ZXMP S325

SDH Based Multi-Service Node Equipment

Product Description
Version 2.20

ZTE CORPORATION
NO. 55, Hi-tech Road South, ShenZhen, P.R.China
Postcode: 518057
Tel: +86-755-26771900
Fax: +86-755-26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn

LEGAL INFORMATION
Copyright © 2012 ZTE CORPORATION.
The contents of this document are protected by copyright laws and international treaties. Any reproduction or
distribution of this document or any portion of this document, in any form by any means, without the prior written
consent of ZTE CORPORATION is prohibited.

Additionally, the contents of this document are protected by

contractual confidentiality obligations.
All company, brand and product names are trade or service marks, or registered trade or service marks, of ZTE
CORPORATION or of their respective owners.
This document is provided “as is”, and all express, implied, or statutory warranties, representations or conditions
are disclaimed, including without limitation any implied warranty of merchantability, fitness for a particular purpose,
title or non-infringement. ZTE CORPORATION and its licensors shall not be liable for damages resulting from the
use of or reliance on the information contained herein.
ZTE CORPORATION or its licensors may have current or pending intellectual property rights or applications
covering the subject matter of this document. Except as expressly provided in any written license between ZTE
CORPORATION and its licensee, the user of this document shall not acquire any license to the subject matter
herein.
ZTE CORPORATION reserves the right to upgrade or make technical change to this product without further notice.
Users may visit ZTE technical support website http://ensupport.zte.com.cn to inquire related information.
The ultimate right to interpret this product resides in ZTE CORPORATION.

Revision History
Revision No.

Revision Date

Revision Reason

R1.1

2012-07-30

Updated the documentation architecture.

R1.0

2012-03-30

ZXMP S325(V2.20) Issued.

Serial Number: SJ-20120320184105-002
Publishing Date: 2012-07-30(R1.1)

SJ-20120320184105-002|2012-07-30(R1.1)

ZTE Proprietary and Confidential

Table of Contents
About This Manual ......................................................................................... I
Chapter 1 System Functions ..................................................................... 1-1
1.1 Service Functions............................................................................................... 1-1
1.1.1 Service Access Types............................................................................... 1-1
1.1.2 Service Access Capacity .......................................................................... 1-2
1.1.3 Multi-Service Functions ............................................................................ 1-2
1.2 System Control and Communication Functions .................................................... 1-3
1.3 Power Supply Function ....................................................................................... 1-4
1.4 Overhead Processing Function ........................................................................... 1-4
1.5 Timing and Synchronization Output Function ....................................................... 1-4
1.6 Alarm Input/Output Function ............................................................................... 1-5
1.7 Alarm Concatenation Function ............................................................................ 1-5
1.8 Tandem Connection Monitoring Function ............................................................. 1-5
1.9 Cross-connect Capacity...................................................................................... 1-6
1.10 Protection Function........................................................................................... 1-7
1.10.1 Equipment Level Protections ................................................................... 1-7
1.10.2 Network Level Protections....................................................................... 1-9

Chapter 2 Technical Specifications .......................................................... 2-1
2.1 Dimension and Weight........................................................................................ 2-1
2.1.1 Cabinet Dimensions and Weights .............................................................. 2-1
2.1.2 Dimensions and Weight of Components .................................................... 2-2
2.1.3 Dimensions and Weight of Boards............................................................. 2-3
2.2 Bearing Requirement of Equipment Room ........................................................... 2-8
2.3 Power Supply Requirements ............................................................................... 2-8
2.3.1 Power Supply Range................................................................................ 2-8
2.3.2 Power Consumption Specifications............................................................ 2-8
2.3.3 Power Consumptions of Typical System Configurations ............................ 2-12
2.4 Environment Requirements............................................................................... 2-14
2.4.1 Grounding Requirements ........................................................................ 2-14
2.4.2 Temperature and Humidity Requirements ................................................ 2-15
2.4.3 Cleanness Requirements........................................................................ 2-15
2.4.4 Application Environment Requirements.................................................... 2-16
2.5 EMC Requirements .......................................................................................... 2-16
I
SJ-20120320184105-002|2012-07-30(R1.1)

ZTE Proprietary and Confidential

...7.6...................................... 2-41 2...............................................6. 2-34 2..................2 Jitter and Wander Tolerance of SDH Input Interfaces ........................................ 2-25 2...................... 2-44 2................2..... 2-36 2............................6.................................... 2-19 2...................6.................................8......................... A-1 II SJ-20120320184105-002|2012-07-30(R1.............................7 Electrical Interface Specifications ............................. 2-16 2......................................... 2-23 2..............................................1) ZTE Proprietary and Confidential ....... 2-30 2.........2 EMI ..............................1 Jitter and Wander Tolerance of PDH Input Interfaces .............................. 2-43 2.......................................8..7......................5...........6 Jitter Transfer Characteristic of Regenerator ..8....11................................8........ 2-22 2......5 Extinction Ratio ......3 Reflection Attenuation of Input/Output Interfaces ..............9 Permitted Frequency Deviation of Optical Input Interfaces .....7.................6..........8........................................................................................................................8................................2 VLAN Specifications .....5.. 2-23 2.............. 2-30 2....6..................................................................6..... 2-23 2........5 Waveform of Output Interfaces ............................................................ 2-24 2.....7 Receiver Overload..................7..............................11.......................................... 2-21 2............... 2-25 2..... 2-33 2......................6......................................9 Clock Specifications ........................... 2-46 2.............................11.................8 Interface Jitter Specifications..............................1 Code Patterns of Electrical Interface..................................................................................................................... 2-42 2.................................... 2-22 2...........................12 RPR Performance Specifications... Frequency Deviation of Input Interfaces and Bit Rate Tolerance of Output Interfaces ..... 2-37 2......6.....11 Ethernet Performance Specifications .......... 2-41 2..............6 Receiver Sensitivity ................6 Optical Interface Specifications ..........................................1 Transmission Code Pattern ............................14 External Interface Standards ...................10 OA Board Specifications ..2 Optical Modules ......... 2-19 2...... 2-24 2..............................13 ATM Characteristics................... 2-23 2............................................................................................. 2-34 2..3 L2 Switching Specifications .......... 2-39 2............4 Mapping Jitter of PDH Tributary....................... 2-19 2.... 2-31 2........2 Permitted Attenuation of Input Interfaces...................4 Anti-Interference Capability of Input Interfaces .........3 Eye Diagram of Optical Transmit Signals .....................................................................7..............4 Mean Optical Launched Power.................................................................................................................10 AIS Rate of Optical Output Interfaces ........3 STM-N Interface Inherent Output Jitter .....................5 Combined Jitter........... 2-23 2......................................... 2-23 2.....6........1 EMS ...................1 Transparent Transmission Performance Specifications.............................................. 2-19 2................... 2-22 2.........8 Mean Optical Received Power ................................ 2-49 Appendix A Standards and Recommendations ........................................

............Glossary ................. I III SJ-20120320184105-002|2012-07-30(R1...........................................................................1) ZTE Proprietary and Confidential ....

IV SJ-20120320184105-002|2012-07-30(R1.1) ZTE Proprietary and Confidential .

5 Gbit/s.1) ZTE Proprietary and Confidential . I SJ-20120320184105-002|2012-07-30(R1.20) SDH Based Multi-Service Node Equipment System Description Unitrans ZXMP S325 (V2. Unitrans ZXMP S325 is a multi-service node equipment with the highest transmission rate of 2.About This Manual Purpose This manual is applicable to the Unitrans ZXMP S325 SDH based multi-service node equipment. It can apply to the access network. Intended Audience This manual is intended for: l l Planning engineer Maintenance engineer What Is in This Manual This manual contains the following chapters: Chapter Summary Chapter 1. Appendix A. Related Documentation The following documentation is related to this manual: l l l l l Unitrans ZXMP S325 (V2. System Functions Explains about the system functions.20) SDH Based Multi-Service Node Equipment Installation Manual Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Operation Instructions Conventions This document uses the following typographical conventions.20) SDH Based Multi-Service Node Equipment Hardware Description Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Maintenance Manual Unitrans ZXMP S325 (V2. Technical Specifications Discusses about the technical specifications. Chapter 2. Standards and Gives the standards and recommendations that ZXMP Recommendations S325 complies with.

option button names. could result in serious injuries. Danger: Indicates an imminently hazardous situation.Typeface Meaning Italics Variables in commands. equipment damages or interruptions of major services. check boxes. if not avoided. parameters and commands. will result in death or serious injury. function names. menu options. which if not avoided. Caution: Indicates a potential hazard that. II SJ-20120320184105-002|2012-07-30(R1. could result in moderate injuries. Note: Provides additional information about a certain topic. CAPS Keys on the keyboard and buttons on screens and company name. Bold Menus. Warning: Indicates a hazard that. equipment damages or partial service interruption. It may also refers to other related manuals and documents.1) ZTE Proprietary and Confidential . dialog box names. window names. if not avoided. drop-down lists. input fields.

..............1) ZTE Proprietary and Confidential ....................................1-1 System Control and Communication Functions ....1-5 Alarm Concatenation Function ........................ Table 1-1 ZXMP S325 Service Access Types Service Type SDH services PDH services Ethernet services ATM services Rate STM-1 (optical/electrical) 155520 kbit/s STM-4 622080 kbit/s STM-16 2488320 kbit/s E3 34368 kbit/s T3 44736 kbit/s E1 2048 kbit/s T1 1544 kbit/s FE 10 Mbit/s or 100 Mbit/s GE 1 Gbit/s ATM(STM-1) 155520 kbit/s 1-1 SJ-20120320184105-002|2012-07-30(R1............................................................................................1-7 1.........................................................................................................................................1..............................................................................1 Service Access Types Table 1-1 lists the services types supported by ZXMP S325...........1-5 Cross-connect Capacity .................................................1-4 Alarm Input/Output Function....1-3 Power Supply Function.......................Chapter 1 System Functions Table of Contents Service Functions......................................................................................................1 Service Functions 1.........................................................................................................1-4 Timing and Synchronization Output Function.......................................1-5 Tandem Connection Monitoring Function.................................1-6 Protection Function .................1-4 Overhead Processing Function .....................................................................

It provides the following interfaces listed in Table 1-3 for multi-service function.1. and ATM interface. 1-2 SJ-20120320184105-002|2012-07-30(R1. including STM-4 or STM-1 optical interfaces. 10/100 Mbit/s Ethernet interfaces.ZXMP S325 Product Description 1. ATM service and RPR service.2 Service Access Capacity The ZXMP S325 provides abundant service interfaces.1) ZTE Proprietary and Confidential . Table 1-2 Service Access Capacity of ZXMP S325 Board/Interface Number of Board Maximum Maximum Type Ports (channels Access Capacity Access Capacity per board) per Subrack per Subrack with without Board Board Protection Protection (channel) Remarks (channel) STM-16 1 5 - without Board Protection STM-4 1、2、3 or 4 13 - without Board Protection STM-1(optical) 1、2、3 or 4 26 - without Board Protection STM-1(electrical) 1 or 2 12 10 - E3/T3 3 18 15 - E1/T1 21 126 105 - 10/100 Mbps 6 36 30 - 8 48 - without Board Ethernet interface (electrical) 100 Mbps Ethernet interface Protection (optical) ATM interface 4 24 - without Board Protection GE optical 2 16 - interface GE electrical without Board Protection 2 16 interface - without Board Protection 1. E3/T3/E1/T1 PDH electrical interfaces.1. Table 1-2 lists the ZXMP S325 service access capability. STM-1 electrical interface.3 Multi-Service Functions The ZXMP S325 can process Ethernet service.

and DCCr+m. and supporting the selection of DCCr. including DCC bytes in the regenerator section (DCCr) and DCC bytes in the multiplex section (DCCm). DCCm. it reports to SMCC (Subnet Management Control Center) the alarm and performance information of this NE and of the subnet which the NE 1-3 SJ-20120320184105-002|2012-07-30(R1.Chapter 1 System Functions Table 1-3 Multi-service Interfaces Provided by the ZXMP S325 Interface Type FE optical Processing Interface Board Connector Board Maximum Board ID ID Type Integration Access Capacity (channel per per Subrack board) (channel) 4 24 2 16 6 36 SFEx6、SED interface OIS1x4 、 LC/PC OIS1x6 TFEx8 EIFEx4 、 EITFEx6 FE electrical interface SFEx6、SED EIFEx4、EIFEx6 TFEx8 EIFEx4 、 RJ45 48 EITFEx6 ATM service AP1x4 OIS1x4 LC/PC 4 24 RSEB、SED - LC/PC 2 16 SED - RJ45 2 16 optical interface GE optical interface GE electrical interface 1. Through the Qx interface.1) ZTE Proprietary and Confidential . Exchanging network management information between NEs through the embedded control channel (ECC). l l Implementing the connection of orderwire phones between NEs through the section overhead bytes E1 and E2 in the SDH frame.2 System Control and Communication Functions The system control and communication functions are carried out by the NCP board. The DCC carries communication data between NEs. The functions include: l l Sending configuration commands to MCUs and collecting their performance and alarm information. Note: The ECC provides the function of transmitting network maintenance information through the data communication channel (DCC) which is the physical layer of ECC.

