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IPC-7351B Compliance

Modified by Jason Howie on 13-Nov-2014

Altium Designer 14.3 incorporates a number of additions and enhancements to both the
IPC-Compliant Footprint Wizard, and the IPC-Compliant Footprints Batch Generator. These
changes are aimed at making both truly compliant with Revision B of the IPC standard 7351 - Generic
Requirements for Surface Mount Design and Land Pattern Standard.
IPC-7351B was released in 2010 and supersedes IPC-7351A (which was released in 2007).
The following additional packages are now supported: CAPAE, CHIP ARRAY, DFN, LGA, PQFN, PSON,
SODFL, SON, and SOTFL. In addition, existing packages have been reviewed and modified with
respect to data required and/or terminology, with graphics enhanced to better illustrate the
application of that data.
Three further beneficial enhancements have also been added in this release:

Splitting of the paste mask into small fills, for packages with a large thermal pad (sized 2.1mm x
1.6mm, or larger).
For packages involving gullwing leads, pads are trimmed to prevent them from otherwise extending
under the package's body.
For small packages having a large central thermal pad (PQFP, QFN, SOIC, SOP), the peripheral pads
are trimmed to ensure required clearance between the pads, in accordance with the IPC Standard.
Where pad trimming is applied, a warning is displayed in the IPC-Compliant Footprint
Wizard, or in the report generated from the IPC-Compliant Footprints Batch Generator.

Create PCB library components compliant with IPC standard 7351B - individually, or en-masse - using the enhanced IPC-Compliant
Footprint Wizard and IPC-Compliant Footprints Batch Generator.

Newly Supported Packages


The following sections detail the new packages introduced in Altium Designer 14.3, and supported in
both the IPC-Compliant Footprint Wizard and the IPC-Compliant Footprints Batch Generator.
Previously existing packages have been modified, where necessary, to comply with the
IPC-7351B standard. Consult the legends in the underlying Excel templates (accessed from
the Open Template menu in the IPC-Compliant Footprints Batch Generator dialog), for the
current data sets for each of those packages.

CAPAE
Description: Electrolytic Aluminum Capacitor
Included Packages: CAPAE

Support for CAPAE packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the CAPAE package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to CAPAE Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Lmin, Lmax

Yes

Real

Minimum and maximum lead span

Wmin, Wmax

Yes

Real

Minimum and maximum body width

Tmin, Tmax

Yes

Real

Minimum and maximum length of lead

Twmin, Twmax

Yes

Real

Minimum and maximum width of lead

Amin

Optional

Real

Minimum component height

Amax

Yes

Real

Maximum component height

L1min, L1max

Yes

Real

Minimum and maximum body length

Dmax,Dmin

Yes

Real

Diameter of Body

DensityLevel

Optional

L, M, N

M = Most or maximum copper (density level A),


N = Nominal or median copper (density level B),
L = Least or minimum copper (density level C)

JHmin

Optional

Real

Minimum value for heel fillet

JSmin

Optional

Real

Minimum value for side fillet

JTmin

Optional

Real

Minimum value for toe fillet

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to CAPAE Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Optional

Real

Distance between pads. Measured from outside edges

Optional

Real

Distance between pads. Measured from inside edges

Optional

Real

Pad width

Optional

Real

Pad length

Optional

Real

Row spacing. Distance between pad centers

Optional

Real

Assembly width

Optional

Real

Assembly length

V1

Optional

Real

Courtyard width

V2

Optional

Real

Courtyard length

R1

Optional

Real

Silkscreen width

R2

Optional

Real

Silkscreen length

Chip Array
Description: Chip Array
Included Packages: Chip Array, Chip Array Exposed Pad

Support for Chip Array packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the Chip Array package
in an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required
information will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to Chip Array Package Specifications.

