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USE THIS FOR YOUR REFERENCE

SPEC. # 4. .1-P1-DCS

FMEA Number : FMEA-034


Prepared by :
FMEA Date:

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)
Process : MOLD
Product :
Core Team :
Process
Function

Requirements
Mold

P Page

8 of 24

Process Responsibility :
Key Date :

Potential
Failure
Mode

Package
void

SPEC. NO.

SHEET

Exposed
die and
epoxy

Potential
Effect(s)
of Failure

S
e
v

C
L
A
S
S

Potential Cause(s
Mechanism(s)
of Failure

O
c
c
u
r

Current
Process
Controls
Prevention

Current
Process
Control
Detection

D
e
t
e
c

R
P
N

Brushing
using copper
brush &
airblow
gun before
& after
molding
Defined
mold tool
cleaning
procedure

In-process
monitoring /
visual inspection

12

Cleaning of mold
tool every 3 days

Follow the required


temp. during preheating of mold
compound

18

Review of PCI
prior prodn use
as reference

36

In-process
monitoring/ visual
Inspection

In-process
monitoring/
visual inspection

27

18

24

Reliability
failure

Clogged air vent


due to accumulated
dirt on air vent

Customer
complaint

Dirty mold tool


surface

Reliability failure /
low yield /
customer
complaint

Reliability failure

Inconsistent preheating of molding


compound due to
different technique
of the assigned optr
per mold press
Wrong placement of
die. Bonding diagram
used was not updated

10
Pitted
package

Low yield

Low/ high temp.


due to loose thermocouple wire

Accumulated dirt
on cavity surface
due to improper
cleaning of mold tool

OF
26

FORM # DC -0 3 REV. A

Low yield /
customer
complaint

Fan lead

Low yield

Low clamp pressure

Defined
procedure in
updating and
securing
bonding
diagrams
Reduce/
increase the
mold temp.
from 175 +
15 C
Removed the
accumulated
dirt using
brass plate
& air blow
gun prior
mass prodn
Cleaning of
mold tool
every 3 days
Defined
mold
parameter

REV.

SPEC # 4.2.3.5-P1-FMEA

Calibrate every
start of the shift

Recommended
Action(s)

DCC to secure
old BDs from
prodn area,
only
latest rev.
should be used

Responsibility
& Target
Completion Date

F. Yabut

Action Results
Action
Taken

S
e
v

O
c
c

D
e
t

R
P
N

Done

24

FORM # FMEA-001 REV. A

USE THIS FOR YOUR REFERENCE

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034


Prepared by :
FMEA Date:

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)
Process : MOLD
Product :
Core Team :
Process
Function

P Page

9 of 24

Process Responsibility :
Key Date :

Potential
Failure
Mode

Potential
Effect(s)
of Failure

Requirements
Mold

Incomplete
fill

Low yield

S
e
v

C
L
A
S
S

Potential Cause(s
Mechanism(s)
of Failure

Unparallel mold
platen surface

Clog air vent

SPEC. NO.

SHEET

3
3

FORM # DC -003

Chip out

Low yield

High mold temp.

Low mold temp.

Embedded plastic on
cavity surface

EV. A
Package
crack

Low yield

O
c
c
u
r

Inadequately cleaned
corner of die cavities

Sticky molding
compound

Ejector stuck up

Current
Process
Controls
Prevention

Defined
cleaning
procedure
of air vent
Defined
cleaning
of mold
surface
Defined
mold temp.
QC
monitoring of
mold temp.
2X/ shift
Defined
mold
procedure
Unused
pressurized
air blow gun,
Cu brush to
clean up
top & bottom
die
Mold
cleaning
procedure

Current
Process
Control
Detection

D
e
t
e
c

R
P
N

Mach PM semiannual/ spot


adjustment of
mold chase
Checking of air
vent every start
of the shift

36

45

Cleaning/ air blow


mold surface
every shot

16

Machine calibration
2 X per shift
Machine
calibration per
shift

45

45

Visual inspection
of mold shot
3x min/ shift
In-process
monitoring / visual
Inspection

48

32

Cleaning of mold
every start of
shift/ change of
device
Further shot of
mold release
agent #x after
mold cleaning
Machine PM
2x/ annum/ spot
adjustment of
ejector spring

48

60

36

SPEC # 4.2.3.5-P1-FMEA

Recommended
Action(s)

Responsibility
& Target
Completion Date

Action Results
Action
Taken

S
e
v

O
c
c

FORM # FMEA-001 REV. A

REV.