The overhead can be configured to any port as required by the EMS. 1. and receives commands and configurations sent from the SMCC to the NE and subnet. the EMS will report alarm. including: clock source selection. Optical line boards separate section overheads from payload in SDH data frame and integrate these overheads into an overhead bus. and clock exporting.3 Power Supply Function Power supply for the subracks of the ZXMP S325 is supplied by the power boards. 1. and NCP board) read or insert corresponding overhead bytes from or to the overhead bus.4 Overhead Processing Function The overhead processing function of ZXMP S325 is performed by NCP board and optical line boards. Fan speed can be set to “half” or “full” in the EMS. The OCS16 board or OCS4 board performs timing and synchronization functions. 1. l Clock source selection There are multiple ways to get the clock source.5 Timing and Synchronization Output Function The master-slave synchronization mode is adopted between ZXMP S325 equipments.ZXMP S325 Product Description l l belongs to. including: à Tracing external timing reference à Locking onto a line clock in a certain direction à Locking onto the internal clock The system allows configuring ten line clock sources and two external clock sources at the same time. Monitoring the board-in-position status and over/under-voltage of the power supply board. The Qx interface works for communication between NE and SMCC. If the fan stops running when equipment is working. Detecting fan status of the NE.1) ZTE Proprietary and Confidential . Each subrack is equipped with two power supply boards (PWRA) for 1+1 protection. optical line board. l Clock source switching The clock source switching occurs under any of the following three cases: à The current clock source is lost 1-4 SJ-20120320184105-002|2012-07-30(R1. clock source switching. Distributed power supply mode is employed in the ZXMP S325 to supply power to each subrack separately. All the boards (including OCS4 board. The ZXMP S325 supports the overhead cross-connect function.

The equipment can access at most four channels of external alarms to detect the alarms of fans.e.Chapter 1 System Functions à A clock source of higher quality level recovers à The current clock source deteriorates The system clock supports the synchronous priority switching and SSM algorithm-based automatic switching. access control. and ambient temperature.7 Alarm Concatenation Function The ZXMP S325 supports the function of alarm concatenation. and the corresponding physical interface is provided by the SAIA or SAIB board. the alarm output interface) can directly connect to that of another ZXMP S325 subrack to implement alarm concatenation of multiple ZXMP S325 equipments. and minor alarm signals to the column head cabinet in the equipment room. l Alarm output interface The ZXMP S325 supports two channels of alarm output. 1. reduce the difficulty of synchronization planning. major alarm. The equipment outputs the alarm signal via the touch point switch. the application of SSM algorithm-based automatic switching can optimize the timing and synchronization distribution of the network.1) ZTE Proprietary and Confidential . thus ensuring the optimal network synchronization. l Clock exporting ZXMP S325 supports the export of two channels of 2 Mbit/s or 2 MHz external reference clock signals. and outputs the alarm ringing signals. 1. critical alarm. and the corresponding physical interface is provided by the SAIA or SAIB board. and avoid timing loops. The subrack alarm concatenation output interface (i. and the corresponding physical interface is provided by the SAIA board or SAIB board. In complex networks. 1-5 SJ-20120320184105-002|2012-07-30(R1. The output interface of external reference clock is supplied by SAIA or SAIB board (system auxiliary interface board).6 Alarm Input/Output Function l External alarm input interface The ZXMP S325 supports the function of external alarm Boolean value input. 1.8 Tandem Connection Monitoring Function The OCS16 or OCS4 board of ZXMP S325 supports the newly added HP-TCM (Higher-order Path Tandem Connection Monitoring) function.

and add/drop modes are subsets of the cross-connect function. Tandem connection mainly applies to inter-office communication. 1. It can also be implemented through forming a direct service route through NE A without establishing another line between T1 and T2 or adding equipment. Configured with OCS4 board. broadcast.707 Recommendation. ZXMP S325 can implement higher-order cross-connect of 128×128 VC-4.1) ZTE Proprietary and Confidential . the inter-interface services can be cross-connected in any form. TU-3. they implement protection switching via cross-connect matrix. Configured with OCS16 board. Figure 1-1 Interfaces of the ZXMP S325 DXC Equipment As shown in Figure 1-2. and lower-order cross-connect of 32×32 VC-4. ZXMP S325 can implement higher-order cross-connection of 64×64 VC-4. In addition. and cross-connect of services.ZXMP S325 Product Description As specified in ITU-T G. add/drop. and lower-order cross-connect of 32×32 VC-4. both the tributary electrical interfaces and optical line interfaces are connected to the cross-connect network and their connections are equivalent. Therefore.9 Cross-connect Capacity Optical line boards and/or electrical tributary boards of ZXMP S325 can cross-connect signals at AU-4. In the equipment. the service interworking between the NE T1 and NE T2 can be achieved on the backbone network through NE A. The pass-through. OCS16 or OCS4 board of ZXMP S325 can perform the functions of a DXC (Digital Cross Connect) equipment to implement the pass-through. TU-12. the tandem connection layer locates between the multiplex section and the path section. as illustrated in Figure 1-1. broadcast. This function is implemented by N1 higher-order path overhead byte. 1-6 SJ-20120320184105-002|2012-07-30(R1. especially at the border between different network carriers. It can detect the number of B3 block errors received in a carrier’s networks and the number of B3 block errors transferred to next carrier’s network. and TU-11 levels.

10 Protection Function 1. The external power supply 1+1 protection ensures that the equipment operates normally when either power group fails.1) ZTE Proprietary and Confidential . l Inside-cabinet power protection Each subrack of the ZXMP S325 can be configured with two power supply boards. Cross-connect Protection and Clock Protection Configured with one active OCS16 or OCS4 board and one standby OCS16 or OCS4 board. the system can control the switching between the two OCS16 or OCS4 boards automatically. In case of fault. When the active or standby power supply fails.1 Equipment Level Protections Power Protection l Out-of-cabinet power protection Two groups of -48 V power supplies in the equipment room are connected to the ZXMP S325 equipment. and they are both in position and work normally. 1. The power distribution box can provide up to 12 channels of power supply to the subrack. At most six groups of active/standby power supply can be provided. each two channels as a group. The two OCS16 or OCS4 boards can work in 1+1 hot backup mode. only the clock of the active OCS16 or OCS4 board is 1-7 SJ-20120320184105-002|2012-07-30(R1. The ZXMP S325 can also be equipped with one OCS16 or OCS4 board. connected to the active power supply and the standby power supply respectively for 1+1 protection. When configured with one active and one standby OCS16 or OCS4 boards.10. Each group can provide power supply in the active/standby mode.Chapter 1 System Functions Figure 1-2 Application of Cross-Connect between Tributaries The cross-connect function of ZXMP S325 also supports network maintenance and test during networking and operation. the power alarm will be reported to the EMS. ZXMP S325 can implement the 1+1 protection for cross-connect and clock.

1-8 SJ-20120320184105-002|2012-07-30(R1. the system can implement at most 1:5 tributary protection. 1:N (N≤5) protection for FE service processor board. and 1:N (N≤5) protection for E3/T3/STM-1 electrical service processor board. while the standby board slot has two choices: à The standby board can choose any slot among the six tributary slots Using this method. i. the system can implement at most 1:6 tributary protection. The system can support at most two groups of 1:N protections. The active board can choose any slot among the six tributary board slots. one subrack does not simultaneously support two groups of 1:N protections for E1 service processor board. the interface board slot corresponding to the standby board slot need to be configured with the BIE1x21 board (E1/T1 electrical interface bridge board). The standby board can choose slot 5/6.1) ZTE Proprietary and Confidential . while the protection for E3/T3/STM-1 (electrical) service processor board belongs to another protection type. the clock is switched to the other OCS16 or OCS4 board. it supports 1:N protection for E1 service processor board and for E3 service processor board simultaneously. l 1:N protection for E1/T1 service processor board The ZXMP S325 can support at most 1:6 protection for E1/T1 service processor board. but cannot simultaneously support multiple groups of service protections with the same protection type. meanwhile. there is no need to install the BIE1x21 board. The standby board can only occupy slot 1. 1:N Protection for Electrical Service Processor Boards ZXMP S325 can implement the 1:N (N≤6) protection for E1/T1 service processor board.ZXMP S325 Product Description exported to the motherboard.e. however. à The standby board can choose the dedicated slot for E1/T1 standby board Using this method. the first slot of the six tributary board slots. If one OCS16 or OCS4 board fails. For example. l 1:N protection for FE service processor board The ZXMP S325 can support at most 1:5 protection for FE service processor board. l 1:N protection for E3/T3/STM-1 (electrical) service processor board The ZXMP S325 can support at most 1:5 protection for E3/T3/STM-1 (electrical) service processor board. One ZXMP S325 subrack can simultaneously support two groups of protections with different protection types. Note: The protection for E1/T1/FE service processor board belongs to the same protection type. meanwhile.

and SNC (N) which is subnet connection protection with no interfered monitoring.Chapter 1 System Functions 1. including SNC (I) which is subnet connection protection with inherent monitoring.1) ZTE Proprietary and Confidential .10.2 Network Level Protections ZXMP S325 supports the following network protection modes: l l l l l l l l l MS chain 1+1 protection MS chain 1:1 protection 2-fiber unidirectional path protection ring 2-fiber bidirectional path protection ring 2-fiber bidirectional MS protection ring with extra service 2-fiber bidirectional MS protection ring without extra service STM-4/STM-16 4-fiber bidirectional MS protection ring DNI (Dual Node Interconnection) protection Subnet Connection Protection (SNCP). 1-9 SJ-20120320184105-002|2012-07-30(R1.

1) ZTE Proprietary and Confidential . 1-10 SJ-20120320184105-002|2012-07-30(R1.ZXMP S325 Product Description This page intentionally left blank.

. you can mount a top box on the top of the cabinet.................................................................................................................................................................. Figure 2-1 illustrates the outline dimensions of the 300 mm-deep cabinet........................................................................................2-49 2.....................................................................................................................................................2-8 Environment Requirements ...1) ZTE Proprietary and Confidential .............2-30 Clock Specifications ..................1 Dimension and Weight 2................................... If a 2600 mm-high cabinet is required on site.2-1 Bearing Requirement of Equipment Room....................................................................................................................................................................................................2-39 Ethernet Performance Specifications.........2-46 External Interface Standards ....................... Table 2-1 Dimensions and Weights of ZXMP S325 Cabinets • • Dimensions (Height × Width × Depth) (Unit: mm) Weight (Unit: kg) 2000 × 600 × 300 59 2200 × 600 × 300 65 The weight refers to the weight of an empty cabinet...............................1.......................................2-8 Power Supply Requirements .........2-23 Interface Jitter Specifications...............................................................................................................................................................Chapter 2 Technical Specifications Table of Contents Dimension and Weight ...1 Cabinet Dimensions and Weights Table 2-1 describes dimensions and weights of ZXMP S325 cabinets..................................................2-37 OA Board Specifications.2-44 ATM Characteristics ............................................................................................ 2-1 SJ-20120320184105-002|2012-07-30(R1............2-14 EMC Requirements ...............................2-41 RPR Performance Specifications........................2-16 Optical Interface Specifications ............................2-19 Electrical Interface Specifications ........................

ZXMP S325 Product Description Figure 2-1 Dimensions of ZTE Transmission Equipment Cabinet (300 mm Deep) 2.2 Dimensions and Weight of Components The dimensions and weights of the ZXMP S325 components are listed in Table 2-2.1) ZTE Proprietary and Confidential . 2-2 SJ-20120320184105-002|2012-07-30(R1.1.

50 - 88.0 5.6 × 75.00 Weight of an empty Depth) (Unit: mm) ZXMP unified 300 mm deep 2000 × 600 × 300 cabinet cabinet 2200 × 600 × 300 65. box components ZXMP S325 subrack fan plug-in box.00 - Lightning-proof unit 43.0 × 240.00 With electronic components AC power lightning protection 88.0 2.6 × 269.5 × 482.7 × 436.20 - Outdoor Power cabinet 800 × 600 × 600 51.5 7.50 - Fan box PCB:90 × 79 × 1.Chapter 2 Technical Specifications Table 2-2 Dimensions and Weights of ZXMP S325 Components Component Dimensions (Height × Width × Weight (Unit: kg) Remarks 59.8 2. dustproof unit) Power distribution box 132.1 × 279.6 × 270 9.6 × 253 Accounted in - subrack weight 2.1 × 482.80 - 221.0 × 197.1) ZTE Proprietary and Confidential .5 × 495.0 2.7 × 445.1 × 482.1.5 × 139.8 × 230.00 Includes motherboard.00 Weight of an empty cabinet Transmission multifunctional 752 × 608 × 520 52. 2-3 SJ-20120320184105-002|2012-07-30(R1.4 × 4.8 Dustproof unit 13.5 × 482.3 Dimensions and Weight of Boards The dimensions and weight of boards of ZXMP S325 are listed in Table 2-3.6 0.00 - Wall-mounted subrack 245 × 512 × 255 3.50 - Motherboard 214.00 - Desktop installation 244.6 × 75.00 - Rectifier unit 43.52 Includes structural unit DC power lightning protection unit parts and hardware Size after assembly: circuits 21.6 × 244.6 × 438.0 2.5 1.