Name

Value
Required

Format

Description (Dimensions in
mm)

FootprintName

Optional

String

If blank, then auto-generated IPC


naming will be used

FootprintDescription Optional

String

If blank, then description is


auto-generated

Emin, Emax

Yes

Real

Minimum and maximum body


width

Dmin, Dmax

Yes

Real

Minimum and maximum body


length (side containing pin 1)

Bmin, Bmax

Yes

Real

Minimum and maximum lead


width

B1min, B1max

Optional

Real

Minimum and maximum corner


lead width

Lmin, Lmax

Yes

Real

Minimum and maximum lead


length

Amax

Yes

Real

Maximum height

Amin

Optional

Real

Minimum height

PinCount

Yes

Integer

Total number of pin positions


(including absent pins)

Pitch

Yes

Real

Pitch (e)

PackageType

Yes

Flat,Concave,ConvexE,
ConvexS

Type of packge

DensityLevel

Optional

L, M, N

M = Most or maximum copper


(density level A), N = Nominal or
median copper (density level B), L
= Least or minimum copper
(density level C)

JHmin

Optional

Real

Minimum value for heel fillet.

JSmin

Optional

Real

Minimum value for side fillet.

JTmin

Optional

Real

Minimum value for toe fillet.

DrawingNote

Optional

String

If package has other features that


will affect the footprint, then enter
details.

Table of data related to Chip Array Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Yes

Real

Distance between pads. Measured from outside edges

Optional

Real

Row spacing. Distance between pad centers

Yes

Real

Distance between pads. Measured from inside edges

Yes

Real

Pad width

X1

Optional

Real

Corner pad width

Yes

Real

Pad length

Yes

Real

Assembly width (E side)

Yes

Real

Assembly length (D side)

V1

Yes

Real

Courtyard width (E side)

V2

Yes

Real

Courtyard length (D side)

R1

Yes

Real

Silkscreen width (E side)

R2

Yes

Real

Silkscreen length (D side)

DFN
Description: Dual Flat No-lead
Included Packages: DFN

Support for DFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the DFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to DFN Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Emin, Emax

Yes

Real

Minimum and maximum body width

Dmin, Dmax

Yes

Real

Minimum and maximum body length (side


containing pin 1)

b1min, b1max

Yes

Real

Minimum and maximum lead width (small lead)

L1min, L1 max

Yes

Real

Minimum and maximum lead length (small lead)

Amax

Yes

Real

Maximum height

Amin

Optional

Real

Minimum height

A1max

Optional

Real

Maximum standoff height

A1min

Yes

Real

Minimum standoff height

PinCount

Yes

Integer

Total number of pin positions (2,3,4)

e1

Optional

Real

Pitch (e1)

e2

Yes

Real

Pitch (e2)

Optional

Real

Pitch (e)

b2min, b2max

Yes

Real

Minimum and maximum lead width (big lead)

L2min, L2max

Yes

Real

Minimum and maximum lead length (big lead)

DensityLevel

Optional

L, M, N

M = Most or maximum copper (density level A),


N = Nominal or median copper (density level B),
L = Least or minimum copper (density level C)

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to DFN Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Yes

Real

Assemble width (D side)

Yes

Real

Assemble length (E side)

Yes

Real

pads span betwen small one

C1

Yes

Real

pads span between big and samll one

C2

Yes

Real

distance from package center to center of big pad

R1

Yes

Real

Silkscreen width (D side)

R2

Yes

Real

Silkscreen length (E side)

V1

Yes

Real

Courtyard width (D side)

V2

Yes

Real

Courtyard length (E side)

X1

Yes

Real

Small pad width

Y1

Yes

Real

Small pad length

X2

Yes

Real

Big pad width

Y2

Yes

Real

Big pad length

LGA
Description: Land Grid Array
Included Packages: LGA

Support for LGA packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the LGA package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to LGA Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Dmin, Dmax

Yes

Real

Minimum and maximum body length along D


side (A, B, C, ...)

D1ave

Yes

Real

Average length of grid along D side

Emin, Emax

Yes

Real

Minimum and maximum body length along E


side (1, 2, 3, ...)

E1ave

Yes

Real

Average length of grid along E side

A1min

Yes

Real

Minimum standoff height

A1max

Optional

Real

Maximum standoff height

A2min, A2max

Optional

Real

Minimum and maximum body height

Amin

Optional

Real

Minimum overall height

Amax

Yes

Real

Maximum overall height

Bnom

Yes

Real

Average lead size

LeadShape

Yes

R,S

Lead shape, round or square

PitchD, PitchE

Yes

Real

Distance between ball centres, in "D" and "E"


directions

GridType

Yes

P, S

P = Plain Grid, S = Staggered Grid

MatrixType

Yes

F, P, SD, TE

F = Full Matrix, P = Perimeter, SD = Selectively


Depopulated, TE = Thermally Enhanced

Rows

Yes

Integer

Number of balls along D side (A, B, C, ...)