USE THIS FOR YOUR REFERENCE

D
e
t

R
P
N

SPEC. # 4. .1-P1-DCS

FMEA Number : FMEA-034

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)

P Page

Process : MOLD

Process
Function

10 of 24

Process Responsibility :
12-18-06

Potential
Failure
Mode

Potential
Effect(s)
of Failure

Requirements
Mold

Delamination

Low yield/
Customer
complaint

S
e
v

C
L
A
S
S

Potential Cause(s
Mechanism(s)
of Failure

SPEC. NO.

12

Current
Process
Controls
Prevention

Current
Process
Control
Detection

D
e
t
e
c

R
P
N

Defined
curing
reqrments
Store the
bare units at
the dry box
with N2
Pre-heat at
the lead
frame prior
molding
process
Defined
transfer
pressure

Machine
Calibration
2x/ shift
Visual inspection

45

48

32

Machine checking
2x/ shift

60

Machine PM 2x/
annum/ spot
removal of plastic
Machine checking
2x/ shift

50

60

50

60

45

Insufficient cure time

Unwanted
contaminants on
leadframe

SHEET

O
c
c
u
r

Insufficient transfer
pressure

Plastic seep along


the edge of the
mold tool
High clamp pressure

Package
mismatch

Low yield

Tool mark

Low yield

Customer
complaint

Leadframe not reclined


flat on the mold chase

Pinched
lead

Low yield

Defective guide pin

Dirty
package

Low yield

Accumulated dirt
on mold die surface

OF

Defined
clamp
pressure
Documented
procedure
during mold
Guide pin
change
based on
defined tool
life
Defined and
documented
cleaning
procedure

Visual insp. of
mold shot
3x min/ shift
Machine PM 2X /
annum/ spot
replacement of
defective guide
pin
Cleaning of mold
every start of
shift/ change
of dev.

SPEC # 4.2.3.5-P1-FMEA

Recommended
Action(s)

Responsibility
& Target
Completion Date

Action Results
Action
Taken

S
e
v

O
c
c

FORM # FMEA-001 REV. A

26
REV.

FORM # DC -003 REV. A

USE THIS FOR YOUR REFERENCE

D
e
t

R
P
N

SPEC. # 4.5.1-P1-DCS

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)

Process

Potential

Potential

Function

Failure
Mode

Effect(s)
of Failure

e
v

L
A
S
S

Potential
Cause(s
Mechanism(s)
of Failure

Current

Current

Recommended

Responsibility

c
c
u
r

Process
Controls
Prevention

Process
Control
Detection

e
t
e
c

P
N

Action(s)

& Target
Completion Date
Action
Taken

Requirements

ELECTRO PLATE

Solderability
Failure

- Poor Contact on
Board
- Yield Loss
- Customer
Complain

Low Plating
Thickness.

Wrong bath
concentration
and
temperature.
Failed pre/post
plating chemical
concentrations.

Overlapping of
units at the
loading area.

Flashes/resin
bleeds on leads

High plating
current
application

SPEC. NO.

SHEET

Exposed
Metal/
Incomplete
Plating/
Plating
Voids

- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain

- Optimize plating
parameters per
package type.
- Set plating
thickness limits
Correct bath
concentration and
temperature.
- Set limits for
pre/post/plating
chemical conc.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
Ensure proper stripto-strip loading at the
machine loading
area.
Optimize deflashing
parameters

16
Rough
Deposit/
Blisters/
Bubbles

OF

- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain

Optimize plating
parameters per
pkge. type

SPEC # 4.2.3.5-P1-FMEA

26
REV.

FORM # DCS-003 REV. A

USE THIS FOR YOUR REFERENCE

Action Results

- PT
measurements
- Solderability Test
- QC Gate

45

- Titration Results
- Temp. monitoring
1x /shift

45

- Daily chemical
monitoring and
dumping record.
- QC Gate

36

- Loader spot
checking every
load.
- QC Gate
- Checking of
deflash parameters
during qual, pkge.
set-up or
conversion.
- QC Gate
-Plating current
checking during
qual, set-up or
conversion
- QC Gate