690 (depth) Front panel: 25 (height) ×74 (width) FAN Fan board PCB: 90 (height) ×79 (width) × 1.5 (height) ×25.6 0. and (thickness) synchronous-clock Front panel: 181. PCB: 160 (height) ×210 (depth) ×2 cross-connect.130 0.4 board (width) STM-16 optical line.520 (thickness) Size after assembly: 21.6 (width) × 244.485 0.160 0.465 (width) STM-1) OL1/4x4 ( 2x 0.4 (width) SAIA SAIB PWRA System auxiliary PCB: 160 (height) ×80 (depth) ×2 interface board (type (thickness) A) Front panel: none System auxiliary PCB: 160 (height) ×80 (depth) ×2 interface board (type (thickness) B) Front panel: none Power supply board PCB: 2 (height) ×72 (width) ×170 0.5 (height) × 139.5 (height) ×25.460 0.4 board (width) OL1/4x4 ( 4x 4-channel STM- PCB: 160 (height) ×210 (depth) ×2 STM-1) 1/STM-4 optical line (thickness) board Front panel: 181.ZXMP S325 Product Description Table 2-3 Dimensions and Weight of Boards Board ID Board Name Dimension (mm) Weight (kg) NCP NE control processor PCB: 160 (height) ×210 (depth) ×2 0.5 (height) ×25.425 STM-1) 2-4 SJ-20120320184105-002|2012-07-30(R1.160 (depth) Front panel: 25 (height) ×74 (width) PWRB Power supply board PCB: 2 (height ) ×72 (width) ×170 0.550 0.4 OL1/4x4 ( 3x 0.5 (height) ×25.1) ZTE Proprietary and Confidential .430 (thickness) Front panel: 181.445 STM-1) OL1/4x4 ( 1x 0.8 (depth) OCS4 OCS16 STM-1/4 optical line. and (thickness) synchronous-clock Front panel: 181. PCB: 160 (height) ×210 (depth) ×2 cross-connect.

125 0.5 (height) ×25.465 STM-4) 0.375 Front panel: 181.4 (width) OIS1x1 LP1x2 1-channel STM-1 PCB: 160 (height) ×80 (depth) ×2 optical interface (thickness) board Front panel: none 2-channel STM-1 line PCB: 160 (height) ×210 (depth) ×2 processor (thickness) 0.4 (width) 2-5 SJ-20120320184105-002|2012-07-30(R1.4 (width) LP1x1 1-channel STM-1 line PCB: 160 (height) ×210 (depth) ×2 processor (thickness) 0.380 Front panel: 181.485 STM-4) OL1/4x4 ( 3x 0.Chapter 2 Technical Specifications Board ID Board Name Dimension (mm) OL1/4x4 ( 4x Weight (kg) 0.445 OL1/4x4 ( 2x STM-4) OL1/4x4 ( 1x 0.5 (height) ×25.410 Front panel: 181.125 0.355 Front panel: 181.425 STM-4) OL16x1 1-channel STM-16 PCB: 160 (height) ×210 (depth) ×2 optical line board (thickness) 0.145 0.360 Front panel: 181.5 (height) ×25.5 (height )×25.4 (width) OIS1x2 LP4x1 2-channel STM-1 PCB: 160 (height) ×80 (depth) ×2 optical interface (thickness) board Front panel: none 1-channel STM-4 line PCB: 160 (height) ×210 (depth) ×2 processor (thickness) 0.5 (height )×25.4 (width) OIS4x1 LP4x2 1-channel STM-4 PCB: 160 (height) ×80 (depth) ×2 optical interface (thickness) board Front panel: none 2-channel STM-4 line PCB: 160 (height) ×210 (depth) ×2 processor (thickness) 0.1) ZTE Proprietary and Confidential .

105 Front panel: none ESS1x2 EPE1x21(75) EPE1x21(120) 2-channel STM-1 PCB: 160 (height) ×80 (depth) ×2 electrical interface (thickness) switching board Front panel: none 21-channel E1 PCB: 160 (height) ×210 (depth) ×2 electrical processor (thickness) 0.250 0.490 Front panel: 181.420 Front panel: 181.5 (height) ×25.185 0.1) ZTE Proprietary and Confidential .5 (height) ×25.4 (width) BIS1 STM-1 bridge PCB: 160 (height) ×80 (depth) ×2 interface board (thickness) 0.4 (width) OBA14 Optical booster PCB: 160 (height) ×210 (depth) ×2 amplifier OBA14 (thickness) 0.4 (width) BIE1x21 21-channel E1/T1 PCB: 160 (height) ×80 (depth) ×2 bridge interface (thickness) board Front panel: none 0.490 Front panel: 181.5 (height) ×25.ZXMP S325 Product Description Board ID Board Name Dimension (mm) Weight (kg) OIS4x2 2-channel STM-4 PCB: 160 (height) ×80 (depth) ×2 0.4 (width) EPT1x21 21-channel T1 PCB: 160 (height) ×210 (depth) ×2 electrical processor (thickness) 0.145 optical interface (thickness) board Front panel: none 4-channel STM-1 PCB: 160 (height) ×80 (depth) ×2 optical interface (thickness) board Front panel: none 6-channel STM-1 PCB: 160 (height) ×80 (depth) ×2 optical interface (thickness) board Front panel: none Optical booster PCB: 160 (height) ×210 (depth) ×2 amplifier OBA12 (thickness) OIS1x4 OIS1x6 OBA12 0.4 (width) EP1EBx21 21-channel E1/T1 PCB: 160 (height) ×210 (depth) ×2 electrical processor (thickness) 0.5 (height) ×25.420 Front panel: 181.090 2-6 SJ-20120320184105-002|2012-07-30(R1.400 Front panel: 181.5 (height) ×25.140 0.

400 Front panel: 181.140 0.115 0.090 Front panel: none AP1x4 ATM processor with PCB: 160 (height) ×210 (depth) ×2 4 STM-1 ports (thickness) 0.5 (height) ×25.145 0.190 (width) BIFE Bridge interface PCB: 160 (height) ×80 (depth) ×2 board of fast Ethernet (thickness) 0.4 (width) BIE3x3 ESE3x3 SFEx6(PPP) SFEx6(GFP) 3-channel E3/T3 PCB: 160 (height) ×80 (depth) ×2 electrical bridge (thickness) interface board Front panel: none 3-channel E3/T3 PCB: 160 (height) ×80 (depth) ×2 electrical interface (thickness) switching board Front panel: none Smart fast Ethernet PCB: 160 (height) ×210 (depth) ×2 board (thickness) 0.5 (height) ×25.4 (width) EIFEx4 EIFEx6 EITFEx6 4-channel electrical PCB: 160 (height) ×80 (depth) ×2 interface board of (thickness) fast Ethernet Front panel: none 6-channel electrical PCB: 160 (height) ×80 (depth) ×2 interface board of (thickness) fast Ethernet Front panel: none 6-channel switching PCB: 160 (height) ×210 (depth) ×2 board of smart and (thickness) fast Ethernet Front panel: 181.430 Front panel: 181.160 electrical interface (thickness) switching board (75 Front panel: none Ω) ESE1x21(120) 21-channel E1/T1 electrical interface switching board EP3x3 3-channel E3/T3 PCB: 160 (height) ×210 (depth) ×2 electrical processor (thickness) 0.4 (width) 2-7 SJ-20120320184105-002|2012-07-30(R1.4 0.1) ZTE Proprietary and Confidential .Chapter 2 Technical Specifications Board ID Board Name Dimension (mm) Weight (kg) ESE1x21(75) 21-channel E1 PCB: 160 (height) ×80 (depth) ×2 0.150 0.5 (height) ×25.5 (height) ×25.430 Front panel: 181.

3.3 Power Supply Requirements 2.3. 2.22 The impedance of interface board clock input/ output interface is 75 Ω 2-8 SJ-20120320184105-002|2012-07-30(R1.380 (width) 2.5 (height) ×25.1) ZTE Proprietary and Confidential .1 Power Supply Range Rated working voltage of ZXMP S325: -48 V DC Range: -40 V DC to -57 V DC 2.50 - SAIA System auxiliary 2. It is less than 250 W with full configuration.5 (height) ×25.16 2.4 0.ZXMP S325 Product Description Board ID Board Name Dimension (mm) Weight (kg) RSEB Ethernet processor PCB: 160 (height) ×210 (depth) ×2 0. Table 2-4 Power Consumptions of Boards in ZXMP S325 Board ID Board Name Max Power Max Power Consumption Consumption (45 (25 Cº) (W) Cº) (W) Remarks NCP NE control processor 4. The power consumption of the whole system depends on system configuration.4 (width) SED Enhanced smart PCB: 160 (height) ×210 (depth) ×2 Ethernet board (thickness) 0. the bearing of the equipment room should be greater than 450 kg/m2.5 (height) ×25.4 (width) TFEx8 8-channel PCB: 160 (height) ×210 (depth) ×2 transparent board (thickness) of fast Ethernet Front panel: 181.2 Bearing Requirement of Equipment Room When only ZXMP S325 is taken into consideration.37 4.2 Power Consumption Specifications Table 2-4 lists power consumptions and weights of boards in the ZXMP S325.640 Front panel: 181.735 with RPR function (thickness) Front panel: 181.

94 - 5.34 - 8.56 6.71 7.60 9.28 - - SFP optical module 0.80 16. and synchronous clock board OCS16 STM-16 optical line.04 10.00 3. and synchronous clock board OL1/4x4 ( 4x 4-channel STM- STM-1) 1/STM-4 optical line OL1/4x4 ( 3x board STM-1) OL1/4x4 ( 2x STM-1) OL1/4x4 ( 1x STM-1) OL1/4x4 ( 4x STM-4) OL1/4x4 ( 3x STM-4) OL1/4x4 ( 2x STM-4) OL1/4x4 ( 1x STM-4) OL16x1 1-channel STM-16 optical line board 2-9 SJ-20120320184105-002|2012-07-30(R1.95 17.94 - 6.60 - board PWRB +24 V power supply board FAN Fan board 8.66 STM-1 application 16.95 - 11.11 14.1) ZTE Proprietary and Confidential .39 - cross-connect.00 interface board Remarks The impedance of clock input/ output interface is 120 Ω PWRA -48 V power supply 3. cross-connect.82 - OCS4 STM-4 optical line.89 - 7.04 8.76 12.11 - 10. 16.80 0.97 1.78 5.17 16.Chapter 2 Technical Specifications Board ID SAIB Board Name System auxiliary Max Power Max Power Consumption Consumption (45 (25 Cº) (W) Cº) (W) 0.51 - 9.57 - 6.46 STM-4 application 20.32 8.76 - 14.88 21.09 - 15.74 6.

14 Provides optical optical interface board interface for SED board OBA12 Optical booster amplifier 3.26 (4.62) 2.16 2.22 Remarks - 1-channel STM-1 optical interface board LP1x2 OIS1x2 - 2-channel STM-1 optical interface board LP4x1 OIS4x1 - 1-channel STM-4 optical interface board LP4x2 OIS4x2 - 2-channel STM-4 optical interface board OIS1x4 4-channel STM-1 Provides optical optical interface board interface for SFEx6.45 (LP4x2 and processor OIS4x2) OIS4x2) 2.51 (LP4x1 and processor OIS4x1) OIS4x1) 2-channel STM-4 line 13.ZXMP S325 Product Description Board ID LP1x1 OIS1x1 Board Name Max Power Max Power Consumption Consumption (45 (25 Cº) (W) Cº) (W) 1-channel STM-1 line 5.98 8.75 (LP1x1 and 5.94 Use EDFA module with OBA14 BIS1 STM-1 interface bridge no cooling 2.05 3.1) ZTE Proprietary and Confidential .20 (4.59 2. RSEB.26 (LP4x1 and 8.06 (LP4x2 and 13. AP1x4 boards OIS1x6 6-channel STM-1 3.98 Use EDFA module with OBA12 OBA14 Optical booster amplifier no cooling 4.67 - 2.17 (LP1x2 and processor OIS1x2) OIS1x2) 1-channel STM-4 line 8.96 (LP1x2 and 7.76) The numbers in board ESS1x2 2-channel STM-1 electrical interface parentheses are switching board consumptions after switching 2-10 SJ-20120320184105-002|2012-07-30(R1.94 9.92 (LP1x1 and processor OIS1x1) OIS1x1) 2-channel STM-1 line 6.

