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Altium Designer 14.3 incorporates a number of additions and enhancements to both the
IPC-Compliant Footprint Wizard, and the IPC-Compliant Footprints Batch Generator. These
changes are aimed at making both truly compliant with Revision B of the IPC standard 7351 - Generic
Requirements for Surface Mount Design and Land Pattern Standard.
IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).
The following additional packages are now supported: CAPAE, CHIP ARRAY, DFN, LGA, PQFN, PSON,
SODFL, SON, and SOTFL. In addition, existing packages have been reviewed and modified with
respect to data required and/or terminology, with graphics enhanced to better illustrate the
application of that data.
Three further beneficial enhancements have also been added in this release:
Splitting of the paste mask into small fills, for packages with a large thermal pad (sized 2.1mm x
1.6mm, or larger).
For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending
under the package's body.
For small packages having a large central thermal pad (PQFP, QFN, SOIC, SOP), the peripheral pads
are trimmed to ensure required clearance between the pads, in accordance with the IPC Standard.
Where pad trimming is applied, a warning is displayed in the IPC-Compliant Footprint
Wizard, or in the report generated from the IPC-Compliant Footprints Batch Generator.
Create PCB library components compliant with IPC standard 7351B - individually, or en-masse - using the enhanced IPC-Compliant
Footprint Wizard and IPC-Compliant Footprints Batch Generator.
CAPAE
Description: Electrolytic Aluminum Capacitor
Included Packages: CAPAE
Support for CAPAE packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the CAPAE package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to CAPAE Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Lmin, Lmax
Yes
Real
Wmin, Wmax
Yes
Real
Tmin, Tmax
Yes
Real
Twmin, Twmax
Yes
Real
Amin
Optional
Real
Amax
Yes
Real
L1min, L1max
Yes
Real
Dmax,Dmin
Yes
Real
Diameter of Body
DensityLevel
Optional
L, M, N
JHmin
Optional
Real
JSmin
Optional
Real
JTmin
Optional
Real
DrawingNote
Optional
String
Name
Value Required
Format
Optional
Real
Optional
Real
Optional
Real
Pad width
Optional
Real
Pad length
Optional
Real
Optional
Real
Assembly width
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
Chip Array
Description: Chip Array
Included Packages: Chip Array, Chip Array Exposed Pad
Support for Chip Array packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the Chip Array package
in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required
information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to Chip Array Package Specifications.
Name
Value
Required
Format
Description (Dimensions in
mm)
FootprintName
Optional
String
FootprintDescription Optional
String
Emin, Emax
Yes
Real
Dmin, Dmax
Yes
Real
Bmin, Bmax
Yes
Real
B1min, B1max
Optional
Real
Lmin, Lmax
Yes
Real
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
PinCount
Yes
Integer
Pitch
Yes
Real
Pitch (e)
PackageType
Yes
Flat,Concave,ConvexE,
ConvexS
Type of packge
DensityLevel
Optional
L, M, N
JHmin
Optional
Real
JSmin
Optional
Real
JTmin
Optional
Real
DrawingNote
Optional
String
Name
Value Required
Format
Yes
Real
Optional
Real
Yes
Real
Yes
Real
Pad width
X1
Optional
Real
Yes
Real
Pad length
Yes
Real
Yes
Real
V1
Yes
Real
V2
Yes
Real
R1
Yes
Real
R2
Yes
Real
DFN
Description: Dual Flat No-lead
Included Packages: DFN
Support for DFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the DFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to DFN Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Emin, Emax
Yes
Real
Dmin, Dmax
Yes
Real
b1min, b1max
Yes
Real
L1min, L1 max
Yes
Real
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
A1min
Yes
Real
PinCount
Yes
Integer
e1
Optional
Real
Pitch (e1)
e2
Yes
Real
Pitch (e2)
Optional
Real
Pitch (e)
b2min, b2max
Yes
Real
L2min, L2max
Yes
Real
DensityLevel
Optional
L, M, N
DrawingNote
Optional
String
Name
Value Required
Format
Yes
Real
Yes
Real
Yes
Real
C1
Yes
Real
C2
Yes
Real
R1
Yes
Real
R2
Yes
Real
V1
Yes
Real
V2
Yes
Real
X1
Yes
Real
Y1
Yes