36

36

36

S
e
v

O
c
c

FORM # FMEA-001 REV. A

D
e
t

R
P
N

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)

Process : Electroplating

Process Responsibility :
12-18-06

Process

Potential

Potential

Function

Failure
Mode

Effect(s)
of Failure

e
v

L
A
S
S

Potential
Cause(s
Mechanism(s)
of Failure

Current

Current

Recommended

Responsibility

c
c
u
r

Process
Controls
Prevention

Process
Control
Detection

e
t
e
c

P
N

Action(s)

& Target
Completion Date

- Set conc. limits for


pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
- Set conc. limits for
pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
Regeneration of DI
water for production
use.

- Daily chemical
monitoring and
dumping record.
- QC Gate

36

- Daily chemical
monitoring and
dumping record.
- QC Gate

45

- Water quality
monitoring 1x/shift

45

Action
Taken

Requirements

SPEC. NO.

SHEET

Peel-Off/
Peeling/
Flaking

ELECTRO PLATE

Discoloration/
Contamination

FORM # D S-0 3 REV. A

SPEC # 4.2.3.5-P1-FMEA

- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain

- Cosmetic
Failure
- Yield Loss
- Solderability
Failure
- Customer
Complain

Failed
pre/post/plating
chemical conc.

Failed
pre/post/plating
chemical conc.

Failed water
quality used
during
production
Failed water
quality used
during
production

Regeneration of DI
water for production
use.

- Water quality
monitoring 1x/shift
- QC Gate

36

Low water
pressure and
flowrates

Set limits for water


pressures and
flowrates.

36

Low product
drying
temperature

Set limits for product


drying temperature

- Water pressures
and flowrates
monitoring 1x/shift
- QC Gate
- Monitor product
drying temp. 1x/shift
- QC Gate

36

Action Results
S
e
v

O
c
c

D
e
t

FORM # FMEA-001 REV. A

R
P
N

REV.

SPEC. # .5. -P1-DCS

FMEA Number : FMEA-034

POTENTIAL
FAILURE MODE AND EFFECT
ANALYSIS
(PROCESS FMEA)
Process : ELECTROPLATE

Process Responsibility :

Process

Potential

Potential

Function

Failure
Mode

Effect(s)
of Failure

e
v

L
A
S
S

Potential
Cause(s
Mechanism(s)
of Failure

Current

Current

Recommended

Responsibility

c
c
u
r

Process
Controls
Prevention

Process
Control
Detection

e
t
e
c

P
N

Action(s)

& Target
Completion Date
Action
Taken

Requirements
Excess
tin/Dentrites/
Potrusion/
Extraneous
Plating/
Tin bridging

SPEC. NO.

SHEET

Tin W hiskers

Pb
Contamination

- Yield Loss
- Interlead
shortening
- Customer
Complain

- Yield Loss
- Interlead
shortening
- Customer
Complain

- Yield Loss
- Cosstumer
Complain

High plating
current
application

Optimize plating
parameters per
pkge. type

-Plating current
checking during
qual, set-up or
conversion
- QC Gate

45

Failed
pre/post/plating
chemical conc.

- Daily chemical
monitoring and
dumping record.
- QC Gate

45

Intermettalic
and stress build
up.

- Lot traveler
- QC Gate
- Reliability Test

45

Low Plating
Thickness.

45

Wrong addition
of Pb on the
plating solution

- PT
measurements
- QC Gate
- Pb monthly
outside test results
monitoring.
- 1x/month
- Pb monthly
outside test results
monitoring.
- 1x/month

- Set conc. limits for


pre/post/
plating chemicals.
- Conduct chemical
analysis and
maintenance on a
daily and weekly
basis.
100% of the plated
units are subject for
oven
curing/annealing for
1Hr+5mins/-0 @
150-160C
Temperature
within 24Hrs.
Optimize plating
parameters per
package type.
- Designate
dedicated Machine
for Pbfree process.

30

30

Set Pb content limits


on the plating
solution

SPEC # 4.2.3.5-P1-FMEA

Action Results
S
e
v

O
c
c

FORM # FMEA-001 REV. A

6
REV.

FO M # CS 003 REV. A

USE THIS FOR YOUR REFERENCE

D
e
t

R
P
N