10 6.13) 2.39 7.54 20.29) 0.30 The interface impedance is 120 Ω EPT1x21 21-channel T1 electrical 6.25) The numbers in electrical processor BIE3x3 3-channel E3/T3 electrical interface bridge board ESE3x3 3-channel E3/T3 electrical interface parentheses are switching board consumptions after switching SFEx6(PPP) SFEx6(GFP) Smart fast Ethernet board 19.13 (4.51 (6.61 - 0 0 Has no active devices electrical processor BIE1x21 21-channel E1/T1 interface bridge board and consumption can be ignored ESE1x21(75) 21-channel E1 electrical 0.28 The interface processor impedance is 100 Ω EP1EBx21 21-channel E1/T1 7.00 3.19 (4.91 - 2-11 SJ-20120320184105-002|2012-07-30(R1.50 (6.48) The interface interface switching impedance is 75 Ω board The numbers in parentheses are consumptions after switching ESE1x21(120) 21-channel E1/T1 The interface electrical interface impedance is 120 switching board Ω or 100 Ω The numbers in parentheses are consumptions after switching EP3x3 3-channel E3/T3 6.1) ZTE Proprietary and Confidential .17 - 3.12 6.27 21.Chapter 2 Technical Specifications Board ID EPE1x21(75) Board Name 21-channel E1 electrical Max Power Max Power Consumption Consumption (45 (25 Cº) (W) Cº) (W) 4.55 The interface processor EPE1x21(120) Remarks impedance is 75 Ω 6.09 - 2.13 - 21.42 4.96 7.

47 (3. optical line boards.43 (2.44 (2.ZXMP S325 Product Description Board ID Board Name EIFEx4 4-channel Ethernet Max Power Max Power Consumption Consumption (45 (25 Cº) (W) Cº) (W) 0. and optical interface boards include the weights of SFP modules.63 - 20. Board/Part Unit Quantity 1 NCP Piece 1 2 SAIA Piece 1 3 PWRA Piece 1 4 OCS4 (S-4. the power capacity provided by the equipment should be 1.N.00) board The value in the parentheses is the value after handover BIFE Ethernet interface 0 0 bridge board Has no active devices and consumption can be ignored AP1x4 4-channel ATM 16.88 21.3 Power Consumptions of Typical System Configurations Table 2-5.52 17.5 to 1. 2.80 17. The refore.90) 0.46 (2. OCS16.28) 0.65 - processor RSEB Ethernet Processor with RPR Function SED Enhanced smart Ethernet board TFEx8 8-channel fast Ethernet transparent transmission board • • The weights of OCS4.02 - 26.1) ZTE Proprietary and Confidential .3.35) Remarks The numbers in electrical interface parentheses are board consumptions after switching EIFEx6 6-channel Ethernet EITFEx6 0.83 27.51 - 16. Table 2-5 ZXMP S325 Power Consumptions (Typical Configuration 1) S. Table 2-6 and Table 2-7 list the power consumptions of three typical ZXMP S325 configurations.1) Piece 2 2-12 SJ-20120320184105-002|2012-07-30(R1. Power consumptions of boards shall be higher during equipment startup and in low temperature environment.05 0.8 times the power consumptions listed in the table.05 Provides electrical electrical interface interface for SED board board 6-channel FE handover 0.

N. Board/Part Unit Quantity 1 NCP Piece 1 2 SAIA Piece 1 3 PWRA Piece 2 4 OCS16 Piece 2 5 OL1/4x4 (4xS-1.23W 2-13 SJ-20120320184105-002|2012-07-30(R1.1.Chapter 2 Technical Specifications S.LC) Piece 2 7 EPE1x21 (75) Piece 2 8 ESE1x21 (75) Piece 2 9 SED Piece 2 10 EIFEx6 Piece 2 11 FAN Piece 2 12 3U power distribution box Set 1 13 ZJ-Front (Front fixed Set 1 subrack including MB and fan) 14 Tested Power Consumption: 124.1) ZTE Proprietary and Confidential .1.38W Table 2-6 ZXMP S325 Power Consumptions (Typical Configuration 2) S.LC) Piece 2 6 OL1/4x4 (4xS-4.1) Piece 2 7 EPE1x21 (75) Piece 2 8 ESE1x21 (75) Piece 2 9 SFEx6 (GFP) Piece 1 10 EIFEx4 Piece 1 11 FAN Piece 2 12 3U power distribution box Set 1 13 ZJ-Front (Front fixed Set 1 subrack including MB and fan) 14 Tested Power Consumption: 109. Board/Part Unit Quantity 5 LP4×1 Piece 2 6 OIS4x1 (S-4.N.

the ground resistance should meet the following requirements: à The ground resistance: ≤ 1 Ω. the grounding resistance should meet the following requirements: à The ground resistance of -48 V GND: ≤ 4 Ω.1) ZTE Proprietary and Confidential .ZXMP S325 Product Description Table 2-7 ZXMP S325 Power Consumptions (Typical Configuration 3) S.1.26 W 2. à The ground resistance of the lightning protection ground: ≤ 3 Ω. the system working ground. à The voltage differences among the lightning protection ground. Board/Part Unit Quantity 1 NCP Piece 1 2 SAIA Piece 1 3 PWRA Piece 2 4 OCS16 Piece 2 5 OL16 (L-16.LC) Piece 1 8 EPE1x21 (75) Piece 2 9 ESE1x21 (75) Piece 2 10 SED Piece 1 11 EIFEx6 Piece 1 12 FAN Piece 2 13 3U power distribution box Set 1 14 ZJ-Front (Front fixed Set 1 subrack including MB and fan) 15 Tested Power Consumption: 160.LC) Piece 3 6 OL1/4x4 (4xS-1. 2-14 SJ-20120320184105-002|2012-07-30(R1. à The ground resistance of the system working ground: ≤ 1 Ω.N.2.4. If combined grounding is employed in the equipment room.1 Grounding Requirements l l If separate grounding is adopted in the equipment room. and the -48 V GND should be less than 1 V.4 Environment Requirements 2.LC) Piece 1 7 OL1/4x4 (4xS-4.1.

030 NO2 0. the temperature and humidity are measured at 1. The detailed information are listed in Table 2-9.15 NH3 0.05 0. The density of dust particles with the diameter greater than 5µm is no more than 3×104 particles/m3.2 1.4 m near the equipment. such as SO2. conductive.5 m above the floor and 0.1) ZTE Proprietary and Confidential .15 Cl2 0. There should be no corrosive metal or insulation-destructive gas in the equipment. Table 2-9 Density Limit of Hazardous Gases in the Equipment l Gas Average (mg/m3) Maximum (mg/m3) SO2 0. with doors and windows tightly sealed. NO2.2 Temperature and Humidity Requirements The requirements regarding the working temperature and relative humidity of the ZXMP S325 are given in Table 2-8.006 0. H2S.4.30 The equipment room should be always kept clean.4.04 0. Table 2-8 Temperature/Humidity Requirements Index Specification Working Temperature (inside desktop.01 0.3 Cleanness Requirements Cleanness requirements include requirements for dust and harmful gases in the air. NH3. The ZXMP S325 equipment should operate in the equipment room that meets the cleanness requirements described below: l l l The equipment room should be free of explosive.Chapter 2 Technical Specifications 2. 2.5 H2S 0. and so on.mounted -5 °C ~ +45 °C on wall or transmission cabinet ) Working Temperature (inside transmission -5 °C ~ +45 °C multifunctional box) Working Temperature (inside outdoor power -40 °C ~ +45 °C cabinet) Relative Humidity • 5% ~ 95% In normal conditions. 2-15 SJ-20120320184105-002|2012-07-30(R1. magnetic-conductive or corrosive dust.

ZXMP S325 Product Description

2.4.4 Application Environment Requirements
According the application scope of GB 4798 and ZXMP S325, the application environment
requirements are listed as follows:
l
l
l

Product storage environment: 1K5, 1Z1, 1B2, 1C2, 1S3, or 1M3. The storage duration
is 180 days.
Product transportation environment: 2K4P, 2B2, 2C2, 2S3, or 2M3. The transportation duration is 30 days.
Product usage environment: 3K5, 3Z2, 3Z7, 3B2, 3C2, 3S2, or 3M3. The usage
duration is 10 years.

2.5 EMC Requirements
The requirements for electromagnetic compatibility (EMC) include two aspects:
requirements for electromagnetic susceptibility (EMS) and electromagnetic interference
(EMI).
The following three criteria should be followed to judge the test result:
l

l

Performance A: Continuous phenomenon. Neither error nor alarm is allowed. After
electromagnetic interference, the number of error bits does not exceed the maximum
value of the normal requirement.
Performance B: Transient phenomenon. During the course of an electromagnetic
interference, the degradation of function is allowed and the equipment can work as
expected without the operator’s intervention.
No loss of frame and synchronization is allowed, and neither pattern out-of-sync, nor
AIS alarm is allowed. The equipment shall work normally after the electromagnetic
interference.
The above does not apply to surge testing where some loss of frame alignment may
be expected. For this test, the EUT shall operate as intended following the cessation
of the exposure.

l

Performance R: Resistive phenomenon. The interference imposed on the equipment
during the test can cause action of the fuse or other specified device which need to
be replaced or reset so that the equipment can work properly.

2.5.1 EMS
ESD Resistivity
The Electrical Static Discharge (ESD) resistivity indexes of ZXMP S325 are listed in Table
2-10.

2-16
SJ-20120320184105-002|2012-07-30(R1.1)

ZTE Proprietary and Confidential

Chapter 2 Technical Specifications

Table 2-10 ESD Resistivity

Contact Discharge

Air Discharge

Criterion

6 kV

8 kV

Performance criterion B

Be sure to wear an antistatic wrist strap during operating in interface areas.

RF Electromagnetic Field Radiation Resistivity
The indexes of the RF electromagnetic field radiation resistivity of the ZXMP S325 are
listed in Table 2-11.
Table 2-11 RF Electromagnetic Field Radiation Resistivity
Test Frequency: 80 MHz ~ 1000 MHz, 1400 MHz ~ 2000 MHz
Electric Field Intensity

Amplitude Modulation

Criterion

10 V/m

80% AM(1 kHz)

Performance criterion A

Electrical Transient Burst Resistivity
The indexes of the electrical transient burst resistivity at different ports of ZXMP S325 are
listed in Table 2-12, Table 2-13, and Table 2-14.
Table 2-12 Electrical Transient Burst Resistivity at DC PowerPort
Generator Waveform: 5 ns/50 ns
Test Voltage

Repetition Frequency

Criterion

±1 kV

5 kHz

Performance criterion B

Table 2-13 Electrical Transient Burst Resistivity at AC PowerPort
Generator Waveform: 5 ns/50 ns
Test Voltage

Repetition Frequency

Criterion

±2 kV

5 kHz

Performance criterion B

Table 2-14 Electrical Transient Burst Resistivity at Signal Cable and ControlCablePorts
Generator Waveform: 5 ns/50 ns
Test Voltage

Repetition Frequency

Criterion

±1 kV

5 kHz

Performance criterion B

Surge Resistivity
The surge resistivity indexes of ZXMP S325 are listed in Table 2-15 to Table 2-18.