Columns

Yes

Integer

Number of balls along E side (1, 2, 3, ...)

Nmax

Yes

Integer

Maximum number of ball positions (Rows x


Columns)

PinCount

Yes

Integer

Number of actual balls present

DepopulateBalls

Optional

String

Ball positions removed from matrix. Example:


C5-H10,B6-B9,A1

RepopulateBalls

Optional

String

Ball positions added back into depopulated


matrix. Example: C8,D6-F9

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to LGA Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Optional

Real

Diameter of pad. If specified this overrides the calculated


value. This can be used to specify a manufacturer's
recommended pad size.

C1

Optional

Real

C2

Optional

Real

Optional

Real

Assembly width

Optional

Real

Assembly length

V1

Optional

Real

Courtyard width

V2

Optional

Real

Courtyard length

R1

Optional

Real

Silkscreen width

R2

Optional

Real

Silkscreen length

PQFN
Description: Pulback Quad Flat No-lead
Included Packages: PQFN

Support for PQFN packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the PQFN package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PQFN Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Dmin, Dmax

Real

Minimum and maximum body span on side D

Yes

Emin, Emax

Yes

Real

Minimum and maximum body span on side E

Bmin, Bmax

Yes

Real

Minimum and maximum lead width

Lmin, Lmax

Yes

Real

Minimum and maximum lead length

Amin

Optional

Real

Minimum height

Amax

Yes

Real

Maximum height

A1min

Yes

Real

Minimum standoff height

A1max

Optional

Real

Maximum standoff height

L1min, L1max

Yes

Real

Lead pull-back length

PinCountD

Yes

Integer

Number of pins on D side of package

PinCountE

Yes

Integer

Number of pins on E side of package

PitchD

Yes

Real

Distance between two adjacent pins on side D

PitchE

Yes

Real

Distance between two adjacent pins on side E

Pin1

Yes

S2, C1

Location of pin 1; S2 = corner of package. C1 =


center of package side

D2min, D2max

Optional

Real

Minimum and maximum thermal pad size on D


side. If there is no thermal pad leave this field
blank

E2min, E2max

Optional

Real

Minimum and maximum thermal pad size on E


side. If there is no thermal pad leave this field
blank

DensityLevel

Optional

L, M, N

M = Most or maximum copper (density level A), N


= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)

Periphery

Optional

Real

Land Periphery

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to PQFN Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

ZE

Optional

Real

Distance between pads. Measured from outside edges

ZD

Optional

Real

Distance between pads. Measured from outside edges

GE

Optional

Real

Distance between pads. Measured from inside edges

GD

Optional

Real

Distance between pads. Measured from inside edges

Optional

Real

Pad width

Optional

Real

Pad length

CE

Optional

Real

Row spacing. Distance between pad centers

CD

Optional

Real

Row spacing. Distance between pad centers

E2t

Optional

Real

Thermal Pad width

D2t

Optional

Real

Thermal Pad length

L2

Optional

Real

Power Bar width.

B2, B3, B4,


B5, G3, G4,
G5, G6

Optional

Real

Power Bar length. If all are blank, no power bars are


drawn.

Optional

Real

Assembly width (E side)

Optional

Real

Assembly length (D side)

V1

Optional

Real

Courtyard width (E side)

V2

Optional

Real

Courtyard length (D side)

R1

Optional

Real

Silkscreen width (E side)

R2

Optional

Real

Silkscreen length (D side)

PSON
Description: Pulback Small Outline No-lead
Included Packages: PSON

Support for PSON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the PSON package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to PSON Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Emin, Emax

Yes

Real

Minimum and maximum body width

Dmin, Dmax

Yes

Real

Minimum and maximum body length (side


containing pin 1)

