Socket 3 Socket 4
1 GB MR256M

MR256M

MR256M

MR256M

1 GB MR512M

MR512M

- -
2 GB MR512M

MR512M

MR512M

MR512M


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Procedure for CP816-A and CP816-AC memory upgrade

There are three different layouts of CP816-A/AC.
Please select appropriate CPU unit based on instructions and pictures below:

ADVANTECH CP816:

Possible equipping options:






















DIMM-
memory size
total
Socket
A1
Socket
B1
Socket
A2
Socket
B2
1 GB - - MRD512A MRD512A
1 GB - - MRD512B MRD512B
1 GB - - MRD1GBA -
1 GB - - MRD1GBB -
2 GB MRD512A MRD512A MRD512A MRD512A
2 GB MRD512B MRD512B MRD512B MRD512B
2 GB - - MRD1GBA MRD1GBA
2 GB - - MRD1GBB MRD1GBB
4 GB MRD1GBA MRD1GBA MRD1GBA MRD1GBA
4 GB MRD1GBB MRD1GBB MRD1GBB MRD1GBB

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FORCE CP816:



Possible equipping options:



















DIMM-
memory size
total
Socket
P10
Socket
P12
Socket
P11
Socket
P13
1 GB - - MRD512A MRD512A
1 GB - - MRD512B MRD512B
1 GB - - MRD1GBA -
1 GB - - MRD1GBB -
2 GB MRD512A MRD512A MRD512A MRD512A
2 GB MRD512B MRD512B MRD512B MRD512B
2 GB - - MRD1GBA MRD1GBA
2 GB - - MRD1GBB MRD1GBB
4 GB MRD1GBA MRD1GBA MRD1GBA MRD1GBA
4 GB MRD1GBB MRD1GBB MRD1GBB MRD1GBB

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RADISYS CP816:




Possible equipping options:























DIMM-
memory size
total
Socket
J11
Socket
J12
Socket
J13
Socket
J14
1 GB - - MRD512A MRD512A
1 GB - - MRD512B MRD512B
1 GB - - - MRD1GBA
1 GB - - - MRD1GBB
2 GB MRD512A MRD512A MRD512A MRD512A
2 GB MRD512B MRD512B MRD512B MRD512B
2 GB - - MRD1GBA MRD1GBA
2 GB - - MRD1GBB MRD1GBB
4 GB MRD1GBA MRD1GBA MRD1GBA MRD1GBA
4 GB MRD1GBB MRD1GBB MRD1GBB MRD1GBB

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Procedure for CP1D-A memory upgrade

The CP1D-A has two vendors that differ in layout.


Advantech CP1D-A:








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Radisys CP1D-A:



Both have similar memory equipping:












DIMM-
memory size
total
Socket
11/J11
Socket
01/J12
Socket
10/J13
Socket
00/J14
2 GB - - MRA2B01 MRA2B01
4 GB MRA2B01 MRA2B01 MRA2B01 MRA2B01

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With Advantech CP1D-A (serial start with AT) it is recommended to support the plug-in unit
when installing memory modules.

Material requirement:
Bakelite pad (plastic cement), size 100mm x 270mm.



Picture 3 The pad which comes under the board.

It is possible to use also some other soft material which support the board that it does not
bend during memory module assembly.

Place the pad (ESD material) under the PWB during memory module assembly (picture 4).

Insert the Memory modules gently having the pad under the PWB.




Picture 4 Location of the pad under the board


In Advantech interchangeability Dxx onwards there is a built in support plate.

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If the Advantech CP1D-A is interchangeability Dxx or newer, there is no need to use extra pad.




Picture 5 The new built in support plate on the board.


7. NOTE
All modules inside each CPU must be same general type e.g. MRD512A and MRD512B
cannot be mixed in same CPU.

Memory modules are very sensitive. Use always an antistatic mat, tools and wristband when
handling CPUs and memory modules. See how to take care ESD issue properly from BSC
Product Documentation (ESD and handling of electrostatic sensitive units).


8. REFERENCES
Technical Support Note 0201 Minimum HW Requirements for BSC RG30 EP1 Release
Technical Support Note 0208 The end of the availability of small memory modules


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