2-17
SJ-20120320184105-002|2012-07-30(R1.1)

ZTE Proprietary and Confidential

ZXMP S325 Product Description

Table 2-15 Surge Resistivity of DC Power Supply
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs); Internal Impedance: 12 Ω
Test Mode

Test Voltage

Criterion

Line to line

±0.5 kV

Performance criterion B

Line to ground

±1 kV

Performance criterion B

Table 2-16 Surge Resistivity of AC Power Supply
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs); Internal Impedance: 12 Ω
Test Mode

Test Voltage

Criterion

Line to ground

±1 kV

Performance criterion B

Line to ground

±2 kV

Performance criterion R

Table 2-17 Surge Resistivity of Outdoor Signal Cable
Generator Waveform: 10 μs/700 µs; Internal Impedance: 40 Ω
Test Mode

Test Voltage

Criterion

Line to line

±2 kV

Performance criterion B

Line to ground

Table 2-18 Surge Resistivity of Indoor Signal Cable (10 m)
Generator Waveform: 1.2 μs/50 μs (8 μs/20 μs); Internal Impedance: 42 Ω
Test Mode

Test Voltage

Criterion

Line to line

±1 kV

Performance criterion B

Line to ground

RF Field Conductivity Resistivity
The indexes of the RF field conductivity resistivity of ZXMP S325 arelisted in Table 2-19.
Table 2-19 RF Field Conductivity Resistivity
Test Frequency: 0.15 MHz ~ 80 MHz
Test Intensity

Amplitude Modulation

Criterion

3V

80% AM(1 kHz)

Performance criterion A

2-18
SJ-20120320184105-002|2012-07-30(R1.1)

ZTE Proprietary and Confidential

15~0.5~30 73 60 • These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS A. 2.707.Chapter 2 Technical Specifications 2.5.6.2 EMI Conductive Emission Electromagnetic Interference The indexes of conductive emission electromagnetic interference of the ZXMP S325 are listed in Table 2-20.5 79 66 0. 2. 2-19 SJ-20120320184105-002|2012-07-30(R1. Table 2-20 Conductive Emission Electromagnetic Interference Test Frequency (MHz) Threshold (dBμV) Quasi-Peak Value Mean Value 0.6 Optical Interface Specifications 2.1) ZTE Proprietary and Confidential .2 Optical Modules l Table 2-22 lists the STM-16 optical modules supported by ZXMP S325. Radiated Emission Electromagnetic Interference The indexes of radiated emission electromagnetic interference of the ZXMP S325 are listed in Table 2-21. Table 2-21 Radiated Emission Electromagnetic Interference Test Frequency (MHz) Quasi-Peak Wave Detection Limit (dBµV/m) Test Distance: 10 m Test Distance: 3 m 30~230 40 50 230~1000 47 57 • These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASS A. Specification for the scramble complies with the 7-class synchronous scrambler specified in the ITU-T Recommendation G.6.1 Transmission Code Pattern ZXMP S325 employs the NRZ scramble code.

2 1550 ≤80 LC/PC or SC/PC 1、2、3 or 4 Single-fiber 1310/1550 ≤15 LC/PC or SC/PC 1、2、3 or 4 1310/1550 ≤40 LC/PC or SC/PC 1、2、3 or 4 bidirectional optical module S-4.2U 1550 ≤150 LC/PC 1 CWDM nS1-2XX Compliant with ≤40 LC/PC 1 ≤80 LC/PC 1 the ITU-T Recommendation G.1 1310 ≤15 LC/PC or SC/PC 1、2、3 or 4 L-4.1 1310 ≤40 LC/PC or SC/PC 1、2、3 or 4 L-4.2 1550 ≤15 LC/PC 1 L-16.695 CWDM nL1-2XX Compliant with the ITU-T Recommendation G. 2-20 SJ-20120320184105-002|2012-07-30(R1.695 l Table 2-23 lists the STM-4 optical modules supported by ZXMP S325.ZXMP S325 Product Description Table 2-22 STM-16 Optical Modules Supported by ZXMP S325 Optical Module Light Nominal Transmission Type Wavelength Distance (km) Connector Type Service Capacity (nm) (Channel per board) S-16.1 1310 ≤40 LC/PC 1 L-16.1 Single-fiber bidirectional optical module L-4.1) ZTE Proprietary and Confidential .2 1550 ≤80 LC/PC 1 L-16.1 1310 ≤15 LC/PC 1 S-16.1 l Table 2-24 lists the STM-1 optical modules supported by ZXMP S325. Table 2-23 STM-4 Optical Modules Supported by ZXMP S325 Optical Module Light Nominal Transmission Type Wavelength Distance (km) Connector Type Service Capacity (nm) (Channel per board) S-4.

6.1 2.1 Single-fiber bidirectional optical module L-1.1 1310 ≤40 LC/PC or SC/PC 1、2、3 or 4 L-1. pulse overshoot. All these may deteriorate the sensitivity of the receiver and therefore should be restricted.1) ZTE Proprietary and Confidential . 2-21 SJ-20120320184105-002|2012-07-30(R1.2 1550 ≤80 LC/PC or SC/PC 1、2、3 or 4 Single-fiber 1310/1550 ≤15 LC/PC or SC/PC 1、2、3 or 4 1310/1550 ≤40 LC/PC or SC/PC 1、2、3 or 4 bidirectional optical module S-1.3 Eye Diagram of Optical Transmit Signals The ZXMP S325 eye diagram conforms to the eye diagram mask of optical transmit signal as shown in Figure 2-2. and ringing.Chapter 2 Technical Specifications Table 2-24 STM-1 Optical Modules Supported by ZXMP S325 Optical Module Light Nominal Transmission Type Wavelength Distance (km) Connector Type Service Capacity (nm) (Channel per board) S-1.1 1310 ≤15 LC/PC or SC/PC 1、2、3 or 4 L-1. Figure 2-2 Mask of Eye Diagram for Optical Transmit Signal General transmitter pulse shape characteristics include rise time. fall time. pulse undershoot.

2 8. Therefore.75 - x2/x3 0.75 x3-x2 - - 0.1/ L-1.1/S-4.2 Diagram Mask 2.1/L1.25/0. The eye diagram mask parameters are listed in Table 2-25.1/L-4.6.2 4.80 0.25/0.2 /L-16. 2-22 SJ-20120320184105-002|2012-07-30(R1.2 10 8. Table 2-26 STM-N Mean Optical Launched Power (dBm) Index STM-1 Mean optical STM-4 STM-16 S-1. the waveform of transmit signal should be limited.6.ZXMP S325 Product Description To prevent excessive deterioration of the receiver’s sensitivity.2 S-4.40/0.2 S-4.5 Extinction Ratio The extinction ratios of the ZXMP S325 are listed in Table 2-27.2U nL1-2XX -15~-8 -5~0 -15~-8 -3~+2 -5~0 -2~+3 0~+5 launched power (dBm) 2.80 0. Systems at different STM levels should meet corresponding requirements for different eye diagram mask shapes.2 nS1-2XX/ S-1.1/ S-4.4 Mean Optical Launched Power The mean optical launched power parameters of the ZXMP S325 STM-N (N=1.2 10 8.2 L-4.1/ L-4.2 L-1. 16) are listed in Table 2-26.1/L-16.1/S-1.6 Receiver Sensitivity The STM-N receiver sensitivities of ZXMP S325 are listed in Table 2-28. 4.1/ L-16.60 - y1/y2 0.65 0.1) ZTE Proprietary and Confidential . the eye diagram mask sent at the transmit point S is specified to regulate the pulse shape of optical transmit signal.6.15/0.2 L1.2 S-16.1/L- S-16.20/0. Table 2-25 Parameters of Eye Diagram Mask for Optical Transmit Signal Coordinate Relations of Eye STM-1 STM-4 STM-16 x1/x4 0.20/0.35/0.85 0. Table 2-27 Extinction Ratio of STM-N Optical Interfaces Index STM-1 Extinction ratio STM-4 STM-16 S-1.2 (dB) 2.

2/L-16. ZXMP S325 conforms to the above specifications. 2. Table 2-29 STM-N Receiver Overload Index S-1.1/S-1.10 AIS Rate of Optical Output Interfaces The AIS rate deviation of the ZXMP S325 optical output interface is within ± 20 ppm (1 ppm=1×10-6) 2.2/L- S-16.6.7.2U/ 1.1/L-1.Chapter 2 Technical Specifications Table 2-28 STM-N Receiver Sensitivity (Unit: dBm) Index STM-1 STM-4 S-1.8 Mean Optical Received Power The mean optical received power should be greater than the worst sensitivity and less than the overload of relevant optical boards.2 Receiver sensitivity -28 STM-16 L-1.1/S- L-16.2/ L16.6. 2.2/L-1.6.1/S-1.1/L-16.2/L- nS1-2XX 16.9 Permitted Frequency Deviation of Optical Input Interfaces The permissible frequency deviation of the ZXMP S325 optical input interface is within ± 20 ppm (1 ppm=1×10-6). 2-23 SJ-20120320184105-002|2012-07-30(R1.1) ZTE Proprietary and Confidential .7 Receiver Overload The receiver overloads of ZXMP S325 are described in Table 2-29.6.3 16.3 -10 -8 STM-16 S-16.7 Electrical Interface Specifications 2.2U/ nL1-2XX 0 -9 BER=1×10-10 。 2.2/nS1-2XX 1 nL1-2XX -18 -27 -28 -34 -28 (dBm) • BER=1×10-10 。 2.1 Code Patterns of Electrical Interface Table 2-30 lists the code patterns of electrical interface supported by the ZXMP S325.1/ S-16.2 Overload (dBm) • STM-4 STM-1 -8 L-1.1/L-1. L-16.

22368 kHz Within ±20 Within ±20 155520 0~12. 1024 kHz Within ±50 Within ±50 34368 0~12. Table 2-31 Permitted Attenuation/Frequency Deviation of Input Interface.1) ZTE Proprietary and Confidential .7.7. Frequency Deviation of Input Interfaces and Bit Rate Tolerance of Output Interfaces The permissible attenuation/frequency deviation of input interface and bit rate tolerances of the ZXMP S325 output interface signals are listed in Table 2-31.2 Permitted Attenuation of Input Interfaces. 772 kHz Within ±32 Within ±32 2048 0~6. 17184 kHz Within ±20 Within ±20 44736 0~20.3 Reflection Attenuation of Input/Output Interfaces The requirements on the reflection attenuation index of an input/output interface of the ZXMP S325 are described in Table 2-32.7.ZXMP S325 Product Description Table 2-30 Code Patterns of Electrical Signal Electrical Bit Rate (kbit/s) Signal Type Code Pattern Code Pattern Full Name Abbreviation E0 64 AMI Alternate Mark Inversion T1 1544 B8ZS Bipolar with 8-Zero Substitution T3 44736 B3ZS Bipolar with 3-Zero Substitution E1 2048 HDB3 High Density Bipolar of order 3 E3 34368 STM-1 (E) 155520 CMI Code Mark Inversion 2. 2-24 SJ-20120320184105-002|2012-07-30(R1. 78 MHz Within ±20 Within ±20 1 ppm=1×10-6 。 2. and Signal Bit Rate Tolerance of Output Interface Interface Rate Permitted Attenuation Permitted Frequency Permitted Bit Error (kbit/s) of Input Interface (dB Deviation of Input Tolerance of Output ) (regular square root Interface (ppm) Interface (ppm) attenuation) • 1544 0~6.

2~102.4 ≥12 102.4 Anti-Interference Capability of Input Interfaces Table 2-33 lists the anti-interference capability of ZXMP S325.7.1) ZTE Proprietary and Confidential .Chapter 2 Technical Specifications Table 2-32 Requirements on the Reflection Attenuation Index of an Input/Output Interface Interface bit rate (kbit/s) 2048 Input interface Output interface 34368 Input interface Output interface 44736 Input interface Output interface 155520 Input/output TestFrequencyRange Reflection Attenuation (kHz) (dB) 51. 2-25 SJ-20120320184105-002|2012-07-30(R1.7.5 Waveform of Output Interfaces The waveforms of various electrical output interfaces of ZXMP S325 satisfy the template requirement of ITU-T G.703 Recommendation.4~2048 ≥18 2048~3072 ≥14 51~102 ≥6 102~3072 ≥8 860~1720 ≥12 1720~34368 ≥18 34368~51550 ≥14 1720~51550 ≥6 102~3072 ≥8 860~1720 ≥12 1720~34368 ≥18 34368~51550 ≥14 1720~51550 ≥6 102~3072 ≥8 8000~240000 ≥15 interface 2. Table 2-33 Anti-interference Capability of ZXMP S325 Interface bit rate (Unit: kbit/s) Signal-to-noise Ratio (S/N) (Unit: dB) 2048 18 34368 20 2.

ZXMP S325 Product Description 1544 kbit/s Electrical Interface The output pulse mask of the 1544 kbit/s electrical interface is shown in Figure 2-3.1) ZTE Proprietary and Confidential . 2-26 SJ-20120320184105-002|2012-07-30(R1. Figure 2-3 Output Pulse Mask at the 1544 kbit/s Electrical Interface 2048 kbit/s Electrical Interface The output pulse mask of the 2048 kbit/s electrical interface is shown in Figure 2-4.

2-27 SJ-20120320184105-002|2012-07-30(R1.Chapter 2 Technical Specifications Figure 2-4 Output Pulse Mask at the 2048 kbit/s Electrical Interface 34368 kbit/s Electrical Interface Figure 2-5 illustrates the output pulse mask of the 34368 kbit/s electrical interface.1) ZTE Proprietary and Confidential .

1) ZTE Proprietary and Confidential .ZXMP S325 Product Description Figure 2-5 Output Pulse Mask at the 34368 kbit/s Electrical Interface 44736 kbit/s Electrical Interface illustrates the output pulse mask of 44736 kbit/s electrical interface. 2-28 SJ-20120320184105-002|2012-07-30(R1.