D2min, D2max

Optional

Real

Minimum and maximum thermal pad size on D


side. If there is no thermal pad leave this field
blank

E2min, E2max

Optional

Real

Minimum and maximum thermal pad size on E


side. If there is no thermal pad leave this field
blank

Bmin, Bmax

Yes

Real

Minimum and maximum lead width

cmin, cmax

Optional

Real

Minimum and maximum lead height

Lmin, Lmax

Yes

Real

Minimum and maximum lead length

L1min, L1max

Optional

Real

Minimum and maximum lead pullback

Amax

Yes

Real

Maximum height

Amin

Optional

Real

Minimum height

A1max

Optional

Real

Maximum standoff height

A1min

Yes

Real

Minimum standoff height

PinCount

Yes

Integer

Total number of pin positions (including absent


pins)

Pitch

Yes

Real

Pitch (e)

AbsentPins

Optional

String

Comma separated list showing absent pins.


Example: 1,2,5. If blank all pins present

PinOrder

Optional

String

Comma separated list showing pin order. If blank


pin order is assumed sequential from 1 to
PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package

DensityLevel

Optional

L, M, N

M = Most or maximum copper (density level A), N


= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)

Periphery

Optional

Real

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to PSON Footprint Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

Yes

Real

Distance between pads. Measured from outside edges

Optional

Real

Row spacing. Distance between pad centers

Yes

Real

Distance between pads. Measured from inside edges

Yes

Real

Pad width

Yes

Real

Pad length

E2t

Optional

Real

Thermal Pad width (X2)

D2t

Optional

Real

Thermal Pad length (Y2)

Yes

Real

Assembly width (E side)

Yes

Real

Assembly length (D side)

V1

Yes

Real

Courtyard width (E side)

V2

Yes

Real

Courtyard length (D side)

R1

Yes

Real

Silkscreen width (E side)

R2

Yes

Real

Silkscreen length (D side)

ViaCountE

Optional

Integer

Number of thermal vias in the E direction

ViaCountD

Optional

Integer

Number of thermal vias in the D direction

ViaPitchE

Optional

Real

Thermal Via Pitch in the E direction

ViaPitchD

Optional

Real

Thermal Via Pitch in the D direction

Real

Peripheral Pads - Top Solder Layer. Enter expansion value


for Solder Mask. Only enter value if following
manufacturer recommendation. Otherwise leave blank

X2Y2_Solder Optional

Real

Thermal Pad - Top Solder Layer. Enter expansion value for


Solder Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank

XY_Paste

Optional

Real

Peripheral Pads - Top Paste Layer. Enter expansion value


for Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.

X2Y2_Paste

Optional

Real

Thermal Pad - Top Paste Layer. Enter expansion value for


Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.

X_Paste

Optional

Real

Peripheral Pads - Fill on Top Paste Layer. Value in X


direction.

Y_Paste

Optional

Real

Peripheral Pads - Fill on Top Paste Layer. Value in Y


direction.

X2_Paste

Optional

Real

Thermal Pad- Fill on Top Paste Layer. Value in X direction.

Y2_Paste

Optional

Real

Thermal Pad- Fill on Top Paste Layer. Value in Y direction.

FillCountE

Optional

Integer

Number of Top Paste fills placed on the thermal pad in


the E direction (No Paste Mask fills placed if blank)

FillCountD

Optional

Integer

Number of Top Paste fills placed on the thermal pad in


the D direction (No Paste Mask fills placed if blank)

Fill_Gap

Optional

Real

Gap between Top Paste fills placed on the thermal pad


(0.2mm if blank)

XY_Solder

Optional

SODFL
Description: Small Outline Diode, Flat Lead
Included Packages: SODFL

Support for SODFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SODFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SODFL Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Dmin, Dmax

Yes

Real

Minimum and maximum body length

Emin, Emax

Yes

Real

Minimum and maximum lead span

E1min, E1max

Yes

Real

Minimum and maximum body width

Bmin, Bmax

Yes

Real

Minimum and maximum width

Lmin, Lmax

Yes

Real

Minimum and maximum lead length

Amin, Amax

Yes

Real

Minimum height

DensityLevel

Yes

L, M, N

M = Most or maximum copper (density level A), N


= Nominal or median copper (density level B), L
= Least or minimum copper (density level C)

