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WAFERLINE EQUIPMENT LIST

POLYSILICON TO WAFERS

The following Diagram gives an overview of the equipment in Wafer Fabrication. It is the
Wafer Fabrication turnkey Line of GT Solar. The stages are from Crucible Preparation to
Wafer Inspection and Sorting.
Crucible Preparation

Company Vesuvius Ceradyne Inc GT Solar


Model RTU SOLAR Crucibles PV casting
Crucibles
Technical Specifications
Bricks 25 ,
16
Size mm 156*156 ,
210 *210
Maximum 1650° C
Temperature
Ready to use Yes
Supports lower quality Provides
feedstock Coating
technology

Nabertherm: no information available about their crucibles

Polysilicon Preparation
Poly Silicon Chunk Etching, Cleaning & Drying

Company GT Solar Stangl MEI LLC


Model GT-FSE1000 MATERIA PCE Automated Chunk
Polysilicon
Cleaning
Throughput 60 to 240 kg/hr 500 to p.a. to 2500
to p.a.
Utilization 24/7, 365
days/year
Availability Uptime > 95 % Uptime > 95 %

Batch Size 10 kg to 40 kg 25 kg 20kg


Typical Cycle Time 5 - 30 min 6mins
Crucible

Sand blasting
No Equipment Identified yet

Ingot Inspection
Company DWFritz Automation, Inc.
Model Silicon Ingot Inspection System
Technical Specifications
INSPECTIONS PERFORMED: Lifetime, Weight, Length, Diameter, End
Perpendicularity, Conductivity, Bar-Code
Confirmation
MATERIAL HANDLING: Ingots supported by V-blocks moving on linear
track system
THROUGHPUT: Approx. cycle time 3 Minutes including bar
code etch
No. of machines 1
Ingot Squaring/Bricking

Company Meyer Burger Meyer Berger Applied Materials Diamond Wire


BandSaw Brickmaster Applied HCT SQ300
Model BS 805 Wiresaw Squarer (squarer)
market
introduction 2004 2005 –
Max. size 890 × 890 × 520 8 × Ø 210 ×
(length × width 890 × 890 × 850 × 850 × mm 520 mm
× height) 650 mm 290 mm
250 μm
structured , opt. 250 μm
diameter - Diamond wire structured 140 - 330 μm
dimension
variation for
size of 156 mm ± 0.2 mm Max. ± 0.25 mm 0.25 mm
roughness RA < 0.9 μm < 3 μm < 3 μm
Throughput
(156 × 156 × 7 h for 1
250 mm brick) Ingot 8h Per cycle 2.7 bricks/h 5 bricks/h
No. of Furnaces
per Squarer
(450 kg
Charge) 7 7 6 10
time to change
band 15 - 20 min _ 1h ~ 15 - 20 min
typical uptime > 95% 95% 98%
time of 8 - 10 months 18 - 20 weeks
delivery 4 - 6 months
price $833,930.00 $840,000.00 $980,000.00
Support JYT ,
JZ-550 Diamond Wire is Support JYT , JZ-
Furnace optional 550 Furnace
Diamond squarer
Air Conditioned trials have
room is attained a high
advantageous level of maturity
900 mm high
ingot support
Brick Line
Fully Automated lines for Grinding, scanning & measuring, Cropping & auto gluing for
the wafer Slicing

Company Meyer Berger Arnold


Model BrickLine S BrickLineM BrickLine L Machine Center
Brick throughout 31'025 bricks 62'050 bricks 93'075 bricks
/year
Capacity Brickline/ Max. 65 MW Max. 130 MW Max. 195 MW 250mw Capacity
Year
Ramp-up options
Robot 1 2 2
Grinding 1 2 2 Diamond Grinding
Cropping 1 2 3
surface finish Ra 0.03micron
Uptime 99% (Claimed by MB) 97%
Scanning & IR- Inspection, combined 3D measurement IR Imaging and MLCT
Measuring options Lifetime and resistivity inspection measurement
Laser Bar-coding
Gluing Section 1 Auto gluing centre
Wafer formats 125/156/210. No Changeover time for
processing
Key Benefits Integration with BrickMaster and Wiresaws of
Meyer Berger
Space required 150m2 274m2 300m2
Support for
Diamond wires
in the next 2
years

Slurry Recovery Unit

Compa Applied Materials Metallkraft & SiC Processing AG


ny Landteknikk
Model Applied HCT Slurry Recovery sic/peg slurry handling SiC Processing
Unit systems
Recovers both silicon 100% recycling of Slurry 75% to 90% usable SiC
carbide (SiC) abrasive and and 85% to 95% PEG
the coolant fluid
stand-alone unit as well as Recycling plants Logistics & Slurry

Feature recycling plants (designed by Supply System

s Landteknikk)
50% reduction in slurry cost recycled slurry
retains fully its cutting
abilities
> 30% reduction in wafering No Chemicals added cost savings in wafering
consumables cost up to 20-30%

Prewashing & Separating

Company Rena Stangl Schmid


Model PreWaClean & WaSep Pre-Clean & Wafer Pre Cleaning
Deglue System
Throughput 4 runs per hour 7200 wafers per 4 wafer blocks per hour

loading length 1080 mm per hour (upto 1000 mm per

run block)