2-29 SJ-20120320184105-002|2012-07-30(R1.Chapter 2 Technical Specifications Figure 2-6 Output Pulse Mask at the 44736 kbit/s Electrical Interface 155520 kbit/s Electrical Interfaces Masks of pulsescorresponding to a binary 0 and a binary 1 at the 155520 kbit/s electrical interface are respectively shown in Figure 2-7 and Figure 2-8.1) ZTE Proprietary and Confidential .

and it meets the requirements listed in Table 2-34.ZXMP S325 Product Description Figure 2-7 Mask of a Pulse Corresponding to a Binary 0 at the 155520 kbit/s Electrical Interface Figure 2-8 Mask of a pulse Corresponding to a Binary 1 at the 155520 kbit/s Electrical Interface 2. 2-30 SJ-20120320184105-002|2012-07-30(R1.1) ZTE Proprietary and Confidential .8 Interface Jitter Specifications 2.1 Jitter and Wander Tolerance of PDH Input Interfaces The jitter and wander tolerance of ZXMP S325 PDH input interface is shown in Figure 2-9.8.

2 Jitter and Wander Tolerance of SDH Input Interfaces The input interfaces jitter and wander tolerance of the ZXMP S325 SDH terminal multiplexer satisfies the requirements described in Figure 2-10.5 0.6 1. Table 2-35. The input interfaces jitter and wander tolerance of the ZXMP S325 SDH regenerator satisfies the requirements shown in Figure 2-11 and Table 2-37.5 0.4k 18k 100k 215-1 10-5 2048 36.2 18 4.Chapter 2 Technical Specifications Figure 2-9 Jitter and Wander Tolerance of PDH Input Interface Table 2-34 Jitter and Wander Tolerance of PDH Input Interface Interface Rate UIp-p A0 Frequency (Hz) A1 A2 A3 f10 f9 Pseudof8 f1 f2 f3 f4 (kbit/s) 1544 random Signal 18 5 0.1 – 1. 2-31 SJ-20120320184105-002|2012-07-30(R1.2× – – 10 120 6k 40k – 0.1 – 1.88× 10-3 7 34368 618.9 1.15 – – – – 100 1k 10k 800k 223-1 44736 18 5 0.2× – – 10 600 30k 400k – 10-5 2. and Table 2-36.66 20 2.8.01 1.1) ZTE Proprietary and Confidential .

56×10-2 0.6×10-3 1.78×10-4 1.15 STM-16 (O) 44790 4977 622 1.075 STM-1 (O) 2800 311 39 1.5 0.56×10-2 0.5 0.6×10-3 1.78×10-4 1.125 19.2×10-5 1.5 0.125 12.5k 65k 1.1) ZTE Proprietary and Confidential .125 19.5 0.ZXMP S325 Product Description Figure 2-10 Jitter Tolerance of STM-N Terminal Multiplexer Input Interface Table 2-35 Input Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer Interface A0 A1 A2 A3 A4 STM-1 (E) 2800 311 39 1.3 500 6.3M 1.1 5000 100k 1M 20M face STM-1 (E) STM-1 (O) STM-4 (O) STM-16 (O) 2-32 SJ-20120320184105-002|2012-07-30(R1.56×10-2 0.56×10-2 0.25k 65k 1.2×10-5 1.125 9.15 Table 2-36 Frequency (Hz) of Input Jitter and Wander Tolerance of SDH Terminal Multiplexer Inter- f0 f12 f11 f10 f9 f8 f1 f2 f3 f4 1.65 1000 25k 250k 5M 1.78×10-4 1.2×10-5 1.2×10-5 1.15 STM-4 (O) 11200 1244 156 1.78×10-4 1.3M 1.6×10-3 1.3 500 3.6×10-3 1.

5 B 12 1.15 1. For the ADM and TM equipment of ZXMP S325. the STM-N interface inherent output jitter satisfies the requirements listed in Table 2-38.15 1.15 1.3 STM-N Interface Inherent Output Jitter l STM-N interface inherent output jitter of SDH equipment is defined as the jitter at the STM-N output interface of the equipment when there is no input jitter.3 250 kHz ~ 5 MHz 0. the test value might exceed the specifications.15 1.Chapter 2 Technical Specifications Figure 2-11 Input Jitter Tolerance of STM-N SDH Regenerator Table 2-37 Input Jitter Tolerances of STM-1.1 STM-4 STM-16 • l Due to the randomness of jitter.5 1 MHz ~ 20 MHz 0.2 0.1 5 kHz ~ 20 MHz 0.2 0. It is acceptable as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).5 A 1000 100 0.5 0.1) ZTE Proprietary and Confidential .3 65 kHz ~ 1.15 1.3 MHz 0.5 B 12 1.5 STM-4 STM-16 2. The STM-N network interface output jitter of SDH equipment is defined as the output jitter value measured at the output interface of any STM-N level in the SDH network.1 1 kHz ~ 5 MHz 0.2 0. STM-4 and STM-16 Regenerators STM Interface f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P) STM-1 A 65 6.5 B 12 1.3 MHz 0.5 A 250 25 0. Table 2-38 STM-N Interface Inherent Output Jitter Specifications of SDH Equipment STM Interface Test Filter Peak-peak Jitter (UI) STM-1 500 Hz ~ 1.8.15 1. 2-33 SJ-20120320184105-002|2012-07-30(R1.

075 1k 250 k 5 1.ZXMP S325 Product Description For ADM and TM equipment of ZXMP S325.7 – 2048 ±50 20 18 k 100 k To be 0. Table 2-39 STM-N Network Interface Output Jitter Specifications of SDH Equipment STM Interface f1 (Hz) f3 (Hz) F4 (MHz) B1 (UIp-p) B2 (UIp-p) STM-1 optical 500 65 k 1.1 2. generally there are both mapping jitter and pointer adjustment jitter.8. the STM-N network interface output jitter satisfies the requirements listed in Table 2-39. 2. For REG equipment.8. The combined jitter of these two jitters is called the combined jitter.4 0. 20 dB/10 Octaves Mapping Jitter of Maximum Peak Value f1 (Hz) f3 (Hz) f4 (Hz) f1 ~ f4 f3 ~ f4 1544 ±22 10 8k 40 k 0. and Table 2-43.4 Mapping Jitter of PDH Tributary ZXMP S325 The mapping jitter of the PDH tributary interface satisfies the requirements listed in Table 2-40. Table 2-42.5 0.1) ZTE Proprietary and Confidential .3 1.075 determined 34368 ±20 100 10 k 800 k To be 0.3 1.5 0. The combined jitter of ZXMP S325 got from various test sequences should satisfy the specifications listed in Table 2-41. when the test filter employs a 12 kHz high-pass filter.15 500 65 k 1. the test value might exceed the specifications.01 UI.5 0. 2-34 SJ-20120320184105-002|2012-07-30(R1.075 determined 44736 ±20 10 30 k 400 k 0.5 0.5 Combined Jitter In SDH system.703 Tolerance Interface (ppm) (kbit/s) High-Pass Filter.15 5k 1M 20 1.15 interface STM-1 electrical interface STM-4 optical interface STM-16 optical interface • l Due to the randomness of jitter. Table 2-40 Mapping Jitter of PDH Tributary Interface G. It is acceptable as long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes). the root mean square caused by jitter should be no more than 0.

9 To be determined Test sequence e h. .3 1 1.3 1.4 0.075 0.4 0.3 To be determined 2-35 SJ-20120320184105-002|2012-07-30(R1. 7 3 UIp-p (f3 ~ f4) 1 1. h.4 0.3 1.3 1.Chapter 2 Technical Specifications Table 2-41 E1/E3 Combined Jitter Specifications PDH In- Bit Rate High-Pass Filter 20 dB/10 terface Toler- Octaves (kbit/s) ance Maximum Peak-Peak Value Combined Jitter UIp-p f1 (Hz) f3 (Hz) f4 (Hz) UIp-p (f1 ~ f4) UIp-p (f3 ~ f4) (ppm) 2048 ±50 20 18 k 100 k 0.075 a b c d a b c d Test sequence Table 2-42 T1 Combined Jitter Specifications PDH Bit High-Pass Filter 20 Inter- Rate dB/10 Octaves face Toler- (kbit/s) ance f1 f3 (Hz) Maximum Peak-Peak Value Combined Jitter UIp-p f4 (Hz) UIp-p (f1 ~ f4) UIp-p (f3 ~ (Hz) f4) (ppm) 1544 ±32 10 8k 40 k 1.1) ZTE Proprietary and Confidential .075 0.3 1.075 0.075 – 34368 ±20 100 10 k 800 k 0. pe- periodic periodic riodic and and and can- regular added celled – Table 2-43 T3 Combined Jitter Specifications PDH Bit High-Pass Inter- Rate Filter 20 face Toler- dB/10 (kbit/s) ance Octaves (ppm) 44736 ±20 Maximum Peak-Peak Value Combined Jitter UIp-p f1 f3 f4 ( ( ( Hz) UIp-p (f1 ~ f4) H- H- z) z) 10 30 40 0 1 k 0k .075 0.075 0.4 – 0.75 0.9 1.4 0. h.4 0.

h.6 Jitter Transfer Characteristic of Regenerator The jitter transfer characteristic of the ZXMP S325 SDH regenerator is shown in Figure 2-12. h.1) ZTE Proprietary and Confidential . h.1 2-36 SJ-20120320184105-002|2012-07-30(R1. h. peri- peri- peri- peri- peri- peri- odic odic odic odic odic odic and and and and and and reg- reg- can- reg- add- can- u- u- cel- ular ed cel- lar ( lar ( led ( 87-3 87-3 87-3 co- co- code de de pat- pat- pat- tern) tern) tern) - led 2.8.1 B 30 0. h. Figure 2-12 Jitter Transfer Characteristic of Regenerator Table 2-44 Parameters of Jitter Transfer Characteristic of Regenerator STM-N STM-1 fc (kHz) P (dB) A 130 0. The parameters of the jitter transfer characteristic of regenerator are listed in Table 2-44.ZXMP S325 Product Description PDH Bit High-Pass Inter- Rate Filter 20 face Toler- dB/10 (kbit/s) ance Octaves (ppm) f1 f3 f4 ( ( ( Hz) H- H- z) z) Test sequence Maximum Peak-Peak Value Combined Jitter UIp-p UIp-p (f1 ~ f4) UIp-p (f3 ~ f4) e f h.

Chapter 2 Technical Specifications STM-N STM-4 STM-16 fc (kHz) P (dB) A 500 0. Output Jitter When there is no input jitter.1 A 2000 0.811 specifies the primary reference clock. All the timings of SDH system should conform to the primary reference clock (PRC) described in G. When using cables with attenuation range of 0 dB ~ 6 dB.811. using a single pole bandpass filter with 20 Hz and 100 kHz turnover frequencies. Permissible input ±4.05 UIP-P.812 specifies slave clocks at different levels. ITU-T Recommendations specify three types of clocks: l l l ITU-T G.6 ppm the output interface 2-37 SJ-20120320184105-002|2012-07-30(R1. ITU-T G. Table 2-45 Specifications of Permissible Input Interface Attenuation/Frequency Deviation and Others Item Specification Permissible input The attenuation characteristic introduced by the input interface signal interface attenuation complies with the frequency square root rule.6 ppm interface frequency deviation Signal bit rate tolerance of ±4.813 specifies the slave clock of SDH equipment. no bit error or clock lock loss occurs in the equipment. Permissible Input Interface Attenuation/Frequency Deviation and Others The specifications of permissible input interface attenuation/frequency deviation of the ZXMP S325 clock are listed in Table 2-45. ITU-T G. The test is conducted at the time interval of 60 s. the inherent jitter of the 2 MHz or 2 Mbit/s clock output interface in ZXMP S325 should not exceed 0.1 2.1) ZTE Proprietary and Confidential .9 Clock Specifications Timing Principles The component closest to the SDH network synchronization performance is the clock unit.1 B 30 0.1 B 30 0.

for the timing recovery through STM-N line signals.2 ns 0.2 ns 100 s<τ≤1000 s Table 2-47 Wander Limit under Temperature Impact (MTIE) Additional Permissible MTIE Value Observation Interval 0. ZXMP S325 satisfies the requirements listed in Table 2-46.1 s<τ≤25 s 0. When the selected timing reference fails. Table 2-47.5 ns 25 s<τ≤100 s 2-38 SJ-20120320184105-002|2012-07-30(R1. the SDH equipment can automatically switch to another timing reference input using the S1 byte.25 τ0. the timing reference failure refers to the signal loss of synchronous clock input interface.1 s<τ≤100 s 50 τ ns τ>100 s Table 2-48 Wander Limit at Constant Temperature (TDEV) TDEV Limit Observation Interval 3.ZXMP S325 Product Description Item Specification Output interface Conforms to the relevant templates specified in ITU-T G. and Table 2-48.1) ZTE Proprietary and Confidential . the timing reference failure refers to the loss of STM-N signals that bear timing signals. Table 2-46 Wander Limit at Constant Temperature (MTIE) MTIE Limit Observation Interval 40 ns 0.1 s<τ≤1 s 40 τ0.703 waveform • 1 ppm=1×10-6 Switching of Timing Reference Sources ZXMP S325 is equipped with more than one external timing reference input. or the AIS occurrence.64 τ0. Long-term Phase Variation in Locked Mode The long-term phase variation in the locked mode is generally expressed by the Maximum Time Interval Error (MTIE) and Time Deviation (TDEV).1 ns 1 s<τ≤100 s 25. Note: For 2 Mbit/s external timing source.5 τ ns 0.