JHmin

Optional

Real

Minimum value for heel fillet

JSmin

Optional

Real

Minimum value of side fillet

JTmin

Optional

Real

Minimum value for toe fillet

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to SODFL Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Optional

Real

Distance between pads. Measured from outside edges

Optional

Real

Distance between pads. Measured from pad centre

Optional

Real

Distance between pads. Measured from inside edges

Optional

Real

Pad width

Optional

Real

Pad length

X1

Optional

Real

Pad width (large pad)

Optional

Real

Assembly width

Optional

Real

Assembly length

V1

Optional

Real

Courtyard width

V2

Optional

Real

Courtyard length

R1

Optional

Real

Silkscreen width

R2

Optional

Real

Silkscreen length

SON
Description: Small Outline No-lead
Included Packages: SON, SON Exposed Pad

Support for SON packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SON package in an
Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information will
be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SON Package Specifications.
Name

Value
Required

Format

Description (Dimensions in mm)

FootprintName

Optional

String

If blank, then auto-generated IPC naming will be used

FootprintDescription Optional

String

If blank, then description is auto-generated

Emin, Emax

Yes

Real

Minimum and maximum body width

Dmin, Dmax

Yes

Real

Minimum and maximum body length (side containing pin 1)

D2min, D2max

Optional

Real

Minimum and maximum thermal pad size on D side. If there is no thermal pad leave this field blank

E2min, E2max

Optional

Real

Minimum and maximum thermal pad size on E side. If there is no thermal pad leave this field blank

Bmin, Bmax

Yes

Real

Minimum and maximum lead width

cmin, cmax

Optional

Real

Minimum and maximum lead height

Lmin, Lmax

Yes

Real

Minimum and maximum lead length

L1min, L1max

Optional

Real

Minimum and maximum lead pullback

Amax

Yes

Real

Maximum height

Amin

Optional

Real

Minimum height

A1max

Optional

Real

Maximum standoff height

A1min

Yes

Real

Minimum standoff height

PinCount

Yes

Integer

Total number of pin positions (including absent pins)

Pitch

Yes

Real

Pitch (e)

AbsentPins

Optional

String

Comma separated list showing absent pins. Example: 1,2,5. If blank all pins present

PinOrder

Optional

String

Comma separated list showing pin order. If blank pin order is assumed sequential from 1 to PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package

DensityLevel

Optional

L, M, N

M = Most or maximum copper (density level A), N = Nominal or median copper (density level B), L = Least or minimum copper (density level
C)

JHmin

Optional

Real

Minimum value for heel fillet.

JSmin

Optional

Real

Minimum value for side fillet.

JTmin

Optional

Real

Minimum value for toe fillet.

DrawingNote

Optional

String

If package has other features that will affect the footprint, then enter details.

Table of data related to SON Footprint Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

Yes

Real

Distance between pads. Measured from outside edges

Optional

Real

Row spacing. Distance between pad centers

Yes

Real

Distance between pads. Measured from inside edges

Yes

Real

Pad width

Yes

Real

Pad length

E2t

Optional

Real

Thermal Pad width (X2)

D2t

Optional

Real

Thermal Pad length (Y2)

Yes

Real

Assembly width (E side)

Yes

Real

Assembly length (D side)

V1

Yes

Real

Courtyard width (E side)

V2

Yes

Real

Courtyard length (D side)

R1

Yes

Real

Silkscreen width (E side)

R2

Yes

Real

Silkscreen length (D side)

ViaCountE

Optional

Integer

Number of thermal vias in the E direction

ViaCountD

Optional

Integer

Number of thermal vias in the D direction

ViaPitchE

Optional

Real

Thermal Via Pitch in the E direction

ViaPitchD

Optional

Real

Thermal Via Pitch in the D direction

XY_Solder

Optional

Real

Peripheral Pads - Top Solder Layer. Enter expansion value


for Solder Mask. Only enter value if following
manufacturer recommendation. Otherwise leave blank

Real

Thermal Pad - Top Solder Layer. Enter expansion value for


Solder Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank

X2Y2_Solder Optional

XY_Paste

Optional

Real

Peripheral Pads - Top Paste Layer. Enter expansion value


for Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.

