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Introduction
2/XX
3/XX
Introduction
Mode I test
4/XX
Mesh generation
Materials definition
Interface between Z-pin and laminates/resin
Definition of boundary conditions and Mode I simplification
Results and discussions
Conclusions
5/XX
Mesh Generation
1. Ply level mesh
Ply-level mesh
2. Stacking
Stacking
6/XX
Mesh Generation
3. Full mesh
Top block
Z-pin
Full model
Bottom block
Experimental sample
Materials definition
Young modulus, El(Gpa)
Young modulus, Et (Gpa)
Shear modulus, Glt (Gpa)
Shear modulus, Gtt (Gpa)
Poissons ratio, vlt
Poissons ratio, vtt
-1
Thermal coefficient, tt(C )
-1
Thermal coefficient, ll(C )
Laminate(IM7/8552)
161
11.38
5.17
3.98
0.32
0.436
3.0e-5
0
Z-pin (T300/9310)
144
7.31
4.45
2.63
0.25
0.39
3.0e-5
0
7/XX
8/XX
n ,max
m,max
t ,max
max( n ,0) t
+
= 1
n , max
t ,max
GI
GIC
n
t ,max
GII
+
= 1
G
IIC
n
Bonding between Z-pin and laminates/resin
0
n = k max(d ,0)
d0 0
t = max( 0 min(max(
d0 d
,0),1) + n , t ,max )
d0
9/XX
blank line
**Imax, IImax,
KI,
KII,
GI,
GII, ,
c
30., 60., 1.e+5., 1.e+5, 1.e+5, 1.e+5, 1, 0.03,
** , s0, smax
0.8, 25, 40
10/XX
Temperature Field:
-160C w.r.t. cure
11/XX
Mode I
Mixed Mode
Mixed Mode
Mode II
Mode II
12/XX
Simplification of Mode I
13/XX
interface compression
interface tension
0.3s
debonding initiation
0.6s
bonding
debonding
1.0s
14/XX
15/XX
complete debonding
frictional pull-out
16/XX
0.6s
17/XX
negligible influence of
interface debonding
18/XX
debonding initiation
0.3s
0.6s
1.0s
19/XX
negligible influence of
interface debonding
Conclusions
20/XX
Acknowledgements
21/XX