1) ZTE Proprietary and Confidential . At the same time. corresponding to 1×10-8/day frequency wander. denoting the frequency deviation of 2×10-6. ZXMP S325 satisfies all these specifications. This mode can be used to deal with external clock interruption faults lasting for several days.4 ns 100 s<τ≤1000 s Clock Accuracy in Hold Mode Once all the timing references are lost. Frequency Accuracy of the Internal Oscillator in Free-Oscillation Mode The internal oscillator of the SEC works in the free-oscillation mode when the SEC loses all of the timing references and their memories or the SEC has no hold mode at all. c=120 ns. It is caused by aging.811.16×10-4 ns/s2. the phase error ΔT between the SEC output signal and SEC input signal should not exceed the following limit when observation time S is greater than 15 s: ΔT (S) = [(a1+a2)S+0. For a reference that conforms to the G. thus.5bS2+c] ns l l l l a1=50 ns/s. there will be no a2S in the phase error ΔT.10 OA Board Specifications OA (Optical Amplifier) boards fall into two categories as per their positions in the system: l OBA: 1-channel optical booster amplifier 2-39 SJ-20120320184105-002|2012-07-30(R1. b=1. If there is no temperature change. Its output frequency accuracy must be within a certain accuracy range. a2=2000 ns/s. and no greater than 20 ppm for REG equipment. 2. SEC will use the last frequency information saved before the timing reference signal is lost as its timing reference. but can still ensure that SEC frequency only has very small frequency deviation from the reference frequency in a long time. When SEC loses its reference source and enters the hold mode.Chapter 2 Technical Specifications TDEV Limit Observation Interval 6. which is caused by the temperature change when the clock enters the hold mode. including any additional phase deviation that might be generated during the transition period when entering the hold mode. the SDH Equipment Clock (SEC) will enter the hold mode after transient phase variation. ZXMP S325 satisfies the above requirements. denoting the initial frequency deviation of 5×10-8. the SEC output frequency accuracy should be no greater than 4. the slip impairment will stay within the permissible specification.6 ppm for SDH terminal equipment working in the free-oscillation mode. the oscillation frequency of the oscillator will slowly wander.

5 ±0.5 - Optical launched power in dBm <3 <3 - Optical interface connector type - LC/PC LC/PC - Working environment ℃ -10~+60 -10~+60 - Eyesafe (APR) mode temperature Table 2-50 lists the specifications of OPA board. Table 2-49 Types and Specifications of OBA Board Index Unit OBA12 OBA14 Remark Working wavelength nm 1530~1562 1530~1562 - Optical received power range dBm -12~+4 -12~+4 - Optical launched power (typical dBm 12 14 - dB 9~12. Table 2-50 Types and Specifications of OPA Board Index Unit OPA38 Remark Working wavelength nm 1550.5 Can be directly value) Adjustment range of optical launched power adjusted.1) ZTE Proprietary and Confidential .ZXMP S325 Product Description l OPA: 1-channel pre-amplifier Table 2-49 lists the specifications of OBA board.5 - Optical interface connector type - LC/PC - Working environment ℃ -10~+60 - value) Adjustment range of optical launched power temperature 2-40 SJ-20120320184105-002|2012-07-30(R1.12 - Optical received power range dBm -38~-20 - Optical launched power (typical dBm -12 - dB -15~-9 Can be directly adjusted. Output controllable precision dB ±0. Output controllable precision dB ±0.5 11~14.

When the RSEB board is configured with GE services. Note: The flow control function of port must be disabled while testing the port throughput.1 Transparent Transmission Performance Specifications Maximum and Minimum Frame Lengths The frame lengths that can be processed by the smart fast Ethernet board (SFEx6).11 Ethernet Performance Specifications 2. and the Ethernet transparent transmission board (TFEx8) of ZXMP S325meet the requirements listed in Table 2-51. the enhanced smart Ethernet board (SED). when the ports of smart fast Ethernet board (SFEx6) are configured with 46 VC-12s. 2-41 SJ-20120320184105-002|2012-07-30(R1. When the ports of Ethernet transparent transmission board (TFEx8) are configured with 63 VC-12s. the port throughput can reach the line speed of 1 Gbit/s. the port throughput can reach the line speed of 100 Mbit/s. the port throughput can reach the line speed of 1 Gbit/s. When the enhanced smart Ethernet board (SED) is configured with GE services.11.1) ZTE Proprietary and Confidential . Table 2-51 Specifications of Frame Length Ethernet Board Minimum Frame Length (byte) Maximum Frame Length (byte) SFEx6 64 1522 SED 64 1522 (1600 with Jumbo frame enabled) RSEB 64 1522 (1600 with Jumbo frame enabled) TFEx8 64 1522 (1600 with Jumbo frame enabled) Board Throughput l l l l For the ZXMP S325. the embedded RPR processor board (RSEB).Chapter 2 Technical Specifications 2. the port throughput can reach the line speed of 100 Mbit/s.

2 VLAN Specifications Specification of VLAN Basic Function The basic function of VLAN refers to the function of the tag-based VLAN that complies with the IEEE 802. one trunk group supports tow Ethernet ports. the enhanced smart Ethernet board (SED). 2-42 SJ-20120320184105-002|2012-07-30(R1.11. it should be as small as possible under certain conditions. 2. They cannot interwork with the Ethernet ports that do not belong to the same Trunk group. Through the network management configuration. and each group can support one to four Ethernet ports.1) ZTE Proprietary and Confidential . and the embedded RPR processor board (RSEB) of ZXMP S325 supports this function. when supporting three trunk groups. The RSEB board can support three trunk groups at most at the user side. The SED board supports eight trunk groups at most at the system side. and the other trunk group supports four Ethernet ports. However.ZXMP S325 Product Description Packet Loss Ratio Packet loss ratio refers to the maximum acceptable packet loss ratio under the prerequisite that data is normally received. four. l l l The SFEx6 board supports two trunk groups at most at the user side. each trunk group supports two Ethernet ports. and each group can support one to four Ethernet ports. the Smart Fast Ethernet board (SFEx6). Trunk Specification Trunk refers to the transmission of large-capacity Ethernet services by binding multiple Ethernet interfaces. The Ethernet ports in the same Trunk group have the same VLAN configuration attributes. However. Note: The flow control function of port must be disabled when conducting the packet loss ratio test. When supporting two trunk groups. or eight Ethernet ports.1Q standard. it should be as low as possible and close to zero under certain conditions. and each group can support two. Delay Delay refers to the maximum acceptable delay under the prerequisite that data is normally received. There is no specific criterion for packet loss ratio. There is no specific criterion for delay. The SED board supports ten trunk groups at most at the user side.

Through network management configurations. The SFEx6 board and the RSEB board of ZXMP S325 support this function by the configuration of EMS.11. The SFEx6 board. 2-43 SJ-20120320184105-002|2012-07-30(R1. to ensure the normal transmission of services with higher priorities. the SED board and the RSEB board of ZXMP S325 support this function. the port can transmit these services according to the preset VLAN priorities and bandwidths. Each port can belong to multiple VLANs.Chapter 2 Technical Specifications Quantity of VLAN IDs In IEEE 802. Only the receive port which has been set can receive the traffic normally without any packet loss. l Setting of static MAC address Manually add a MAC address and the information of the corresponding port into the MAC address list. Once the total traffic exceeds the transmit bandwidth of the port. l Broadcast address filtering A broadcast address is a MAC address of all “F”s. Through network management configurations. the SFEx6 board. VLAN Priority Under the prerequisite that the QoS function is enabled. 2. the enhanced smart Ethernet board (SED). the port will discard the services with lower priorities and over bandwidth limit. and the RSEB board of ZXMP S325 support the configurations of VLAN priority and bandwidth proportion.1Q standard. MAC address filtering. and the embedded RPR processor board are able to recognize C-VLAN IDs that comply with IEEE 802.3 L2 Switching Specifications Security Filtering Characteristics The security filtering characteristics include the static MAC address setting. The smart fast Ethernet board (SFEx6). The range of VLAN ID is 1 to 4094. The port that has been set cannot receive any traffic. a header of four bytes is defined as a VLAN ID. when services from multiple sources are converged at one transmit port. the SED board. l MAC address filtering Filter frames that have a MAC address as the source address or the destination address by adding the MAC address manually into the MAC address list. Broadcast address filtering can prevent path congestion. It may increase network load and cause path congestion.1Q standards. the SFEx6 board and the RSEB board of ZXMP S325 support this function. and broadcast address filtering.1) ZTE Proprietary and Confidential .

The buffered MAC address can prevent the abandon or flooding of received frames during the transition.12 RPR Performance Specifications ZXMP S325 complies with the RPR performance specifications with L2 switching function. It is generally defined as the minimum frame interval between Ethernet frames. Address Buffering Capability The address buffering capability refers to the number of MAC addresses that one port/module/node can buffer. 2.1) ZTE Proprietary and Confidential . the SED board and the RSEB board of ZXMP S325 support these two functions.ZXMP S325 Product Description Specifications of QoS and Flow Control Function Both the QoS and flow control are methods of handling congestion. QoS emphasizes the normal operation of standardized services to maximize the utilization of bandwidth. Burst Interval The burst interval refers to the time interval between the frame bursts of the Ethernet port at the user side.96 1000 0. the SFEx6 board. The RPR loop protection switching includes two modes: wrapping and steering. Table 2-52 lists the burst intervals. It discards packets of the service exceeding the flow standard to handle congestion. The RPR loop protection switching time of ZXMP S325 satisfies the above requirements. RPR Loop Protection Switching Time The RPR loop protection switching time is the protection switching time of RPR itself. The protection switching time of both these two modes should be less than 50 ms.096 The burst interval of ZXMP S325 satisfies the above requirements. 2-44 SJ-20120320184105-002|2012-07-30(R1. The ZXMP S325 RPR ring network can buffer no less than 128 k addresses. The flow control function suspends transmission to the transmit end to handle congestion and ensure that the traffic is not discarded. Through network management configurations.6 100 0. Table 2-52 The Minimum Frame Interval between Ethernet Frames Ethernet Rate (Unit: Mbit/s) Minimum Frame Interval (Unit: ms) 10 9.

Extremely low. l Protection configuration Whether to use RPR MAC layer protection and SDH layer protection simultaneously can be configured in the EMS. with Extremely low. Service Characteristics l Service types The total number of type-A and type-C services supported by the RSEB board of ZXMP S325 is 1000.25 Gbit/s. depends on the on the network network situation situation Service bandwidth range ZXMP S325 supports the service bandwidth ranging from 20 kbit/s to 1 Gbit/s.1) ZTE Proprietary and Confidential . l Service rate limit granularity ZXMP S325 supports the service rate limit granularity of 20 kbit/s. Table 2-53 compares different RPR service types. And the number of type-B services supported is eight. Table 2-53 Comparisons of RPR Service Types RPR Throughput Delay Jitter Loss of Frame Constant rate. The RPR MAC layer protection supports the wrapping or steering protection. depends Service Type A0 A1 Variable rate.Chapter 2 Technical Specifications RPR Ring Network Bandwidth The RSEB board of ZXMP S325 supports the RPR sub-ring bandwidth ranging from 155 Mbit/s to 1. has higher priority than C C l No guarantee. with guarantee B Can be over configured. Protection between Layers l Protection types The RSEB board provided by ZXMP S325 supports both SDH layer protection and RPR MAC layer protection. Extremely low guarantee with guarantee with guarantee mechanism mechanism Low Variable Low No requirement No requirement Medium No requirement No requirement High. When these two protections are configured to be used 2-45 SJ-20120320184105-002|2012-07-30(R1.

the switching will not occur. The stepping is 10 ms. the service will switch back to the previous working path. The default value is 0 ms. the cancellation of protection status). the RPR MAC layer protection will launch.ZXMP S325 Product Description simultaneously. 2-46 SJ-20120320184105-002|2012-07-30(R1. if service recovers. The delay of RPR MAC layer protection switching is the waiting time between the service failure detection and switching launch. The returnable switching indicates that when the working path is faulty. During this period. à The switching restore time is the waiting time between the service recovery and the service fault status clearance (i. l l Protection principle à When network fault occurs. the service will switch to the protection path. à When the service recovers and keeps normal after the switching restore time had passed. the SDH layer protection will launch first. à If the SDH layer protection fails after the delay of RPR MAC layer protection switching. the service will return to the previous working path from the protection path. delaying the switching time of RPR MAC layer protection can support the switching between layers and thus guarantee that these two switchings will not overlap. Returnable and non-returnable protection switching The RSEB board supports setting the protection switching to be returnable or non-returnable. The non-returnable switching will not return to the working path even after the service recovers. During this period. if the service fails. The default configuration is “returnable”.e. It takes effect only when the “returnable switching" is set.1) ZTE Proprietary and Confidential . The default value is 10 s. l Switching restore time The switching restore time ranges from 0 s to 1440 s. and when the service recovers. the protection will not be cancelled any more. The stepping unit is “second” which is configurable. l Protection delay The delay of protection between layers ranges from 0 ms to200 ms. 2.13 ATM Characteristics Range of VPI/VCI Value ATM services can be transmitted or received normally only when the VP/VC connection is within the value range.