X2Y2_Paste

Optional

Real

Thermal Pad - Top Paste Layer. Enter expansion value for


Paste Mask. Only enter value if following manufacturer
recommendation. Otherwise leave blank.

X_Paste

Optional

Real

Peripheral Pads - Fill on Top Paste Layer. Value in X


direction.

Y_Paste

Optional

Real

Peripheral Pads - Fill on Top Paste Layer. Value in Y


direction.

X2_Paste

Optional

Real

Thermal Pad- Fill on Top Paste Layer. Value in X direction.

Y2_Paste

Optional

Real

Thermal Pad- Fill on Top Paste Layer. Value in Y direction.

FillCountE

Optional

Integer

Number of Top Paste fills placed on the thermal pad in


the E direction (No Paste Mask fills placed if blank)

FillCountD

Optional

Integer

Number of Top Paste fills placed on the thermal pad in


the D direction (No Paste Mask fills placed if blank)

Fill_Gap

Optional

Real

Gap between Top Paste fills placed on the thermal pad


(0.2mm if blank)

SOTFL
Description: Small Outline Transistor, Flat Lead
Included Packages: 3-Leads, 5-Leads, 6-Leads

Support for SOTFL packages, added to the IPC-Compliant Footprint Wizard and IPC-Compliant Footprints Batch Generator.

The following tables list the information (required and optional) when defining the SOTFL package in
an Excel file for use with the IPC-Compliant Footprints Batch Generator. Similar required information
will be reflected in the corresponding pages of the IPC-Compliant Footprint Wizard.
Table of data related to SOTFL Package Specifications.

Name

Value
Required

Format

Description (Dimensions in mm)

Optional

String

If blank, then auto-generated IPC naming will be


used

FootprintDescription Optional

String

If blank, then description is auto-generated

Dmin, Dmax

Yes

Real

Minimum and maximum body length

Emin, Emax

Yes

Real

Minimum and maximum lead span

E1min, E1max

Yes

Real

Minimum and maximum body width

PinCount

Yes

3,5

Total number of pin positions, not including tab

FootprintName

PinOrder

Optional

String

Comma separated list showing pin order. If blank


pin order is assumed sequential from 1 to
PinCount. Example: 8,7,6,5,4,3,2,1 will reverse
the pin order of an 8 pin package

AbsentPins

Optional

String

Comma separated list showing absent pins.


Example: 1,2,5. If blank all pins present

Bmin, Bmax

Yes

Real

Minimum and maximum width of narrow leads

B1min, B1max

Optional

Real

Minimum and maximum width of wide lead (3 pin


packages only)

cmin, cmax

Optional

Real

Minimum and maximum lead thickness

L1min, L1max

Optional

Real

Minimum and maximum lead length (from body to


end of lead)

LPmin, LPmax

Yes

Real

Minimum and maximum lead length

Pitch

Yes

Real

Pitch (e)

Amin, Amax

Yes

Real

Minimum height

DensityLevel

Yes

L, M, N

M = Most or maximum copper (density level A), N


= Nominal or median copper (density level B), L =
Least or minimum copper (density level C)

JHmin

Optional

Real

Minimum value for heel fillet

JSmin

Optional

Real

Minimum value of side fillet

JTmin

Optional

Real

Minimum value for toe fillet

DrawingNote

Optional

String

If package has other features that will affect the


footprint, then enter details.

Table of data related to SOTFL Footprint Specifications.

Name

Value Required

Format

Description (Dimensions in mm)

Optional

Real

Distance between pads. Measured from outside edges

Optional

Real

Distance between pads. Measured from pad centre

Optional

Real

Distance between pads. Measured from inside edges

Optional

Real

Pad width

Optional

Real

Pad length

X1

Optional

Real

Pad width (large pad)

Optional

Real

Assembly width

Optional

Real

Assembly length

V1

Optional

Real

Courtyard width

V2

Optional

Real

Courtyard length

R1

Optional

Real

Silkscreen width

R2

Optional

Real

Silkscreen length

Source URL: http://techdocs.altium.com/display/ADOH/IPC-7351B+Compliance

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