Real
X2
Yes
Real
Y2
Yes
Real
LGA
Description: Land Grid Array
Included Packages: LGA
Support for LGA packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the LGA package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to LGA Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Dmin, Dmax
Yes
Real
D1ave
Yes
Real
Emin, Emax
Yes
Real
E1ave
Yes
Real
A1min
Yes
Real
A1max
Optional
Real
A2min, A2max
Optional
Real
Amin
Optional
Real
Amax
Yes
Real
Bnom
Yes
Real
LeadShape
Yes
R,S
PitchD, PitchE
Yes
Real
GridType
Yes
P, S
MatrixType
Yes
F, P, SD, TE
Rows
Yes
Integer
Columns
Yes
Integer
Nmax
Yes
Integer
PinCount
Yes
Integer
DepopulateBalls
Optional
String
RepopulateBalls
Optional
String
DrawingNote
Optional
String
Name
Value Required
Format
Optional
Real
C1
Optional
Real
C2
Optional
Real
Optional
Real
Assembly width
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
PQFN
Description: Pulback Quad Flat No-lead
Included Packages: PQFN
Support for PQFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the PQFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PQFN Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Dmin, Dmax
Real
Yes
Emin, Emax
Yes
Real
Bmin, Bmax
Yes
Real
Lmin, Lmax
Yes
Real
Amin
Optional
Real
Minimum height
Amax
Yes
Real
Maximum height
A1min
Yes
Real
A1max
Optional
Real
L1min, L1max
Yes
Real
PinCountD
Yes
Integer
PinCountE
Yes
Integer
PitchD
Yes
Real
PitchE
Yes
Real
Pin1
Yes
S2, C1
D2min, D2max
Optional
Real
E2min, E2max
Optional
Real
DensityLevel
Optional
L, M, N
Periphery
Optional
Real
Land Periphery
DrawingNote
Optional
String
Name
Value Required
Format
ZE
Optional
Real
ZD
Optional
Real
GE
Optional
Real
GD
Optional
Real
Optional
Real
Pad width
Optional
Real
Pad length
CE
Optional
Real
CD
Optional
Real
E2t
Optional
Real
D2t
Optional
Real
L2
Optional
Real
Optional
Real
Optional
Real
Optional
Real
V1
Optional
Real
V2
Optional
Real
R1
Optional
Real
R2
Optional
Real
PSON
Description: Pulback Small Outline No-lead
Included Packages: PSON
Support for PSON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the PSON package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PSON Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Emin, Emax
Yes
Real
Dmin, Dmax
Yes
Real
D2min, D2max
Optional
Real
E2min, E2max
Optional
Real
Bmin, Bmax
Yes
Real
cmin, cmax
Optional
Real
Lmin, Lmax
Yes
Real
L1min, L1max
Optional
Real
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
A1min
Yes
Real
PinCount
Yes
Integer
Pitch
Yes
Real
Pitch (e)
AbsentPins
Optional
String
PinOrder
Optional
String
DensityLevel
Optional
L, M, N
Periphery
Optional
Real
DrawingNote
Optional
String
Name
Value
Required
Format
Yes
Real
Optional
Real
Yes
Real
Yes
Real
Pad width
Yes
Real
Pad length
E2t
Optional
Real
D2t
Optional
Real
Yes
Real
Yes
Real
V1
Yes
Real
V2
Yes
Real
R1
Yes
Real
R2
Yes
Real
ViaCountE
Optional
Integer
ViaCountD
Optional
Integer
ViaPitchE
Optional
Real
ViaPitchD
Optional
Real
Real
X2Y2_Solder Optional
Real
XY_Paste
Optional
Real
X2Y2_Paste
Optional
Real
X_Paste
Optional
Real
Y_Paste
Optional
Real
X2_Paste
Optional
Real
Y2_Paste
Optional
Real
FillCountE
Optional
Integer
FillCountD
Optional
Integer
Fill_Gap
Optional
Real
XY_Solder
Optional
SODFL
Description: Small Outline Diode, Flat Lead
Included Packages: SODFL
Support for SODFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SODFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SODFL Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Dmin, Dmax
Yes
Real
Emin, Emax
Yes
Real
E1min, E1max
Yes
Real
Bmin, Bmax
Yes
Real
Lmin, Lmax
Yes
Real
Amin, Amax
Yes
Real
Minimum height
DensityLevel
Yes
L, M, N
JHmin
Optional
Real
JSmin
Optional
Real
JTmin
Optional
Real
DrawingNote
Optional
String
Name
Value Required
Format
Optional
Real
Optional
Real
Optional
Real
Optional
Real
Pad width
Optional
Real
Pad length
X1
Optional
Real
Optional
Real
Assembly width
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length
SON
Description: Small Outline No-lead
Included Packages: SON, SON Exposed Pad
Support for SON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SON package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SON Package Specifications.