The AP1x4 board supports the enable and restore of VP-Ring protection after configured in the network management system. and for each interface there is only one ATM link. The range of VPI value for user-to-network interface (UNI) is 1 to 255. the ATM equipment will discard cells according to the priority of services once the congestion occurs. When the transmission flow of ATM services exceeds the maximum cell flow traffic of the ATM equipment. The AP1x4 board of ZXMP S325 meets the value range requirements above. VP-Ring Protection The VP-Ring protection adopts the principle of concurrent transmitting and preferred receiving with alarm supervision. VP/VC Multicast l VP/VC spatial multicast The VP/VC link transmitting ATM service can be copied to two or more physical interfaces. LOF (loss of frame). The range of VCI value is 1 to 16383. the previous active VP connection will recover automatically.1) ZTE Proprietary and Confidential . LOS (loss of signal). When the alarms disappear and no alarm appear after the switching restore time. 。 l VP/VC logical multicast The VP/VC link transmitting ATM service can be copied to VP/VC links sharing one physical interface. and LAIS (line alarm indication signal). The AP1x4 board provided by the ZXMP S325 has the above function. Transmission Priority of ATM Cells The ATM service has four types: l l l l Constant bit rate service (CBR) Real-time variable bit rate service (rt-VBR) Non-real-time variable bit rate service (nrt-VBR) Unspecified bit rate service (UBR) The ATM services transmission priority is: CBR > rt-VBR > nrt-VBR > UBR. The AP1x4 board provided by ZXMP S325 supports both the VP/VC spatial multicast and logical multicast. such as VP-AIS (VP alarm indication signal). The standby VP connection of the receive direction will be selected when alarms are found.Chapter 2 Technical Specifications The range of VPI value for network-to-network interface (NNI) is 1 to 4095. OOF (out of frame). 2-47 SJ-20120320184105-002|2012-07-30(R1.

When network fault occurs. cell delay variation (CDV). rt-VBR. rt-VBR. nrt-VBR. The default value is 720 s.ZXMP S325 Product Description Note: The ATM service type of CBR is recommended for testing the VP-Ring protection Protection between Layers The AP1x4 board provided by ZXMP S325 can support the protection of SDH layer and ATM layer. And the cell transmission quality of these services can be supervised with data network analyzers. l l Note: The ATM service type of CBR is recommended for testing the protection between layers.1) ZTE Proprietary and Confidential . The default value is 500 ms. nrt-VBR. The switching restore time ranges from 0 min to 30 min. or UBR. the ATM service will return to the working connection channel from protection connection after switching restore time. 2-48 SJ-20120320184105-002|2012-07-30(R1. To guarantee the transmission quality of ATM services. The protection of ATM layer refers to VP or VC protection. ATM Transmission Performance The ATM transmission performance represents the transmission quality of ATM cells. and the stepping is 100 ms. The switching restore time refers to the restore time of the ATM layer protection. The cell transmission quality involves cell transfer delay (CTD). the SDH layer protection will launch first. the requirements of parameters specified above are different for ATM services of different types (CBR. cell error ratio (CER). If the SDH layer protection fails after the delay of ATM layer protection switching. the ATM layer protection will be enabled. and bit error ratio (BER). and UBR). Once the service recovers. cell loss ratio (CLR). The AP1x4 board supports ATM services of the type CBR. The AP1x4 board can be configured in the network management system to enable and restore the protection between layers. The delay of protection between layers ranges from 0 s to 10 s. cell mis-insertion ratio (CMR). and the stepping is 100 ms.

703 kbit/s、2048 kbit/s、34368 kbit/s、44736 kbit/s) Physical/electrical characteristics of hierarchical digital interfaces ITU-T G.14 External Interface Standards The external interfaces refer to interfaces that connect the ZXMP S325 with other external equipment.707 Network node interface for the synchronous digital kbit/s、622080 kbit/s、2488320 kbit/s) hierarchy (SDH) ITU-T G. Table 2-54 External Interface Standards of ZXMP S325 Interface Types Standard Description Optical interface (155520 ITU-T G.957 Optical interfaces for equipments and systems relating to the synchronous digital hierarchy (SDH) ITU-T G.691 Optical interfaces for single-channel SDH systems with optical amplifiers and STM-64 system ITU-T G.703 Physical/electrical characteristics of hierarchical digital interfaces ITU-T G.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH) GB 7611-87 Parameters of digital interface for PCM systems over telecommunication network 2.704 Synchronous frame structures used at 1544.707 kbit/s) Network node interface for the synchronous digital hierarchy (SDH) ITU-T G. 8448.048 MHz network clock ITU-T G.Chapter 2 Technical Specifications 2. 2048. and 44736 kbit/s hierarchical levels ITU-T G. The ZXMP S325 external interfaces standards are listed inTable 2-54.1) ZTE Proprietary and Confidential .692 Optical interfaces for multi-channel systems with optical amplifiers ITU-T G.703 synchronous interface Physical/electrical characteristics of hierarchical digital interfaces 2-49 SJ-20120320184105-002|2012-07-30(R1.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH) Electrical interface (1544 ITU-T G.825 The control of jitter and wander within digital networks which are based on the synchronous digital hierarchy (SDH) Electrical interface (155520 ITU-T G. 6312.

3 standard. 2-50 SJ-20120320184105-002|2012-07-30(R1. and 10Base-T physical interfaces specified by IEEE 802. The phone modulation method is PCM. 100Base-FX. and the bit rate is 64 kbit/s.ZXMP S325 Product Description Interface Types Standard Description Dual-line interface of orderwire - The frequency range is 300 Hz ~ 3400 Hz. Ethernet Interfaces - 1000BASE-TX. 1000Base-FX.1) ZTE Proprietary and Confidential . 100BASE-TX.

774 Synchronous digital hierarchy (SDH) management 02/2001 information model for the network element view ITU-T G.784 Synchronous digital hierarchy (SDH) management 07/1999 ITU-T G.1) ZTE Proprietary and Confidential . 2048. 6312.783 Characteristics of synchronous digital hierarchy (SDH) 10/2000 equipment functional blocks ITU-T G.785 Characteristics of a flexible multiplexer in a synchronous 11/1996 digital environment A-1 SJ-20120320184105-002|2012-07-30(R1. 10/1998 8448.706 Frame alignment and cyclic redundancy check (CRC) 04/1991 procedures relating to basic frame structures defined in Recommendation G.707 Network node interface for the synchronous digital hierarchy 10/2000 (SDH) ITU-T G. Table A-1 Standards and Recommendations Complied by ZXMP S325 Recommendation Description Version ITU-T G.708 Sub STM-0 network node interface for the synchronous 06/1999 digital hierarchy (SDH) ITU-T G.704 ITU-T G.703 Physical/electrical characteristics of hierarchical digital 11/2001 interfaces ITU-T G.780 Terms and definitions for synchronous digital hierarchy 07/1999 (SDH) networks ITU-T G.773 Protocol suites for Q-interfaces for management of 03/1993 transmission systems ITU-T G.704 Synchronous frame structures used at 1544.781 Synchronization layer functions 06/1999 ITU-T G. and 44736 kbit/s hierarchical levels ITU-T G.Appendix A Standards and Recommendations Table A-1 lists the ITU-T recommendations and other standards that ZXMP S325 is compliant with.705 Characteristics of Plesiochronous Digital Hierarchy (PDH) 10/2000 equipment functional blocks ITU-T G.

831 Management capabilities of transport networks based on 03/2000 the synchronous digital hierarchy (SDH) ITU-T G.810 Definitions and terminology for synchronization networks 08/1996 ITU-T G.803 Architecture of transport networks based on the synchronous 03/2000 digital hierarchy (SDH) ITU-T G.823 The control of jitter and wander within digital networks which 03/2000 are based on 2048 kbit/s hierarchy ITU-T G.841 Types and characteristics of SDH network protection 10/1998 architectures ITU-T G.806 Characteristics of transport equipment .828 Error performance parameters and objectives for 03/2000 international.811 Timing characteristics of primary reference clocks 09/1997 ITU-T G.805 Generic functional architecture of transport networks 03/2000 ITU-T G.Frame and 10/1998 multiplexing structures ITU-T G.957 Optical interfaces for equipments and systems relating to 07/1999 the synchronous digital hierarchy (SDH) A-2 SJ-20120320184105-002|2012-07-30(R1.812 Timing requirements of slave clocks suitable for use as node 06/1998 clocks in synchronization networks ITU-T G. constant bit rate synchronous digital paths ITU-T G.832 Transport of SDH elements on PDH networks .824 The control of jitter and wander within digital networks which 03/2000 are based on the 1544 kbit/s hierarchy ITU-T G.813 Timing characteristics of SDH equipment slave clocks (SEC) 06/1998 ITU-T G.ZXMP S325 Product Description Recommendation Description Version ITU-T G.842 Interworking of SDH network protection architectures 04/1997 ITU-T G.829 Error performance events for SDH multiplex and regenerator 03/2000 sections ITU-T G.Description 10/2000 methodology and generic functionality ITU-T G.1) ZTE Proprietary and Confidential .825 The control of jitter and wander within digital networks which 03/2000 are based on the synchronous digital hierarchy (SDH) ITU-T G.

Electromagnetic Compatibility EMI .Bit Error Rate CBR .Direct Current DCC .Cell Loss Ratio CMR .Electromagnetic Interference I SJ-20120320184105-002|2012-07-30(R1.Asynchronous Transfer Mode BER .Data Communications Channel DNI .Digital Cross Connect ECC .Cell Misinsertion Ratio CTD .Cell Error Ratio CLR .Alarm Indication Signal ATM .1) ZTE Proprietary and Confidential .Cell Delay Variation CER .Embedded Control Channel EMC .Glossary ADM .Cell Transfer Delay DC .Add/Drop Multiplexer AIS .Constant Bit Rate CDV .Dual Node Interconnection DXC .

1) ZTE Proprietary and Confidential .Loss Of Signal MAC .Mobile Station MTIE .Equipment Under Test FE .Line Alarm Indication Signal LOF .Optical Pre-Amplifier II SJ-20120320184105-002|2012-07-30(R1.Electromagnetic Susceptibility EUT .ZXMP S325 Product Description EMS .Maximal Time Interval Error NE .Out Of Frame OPA .Medium Access Control MCU .Fast Ethernet GE .Loss Of Frame LOS .Telecommunication Standardization Sector L2 .Network Element NNI .Micro Control Unit MS .Optical Amplifier OBA .Gigabit Ethernet ITU-T .International Telecommunication Union .Network Node Interface OA .Layer 2 LAIS .Optical Booster Amplifier OOF .

Synchronous Digital Hierarchy SEC .Resilient Packet Ring SDH .SDH Equipment Clock SMCC .Primary Reference Clock QoS .Synchronization Status Message STM .Synchronous Transport Module STM-N . 64) TDEV .Virtual Channel III SJ-20120320184105-002|2012-07-30(R1.Terminal Multiplexer UBR .Plesiochronous Digital Hierarchy PRC .Pulse Code Modulation PDH .Quality of Service REG .Glossary PCM .Sub-network Management Control Center SNC . 4.Sub-Network Connection Protection SSM .1) ZTE Proprietary and Confidential .REGenerator RPR .Sub-Network Connection SNCP .Unspecified Bit Rate UNI .Time Deviation TM .Synchronous Transport Module. level N(N=1. 16.User Network Interface VC .

Virtual Path .Virtual Path VP-AIS .1) ZTE Proprietary and Confidential .ZXMP S325 Product Description VCI .Alarm Indication Signal VPI .non-real time Variable Bit Rate rt-VBR .Virtual Local Area Network VP .Virtual Channel Identifier VLAN .Virtual Path Identifier nrt-VBR .real-time Variable Bit Rate IV SJ-20120320184105-002|2012-07-30(R1.