Name
Value
Required
Format
FootprintName
Optional
String
FootprintDescription Optional
String
Emin, Emax
Yes
Real
Dmin, Dmax
Yes
Real
D2min, D2max
Optional
Real
Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank
E2min, E2max
Optional
Real
Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank
Bmin, Bmax
Yes
Real
cmin, cmax
Optional
Real
Lmin, Lmax
Yes
Real
L1min, L1max
Optional
Real
Amax
Yes
Real
Maximum height
Amin
Optional
Real
Minimum height
A1max
Optional
Real
A1min
Yes
Real
PinCount
Yes
Integer
Pitch
Yes
Real
Pitch (e)
AbsentPins
Optional
String
Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present
PinOrder
Optional
String
Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package
DensityLevel
Optional
L, M, N
M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level
C)
JHmin
Optional
Real
JSmin
Optional
Real
JTmin
Optional
Real
DrawingNote
Optional
String
If package has other features that will affect the footprint, then enter details.
Name
Value
Required
Format
Yes
Real
Optional
Real
Yes
Real
Yes
Real
Pad width
Yes
Real
Pad length
E2t
Optional
Real
D2t
Optional
Real
Yes
Real
Yes
Real
V1
Yes
Real
V2
Yes
Real
R1
Yes
Real
R2
Yes
Real
ViaCountE
Optional
Integer
ViaCountD
Optional
Integer
ViaPitchE
Optional
Real
ViaPitchD
Optional
Real
XY_Solder
Optional
Real
Real
X2Y2_Solder Optional
XY_Paste
Optional
Real
X2Y2_Paste
Optional
Real
X_Paste
Optional
Real
Y_Paste
Optional
Real
X2_Paste
Optional
Real
Y2_Paste
Optional
Real
FillCountE
Optional
Integer
FillCountD
Optional
Integer
Fill_Gap
Optional
Real
SOTFL
Description: Small Outline Transistor, Flat Lead
Included Packages: 3-Leads, 5-Leads, 6-Leads
Support for SOTFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.
The following tables list the information (required and optional) when defining the SOTFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SOTFL Package Specifications.
Name
Value
Required
Format
Optional
String
FootprintDescription Optional
String
Dmin, Dmax
Yes
Real
Emin, Emax
Yes
Real
E1min, E1max
Yes
Real
PinCount
Yes
3,5
FootprintName
PinOrder
Optional
String
AbsentPins
Optional
String
Bmin, Bmax
Yes
Real
B1min, B1max
Optional
Real
cmin, cmax
Optional
Real
L1min, L1max
Optional
Real
LPmin, LPmax
Yes
Real
Pitch
Yes
Real
Pitch (e)
Amin, Amax
Yes
Real
Minimum height
DensityLevel
Yes
L, M, N
JHmin
Optional
Real
JSmin
Optional
Real
JTmin
Optional
Real
DrawingNote
Optional
String
Name
Value Required
Format
Optional
Real
Optional
Real
Optional
Real
Optional
Real
Pad width
Optional
Real
Pad length
X1
Optional
Real
Optional
Real
Assembly width
Optional
Real
Assembly length
V1
Optional
Real
Courtyard width
V2
Optional
Real
Courtyard length
R1
Optional
Real
Silkscreen width
R2
Optional
Real
Silkscreen length